Abstract: There is provided a multilayered ceramic electronic component including: a ceramic body including dielectric layers; internal electrodes disposed to face each other, having the dielectric layer therebetween; and external electrodes formed at an outer side of the ceramic body and respectively electrically connected to the internal electrodes, wherein the internal electrodes include a single ceramic layer therein. The disconnection generated by a difference in contraction and extension rates due to a difference in the sintering temperature between the internal electrodes and the dielectric is prevented and the electrode connectivity and the coverage are maintained, whereby the high capacitance multilayered ceramic electronic component having excellent reliability may be implemented.

Abstract: Provided herein are novel electrodes for use, such as, for example, in electrochemical energy storage systems (i.e., Li-ion secondary batteries), fuel cells, secondary batteries based on hydrogen storage and ultracapacitors. The electrodes include carbon nanotubes attached to metal foil. In some embodiments, an ultracapacitor device is provided. The ultracapacitor device contains, inter alia, the novel electrodes described herein. In still other embodiments, a method of synthesizing the electrodes described herein is provided. Carbon nanotubes are deposited on a metal foil and amorphous carbon is removed.

Abstract: An electrically conductive paste composition comprises: (a) silver powders comprising spherical silver powders having a mean particle size (D50) of over 0.1 ?m and no more than 5 ?m and flake-shaped silver powders having a mean particle size of no more than 10 ?m; and (b) binder resins comprise (b-1) aliphatic thermoplastic resin and (b-2) self-polymerizing thermosetting resin; wherein the content of the silver powders is no more than 60 wt % based on the total weight of the paste composition, wherein the weight ratio of the aliphatic thermoplastic resin for the self-polymerizing thermosetting resin ((b-1)/(b-2)) is 99/1-67/33 and wherein the weight ratio of the silver powders for the binder resins ((a)/(b)) is 94/6-85/15.

Abstract: A solid electrolytic capacitor includes a porous sintered body made of a valve metal, a dielectric layer on the porous sintered body, a solid electrolyte layer on the dielectric layer, and a cathode layer on the solid electrolyte layer. The solid electrolyte layer includes an inner electrode layer covering the dielectric layer inside the porous sintered body and an outer electrode layer covering the inner electrode layer outside the porous sintered body. The outer electrode layer includes a solid particle containing layer formed by applying a dispersion material liquid containing a conductive polymer dispersion material, solid particles and a solvent to the inner electrode layer and then removing the solvent.

Abstract: An electrical junction box of the present invention includes a frame (11) in which a storing box B is formed which has a unit storing room (20) in which an electronic control unit (63) is accommodated, and an upper cover (15) which is assembled to the side of the frame (11) where a accommodating port (20a), which becomes an entrance when the electronic control unit (63) is accommodated in the unit storing room (20), is formed so that the accommodating port (20a) is closed.

Abstract: Systems and apparatuses are provided in which outlets are coupled to a power distribution unit (PDU) or PDU module in various configurations. The outlets may be coupled to a recessed surface within a PDU housing. The outlets may be coupled to a printed circuit board that is at least partially disposed within the PDU housing. The outlets may extend away from the recessed surface or printed circuit board towards or beyond a front face of the PDU housing.

Abstract: Described herein are various embodiments of a power distribution unit having modular components. For example, according to one embodiment, a power distribution unit can include a component portion that comprises at least two modules including outlet modules, circuit protection modules, power input modules, communications I/O modules, and display modules. Each of the at least two modules of the component portion can comprise at least one connection element and can be removably secured to one or more other of the at least two modules via the connection elements. The power distribution unit can also include a housing that defines an interior cavity. The component portion can be removably secured to the housing at least partially within the interior cavity.

Abstract: Described herein are various embodiments of a power distribution unit having modular components. For example, according to one embodiment, a power distribution unit can include a component portion that comprises at least two modules including outlet modules, circuit protection modules, power input modules, communications I/O modules, and display modules. Each of the at least two modules of the component portion can comprise at least one connection element and can be removably secured to one or more other of the at least two modules via the connection elements. The power distribution unit can also include a housing that defines an interior cavity. The component portion can be removably secured to the housing at least partially within the interior cavity.

Abstract: A circuit breaker module is provided. The circuit breaker module includes: a frame assembly, a faceplate assembly, and a number of circuit breakers, the circuit breakers having an electrically conductive surface and an extending handle, the frame assembly having a front member and a back member, the frame assembly front member and the frame assembly back member being spaced from each other and defining an enclosed space, the frame assembly front member being electrically conductive, the faceplate assembly having an electrically conductive faceplate, the faceplate being a planar member with a number of openings therein, the faceplate coupled to the frame assembly front member, the circuit breaker disposed in the frame assembly enclosed space, and wherein the circuit breaker is in electrical communication with the faceplate and the frame assembly front member, whereby a current may pass from the circuit breaker to the frame assembly front member.

Abstract: An electrical enclosure wherein an electrical component can be moved between various positions (e.g., connected, disconnected, test, etc.) without opening an enclosure door. The electrical enclosure supports a component for movement between a withdrawn position, a test position, and an inserted position. A handle is accessible by an operator from an exterior of the enclosure and is configured to move the component between the respective positions without having to open the enclosure. The handle is integral with the enclosure and thus an operator needs no special tool or other device to effect movement of the electrical component between its respective positions.

Abstract: A device includes: a first component and a second component coupled to one another by a pivot member and being movable relative to one another between an open position in which the first component and the second component are in the same plane and a folded position; a first slider coupled to the first component and a second slider coupled to the second component; and a flexible membrane coupled to the first slider and the second slider, the flexible membrane being exposed in the folded position; wherein the first component and the second component are coupled to one another to maintain the flexible membrane at a constant length when the flexible membrane is moved between the open position and the folded position.

Abstract: A touch module with photovoltaic conversion function includes a touch zone and a non-touch zone. The touch zone includes a first clear substrate, a second clear substrate and a photovoltaic conversion unit. The first clear substrate has opposite first and second sides, and the second clear substrate has opposite third and fourth sides. A first and a second touch electrode layer are provided on the second side and the third side, respectively; and the photovoltaic conversion unit is provided on the first side of the first clear substrate. By providing the photovoltaic conversion unit in the touch zone of the touch module, the photovoltaic conversion unit can have increased light-absorption areas to enable conversion of light into more electric current and accordingly, enable a touch device using the touch module to have extended standby and operation time.

Abstract: A touch device with photovoltaic conversion function includes a main body divided into a touch zone and a non-touch zone located immediately around the touch zone. A photovoltaic conversion layer is provided on a top of the touch zone. By providing the photovoltaic conversion layer on the top of the touch zone of the touch device, the photovoltaic conversion layer can have an increased light-absorption area to enable conversion of more light into more electric current for use by the touch device and accordingly, enable the touch device to have extended standby and operation time.

Abstract: A touch device includes a top housing and bottom housing, which define an accommodating space. A touch panel has a lateral surface abutting the top housing. A hollow frame crosses adjacency between a top surface of the touch panel and a top surface of the top housing.

Abstract: A display apparatus includes: a display displaying images on a display surface; a back chassis arranged in a position opposite to the display surface of the display; and a rear cover arranged in a position opposite to a surface of the back chassis which faces the display, wherein through holes piercing in a thickness direction are formed in the back chassis and reinforcing portions are provided in the back chassis.

Abstract: An electronic device includes a first body and a second body. The first body has a lock portion. The second body includes a main body, a lock component, an actuator and a retainer. The main body is configured to be detachably assembled to the first body. The lock component is movably disposed in the main body. The actuator is disposed in the main body. The retainer is connected to the actuator, in which when the main body is detachably assembled to the first body and the lock component is located at a first position, the lock component locks the lock portion to prevent the main body being separated from the first body, and the actuator is configured to drive the retainer pushing the lock component so as to prevent the lock component departing from the first position.

Abstract: A sealing member is disclosed, which includes a first structure and a second structure. The first structure includes a groove with an opening towards the outside of the sealing member, wherein the second structure is disposed in the groove. The first structure includes a first material, and the second structure includes a second material, wherein the water absorption rate of the second material is greater than the water absorption rate of the first material. Also, an electronic device using the sealing member is disclosed.

Abstract: Disclosed is an electronic device. The electronic device includes a shell, a display panel coupled with the shell for forming an accommodating space, a receiver positioned in the accommodating space and a sound hole formed on the display panel. The sound hole is composed of a number of tiny holes, each of the tiny holes has a diameter less than 0.1 millimeter. The electronic device has a high working reliabilities and a good communication sound effect.

Abstract: A drawer for receiving components may comprise an inner member, and intermediate member, and a carrier member. The carrier member may comprise a substantially planar top generally parallel to an inner member bottom, a substantially planar bottom generally parallel to the top, a carrier spine mechanically coupled between the top and the bottom, a plurality of bays, each bay having one or more structural components for receiving a modular information handling resource and configured such that the bay is accessed for insertion or removal of the modular information handling resource via a carrier member side of the carrier member generally parallel to an inner member side, and at least one web generally parallel to the inner member sides and mechanically coupling the carrier member to the intermediate member such that when the drawer is translated to an open position, each of the plurality of bays is accessible.

Abstract: An information handling system chassis is built at least in part from ceramic elements. For example, a transparent aluminum oxide ceramic portion covers a touchscreen to provide a rigid outer surface for accepting end user inputs. As another example, a ceramic chassis element has a ceramic material formed around a metal material of similar substance with bonding of the ceramic to the underlying material enhanced with oxidation of the outer surface of the metal material.

Abstract: A display device using a window includes: a display panel; a window protecting the display panel from an external environment; and an adhesive layer adhering a top surface of the display panel to a bottom surface of the window. In the display device, the window has at least one irregularity on a bottom surface thereof. Accordingly, it is possible to provide a display device using a window having improved strength.

Abstract: A display device stand includes a base, a first member supported by the base, and a second member supported by the first member. The first member is moveable between a collapsed position and at least one extended position, and the base provides a passage under and between opposite ends of the first member with the first member in the collapsed position.

Abstract: A device includes: a housing having a first component and a second component coupled to one another by a pivot member and movable relative to one another between an open position in which the first component and the second component are in the same plane and a folded position; a first slider slidably received in the first component and a second slider slidably received in the second component, the first slider and the second slider being movable toward the pivot member when the first component and the second component move from the open position to the folded position; and a flexible membrane coupled to the first slider, the second slider and the pivot member; wherein, in the folded position, the flexible membrane is located between the first component and the second component.

Abstract: portable electronic device includes a host module, a display module and a hinge structure. The hinge structure is pivotally connected to the host module and the display module. The hinge structure includes a support frame, a rotating component and two pivotal components. An end of the rotating component is installed inside the support frame and another end of the rotating component is installed inside the display module, so that the display module is capable of rotating in a first rotating direction relative to the support frame. The two pivotal components are disposed at opposite sides of the support frame and separated from the rotating component. An end of each pivotal component is installed inside the support frame and another end of each pivotal component is installed inside the host module, so that the display module is capable of rotating in a second rotating direction relative to the host module.

Abstract: An information handling system chassis is built at least in part from ceramic elements. For example, a transparent aluminum oxide ceramic portion covers a touchscreen to provide a rigid outer surface for accepting end user inputs. As another example, a ceramic chassis element has a ceramic material formed around a metal material of similar substance with bonding of the ceramic to the underlying material enhanced with oxidation of the outer surface of the metal material.

Abstract: A memory combination includes a first riser board, a second riser board, and a pivotal plate. The first riser hoard includes a plurality of first memory sockets of which long axis directions are parallel to each other. The second riser board includes a plurality of second memory sockets of which long axis directions are parallel to each other. Two end of the pivotal plate are pivotally connected to the first riser board and the second riser board based on an axial direction respectively. When the first and second riser boards rotate to be perpendicular to the pivotal plate, the first memory sockets face the second riser board, and the second memory sockets face the first riser board. The axial direction is perpendicular to the long axis directions of the first memory sockets and the long axis directions of the second memory sockets.

Abstract: Aspects of the present invention relate to a textile fibre, thread or yarn. The fibre, thread or yarn is generally for production into a fabric. Alternative aspects are described for achieving a cooling effect, energy harvesting, heating, energy generation, energy emission, and others.

Abstract: A serial advanced technology attachment dual in-line memory module (SATA DIMM) device includes a number of storage chips, a control chip, a power circuit, and a SATA connector. The control chip is connected to the storage chips. The power circuit is connected to the control chip and the storage chips for providing a voltage to the control chip and the storage chips. The SATA connector includes an idle pin, a pair of signal input pins, a pair of signal output pins, and a pair of ground pins. The idle pin is connected to the power circuit. The signal input pins and the signal output pins are connected to the control chip. The ground pins are grounded.

Abstract: The present invention is directed to an apparatus for reducing and constraining EMI (electronic magnetic radiation) emissions without affecting the internals of data storage system components. A baffle is attached to the exterior of the housing of a data storage system component by baffle mounts. The baffle is operable between a closed position, where the baffle blocks EMI emitted by connectors on the data storage system component, and an open position, where the connectors are not blocked allowing for servicing and cable management. The baffle may comprise an EMI absorbing material and be tuned to meet specific EMI requirements. The baffle mounts offsets the baffle from the data storage system component and the baffle includes a number of holes to allow airflow. The adjustable EMI baffling apparatus does not interfere with other mounted components while the data storage system component is mounted in a cabinet.

Abstract: A removable computer component module includes a plurality of drive trays each adapted for receiving a computer component. Each of the plurality of drive trays includes front and back ends at two lateral opposite ends thereof, two first and two second engaging portions arranged at two vertical opposite ends thereof. The two first and two second engaging portions horizontally extended from the front end to the back end. The two first engaging portions of one of the plurality of drive trays are engageable with the second engaging portions of the other of the plurality of drive trays to form a vertical array without tools.

Abstract: A high performance computing system includes one or more blade enclosures having a cooling manifold and configured to hold a plurality of computing blades, and a plurality of computing blades in each blade enclosure with at least one computing blade including two computing boards. The system further includes two or more cooling plates with each cooling plate between two corresponding computing boards within the computing blade, and a fluid connection coupled to the cooling plate(s) and in fluid communication with the fluid cooling manifold.

Abstract: A high performance computing system with a plurality of computing blades has at least one computing blade that includes one or more computing boards and two side rails disposed at either side of the computing board. Each side rail has a board alignment element configured to hold the computing board within the computing blade, so that a top of the computing board is coupled to, and adjacent to, a portion of the board alignment element.

Abstract: A high performance computing system includes one or more blade enclosures configured to hold a plurality of computing blades, a connection interface, coupled to the one or more blade enclosures, having one or more connectors and a shared power bus that distributes power to the one or more blade enclosures, and at least one power shelf removably coupled to the one or more connectors and configured to hold one or more power supplies. The system may further include the computing blades and the power supplies. The power shelf may include a power distribution board configured to connect the power supplies together on the shared power bus.

Abstract: In accordance with embodiments of the present disclosure, a method may include sliding a slider slidably coupled to the structural member and mechanically coupled to the structural member by an ejection spring with an ejection spring force configured to bias the slider in a first position relative to the structural member in absence of a force other than the rejection spring force, wherein the sliding is in a direction opposite the ejection spring force and away from the first position, and wherein the structural member defines at least a portion of a bay for receiving an information handling resource. The method may also include engaging the slider with a release latch mechanically coupled to the structural member, such that when engaged with the release latch, the slider is biased in a second position away from the first position.

Abstract: A mounting apparatus includes a mounting base, a securing plate attached to the mounting base, and an enclosure. The mounting base defines an opening. The securing plate includes a securing portion secured to the mounting base. The enclosure extends through the opening and is attached to the securing plate. A circuit board, used to secure a power supply, is received in the enclosure and is attached to the securing plate.

Abstract: An air duct is made to be set on a motherboard in a variety of different locations and aspects, for covering a number of electronic components in the most efficient way. The air duct includes a top wall, two sidewalls extending down from opposite sides of the top wall, and a frame mounted to a first end of the top wall. The frame defines a receiving space for receiving a fan, the manner of installation of the air duct permits more than one installation location, to allow for new or differently-located components on the motherboard.

Abstract: A control circuit for controlling rotation speed of a cooling fan of a computer system includes a temperature sensor, a controller, a switch component, and a current control circuit. The controller generates a pulse width modulation (PWM) signal according to a temperature sensed by the temperature sensor. The integral circuit converts the PWM signals into analog voltage signals and output the voltage signals to the switch component, to adjust a voltage output to the cooling fan from the current control circuit and to control the rotation speed of the cooling fan using the voltage output from the current control circuit.

Abstract: An apparatus for dissipating heat is presented. The apparatus comprises a base provided with a recess on a top thereof for containing a portion of a flat panel electronic device. It also comprises a base heat sink disposed in the base. Finally, it comprises a heat-conducting plug with a first end thereof thermally contacting with the base heat sink, and a second end thereof extending upward from a bottom of the recess for plugging into a heat-conducting socket of the flat panel electronic device when the flat panel electronic device is placed on the base.

Abstract: Methods and coolant distribution systems are provided for automated coolant flow control for, for instance, facilitating cooling of multiple different electronic systems. The methods include, for instance, automatically controlling coolant flow to a plurality of coolant circuits, and for a coolant circuit i of the coolant circuits: automatically determining the heat load transferred to coolant flowing through coolant circuit i, and automatically controlling coolant flow through coolant circuit i based on the determined heat load transferred to the coolant. The different coolant circuits may have the same or different coolant flow impedances, and flow through the different coolant circuits may be controlled using different heat load-to-coolant ranges for the different circuits.

Abstract: A heat dissipation lid that includes a plate having a first surface, an opposing second surface, and at least one sidewall extending from the plate second surface. The heat dissipation lid also includes at least one fluid delivery conduit and at least one fluid removal conduit, each extending between the plate first and second surface, and at least one spacing projection extending from the plate second surface to establish and maintain a desired distance between the plate second surface and a microelectronic device, when the heat dissipation lid is positioned to remove heat from the microelectronic device.

Abstract: Methods are provided for automated coolant flow control for, for instance, facilitating cooling of multiple different electronic systems. The methods include, for instance, automatically controlling coolant flow to a plurality of coolant circuits, and for a coolant circuit i of the coolant circuits: automatically determining the heat load transferred to coolant flowing through coolant circuit i, and automatically controlling coolant flow through coolant circuit i based on the determined heat load transferred to the coolant. The different coolant circuits may have the same or different coolant flow impedances, and flow through the different coolant circuits may be controlled using different heat load-to-coolant ranges for the different circuits.

Abstract: A circuit board assembly includes a circuit board, a heat dissipating apparatus, and a support member. The heat dissipating apparatus and the support member are attached to opposite sides of the circuit board. The support member helps the circuit board to support the heat dissipating apparatus. A plurality of mounting holes is defined in the circuit board. Each of the plurality of mounting holes includes a mounting portion and a limiting portion narrower than the mounting portion. The support member includes a plurality of taper-shaped mounting posts for engaging with the plurality of mounting holes. When the mounting post is engaged with the mounting portion, the support member is located at an unlatched position where the support member is disengageable from the circuit board. When the mounting post is engaged with the limiting portion, the support member is located at a latched position and secured to the circuit board.

Abstract: According to one embodiment, semiconductor memory device is capable of operating at a first mode and a second mode which is higher in speed than the first mode. The semiconductor memory device comprising: a semiconductor memory; a controller which controls the semiconductor memory; a connector which is provided with terminals for sending and receiving data to and from an external device; and a substrate on which the semiconductor memory, the controller, and the connector are mounted, the substrate comprising a plurality of wiring layers. The controller and the connector are mounted on an identical surface of the substrate. The substrate comprises a wiring which connects a mounting pad for the terminal for data transfer at the second mode of the connector and a mounting pad for a pin for data transfer at the second mode of the controller to each other on the wiring layer on a mounting surface for the connector and the controller.

Abstract: A power converter includes an inverter in an inverter case, and a DC/DC converter in a converter case detachably fixed to the inverter case. The inverter includes power semiconductor modules, and the DC/DC converter includes a down-converter circuit and/or a boost converter circuit. The inverter case includes first and second path-forming members thermally contacting the converter case. In the first path-forming member, the power semiconductor module is inserted into a first coolant path. In the second path-forming member, the power semiconductor module inserted into the second coolant path, which is parallel to the first coolant path. The DC/DC converter includes an inductance device, and a switching device board on which a switching device con rolling electric current in the inductance device is mounted. The inductance and switching devices are in an area of the converter case thermally contacting first and second path forming members.

Abstract: To provide a brazing material for maintaining bonding strength between ceramic substrate and metal plate at a conventionally attainable level, while addition amount of In is reduced, and a brazing material paste using the same. A mixture powder provided by mixing alloy powder composed of Ag, In, and Cu, Ag powder, and active metal hydride powder, the mixture powder containing active metal hydride powder with a 10-to-25-?m equivalent circle average particle diameter by 0.5 to 5.0 mass %, the equivalent circle average particle diameters for the alloy powder, Ag powder, and active metal hydride powder having a relationship: alloy powder?active metal hydride powder>Ag powder, and the powder mixture having a particle size distribution of d10 of 3 to 10 ?m, d50 of 10 to 35 ?m, and d90 of 30 to 50 ?m, and in the frequency distribution, a peak of the distribution existing between d50 and d90.

Abstract: In a circuit module, a multilayer substrate has a core layer made of a metal, a filter device is stored in a storage portion of the core layer, the filter device and a power amp IC are arranged such that a parallel projection region of the filter device is completely covered by a parallel projection region of the power amp IC, and the power amp IC is connected to the upper surface (one surface in the thickness direction) of the core layer through a plurality of thermal vias provided in the multilayer substrate.

Abstract: An electronic circuit module includes a substrate with built-in component, a mount component mounted on the substrate with built-in component, a sealing portion covering the mount component, and a shield made of a conductive synthetic resin covering the sealing portion. The substrate with built-in component has a core layer made of a metal, an outer cover made of an insulating synthetic resin, and a first protrusion. The core layer has corners and side faces. The outer cover covers the corners and the side faces, and has a first surface. The first protrusion has a first end face exposed at the outer cover and a second surface adjacent to the first surface, and is formed away from the corners of the side faces to protrude outwardly. The sealing portion covers the mount component. The shield covers the sealing portion, and has a third surface bonded to the first surface and the second surface.

Abstract: A mating connector assembly for electrically coupling modular electrical devices. A first stationary connector is coupled to a first rigid circuit board positioned within a first housing of a first modular electrical device. The first floating connector is coupled to a flexible circuit element positioned within a second housing of a second modular electrical device, the flexible circuit element coupled to a circuit board positioned within a second housing of a second modular electrical device. The second housing includes a first latch plate adjustable between an unlatched position and a latched position, the first latch plate including a biasing member, such that, when the first modular electronic device is pressed together with the second modular electronic device, the biasing member applies a force to the first floating connector during a latch plate transition position to ensure that the first floating connector has fully mated with the first stationary connector.

Abstract: A system in package (SiP) module includes a first circuit board assembly, a second circuit board assembly and a plurality of metallic pillars. The first circuit board assembly has a first top surface, a first bottom surface and a plurality of pads mounted on the first bottom surface. The second circuit board assembly has a second top surface, a second bottom surface and a plurality of second pads mounted on the second top surface. The metallic pillars are disposed between the first bottom surface and the second top surface. The metallic pillars electrically connect the first pad and the second pad.

Abstract: There is provided an electronic circuit module that prevents a bonding force between ground wiring and a shield from decreasing and maintains successfully a desirable shield effect. The electronic circuit module includes a core layer also functioning as the ground wiring, each face OS of each first protrusion of the core layer facing to an end face of a shield is adjacent to faces OS of an outer cover made of an insulating synthetic resin facing to the end face of the shield, and the end face of the shield is bonded to both of the each face OS of each first protrusion facing to the end face of the shield and the faces OS of the outer cover facing to the end face of the shield.