Abstract: A air channeling sub-system may include a mechanical cooling section and a direct evaporative cooling section. The direct evaporative cooling section may be downstream from the mechanical cooling section. Cooling air is channeled through the air channeling sub-system and into the room. If a first set of control conditions is met, the air channeling sub-systems is operated in an adiabatic mode. The adiabatic mode includes channeling cooling air through the direct evaporative cooling section to evaporate water into the cooling air. If a second set of control conditions is met, the air channeling sub-system is operated in a hybrid mode. The hybrid mode includes channeling cooling air through the mechanical cooling section to remove heat from the cooling air and channeling the cooling air through the direct evaporative cooling section to evaporate water into the cooling air.

Abstract: An adjustable heat sink assembly includes a thermo-conductive bottom panel having a flat contact face protruded from the bottom wall thereof, elevation-adjustment fasteners mounted in the thermo-conductive bottom panels and fastened to a circuit board and vertically adjusted to keep the flat contact face in positive contact with a heat source at the circuit board, a thermo-conductive top panel, pitch-adjustment fasteners joining the thermo-conductive bottom panel and the thermo-conductive top panel and adjustable to control the distance between the thermo-conductive bottom panel and the thermo-conductive top panel and to keep the thermo-conductive top panel in positive contact with the housing, face panel or radiation fin of the electronic apparatus using the circuit board, and heat pipes connected between the thermo-conductive bottom panel and the thermo-conductive top panel.

Abstract: A portable computer having a heat dissipation structure includes a main body in which a heat generation device generating heat is arranged, wherein a sealed space that is sealed to prevent intrusion of external water and an exposed space into which external air is taken, a heat transfer unit connected to the heat generation device and extended to the exposed space in the sealing space of the main body and transferring the heat of the heat generation device to the exposed space, and a heat dissipation unit arranged in the exposed space of the main body and dissipating the heat transferred by the heat transfer unit. The intrusion of water into the main body may be prevented and simultaneously the heat generated by the heat generation devices may be efficiently dissipated. Thus, the portable computer may be used even in an inferior outdoor environment during rain.

Abstract: An electronic device includes a mainboard and a fan mounted on the mainboard. The fan includes a stator and a rotor. The rotor includes a hub covering around a periphery of the stator, and a plurality of blades disposed at a periphery of the hub. The stator is directly fixed to and directly electrically connected to the mainboard.

Abstract: There is disclosed a mounting assembly for structurally mounting a peripheral device to a portable computer. The mounting assembly comprises a bracket arranged to be structurally secured to the portable computer and comprising a first coupling; and a second coupling which in use is attached to or part of the peripheral device. The first and second couplings are arranged to be releasably engaged to form a structural connection, such that in use the peripheral device can be structurally mounted to the portable computer. There is also disclosed a portable computing apparatus comprising a portable computer, a peripheral device and a mounting assembly; and a electronic entry control board for mobile telemetry monitoring apparatus comprising a portable computer, a wireless communication unit and a mounting assembly.

Abstract: Disclosed is a tablet PC. The tablet PC includes a pad main body which includes an input portion for inputting predetermined data, and an output portion for outputting results corresponding to input data; a detachable auxiliary device which is detachably coupled to one side of the pad main body to assist functions of the pad main body; and a fastening unit which is provided in the pad main body and fastens the detachable auxiliary device to the pad main body. With this, it is possible to use various auxiliary functions such as convenience in mobility, physical distribution management, inventory control, payment, personal authentication, etc.

Abstract: An electrical apparatus, comprises a restricted breathing enclosure having an interior cavity, and a temperature regulator having at least an interior sensing portion within the interior cavity, the temperature regulator including a processor responsive to the interior sensing portion to send control signals to a heat transfer portion of the temperature regulator.

Abstract: An improved electronic communications system and process 100 with front to back cooling can be provided in which the flow of influent cooling air can be directed horizontally through an intake cooling plenum chamber 145-146 positioned above or below line cards 127-129 and then passed downwardly through an inlet side cooling plenum 139-141. The cooling air can thereafter be propelled sideways, laterally and horizontally across passageways 138 between the line cards to remove heat generated by the line cards. The effluent heated air can be passed upwardly through an outlet side cooling plenum 142-144 and can be discharged through an exhaust cooling plenum to chamber 147-148 which can be diagonally separated from the intake cooling plenum chamber 145-146 by a fluid-impermeable plate 149-151.

Abstract: A heat-dissipating type of power converter comprises a support unit, at least one power module, at least one pair of rails and at least one main air duct module corresponding to the at least one power module. The pair of rails are fixed to the support unit and parallel to each other. The power module comprises a mounting plate module, a power unit and a radiator. wherein the power unit is fixed to the radiator, and the mounting plate module and the radiator are fixedly connected to each other. the main air duct module is fixed to the support unit and provided between the pair of rails, a second opening is defined in a side of the main air duct module toward the power module. The power module is assembled with or disassembled from the main air duct module by sliding along the pair of rails.

Abstract: A heat-dissipating system for high-power cabinet is provided, which comprises: a cabinet; at least one main air duct, which is formed in the cabinet with a first opening and a second opening, and a first heat-generating assembly, a second heat-generating assembly and at least one first fan, which are mounted in the at least one main air duct, wherein the first fan is mounted between the first heat-generating assembly and the second heat-generating assembly; and the outlet of the first fan faces the first heat-generating assembly, airflow enters the main air duct from the first opening of the main air duct, flows through the second heat-generating assembly, an inlet of the first fan, an outlet of the first fan, and the first heat-generating assembly in sequence, and finally is discharged out of the cabinet from the second opening of the main air duct cabinet.

Abstract: A communication module-cooling structure includes a main body section to be cooled by a cooling mechanism, and a heat sink including a cooling receiving section including partition walls and slit-shaped receiving spaces defined by the partition walls. The receiving spaces of the cooling receiving section receive communication modules, and each of the communication modules includes a substrate mounted with a communication circuit component thereon and first and second sidewalls which sandwich the substrate therebetween in a thickness direction of the substrate. At least one of the first and second sidewalls of each of the communication modules is in surface contact with an inner surface of each of the receiving spaces.

Abstract: A power electronics system includes a multipart housing having three housing elements of cuboid basic structure to define a central element with inlet and outlet ports for a cooling liquid, an upper and lower cover elements which are arranged on opposite connection surfaces of the central element. A plurality of power electronics switching devices is accommodated in the housing, and a condenser device having condenser connection elements is arranged in the central element of the housing> Further provided is a liquid cooling system having at least one first upper cooling chamber between the central element and the upper cover element, and at least two first and second lower cooling chambers between the central element and the lower cover element. The upper and lower cooling chambers are configured for circulation of the cooling liquid entering through the inlet port and exiting through the outlet port of the housing.

Abstract: Systems and methods for thermally enhanced electronic component packaging with through mold vias are described. In some embodiments, a method may include forming one or more vias through an encapsulant with a laser, each of the one or more vias having one end proximal a top surface of an electronic component covered by the encapsulant and another end proximal an outer surface of the encapsulant. The method may also include inserting a thermally conductive material into the one or more vias, providing a heat spreader over the outer surface of the encapsulant, the heat spreader thermally coupled to the thermally conductive material, and reflowing the thermally conductive material.

Abstract: Heat dissipation resources are allocated in an optical communications module based on the sensitivity of electrical and optoelectronic components of the module to temperature. Components that have a higher sensitivity to temperature are allocated a greater proportion of available heat dissipation resources than components that have a lower sensitivity to temperature. In addition, heat dissipation resources that are allocated to components that have different sensitivities to temperature are thermally decoupled from one another.

Abstract: A power FET (100) comprising a leadframe including a pad (110), a first lead (111), and a second lead (112); a first metal clip (150) including a plate (150a), an extension (150b) and a ridge (150c), the plate and extension spaced from the leadframe pad and the ridge connected to the pad; a vertically assembled stack of FET chips in the space between the plate and the pad, the stack including a first n-channel FET chip (120) having the drain terminal on one surface and the source and gate terminals on the opposite surface, the drain terminal attached to the pad, the source terminal attached to a second clip (140) tied to the first lead; and a second n-channel FET chip (130) having the source terminal on one surface and the drain and gate terminals on the opposite surface, the source terminal attached to the second clip, its drain terminal attached to the first clip; wherein the drain-source on-resistance of the FET stack is smaller than the on-resistance of the first FET chip and of the second FET chip.

Abstract: Described herein is an apparatus for dissipating or transferring heat from electronics secured in a housing unit. A housing unit includes a cover having a first fastener part and a base having a second fastener part. The base further includes a support structure for holding a printed circuit board (PCB) with mounted electronic components. A heat sink is placed within the base. The first fastener part and the second fastener part lock the cover and base together, with the heat sink and the PCB being secured between the support structure and the cover.

Abstract: An electronic device includes a sidewall, a circuit board arranged on the sidewall, an electronic component set on a side of the circuit board opposite to the sidewall, and a heat dissipation assembly connected between the sidewall and the circuit board.

Abstract: A cooling structure for a shunt resistor has a semiconductor switching element mounted on a component side of a circuit board, a shunt resistor surface-mounted a solder side of the circuit board, a radiator for releasing heat generated from the semiconductor switching element and the shunt resistor, and an insulating material interposed between the shunt resistor and the radiator and having a high thermal conductivity.

Abstract: Methods for producing a circuit board system and a circuit board arrangement are disclosed. One method for producing a circuit board system includes: providing a first circuit board including a top side, a bottom side, a top metallization layer arranged at the top side, and a bottom metallization layer arranged at the bottom side, wherein the bottom metallization layer comprises a number of soldering pads; applying a first solder over the soldering pads; and applying a second solder over the top metallization layer. The method further includes providing a number of electronic components and a metallic or metallized shielding frame; arranging the number of electronic components and the shielding frame on the applied second solder; and soldering the number of electronic components and the shielding frame to the top metallization layer with the second solder.

Abstract: An apparatus including an automated banking machine is operative to cause financial transfers responsive at least in part to data read from data bearing records. The machine includes a card reader that is operative to read card data usable to identify at least one of a user of the machine and a financial account. A computer associated with the machine is operative to cause card data to be read through operation of the card reader, and to cause a determination to be made that read card data corresponds to a financial account authorized to conduct a transaction through the machine. The computer is operative responsive at least in part to the determination to cause the financial account to be at least one of assessed and credited with a value associated with a financial transaction. Transaction function devices of the machine are supported through slides that can be configured in different ways to facilitate mounting of devices within the machine.

Abstract: A hinge for pivotally interconnecting first and second brackets includes a shaft having a shaft body extending through the first and second brackets and formed with an engaging end portion proximate to the second bracket, a fixing member connected to the engaging end portion, a ratchet sleeved rotatably on the shaft body between the fixing member and the second bracket, a friction mechanism having an urging unit sleeved on the shaft body between the ratchet and the fixing member and pressing the ratchet toward the second bracket, and a brake mechanism disposed on the second bracket and having a pawl member releasably engaged to the ratchet.

Abstract: A circuit module includes a circuit board and electronic components mounted on the circuit board. The mounted electronic components include at least one discrimination-target electronic component and at least one module-discrimination electronic component. In addition, the circuit board includes land electrodes allowing the module-discrimination electronic component to be mounted at different positions and/or orientations with respect to the circuit board, and the module-discrimination electronic component is mounted at any one position and/or orientation among different positions and/or orientations with respect to the circuit board in accordance with the type of the discrimination-target electronic component.

Abstract: Maintenance of reliable and highly available electronic systems to perform servicing and preventive maintenance may need to be performed without interruption of operations. Removal of circuit cards from a chassis may render the connectors on a chassis vulnerable to inadvertent short circuiting of power sources by stray metallic objects. A configuration where the power is removed from a connector as the circuit card is being extracted eliminates his possibility. The control circuits for the power supply connections and the power supplies are themselves redundant so that they may be similarly serviced.

Abstract: An electronic module includes: a first substrate having first surface on which a first sensor element is provided and a second surface on which a circuit element is provided; a second substrate having a third surface on which a second sensor element is provided; a third substrate having a fifth surface on which a third sensor element is provided; a first connecting portion connecting the first substrate and the second substrate to each other; and a second connecting portion connecting the first substrate and the third substrate to each other. A shield layer is provided between the first sensor element and the circuit element.

Abstract: A printed-circuit board arrangement electrically connects the at least one transmitter and/or receiver unit with at least one antenna element, whereas the at least one transmitter and/or receiver unit and the at least one antenna element are at least partially integrated into the printed-circuit board arrangement. In this context, the printed-circuit board arrangement includes different printed circuit boards, which are mechanically connected to one another in a rigid manner. A first part of the printed-circuit board arrangement is formed by at least one printed-circuit board, of which the substrate is made from a first material which is suitable for high-frequency, and a second part of the printed-circuit board arrangement is formed by at least one printed-circuit board, of which the substrate is made from a second material different from the first material, which is still sufficiently suitable for a low frequency and/or for a direct-voltage range.

Abstract: A terminal includes: a touch unit that includes first electrodes connected in a first diagonal direction, the first diagonal direction being oblique to each side of the touch unit, and a second electrodes disposed in the second diagonal direction which intersects the first diagonal direction, the second diagonal direction being oblique to each side of the touch unit, and a Printed Circuit Board (PCB) configured to receive information generated in response to electric signals from one or more of the first electrodes and the second electrodes. Accordingly, a width of the terminal may be reduced as signal wirings need not be formed at the side surface thereof.

Abstract: A laminating method of a chip on flexible printed circuit board (COF) and a printed circuit board assembly (PCBA) includes arranging an isolation groove on one side or two sides of a laminating area of the PCBA, which is laminated with the COF. The method further includes laminating the COF onto the PCBA by using a high-temperature laminating bit, so that the PCBA and the COF are connected in the laminating area.

Abstract: According to an embodiment, a joint structure of package members housing or holding an electronic component includes a first member, a second member joined to the first member, and a joint portion provided between the first member and the second member. The joint portion contains a metal element with a melting point of 400° C. or more and the metal element of 98 percent by weight or more.

Abstract: A dual screen electronic device includes a main device having a first casing and a display screen, and a detachable display module. The first casing has a first opening. The display screen is located on the first casing and exposed from the first opening. The detachable display module includes a second casing, a power supply module, an electrophoretic display (EPD) module, and a control module. The second casing is detachably positioned on the first casing, and has a second opening. The power supply module is arranged on the second casing. The EPD module is fixed to the second casing, or is detachably positioned on the second casing, and has a display region exposed from the second opening. The control module is selectively located on the second casing or on the EPD module, and is electrically connected to the EPD module and the power supply module.

Abstract: A drip-proof structure of an electronic apparatus in which a printed circuit board is fixed to a stud provided on a housing includes a concave portion and/or a convex portion that is provided around the stud on the housing. Therefore, when a liquid, such as a cutting fluid, flows on the housing, the flow of the liquid from the stud to the printed circuit board is prevented by the concave portion and/or the convex portion.

Abstract: An electronic device includes: a case; a first board that includes a first connector; a positioning section that positions the first board with respect to the case; a second board that includes a second connector; a guide rail that has an end portion on the first board side formed with a fitting port into which the first connector fits, and that guides the second connector towards the first connector that is fitted into the fitting port; a pair of sloping portions formed to edge portions on both guide rail pivot direction sides of the fitting port; and a pair of stoppers respectively disposed at each of the guide rail pivot direction sides so as to restrict the pivot range of the guide rail such that the first connector is insertable between the pair of sloping portions.

Abstract: Off-plane conductive line interconnects may be formed in microelectronic devices. In one example, such as device includes a first set of metal conductive lines in a dielectric substrate at a first horizontal layer of the substrate, a second set of metal conductive lines in the substrate at the first horizontal layer of the substrate and vertically offset from the first set of metal lines, and a dielectric material insulating the metal lines from each other and the first horizontal layer from other horizontal layers. Vias in the dielectric material to connect both the first and second set of metal lines to metal lines at a second horizontal layer of the substrate.

Abstract: A bonding wire according to the invention contains a core having a surface, in which the core contains silver as a main component and at least one element selected from gold, palladium, platinum, rhodium, ruthenium, nickel, copper, and iridium. The wire exhibits at least one of the following properties: I. an average size of crystal grains of the core is between 0.8 ?m and 3 ?m, II. the amount of crystal grains having an orientation in the <001> direction in a wire cross section is in a range of 10-20%, III. the amount of crystal grains having an orientation in the <111> direction in a wire cross section is in a range of 5-15%, and IV. the total amount of crystal grains having orientations in the <001> and <111> directions in a wire cross section is in a range of 15-40%.

Abstract: A wiring board includes: a core layer having a through hole therethrough and comprising a first surface and a second surface opposite to the first surface; a first wiring layer formed on the first surface of the core layer and having a first opening which is communicated with the through hole, wherein an opening area of the first opening is larger than that of the through hole in a plan view; an electronic component disposed in the through hole and the first opening and having a first surface, and a second surface opposite to the first surface, the electronic component further having a pair of terminal on the first surface thereof; and a first resin layer filled in the through hole, the first opening and a gap between the pair of terminals so as to cover the second surface and the side surface of the electronic component.

Abstract: An electronic component incorporated substrate includes a first substrate and a second substrate that are electrically connected to each other by a spacer unit. An electronic component is mounted on the first substrate and arranged between the first substrate and the second substrate. An encapsulating resin fills a space between the first substrate and the second substrate to encapsulate the electronic component. The spacer unit includes a stacked structure of a metal post and a solder ball stacked in a stacking direction of the first substrate and the second substrate. The spacer unit further includes an insulation layer that is formed on the second substrate and covers a side wall of the metal post.

Abstract: A through-hole stub AC termination circuit including a resistor and a capacitor, is connected to an open end of a stub of a through-hole provided in a circuit board.

Abstract: Representative implementations of devices and techniques provide isolation between a carrier and a component mounted to the carrier. A multi-layer device having lateral elements provides electrical isolation at a preset isolation voltage while maintaining a preselected thermal conductivity between the component and the carrier.

Abstract: A circuit device according to one exemplary embodiment includes a ceramic substrate, a first conductive pattern provided on one face of the ceramic substrate, a second conductive pattern, formed mainly of Cu, which is provided on the other face of the ceramic substrate, and a semiconductor element provided on an island that constitutes the second conductive pattern. An electrode, whose outermost surface is formed mainly of Cu, is provided in the semiconductor element, and the interface between the island and the electrode is directly fixed by solid-phase bonding.

Abstract: An electronic component incorporated substrate includes a first substrate and a second substrate electrically connected to each other by a spacer unit. An electronic component is mounted on the first substrate and arranged between the first substrate and the second substrate. A first encapsulating resin is formed between the first substrate and the second substrate to encapsulate the electronic component. A second encapsulating resin is formed on a first surface of the first encapsulating resin to fill a space between the first encapsulating resin and the second substrate. The spacer unit includes a stacked structure of a first solder ball, a metal post, and a second solder ball stacked in a stacking direction of the first substrate and the second substrate.

Abstract: Components may be mounted to printed circuit substrates using solder. A breakaway support tab may be detachably connected to a component and may help prevent the component from shifting or toppling over during reflow operations. The component and breakaway support tab may be formed from sheet metal. The interface that links the component to the breakaway support tab may be perforated or half sheared to allow the breakaway support tab to be easily separated from the component following reflow operations. The breakaway support tab may be fixed in place during reflow operations by mechanically coupling the breakaway support tab to a fixture or by mounting the breakaway support tab to an unused portion of a panel of printed circuit substrates. A breakaway support tab may be mechanically coupled between two components on a printed circuit substrate and may be used to maintain a distance between the components during reflow operations.

Abstract: A plug-in board replacement method includes preparing a board having a piece board, forming first conductive pattern on first surface of the board, forming second conductive pattern on second surface on the opposite side such that the second pattern is on the opposite side of the first pattern, irradiating laser upon the first and second surfaces along the first and second patterns such that the piece is cut out from the board, and fitting the piece into another board. The irradiating includes irradiating laser upon the first surface along the first pattern such that laser is irradiated along the border between edge portion of the first pattern and the first surface and laser upon the second surface along the second pattern such that laser is irradiated along the border between edge portion of the second pattern and the second surface such that the piece is cut out through the board.

Abstract: A mount base includes: a rotary seat rotatably provided against a stand unit by a shaft member, the shaft member being fixed to the stand unit; a rotary prop that rotates along with the rotary seat; and a cable that goes through a fixing portion provided on the rotary prop and a holding portion provided on the shaft member, and connects a first electronic device attached to a tip side of the rotary prop to a second electronic device attached to the stand unit.

Abstract: An electronic apparatus includes a main body having a first surface having a display surface, a second surface opposite to the first surface, and a first support disposed between the first surface and the second surface being capable of contacting with a put-on surface; a stand member attached to the main body having a second support being capable of contacting with the put-on surface; and a hinge unit having a hinge rotatably supporting the stand member against the main body between a first rotational position for standing up the main body on the put-on surface and a second rotational position for laying the main body over the put-on surface, and an elastic member disposed at the hinge for adding a rotational force from a second rotational position side to a first rotational position side.

Abstract: Electronic devices may be provided with conductive structures and antennas mounted near a gap between the conductive structures. A conductive member may be used to at least partially fill the gap in order to prevent emission from the antenna from entering the gap and interfering with the operation of the antenna. The conductive gap-filling member may include a conductive outer layer and a non-conductive inner layer. The inner layer may have opposing edge portions that are attached to each other or may be a continuous tubular insulating layer. The outer layer may be a layer of conductive fabric having opposing edge portions that are attached to each other or to opposing edge portions of the inner layer. An edge portion of the outer layer may be attached to a conductive structure. An insulating material may be formed between another edge portion of the outer layer and a second conductive structure.

Abstract: An electromagnetic shield is provided, for example for a printed circuit board. A shield lid fits onto a base structure having at least two, more typically four, opposing sidewalls. The lid includes a top portion and a lip extending downward from the top portion to cap the base structure. The lid includes at least one deformation inhibiting feature extending downward from the top portion, for placement near or against an interior portion of a sidewall, for example against an edge of a folded-over sidewall. The deformation inhibiting feature may include one or more half-dimples stamped into the lid. In response to an external force, the deformation inhibiting feature presses against its adjacent sidewall in order to brace the shield lid. This inhibits the base structure from deforming the lip due to outward pressure of a sidewall onto a portion of the lip, located opposite the deformation inhibiting feature.

Abstract: The present invention includes a light-emitting element, and a reflector including a reflection face that reflects light from the light-emitting element toward a rectangular area to be photographed. The reflection face includes a pair of first refection faces facing each other with the light-emitting element interposed therebetween in a direction corresponding to a long-side direction demarcating the area to be photographed, and a pair of second reflection faces facing each other with the light-emitting element interposed therebetween in a direction corresponding to a short-side direction demarcating the area to be photographed. Furthermore, a height of the second reflection faces is lower than a height of the first reflection faces. This makes it possible to achieve a lighting apparatus used in photography, which is small and with which the whole area to be photographed is illuminated uniformly.

Abstract: A lighting system includes a low-profile LED driver box with quick connect LED drivers that are accessible through service doors, panels or plates. The LED driver box attaches to a ceiling mount to support or suspend an LED light fixture. The LED light fixture is suspended from the LED driver box through a power-feed suspension mechanism that includes at least one direct current power conductor cable to power to the LED light fixture. The LED light fixture includes one or more linear arrays of LEDs. The system also includes a controller or dimming circuit for controlling light output and/or a backup battery for providing power to the LED light fixture in the event of a power failure.

Abstract: A self cooling light effects device for use in a standard light bulb socket having a socket adaptor, surface embedded LEDs as means to generate light effects, means to control light effects, and means for cooling. Fiber optic cables provide further light effects. Means to control 5 light effects may include a logic board. Means for cooling may be any combination of fans, heat sinks, heat pipes, thermoelectric cooling, a heat conductive filler, and a heat conductive housing.

Abstract: A system includes a layer, a shaftless stepper motor, a lighting element, an input magnet, an output magnet, and a pointer. The layer includes first and second opposed sides. The shaftless stepper motor is disposed on the first opposed side of the layer. The lighting element is disposed on the first opposed side of the layer. The input magnet is disposed on the first opposed side of the layer and is connected to the shaftless stepper motor. The output magnet is disposed on the second opposed side of the layer. The pointer is connected to the output magnet. The input magnet connected to the shaftless stepper motor moves, through magnetism, the output magnet and the connected pointer, and the lighting element transmits lights to light the pointer.

Abstract: A lighting device includes one or more lumiphoric materials spatially segregated from one or more electrically activated (e.g., solid state) emitters and arranged to emit light toward a reflector for reflection of lumiphor-converted light emissions toward a light transmissive end of the lighting device. One or more adjustment elements may be arranged adjust position of the at least one lumiphoric material, and/or to adjust at least one of (a) position, (b) aim, and (c) focus, of the at least one electrically activated light emitting source.