Abstract: A method and apparatus for memory power and/or area reduction. An array of memory cells may be scanned to detect faulty memory cells, if any, in the array. A supply voltage Vmem applied to the array of memory cells may be controlled based on a result of the scan, and based on a sensitivity coefficient of one, or more, of the array of memory cells. The sensitivity coefficient may indicate an impact that the one, or more, of the array of memory cells being faulty may have on the performance of a device that reads and writes data to the memory array. Additionally or alternatively, the physical dimensions of the memory cells may be determined based on the sensitivity coefficient(s) and/or based on a number of faulty memory cells that can be tolerated in the array of memory cells.

Abstract: A memory module with power management system, and a method of operation of a memory module with power management system thereof, including: a base power plane; a power management circuit electrically connected to the base power plane; a managed power plane electrically connected to the base power plane only through the power management circuit; and a memory array electrically connected to the managed power plane.

Abstract: Providing for a non-volatile memory architecture having write and overwrite capabilities providing low write amplification to a storage system is described herein. By way of example, a memory array is disclosed comprising blocks and sub-blocks of two-terminal memory cells. The two-terminal memory cells can be directly overwritten in some embodiments, facilitating a write amplification value as low as one. Furthermore, the memory array can have an input-output multiplexer configuration, reducing sneak path currents of the memory architecture during memory operations.

Abstract: Integrated circuits with multiport memory elements may be provided. A multiport memory element may include a latching circuit, a first set of address transistors, and a second set of address transistors. The latching circuit may include cross-coupled inverters, each of which includes a pull-up transistor and a pull-down transistor. The first set of address transistors may couple the latching circuit to a write port, whereas the second set of address transistors may couple the latching circuit to a read port. The pull-down transistors and the second set of address transistors may have body bias terminals that are controlled by a control signal. During data loading operations, the control signal may be temporarily elevated to weaken the pull-down transistors and the second set of address transistors to improve the write margin of the multiport memory element.

Abstract: Memory devices, memory device operational methods, and memory device implementation methods are described. According to one arrangement, a memory device includes memory circuitry configured to store data in a plurality of different data states, temperature sensor circuitry configured to sense a temperature of the memory device and to generate an initial temperature output which is indicative of the temperature of the memory device, and conversion circuitry coupled with the temperature sensor circuitry and configured to convert the initial temperature output into a converted temperature output which is indicative of the temperature of the memory device at a selected one of a plurality of possible different temperature resolutions, and wherein the converted temperature output is utilized by the memory circuitry to implement at least one operation with respect to storage of the data.

Abstract: A shiftable memory supporting atomic operation employs built-in shifting capability to shift a contiguous subset of data from a first location to a second location within memory during an atomic operation. The shiftable memory includes the memory to store data. The memory has the built-in shifting capability. The shiftable memory further includes an atomic primitive defined on the memory to operate on the contiguous subset.

Abstract: A semiconductor apparatus including a register input selection block configured to serially receive input data and output the input data in parallel as first and second data sets, or receive register selection output signals and output the register selection output signals as the first and second data sets, in response to a shift control signal and a capture control signal; a first data register configured to receive and store the first data set and output stored data as first register output signals; a second data register configured to receive and store the first and second data sets and output stored data as second register output signals; a register output selection block configured to output ones of the first and second register output signals as the register selection output signals; and a data output selection block configured to serially output one of the first and second data sets as output data.

Abstract: A static random-access memory (SRAM) in an integrated circuit with circuitry for timing the enabling of sense amplifiers. The memory includes read/write SRAM cells, along with word-line tracking transistors arranged in one or more rows along a side of the read/write cells, and read-tracking transistors arranged in a column along a side of the read/write cells. A reference word line extends over the word-line tracking transistors, with its far end from the driver connected to pass transistors in the read-tracking transistors. The read-tracking transistors are preset to a known data state that, when accessed responsive to the reference word line, discharges a reference bit line, which in turn drives a sense amplifier enable signal.

Abstract: In response to a write operation to a memory cell that causes a data line of the memory cell to have a first voltage direction, causing the data line to have a second voltage direction opposite the first voltage direction.

Abstract: The present disclosure herein relates to a sense amplifier and a semiconductor memory device employing the same. The sense amplifier includes an inverter including a pull-up transistor and a pull-down transistor, and a switching unit configured to change a connection relationship between the pull-up transistor and the pull-down transistor according to whether an input terminal of the inverter is precharged or a signal applied to the input terminal is sensed.

Abstract: The disclosed technology provides for multi-dimensional data randomization in a memory cell array using circular shifts of an initial scrambling sequence. Data addressed to a first row of a data array is randomized using the initial scrambling sequence and data addressed to each row of the memory cell array is randomized using a scrambling sequence that is equal to a circular shift of the initial sequence.

Abstract: A method includes clearing configuration bits of a plurality of latches of an integrated circuit. The method also includes implementing an initialization routing pattern of the plurality of latches by configuring the configuration bits of the plurality of latches. The method further includes storing initialization data in a set of the plurality of latches based on the initialization routing pattern. The method includes clearing the configurations bit of the plurality of latches, wherein the initialization data remains stored in the set of the plurality of latches. The method also includes implementing a user-designed routing pattern of the plurality of latches by configuring the configuration bits of the plurality of latches.

Abstract: A nonvolatile memory device includes a data path; and a FIFO memory including a plurality of registers connected to the data path. The plurality of registers sequentially receive data from the data path in response to data path input clocks and sequentially output the received data to an input/output pad in response to data path output clocks. The data path output clocks are clocks that are generated by delaying the data path input clocks as long as a delay time.

Abstract: A semiconductor device includes a flag signal generating circuit, a reference voltage generating circuit, and a first buffer. The flag signal generating circuit generates a flag signal based on an internal command and a training control code which are extracted from an external signal. The reference voltage generating circuit receives a set code based on the flag signal, an input control code and an output control code, and generates a reference voltage whose level is set based on the set code. The first buffer buffers the external signal based on the reference voltage to generate an internal signal, and generates a calibration code from the internal signal based on the flag signal to output the calibration code.

Abstract: A semiconductor device may include a driving control signal generation circuit configured to generate a driving control signal by determining whether a corresponding operation is a gapless read operation, according to a read strobe signal. The semiconductor device may also include a power driving circuit configured to drive a supply voltage to a power supply voltage in response to the driving control signal, and a read control signal generation circuit configured to generate a read control signal for controlling a read operation from the read strobe signal in response to the supply voltage.

Abstract: A memory device includes a memory cell array having a plurality of memory cells, a storage unit suitable for storing a fail address corresponding to a fail memory cell in the memory cell array, an available storage capacity determination unit suitable for generating available capacity information indicating an available storage capacity in the storage unit, and an output circuit suitable for outputting the available capacity information.

Abstract: A memory device can include a plurality of banks, each bank including memory locations accessible by different access circuits; at least a first address port configured to receive addresses on falling and rising edges of a timing clock, each address corresponding to locations in different banks; and at least two read/write data ports configured to receive write data for storage in one of the banks, and output read data from one of the banks.

Abstract: An ST-MRAM structure, a method for fabricating the ST-MRAM structure and a method for operating an ST-MRAM device that results from the ST-MRAM structure each utilize a spin Hall effect base layer that contacts a magnetic free layer and effects a magnetic moment switching within the magnetic free layer as a result of a lateral switching current within the spin Hall effect base layer. This resulting ST-MRAM device uses an independent sense current and sense voltage through a magnetoresistive stack that includes a pinned layer, a non-magnetic spacer layer and the magnetic free layer which contacts the spin Hall effect base layer. Desirable non-magnetic conductor materials for the spin Hall effect base layer include certain types of tantalum materials and tungsten materials that have a spin diffusion length no greater than about five times the thickness of the spin Hall effect base layer and a spin Hall angle at least about 0.05.

Abstract: A magnetic storage device of one embodiment includes a first and second magnetoresistive effect elements. The first magnetoresistive element includes a first magnetic layer having a first coercivity, a second magnetic layer having a second coercivity higher than the first coercivity, and a third magnetic layer having a third coercivity higher than the second coercivity. Magnetization orientations of the second and third magnetic layers are antiparallel. The second magnetoresistive effect element includes a fourth magnetic layer having a fourth coercivity, a fifth magnetic layer having a fifth coercivity higher than the fourth coercivity, and a sixth magnetic layer having a sixth coercivity higher than the fifth coercivity. Magnetization orientations of the fifth and sixth magnetic layers are parallel.

Abstract: A magnetic memory and methods for providing and programming the magnetic memory are described. The memory includes storage cells, magnetic oscillator(s) and bit lines. Each storage cell includes magnetic junction(s) having a free layer, a reference layer, and a nonmagnetic spacer layer between reference and free layers. The free layer is switchable between stable magnetic states when a write current is passed through the magnetic junction. The free layer has a first magnetic anisotropy at room temperature and a second magnetic anisotropy at a minimum switching temperature due to at least the write current. The second magnetic anisotropy is not more than ninety percent of the first magnetic anisotropy. The first and second magnetic anisotropies correspond to first and second ferromagnetic resonance (FMR) frequencies. The magnetic oscillator(s) have a frequency range. The first FMR frequency is outside of the frequency range. The second FMR frequency is within the frequency range.

Abstract: The present invention provides integrated circuit chips having chip identification aspects. The chips include magnetic tunnel junction (MTJ) structures, and more specifically, include permanent bit strings used for chip identification and/or authentication. Systems and processes for chip identification are also disclosed herein. The MTJ element structures provided herein can have a defined resistance profile such that the intrinsic variability of the MTJ element structure is used to encode and generate a bit string that becomes a fingerprint for the chip. In some embodiments, an oxygen treatment covering all or a selected portion of an array of MTJ elements can be used to create a mask or secret key that can be used and implemented to enhance chip identification.

Abstract: A thermally-assisted magnetic writing device includes at least one magnetic element including: a reference layer having a stable vortex magnetization configuration; a device to create a magnetic field to reversibly move the vortex core in the plane of the reference layer; a storage layer having a variable magnetization configuration; a non-magnetic spacer that separates and magnetically decouples the reference layer and the storage layer; an antiferromagnetic pinning layer in contact with the storage layer, the antiferromagnetic layer being capable of pinning the magnetization configuration of the storage layer, the storage layer having at least two storage levels corresponding to two pinned magnetization configurations; a device to heat the antiferromagnetic pinning layer such that when heated, the temperature of the antiferromagnetic pinning layer exceeds its blocking temperature such that the magnetization configuration of the storage layer is no longer pinned when warm.

Abstract: A magnetoresistive memory device that stores data in the reference portion of spin-torque memory cells provides for more robust data storage. In normal operation, the memory cells use the free portion of the memory cell for data storage. Techniques for storing data in the reference portions of memory cells are presented, along with techniques for recovering data stored in the reference portions of memory cells.

Abstract: A data processing system includes a memory channel and a data processor coupled to the memory channel. The data processor is adapted to access at least one rank and has refresh logic. In response to an activation of the refresh logic, the data processor generates refresh cycles to a bank of the memory channel. The data processor selects one of a first state corresponding to a first auto-refresh command that causes the data processor to auto-refresh the bank, and a second state corresponding to a second auto-refresh command that causes the data processor to auto-refresh a selected subset of the bank. The data processor initiates a switch between the first state and the second state in response to the refresh logic detecting a first condition related to the bank, and between the second state and the first state in response to the refresh logic circuit detecting a second condition.

Abstract: An information processing apparatus according to an aspect of the present invention acquires temperature information for each of a plurality of memories in a wide IO memory device, and when execution of a job is instructed, decides on a memory having a lower temperature as the memory to be used by a functional module that corresponds to a function, based on the memory size to be used by the functional module that corresponds to the function, and on the acquired temperature information for the memories.

Abstract: One semiconductor device includes a command receiver receiving the command signal to generate a first internal command signal, and a latency control circuit activating a second internal chip select signal after elapse of first cycles of a clock signal since a first internal chip select signal is activated. The latency control circuit activates a second control signal when the chip select signal is maintained in an inactive state during second cycles of the clock signal that is larger than the first cycles. The command receiver is activated based on a first control signal. The first control signal is activated in response to the first internal chip select signal. The first control signal is deactivated in response to the second control signal.

Abstract: A system, includes a controller comprising a plurality of first external terminals configured to supply a command and an address, and communicate a data, and communicate a strobe signal related to the data; and a semiconductor memory device including a plurality of second external terminals corresponding to the plurality of first external terminals, at least one of the plurality of first external terminals and at least one of the plurality of second external terminals each being capable of supplying an information specifying a length of a preamble of the strobe signal before the semiconductor memory device communicates the data between the controller and the semiconductor memory device, the semiconductor memory device further including a preamble register configured to be capable of storing the information.

Abstract: Disclosed herein is a semiconductor device that includes an access control circuit generating an internal command based on a verification result signal and an external command. The external command indicates at least one of a first command that enables the access control circuit to access a first circuit and a second command that enables the access control circuit not to access the first circuit or enables the access control circuit to maintain a current state of the first circuit. The access control circuit, when the verification result signal indicates a first logic level, generates the internal command based on the external command. The access control circuit, when the verification result signal indicates a second logic level, generates the internal command that corresponds to a second command even if the external command indicates a first command.

Abstract: This invention concerns a semiconductor memory device comprising: at least one sense amplifier circuit for reading data sensed from selected memory cells in a memory array,—at least one reference circuit, each reference circuit being a replica of the sense amplifier circuit and having an output through which the reference circuit delivers an output physical quantity, a regulation network providing a regulation signal to each sense amplifier circuit and each reference circuit, wherein the regulation signal is derived from an averaging of the output physical quantity over time and/or space, wherein the regulation network comprises a control unit configured to sum up the physical quantities of each output of the reference circuit and a target mean value, the control unit delivering a regulation signal based on the sum, the regulation signal being fed in to each regular sense amplifier circuit and to each reference circuit.

Abstract: A method of screening complementary metal-oxide-semiconductor CMOS integrated circuits, such as integrated circuits including CMOS static random access memory (SRAM) cells, for transistors susceptible to transistor characteristic shifts over operating time. For the example of SRAM cells formed of cross-coupled CMOS inverters, separate ground voltage levels can be applied to the source nodes of the driver transistors, or separate power supply voltage levels can be applied to the source nodes of the load transistors (or both). Asymmetric bias voltages applied to the transistors in this manner will reduce the transistor drive current, and can thus mimic the effects of bias temperature instability (BTI). Cells that are vulnerable to threshold voltage shift over time can thus be identified.

Abstract: An integrated circuit chip includes a first type memory cell and a second type memory cell. The first type memory cell includes a first reference line landing pad and a first word line landing pad. The first reference line landing pad of the first type memory cell and the first word line landing pad of the first type memory cell are aligned along a first direction. The second type memory cell includes a first reference line segment extending along the first direction and a first word line landing pad. The first word line landing pad of the second type memory cell and the first reference line segment of the second type memory cell are spaced apart along a second direction different from the first direction.

Abstract: A three dimensional dual-port bit cell generally comprises a first portion disposed on a first tier, wherein the first portion includes a plurality of port elements. The dual-port bit cell also includes a second portion disposed on a second tier that is vertically stacked with respect to the first tier using at least one via, wherein the second portion includes a latch.

Abstract: An SRAM cell with dynamic split ground (GND) and split wordline (WL) for extreme scaling is disclosed. The memory cell includes a first access transistor enabled by a first wordline to control access to cross coupled inverters by a first bitline. The memory cell further includes a second access transistor enabled by a second wordline to control access to the cross coupled inverters by a second bitline. The memory cell further includes a split ground line comprising a first ground line (GNDL) separated from a second ground line (GNDR). The GNDL is connected to a transistor of a first inverter of the cross coupled inverters and the GNDR is connected to a first transistor of a second inverter of the cross coupled inverters.

Abstract: Adaptive write operations for non-volatile memories select programming parameters according to monitored programming performance of individual memory cells. In one embodiment of the invention, programming voltage for a memory cell increases by an amount that depends on the time required to reach a predetermined voltage and then a jump in the programming voltage is added to the programming voltage required to reach the next predetermined voltage. The adaptive programming method is applied to the gate voltage of memory cells; alternatively, it can be applied to the drain voltage of memory cells along a common word line. A circuit combines the function of a program switch and drain voltage regulator, allowing independent control of drain voltage of selected memory cells for parallel and adaptive programming. Verify and adaptive read operations use variable word line voltages to provide optimal biasing of memory and reference cells during sensing.

Abstract: A thin-film memory may include a thin-film transistor-free address decoder in conjunction with thin-film memory elements to yield an all-thin-film memory. Such a thin-film memory excludes all single-crystal electronic devices and may be formed, for example, on a low-cost substrate, such as fiberglass, glass or ceramic. The memory may be configured for operation with an external memory controller.

Abstract: Method and apparatus for managing data in a memory, such as a flash memory array. In accordance with some embodiments, a block of solid-state non-volatile memory cells are each programmed to an associated programmed state responsive to a respective amount of accumulated charge. A charge loss compensation circuit adds a relatively small amount of additional charge to the respective amount of accumulated charge in each of the memory cells to maintain the associated programmed states of the cells.

Abstract: A method for read measurement of a plurality N of resistive memory cells having a plurality M of programmable levels is suggested. The method includes a step of reading back from a number of reference cells to obtain a reading back parameter, a step of determining an actual read voltage for the N memory cells based on the obtained reading back parameter for obtaining a target read current at a following read measurement, and, a step of applying the determined actual read voltage to the N memory cells at the following read measurement.

Abstract: According to one embodiment, a method of RRAM operations is provided. The method includes the following operations: providing a first voltage difference across a resistor of the RRAM during a read operation; and providing a second voltage difference across the resistor of the RRAM during a reset operation, wherein the first voltage difference has the same polarity as the second voltage difference.

Abstract: The invention provides a resistive memory apparatus including at least one first resistive memory cell, a first bit line selecting switch, a first source line selecting switch, a first pull down switch and a second pull down switch. The first bit line selecting switch is coupled between a first bit line and a sense amplifier. The first source line selecting switch is coupled between a source line and the sense amplifier. The first and second pull down switches are respectively coupled to the bit line and source line. When a reading operation is operated, on or off statuses of the first bit line selecting switch and the second pull down switch are the same, on or off statuses of the first source line selecting switch and the first pull down switch are the same, and on or off statuses of the first and second pull down switches are complementary.

Abstract: A bit-line of a resistive memory cell includes a reference branch including a reference resistor having a predetermined value and a cell branch including an adjustable memory resistor having a variable value. The reference branch generates a reference current based on the predetermined value of the reference resistor and the cell branch generates a cell branch current based on a selected value of the adjustable memory resistor. A sense amplifier has a first input coupled to the reference branch and a second input coupled to the cell branch. A first pre-charge transistor is coupled to a first pre-charge voltage and the cell branch. The first pre-charge transistor is configured to pre-charge the cell branch to the first pre-charge voltage prior to a read operation.

Abstract: Apparatuses, sense circuits, and methods for compensating for a voltage increase on a wordline in a memory is described. An example apparatus includes a bitline, a memory cell coupled to the bitline, a bipolar selector device coupled to the memory cell, a wordline coupled to the bipolar selector device, and a wordline driver coupled to the wordline. The apparatus further includes a model wordline circuit configured to model an impedance of the wordline and an impedance of the wordline driver, and a sense circuit coupled to the bitline and to the model wordline circuit. The sense circuit is configured to sense a state of the memory cell based on a cell current and provide a sense signal indicating a state of the memory cell. The sense circuit is further configured to adjust a bitline voltage responsive to an increase in wordline voltage as modeled by the model wordline circuit.

Abstract: An apparatus for programming at least one multi-level Phase Change Memory (PCM) cell having a first terminal and a second terminal. A programmable control device controls the PCM cell to have a respective cell state by applying at least one current pulse to the PCM cell, the control device controlling the at least one current pulse by applying a respective first pulse to the first terminal and a respective second pulse applied to the second terminal of the PCM cell. The respective cell state is defined by a respective resistance level. The control device receives a reference resistance value defining a target resistance level for the cell, and further receives an actual resistance value of said PCM cell such that the applying the respective first pulse and said respective second pulse is based on said actual resistance value of the PCM cell and said received reference resistance value.

Abstract: A device and method for setting a resistive random access memory cell are provided. An exemplary method includes: providing a set current to a bit line of the RRAM cell by a current source. An exemplary device includes: a first RRAM cell and a current source. The first RRAM cell is connected to a first word line. The current source selectively connected to the first bit line. The current source selectively provides a current to the first bit line of the first RRAM cell to set the first RRAM cell.

Abstract: A memory cell is provided that includes a vertically-oriented adjustable resistance structure including a control terminal coupled to a word line, and a reversible resistance-switching element coupled in series with and disposed above or below the vertically-oriented adjustable resistance structure.

Abstract: Embodiments disclosed herein may relate to programming a memory cell with a programming pulse that comprises a quenching period having different portions. The memory cell may have more than two possible programmed states, where each programmed state of the memory cell includes a different fraction of amorphous material. A memory element may be melted and then quenched. The fraction of amorphous material, and thus the programmed state, may be controlled by selecting one of multiple quenching periods for the programming pulse.

Abstract: Some embodiments include apparatuses and methods having a memory cell, first and second conductive lines configured to access the memory cell, and a switch configured to apply a signal to one of the first and second conductive lines. In at least one of such embodiments, the switch can include a phase change material. Other embodiments including additional apparatuses and methods are described.

Abstract: A three-dimensional array of memory elements that reversibly change a level of electrical conductance in response to a voltage difference being applied across them. The memory elements can be set to a low resistance state and reset to a high resistance state during standard operation by biasing appropriate voltages on the word lines and bit lines. Prior to standard operation, the memory elements undergo a forming operation, during which current through the bit lines is limited. A forming voltage is applied to the memory elements during forming with a polarity such that a higher voltage is applied to anodes and a lower voltage to cathodes.

Abstract: A memory device has an SRAM that stores a logic state. A first MTJ has two terminals. A second one of the terminals is coupled to a storing node. A first terminal of a second MTJ is coupled to the storing node. The first and second MTJs are programmed to a first resistance by flowing current from the first second terminals and to a second resistance by flowing current from the second to first terminal. A storing circuit is coupled to the storing node, the SRAM cell, and a non-volatile word line. The storing circuit couples the logic state of the SRAM cell to the storing node during a store mode. The logic state of the SRAM cell is stored in the first and second MTJs by applying a storing voltage between the first terminal of the first MTJ and the second terminal of the second MTJ of a first polarity then a second polarity.

Abstract: Subject matter disclosed herein relates to management of a memory device.

Abstract: Multi-port memory circuitry includes single-port memory circuitry, and arbitration logic circuitry that accepts multiple memory queries for the single-port memory circuitry and prevents the multiple memory queries from addressing conflicting portions of the single-port memory circuitry within a single clock cycle. The arbitration logic circuitry may include conflict-resolution logic circuitry that determines whether multiple memory queries address conflicting portions of the single-port memory circuitry. The single-port memory circuitry may be divided into a plurality of sub-arrays, and the conflict-resolution logic circuitry determines whether the multiple memory queries address overlapping groups of sub-arrays. The single-port memory circuitry may be a content-addressable memory or a random-access memory. The multi-port memory circuitry may be part of a shared-memory, multi-processor apparatus.