Abstract: An AC/DC converter system comprises an input circuit for connection to a 3-phase AC source. An autotransformer is coupled to the input circuit for developing first and second phase shifted AC supplies. A first AC/DC converter has a first rectifier connected to the first phase shifted AC supply converting AC power to DC power across a first DC bus having a first DC bus capacitor. A second AC/DC converter has a second rectifier connected to the second phase shifted AC supply converting AC power to DC power across a second DC bus having a second DC bus capacitor. First and second sets of switches are connected between the respective first and second DC buses and a main DC bus having a main DC bus capacitor. The first and second sets of switches are controlled so that only one of the first and the second DC buses is connected to the main DC bus to charge the main DC bus capacitor.

Abstract: A high voltage inverter is provided which includes a plurality of k-level flying capacitor H bridge modules, k being greater than 2, each having a positive dc terminal, a negative dc terminal, and two ac terminals, a connecting unit for connecting said ac terminals of said plurality of k-level flying capacitor H bridge modules in series to form a cascading set of modules, and a dc source connected to an ac source and having a transformer, a rectifier rectifying an output voltage of said transformer, and a capacitor connected between the positive and negative dc terminals.

Abstract: In a controller for a power converter, a control terminal can provide a control signal to control a power converter. A cycle of the control signal includes a first time interval and a second time interval. The control circuitry can increase a primary current flowing through a primary winding of transformer circuitry and a secondary current flowing through a secondary winding of the transformer circuitry in the first time interval, and can terminate the increasing of the primary current in the second time interval. The control circuitry can also control the first time interval to be inversely proportional to an input voltage provided to the primary winding.

Abstract: A method and apparatus for controlling an inverter includes operating the inverter in a one of a normal run mode or a pulse mode depending on one or more criteria. When operating in the pulse mode, the inverter generates a sinusoidal output pulse waveform including a plurality of pulses having a determined pulse width. The pulse width is less than a half-wave period of a full-cycle sinusoidal waveform and may be determined as function of, for example, the output power of the inverter, a grid voltage, and/or other criteria.

Abstract: The present invention relates to a switch driving circuit and a driving method thereof that are capable of preventing hard switching. The present invention includes: a dead time controller generating an high-side switching driver controlling signal and a low-side switching driver controlling signal controlling the switching operation of the high-side switch and the low-side switch according to a dead time controlling signal; and a phase detector detecting a phase of a resonance current flowing into the second power voltage terminal to generate a phase information signal, wherein one of the high-side switch driver controlling signal and a signal corresponding thereto, and the phase information signal are compared, and if the turn-on time of the high-side switch is later than the phase change of the resonance current, the dead time is controlled for the turn-on time of the high-side switch to advance the phase change of the resonance current.

Abstract: A boost converter including two or more inductors coupled to an input DC power source and to switches that can each be modulated with a modulation signal to control the output power of the boost converter. Two or more of the modulation signals have a relative phase other than 360° divided by the number of switches.

Abstract: A method is provided for predicting pulse width modulated switching sequences for a multi-phase multi-level converter. With a first predicted switching sequence, due to multi-phase redundancies, equivalent switching sequences are determined. From the equivalent switching sequences, one switching sequence optimal with respect to a predefined optimization goal is selected. The selected switching sequence is used to switch the converter.

Abstract: A switching power supply device includes: a chopper circuit that adjusts a DC voltage input through a reactor to a desired DC voltage by performing an on/off operation of a switching element; an inverter circuit that converts an output of the chopper circuit into a desired AC voltage; a first capacitor that is provided on a side of the inverter circuit relative to the switching element; a second capacitor that is provided on a side of the inverter circuit relative to the switching element; and a resistor that is in a resonant loop formed by three constituent elements that are the first capacitor, the second capacitor, and a wiring inductance between the chopper circuit and the inverter circuit, where the resistor is connected in series to the second capacitor and inserted between the DC bus-bars.

Abstract: Bridge device architecture for connecting discrete memory devices is disclosed. A bridge device is used in conjunction with a composite memory device including at least one discrete memory device. The bridge device comprises a local control interface connected to the at least one discrete memory device, a local input/output interface connected to the at least one discrete memory device, and a global input/output interface interposed between the local control interface and the local input/output interface. The global input/output interface receives and provides global memory control signals and also receives and provides write data to and read data from the at least one discrete memory device.

Abstract: A multi-die memory device includes a first die of a first type and configured to electrically interface with an external processor via a first synchronous interface operating at a first clock rate, and at least one second die of a second type and configured for data storage. Each second die transacts data with the first die via a second synchronous interface operating at a second clock rate, where the first clock rate is an integer multiple of the second clock rate, and where a timing reference associated with the second synchronous interface is transmitted by the first die to the second die.

Abstract: A memory circuit includes at least one memory cell for storing a datum. The memory cell is coupled with a word line, a bit line, a bit line bar, a first voltage line, and a second voltage line. The memory circuit includes a first conductive layer, a second conductive layer coupled with the first conductive layer, a third conductive layer coupled with the second conductive layer. The third conductive layer is routed for the word line and is free from including the bit line, the bit line bar, the first voltage line, and the second voltage line within the memory cell.

Abstract: A 3D memory that is configurable for performance and power. An embodiment of a memory device includes a dynamic random-access memory (DRAM) including multiple memory dies, each memory die including multiple memory arrays, each memory array including peripheral logic circuits and a configurable logic. The memory device further includes a system element coupled with the DRAM, the system element including a memory controller. The memory controller is to provide for control of the configurable logic to provide for separate or shared peripheral logic circuits for one or more memory arrays, the configurable logic being configurable to enable or disable one or more of the peripheral logic circuits and to enable or disable one or more I/O connections between the memory arrays.

Abstract: A memory device in which data can be retained for a long time is provided. The memory device includes a memory element and a transistor which functions as a switching element for controlling supply, storage, and release of electrical charge in the memory element. The transistor includes a second gate electrode for controlling the threshold voltage in addition to a normal gate electrode. Further, the off-state current of the transistor is extremely low because an active layer thereof includes an oxide semiconductor. In the memory device, data is stored not by injection of electrical charge to a floating gate surrounded by an insulating film at high voltage but by control of the amount of electrical charge of the memory element through the transistor whose off-state current is extremely low.

Abstract: A circuit is provided that includes a plurality of vertically oriented p-i-n diodes. Each p-i-n diode includes a bottom heavily doped p-type region. When a voltage between about 1.5 volts and about 3.0 volts is applied across each p-i-n diode, a current of at least 1.5 microamps flows through 99 percent of the p-i-n diodes. Numerous other aspects are also provided.

Abstract: A memory device in a 3-D read and write memory includes memory cells. Each memory cell includes a resistance-switching memory element (RSME) in series with a steering element. The RSME has first and second resistance-switching layers on either side of a conductive intermediate layer, and first and second electrodes at either end of the RSME. The first and second resistance-switching layers can both have a bipolar or unipolar switching characteristic. In a set or reset operation of the memory cell, an electric field is applied across the first and second electrodes. An ionic current flows in the resistance-switching layers, contributing to a switching mechanism. An electron flow, which does not contribute to the switching mechanism, is reduced due to scattering by the conductive intermediate layer, to avoid damage to the steering element. Particular materials and combinations of materials for the different layers of the RSME are provided.

Abstract: A resistive memory device and method of initialization are provided. The resistive memory device includes a first group of resistive memory cells connected between bit lines and a first plate and a second group connected between bit lines and a second plate. First and second initialization voltages are respectively applied to the first and second plates outside a normal path associated with a normal operation of the resistive memory cells.

Abstract: Methods and means related to memory resistors are provided. A memristor includes two multi-layer electrodes and an active material layer. One multi-layer electrode forms an Ohmic contact region with the active material layer. The other multi-layer electrode forms a Schottky barrier layer with the active material layer. The active material layer is subject to oxygen vacancy profile reconfiguration under the influence of an applied electric field. An electrical resistance of the memristor is thus adjustable by way of applied programming voltages and is non-volatile between programming events.

Abstract: Switching device structures and methods are described herein. A switching device can include a vertical stack comprising a material formed between a first and a second electrode. The switching device can further include a third electrode coupled to the vertical stack and configured to receive a voltage applied thereto to control a formation state of a conductive pathway in the material between the first and the second electrode, wherein the formation state of the conductive pathway is switchable between an on state and an off state.

Abstract: A method of a forming process for a variable resistive element, which is performed in short time comparable to the pulse forming and a writing current in a switching action is the same level as that of the DC forming, is provided. In the forming process, a variable resistive element is changed by voltage pulse application from an initial high resistance state just after produced to a variable resistance state where the switching action is performed. The forming process includes a first step of applying a first pulse having a voltage amplitude lower than a threshold voltage at which the resistance of the variable resistive element is lowered, to between both electrodes of the variable resistive element, and a second step of applying a second pulse having a voltage amplitude having the same polarity as the first pulse and not lower than the threshold voltage, thereto after the first step.

Abstract: In a semiconductor device including a memory cell array formed of memory cells using a storage element by a variable resistor and a select transistor, a buffer cell is arranged between a sense amplifier and the memory cell array and between a word driver and the memory cell array. The resistive storage element in the memory cell is connected to a bit-line via a contact formed above the resistive storage element. Meanwhile, in the buffer cell, the contact is not formed above the resistive storage element, and a state of being covered with an insulator is kept upon processing the contact in the memory cell. By such a processing method, exposure and sublimation of a chalcogenide film used in the resistive storage element can be avoided.

Abstract: A system and method to manage leakage of a complementary metal-oxide-semiconductor (CMOS) read transistor in a memory cell. In a particular embodiment, a memory cell is disclosed that includes a storage element and a complementary metal-oxide-semiconductor (CMOS) read transistor. The CMOS read transistor includes a first terminal coupled to a read word line, a second terminal coupled to a read bit line, and a third terminal coupled to the storage element. During a non-read operating time, the read word line and the read bit line are both maintained at substantially the same voltage level. During a read operation, the read word line is maintained at a particular voltage level until after a voltage representing data stored at the storage element is sensed by the CMOS read transistor.

Abstract: Provided is a semiconductor memory device including: first and second SRAM cells; a first hit line pair provided with the first SRAM cell; a second bit line pair provided with the second SRAM cell; a first switch circuit provided between the first bit line pair and the second bit line pair; and a controller that controls the first switch circuit to render the first bit line pair and the second bit line pair conductive, in a case of testing the first SRAM cell.

Abstract: A magnetic memory cell 1 is provided with a magnetic recording layer 10 which is a ferromagnetic layer and a pinned layer 30 connected with the magnetic recording layer 10 through a non-magnetic layer 20. The magnetic recording layer 10 has a magnetization inversion region 13, a first magnetization fixed region 11 and a second magnetization fixed region 12. The magnetization inversion region 13 has a magnetization whose orientation is invertible and overlaps the pinned layer 30. The first magnetization fixed region 11 is connected with a first boundary B1 in the magnetization inversion region 13 and a magnetization orientation is fixed on a first direction. The second magnetization fixed region 12 is connected with a second boundary B2 in magnetization inversion region 13 and a magnetization orientation is fixed on a second direction. The first direction and the second direction are opposite to each other.

Abstract: Described examples include sensing circuits and reference voltage generators for providing a reference voltage to a sensing circuit. The sensing circuits may sense a state of a memory cell, which may be a PCM memory cell. The sensing circuits may include a cascode transistor. Examples of reference voltage generators may include a global reference voltage generator coupled to multiple bank reference voltage generators which may reduce an output resistance of the voltage generator routing.

Abstract: A method of storing a bit at a memory device is disclosed. A memory cell the memory device is formed of a germanium-deficient chalcogenide glass configured to alternate between an amorphous phase and a crystalline phase upon application of a selected voltage, wherein a drift coefficient of the germanium-deficient chalcogenide glass is less than a drift coefficient of an undoped chalcogenide glass. A voltage is applied to the formed memory cell to select one of the amorphous phase and the crystalline phase to store the bit.

Abstract: According to one embodiment, a nonvolatile memory device includes a magnetic memory element and a control unit. The magnetic memory element includes a stacked body including first and second stacked units. The first stacked unit includes a first ferromagnetic layer having a magnetization fixed, a second ferromagnetic layer having a magnetization variable and a first nonmagnetic layer provided between the first and second ferromagnetic layers. The second includes a third ferromagnetic layer having a magnetization rorated by a passed current to produce oscillation, a fourth ferromagnetic layer having a magnetization fixed and a second nonmagnetic layer provided between the third and fourth ferromagnetic layers stacked with each other. A frequency of the oscillation changes in accordance with the direction of the magnetization of the second ferromagnetic layer. The control unit includes a reading unit reading out the magnetization of the second ferromagnetic layer.

Abstract: A system includes a control chip and a plurality of command terminals receiving a plurality of command signals, respectively; a command decoder coupled to the command terminals, the command decoder being configured to output an internal command in response to the command signals; and a layer address buffer configured to output a layer address each time the command decoder outputs a row command as the internal command and outputs a column command as the internal command; and a plurality of core chips stacked with one another, each of the core chips being configured to receive the, row command and the layer address output together with the row command, to receive the column command and the layer address output together with the column command, and to free from receiving the command signals.

Abstract: There is provided a semiconductor device including a word line, a bit line, a power supply node, a memory element, and a capacitor. The memory element includes at least first and second regions that form a PN junction between the bit line and the power supply node, and a third region that forms a PN junction with the second region. The capacitor includes a first electrode provided independently from the second region of the memory element and electrically connected to the second region of the memory element, and a second electrode connected to the word line.

Abstract: In a nonvolatile memory array that stores randomized data, the program level—the number of states per cell stored in a population of memory cells—may be determined from the aggregated results of a single read step. A circuit for aggregating binary results of a read step includes parallel transistors with control gates connected to the data latches holding the binary results, so that current flow through the combined transistors depends on the binary results.

Abstract: A data writing method for writing data into a memory cell of a rewritable non-volatile memory module, and a memory controller and a memory storage apparatus using the same area provided. The method includes recording a wear degree of the memory cell and adjusting an initial write voltage and a write voltage pulse time corresponding to the memory cell based on the wear degree thereof. The method further includes programming the memory cell by applying the initial write voltage and the write voltage pulse time, thereby writing the data into the memory cell. Accordingly, data can be accurately stored into the rewritable non-volatile memory module by the method.

Abstract: A memory controller has a digital signal processor. The digital signal processor is configured to output a digital data signal of M+N bits of program data intended for programming a memory cell of a memory device. The digital signal processor is configured to receive a digital data signal of M+L bits read from the memory cell of the memory device and to retrieve from the received digital data signal M bits of data that were stored in the memory cell.

Abstract: A semiconductor memory device and a method of operating the same are disclosed. The semiconductor memory device includes a memory cell block configured to have memory cell groups, a peripheral circuit configured to read data by supplying a read voltage to memory cells in the memory cell groups, a fail detection circuit configured to perform a pass/fail check operation of memory cell groups according to the data read by the peripheral circuit and a control circuit configured to control the peripheral circuit and the fail detection circuit to perform again the read operation about the memory cell groups using a compensation read voltage different from the read voltage in the event that it is determined that one or more memory cell group is failed according to the pass/fail check operation.

Abstract: A nonvolatile memory device has improved reliability by compensating a threshold voltage of a flash memory cell. A nonvolatile memory device includes a memory cell array and a voltage generator for supplying a select read voltage to a select word line and an unselect read voltage to unselected word lines when a read operation is performed, and supplying a verify voltage to a select word line and the unselect read voltage to unselected word lines when a program operation is performed. The voltage generator supplies a first unselect read voltage to at least one between an upper word line and a lower word line adjacent to the select word line when the program operation is performed, and supplies a second unselected read voltage to at least one between the upper word line and the lower word line adjacent to the select word line when the read operation is performed.

Abstract: A method includes determining a programming step size for a word line of a memory in a data storage device. The programming step size is determined at least partially based on a count of memory elements of the word line to be programmed to a particular state.

Abstract: Memory devices and methods are disclosed. An embodiment of one such method includes programming a first memory cell to a first program level by applying a first series of programming pulses to a control gate of the first memory cell, where the programming pulses of the first series have voltages that sequentially increase by a certain first voltage; and programming a second memory cell to a second program level that is higher than the first program level by applying a second series of programming pulses to a control gate of the second memory cell, where the programming pulses of the second series have voltages that sequentially increase by a certain second voltage less than the certain first voltage.

Abstract: In non-volatile memory devices, a write typically consists of an alternating set of pulse and verify operations. At the end of a pulse, the device must be biased properly for an accurate verify, after which the device is re-biased for the next pulse. In some cases a non-volatile memory is programmed by an alternating set of pulses, but, for at least some pulses without any intervening verify operations. After a one pulse, but before biasing the memory for the next pulse without an intervening very, the source and bit line levels can be left to float.

Abstract: Cells of a solid-state, non-volatile memory are assigned to one of a plurality of groups. Each group is defined by expected symbols stored in the cells in view of actual symbols read from the cells. Based on cell counts within the groups, it can be determined that a shift in a reference voltage will reduce a collective bit error rate of the cells. The shift can be applied to data access operations affecting the cells.

Abstract: A nonvolatile semiconductor storage device according to an embodiment includes a drive circuit. A voltage applied to a dummy wire connected to a first dummy cell adjacent to a memory string is defined as a first dummy wire voltage, a voltage applied to a selection wire connected to a first memory cell adjacent to the first dummy cell is defined as a first selection wire voltage, and a voltage applied to a selection wire connected to a second memory cell adjacent to the first memory cell is defined as a second selection wire voltage. When the second selection wire voltage is lower than the first dummy wire voltage in an erase operation, the drive circuit controls voltages so that a difference between the first dummy wire voltage and the second selection wire voltage is less than a difference between the first dummy wire voltage and the first selection wire voltage.

Abstract: A Flash memory device operable under a single-bit or multiple-bit serial protocol is provided with a capability to determine the address boundary condition of an application from the address field of an address boundary configurable (“ABC”) read command. Based on the identified address boundary condition, the Flash memory device may perform multiple sensing of the memory array as required by the ABC read command using optimal internal sense times for each sensing. The number of dummy bytes may be specified for the read command in advance by the user, based on the address boundary of the application and the desired frequency of operation of the Flash memory device. Therefore, Flash memory device read performance is improved both by minimizing the number of dummy bytes in the read command and by optimizing the internal sense times for the read operation.

Abstract: Disclosed is an apparatus and method for determining a read level voltage to apply to a block of memory cells in a non-volatile memory circuit. A prediction value is compared to a prediction indicator to determine whether a new read level voltage to be applied to read the memory cells should be estimated. If a new read level should be estimated the new read level is calculated as a function of an initial read level and a dwell time and a number of program/erase cycles. A controller provides one or more programming commands representative of the new read level voltage to the memory circuit to read the cells.

Abstract: A memory device includes a word line driver circuit, a write voltage generator for providing a write voltage to the word line driver during a write operation to memory cells coupled to the word line driver circuit, and a write bias generator including an output node for providing a write bias voltage that is different from the write voltage to the word line driver circuit during a write operation to memory cells coupled to the word line driver circuit. The write bias voltage is used to reduce current drawn by the word line driver circuit from the write voltage generator during a write operation to memory cells coupled to the word line driver circuit.

Abstract: Subject matter disclosed herein relates to techniques to operate memory.

Abstract: The present disclosure includes apparatuses and methods for determining soft data for combinations of memory cells. A number of embodiments include an array of memory cells including a first and a second memory cell each programmable to one of a number of program states, wherein a combination of the program states of the first and second memory cells corresponds to one of a number of data states, and a buffer and/or a controller coupled to the array and configured to determine soft data associated with the program states of the first and second memory cells and soft data associated with the data state that corresponds to the combination of the program states of the first and second memory cells based, at least in part, on the soft data associated with the program states of the first and second memory cells.

Abstract: A semiconductor memory device includes strings configured to include a drain select transistor, memory cells, and a source select transistor coupled in series between a bit line and a common source line and peripheral circuits configured to precharge a bit line so that the precharge level of the bit line varies depending on whether an adjacent unselected memory cell is in the program or erase states, by supplying a first voltage to the adjacent unselected memory cell arranged toward the drain select transistor, a second voltage to the remaining memory cells, and a third voltage higher than a bit line precharge voltage to the common source line and perform a read operation of supplying a read voltage lower than the second voltage to the selected memory cell, the second voltage to the remaining memory cells including the adjacent unselected memory cell, and a ground voltage to the common source line.

Abstract: Disclosed is an apparatus and method for determining a parameter for programming a non-volatile memory circuit. On receiving write or erase operation a parameter is determined as a function of a circuit characteristic associated with a memory block. An adjusted condition, for example, read or write time, or the standard deviation of voltage thresholds in a distribution of cells, is then determined as a function of the parameter, and a command provided to the memory circuit to use the parameter in the next write or erase operation performed on the memory block. The method can be triggered by an event such as P/E cycle times and the condition is dynamically adjusted to extend the life of the memory circuit.

Abstract: An internal voltage generation circuit includes a vblh voltage generation circuit that generates a voltage vblh that is supplied as a high-voltage power supply of a sense amplifier, and a voltage distribution control circuit that has a first current source that pulls down an output node and a second current source that pulls up the output node. The output node is pulled down by the first current source operating, and the voltage thereof is maintained at a voltage that corresponds to a lower limit of a detection voltage value. The output node is pulled up by the second current source operating, and the voltage thereof is maintained at a voltage that corresponds to an upper limit of the detection voltage value.

Abstract: Disclosed herein is a semiconductor device that includes a command decoder activating a first mode register setting signal in response to a mode register setting command supplied from outside, a first latency shifter activating a second mode register setting signal after elapse of predetermined cycles of a clock signal since the first mode register setting signal is activated, and a mode register storing a mode signal supplied from outside in response to the second mode register setting signal.

Abstract: An embodiment of a sense amplifier includes a sense circuit and a monitor circuit. The sense circuit is configured to convert a first signal that corresponds to data stored in a memory cell into a second signal that corresponds to the data, and the monitor circuit is configured to indicate a reliability of the second signal. The monitor circuit allows, for example, adjusting a parameter of a memory in which the memory cell is disposed to increase the read accuracy, and may also allow recognizing and correcting an error due to an invalid second signal.

Abstract: A semiconductor memory device includes: a data multiplexing unit configured to output one of a data training pattern and data transferred through a first global input/output line in response to a training control signal; and a latch unit configured to latch an output of the data multiplexing unit to apply and maintain the latched output to a second global input/output line.

Abstract: A semiconductor memory device includes a first bank including a plurality of cell matrices a second bank including a plurality of cell matrices and a shared-fuse set, which is shared by the first and second banks, configured to output a defect indication signal when the first bank or the second bank is enabled and a defective cell matrix is included in the enabled bank.