Patents Issued in April 8, 2014
  • Patent number: 8692096
    Abstract: An inbred corn line, designated SLD14, the plants and seeds of the inbred corn line SLD14, methods for producing a corn plant, either inbred or hybrid, produced by crossing the inbred corn line SLD14 with itself or with another corn plant, and hybrid corn seeds and plants produced by crossing the inbred line SLD14 with another corn line or plant and to methods for producing a corn plant containing in its genetic material one or more transgenes and to the transgenic corn plants produced by that method. This invention also relates to inbred corn lines derived from inbred corn line SLD14, to methods for producing other inbred corn lines derived from inbred corn line SLD14 and to the inbred corn lines derived by the use of those methods.
    Type: Grant
    Filed: June 14, 2012
    Date of Patent: April 8, 2014
    Assignee: Agrigenetics Inc.
    Inventor: Kenneth J. Byrnes
  • Patent number: 8692097
    Abstract: An inbred corn line, designated D036013, the plants and seeds of the inbred corn line D036013, methods for producing a corn plant, either inbred or hybrid, produced by crossing the inbred corn line D036013 with itself or with another corn plant, and hybrid corn seeds and plants produced by crossing the inbred line D036013 with another corn line or plant and to methods for producing a corn plant containing in its genetic material one or more transgenes and to the transgenic corn plants produced by that method. This invention also relates to inbred corn lines derived from inbred corn line D036013, to methods for producing other inbred corn lines derived from inbred corn line D036013 and to the inbred corn lines derived by the use of those methods.
    Type: Grant
    Filed: June 14, 2012
    Date of Patent: April 8, 2014
    Assignee: Agrigenetics Inc.
    Inventor: Daniel J. Martinelli
  • Patent number: 8692098
    Abstract: A leg lever adjustment device for a hi-hat musical cymbals device to enable variable adjustment of spacing between an upper cymbal and lower cymbal without the need for hand or foot operation, includes: a) a base support having a connector mechanism for attachment to a hi-hat cymbals device vertical tube; b) a spring-biased cymbal arm rotatably attached to the base support, moveably positioned above the base support; c) a spring so as to bias the cymbal arm upwardly; d) a leg lever connected to the cymbal arm. A user may attach the leg lever adjustment device to a hi-hat such that in the leg lever rest position, the cymbal arm pushes the lower cymbal toward the upper cymbal, and by pressing the leg lever with a leg, pushes the lower cymbal down and away from the upper cymbal to alter impact sound.
    Type: Grant
    Filed: February 26, 2013
    Date of Patent: April 8, 2014
    Inventor: Christopher S. Reinhard
  • Patent number: 8692099
    Abstract: A musical workstation system produces a display presentation in one of a musical composition responsive to musical composition data and responsive to one or both of input variables and a selected operating mode. The system is comprised of (1) means to provide the musical composition data (such as local storage (ROM, RAM, CD-ROM, hard disk etc.), or via a communications interface to an external device (such as another music workstation, a master controller, a computer), a memory, a selection subsystem, a controller, and a display subsystem. The memory selectively stores the received original musical compositions. The selection subsystem determines a selected operating mode and display format. The controller, responsive to the selection subsystem, provides means for selectively controlling the storing of the musical composition data in memory and selectively processing (e.g.
    Type: Grant
    Filed: November 1, 2007
    Date of Patent: April 8, 2014
    Inventor: David H. Sitrick
  • Patent number: 8692100
    Abstract: A method and user interface for data sonification for representing multidimensional numerical information with a plurality of variable-timbre channels are described. The method includes providing a user interface that includes a plurality of metaphors and spatial sound rendering operations resulting in stereo audio output. In one implementation, a metaphor is used in making parameter assignments according to which audio-frequency waveforms having adjustable timbre attributes are generated. In another implementation, timbre attributes are adjustable over a range of timbre variation and are further associated with corresponding metaphors.
    Type: Grant
    Filed: March 18, 2013
    Date of Patent: April 8, 2014
    Inventor: Lester F. Ludwig
  • Patent number: 8692101
    Abstract: Disclosed is a stringed instrument that includes a plurality of strings and a pickup to which each of the plurality of strings is respectively coupled that is connectable to a computer to implement DSP modeling. A serial interface circuit is coupled to the pickup and to a digital connector that formats each digital string vibration signal received from the pickup into a digital serial protocol. A computer is coupled by a serial link to the digital connector such that the computer receives each serially formatted digital string signal (SFDSS). The computer operates at least one audio DSP-based software module to process each received SFDSS wherein each SFDSS is processed in order to emulate a corresponding string tone of one of a plurality of stringed instruments to create an emulated digital string tone signal (EDSTS). Each EDSTS is then transmitted back over the serial link to the stringed instrument for playback.
    Type: Grant
    Filed: August 18, 2010
    Date of Patent: April 8, 2014
    Assignee: Line 6, Inc.
    Inventors: Marcus Ryle, Michel A. Doidic, Peter J. Celi, Alan Zak
  • Patent number: 8692102
    Abstract: A pickup cable for a stringed instrument can switch between the output of the direct vibrational sound of strings and the output of the sound from the stringed instrument body generated by the vibrations of the strings and can also simultaneously output both the sound components. The pickup cable for a stringed instrument includes an input terminal to be inserted in a jack of the stringed instrument; a microphone to collect and convert sound of an internal space of the stringed instrument into collected-sound electrical signals; and an output terminal to output the collected-sound electrical signals. The microphone is incorporated in the input terminal.
    Type: Grant
    Filed: June 13, 2013
    Date of Patent: April 8, 2014
    Assignee: Kabushiki Kaisha Audio-Technica
    Inventors: Kazuhisa Kondo, Pen-Hao Ma, Yoshiaki Abe
  • Patent number: 8692103
    Abstract: A metal mixture is prepared, in which an excess amount of Te is added to a (Bi—Sb)2Te3 based composition. After melting the metal mixture, the molten metal is solidified on a surface of a cooling roll of which the circumferential velocity is no higher than 5 m/sec, so as to have a thickness of no less than 30 ?m. Thus, a plate shaped raw thermoelectric semiconductor materials 10 are manufactured, in which Te rich phases are microscopically dispersed in complex compound semiconductor phases, and extending directions of C face of most of crystal grains are uniformly oriented. The raw thermoelectric semiconductor materials 10 are layered in the direction of the plate thickness. And the layered body is solidified and formed to form a compact 12. After that, the compact 12 is plastically deformed in such a manner that a shear force is applied in a uniaxial direction that is approximately parallel to the main layering direction of the raw thermoelectric semiconductor materials 10.
    Type: Grant
    Filed: April 11, 2011
    Date of Patent: April 8, 2014
    Assignee: IHI Corporation
    Inventors: Toshinori Ota, Hiroki Yoshizawa, Kouiti Fujita, Isao Imai, Tsuyoshi Tosho, Ujihiro Nishiike
  • Patent number: 8692104
    Abstract: A thermoelectric element has a first substrate at a high temperature side, a second substrate at a low temperature side facing the first substrate, a thermoelectric material placed on the second substrate via a silicon layer, a first electrode formed on the first substrate, and a second electrode formed on the silicon layer. The thermoelectric element has a stress releasing section which is formed between the first electrode and the thermoelectric material, and which includes a plurality of columnar portions. The stress releasing section suppresses defects such as cracks that might be produced in the thermoelectric element due to a stress generated in the thermoelectric element.
    Type: Grant
    Filed: August 17, 2012
    Date of Patent: April 8, 2014
    Assignee: TDK Corporation
    Inventors: Takashi Asatani, Fujimi Kimura
  • Patent number: 8692105
    Abstract: A method to suppress thermal conductivities of nitride films by using stacking faults and/or nano-scale In-composition fluctuation(s). Therefore, the present invention reduces thermal conductivity of nitride while keeping electrical conductivity high. In addition, In composition fluctuations can enhance the Seebeck coefficient through thermionic emission. The present invention further discloses a nitride based (e.g. GaN) thermoelectric lateral device with a short length.
    Type: Grant
    Filed: April 18, 2011
    Date of Patent: April 8, 2014
    Assignee: The Regents of the University of California
    Inventors: Hiroaki Ohta, Alexander Sztein, Steven P. DenBaars, Shuji Nakamura
  • Patent number: 8692106
    Abstract: The invention is a bulk-processed thermoelectric material and a method for fabrication. The material measures at least 30 microns in each dimension and has a figure of merit (ZT) greater than 1.0 at any temperature less than 200° C. The material comprises at least two constituents; a host phase and a dispersed second phase. The host phase is a semiconductor or semimetal and the dispersed phase of the bulk-processed material is comprised of a plurality of inclusions. The material has a substantially coherent interface between the host phase and the dispersed phase in at least one crystallographic direction.
    Type: Grant
    Filed: December 7, 2009
    Date of Patent: April 8, 2014
    Assignee: Carrier Corporation
    Inventors: Rhonda R. Willigan, Susanne M. Opalka, Joseph V. Mantese, Slade R. Culp, Jefferi J. Covington
  • Patent number: 8692107
    Abstract: Solar system for converting solar radiation into electric energy, the system comprising: a refraction array and a converting array, the refracting array including at least one refraction sub array, each of the refraction sub arrays including a plurality of refraction sites, each of the refraction sites refracting variable approach angle collimated solar radiation into a plurality of solar rays, each of the solar rays being of a different waveband, each of the refraction sites directing each of the solar rays, refracted thereby, in a different direction, the different direction being at least dependent on the approach angle of the solar radiation, the converting array including a plurality of broadband converting cells, positioned such that light refracted by the refraction array impinges on the converting array, wherein at any given moment, each of the converting cells receives solar rays of a specific waveband originating from different refraction sites and arriving from different directions thereto.
    Type: Grant
    Filed: April 5, 2009
    Date of Patent: April 8, 2014
    Assignee: Mosaic Crystals Ltd.
    Inventor: Moshe Einav
  • Patent number: 8692108
    Abstract: A solar power collecting device including a parabolic concentrating unit, a light-guide pillar positioned on the parabolic concentrating unit, a solar cell positioned on the light-guide pillar and a transmissive protection cap for covering the light-guide pillar and the solar cell is disclosed.
    Type: Grant
    Filed: December 30, 2010
    Date of Patent: April 8, 2014
    Assignee: EPISTAR Corporation
    Inventor: Tsung-Xian Lee
  • Patent number: 8692109
    Abstract: The present invention provides a solar cell module including: a light transmitting plate having light transmittance; solar cells having bonding pads and conductive bumps bonded to the bonding pads; an adhesive film disposed between the light transmitting plate and the solar cells to bond the light transmitting plate and the solar cells; and a conductive pad disposed by being inserted in the adhesive film and surrounding and electrically connecting the conductive bumps of the adjacent solar cells.
    Type: Grant
    Filed: January 27, 2011
    Date of Patent: April 8, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jin Mun Ryu, In Taek Song, Tae Young Kim, Seung Yun Oh
  • Patent number: 8692110
    Abstract: Solar cells include bus bars and high aspect-ratio gridlines that are printed on a substrate, and localized melting is induced to slump or flatten the gridline “vertex” portions that are disposed on the bus bars, while maintaining the high aspect-ratio of gridlines portions disposed on the substrate between the bus bars. The localized melting process is induced using one of several disclosed methods, such as rheological melting in which the two printed inks produce a compound that is relatively liquid. Localized melting is also induced using a deliquescing material (e.g., a flux or a solvent film) that is applied to the bus bar or gridline material. Also, eutectic melting is induced using a processing temperature that is between a melting point of the combined gridline/bus bar inks and the individual melting points of the inks alone. Laser-based melting and the use of copolymers is also disclosed.
    Type: Grant
    Filed: October 15, 2010
    Date of Patent: April 8, 2014
    Assignee: Palo Alto Research Center Incorporated
    Inventors: David K. Fork, Andre Kalio, Ranjeet Rao
  • Patent number: 8692111
    Abstract: Contact holes of solar cells are formed by laser ablation to accommodate various solar cell designs. Throughput of the solar cell ablation process is improved by incorporating linear base diffusion regions with narrow width, for example as compared to an overlying metal contact. Throughput of the solar cell ablation process may also be improved by having contact holes to base diffusion regions that are perpendicular to contact holes to emitter diffusion regions. To allow for continuous laser scanning, a laser blocking layer may be located over an interlayer dielectric to prevent contact hole formation on certain regions, such as regions where a metal contact of one polarity may electrically shunt to a diffusion region of opposite polarity. In a hybrid design, a solar cell may have both linear and dotted base diffusion regions. An electro-optical modulator may be employed to allow for continuous laser scanning in dotted base diffusion designs.
    Type: Grant
    Filed: November 16, 2011
    Date of Patent: April 8, 2014
    Assignee: SunPower Corporation
    Inventors: Taeseok Kim, Gabriel Harley, David D. Smith, Peter John Cousins
  • Patent number: 8692112
    Abstract: An organic thin film solar cell comprises: positive and negative electrode layers; and an organic thin film layer disposed between the positive and negative electrode layers, the organic thin film layer including: a mixture of at least a first organic compound having a light-absorbing dye moiety and an electron-accepting second organic compound, in which the organic thin film layer further includes inorganic nanoparticles.
    Type: Grant
    Filed: December 24, 2008
    Date of Patent: April 8, 2014
    Assignee: Hitachi, Ltd.
    Inventors: Naoki Yoshimoto, Hiroto Naito
  • Patent number: 8692113
    Abstract: The connector assembly for a printed circuit board includes a set of differential signal wires, a set of alternating current (AC) power wires, a ground wire, and a connector. The set of differential signal wires includes a plurality of signal wires, and each of the signal wires has an insulator and a conductor. The set of AC power wires includes a plurality of power wires, and each of the power wires has an insulator and a conductor. The connector includes an insulated shell and a plurality of conductive pins received therein, and each of the conductive pins has a nipper. An end of each of the set of differential signal wires and the set of AC power wires is electrically connected to the printed circuit board, and the other end thereof is electrically connected to the nipper.
    Type: Grant
    Filed: September 14, 2011
    Date of Patent: April 8, 2014
    Assignee: Chicony Power Technology Co., Ltd.
    Inventors: Chao-Jui Huang, Wen-Nan Huang
  • Patent number: 8692114
    Abstract: A wiring harness conduit shield assembly that provides shield continuity for a transition from one or more main wire bundle conduits into two or more wire bundle conduit branches. The assembly includes a pre-branch shield sock disposed over at least one main wire bundle conduit and two or more post-branch shield socks, one each disposed around each of the wire bundle conduit branches. An interconnect ring is coaxially disposed around the main wire bundle conduit at the branching point, and the post-branch shield socks have a tail portion that is disposed over the outer surface of the interconnect ring. The pre-branch shield sock is likewise disposed over the interconnect ring, overlapping the tail portions, and a retaining ring is tightly placed over both to clamp them onto the interconnect ring in metal-to-metal contact with one another so as to create shield continuity between the pre-branch shield sock and the post-branch shield socks.
    Type: Grant
    Filed: June 27, 2011
    Date of Patent: April 8, 2014
    Inventors: Lucian Popescu, Dennis L. Baney, Scott M. Andrews
  • Patent number: 8692115
    Abstract: Electric submersible well pumping systems operable in well temperatures of above about 180° C. (356° F.) utilize high temperature electrical insulation. The electrical insulation includes E-base polyimide films or perfluoropolymer TE films on various components. The insulation films are employed around magnet wires that are threaded through slots in the stator. Slot insulation of E-base polyimide or perfluoropolymer TE film surrounds the magnet wires in the stator slots. Sheets of E-base polyimide or perfluoropolymer TE film extend around and between phase loops of the magnet wire at the lower end of the stator. The motor contains a PAO oil having additives to dissipate acid generated by epoxy used in the motor.
    Type: Grant
    Filed: May 16, 2011
    Date of Patent: April 8, 2014
    Assignee: Baker Hughes Incorporated
    Inventors: Michael R. Rumbaugh, Jim F. Evenson, Jackson E. Reynolds, David G. Korte, David W. Livingston, Jeffrey G. Frey
  • Patent number: 8692116
    Abstract: A guarded coaxial cable assembly includes a micro-coaxial cable and an adjacent structure for protecting the micro-coaxial cable.
    Type: Grant
    Filed: February 7, 2011
    Date of Patent: April 8, 2014
    Assignee: Holland Electronics, LLC
    Inventor: Michael Holland
  • Patent number: 8692117
    Abstract: Durable fine wire electrical conductors are robust, durable, small in profile, and light weight, yet capable of operating under extreme environmental conditions. Formed of a glass, silica, sapphire or crystalline quartz fiber core with a metal coating and one or more polymer layers, a unipolar electrical conductor can have an outer diameter as small as about 300 microns or even smaller. The metal buffer coating may be deposited directly on the glass/silica fiber, or upon an intermediate layer between the glass/silica fiber and metal, consisting of carbon and/or polymer. The resulting metallized glass/silica fibers are extremely durable, can be bent through small radii and will not fatigue even from millions of iterations of flexing. Bipolar electrical conductors can include several insulated metallized glass/silica fibers residing side by side, or can be coaxial with two or more insulated metal conductive paths. An outer protective sheath of a flexible polymer material can be included.
    Type: Grant
    Filed: July 16, 2010
    Date of Patent: April 8, 2014
    Assignee: Cardia Access, Inc.
    Inventors: Robert G. Walsh, Jin Shimada, Scott Engle
  • Patent number: 8692118
    Abstract: A wire structure, which may be configured for a semiconductor device, is disclosed. The wire may include an elongate flexible core formed of a conductor material and a cladding layer covering an outer surface of the core. The cladding layer may be a conductor. In various aspects the cladding layer and core have a different grain sizes. An average grain size of the core material may several orders of magnitude greater than an average grain size of the cladding layer material. The cladding layer may be an alloy having a varying concentration of a minor component across its thickness. Methods of forming a wire structure are also disclosed.
    Type: Grant
    Filed: June 24, 2011
    Date of Patent: April 8, 2014
    Assignee: Tessera, Inc.
    Inventors: Cyprian Uzoh, Craig Mitchell
  • Patent number: 8692119
    Abstract: An analysis device for analysis of a sample on a test element is provided that comprises at least one component configured to make electrical contact with at least one other component for electrical transmission therebetween. The at least one component generally comprises an injection-molded circuit mount, also called an MID, or molded interconnect device.
    Type: Grant
    Filed: November 6, 2012
    Date of Patent: April 8, 2014
    Assignee: Roche Diagnostics Operations, Inc.
    Inventors: Stefan Riebel, Manfred Augstein, Gregor Bainczyk, Albert Grosser, Oliver Kube, Dieter Meinecke, Bruno Thoes, Herbert Wieder
  • Patent number: 8692120
    Abstract: The present invention relates to an electrical control cable of the type comprising a core having a plurality of polymer filaments, a plurality of strands of conductor material extending in the longitudinal direction of said core, an outer insulating sheath. According to the invention, said strands are distributed uniformly and concentrically over the periphery of said core, in contact with one another in pairs and in contact with said core, and the filaments of said core are secured to one another to form a non-metallic unitary structure that is obtained by organizing said filaments into a plurality of subassemblies, the filaments in any one subassembly being twisted together helically, the subassemblies in turn being twisted with one another to form an overall helix. Advantage: the cable uses a limited number of copper strands while guaranteeing that crimping operations are reliable.
    Type: Grant
    Filed: July 9, 2008
    Date of Patent: April 8, 2014
    Assignee: Nexans
    Inventors: Francis Debladis, Laurent Tribut, Stéphane Morice
  • Patent number: 8692121
    Abstract: This invention relates generally to a method and apparatus to engage and suspend an electrical contact of a cylindrical and elongated configuration. In accordance with the invention and described is a hollowed out, cylindrical and elongated device having two pair of spaced apart cantilever beams which extend forwardly from a base to a pin receiving end wherein the counter levered beams of each pair are opposing each other and are equally spaced along the entire circumference wherein a pin like cylindrical object engages through the hollowed out portion and urges against the cantilevered beams in a fashion to increase the distance between the opposing beams.
    Type: Grant
    Filed: July 11, 2012
    Date of Patent: April 8, 2014
    Inventor: Volker von Detten
  • Patent number: 8692122
    Abstract: A grommet is fit on a pipe harness formed by inserting a wire harness into a metallic pipe. The grommet has a small-diameter tube configured to allow insertion of the pipe harness therethrough in a tight manner. The small-diameter tube has an inner diameter B obtained by adding an allowable tolerance dimension ? to an outer diameter A of the pipe. Two annular ribs project from an outer peripheral surface of the small-diameter tube on the side of a distal end opening and a band winding portion is interposed between the annular ribs. An annular sealing lip projects from an inner peripheral surface of the small-diameter tube at an inner position displaced from a position corresponding to the band winding portion. The sealing lip has an inner diameter C obtained by subtracting the allowable tolerance dimension ? from the outer diameter A of the pipe.
    Type: Grant
    Filed: February 9, 2012
    Date of Patent: April 8, 2014
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventor: Takashi Suzuki
  • Patent number: 8692123
    Abstract: An electrical device including an electrical power cord secured to a base of the electrical device by using a plug having a pair of resilient prongs. The plug is inserted into an opening in the base to secure a strain reliever on an end of the electrical power cord into the opening. The resilient prongs flex towards each other when the plug is inserted into the opening. The prongs return to their original positions after passing through the opening and seat the plug in the opening. When seated, the plug secures the strain reliever into the opening thereby securing the electrical power cord to the base.
    Type: Grant
    Filed: June 12, 2012
    Date of Patent: April 8, 2014
    Assignee: Sunbeam Products, Inc.
    Inventors: Thanh Nguyen, Leonard C. Johnson
  • Patent number: 8692124
    Abstract: An electrical connector comprises an elongated flexible circuit having rigid strips bonded onto one or both sides and one or more ends thereof. The strips contain metallized castellations that are aligned with respective metal traces on the flex circuit and soldered thereto. The flexible portion, along with the attached rigid board(s) forms a plug assembly that mates with a socket having contact pins that engage with their respective metallized castellations, with the castellations providing a self-aligning function. The invention may be used to form a flex cable with connectors on one or both ends. Alternatively, the elongated flexible circuit may represent an extension of a larger flex circuit substrate that further contains other electronic devices mounted thereon. The socket and contact pins are preferably attachable to a motherboard by soldering or other means.
    Type: Grant
    Filed: November 17, 2010
    Date of Patent: April 8, 2014
    Assignee: Microelectronics Assembly Technologies
    Inventors: James E. Clayton, Zakaryae Fathi
  • Patent number: 8692125
    Abstract: A multilayer substrate that retains a curved state without causing fluctuations in electrical characteristics includes a main body including a plurality of insulating sheets to be stacked and made of a flexible material. A signal wire extends in the main body. A ground conductor is provided at a positive-direction side in a z-axis direction relative to the signal wire in the main body, and overlaps the signal line in a plan view seen from the z-axis direction. A ground conductor is provided on a negative-direction side in the z-axis direction relative to the signal wire in the main body, and overlaps the signal line in a plan view seen from the z-axis direction. The state in which the main body is curved so that the signal wire defines an arc is retained by plastic deformation of the ground conductors.
    Type: Grant
    Filed: February 9, 2012
    Date of Patent: April 8, 2014
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Noboru Kato, Jun Sasaki, Satoshi Ishino
  • Patent number: 8692126
    Abstract: A wired circuit board includes a metal supporting layer, an insulating layer formed on the metal supporting layer, and a conductive layer formed on the insulating layer. In the metal supporting layer, a reference hole for positioning is formed, and a stepped portion is formed so as to surround the reference hole.
    Type: Grant
    Filed: August 16, 2010
    Date of Patent: April 8, 2014
    Assignee: Nitto Denko Corporation
    Inventors: Jun Ishii, Hirotoshi Iguchi
  • Patent number: 8692127
    Abstract: The present invention relates to a terminal structure. The terminal structure includes: a terminal having: a conductor layer containing at least one metal selected from gold, silver, and copper; a first layer containing nickel and phosphorus, laid on the conductor layer; a second layer having a smaller atomic ratio of nickel to phosphorus than the first layer and containing Ni3P, laid on the first layer; a third layer containing a first intermetallic compound of an Ni—P—Sn type, laid on the second layer; and a fourth layer containing a second intermetallic compound of an Ni—Cu—Sn type, laid on the third layer; and a solder layer on the fourth layer of the terminal. Ra2 is larger than Ra1, where Ra1 is a surface roughness of the third layer on the second layer side and Ra2 is a surface roughness of the third layer on the fourth layer side.
    Type: Grant
    Filed: July 22, 2011
    Date of Patent: April 8, 2014
    Assignee: TDK Corporation
    Inventors: Yuhei Horikawa, Kenichi Yoshida, Atsushi Sato
  • Patent number: 8692128
    Abstract: A printed circuit board, comprises an insulative substrate, a grounding layer located on a surface of the insulative substrate and defining a through slot, a plurality of conductive pins located on an outer surface of the printed circuit board; and a fence layer located between the conductive path and the grounding layer. Each conductive pin defines at least a soldering portion. The soldering portion is alignment to the through slot along a vertical direction.
    Type: Grant
    Filed: November 7, 2011
    Date of Patent: April 8, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Ping-Sheng Su, Jun Chen, Feng-Jun Qi, Qing Wang
  • Patent number: 8692129
    Abstract: A printed wiring board includes an interlayer insulation layer, first pads positioned to mount a semiconductor element and forming a first pad group on the insulation layer, second pads forming a second pad group on the insulation layer and positioned along a peripheral portion of the first group, a first solder-resist layer formed on the insulation layer and having first openings exposing the first pads, respectively, and second openings exposing the second pads, respectively, conductive posts formed on the second pads through the second openings of the first solder-resist layer, respectively, and a second solder-resist layer formed on the first solder-resist layer and having a third opening exposing the first pads and fourth openings exposing surfaces of the posts, respectively. The second openings have a diameter greater than a diameter of the posts, and the second solder-resist layer is filling gaps formed between the second openings and the posts.
    Type: Grant
    Filed: March 26, 2012
    Date of Patent: April 8, 2014
    Assignee: Ibiden Co., Ltd.
    Inventors: Toshiaki Kasai, Takema Adachi
  • Patent number: 8692130
    Abstract: A transparent thin plate including a transparent substrate in a sheet form, a mesh layer formed on a surface of the transparent substrate and made of an opaque material having a structure wherein an outline of meshes is made of bands that are very thin and have a substantially equal width, and having a light transmittance of 50% or more. The transparent thin plate also includes a colored layer that is arranged in a state in which the colored layer is laminated in a partial area of the mesh layer and on the surface of the mesh layer, and has a color different from that of the opaque material constituting the mesh layer.
    Type: Grant
    Filed: April 9, 2008
    Date of Patent: April 8, 2014
    Assignee: Nissha Printing Co., Ltd.
    Inventors: Shuzo Okumura, Ryomei Omote, Takao Hashimoto, Yuki Matsui
  • Patent number: 8692131
    Abstract: This invention is directed to a polymer thick film conductive composition that may be used in applications where thermoforming of the base substrate occurs, e.g., as in capacitive switches. Polycarbonate substrates are often used as the substrate and the polymer thick film conductive composition may be used without any barrier layer. Thermoformable electric circuits benefit from the presence of an encapsulant layer over the dried polymer thick film conductive composition. The electrical circuit is subsequently subjected to an injection molding process.
    Type: Grant
    Filed: October 10, 2013
    Date of Patent: April 8, 2014
    Assignee: E I du Pont de Nemours and Company
    Inventors: Jay Robert Dorfman, Vincenzo Arancio
  • Patent number: 8692132
    Abstract: A method for manufacturing a multilayered printed circuit board including forming a first insulating resin substrate having a metal layer substantially corresponding to dimensions of a semiconductor device, forming a second insulating resin substrate, forming a recess extending to the metal layer of the first insulating resin substrate such that a surface of the metal layer is exposed, accommodating the semiconductor device in the recess such that the semiconductor device is mounted on the surface of the metal layer, and forming a resin insulating layer on the first insulating resin substrate such that the semiconductor device accommodated in the recess is covered.
    Type: Grant
    Filed: September 23, 2011
    Date of Patent: April 8, 2014
    Assignee: Ibiden Co., Ltd.
    Inventors: Sotaro Ito, Michimasa Takahashi, Yukinobu Mikado
  • Patent number: 8692133
    Abstract: Provided is a semiconductor package. The semiconductor package includes an insulation substrate with top and bottom surfaces. The semiconductor package further includes a circuit pattern on the top surface. The circuit pattern includes a first signal conductive pattern and first and second ground conductive patterns. The semiconductor package includes a first insulation film covering the first signal conductive pattern and exposing a first portion of the first ground conductive pattern and a portion of the second ground conductive pattern. The semiconductor package further includes a first conductive member on the first signal conductive pattern and the first and second ground conductive patterns. The first conductive member electrically connects the first and second ground conductive patterns by covering a portion of the first insulation film and coming in contact with the first portion of the first ground conductive pattern and the portion of the second ground conductive pattern.
    Type: Grant
    Filed: March 9, 2010
    Date of Patent: April 8, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Yeoung-Jun Cho
  • Patent number: 8692134
    Abstract: An electrical connection includes a first wire bonded to adjacent bond pads proximate to an edge of a die and a second wire having one end bonded to a die bond pad distal to the die edge and a second end bonded to a lead finger of a lead frame or a connection pad of a substrate. The second wire crosses and is supported by the first wire. The first wire acts as a brace that prevents the second wire from touching the edge of the die. The first wire also prevents the second wire from excessive lateral movement during encapsulation.
    Type: Grant
    Filed: August 16, 2011
    Date of Patent: April 8, 2014
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Jie Yang, Qingchun He, Hanmin Zhang
  • Patent number: 8692135
    Abstract: A wiring board is configured by stacking one or more conductor wiring layers and one or more insulating resin layers and comprising one or more metal vias configured to penetrate the insulating resin layer, wherein the boundary surface between the metal via and the insulating resin layer has a concavo-convex boundary cross-section structure in which the metal via and the insulating resin layer are engaged with each other.
    Type: Grant
    Filed: August 25, 2009
    Date of Patent: April 8, 2014
    Assignee: NEC Corporation
    Inventors: Takuo Funaya, Shintaro Yamamichi, Daisuke Ohshima, Yoshiki Nakashima
  • Patent number: 8692136
    Abstract: There are provided a method of repairing a probe card and a repaired probe board. The method of repairing a probe card includes: in a board body composed of a sintered ceramic having first and second pillar surfaces disposed at a position opposed to each other, preparing the board body including a plurality of main channels for electrically connecting a first pad formed on the first pillar surface to a second pad formed on a second pillar surface and reserved channels disposed to be adjacent to the main channels to repair to damaged main channels; when the main channels are damaged; removing the first and second pads formed in the main channels and the reserved channels; forming cavities by partially removing the board between the damaged main channels and the reserved channels adjacent to the main channel; and forming repair connection parts in the cavities in order to electrically connect the damaged main channels to the reserved channels adjacent thereto.
    Type: Grant
    Filed: December 9, 2010
    Date of Patent: April 8, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Kwang Jae Oh, Joo Yong Kim, Yoon Hyuck Choi, Bong Gyun Kim
  • Patent number: 8692137
    Abstract: A noise dampening tape and gasket material for reducing or preventing unwanted electromagnetic interference from escaping or entering an enclosure. The noise dampening gasket includes an inner core section, a carbon material layer surrounding the inner core section, an insulating layer surrounding the carbon material layer, and a metal shield layer surrounding the insulating layer. The noise dampening tape includes a metal shield layer, an insulating layer adjacent to and in contact with the metal shield layer, a carbon material layer adjacent to and in contact with the insulating layer, and an adhesive layer disposed on a surface of the carbon material layer. A second adhesive layer can be disposed on a surface of the metal shield layer.
    Type: Grant
    Filed: June 29, 2011
    Date of Patent: April 8, 2014
    Assignee: Tangitek, LLC
    Inventors: Robert L. Doneker, Kent G. R. Thompson
  • Patent number: 8692138
    Abstract: A mold structure for a light-emitting diode (LED) package. The mold structure includes a notch, which is formed at at least an end portion of a package mold, in which a cavity is formed to mount a LED therein. Furthermore, an electrode lead, may be formed at at least an end portion of the package mold and may be closely attached to the package mold, and thus the overall size of a LED package may be reduced.
    Type: Grant
    Filed: August 24, 2011
    Date of Patent: April 8, 2014
    Assignee: Samsung Elecronics Co., Ltd.
    Inventors: Sun Choi, Jong-Jin Park
  • Patent number: 8692139
    Abstract: A cable gland assembly for terminating cable is described herein. The cable gland assembly can include a gland configured to receive a cable, and a gland nut disposed around the gland. A skid washer may be disposed within the gland nut above or below the gland. The cable gland assembly can also include an intermediate body having a first end and a second end, in which the first end may be coupled to the gland nut. The cable gland assembly can further include a body coupled to the second end of the intermediate body, and an intermediate nut disposed around a portion of the body and the second end of the intermediate body.
    Type: Grant
    Filed: September 6, 2012
    Date of Patent: April 8, 2014
    Assignee: Cooper Technologies Company
    Inventors: Alvah Aldrich, Evgeny M. Orlov
  • Patent number: 8692140
    Abstract: A surgical sponge and fluid monitoring system and method are provided. The system includes a support ring for securely supporting a container with at least one port opening for placing sponges into the container through the port opening with the aid of gravity. The support ring includes IR emitters and sensors that blanket IR beams across the port opening. The support ring is mechanically linked to a load cell in the system. The processor, with novel methods, reliably detects when sponges are placed into the container through the port opening, counts the number of sponges in the container, sorts the types of sponges, and calculates fluid loss for a patient in a surgical procedure. A user interface in the monitoring system keeps the medical professionals in the OR fully informed.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: April 8, 2014
    Assignee: Surgitrac Corporation
    Inventors: Richard A. Pollock, Mahmood S. Kassam, Thomas D. Cox
  • Patent number: 8692141
    Abstract: An integral weighing device for determining whether the weight of a luggage container and its contents exceed a maximum allowable amount simply by suspending the container by its handle. If the container weighs more than a set amount the integral weighing device provides a visual cue that the container exceeds the predefined weight. The integral weighing device comprises a torsion spring mounted within a housing, and a cord attached to each end of the torsion spring and fed via a guide-way through and out of the housing to an externally accessible grip handle. An indicator arm is rotationally mounted to the housing. When a person lifts the luggage by the grip handle the force is transferred to the torsion spring causing angular deflection toward the indicator arm. If the container exceeds the set weight the indicator arm provides a visual cue that the bag exceeds the predetermined weight.
    Type: Grant
    Filed: January 7, 2011
    Date of Patent: April 8, 2014
    Inventors: David Bieber, Richard J. Rekuc, David E. Ringel, Cheung Shik Kui
  • Patent number: 8692142
    Abstract: The invention provides a circuit for determining positions of contacts on a capacitive position detecting panel. The capacitive position detecting panel includes a plurality of sensing lines and driving lines. The circuit includes a plurality of first amplifiers and second amplifiers. The first amplifiers respectively connect to the sensing lines, and the second amplifiers respectively connect to the driving lines. Input nodes of the first amplifiers are connected to a first input signal source, and input nodes of the second amplifiers are selectively connected to the first input signal source or a second input signal source. When the circuit is operated under a first operation mode, the input nodes of the second amplifiers are connected to the first input signal source; and when the circuit is operated under a second operating mode, the input modes of a plurality of specific second amplifiers are connected to the second input signal source.
    Type: Grant
    Filed: September 20, 2011
    Date of Patent: April 8, 2014
    Assignee: AU Optronics Corp.
    Inventors: Chung-Chun Chen, Cheng-Chiu Pai
  • Patent number: 8692143
    Abstract: An assembly for mutual mechanical blocking of actuation of a plurality of electrical switches includes a first locking mechanism assigned to a first switch and actuatable by an actuation device of the first switch, the actuation device being configured to transmit via Bowden cables at least one of an OFF position and an ON position of the first switch to a locking device of at least one other locking mechanism assigned to at least one other switch, the locking device including a two-armed rocker having a center portion configured to lock the at least one other switch and having lever arms, each of the lever arms having a respective bore configured to receive: (a) a driving element for a respective Bowden cable so as to provide a mutual locking of three switches, and (b) a fastening pivot pin for rotatable fastening of the two-armed rocker to a mounting plate that accommodates the first locking mechanism, so as to provide a mutual locking of two switches.
    Type: Grant
    Filed: January 21, 2009
    Date of Patent: April 8, 2014
    Assignee: Eaton Industries GmbH
    Inventor: Bernd Schneider
  • Patent number: 8692144
    Abstract: A keyboard includes a membrane circuit board, a luminous key, a light-emitting element and a plastic film layer. The luminous key has a keycap with a light-transmissible part. The luminous key is configured for triggering a membrane switch of the membrane circuit board. The light-emitting element is disposed on the membrane circuit board and arranged under the light-transmissible part for emitting a light beam. The plastic film layer is disposed on the membrane circuit board, and includes a convex structure, which is integrally formed with the plastic film layer. The light-emitting element is enclosed by the convex structure. The convex structure has an opening aligned with the light-emitting element. The keyboard of the present invention has enhanced production yield and reduced light leakage.
    Type: Grant
    Filed: November 29, 2010
    Date of Patent: April 8, 2014
    Assignee: Primax Electronics Ltd.
    Inventor: Bo-An Chen
  • Patent number: 8692145
    Abstract: A keyboard includes a membrane circuit board, a luminous key, a light-emitting element and a plastic film layer. The luminous key has a keycap with a light-transmissible part. The luminous key is configured for triggering a membrane switch of the membrane circuit board. The light-emitting element is disposed on the membrane circuit board and arranged under the membrane circuit board for emitting a light beam. The plastic film layer is disposed on the membrane circuit board, and includes a convex structure, which is integrally formed with the plastic film layer. The light-emitting element is enclosed by the convex structure. The convex structure has a light-transmissible zone aligned with the light-emitting element. In such way, the keyboard of the present invention has enhanced production yield and reduced leak leakage.
    Type: Grant
    Filed: January 19, 2011
    Date of Patent: April 8, 2014
    Assignee: Primax Electronics Ltd.
    Inventor: Bo-An Chen