Abstract: A load control device for controlling the power delivered from an AC power source to an electrical load includes a thyristor, a gate coupling circuit for conducting a gate current through a gate of the thyristor, and a control circuit for controlling the gate coupling circuit to conduct the gate current through a first current path to render the thyristor conductive at a firing time during a half cycle. The gate coupling circuit is able to conduct the gate current through the first current path again after the firing time, but the gate current is not able to be conducted through the gate from a transition time before the end of the half-cycle until approximately the end of the half-cycle. The load current is able to be conducted through a second current path to the electrical load after the transition time until approximately the end of the half-cycle.

Abstract: An inverter circuit includes a DC-AC inverter, a sampling circuit, a voltage-current conversion circuit, an isolation circuit and an electronic starter switch. The sampling circuit includes a first and a second diode connected in parallel and opposite in polarity. A forward voltage drop at the first diode blocks the conductance of a first transistor of the voltage-current conversion circuit when there is no load, and a forward voltage drop at the second diode turns on the first transistor when there is a load. The connection of the first and second diodes to a second AC output terminal of the DC-AC inverter nearly has no impact on the AC output of the inverter circuit. These enable the inverter circuit to have low power consumption when there is no load and to be immediately activated upon connection of a load, thereby achieving detection of a load smaller than 0.1 W.

Abstract: There is disclosed a power conversion apparatus 3 for converting polyphase ac power directly to ac power. A conversion circuit includes first switching devices 311, 313, 315 and second switching devices 312, 314, 316 connected, respectively, with the phases R, S, T of the polyphase ac power, and configured to enable electrical switching operation in both directions. There are provided input lines R, S, T connected with input terminals of the switching devices and output lines P, N connected with output terminals of the switching devices. The output terminals of the first switching devices and the output terminals of the second switching devices are, respectively, arranged in a row. The first switching devices and second switching devices are arranged side by side with respect to a direction of the rows. The output lines are disposed below the input lines in an up and down direction.

Abstract: An entry including multiple bits of unit cells each storing data bit is coupled to a match line. The match line is supplied with a charging current having a restricted current value smaller than a match line current flowing in a one-bit miss state in one entry, but larger than a match line current flowing in an all-bit match state in one entry. A precharge voltage level of a match line is restricted to a voltage level of half a power supply voltage or smaller. Power consumption in a search cycle of a content addressable memory can be reduced, and a search operation speed can be increased.

Abstract: Semiconductor memory devices include unit cells two-dimensionally arranged along rows and columns in one cell array block. The unit cells are classified into a plurality of cell subgroups, and each of the cell subgroups includes the unit cells constituting a plurality of the rows. Each of the unit cells includes a selection element and a data storage part. A word line is connected to gate electrodes of selection elements of the unit cells constituting each column. Bit lines are connected to data storage parts of the unit cells constituting the rows. A source line, parallel to the bit line, is electrically connected to source terminals of the selection elements of the unit cells in each cell subgroup. The source line is parallel to the bit line. A distance between the source line and the select bit line is equal to a distance between the bit lines adjacent to each other.

Abstract: Polysilicon diodes fabricated in standard CMOS logic processes can be used as program selectors for One-Time Programmable (OTP) devices, using electrical fuse, contact/via fuse, contact/via anti-fuse, or gate-oxide breakdown anti-fuse etc. as OTP element The diode can be constructed by P+/N+ implants on a polysilicon as a program selector. The OTP device can have an OTP element coupled to a polysilicon diode. The OTP devices can be used to construct a two-dimensional OTP memory with the N-terminals of the diodes in a row connected as a wordline and the OTP elements in a column connected as a bitline.

Abstract: Provided is a variable resistance element (Rij) the resistance state of which is reversibly changed by applying electrical signals of different polarities; and a current steering element (Dij) in which a first current is larger than a second current, the first current being a current which flows when a voltage of the first polarity having a first value is applied, the first value being less than a predetermined voltage value and having an absolute value greater than zero, the second current being a current which flows when a voltage of the second polarity having an absolute value which is the first value is applied, the second polarity being different from the first polarity, in which Rij and Dij are connected in series such that the polarity of a voltage to be applied to Dij is the second polarity when the resistance state of Rij is changed to high resistance state.

Abstract: A method of driving a nonvolatile memory element including a variable resistance element having a state reversibly changing between low and high resistance states by an applied electrical signal and a transistor serially connected to the variable resistance element. The method including: setting the variable resistance element to the low resistance state by applying a first gate voltage to a gate of the transistor and applying a first write voltage negative with respect to a first electrode; and changing a resistance value of the transistor obtained in a low-resistance write operation, when a value of current passing through the variable resistance element in the setting of the low resistance state or a resistance value of the nonvolatile memory element in the case where the variable resistance element is in the low resistance state is outside a predetermined range.

Abstract: A memory device includes an upper conductive layer, a lower layer, and a resistive, optical or magnetic matrix positioned between the upper and lower layers.

Abstract: A memory cell array includes memory cells disposed at intersections of first lines and second lines, and each having a rectifying element and a variable resistance element connected in series. A control circuit, when performing an operation to change retained data, applies a first voltage to a selected first line and applies a second voltage to a selected second line; furthermore, applies a third voltage to a non-selected first line; and, moreover, applies a fourth voltage larger than the third voltage to a non-selected second line. An absolute value of a difference between the third voltage and the fourth voltage is set smaller than an absolute value of a difference between the first voltage and the second voltage by an amount of an offset voltage. A value of the offset voltage increases as the absolute value of the difference between the first and second voltages increases.

Abstract: To provide a semiconductor device in which power consumption can be reduced and operation delay due to a stop and a restart of supply of power supply voltage can be suppressed and a driving method thereof. A potential corresponding to data held in a period during which power supply voltage is continuously supplied is saved to a node connected to a capacitor before the supply of power supply voltage is stopped. By utilizing change of channel resistance of a transistor whose gate is the node, data is loaded when the supply of power supply voltage is restarted.

Abstract: A memory circuit includes a transistor having a channel in an oxide semiconductor layer, a capacitor, a first arithmetic circuit, a second arithmetic circuit, a third arithmetic circuit, and a switch. An output terminal of the first arithmetic circuit is electrically connected to an input terminal of the second arithmetic circuit. The input terminal of the second arithmetic circuit is electrically connected to an output terminal of the third arithmetic circuit via the switch. An output terminal of the second arithmetic circuit is electrically connected to an input terminal of the first arithmetic circuit. An input terminal of the first arithmetic circuit is electrically connected to one of a source and a drain of the transistor. The other of the source and the drain of the transistor is electrically connected to one of a pair of electrodes of the capacitor and to an input terminal of the third arithmetic circuit.

Abstract: A domino static random access memory (SRAM) having one or more SRAM memory cells connected with a local bit line is disclosed. The SRAM may include a precharge device connected between a voltage supply and the local bit line, and global bit line (GBL) discharge logic connected between a local bit line and a GBL. The GBL discharge logic transfers a logic value of the local bit line to the GBL during a read operation. GBL precharge logic connects the GBL to a global precharge input. The GBL precharge logic is adapted to draw the GBL to a precharge voltage above a discharge voltage and below a supply voltage during a precharge operation.

Abstract: A cache memory die includes a substrate, a predetermined number of sets of memory cells on the substrate, a first set of input/output terminals on a first surface of the cache memory die, and a second set of input/output terminals on a second surface of the cache memory die. The first set of input/output terminals are connected to a primary memory circuit outside the cache memory die. A portion of the second set of input/output terminals are compatible with the first set of input/output terminals.

Abstract: A processor and a system are provided for tuning a supply voltage for data retention. The contents of data storage circuitry are read and a data verification indication corresponding to the contents is computed. Then, the supply voltage provided to the data storage circuitry is reduced to a low voltage level that is intended to retain the contents of the data storage circuitry.

Abstract: A domino static random access memory (SRAM) having one or more SRAM memory cells connected with a local bit line is disclosed. The SRAM may include a precharge device connected between a voltage supply and the local bit line, and global bit line (GBL) discharge logic connected between a local bit line and a GBL. The GBL discharge logic transfers a logic value of the local bit line to the GBL during a read operation. GBL precharge logic connects the GBL to a global precharge input. The GBL precharge logic is adapted to draw the GBL to a precharge voltage above a discharge voltage and below a supply voltage during a precharge operation.

Abstract: An SRAM with buffered-read bit cells is disclosed (FIGS. 1-6). The integrated circuit includes a plurality of memory cells (102). Each memory cell has a plurality of transistors (200, 202). A first memory cell (FIG. 2) is arranged to store a data signal in response to an active write word line (WWL) and to produce the data signal in response to an active read word line (RWL). A test circuit (104) formed on the integrated circuit is operable to test current and voltage characteristics of each transistor of the plurality of transistors of the first memory cell (FIGS. 7-10).

Abstract: Cell power supply lines are arranged for memory cell columns, and adjust impedances or voltage levels of the cell power supply lines according to the voltage levels of bit lines in the corresponding columns, respectively. In the data write operation, the cell power supply line is forced into a floating state according to the bit line potential on a selected column and has the voltage level changed, and a latching capability of a selected memory cell is reduced to write data fast. Even with a low power supply voltage, a static semiconductor memory device that can stably perform write and read of data is implemented.

Abstract: A magnetoresistive random access memory (MRAM) apparatus includes a first conductive line and a second conductive line. A magnetic tunnel junction is in electrical communication with the first conductive line and the second conductive line. The magnetic tunnel junction includes at least one programmable magnetic layer. The MRAM apparatus also includes an insulating layer radially surrounding the magnetic tunnel junction, and the insulating layer has a cavity adjacent to the magnetic tunnel junction.

Abstract: A mechanism is provided for storing multiple bits in a domain wall nanowire magnetic junction device. The multiple bits are encoded based on a resistance of the domain wall nanowire magnetic junction device using a single domain wall. The single domain wall is shifted to change the resistance of the domain wall nanowire magnetic junction device to encode a selected bit. The resistance is checked to ensure that it corresponds to a preselected resistance for the selected bit. Responsive to the resistance corresponding to the preselected resistance for the selected bit, he selected bit is stored. Responsive to the resistance not being the preselected resistance for the selected bit, the single domain wall is shifted until the resistance corresponds to the preselected resistance.

Abstract: A mechanism is provided for storing multiple bits in a domain wall nanowire magnetic junction device. The multiple bits are encoded based on a resistance of the domain wall nanowire magnetic junction device using a single domain wall. The single domain wall is shifted to change the resistance of the domain wall nanowire magnetic junction device to encode a selected bit. The resistance is checked to ensure that it corresponds to a preselected resistance for the selected bit. Responsive to the resistance corresponding to the preselected resistance for the selected bit, he selected bit is stored. Responsive to the resistance not being the preselected resistance for the selected bit, the single domain wall is shifted until the resistance corresponds to the preselected resistance.

Abstract: A mechanism is provided for reading a cross point cell array. Voltage biasing is applied to the cross point cell array to determine a state of a target cell on a selected bit line. A negative magnetic field is generated for a selected write bit line corresponding to the target cell. A first current is measured through a selected word line responsive to the negative magnetic field. A positive magnetic field is generated for the selected write bit line corresponding to the target cell. A second current is measured through the selected word line responsive to the positive magnetic field. The state of the target cell is determined based on the first current relative to the second current.

Abstract: The present disclosure concerns a multilevel magnetic element comprising a first tunnel barrier layer between a soft ferromagnetic layer having a magnetization that can be freely aligned and a first hard ferromagnetic layer having a magnetization that is fixed at a first high temperature threshold and freely alignable at a first low temperature threshold. The magnetic element further comprises a second tunnel barrier layer and a second hard ferromagnetic layer having a magnetization that is fixed at a second high temperature threshold and freely alignable at a first low temperature threshold; the soft ferromagnetic layer being comprised between the first and second tunnel barrier layers. The magnetic element disclosed herein allows for writing four distinct levels using only a single current line.

Abstract: Systems and method for reading/sensing data stored in magnetoresistive random access memory (MRAM) cells using magnetically annealed reference cells. A MRAM includes a reference circuit comprising at least one magnetic storage cell, wherein each magnetic storage cell in the MRAM is programmed to the same state. The reference circuit includes a load element coupled to the magnetic storage cell, wherein the load element is configured to establish a reference voltage during a read operation.

Abstract: A semiconductor memory device and an operating method of the semiconductor memory device change a read voltage used in a read operation by performing a moving read operation, a randomize operation, and a program/erase compensation operation independently or in combination, thereby stably performing the read operation without an error and reducing a time for the read operation even when distribution of threshold voltages of the memory cells is changed according to a program/erase cycling effect or a retention effect.

Abstract: Techniques are disclosed for SLC blocks having different characteristics than MLC blocks such that SLC blocks will have high endurance and MLC blocks will have high reliability. A thinner tunnel oxide may be used for memory cells in SLC blocks than for memory cells in MLC blocks. A thinner tunnel oxide in SLC blocks may allow a lower program voltage to be used, which may improve endurance. A thicker tunnel oxide in MLC blocks may improve data retention. A thinner IPD may be used for memory cells in SLC blocks than for memory cells in MLC blocks. A thinner IPD may provide a higher coupling ratio, which may allow a lower program voltage. A lower program voltage in SLC blocks can improve endurance. A thicker IPD in MLC blocks can prevent or reduce read disturb. SLC blocks may have a different number of data word lines than MLC blocks.

Abstract: Methods and apparatus are provided for storing data in a multi-level cell flash memory device with cross-page sectors, multi-page coding and per-page coding. A single sector can be stored across a plurality of pages in the flash memory device. Per-page control is provided of the number of sectors in each page, as well as the code and/or code rate used for encoding and decoding a given page, and the decoder or decoding algorithm used for decoding a given page. Multi-page and wordline level access schemes are also provided.

Abstract: Methods and apparatus are provided for storing data in a multi-level cell flash memory device with cross-page sectors, multi-page coding and per-page coding. A single sector can be stored across a plurality of pages in the flash memory device. Per-page control is provided of the number of sectors in each page, as well as the code and/or code rate used for encoding and decoding a given page, and the decoder or decoding algorithm used for decoding a given page. Multi-page and wordline level access schemes are also provided.

Abstract: Methods and apparatus are provided for storing data in a multi-level cell flash memory device with cross-page sectors, multi-page coding and per-page coding. A single sector can be stored across a plurality of pages in the flash memory device. Per-page control is provided of the number of sectors in each page, as well as the code and/or code rate used for encoding and decoding a given page, and the decoder or decoding algorithm used for decoding a given page. Multi-page and wordline level access schemes are also provided.

Abstract: The disclosure is related to memory arrays and methods. One such memory array has a substantially vertical pillar. A memory cell adjacent to the pillar where the pillar has a first size has a greater channel length than a memory cell adjacent to the pillar where the pillar has a second size larger than the first size.

Abstract: Programming NAND strings in a 3D stacked storage device to a conductive state is disclosed. Storage elements may be erased by raising their Vt and programmed by lowering their Vt. Programming may include applying a series of increasing voltages to selected bit lines until the selected memory cell is programmed. Unselected bit lines may be held at about ground, or close to ground. The selected word line may be grounded, or be held close to ground. Unselected word lines between the selected word line and the bit line may receive about the selected bit line voltage. Unselected word lines between the source line and the selected word line may receive about half the selected bit line voltage. Programming may be achieved without boosting channels of unselected NAND strings to inhibit them from programming. Therefore, program disturb associated with leakage of boosted channel potential may be avoided.

Abstract: Charge leakage from a floating gate in a NAND flash memory die is reduced by applying a data retention bias to a word line extending over the floating gates. The data retention bias is applied to one or more selected word lines when the memory die is in idle mode, when no read, write, erase, or other commands are being executed in the memory die.

Abstract: A memory circuit includes an array subdivided into multiple divisions, each connectable to a corresponding set of access circuitry. A serializer/deserializer circuit is connected to a data bus and the access circuitry to convert data between a (word-wise) serial format on the bus and (multi-word) parallel format for the access circuitry. Column redundancy circuitry is connect to the serializer/deserializer circuit to provide defective column information about the array. In converting data from a serial to a parallel format, the serializer/deserializer circuit skips words of the data in the parallel format based on the defective column information indicating that the location corresponds to a defective column. In converting data from a parallel to a serial format the serializer/deserializer circuit skips words of the data in the parallel format based on the defective column information indicating that the location corresponds to a defective column.

Abstract: A system including a reference voltage module configured to generate one or more reference voltages for determining states of a plurality of memory cells of a nonvolatile memory, where the plurality of memory cells have a threshold voltage distribution. A divider module divides, in response to a change in the threshold voltage distribution, a voltage range into a plurality of regions. An update module updates, to compensate for the change in the threshold voltage distribution, one of the reference voltages to a voltage value associated with one of the plurality of regions.

Abstract: Apparatuses and methods for reprogramming memory cells are described. One or more methods for memory cell operation includes programming a number of memory cells such that each of the number of memory cells are at either a first program state or a second program state, the second program state having a first program verify voltage associated therewith; and reprogramming the number of memory cells such that at least one of the number of memory cells is reprogrammed to a third program state having a second program verify voltage associated therewith, wherein those of the number of memory cells having a threshold voltage less than the second program verify voltage represent a same data value.

Abstract: A flash memory device including a memory array, a row decoder and M page buffers is provided, wherein M is an integer greater than 2. The memory array includes a plurality of memory cells and is connected to a plurality of word lines and a plurality of bit lines. The row decoder drives a specific word line among the word lines during an enabling period. Each of the page buffers is connected to N bit lines of the bit lines, and N is an integer equal to or greater than 3. A jth page buffer drives an (N*(j?1)+1)th bit line to an (N*j)th bit line during the enabling period, and one of an (i?1)th bit line and an (i+1)th bit line is not driven when an ith bit line is not driven, wherein j is an integer and 1?j?M, and i is an integer and 1<i<M*N.

Abstract: Memory devices and methods are disclosed, such as devices configured to store a number of access line biasing patterns to be applied during a memory device operation performed on a particular row of memory cells in the memory device. Memory devices are further configured to support modification of the stored bias patterns, providing flexibility in biasing access lines through changes to the bias patterns stored in the memory device. Methods and devices further facilitate performing memory device operations under multiple biasing conditions to evaluate and characterize the memory device by adjustment of the stored bias patterns without requiring an associated hardware change to the memory device.

Abstract: A method of operating a semiconductor memory device may include increasing threshold voltage of memory cells by performing an LSB program operation on the memory cells having first state, decreasing threshold voltage of memory cells to be programmed to second state of the memory cells to a level lower than a first level in unit of a memory cell for an MSB program operation, and increasing threshold voltage of memory cells to be programmed to third state of the memory cells to a level higher than a second level, which is higher than the first level, in unit of a memory cell for an MSB program operation.

Abstract: A semiconductor device has a semiconductor layer, a floating gate electrode provided over the semiconductor layer via a first insulation film, and an erase gate electrode to which an erase voltage is applied. The floating gate electrode has an opposing region that opposes via a second insulation film to the erase gate electrode. The opposing region has such a shape that multiple electric field concentrating portions are formed when the erase voltage is applied to the erase gate electrode.

Abstract: To include first and second data input/output terminals allocated to first and second memory circuit units, respectively, and an address terminal allocated in common to these memory circuit units. When a first chip selection signal is activated, the first memory circuit unit performs a read operation or a write operation via the first data input/output terminal based on an address signal regardless of an operation of the second memory circuit unit. When a second chip selection signal is activated, the second memory circuit unit performs a read operation or a write operation via the second data input/output terminal based on the address signal regardless of an operation of the first memory circuit unit. With this configuration, a wasteful data transfer can be prevented, and the effective data transfer rate can be increased.

Abstract: A method for testing a memory device includes entering a test mode in which multiple memory banks operate in a same manner, allowing a row corresponding to a row address in the multiple memory banks to be activated, latching a bank address and the row address corresponding to the multiple memory banks, writing same data in a column selected by a column address in the multiple memory banks, reading the data written in the writing of the data from the multiple memory banks, checking whether the data read from the multiple memory banks in the reading of the data are equal to each other, and matching the memory bank address and the row address with each other and programming the matched address to a nonvolatile memory when the data read from the multiple memory banks are different from each other.

Abstract: A method for testing a memory device includes entering a test mode in which multiple memory banks operate in a same manner, allowing a row corresponding to a row address in the multiple memory banks to be activated, latching a bank address and the row address corresponding to the multiple memory banks, writing same data in a column selected by a column address in the multiple memory banks, reading the data written in the writing of the data from the multiple memory banks, checking whether the data read from the multiple memory banks in the reading of the data are equal to each other, and programming the row address to locations designated by the bank address latched in the latching in a nonvolatile memory when the data read from the multiple memory banks are different from each other.

Abstract: An adaptive synchronous FIFO includes a plurality of input data latch stages that sample variable-length input data at a write clock frequency, and a data compression circuit that combines the variable-length input data, together with partial-row data from a row of the FIFO storage array, and writes the combined data at a read clock frequency. The number of data latch stages is adaptive according to the ratio of the read and write clock frequencies.

Abstract: A memory system includes one or more memory chips, and a repair information storage chip including a nonvolatile memory configured to store a repair information of the one or more memory chips, wherein during an initial operation of the memory system, the repair information stored in the repair information storage chip is transmitted to the one or more memory chips.

Abstract: Embodiments of a data capture system and method may be used in a variety of devices, such as in memory controllers and memory devices. The data capture system and method may generate a first set of periodic signals and a second set of periodic signals that differs from the first set. Either the first set of periodic signals or the second set of periodic signals may be selected and used to generate a set of data capture signals. The selection of either the first set or the second set may be made on the basis of the number of serial data digits in a previously captured burst of data. The data capture signals may then be used to capture a burst of serial data digits.

Abstract: An electronic device includes a non-volatile memory having a plurality of memory cells, a memory controller, and an evaluator. The memory controller is configured to provide control signals to the non-volatile memory causing the non-volatile memory, or a selected memory section of the non-volatile memory, to be in one of a read state and a weak erase state, wherein the weak erase state causes the plurality of memory cells to maintain different states depending on different physical properties of the plurality of memory cells. The evaluator is configured to read out the plurality of memory cells and to provide a readout pattern during the read state, wherein the readout pattern that is provided after a preceding weak erase state corresponds to a physically unclonable function (PUF) response of the electronic device uniquely identifying the electronic device.

Abstract: Techniques for refreshing a semiconductor memory device are disclosed. In one particular exemplary embodiment, the techniques may be realized as a semiconductor memory device including a plurality of memory cells arranged in an array of rows and columns. Each memory cell may include a first region coupled to a source line and a second region coupled to a carrier injection line. Each memory cell may also include a body region capacitively coupled to at least one word line and disposed between the first region and the second region and a decoupling resistor coupled to at least a portion of the body region.

Abstract: A memory device includes a boot-up control unit configured to control a start of boot-up operation by starting the boot-up operation when an initialization signal is activated, and ignore the initialization signal after a complete signal is activated, a nonvolatile memory unit configured to store repair data, and output the stored repair data during the boot-up operation, a plurality of registers configured to store the repair data outputted from the nonvolatile memory unit, a plurality of memory banks configured to replace a normal cell with a redundant cell, using the repair data stored in the corresponding registers among the plurality of resistors, and a verification unit configured to generate the complete signal to notify that the boot-up operation is completed.

Abstract: A shiftable memory is employed in a system and a method to shift a contiguous subset of stored data within the shiftable memory. The shiftable memory includes a memory having built-in shifting capability to shift a contiguous subset of data stored by the memory from a first location to a second location within the memory. The contiguous subset has a size that is smaller than a total size of the memory. The system further includes a processor to provide an address and the length of the contiguous subset. The method includes selecting the contiguous subset of data and shifting the selected contiguous subset.

Abstract: A strobe calibration component for a memory control device includes a tri-state detection receiver, an edge detection component, and an extension gate generation component. The tri-state detection receiver is configured to identify states of an input signal. One of the states includes a high impedance state. The edge detection component is configured to identify valid edges from a sequence of states provided from the tri-state detection receiver. The extension gate generation component is configured to generate a calibrated gate signal according to the valid edges from the edge detection component.