Abstract: A power supply device includes a first converter which converts an input voltage to a first voltage, a second converter which converts the first voltage from the first converter to a second voltage, a voltage comparison section which compares the first voltage outputted from the first converter with a predetermined reference voltage, a voltage comparison result output section which outputs a first signal until the first voltage is determined to be higher than the predetermined reference voltage by the voltage comparison section and retains a second signal as an output after the first voltage is determined to be higher than the predetermined reference voltage, and a converter control section which controls the second converter to stop when the first signal is outputted from the voltage comparison result output section and controls the second converter to operate when the second signal is outputted from the voltage comparison result output section.

Abstract: A power converter controller includes a drive signal generator coupled to generate a drive signal to control switching of a power switch to regulate a flow of energy to a power converter output in response to an energy requirement of a load. A voltage supply rail is coupled to supply a voltage to the drive signal generator. The supplied voltage is used by the drive signal generator to generate the drive signal. A control circuit is coupled to generate a power down signal that stops the supply of the voltage to the drive signal generator to stop the generation of the drive signal and the control of the switching of the power switch for a period of time. Timer circuitry determines a duration of the period of time and triggers the control circuit to restart the supply of the voltage by the supply rail to the drive signal generator.

Abstract: Power conversion systems and methods are presented for detecting input filter capacitor degradation or approach of end of operational life based on filter capacitor current measurements using single and/or dual threshold comparisons for computed instantaneous sum of squares of filter currents or power values.

Abstract: A method for reducing a ripple, caused by rotational nonuniformity of an internal combustion engine, in the output voltage of a generator which is driven by the internal combustion engine is provided. The generator has a stator winding, a rotor winding, a field controller, associated with the rotor winding, for regulating the output voltage of the generator, and a downstream power converter having controllable switching elements. To reduce the voltage ripple, the output voltage of the generator is regulated on the stator side by appropriately controlling the switching elements of the power converter.

Abstract: A power adapter and an electrical connector for the power adapter operate to provide power to an electronic device such as a laptop computer. The power adapter includes a switch and a circuit for detecting whether or not the electrical connector is connected to the electronic device. If the adapter is not connected to an electronic device, the switch is opened so that no power is drawn from an AC supply. The electrical connector includes first and second conductors that are electrically connected to the detection circuit. The detection circuit detects a change in potential when the connector is plugged into an electronic device.

Abstract: Damage to an inverter due to an excessively high start-up current, when using space vector control without a voltage sensor in conjunction with small connection inductances, can be prevented with a method for controlling the inverter, and with a corresponding controller, wherein the controller is configured to transmit in a start-up phase of an inverter circuit a control signal to a control input of the inverter circuit, wherein the control signal simultaneously switches three first semiconductor switches, which are connected to a first DC voltage terminal of the inverter circuit, temporarily into a conducting state.

Abstract: A power converter control system having a phase tracker that is designed and configured to estimate the phase of the voltage on the power network that will be on the network when network recovers from a fault on the network. Such a power converter control system allows a power-network-connected power source to ride-through a fault event and continue supplying power thereto at the designed phase and frequency. In one embodiment, the phase tracker provides this estimate by having a response time slow enough that the voltage drop or sag caused by the fault substantially does not affect the control system. In another embodiment, the phase detector is designed and configured to freeze the frequency of its output upon detection of a fault event on the power network.

Abstract: A power quality management system includes a plurality of phase balancers, each phase balancer including single phase converters coupled between two phase lines and a plurality of controllers to control the plurality of phase balancers. Each controller includes a voltage unbalance detection module to detect amount of voltage unbalance in a plurality of phase lines and a voltage unbalance compensation module to generate reference current commands for each of the single phase converters to reduce the voltage unbalance.

Abstract: There are provided a power converting apparatus and an operating method thereof, and a solar power generation system. The power converting apparatus for a solar power generation system includes: a power converting unit converting an input signal generated by a solar cell module into an output signal; and a control circuit unit controlling an operation of the power converting unit, wherein the power converting unit includes at least one transformer, and a current sensor and a switching circuit connected to a primary winding of the at least one transformer, and the control circuit unit calculates a voltage and a current of the input signal using a current of the primary winding of the at least one transformer sensed by the current sensor and performs a maximum power point tracking (MPPT) control so that the power converting unit is operated at a maximum power point.

Abstract: There are provided a power supplying apparatus, a method of operating the same, and a solar power generation system including the same. The power supplying apparatus includes: a power supply unit generating a direct current (DC) input signal; a main circuit unit including a plurality of flyback converter circuits connected to the power supply unit to generate a DC output signal; and a control circuit unit controlling an operation of the main circuit unit, wherein the control circuit unit connects the plurality of flyback converter circuits to each other in series or in parallel according to a level of the DC input signal. Therefore, even in the case in which the level of the DC input signal is high, a circuit maybe configured using a circuit device having a low withstand voltage range and damage and deterioration of the circuit device may be prevented.

Abstract: A controller circuit for activating and deactivating an electrical power converter that provides power to a device includes power input terminals on a primary side, and power output terminals on a secondary side, which are configured to provide power to the device. The controller circuit includes a detection circuit configured to determine whether the device is connected and, if connected, causes power to be routed to the electrical power converter to activate the electrical power converter. When the device is not detected, the electrical power converter is deactivated until the device is reconnected.

Abstract: A controller circuit for activating and deactivating an electrical power converter that provides power to a device includes power input terminals on a primary side, and power output terminals on a secondary side, which are configured to provide power to the device. The controller circuit includes a detection circuit configured to determine whether the device is connected and, if connected, causes power to be routed to the electrical power converter to activate the electrical power converter. When the device is not detected, the electrical power converter is deactivated until the device is reconnected.

Abstract: The present techniques include methods and systems for operating an inverter to maintain a lifespan of the inverter. In some embodiments, the switching frequency and/or the output current of the inverter may be changed such that stress may be reduced on the inverter bond wires of the inverter. More specifically, embodiments involve calculating the aging parameters for certain operating conditions of the inverter and determining whether the operating conditions result in aging the inverter to a point which reduces the inverter lifespan below a desired lifespan. If the operating conditions reduce the inverter lifespan below the desired lifespan, the switching frequency may be reduced to a lower or minimum switching frequency of the inverter and/or the output current of the inverter may be reduced to a maximum output current at the minimum switching frequency.

Abstract: A reactor 1 of the present invention includes a coil 2 and a magnetic core 3 disposed inside and outside the coil 2 to form a closed magnetic path. At least part of the magnetic core 3 is made of a composite material containing a magnetic substance powder and a resin containing the powder being dispersed therein. The magnetic substance powder contains powders respectively made of a plurality of materials differing in the relative permeability, representatively, a pure iron powder and an iron alloy powder. Thanks to provision of the magnetic core 3 made of the composite material containing magnetic substance powders made of different types of materials, the reactor 1 achieves both a high saturation magnetic flux density and a low-loss characteristic.

Abstract: Cascade H-Bridge inverters and carrier-based level shift pulse width modulation techniques are presented for generating inverter stage switching control signals, in which carrier waveform levels are selectively shifted to control THD and to mitigate power distribution imbalances within multilevel inverter elements.

Abstract: An apparatus and a method of operating the apparatus. The apparatus includes a driver circuit and a memory circuit. The driver circuit may be configured to precharge a hitline in response to a predetermined voltage level and a control signal and sense a result of a compare operation based upon a hitline signal on the hitline. The driver circuit generally precharges the hitline to a voltage level lower than the predetermined voltage level and senses the result of the compare operation using the full predetermined voltage level. The memory circuit may be configured to perform the compare operation using the hitline.

Abstract: Described are memory apparatus organized in physical banks and including configurable data control circuit to support multiple data-width configurations. Relatively narrow width configurations load fewer sense amplifiers, resulting in reduced power usage for relatively narrow memory configurations. Also described are memory controllers that convey configuration value to configurable memory apparatus and support point-to-point data buffers for multiple width configurations.

Abstract: A microelectronic structure has active elements defining a storage array, and address inputs for receipt of address information specifying locations within the storage array. The structure has a first surface and can have terminals exposed at the first surface. The terminals may include first terminals and the structure may be configured to transfer address information received at the first terminals to the address inputs. Each first terminal can have a signal assignment which includes one or more of the address inputs. The first terminals are disposed on first and second opposite sides of a theoretical plane normal to the first surface, wherein the signal assignments of the first terminals disposed on the first side are a mirror image of the signal assignments of the first terminals disposed on the second side of the theoretical plane.

Abstract: A column of a memory includes a first edge cell and at least one memory cell. The first edge cell is located at a first edge of the column and includes a first edge cell reference node and a second edge cell reference node. Each of the at least one memory cells includes a first memory reference node. The first edge cell reference node is coupled to respective first memory reference nodes of the at least one memory cell. The second edge cell reference node serves as second memory reference nodes of the at least one memory cell. Front-end layers of the first edge cell are the same as front-end layers of a memory cell of the at least one memory cell.

Abstract: An anti-fuse one-time-programmable (OTP) nonvolatile memory cell has a P well substrate with two P? doped regions. Another N+ doped region, functioning as a bit line, is positioned adjacent and between the two P? doped regions on the substrate. An anti-fuse is defined over the N+ doped region. Two insulator regions are deposited over the two P? doped regions. An impurity doped polysilicon layer is defined over the two insulator regions and the anti-fuse. A polycide layer is defined over the impurity doped polysilicon layer. The polycide layer and the polysilicon layer function as a word line. A programmed region, i.e., a link, functioning as a diode, is formed on the anti-fuse after the anti-fuse OTP nonvolatile memory cell is programmed. The array structure of anti-fuse OTP nonvolatile memory cells and methods for programming, reading, and fabricating such a cell are also disclosed.

Abstract: A one-time programmable memory includes a first one-time programmable memory cell including a fuse core having an input terminal for receiving a trim signal, an output terminal for providing a sense signal, and a fuse. The fuse core conducts current through the fuse in response to the trim signal. The one-time programmable memory cell also includes a sense circuit having an input terminal coupled to the output terminal of the fuse core, and an output terminal for providing a termination signal, and a logic circuit having a first input terminal for receiving a program enable signal, a second input terminal for receiving a data signal, a third input terminal coupled to the output terminal of the sense circuit for receiving the termination signal, and an output terminal coupled to the input terminal of the fuse core for providing the trim signal.

Abstract: A method for blocking current leakage through defective memory cells in a memory array is provided. The memory cells include access devices and programmable resistance memory elements. The method includes identifying addresses of defective memory cells in the memory array, and applying a modifying bias condition to modify the defective memory cells at the identified addresses. The modifying bias condition causes the defective memory cells to transform into a current blocking condition. The method also includes storing the identified addresses in a redundancy table of addresses. An automatic test system includes a device tester adapted to identify addresses of defective memory cells in a memory array in an integrated circuit under test, and to apply a modifying bias condition to modify the defective memory cells at the identified addresses.

Abstract: A memory array is disclosed having bipolar current-voltage (IV) resistive random access memory cells with built-in “on” state rectifying IV characteristics. In one embodiment, a bipolar switching resistive random access memory cell may have a metal/solid electrolyte/semiconductor stack that forms a Schottky diode when switched to the “on” state. In another embodiment, a bipolar switching resistive random access memory cell may have a metal/solid electrolyte/tunnel barrier/electrode stack that forms a metal-insulator-metal device when switched to the “on” state. Methods of operating the memory array are also disclosed.

Abstract: Some embodiments include methods and apparatus having a module configured to program a memory cell using a signal to cause the memory cell to have a programmed resistance value, to adjust a programming parameter value of the signal if the programmed resistance value is outside a target resistance value range, and to repeat at least one of the programming and the adjusting if the programmed resistance value is outside the target resistance value range, the signal including a different programming parameter value each time the programming is repeated.

Abstract: Provided is a data write method for writing data to a nonvolatile memory element, the data write method including: a first application step of applying a first voltage pulse for changing a resistance state of the nonvolatile memory element from a first state to a second state; a second application step of applying a second voltage pulse which has a same polarity as the first voltage pulse and a voltage value of which has a smaller absolute value than the first voltage pulse; a determination step of determining whether the resistance state of the nonvolatile memory element is the second state; and a third application step of applying a third voltage pulse for changing the resistance state of the nonvolatile memory element from the first state to the second state when it is determined that the resistance state of the nonvolatile memory element is not the second state.

Abstract: A memory mat (101) includes a main body portion (200) that includes a first capacitor (203A), a linear conductive film (204) that is formed between the main body portion (200) and a peripheral circuit (104), and a second capacitor (203B) that is formed to be in contact with the conductive film (204) at a bottom of the second capacitor (203B). The first capacitor (203A) is in contact with a contact layer (202) at a bottom of the first capacitor (203A).

Abstract: A method of operating a memory circuit compatible with dynamic random access memories (DRAM) and static random access memories (SRAM) is disclosed. The method includes selecting a word line (708) connected to a row of memory cells in response to a plurality of row address signals and selecting a plurality of columns (706,710) of memory cells in response to a plurality of column address signals. A first part (714) of the plurality of columns is selected in response to a first voltage applied to the selected word line. A second part (716) of the plurality of columns is selected in response to a second voltage applied to the selected word line.

Abstract: A method and circuit for implementing write assist for Static Random Access Memory (SRAM) arrays, and a design structure on which the subject circuit resides are provided. The circuit includes a write driver including a common bit line supply node, and a common bit line source node. The circuit includes voltage boost circuitry that temporarily boosts the common bit line supply node above supply voltage and temporarily boosts the common bit line source node below source voltage through isolation devices for applying the boosted source and supply voltages to a selected SRAM cell during a write operation. Splitting the boost differential between the common bit lines decreases an overall device voltage differential for providing substantially enhanced reliability of the SRAM array.

Abstract: A method for refreshing static random access memory comprises providing at least one six-transistor static random access memory cell disposed on a substrate and providing a light source emitting light. The six-transistor static random access memory cell comprises two storage nodes, two pass transistors, two load transistors, and two driver transistors, the drain diffusion regions of the load transistors forming pn-junctions with the substrate. A portion of the light emitted by the light source is absorbed and converted to minority carriers in the substrate, The minority carriers diffuse through the substrate, and a portion of the minority carriers reach the pn-junctions and cause the pn-junctions to generate electrical current. The electrical current generated charges the storage nodes.

Abstract: A semiconductor memory includes an array of volatile memory cells, wherein one of the volatile memory cells has transistors connected in a first memory cell circuit, and at least one non-volatile memory cell having transistors connected in a second memory cell circuit, wherein the transistors in the first memory cell circuit are at least one more than the transistors in the second memory cell circuit.

Abstract: A SRAM includes a first CMOS inverter of first and second MOS transistors connected in series, a second CMOS inverter of third and fourth MOS transistors connected in series and forming a flip-flop circuit together with the first CMOS inverter, and a polysilicon resistance element formed on a device isolation region, each of the first and third MOS transistors is formed in a device region of a first conductivity type and includes a second conductivity type drain region at an outer side of a sidewall insulation film of the gate electrode with a larger depth than a drain extension region thereof, wherein a source region is formed deeper than a drain extension region, the polysilicon gate electrode has a film thickness identical to a film thickness of the polysilicon resistance element, the source region and the polysilicon resistance element are doped with the same dopant element.

Abstract: A low sensing current non volatile flip flop includes a first stage to sense a resistance difference between two magnetic tunnel junctions (MTJs) and a second stage having circuitry to amplify the output of the first stage. The output of the first stage is initially pre-charged and determined by the resistance difference of the two MTJs when the sensing operation starts. The first stage does not have a pull-up path to a source voltage (VDD), and therefore does not have a DC path from VDD to ground during the sensing operation. A slow sense enable (SE) signal slope reduces peak sensing current in the first stage. A secondary current path reduces the sensing current duration of the first stage.

Abstract: Spin Torque Transfer (STT) memory cell structures and methods are described herein. One or more STT memory cell structures include a tunneling barrier material positioned between a ferromagnetic storage material and a pinned ferromagnetic material in contact with an antiferromagnetic material. The tunneling barrier material is a multiferroic material and the antiferromagnetic material, the ferromagnetic storage material, and the pinned ferromagnetic material are positioned between a first electrode and a second electrode.

Abstract: A spin toque transfer magnetic random access memory (STTMRAM) element comprises a reference layer, which can be a single layer structure or a synthetic multi-layer structure, formed on a substrate, with a fixed perpendicular magnetic component. A junction layer is formed on top of the reference layer and a free layer is formed on top of the junction layer with a perpendicular magnetic orientation, at substantially its center of the free layer and switchable. A spacer layer is formed on top of the free layer and a fixed layer is formed on top of the spacer layer, the fixed layer has a fixed perpendicular magnetic component opposite to that of the reference layer. The magnetic orientation of the free layer switches relative to that of the fixed layer. The perpendicular magnetic components of the fixed layer and the reference layer substantially cancel each other and the free layer has an in-plane edge magnetization field.

Abstract: Embodiments disclosed herein may relate to heating a phase change memory (PCM) cell.

Abstract: Recording and erasing of data in PRAM have hitherto been performed based on a change in physical characteristics caused by primary phase-transformation of a crystalline state and an amorphous state of a chalcogen compound including Te which serves as a recording material. Since, however, a recording thin film is formed of a polycrystal but not a single crystal, a variation in resistance values occurs and a change in volume caused upon phase-transition has placed a limit on the number of times of readout of the record. In one embodiment, the above problem is solved by preparing a solid memory having a superlattice structure with a thin film containing Sb and a thin film containing Te. The solid memory can realize the number of times of repeated recording and erasing of 1015.

Abstract: Subject matter disclosed herein relates to a method of manufacturing a semiconductor integrated circuit device, and more particularly to a method of fabricating a phase change memory device.

Abstract: Spin Torque Transfer (STT) memory cell structures and methods are described herein. One or more STT memory cell structures comprise an annular STT stack including a nonmagnetic material between a first ferromagnetic material and a second ferromagnetic material and a soft magnetic material surrounding at least a portion of the annular STT stack.

Abstract: A memory cell is provided that includes a first conductor, a second conductor, and a semiconductor junction diode between the first and second conductors. The semiconductor junction diode is not in contact with a material having a lattice mismatch of less than 12 percent with the semiconductor junction diode. Numerous other aspects are provided.

Abstract: Non-volatile memory cells and methods. In an apparatus, an array of non-volatile storage cells formed in a portion of a semiconductor substrate includes a first storage cell having a first bit cell and a second bit cell; a second storage cell having a third bit cell and a fourth bit cell; and a column multiplexer coupled to a plurality of column lines, selected ones of the column lines coupled to a first source/drain terminal of the first and the second storage cell and coupled to a second source/drain terminal of the first and second storage cell, the column multiplexer coupling a voltage to one of the column lines connected to the first storage cell corresponding to the data, and coupling a voltage to one of the column lines connected to the second storage cell corresponding to the complementary data. Methods for operating the non-volatile memory cells are disclosed.

Abstract: According to one embodiment, a semiconductor memory device includes a memory cell, a flag memory cell for a flag, a dummy cell and a controller. The flag memory cell is selected at the same time as the memory cell. The dummy cell is selected at the same time as the memory cell and the flag memory cell. The controller controls write and read of the memory cell, the flag memory cell and the dummy cell. Data is written also in the dummy cell which neighbors the flag cell.

Abstract: A memory device includes: a plurality of nonvolatile memory sections configured to allow one memory cell to record data of a plurality of bits, and to include a corresponding number of pages to the plurality of bits in accordance with a plurality of the memory cells as a write control unit; and a control section configured to control writing and reading data to and from the plurality of nonvolatile memory sections, wherein among the plurality of nonvolatile memory sections, if data is written into one of the nonvolatile memory sections, the data is written for each page in sequence from a low-order page to a high-order page, and when the data is written into the low-order page, control is performed such that the data to be written into the low-order page is written into any area of the other of the nonvolatile memory sections at same timing.

Abstract: Integrated circuit memory devices include an array of nonvolatile N-bit memory cells, where N is an integer greater than one. Control circuitry is also provided to reliably read data from the N-bit memory cells. This control circuitry, which is electrically coupled to the array, is configured to determine, among other things, a value of at least one bit of data stored in a selected N-bit memory cell in the array. This is done by decoding at least one hard data value and a plurality of soft data values (e.g., 6 data values) read from the selected N-bit memory cell using a corresponding plurality of unequal read voltages applied to the selected N-bit memory cell during a read operation.

Abstract: A method of programming/reading a multi-bit per cell non-volatile memory with a sequence is disclosed. A plurality of less-significant-bit pages are programmed, and a plurality of consecutive most-significant-bit pages of a plurality of consecutive word lines are programmed one after the other in a consecutive order. The most-significant-bit pages through all word lines in at least one memory block of the non-volatile memory are programmed or read after the less-significant-bit pages through all the word lines in the at least one memory block are programmed or read.

Abstract: A NAND flash memory includes a plurality of NAND flash memory structures separated by an insulating layer. In one embodiment of the present disclosure, the NAND flash memory structure includes a first bitline extending along a first direction, a first charge-trapping region positioned over the first bitline, a wordline positioned over the first charge-trapping region and extending along a second direction, a second charge-trapping region positioned over the wordline, and a second bitline positioned over the second charge-trapping region, wherein the first charge-trapping region and the second charge-trapping region are stacked along a third direction substantially perpendicular to the first direction and the second direction.

Abstract: A semiconductor memory device includes: a semiconductor region extending vertically from a first region of a substrate; a plurality of gate electrodes disposed on the first region of the substrate in a vertical direction, but separated from each other along a sidewall of the semiconductor region; a gate dielectric layer disposed between the semiconductor region and the plurality of gate electrodes; a substrate contact electrode extending vertically from the impurity-doped second region of the substrate; and an insulating region formed as an air gap between the substrate contact electrode and at least one of the plurality of gate electrodes.

Abstract: The present disclosure includes methods, devices, and systems for determining and using soft data in memory devices and systems. One or more embodiments include an array of memory cells and control circuitry coupled to the array. The control circuitry is configured to perform a number of sense operations on the memory cells using a number of sensing voltages to determine soft data associated with a target state of the memory cells, and adjust a sensing voltage used to determine the target state based, at least partially, on the determined soft data.

Abstract: A NAND flash memory in which a command/address pin is separated from a data input/output pin. The NAND flash memory includes a memory cell array used for storing data, a command/address pin through which a command and an address are received for transmitting data in the memory cell array, and a data input/output pin through which data are transmitted in the memory cell array. The command/address pin is separated from the data input/output pin in the NAND flash memory. Data input/output speed is increased. Furthermore, the NAND flash memory can perform a bank interleaving operation with a minimal delay time.

Abstract: According to one embodiment, a semiconductor memory apparatus includes an array, a source, a bit line, a sense, and current circuit. The array includes a NAND string. The NAND string includes memory cell. The sense includes a first transistor. One end of transistor is connected to a first node, and other end of the transistor is connected to a second. The first node is used for reading the data held by the memory cell. An internal voltage is smaller than the source voltage. The current circuit outputs a first voltage to a gate of the transistor, and the first voltage is smaller than the internal voltage. The transistor limits a first current from the source to the sense based on a threshold voltage of the memory cell to be read.

Abstract: Strings of series-coupled memory cells selectively coupled to the same bit line may facilitate increased memory densities, reduced fabrication steps and faster read operations when compared to traditional memory array architectures. Reading of the memory cells may be accomplished using charge sharing techniques similar to read operations in a DRAM device.