Abstract: According to one embodiment, a server rack includes a server, a housing which includes a ventilation opening part, and surrounds the server, a water sensor which is provided outside the housing and senses water, a closing member which is movable between a first position in which the closing member is dislocated from the opening part and a second position in which the closing member covers the opening part, a moving mechanism which moves the closing member from the first position to the second position, an adhering mechanism which brings the closing member that has moved to the second position into close contact with the housing, and a controller which operates the moving mechanism and the adhering mechanism, when the water sensor senses water.

Abstract: An adjustable blocking arrangement for electronic hardware or computer racks, for preventing the undesired leakage of air through rack spaces not filled with hardware. An airflow control device is provided comprising a flexible web and a magazine adapted to receive the part of the flexible web that is not deployed. The device is adapted such that a length of the web may be deployed to sealingly block a space in the rack that is not filled with hardware modules, to prevent the flow of air through the space. The device may comprising a detection system adapted to detect the space in the rack that is not filled with hardware modules, and a processing system adapted to receive a signal from the detection system, and as a function of the signal to automatically deploy or retract the flexible web so as to sealingly block the space.

Abstract: There is provided an electric device configured to cool a plurality of plug-in units, the electric device including a plurality of slots, each slot configured to install a plug-in unit, a first fan configured to create a current of air for cooling the plug-in units, a first plug-in unit installed into a first slot, and a second plug-in unit including a second fan configured to create a current of air for cooling the first plug-in unit, the second plug-in unit being installed into a second slot adjacent to the first slot, arranged to a side of mounting component of the first plug-in unit.

Abstract: A server system has an air inlet side and an air outlet side. The server system includes two server rack modules arranged side by side and a controller electrically connected to the server rack modules. Each server rack module includes a cabinet having a first side close to the air inlet side, multiple server hosts detachably disposed in the cabinet and a fan component. The fan component, disposed at the first side, includes multiple fans electrically connected to the controller. The first side of one of the cabinets abuts against the second side of the other cabinet. When the fan components operate, an air flow is formed in the cabinets. The server hosts are located in the flow path of the air flow. When one of the fans is failed, the controller is adapted for increasing a rotational speed of the fan component close to the air outlet side.

Abstract: The invention provides storage enclosure, comprising an enclosure housing; one or more drawers slidably arranged within the enclosure housing, wherein each drawer has a pivotably mounted midplane having storage media coupled thereto wherein the storage media are coupled to both sides of the pivotably mounted midplane.

Abstract: A power inverter includes a metallic chassis having a containing space at an inner portion thereof, having a lid on one side in a vertical direction, the other side thereof being enclosed by a bottom, a cooling block of forming a coolant path along a bottom side in the vertical direction of the chassis, and a side portion of the inner portion of the chassis, plural semiconductor modules each incorporating a semiconductor chip for configuring an inverter circuit of converting a direct current power into an alternate current power, and provided with a direct current terminal for making a current flow to the semiconductor chip and a control terminal for controlling an operation of the semiconductor chip to be protruded to an outer portion.

Abstract: A system for cooling items of equipment likely to give off energy, comprises: an enclosure comprising a membrane that is porous to water vapor and sealed to liquid water, said membrane separating the cavity into a first portion designed to contain a fluid consisting of water and vapor, a second portion designed to contain the vapor resulting from the vaporization of the water, a temperature sensor for measuring the temperature of the liquid-vapor fluid contained in the cavity, a device to discharge the vapor from the cavity into the environment creating a vacuum in this cavity and breaking the natural liquid/vapor balance of the cavity containing the liquid, thus causing a vaporization of a portion of the liquid, a means for controlling the flow rate of the vapor discharged to outside of the cavity, said control means being regulated on the signal delivered by the temperature sensor.

Abstract: An electronic device includes a housing, a heat source located inside a casing, and a heat dissipation device disposed inside a casing. The heat dissipation device is in thermal contact with the heat source. The heat dissipation device includes a casing having a heat dissipation material. The heat dissipation material includes 15 to 30 volume percent of multiple copper materials, 50 to 85 volume percent of a phase change material, and 15 to 20 volume percent of air. The casing has a surface being in thermal contact with the heat source. A central area and an outer ring area are defined on the surface. The outer ring area surrounds the central area. A geometric midpoint of the central area and a geometric midpoint of the surface are overlapped. The heat dissipation device absorbs heat generated by the heat source located in the central area through thermal conduction.

Abstract: An electronic device includes a housing, a heat source located in the housing, and a heat dissipation device disposed in the housing. The heat dissipation device thermally contacts the heat source. The heat dissipation device includes a casing. A heat dissipation material is disposed in the casing. The heat dissipation material includes 15 to 30 percent volume of multiple copper materials, 50 to 85 percent volume of a phase change material and 15 to 20 percent volume of air. The heat dissipation device has a surface thermally contacting the heat source. A central area and an outer ring area are defined on the surface. The outer ring area surrounds the central area. A geometric midpoint of the central area overlaps that of the surface. The heat source is located in the outer ring area. The heat dissipation device absorbs heat from the heat source through thermal conduction.

Abstract: A thermosyphon heat exchanger includes a first set of first conduit elements for heat absorbing and a second set of second conduit elements for heat releasing. A first end of the first set can be connected to a first end of the second set by at least one manifold and a second end of the first set is connected to a second end of the second set by at least one other manifold. At least one first set of first conduit elements and the at least one second set of second conduit elements are at least partially arranged such that a stack is formed.

Abstract: An electronic device includes an enclosure, a circuit board arranged in the enclosure, a heat dissipation module set on the circuit board, and a fan arranged in the enclosure and aligned with the heat dissipation module. The heat dissipation module includes a base and a number of fins. A number of parallel receiving portions are formed on the base. A slot is defined in each retaining portion. Each fin includes a main plate and a pivoting portion formed at a bottom the main plate. The pivoting portions are respectively and pivotably received in the slots of the base.

Abstract: Described herein is an apparatus for dissipating or transferring heat from electronics secured in a housing unit. A housing unit includes a cover having a first fastener part and a base having a second fastener part. The base further includes a support structure for holding a printed circuit board (PCB) with mounted electronic components. A heat sink is placed within the base. The first fastener part and the second fastener part lock the cover and base together, with the heat sink and the PCB being secured between the support structure and the cover.

Abstract: An electronic apparatus 1 includes a flat cable 70, an end 70a of which is bonded to the front surface of a sub-board 30 through an anisotropic conductive film 79, engaged portions 74A and 74B formed in the flat cable 70, and an intermediate frame 40 that engages with the engaged portions 74A and 74B to restrain the movement of the engaged portions 74A and 74B in a direction away from the electrode on the sub-board 30. Consequently, it is possible to realize a reduction in costs while maintaining connection stability between a flat cable and a circuit board.

Abstract: A housing for electronic components comprising at least one hardware module and a frame. The hardware module comprises a mounting element, wherein the frame connects the at least one hardware module through the mounting element mechanically stable to the housing. A labeling element is attached to the mounting element and the housing has at least one viewing opening so that at least one part of the labeling element can be seen from the outside of the housing.

Abstract: An electronic module includes a first circuit board having a first surface, a second circuit board having a second surface, first electronic components on the first surface, second electronic components on the second surface, a first conductive fence, and a second conductive fence. The first conductive fence encloses the first electronic components and has a first opening exposing the first electronic components. The second conductive fence encloses the second electronic components and has a second opening exposing the second electronic components. The first opening of the first conductive fence joints the second opening of the second conductive fence, such that the first electronic components and the second electronic components are surrounded by the first circuit board, the second circuit board, the first conductive fence, and the second conductive fence. At least one of the first electronic components is higher than the first conductive fence.

Abstract: Affixed to a projection (111) of a glass substrate (110) included in a liquid crystal module (100) are a first ACF (150a), which has low surface tack strength but high connection reliability, and a second ACF (150b), which has high component attaching capability attributed to high surface tack strength. With these, an LSI chip (130), electronic components (150), etc., are mounted on the glass substrate (110), so that high-speed electronic component mounting can be achieved while ensuring connection reliability.

Abstract: A signal wiring of a touch panel mainly extends a bonding portion of a touch sensing unit from a signal wire on a substrate outside the substrate. The bonding portion is further attached to a signal bus so as to shrink the wiring area of the touch sensing unit and the edge frame as well. The bonding portion outside the substrate is allowed to be formed larger for improving improving the stability and yield of the connection between the touch sensing unit and the signal bus.

Abstract: According to one embodiment, an electronic apparatus includes a case, a printed circuit board contained in the case and having a through-hole, and a fixing member including a shaft portion inserted in the through-hole and a head portion located at one end of the shaft portion. The electronic apparatus also includes copper foil provided on the printed circuit board, and a cover film including an opening portion configured to expose part of the copper foil. The opening portion is located at a position which is to be covered with the head portion, and the cover film covers the copper foil at positions other than the position where the opening portion is located. The electronic apparatus further includes a conductive material provided on the copper foil inside the opening portion and configured to electrically connect the head portion and the copper foil to each other.

Abstract: According to one embodiment, an electronic apparatus includes a first housing, a second housing, a third housing between the first housing and the second housing, the third housing being rotatably connected to the first housing and the second housing, and an antenna in the third housing.

Abstract: Analyte sensor connectors that connect analyte sensors, e.g., conductive members of analyte sensors, to other devices such as sensor electronics units, e.g., sensor control units, are provided. Also provided are systems that include analyte sensors, analyte sensor connectors, and analyte sensor electronics units, as well as methods of establishing and maintaining connections between analyte sensors and analyte sensor electronics units, and methods of analyte monitoring/detection. Also provided are methods of making analyte sensor connectors and systems that include analyte sensor connectors.

Abstract: In a first conductive layer and a third conductive layer that are respectively closest to a core layer having a storage portion that penetrates therethrough, four first penetrating holes and four first penetrating holes are formed so as to overlap part of an opening edge of the storage portion that is projected onto the first conductive layer and the third conductive layer, respectively.

Abstract: A random access memory (RAM) memory module has a compact form factor and is removable from a corresponding socket assembly to allow easy replacement of the memory module or reconfiguration of the memory module during development of an electronic device that includes the memory module.

Abstract: A device and/or method mount and affix a microchannel plate in a micro system. The device and/or method has at least one conductive spring structure, formed to accept a microchannel plate, for aligning, fixing and making electrical contact with the microchannel plate. The device and/or method also has at least one stop against which the microchannel plate is pushed or pressed when affixed by at least one conductive spring structure, wherein the at least one conductive spring structure and the at least one stop are being applied on a non-conductive substrate.

Abstract: A power supply with a digital control circuit generates an output voltage by driving a piezoelectric transducer with an alternating current voltage at a digitally controlled driving frequency. To skip over a spurious frequency, the driving frequency is switched between a first range above the spurious frequency and a second range below the spurious frequency. Within the first and second ranges, the driving frequency is varied in directions that make the output voltage track a target voltage. If the driving frequency arrives at the lower limit of the first range, it jumps to a switchover frequency in the second range. The first range can be used to generate a comparatively low output voltage, and the second range to generate a comparatively high output voltage.

Abstract: The present invention proposes a switching controller of a flyback power converter. The switching controller includes a switching circuit, a sample-and-hold circuit, a voltage detection circuit, an oscillation circuit, and a comparator. The voltage detection circuit generates a holding signal when a level of an input voltage of the flyback power converter is lower than a low-threshold. The oscillation circuit limits the maximum frequency of switching signal. The maximum frequency is increased in response to a decrement of a modulation signal. The modulation signal correlated with a level of the input voltage is used to generate a control signal when the level of the input voltage is lower than an ultra-low-threshold. The control signal is enabled to operate the flyback power converter in continuous current mode operation. Therefore, an input capacitor can be eliminated and manufacturing cost is saved.

Abstract: Bypassing methods and apparatus are presented along with power cells and sub cells for multilevel inverters in which DC current flow into a DC link capacitance is interrupted and a bypass switch is closed across a power cell or sub cell output to selectively bypass a power stage of a multilevel inverter.

Abstract: The present invention provides an excitation control circuit and the electrically excited wind power system having the same. The excitation control circuit includes a plurality of full-power converters, each of which has a generator-side converter and a grid-side converter; a DC excitation module including a plurality of DC-DC converters; and a control module, controlling or switching any DC-DC converter working normally, and controlling excitation switch turning ON or turning OFF.

Abstract: The present invention provides an electric circuit wherein a multi-phase bridge is connected in series with a plurality of single-phase bridges. The multi-phase bridge is composed of a plurality of 3-level diode clamped legs, while the single-phase bridges each is composed of two 3-level diode clamped legs. The present invention also provides control strategy for synthesizing multi-level voltage waveforms from output voltages of the multi-phase bridge and the plurality of single-phase bridges.

Abstract: In a frequency converter operated for safety of personnel and/or fire protection via a ground fault interrupter is frequently not able to distinguish between an actual fault current and an operationally generated leakage current. The proposed method addresses this problem by determining a course of a magnitude of a current flowing through the frequency converter, predefining a signal portion which is independent of switching processes within the frequency converter while the frequency converter operates fault-free, checking whether the determined course satisfies a criterion that is predetermined depending on the signal portion, and interrupting the current the determined course fails to satisfy the predetermined criterion.

Abstract: Representative implementations of devices and techniques minimize switching losses in a switched capacitor dc-dc converter. The slope of the charging and/or discharging phase may be modified, smoothing the transitions from charge to discharge and/or discharge to charge of the switched capacitor.

Abstract: An arrangement transmits power between a DC power line and an AC power line carrying a voltage having a number of phases. The arrangement includes a number of transformers, one for each phase and a number of power transfer modules, one for each phase, connected in series between the DC power line and ground, where each module includes a first branch including series connected converter cells and a second branch including series connected switching elements. The primary winding of a transformer is connected to a corresponding AC phase conductor of the AC power line and the secondary winding is connected between a midpoint of the first branch and a midpoint of the second branch of a corresponding power transfer module.

Abstract: A synchronous rectifier includes a primary rectifier circuit and a secondary rectifier circuit. The primary rectifier circuit is configured to produce first and second half-rectified signals from respective first and second primary voltage outputs of a first transformer winding. The secondary rectifier circuit is configured to rectify a voltage output of a second transformer winding in response to first and second transistor gate inputs. A first buffer driver is configured to receive the first half-rectified signal and to provide a first buffered control signal to the first transistor gate input. A second buffer driver is configured to receive the second half-rectified signal and to provide a second buffered control signal to the first transistor gate input.

Abstract: A power supply control system for a power supply having a first half-bridge leg and a second half-bridge leg. In the control system, a first plurality of drive signals are configured to operate a half-bridge as a forward leg while a second plurality of drive signals are configured to operate a half-bridge as a backward leg. A switch element is intermediate the first and second plurality of drive signals and the first and the second half-bridge legs, the switch element being adapted to operate the first half-bridge as a forward leg and the second half-bridge as a backward leg in a first operating mode, the switch element being further adapted to operate the first half-bridge as a backward leg and the second half-bridge as a forward leg in a second operating mode.

Abstract: The power conversion device includes a plurality of semiconductor modules, each having a main body section including a switching element therein. In a module unit, a positive module and a negative module are disposed such that main surfaces of the respective main body sections oppose each other. A positive terminal, a first intermediate terminal, a negative terminal, and a second intermediate terminal project in a Z direction perpendicular to X direction in which the positive module and the negative module oppose each other. A first vector V1 from the positive terminal towards the first intermediate terminal and a second vector V2 from the second intermediate terminal towards the negative terminal are configured such that these vector components V12 and V22 in a Y direction perpendicular to both the X and Z directions are opposite to each other.

Abstract: An architecture for current-modulating power-handling circuits, such as power converters, where a small saturating inductance is used to obtain a pulse edge when the main current value crosses zero.

Abstract: A method for data storage includes defining a first programming scheme that programs a group of analog memory cells while reducing interference caused by at least one memory cell that neighbors the group, and a second programming scheme that programs the group of the analog memory cells and does not reduce all of the interference reduced by the first programming scheme. One of the first and second programming schemes is selected based on a criterion defined with respect to the analog memory cells. Data is stored in the group of the analog memory cells using the selected programming scheme.

Abstract: A digital design and technique may be used to implement a Manhattan Nearest Neighbor content addressable memory function by augmenting a serial content addressable memory design with additional memory and counters for bit serially accumulating in parallel and subsequently comparing in parallel all the Manhattan distances between a serially inputted vector and all corresponding vectors resident in the CAM. Other distance measures, besides a Manhattan distance, may optionally be used in conjunction with similar techniques and designs.

Abstract: A content addressable memory (CAM) system includes one or more CAM cells, each including a bit cell to store a bit and a complementary bit, and a compare circuit to compare a reference input to the stored bit and to the stored complementary bit. The compare circuit may be implemented to compare a single-ended reference input to each of the stored bit and the complementary bit. The compare circuit may include a pass circuit to selectively provide the reference input to an output under control of the stored bit and the stored complementary bit, a pull-up circuit to selectively pull-up the output under control of the reference input and the stored complementary bit, and a pull-down circuit to selectively pull-down the output under control of the reference input and the stored bit. The reference input may be provided to multiple CAM cells, which may share compare circuitry.

Abstract: A system, method and computer program product for operating a three-dimensional memory array. An example array includes access transistors with first, second and gate terminals. Bit lines are coupled to the first terminals, word lines coupled to the gate terminals, and vertical lines are coupled to the second terminals. The bit, word, and vertical lines are perpendicular to one another. Memory cells are positioned along the vertical lines, including a bidirectional access device coupled in series with a memory element. The memory element is programmable to first and second states by application of first and second write voltages, opposite in polarity to one another. The array includes conductive plates parallel to the word and bit lines, and perpendicular to the vertical lines. The conductive plates are coupled to memory cells of the same height and separated by insulating layers.

Abstract: Integrated electronic memory devices include control logic and one or more cross point information storage arrays. The cross point storage array(s) include a non-linear conductor proximate to at least one cross point storage location, and the control logic comprises (i) an NMOS type transistor and a PNP type transistor, but not a PMOS type transistor, or (ii) a PMOS type transistor and an NPN type transistor, but not an NMOS type transistor.

Abstract: An e-fuse array circuit includes a program gate line and a word line gate line that are stretched in parallel to each other, and a metal line formed over the program gate line and the word line gate line to cover the program gate line and the word line gate line, the metal line connected to the program gate line through a plurality of contact plugs disposed at a given distance.

Abstract: Methods and apparatus are provided for an integrated circuit with a programmable electrical connection. The apparatus includes an inactive area with a memory line passing over the inactive area. The memory line includes a programmable layer. An interlayer dielectric is positioned over the memory line and the inactive area, and an extending member extends through the interlayer dielectric. The extending member is electrically connected to the programmable layer of the memory line at a point above the inactive area.

Abstract: Programmable resistive memory using at least one diodes as program selectors can be data protected by programming protection bits in a non-volatile protection bit register. The data stored in the protection bit register can be used to enable or disable reading or writing in part or the whole programmable resistive memory. The data stored in the protection bit register can also be used to enable or enable scrambling the addresses to allow accessing the programmable resistive memory array. Similarly, the data stored in the protection bit register can be used to scramble data when writing into and descramble data when reading from the programmable resistive memory. Keys can be provided for address or data scrambling. The non-volatile protection bit register can be built with the kind of cells as the main array and/or integrated with the main array in the programmable resistive memory.

Abstract: A device for one-time-programmable (OTP) memory may include a capacitor formed by a conductive layer, an oxide layer, and a semiconductor well, and a diode that is formed after programing the device. The device may be programmable by applying a voltage between the conductive layer and the semiconductor well. The applied voltage may be capable of rupturing the oxide layer at one or more points. The conductive layer, the oxide layer, and the semiconductor well may be native CMOS process formations.

Abstract: An electromechanical memory element includes a fixed body and a deformable element attached to the fixed body. An actuator causes a deformation of the deformable element from a first position (associated with a first logic state) to a second position (associated with a second logic state) where a mobile element makes contact with a fixed element. A programming circuit then causes a weld to be formed between the mobile element and the fixed element. The memory element is thus capable of associating the first and second positions with two different logic states. The weld may be selectively dissolved to return the deformable element back to the first position.

Abstract: The present disclosure concerns a MRAM cell comprising a first tunnel barrier layer comprised between a soft ferromagnetic layer having a free magnetization and a first hard ferromagnetic layer having a first storage magnetization; a second tunnel barrier layer comprised between the soft ferromagnetic layer and a second hard ferromagnetic layer having a second storage magnetization; the first storage magnetization being freely orientable at a first high predetermined temperature threshold and the second storage magnetization being freely orientable at a second predetermined high temperature threshold; the first high predetermined temperature threshold being higher than the second predetermined high temperature threshold. The MRAM cell can be used as a ternary content addressable memory (TCAM) and store up to three distinct state levels. The MRAM cell has a reduced size and can be made at low cost.

Abstract: Structures and methods for recovering data in a semiconductor memory device are disclosed herein. In one embodiment, a method of recovering data in a semiconductor memory device, can include: (i) pre-conditioning a first memory cell on the semiconductor memory device by using a formation voltage to program a first data state in the first memory cell; (ii) storing a second data state in a second memory cell on the semiconductor memory device by maintaining the second memory cell in a virgin state; (iii) mounting the semiconductor memory device on a printed-circuit board (PCB) by using a high temperature process that increases a resistance of the first memory cell; and (iv) performing a recovery of the first data state by reducing the resistance of the first memory cell.

Abstract: A control circuit controls a voltage applied to a memory cell array. A first electrode contacts to a first surface of a variable resistance element, while a second electrode contacts to a second surface of the variable resistance element. The first electrode is configured by a metal, and the second electrode is configured by a P type semiconductor. The control unit, when performing a setting operation of a memory cell, applies a voltage such that a current flows in a direction from the first electrode toward the second electrode.

Abstract: FORMING reversible resistivity-switching elements is described herein. The FORMING voltage may be halted if the current through the memory cell reaches some reference current. The reference current may depend on how many groups of memory cells have been FORMED. This can help to increase the accuracy of determining when to halt the FORMING voltage. After the FORMING voltage is applied, a RESET voltage may be applied to those memory cells that have a resistance that is lower than a reference resistance to raise the resistance of those memory cells. By raising the resistance, the leakage current of these memory cells when other groups are programmed may be less. This, in turn, helps to prevent FORMING of the other groups from slowing down. A reason why this helps to prevent the slowdown is that the FORMING voltage may be kept near a desired level.

Abstract: A word line driver circuit allows for dynamic selection of different word line voltages for selection and deselection of memory cells included in a resistive memory array in a manner that reduces circuit complexity, device count, and leakage currents.