Abstract: A multilayer ceramic composition showing good characteristics, even when electric intensity on dielectric layers is high and a stacked number of a multilayer ceramic capacitor is increased, and an electronic device thereof. Said composition comprises: a perovskite compound ABO3, and with respect to 100 moles of said compound, 0.6 or more to 1.4 or less moles of Ra2O3 in which Ra is at least one of Dy, Gd and Tb, 0.2 or more to 0.7 or less moles of Rb2O3 in which Rb is at least one of Ho and Y, and 0.2 or more to 0.7 or less moles of Rc2O3 in which Rc is at least one of Yb and Lu, in terms of each oxide, 0.6 or more to 1.6 or less moles of Mg oxide in terms of Mg, and 0.6 or more to less than 1.2 moles of Si included compound in terms of Si.

Abstract: Disclosed herein is a multilayer ceramic device, including a device body having a plurality of dielectric sheets stacked on one another, the device body having spaced-apart sides and circumferential surfaces connecting the sides; internal electrodes formed on the dielectric sheets; an external electrode having a front portion to cover the sides and a band portion to extend from the front portion to cover parts of the circumferential surfaces; and a reinforcement pattern having a plurality of metal patterns arranged facing one another between the internal electrodes and the circumferential surfaces, wherein a distance between the metal patterns may be smaller than thicknesses of the dielectric sheets on which the internal electrodes are formed.

Abstract: There is provided a multilayer ceramic electronic component, including a ceramic body, and an internal electrode formed in the ceramic body and having a plurality of non-electrode regions formed therein, wherein in a cross section formed in length and thickness directions of the ceramic body, when a thickness of the internal electrode is Te, an area of the internal electrode is Ae, and an area of the plurality of non-electrode regions is Ao, 0.1 ?m?Te?0.55 ?m and 3.2%?Ao:Ae?4.5% are satisfied.

Abstract: Disclosed herein is a multilayer ceramic device, including a device body; an inner electrode arranged in the device body; and an external electrode arranged at outside of the device body and being electrically connected to the inner electrode; wherein the external electrode includes: an inner layer covering the device body; an outer layer covering the inner layer and being exposed to the outside; and an intermediate layer arranged between the inner layer and the outer layer, and made of a mixture of a copper metal and a resin, a surface of the copper metal being coated with an oxide film.

Abstract: A capacitor includes a sealing member that includes a valve installation part, the valve installation part being higher than a processed sealing part of an outer packaging case for housing a capacitor element; and a pressure valve that is installed in a through hole of the valve installation part and whose valve function part is set at a position, the position being higher than the processed sealing part.

Abstract: A high-voltage transformer module includes a transformer core including at least one winding, and a mechanical supporting structure having the transformer core integrated permanently therein. The mechanical supporting structure has corner points arranged in the form of a right-parallelepiped. The corner points are in the form of load transfer points and are arranged corresponding to the dimensions of a CSC (International Convention for Safe Containers) container.

Abstract: A power distribution box apparatus and method for implementing a priority disconnect scheme and a network communication bridge at a worksite, where the power distribution box distributes temporary power. The power distribution box includes a housing portion and a base portion elevating the housing portion off of the ground or another surface. The power distribution box includes a communication module having a network connecting module operable to connect to an external communication network (e.g., the Internet), and a wireless network module operable to wirelessly communicate with an external device (e.g., a smart phone) to, thereby, connect the external device to the external communication network. The power distribution box may also include a priority disconnect module to selectively disconnect AC output receptacles in response to over-current situations based on a priority level associated with each receptacle.

Abstract: An electronic device (100) includes a housing member (103) and a display layer (512). The display includes two substrate layers (404,405) sealed together at a seam (408) disposed along a periphery (602) of each substrate layer. A compression gasket (604) is disposed between the housing member and the display, the compression gasket being disposed against the display interior to the seam. A second compression gasket (995) can be disposed interior to the compression gasket to provide a dampening function.

Abstract: A protecting structure of an uninterruptible power supply prevents the uninterruptible power supply. The uninterruptible power supply device has a switch with a switching piece. The protecting structure includes a chassis, a sensor and a cover body. The chassis has an opening slot, the uninterruptible power supply device is installed in the chassis, and the switching piece is disposed corresponding to the opening slot. The sensor is provided on a side of the opening slot of the chassis and electrically connected with the uninterruptible power supply device. The cover body includes a cover plate and at least one blocking member connecting with the cover plate. The cover plate covers the opening slot, wherein the switching piece ejects the blocking member to expose the opening slot when the covered switching piece is switched from a first position to a second position.

Abstract: An electronic device and a glass sealing method used therefor, with which a sufficient joint strength can be acquired only with the use of a glass sealing material without using an activated brazing material is provided. A crystal device includes an element loading member, lid member, a crystal vibration element, and a glass sealing material. The glass sealing material is provided in a ring-like form between the fringe of the lid member on a main surface side and the fringe of the element loading member on a main surface side, and keeps a space in vacuum.

Abstract: A display apparatus includes a display module for displaying an image, a variable member for varying a shape of the display module, and a rear cover disposed at a rear surface of the display module and varying with the varying shape of the display module.

Abstract: A clamp meter configured to receive a removable and rechargeable battery pack. The clamp meter includes a main body having a first axis, a handle, a clamp, a trigger, and a display. The handle has a second axis and includes a first recess configured to receive the battery pack. The first recess includes at least first and second electrical terminals which are exposed when the battery pack is not inserted into the first recess. The second axis forms an oblique angle with the first axis, and the battery pack is inserted into the first recess along the second axis. The clamp is coupled to the main body, aligned with the first axis, and operable to measure an electrical characteristic of a conductor based on an induced current. The trigger is operable to selectively open and close the clamp, and the display configured to display an indication of the electrical characteristic.

Abstract: A drive assembly comprising a drive and a drive carrier. The drive carrier includes an active bar which comprises a plurality of drive holders and an engagement mechanism. The active bar of a drive assembly performs a plurality of drive assembly functions.

Abstract: A system for the management of rack-mounted field replaceable units (FRUs) that affords the enhanced availability and serviceability of FRUs provided by blade-based systems but in a manner that accommodates different types of FRUs (e.g., in relation to form factors, functionality, power and cooling requirements, and/or the like) installed within a rack or cabinet.

Abstract: An electronic device includes a structure for inserting a card-type external device. The electronic device includes a case frame, a slot, a first unit, a second unit, and an external device. The slot is formed in the case frame and has a certain size. The first unit is disposed at a location corresponding to the slot inside the electronic device. The second unit corresponds to the slot inside the electronic device and is installed around the first unit. The external device is detachably mounted in the first unit through the slot.

Abstract: A device housing assembly has a display module including a front pane and a rear pane, the rear pane having a section longer than the front pane in at least one direction. The housing assembly further has a transparent lens and plastic housing, the transparent lens having a front and rear surface; and an adhesive between the front transparent pane and the rear surface of the transparent lens. The housing includes a support structure molded to the rear surface of the transparent lens positioned proximally to the longer section of the rear pane and adjacent to the front pane of glass, the structure providing mechanical support for the rear pane.

Abstract: Techniques for and a wearable device with component protective overmolding are described. In one embodiment, the wearable device has one or more elements coupled to a framework, a protective material selectively applied over the one or more elements, a first protective layer formed substantially over the framework, the one or more elements, and the protective material, and a second protective layer formed substantially over the first protective layer, the second protective layer being removable and providing a surface configured to receive a pattern. In one embodiment, the one or more elements may be a sensor. Further, the protective material may comprise a material that is applied in substantially atmospheric conditions, and the first protective layer and the second protective layer may comprise a material that is molded or formed in harsh environmental conditions.

Abstract: A chassis for a storage system contains a digital chamber that houses conventional electronic components and a thermal chamber that houses non-volatile solid state memory such as flash memory. A temperature regulating system monitors temperature within the digital chamber to keep the components therein below their maximum junction temperature. The temperature regulating system tightly regulates the temperature of solid state memory chips to within a nominal operating temperature range selected to extend the lifetime and/or improve the endurance and reliability of the solid state memory. The temperature regulating system may regulate different memory chips to different nominal temperatures based on the operations being performed and lifetime factors for the memory chips including current health and prior use.

Abstract: A system for the management of rack-mounted field replaceable units (FRUs) that affords the enhanced availability and serviceability of FRUs provided by blade-based systems but in a manner that accommodates different types of FRUs (e.g., in relation to form factors, functionality, power and cooling requirements, and/or the like) installed within a rack or cabinet.

Abstract: A drive carrier includes a bezel and opposing sidewalls connected to the bezel. At least one of the opposing sidewalls includes a plurality of slots that form at least part of a keying solution, and a dimension of at least two of the plurality of slots is not the same.

Abstract: An example includes an apparatus to pump a fluid. The apparatus includes a housing extending along a length defining an elongate interior, an actuator in the housing, conforming to the elongate interior, the actuator including a plurality of lumens, each having a length extending substantially parallel to the elongate interior, each from around 10 to 200 micrometers across and an actuator configured to oscillate the actuator in the actuator housing along the length of the elongate interior with a rate differential between movement in a first direction versus movement in a second direction opposite the first direction to pump the fluid.

Abstract: The invention relates to a cooling circuit system, comprising a plurality of juxtaposed racks; a double bottom consisting of double bottom elements mounted on a base bottom on which double bottom the racks are mounted; electric or electronic components to be cooled, which components are accommodated in the racks; and a cooling system, the components of which are accommodated in the double bottom, wherein the cooling system comprises fans that are connected in parallel and that blow cooled air from the double bottom towards the juxtaposed racks. The invention relates also to a method of controlling a cooling circuit system of that type.

Abstract: A cooling subsystem is provided for dissipating heat from processor. The cooling subsystem includes a heat sink comprising an upper portion having a plurality of fins formed therein and a base portion fixed to the upper portion to form a vapor chamber in an enclosed volume between the upper portion and the base portion.

Abstract: A system selectively cools a set of at least one rack-mounted server in a chassis. The system comprises: a chassis; a chassis manager; a set of at least one thermal sensor coupled to each rack-mounted server in the chassis; a cold air source; a cold air conduit coupled to the cold air source; a plurality of cold air valves coupled to the cold air conduit; and an expandable tube of flexible memory material coupled to each of the plurality of cold air valves, where the expandable tube inflates with cold air from the cold air source to expose directional holes, and thus cold air, across a specific predetermined sub-area of a particular overheating rack-mounted server in response to the chassis manager detecting that the particular overheating rack-mounted server is exceeding a predetermined temperature.

Abstract: A system includes a support rack and a component housing. The support rack includes a pair of vertically-extending panels, and each panel of the pair of vertically-extending panels has one or more first mating members of a water coupler pair extending outwardly from the support rack. The component housing is slidably disposed between the pair of vertically-extending panels and has a front panel, a pair of sidewalls extending rearwardly from the front panel, a component water line, and two second mating members of the water coupler pair connected to each other by the component water line.

Abstract: Thermal energy exposed at the outer surface of an information handling system housing is managed by spreading the thermal energy across the housing X and Y axes while restricting heat transfer from the housing at the Z axis. For example, a graphene outer surface couples to an aerogel substrate strengthened by a carbon fiber laminate. The graphene spreads thermal energy that escapes through the housing across the housing outer surface to limit the impact of thermal energy at any particular location, such as proximate to the location of a processor.

Abstract: An electronic device having a heat generating part in an internal space between a front case and a rear case wherein the rear case is integrally molded with a metal sheet and the metal sheet is given relief shapes which increase its surface area, whereby the heat of the heating generating part is dissipated from the rear case and conduction to the front case is reduced. The relief shapes can be formed from a wave shape. The rear case may be made a bathtub shape. Relief shapes of the metal sheet may be exposed at the inside space of the electronic device at the side wall part of the rear case or its vicinity. As a result, the heat which is generated inside the housing of a small electronic device can be efficiently dissipated from the back side and conduction of heat to the front side can be made difficult.

Abstract: An electronic device includes a first electronic unit having a top surface, a first pivot side and a receiving groove, a second electronic unit having a second pivot side pivoted to the first pivot side, an internal module movably received in the receiving groove, and first and second magnetic units respectively disposed on the second pivot side and the internal module. The second electronic unit is pivotable between covering and opening positions that covers and that is distant from the top surface, respectively. The second magnetic unit is magnetically attracted by the first magnetic unit to move one side of the internal module out of the receiving groove and toward the second pivot side when the second electronic unit is in the opening position.

Abstract: A cam system includes a beam including a plurality of coupling features. A first handle is operable to be coupled to the beam using the coupling features. A plurality of cam elements are each operable to be coupled to the beam at different locations along the beam using the coupling features. A plurality of cam brackets are each operable to be mounted to a first member having a first connector. The coupled-together beam, first handle, and cam elements are operable to be coupled a second member having a second connector such that, with the cam brackets mounted to the first member, the engagement of the cam elements with the cam brackets mate the first connector and the second connector.

Abstract: A servo amplifier includes a housing, a heat source arranged in the housing, and a heat dissipating structure including a heat sink arranged in the housing and thermally connected to the heat source. The heat sink has heat dissipating fins extending from at least a portion of a surface of the heat sink, other than a connecting face thermally connected to the heat source. The at least a portion of the surface of the heat sink, other than the connecting face, is thermally connected to a surface of the housing.

Abstract: A window member includes a base substrate that includes a display area transmitting a light and a non-display area disposed adjacent to the display area, a color pattern disposed on a surface of the base substrate in the non-display area, and a heat-discharge member that covers the color pattern and absorbs a heat to discharge the heat to an outside.

Abstract: The invention relates to an electronic module comprising at least one electronic or electric component (3), a base plate (4), and a support plate (2), in particular a printed circuit board or a substrate. Said support plate (2) is arranged on the base plate (4) and comprises conductor paths. Said base plate (4) comprises a blind hole-type recess (5) on a side oriented towards the support plate (2). The component (3) is in contact on the support plate (2) and is arranged in the recess (5) of the base plate (4).

Abstract: A thermally conductive grease includes a carrier oil, at least one dispersant, and thermally conductive particles. The thermally conductive particles have a D50 (Vol. Average) particle size of no greater than about 11 microns and the thermally conductive particles in the thermally conductive grease contain less than 3% by volume of particles having a particle size of 0.7 microns or less, based on the total volume of thermally conductive particles in the thermally conductive grease.

Abstract: An electronic apparatus, such as a lighting fixture, includes a substrate, an electronic device such as a chip-on-board light emitting diode and a thermal interface located between the substrate and the electronic device. The thermal interface includes at least two distinct materials, including a dielectric material and a thermally conductive material. The dielectric material includes a cutout into which the thermally conductive material is located. The dielectric material can completely surround the perimeter of the electronic device or can be located proximate portions of the electronic device that are prone to arcing in order to protect the substrate from arcing. The electronic apparatus operates at a reduced temperature as compared to an electronic apparatus that does not include the thermal interface. Methods for making an electronic apparatus having a thermal interface with a discrete dielectric material and thermally conductive material are also described.

Abstract: Cooling apparatuses and coolant-cooled electronic assemblies are provided which include a thermal transfer structure configured to couple to one or more sides of an electronics card having one or more electronic components to be cooled. The thermal transfer structure includes a thermal spreader coupled to the one side of the electronics card, and the apparatus further includes a coolant-cooled structure disposed adjacent to the socket of the electronic system. The coolant-cooled structure includes: one or more low-profile cold rails sized and configured to thermally couple to the thermal spreader along a bottom edge of the thermal spreader with operative docking of the electronics card within the socket; and one or more coolant-carrying channels associated with the low-profile cold rail(s) for removing heat from the low-profile cold rail(s) to coolant flowing through the coolant-carrying channel(s).

Abstract: The present invention among other things relates to a housing and a construction kit for a control apparatus, e.g. in the form of a controller for a window lifter of a motor vehicle. A controller module with a printed circuit board here is to be accommodated in a housing at least in part, and there are provided two different types of controller modules, e.g. for a right vehicle side on the one hand and for a left vehicle side on the other hand. According to a first aspect of the invention the housing is suitable for both types of controller modules, so that the housing can selectively be combined with the one or the other type of controller module, in order to mount a control apparatus.

Abstract: Buffer structures are provided that can be used to reduce a strain in a conformable electronic system that includes compliant components in electrical communication with more rigid device components. The buffer structures are disposed on, or at least partially embedded in, the conformable electronic system such that the buffer structures overlap with at least a portion of a junction region between a compliant component and a more rigid device component. The buffer structure can have a higher value of Young's modulus than an encapsulant of the conformable electronic system.

Abstract: Disclosed is a flexible display device. The flexible display device includes a display panel configured to include a first substrate that includes a plurality of pixels and a second substrate that is facing-coupled to the first substrate, and a first flexible circuit board connected to the first substrate. A driving IC which supplies a driving signal to the display panel is mounted on the first flexible circuit board. The first substrate includes a display part covered by the second substrate and configured to include the plurality of pixels, a non-display part provided near the display part and coupled to the second substrate, a bending part configured to extend from one side of the non-display part, and bent at a certain curvature, and a pad part connected to one side of the first flexible circuit board.

Abstract: An electronic assembly is disclosed that includes a flexible insulating film, a semiconductor component that has a thickness of less than 50 micrometers, a conductive interconnect extending through the flexible insulating film, a second patterned metal wiring film adjacent, and a third patterned metal wiring film. The second patterned metal wiring film is electrically coupled with the third patterned metal wiring film through the conductive interconnect. The semiconductor component is coupled to the first patterned metal wiring film and at least one of the second patterned metal wiring film or the third patterned metal wiring film.

Abstract: An electronic device includes a display. The display includes a cover, a protection module, and a display panel. The protection module includes an outer frame, a flange, and a supporting strip. The outer frame is secured to the cover. The flange is secured to a first side of the outer frame. The supporting strip extends out of a second side of the outer frame and is located between the cover and the display panel, to protect the display panel from external impact. The flange and the supporting strip are integrally formed with the outer frame.

Abstract: There is provided an electronic device. The electronic device includes: a wiring board; a first electronic component mounted on the wiring board and configured to emit an electromagnetic wave having a first frequency band; a second electronic component mounted on the wiring board and configured to emit an electromagnetic wave having a second frequency band; a first magnetic thin film covering the wiring board, the first electronic component and the second electronic component, wherein the first magnetic thin film has a composition corresponding to the first frequency band; and a second magnetic thin film covering the first magnetic thin film, wherein the second magnetic thin film has a composition corresponding to the second frequency band.

Abstract: An electronic device such as a media player may be formed from electrical components such as integrated circuits, buttons, and a battery. Electrical input-output port contacts may be used to play audio and to convey digital signals. Electrical components for the device may be mounted to a substrate. The components may be encapsulated in an encapsulant and covered with an optional housing structure. The electrical input-output port contacts and portions of components such as buttons may remain uncovered by encapsulant during the encapsulation process. Integrated circuits may be entirely encapsulated with encapsulant. The integrated circuits may be packaged or unpackaged integrated circuit die. The substrate may be a printed circuit board or may be an integrated circuit to which components are directly connected without interposed printed circuit board materials.

Abstract: An interposer can have conductive elements at a first side and terminals at a second side opposite therefrom, for connecting with a microelectronic element and a second component, respectively. The component can include a first element having a thermal expansion coefficient less than 10 ppm/° C., and an insulating second element, with a plurality of openings extending from the second side through the second element towards the first element. Conductive structure extending through the openings in the second element and through the first element electrically connects the terminals with the conductive elements.

Abstract: The invention concerns a method for producing a microelectronic device comprising a substrate and a stack comprising at least one electrically conductive layer and at least on dielectric layer, wherein it comprises the following steps: formation, from one face of the substrate, of at least one pattern that is in depression with respect to a plane of the face of the substrate, the wall of the pattern comprising a bottom part and a flank part, the flank part being situated between the bottom part and the face of the substrate, the flank part comprising at least one inclined wall as far as the face of the substrate, formation of the stack, the layers of the stack helping to at least partially fill in the pattern, thinning of the stack at least as far as the plane of the face of the substrate so as to completely expose the edge of said at least one electrically conductive layer flush in one plane, formation of at least one electrical connection member (710, 720) on the substrate in contact with the edge of sai

Abstract: A connection structure for an electronic component, which is set on two lead frames spaced apart from each other. The electronic component is connected to the two lead frames by a conductive joining member. The connection structure includes two electrodes arranged on at least portions of a lower surface of the electronic component. The two electrodes respectively face the two lead frames. A receiving surface is included in each of the two lead frames immediately below the corresponding electrode. The receiving surface extends from a supporting portion supporting the electronic component toward the other one of the lead frames and away from the electronic component. The conductive joining member is located between the receiving surface of each of the two lead frames and the corresponding one of the electrodes.

Abstract: A main body of an electronic part has multiple electrodes, to which multiple terminals are connected. The terminals include a normal terminal and a fuse terminal, each of which extends from lands formed in a printed board so as to hold the main body at a position above and separated from a board surface of the printed board. The fuse terminal has a cut-off portion having a smaller width than other portions of the fuse terminal, so that the cut-off portion is melted down when excess current flows in the fuse terminal. The normal terminal holds the main body at the position above and separated from the board surface even in a case of melt-down of the cut-off portion.

Abstract: A main body of an electronic part is formed in a rectangular pillared shape having a first and a second axial end surface. A first electrode is formed on the first axial end surface electrically and mechanically connected to a first wiring pattern formed on a board surface of a printed board. A second electrode is formed on the second axial end surface, to which one end of a fuse terminal is electrically connected. The other end of the fuse terminal is connected to a second wiring pattern of the printed board or a wiring member which is formed as an independent member from the printed board. A cut-off portion is formed in a connecting portion of the fuse terminal.

Abstract: An interconnection technology may use molded solder to define solder balls. A mask layer may be patterned to form cavities and solder paste deposited in the cavities. Upon heating, solder balls are formed. The cavity is defined by spaced walls to keep the solder ball from bridging during a bonding process. In some embodiments, the solder bumps connected to the solder balls may have facing surfaces which are larger than the facing surfaces of the solder ball.

Abstract: A microelectronic circuit having at least one component adjacent a carrier which is not a semiconductor or sapphire.

Abstract: A first electrode at a first side of a first semiconductor die is connected to a first conductive region of a substrate. A first electrode at a first side of a second semiconductor die is connected to a second conductive region of the substrate. Each die has a second electrode at an opposing second side of the respective die. A first metal layer extends from a periphery region of the substrate to over the first die. The first metal layer has a generally rectangular cross-sectional area and connects one of the conductive regions in the periphery region of the substrate to the second electrode of the first die. A second metal layer separate from the first metal layer extends over the first and second dies. The second metal layer has a generally rectangular cross-sectional area and connects the second electrodes of the first and second dies.