Abstract: A movie editor converts a received movie into a proxy format, and creates a texture strip representing the frames of the movie. An editor can use the texture strip to edit the movie, rather than editing the movie directly. Deep tags and/or special effects can be defined for the texture strip using a graphical interface. The graphical interface enables movies to be combined into a playback product according to a control structure graphically presented in the graphical interface.

Abstract: Embodiments of the present disclosure may provide methods and systems enabled to receive a plurality of streams comprising at least one video stream and at least one telemetry data stream associated with the at least one video stream; and create metadata corresponding to the at least one video stream and the at least one telemetry data stream, wherein creating the metadata comprises: processing at least one frame of the at least one video stream to detect at least one artifact within the frame, processing the at least one telemetry data stream to determine telemetry data associated with the at least one frame of the at least one video stream, and annotating the at least one artifact and the telemetry data associated with the at least one frame.

Abstract: A storage method according to one aspect includes: a reception step of receiving a coded stream including a plurality of files that are of a data unit in a predetermined file format; a storage step of storing the received plurality of files of the coded stream in a memory; and a generation step of generating first control information used to play back the stored plurality of files, the first control information correlating the plurality of files. Therefore, the method for storing data in which one coded stream is divided into a plurality of files is provided.

Abstract: The invention concerns a memory cell having: first and second cross-coupled gated inverters (102, 104), each including first and second inputs (IN1, IN2) and an output (OUT) and being adapted to couple its output to a first logic level only when the first and second inputs both receive the inverse of the first logic level; a first cut-off circuit (106) coupling the second input (IN2) of the first gated inverter (102) to the first input (IN1) of the first gated inverter (102); and a second cut-off circuit (108) coupling the second input (IN2) of the second gated inverter (104) to the first input (IN1) of the second gated inverter (104).

Abstract: An integrated circuit includes circuitry performing memory operations. The power from only one of a first power lead and a second power lead is sufficient for the circuitry to operate. A package encasing the integrated circuit. Leads on the package electrically couple power and data from an exterior of the package to the integrated circuit encased by the package, including the first power lead, the second power lead, and a ground lead. An isolation circuit electrically couples the circuitry to the first power lead but not the second lead at a first time, and electrically couples the circuitry to the second power lead but not the first power lead at a second time.

Abstract: A memory device with word-line voltage boosting includes a set of first switches that are operable to couple a word-line of the memory device to a supply voltage to pull the word-line up to a rail voltage. A dummy line including a conductive route can be disposed in a vicinity of the word-line to form a parasitic coupling capacitance with the word-line. A second switch is operable to couple the dummy line to the supply voltage to pull the dummy line to the rail voltage. Pulling up the dummy line boosts the word-line voltage above the rail voltage by a boost voltage.

Abstract: A strobe signal interval detection circuit may include an oscillator configured to generate a periodic signal at a preset cycle determined through a delay time of a delay circuit. The delay time of the delay circuit may be configured by modeling a path traveled by a strobe signal being transmitted to a data latch. The strobe signal interval detection circuit may include a counter configured to count the periodic signal and generate strobe interval information.

Abstract: A bi-synchronous electronic device may include a FIFO memory circuit configured to store data, and a first digital circuit coupled to the FIFO memory circuit and configured to operate based upon a first clock signal and a write pointer, write a data burst to the FIFO memory circuit, thereby causing a jump in the write pointer to a new position, and write a burst indicator associated with the new position in the FIFO memory circuit. The bi-synchronous electronic device may include a second digital circuit coupled to the FIFO memory circuit and configured to operate based upon a second clock signal different from the first clock signal, read from the FIFO memory circuit based upon a read pointer, and synchronize the read pointer to the write pointer based upon the burst indicator.

Abstract: A bi-synchronous electronic device may include a FIFO memory circuit, and a first digital circuit coupled to the FIFO memory circuit and configured to operate based upon a first clock signal, and write to the FIFO memory circuit based upon a write pointer. The bi-synchronous electronic device may include second digital circuit coupled to the FIFO memory circuit and configured to operate based upon a second clock signal different from the first clock signal, and read from the FIFO memory circuit based upon a read pointer. The FIFO memory circuit may be configured to detect a jump in the write pointer to a new position, determine jump candidates for the read pointer from a current position, select a jump candidate, and synchronize the read pointer based upon the selected jump candidate.

Abstract: A memory includes a column decoder performing at least two levels of decoding using a first level decoder that decodes between the column bit lines and first level decode lines and a second level decoder that decodes between the first level decode lines and second level decode lines. The second level decoder includes first transistors coupled between the first level decode lines and read output lines and second transistors coupled between the first level decode lines and write input lines. The first transistors have a first voltage rating and are driven by decode control signals referenced to a low supply voltage compatible with the first voltage rating. The second transistors have a second voltage rating, higher than the first voltage rating, and are driven by decode control signals referenced to a high supply voltage (in excess of the low supply voltage) compatible with the second voltage rating.

Abstract: Methods for reducing pin capacitance and improving off-chip driver performance by using TSVs to enable usage of off-chip drivers located within selected and unselected die of a plurality of stacked die are described. A reduction in pin capacitance allows for faster switching times and/or lower power operation. In some embodiments, a TSV may connect an internal node (e.g., the output of a pre-driver) within a selected die of a plurality of stacked die with the input of an off-chip driver within an unselected die of the plurality of stacked die. In some cases, only a single die within a die stack may be selected (or enabled) at a given time. Using a TSV to connect internal nodes associated with off-chip drivers located within both selected and unselected die of the die stack allows for reduced off-chip driver sizing and thus reduced pin capacitance.

Abstract: Voltage controlled magnetic tunnel junctions and memory devices are described which provide efficient high speed switching of non-volatile magnetic devices at high cell densities. Implementations are described which provide a wide range of voltage control alternatives with in-plane and perpendicular magnetization, bidirectionally switched magnetization, and control of domain wall dynamics.

Abstract: A magnetic-assist, spin-torque transfer magnetic tunnel junction device and a method for performing a magnetic-assist, spin-torque-transfer write to the device are disclosed. In an exemplary embodiment, the magnetic tunnel junction device includes a first electrode, a pinned layer disposed on the first electrode, a free layer disposed on the pinned layer, and a barrier layer disposed between the pinned layer and the free layer. The device further includes a second electrode electrically coupled to the free layer, the second electrode containing a magnetic assist region. In some embodiments, the magnetic assist region is configured to produce a net magnetic field when supplied with a write current. The net magnetic field is aligned to assist a spin-torque transfer of the write current on the free layer.

Abstract: In some examples, a memory device may be configured to utilize differential bit cells formed from two or more tunnel junctions. In some cases, the tunnel junctions forming the differential bit cell may be arranged to utilize shared read circuitry to reduce device mismatch. For instance, the read operations associated with both tunnel junction may be time multiplexed such that the same preamplifier circuitry may sense voltages representative of the tunnel junctions.

Abstract: In some examples, a memory device may be configured to read or write multiple bit cells as part of the same operation. In some cases, the tunnel junctions forming the bit cells may be arranged to utilize shared read/write circuitry. For instance, the tunnel junctions may be arranged such that both tunnel junctions may be written using the same write voltages. In some cases, the bit cells may be configured such that each bit cell is driven to the same state, while in other cases, select bit cells may be driven high, while others are driven low.

Abstract: A spin-torque magnetoresistive memory includes array read circuits and array write circuits coupled to an array of magnetic bits. The array read circuits sample magnetic bits in the array, apply a write current pulse to the magnetic bits to set them to a first logic state, resample the magnetic bits, and comparing the results of sampling and resampling to determine the bit state for each magnetic bit. For each of the magnetic bits in the page having the second logic state, the array write circuits initiate a write-back, wherein the write-back includes applying a second write current pulse having opposite polarity in comparison with the first write current pulse to set the magnetic bit to the second state. A read or write operation may be received after initiation of the write-back where the write-back can be aborted for a portion of the bits in the case of a write operation.

Abstract: Circuitry and a method provide a plurality of timed control and bias voltages to sense amplifiers and write drivers of a spin-torque magnetoresistive random access memory array for improved power supply noise rejection, increased sensing speed with immunity for bank-to-bank noise coupling, and reduced leakage from off word line select devices in an active column.

Abstract: Disclosed herein is a device that includes a memory cell array including plurality of word lines, a plurality of bit lines each intersecting the word lines and a plurality of memory cells each disposed at an associated one of intersections of the word and bit lines, and the device further includes a driver configured to drive a selected one of the word lines from an inactive level to an active and to drive the selected one of the word lines from the active level to an intermediate level at a first rate and from the intermediated level to the inactive level at a second rate. The intermediate level is between the active and inactive levels, and the first rate is greater than the second rate.

Abstract: A self-refresh device, adopted in a memory array including a plurality of memory cells, includes a first word-line selecting module, which is enabled according to a first main-word-line signal, and a self-refresh controller. The first word-line selecting module includes a first selecting device, which selects a first word line according to a first word-line driving signal, and a second selecting device, which selects a second word line according to a second word-line driving signal. The self-refresh controller generates the first word-line driving signal, the second word-line driving signal, and the first main word-line signal to select one of the memory cells corresponding to the selected one of the first word line and the second word line for self-refreshing. When the first word line switches to the second word line, the self-refresh controller maintains the first main word-line signal at the same logic level.

Abstract: A memory circuit is provided. The memory circuit includes a memory array, a plurality of word lines and a memory controller. The memory array has a plurality of memory blocks. The memory controller outputs an access instruction and an access address to address the word lines for accessing the memory array, or the memory controller outputs a refresh instruction and a refresh address to address the word lines for refreshing the memory array, wherein the memory controller performs a refresh operation on each of the memory blocks corresponding to each of the word lines at predetermined intervals. The memory controller counts the number of times the access instructions have been output and determines whether that number equals a predetermined value or not. According to the determination result, the memory controller selects an address adjacent to the access address as the refresh address for the next refresh operation.

Abstract: Provided are a method and apparatus for a memory module to accept a command in multiple parts. A first half of a command is placed on a bus for a memory module in a first clock cycle. A chip select signal is placed on the bus for the memory module for the first half of the command. A second half of the command is placed on the bus in a second clock cycle following the first clock cycle, wherein the memory module accepts the second half of the command a delay interval from accepting the first half of the command.

Abstract: In one memory array embodiment, in order to compensate for bit-line leakage currents by OFF-state bit-cell access devices, a leakage-current reference circuit tracks access-device leakage current over different process, voltage, and temperature (PVT) conditions to generate a leakage-current reference voltage that drives a different leakage-current abatement device connected to each different bit-line to inject currents into the bit-lines to compensate for the corresponding leakage currents. In one implementation, the leakage-current reference circuit has a device that mimics the leakage of each access device configured in a current mirror that drives the resulting leakage-current reference voltage to the different leakage-current abatement devices.

Abstract: Volatile memory is described, comprising: (i) a first inverter comprising a first p-type field effect transistor (FET) connected to a first n-type FET; (ii) a second inverter comprising a second p-type FET connected to a second n-type FET; (iii) a third p-type FET; (iv) a fourth p-type FET; and (v) a floating line connecting (i) a source of the third p-type FET, and (ii) a source of the fourth p-type FET, wherein: (a) the first data line is connected to: a gate of the second p-type FET, a gate of the second n-type FET, a drain of the third p-type FET, and a gate of the fourth p-type FET, and (b) the second data line is connected to: a gate of the first p-type FET, a gate of the first n-type FET, a drain of the fourth p-type FET, and a gate of the third p-type FET.

Abstract: This invention provides a 2-level BL-hierarchical NAND memory architecture and associated concurrent operations applicable to both 2D and 3D HiNAND2 memory arrays. New Latch designs in Block-decoder and Segment-decoder with one common dedicated metal0 power line per one 2N-bit dynamic page buffer (DPB) formed in corresponding 2N broken-LBL metal1 line capacitors for Program and per one 2N-bit Segment DPB formed in corresponding 2N local LBL metal1 line capacitors for Read are provided for performing concurrent and pipeline operations of multiple-WL Program, Read, Erase-Verify, and Program-Verify in dispersed Blocks in a same or multiple different NAND planes with much enhanced array flexibility and multiple-fold performance improvements.

Abstract: Apparatuses and methods for threshold voltage (Vt) distribution determination are described. A number of apparatuses can include sense circuitry configured to determine a first current on a source line of an array of memory cells, the first current corresponding to a first quantity of memory cells of a group of memory cells that conducts in response to a first sensing voltage applied to an access line and determine a second current on the source line, the second current corresponding to a second quantity of memory cells of the group that conducts in response to a second sensing voltage applied to the access line. The number of apparatuses can include a controller configured to determine at least a portion of a Vt distribution corresponding to the group of memory cells based, at least in part, on the first current and the second current.

Abstract: A method for operating a memory device includes sensing a change in temperature of the memory device, adjusting a level of a reference current for a read operation, and reading data from memory cells of the memory device based on the adjusted level of the reference current. The level of the reference current is adjusted from a reference value to a first value when the temperature of the memory device increases and is adjusted from the reference value to a second value when the temperature of the memory device decreases. A difference between the reference value and the first value is different from a difference the reference value and the second value.

Abstract: An Sb—Te—Ti phase-change thin-film material applicable to a phase-change memory and preparation thereof. The Sb—Te—Ti phase-change memory material is formed by doping an Sb—Te phase-change material with Ti, Ti forms bonds with both Sb and Te, and the Sb—Te—Ti phase-change memory material has a chemical formula SbxTeyTi100-x-y, where 0<x<80 and 0<y<100?x. When the Sb—Te—Ti phase-change memory material is a Ti—Sb2Te3 phase-change memory material, Ti atoms replace Sb atoms, and phase separation does not occur. The crystallization temperature of the Sb—Te—Ti phase-change memory material is significantly risen, retention is improved, and thermal stability is enhanced; meanwhile, the amorphous state resistance decreases, and the crystalline state resistance increases; and the Sb—Te—Ti phase-change memory material has wide application in phase-change memories.

Abstract: A resistance change memory has a resistance change device and a control circuit for controlling application of voltage to the resistance change device. The resistance change device has a first electrode, a second electrode, and a resistance change layer interposed between the first electrode and the second electrode. A material for the second electrode includes one of members selected from the group consisting of W, Ti, Ta, and nitrides thereof. During forming of the resistance change device, the control circuit performs a second forming treatment succeeding to a first forming treatment. The first forming treatment includes application of voltage such that the potential of the first electrode is higher than the potential of the second electrode. The second forming treatment includes application of voltage such that the potential of the second electrode is higher than the potential of the first electrode.

Abstract: A method for operating a memory device includes sensing a temperature of the resistive memory device, setting a level of a set voltage or current for writing to a memory cell based on the temperature, setting a level of a reset voltage for reset writing to the memory cell based on the temperature, and performing a write operation on the memory cell based on the level of the set voltage or current and the level of the reset voltage. The memory device may be a resistive memory device.

Abstract: A memory apparatus includes a content addressable memory, CAM, cell block including CAM cells and a random access memory (RAM), cell block including RAM cells. A geometric footprint of each of the CAM cells has a side bigger than a side of a geometric footprint of each of the RAM cells, where the sides of the CAM cells and the RAM cells are parallel to each other. The apparatus is configured to translate an input keyword at an input of the CAM cell block to an output word at an output of the RAM cell block when the keyword at the input of the CAM cell block is stored in the CAM cell block. The CAM cell block is split into a first part and a second part of the CAM cells.

Abstract: An array organization and architecture for a content addressable memory (CAM) system. More specifically, a circuit is provided for that includes a first portion of the CAM configured to perform a first inequality operation implemented between 1 to n CAM entries. The circuit further includes a second portion of the CAM configured to perform a second inequality operation implemented between the 1 to n CAM entries. The first portion and the second portion are triangularly arranged side by side such that the first inequality operation and the second inequality operation are implemented between the 1 to n CAM entries using the same n wordlines.

Abstract: A memory cell array includes local blocks disposed in parallel with rows and arrayed along a direction parallel with columns, first selection lines being parallel with the rows and including a couple of first selection lines connected to each of the local blocks, second selection lines disposed in parallel with the columns, and local block selectors disposed between the plurality of local blocks. Each of the local block selectors is disposed between a Qth wherein, “Q” is an odd number local block and a (Q+1)th local block among the local blocks to electrically connect unit cells disposed in any one of the Qt local block and the (Q+1)th local block to the second selection lines. The unit cells in the local blocks are disposed at cross points of the first selection lines and the second selection lines, respectively. Each of the unit cells includes a P-channel MOSFET.

Abstract: A page buffer for a NAND flash memory array includes a pre-charge switch, a first switch, a read switch, a write switch, a latch, and a data switch. The pre-charge switch is coupled between a supply node with a supply voltage and a bit line that is coupled to a selected cell of the NAND flash memory array. The first switch is coupled between the bit line and a data node. The read switch is coupled between the data node and an I/O node. The write switch is coupled between an inverse data node, which is out of phase with the data node, and the I/O node. The latch is coupled between the data node and the inverse data node. The data switch is coupled between the inverse data node and a first node. The enable switch is coupled between the first node and a ground.

Abstract: Systems, apparatuses, and methods may be provided that adapt to trim set advancement. Trim set advancement may be a change in trim sets over time. A cell of a semiconductor memory may have a first charge level and be programmed with a first trim set. The cell may be reprogrammed by raising the first charge level to a second charge level that corresponds to the cell programmed with a second trim set.

Abstract: Techniques are provided for programming the memory cells of a drain-side edge word line of a set of word lines before programming memory cells of any other word line of the set. Pass voltages applied to the other word lines act as stress pulses which redistribute holes in the charge-trapping material of the memory cells of the other word lines to reduce short-term charge loss and downshifting of the threshold voltage. Additionally, one or more initial program voltages used for the drain-side edge word line are relatively low and also act as stress pulses. The memory cells of the drain-side edge word line are programmed to a narrower Vth window than the memory cells of the other word lines. This compensates for a higher level of program disturb of erased state memory cells of the drain-side edge word line due to reduced channel boosting.

Abstract: A non-volatile memory and method have programming circuitry that outputs a series of programming pulses of increasing voltage level to program in parallel a group of memory cells associated with a selected word line. Individual timing of the programming pulses such as rise and fall times of the pulse is optimally and dynamically adjusted according to the relative numbers of program-enabled and program-inhibited memory cells in the group associated with that pulse.

Abstract: A semiconductor memory and a method of programming the same are provided. A semiconductor memory device may include a memory cell array including a plurality of normal memory cells, a select transistor, and a dummy memory cell. The semiconductor memory device may include a voltage generator configured for generating a program voltage applied to a normal memory cell selected among the plurality of normal memory cells, and for generating a dummy word line voltage applied to the dummy memory cell in a program operation. The semiconductor memory device may include a control logic configured for controlling the voltage generator to adjust the dummy word line voltage based on the program voltage.

Abstract: A flash memory controller is configured to provide a first erase mode for erasing one or more groups of flash memory cells in a flash memory device using a plurality of erase pulses and a second erase mode for erasing the one or more groups of flash memory cells using a single erase pulse. The controller may receive a fast erase signal to erase the one or more groups of flash memory cells and, in response to the signal, switch operating parameters of the flash memory device from first parameters corresponding to the first erase mode to second parameters corresponding to the second erase mode, and instruct the flash memory device to perform an erase operation on the one or more groups of flash memory cells according to the second parameters. The controller may then verify that the erase operation was completed using the single erase pulse.

Abstract: A data writing method, a memory storage device, and a memory control circuit unit are provided. The method includes: writing data into at least one first logical unit and at least one second logical unit, and the data includes first data and second data; storing first data into at least one first physical erasing unit and filling the first physical erasing unit with the first data; storing second data into at least one second physical erasing unit; determining whether a remaining space of each second physical erasing unit is less than a threshold; if the remaining space of one of the at least one second physical erasing unit is less than the threshold, selecting at least one fourth physical erasing unit from a spare area and writing the second data into the at least one second physical erasing unit and the at least one fourth physical erasing unit.

Abstract: A semiconductor device includes memory strings each including a drain select transistor, memory cells and a source select transistor, which are connected between a bit line and a common source line and suitable for operating based on voltages applied to a drain select line, word lines and a source select line, respectively, and an operation circuit suitable for performing a pre-program operation, an erase operation and a post-program operation on the memory strings. The operation circuit sequentially performs erase operations on the drain select transistors included in the memory strings.

Abstract: A non-volatile semiconductor memory apparatus and a data erasing method thereof are provided to suppress deterioration in reliability due to data rewriting. An erasing method of a flash memory is provided, which includes the following steps. A control gate is maintained at 0V, a high-voltage erase pulse is applied to a P well, such that electrons is emitted from a floating gate to the P well. Then, the control gate is again maintained, and a weak erase pulse with a voltage lower than the erase pulse is applied to the P well.

Abstract: A data storage device may include a memory die. The memory die includes a memory and a latch. A method may include receiving a command corresponding to a write operation to write information to the memory. The method may further include loading a set of bits into the latch prior to receiving the information at the memory die. The set of bits includes at least a first bit having a first value and a second bit having a second value that is different than the first value. The method further includes receiving the information at the memory die and overwriting at least a portion of the set of bits at the latch with the information.

Abstract: Disclosed herein are techniques for pre-charging channels when programming memory cells. A pre-charge voltage is applied to both selected bit lines and inhibited bit lines during a channel pre-charge phase. The pre-charge voltage is passed to the channels of NAND strings. The voltage on the inhibited bit lines is then reduced to a program inhibit voltage. Also, the voltage on the selected bit lines is reduced to a program enable voltage. Further, the pre-charge voltage from the channels of the selected NAND strings is discharged while maintaining the pre-charge voltage in the channels of the inhibited NAND strings. The potential in the channels of the inhibited NAND strings may then be boosted and a programming voltage may be applied to a selected word line.

Abstract: A non-volatile memory device that a semiconductor substrate of a first conductivity type. An array of non-volatile memory cells is in the semiconductor substrate arranged in a plurality of rows and columns. Each memory cell comprises a first region on a surface of the semiconductor substrate of a second conductivity type, and a second region on the surface of the semiconductor substrate of the second conductivity type. A channel region is between the first region and the second region. A word line overlies a first portion of the channel region and is insulated therefrom, and adjacent to the first region and having little or no overlap with the first region. A floating gate overlies a second portion of the channel region, is adjacent to the first portion, and is insulated therefrom and is adjacent to the second region. A coupling gate overlies the floating gate. A bit line is connected to the first region. A negative charge pump circuit generates a first negative voltage.

Abstract: According to example embodiments of inventive concepts, a nonvolatile memory device includes at least two strings that are vertically stacked on a substrate and share one bit line. A program method of the nonvolatile memory device includes setting a pre-charge condition on the basis of a disturb environment between the at least two cell strings, pre-charging or not pre-charging an unselected cell string among the at least two cell strings in response to the pre-charge condition and programming memory cells in a selected cell string among the at least two cell strings.

Abstract: A sense circuit is coupled to a bit line of a memory array. Control circuitry coupled to the sense circuit controls a program operation for a memory cell. After a program phase in which the memory cell in the memory array is programmed, in a program verify phase the control circuitry causes the sense circuit to sense data stored on the memory cell multiple times during the program verify phase. The multiple times include a first time sensing data from the memory cell and a second time sensing data from the memory cell.

Abstract: Disclosed herein are techniques for sensing multiple reference levels in non-volatile storage elements without changing the voltage on the selected word line. One aspect includes determining a first condition of a selected non-volatile storage element with respect to a first reference level based on whether a sensing transistor conducts in response to a sense voltage on a sense node. Then, a voltage on the source terminal of the sensing transistor is modified after determining the first condition with respect to the first reference level. A second condition of the selected non-volatile storage element is then determined with respect to a second reference level based on whether the sensing transistor conducts in response to the sense voltage on the sense node. This allows two different reference levels to be efficiently sensed. Dynamic power is saved due low capacitance of the sensing transistor relative to the sense node.

Abstract: Techniques that allow dynamic management of throughput in a memory device based on a power supply voltage are provided. In an example embodiment, a method of operating a memory device comprises monitoring on the power supply level applied to the device and determining a corresponding number of bitlines that the device can activate at the same time, generating a control signal based on the number of bitlines, and using the control signal to activate a portion of the memory device corresponding to the determined number of bitlines.

Abstract: A memory device includes core memory such as flash memory for storing data. The memory device includes a first power input to receive a first voltage used to power the flash memory. Additionally, the memory device includes a second power input to receive a second voltage. The memory device includes power management circuitry configured to receive the second voltage and derive one or more internal voltages. The power management circuitry supplies or conveys the internal voltages to the flash memory. The different internal voltages generated by the power management circuitry (e.g., voltage converter circuit) and supplied to the core memory enable operations such as read/program/erase with respect to cells in the core memory.

Abstract: A non-volatile memory has an ADC that digitizes an analog voltage in a range delimited by V1 and V2 into N intervals, resulting in a digital Vx with x between 1 to N. A ramp voltage Vramp(x) calibrated to rise linearly from V1 to V2 in x=1 to N clock cycles is used to scan the analog voltage. Vx is then given by Vx=Vramp(x). The ramp voltage is provided by a constant current charging a capacitor and has a slope proportional to a DAC resistor, R(x) that is programmable from 1 to N. In a calibration mode, the R(x) is set to N, which results in K clock cycles spanning V1 to V2. In a subsequent normal mode, the DAC resistor is reset to R(K) to result in a calibrated ramp voltage that would rise from V1 to V2 in N clock cycles.