Abstract: A method of reading a memory cell of a magneto-resistive random access memory device, wherein the memory cell has a ferromagnetic free layer having a first magnetization orientation and a ferromagnetic reference layer, includes applying a first read current from the ferromagnetic free layer to the ferromagnetic reference layer and storing a first voltage generated by the memory cell in response to the first read current, generating a magnetic field adjacent to the memory cell, the magnetic field having a second magnetization orientation that is not parallel to the first magnetization orientation, while the magnetic field is being generated, applying a second read current from the ferromagnetic free layer to the ferromagnetic reference layer and storing a second voltage generated by the memory cell in response to the second read current, and determining a state of the memory cell based on the first voltage and the second voltage.

Abstract: A memory device includes: a plurality of memory blocks; an address counting block suitable for generating a counting address that is changed when all the memory blocks are refreshed; a target address generation block suitable for generating a target address, which is an address of a word line requiring an additional refresh operation, in the memory blocks; and a refresh control block suitable for controlling a 1st number of the memory blocks to be refreshed when a refresh command is inputted a 1st number of times and controlling a 2nd number of the memory blocks to be refreshed when the refresh command is inputted a 2nd number of times, wherein the refresh control block controls a word line corresponding to the counting address to be refreshed and controls a word line corresponding to the target address to be refreshed during a target refresh operation.

Abstract: A refresh control device may include a fuse array configured to store fuse data. The refresh control device may include a refresh controller including cell arrays including unit cells. The refresh controller may be configured to store position information of a word line having weak cell characteristics based on fuse data. The refresh control device may include a comparator configured to receive data from the cell arrays of a selected cell and may be configured to compare the data to determine the presence of a weak word line to either perform or skip the refresh operation on the corresponding cell.

Abstract: A semiconductor device includes a 1st controller suitable for generating refresh control signals for controlling at least two types of refresh operations according to an external refresh signal; and a 2nd controller suitable for controlling the at least two types of refresh operations to be evenly and alternately performed on a plurality of word lines according to the refresh control signals, a predetermined number of times during a unit refresh period corresponding to the external refresh signal.

Abstract: An apparatus including a memory module and power converter and method of operating the same. In one embodiment, the apparatus includes a memory module, located on a circuit board, configured to operate from a first voltage and a second voltage being a multiple of the first voltage. The apparatus also includes a power converter employing a switched-capacitor power train, located on the circuit board, configured to provide the second voltage for the memory module from the first voltage.

Abstract: A memory controller transmits a control signal to a memory module, where the memory controller continuously transmits a clock signal to the memory module. The memory controller determines adjustments to the control signal with respect to the clock signal, by iteratively analyzing a strobe signal.

Abstract: A system and method for efficient data eye training reduces the time and resources spent calibrating one or more memory devices. A temporal calibration mechanism reduces the time and resources for calibration by reducing the number tests needed to sufficiently determine the boundaries of the data eye of the memory device. For one or more values of the voltage reference, the temporal calibration mechanism performs a minimal number of tests to find the edges of the data eye for the hold and setup times.

Abstract: A control method for a memory system is provided. A memory controller of the memory system is configured to control the memory device. After a condition is met, the memory controller performs a retry operation to compensate for shifting of a data strobe signal sent from the memory device until the memory system enters a normal operation mode. When the shifting of the data strobe signal is compensated for, the number of pulses of the data strobe signal in the gating window is equal to the first predetermined number.

Abstract: An address generation circuit may include: a first latch unit suitable for latching an address obtained by inverting a part of an input address; a second latch unit suitable for latching the partly inverted input address of the first latch unit, and suitable for latching an added/subtracted address after a first refresh operation during a target refresh period; a third latch unit suitable for latching the partly inverted input address of the first latch unit during a period other than the target refresh period; and an addition/subtraction unit suitable for generating the added/subtracted address by adding/subtracting a predetermined value to/from the latched address of the second latch unit.

Abstract: A sense amplifier includes an equalization unit configured to precharge a pair of bit lines to a level of a bit line precharge voltage in response to a bit line equalizing signal; and an amplification unit configured to sense and amplify voltages of the pair of bit lines, supply, during an active operation, a ground voltage to a pull-down node of a latch section, and supply, when a precharge signal is enabled, a first voltage lower than the ground voltage to the pull-down node of the latch section for a predetermined time.

Abstract: Provided is an electronic device including a circuit for reading data from a memory cell that can store multilevel data. The electronic device includes a memory cell array region, N sense amplifier regions, and switching elements. The memory cell array region includes memory cells that store, when (N+1)-level data is stored, the (N+1)-level data as different potentials. Each of the N sense amplifier regions compares a read potential, which depends on a charge released to a bit line and a wiring or the like connected thereto, with a reference potential and performs amplification. Each of the switching elements electrically isolates a sense amplifier region from the other sense amplifier regions after all of the N sense amplifier regions are electrically connected to the bit line. Each of the sense amplifier regions can output a write potential to the bit line.

Abstract: The disclosure provides an input/output (IO) circuit powered by an input/output (IO) supply voltage. The IO circuit includes a cutoff circuit that receives a first invert signal, the IO supply voltage, a bias voltage and a pad voltage. An output stage is coupled to the cutoff circuit. The output stage receives a first signal, a second signal and the bias voltage. A pad is coupled to the output stage, and a voltage generated at the pad is the pad voltage. The cutoff circuit and the output stage maintain the pad voltage at logic high when the IO supply voltage transition below a defined threshold.

Abstract: A static random access memory unit structure and layout structure includes two pull-up transistors, two pull-down transistors, two slot contact plugs, and two metal-zero interconnects. Each metal-zero interconnect is disposed on each slot contact plug and a gate of each pull-up transistor, in which, each slot contact plug crosses a drain of each pull-down transistor and a drain of each pull-up transistor and extends to cross an end of each metal-zero interconnect. A gap between the slot contact plugs is smaller than a gap between the metal-zero interconnects.

Abstract: A semiconductor device for reducing an instantaneous voltage drop is provided. The semiconductor device includes a first power line configured to provide a first power supply voltage and a first power transistor connected between the first power line and a first logic transistor. The first power transistor includes a first source or drain connected to the first power line, a gate receiving a power gating control signal, and a second source or drain connected to a first source or drain of the first logic transistor using a shared semiconductor junction.

Abstract: A mutltiport memory cell having improved density area is disclosed. The memory cell includes a data storing component, a first memory access component coupled to a first side of the data storing component, a second memory access component coupled to a second side of the data storing component, first and second bit lines coupled to the first memory access component, first and second bit lines coupled to the second memory access component, first and second write lines coupled to the first memory access component and first and second write lines coupled to the second memory access component. The multiport memory cell also includes a read/write assist transistor, coupled to load transistors of the data storing component, that during read operations is activated for the duration of the read operation and during write operations is activated to impress the desired voltage level before or after one or more memory access components activated as a part of the write operation are deactivated.

Abstract: Described is an apparatus for self-induced reduction in write minimum supply voltage for a memory element. The apparatus comprises: a memory element having cross-coupled inverters coupled to a first supply node; a power device coupled to the first supply node and a second supply node, the second supply node coupled to power supply; and an access device having a gate terminal coupled to a word-line, a first terminal coupled to the memory element, and a second terminal coupled to a bit-line which is operable to be pre-discharged to a logical low level prior to write operation.

Abstract: A 6T static random access memory cell, array, and memory thereof are provided, in which the memory cell includes a first inverter, a second inverter, a first NMOS transistor, and a second NMOS transistor. A first high supply voltage and a low supply voltage are coupled to the first inverter. A second high supply voltage and the low supply voltage are coupled to the second inverter. The first NMOS transistor has a gate terminal coupled to a first word line. The first NMOS transistor has a source terminal coupled to the first node. The second NMOS transistor has a gate terminal coupled to a second word line, and the second NMOS transistor has a source terminal coupled to the second node. The first word line provides ON signals to turn on the first NMOS transistor, and the second high supply voltage provides a first boost voltage simultaneously.

Abstract: A memory and a method to operate the memory are provided. The memory includes a plurality of memory cells and a wordline driver configured to output a wordline. The memory cells are coupled to the wordline. A control circuit is configured to supply an operating voltage to the memory cells and to the wordline driver. A voltage-adjustment circuit is configured to adjust the operating voltage supplied to the memory cells during the control circuit supplying the operating voltage to the memory cells and to the wordline driver. The method includes supplying an operating voltage to at least one memory cells and to a wordline coupled to the at least one memory cells and adjusting the operating voltage supplied to the at least one memory cells during the supplying the operating voltage to the at least one memory cells and to the wordline.

Abstract: A static random access memory (SRAM) cell is provided with improved write margin. The SRAM cell includes: a pair of inverters cross coupled to each other and forming two storage nodes; read access switches electrically coupled between a read bit line and the two storage nodes; write access switches electrically coupled between write bit lines and two storage nodes; and supply switches electrically coupled between a supply voltage and the pair of inverters and operable, in response to a signal on at least one of the write bit lines, to selectively connect the supply voltage to at least one of the inverters in the pair of inverters. During a write operation, the supply switches operate to cut off the supply voltage to the inverter in the pair of inverters having a charged state.

Abstract: The present patent application describes 9T, 8T, and 7T versions of bitcells used with 1R1W memories. It also describes 9T, 8T, and 7T versions of bitcells used with single port SRAM memories. Different circuits are discussed to support different bitcells and architectures mentioned above. Our 1R1W and single port bitcells and architectures give significant advantages over the conventional bitcells and architectures.

Abstract: There is provided a method of detecting offset in a sense amplifier of an SRAM memory unit. The method comprises using a sense amplifier of the SRAM memory unit to implement a read of a first data value stored in a memory cell of the SRAM memory unit, and measuring a first time for the sense amplifier to read the first data value. The method further comprises using the sense amplifier to implement a read of a second data value stored in a memory cell of the SRAM memory unit, and measuring a second time for the sense amplifier to read the second data value. The method then comprises calculating a difference between the first time and the second time, and determining whether an offset adjustment should be applied to the sense amplifier in dependence upon the difference between the first time and the second time.

Abstract: A superconducting memory cell includes a magnetic Josephson junction (MJJ) with a ferromagnetic material, having at least two switchable states of magnetization. The binary state of the MJJ manifests itself as a pulse appearing, or not appearing, on the output. A superconducting memory includes an array of memory cells. Each memory cell includes a comparator with at least one MJJ. Selected X and Y-directional write lines in their combination are capable of switching the magnetization of the MJJ. A superconducting device includes a first and a second junction in a stacked configuration. The first junction has an insulating layer barrier, and the second junction has an insulating layer sandwiched in-between two ferromagnetic layers as barrier. An electrical signal inputted across the first junction is amplified across the second junction.

Abstract: Techniques are presented for the programming of a non-volatile memory in which multi-state memory cells use a charge trapping layer. When writing data onto a word lines, different data states are written individually, while programming inhibiting the other states, thereby breaking down the write operation into a number of sub-operations, one for each state to be written. This allows for improved timing and decreased power consumption.

Abstract: A method for writing data into a flash memory unit includes: when writing data into the flash memory unit for the n-th time, determining a data polarity of an n-th data bit to be written into the flash memory unit; selectively injecting an n-th electrical charge amount into a floating gate of the flash memory unit according to the data polarity of the n-th data bit; when writing data into the flash memory unit for the (n+1)-th time, determining the data polarity of an (n+1)-th data bit to be written into the flash memory unit; and selectively injecting an (n+1)-th electrical charge amount into the floating gate of the flash memory unit according to the data polarity of the (n+1)-th data bit. The (n+1)-th electrical charge amount is not equal to the n-th electrical charge amount, and n is a positive integer not less than 1.

Abstract: A memory cell array is configured to have a plurality of memory cells arranged in a matrix, each of the memory cells being connected to a word line and a bit line and being capable of storing n values (n is a natural number equal to or larger than 3). A control circuit controls the potentials of the word line and bit line according to input data and writes data into a memory cell. The control circuit writes data into the memory cell to a k-valued threshold voltage (k<=n) in a write operation, precharges the bit line once, and then changes the potential of the word line an i number of times to verify whether the memory cell has reached an i-valued (i<=k) threshold voltage.

Abstract: Inventive aspects include a memory device having one or more memory pages including a plurality of memory cells each having a plurality of programmable state levels. The memory device includes a memory control logic section including a program logic section and page-level reprogram state metadata. The program logic section may program the plurality of memory cells dependent on the page-level reprogram state metadata. The program logic section may program a first state level, a second state level, and a third state level of each of the memory cells in consecutive programming operations of the plurality of memory cells dependent on the page-level reprogram state metadata, without requiring any erase operations or read operations during or between the programming operations.

Abstract: A memory access module for performing memory access management of a storage device including a plurality of storage cells includes: sensing means for performing a plurality of sensing operations respectively corresponding to a plurality of different sensing voltages in order to generate at least a first digital value of a storage cell, wherein each subsequent sensing operation corresponds to a sensing voltage which is determined according to a result of the previous sensing operation; processing means for using the first digital value to obtain soft information of a bit stored in the storage cell; and decoding means for using the soft information to perform soft decoding.

Abstract: Some embodiments include apparatuses and methods having a first memory element and a first select component coupled to the first memory element, a second memory element and a second select component coupled to the second memory element, and an access line shared by the first and second select components. At least one of the embodiments can include a circuit to generate a signal indicating a state of the second memory element based on a first signal developed from a first signal path through the first memory element and a second signal developed from a second signal path through the second memory element.

Abstract: Apparatuses and methods are described herein for limiting current in threshold switching memories. In an example, an apparatus may include a plurality of first decoder circuits, a plurality of second decoder circuits, an array of memory cells, and a control circuit. Each memory cell of the array of memory cells may be cells coupled to a pair of first decoder circuits of the plurality of first decoder circuits, and further coupled to a pair of second decoder circuits of the plurality of second decoder circuits.

Abstract: A memory device includes a plurality of bit lines extending in a first direction, a plurality of word lines extending in a second direction crossing the first direction, and a plurality of memory cells. Each memory cell includes a memory element and two select transistors disposed along the first direction and the memory element being configured to store information based on changes in resistance. A first and a second column are formed by repeatedly arranging a first group and a second group of the memory cells, respectively, along the first direction, and the second column is disposed adjacent to the first column and the first group is displaced in the first direction such that, in the second direction, a first select transistor in respective memory cells in the first column is aligned with a second select transistor in respective memory cells in the second column.

Abstract: A memory operating method comprises the following steps: a first read voltage is applied to the memory cell to read a first group of data levels of the memory cell; and if the data of the memory cell can not be read with the first read voltage, a second read voltage is applied to the memory cell to read a second group of data levels of the memory cell.

Abstract: Phase change memory devices, systems, and associated methods are provided and described. Such devices, systems, and methods manage and reduce voltage threshold drift to increase read accuracy of phase change memory. A pre-read pulse can be delivered across a select device and a phase change material of a phase change memory cell to at least partially reset the voltage threshold drift of the select device while maintaining a program state of the phase change material.

Abstract: A resistive memory device comprising: a memory cell having a programmable resistance representing stored data; and a read circuit configured to be connected to the memory cell via a first signal line and read the stored data, wherein the read circuit includes: a voltage controller configured to control a first voltage of the first signal line to be a constant voltage and output a signal to a sensing node; and a sense amplifier connected to the voltage controller via the sensing node, and configured to compare a sensing voltage of the sensing node with a reference voltage.

Abstract: Providing for programming a two-terminal memory cell array with low sneak path current is described herein. Groups of two-terminal memory cells can be arranged into blocks or sub-blocks, along sets of bitlines and local wordlines. Further, groups of local wordlines within a given sub-block can be electrically isolated from bitlines outside the sub-block. A programming signal can be applied to the two-terminal memory cells from an associated local wordline thereof. Sneak path currents can be mitigated or avoided with respect to bitlines outside a particular sub-block, or on non-selected wordlines of the sub-block. This can significantly reduce a magnitude of combined sneak path current within the sub-block in response to the programming operation.

Abstract: An operating method, an operating system and a resistance random access memory (ReRAM) are provided. The operating method includes the following steps. A write voltage and a write current are set at a first predetermined voltage value and a first predetermined current value respectively. The write voltage and the write current are applied to a memory cell of the ReRAM for writing. Whether the write current reaches a second predetermined current value is verified, if a read current of the memory cell is not within a predetermined current range. The write current is increased, if the write current does not reach the second predetermined current value. Whether the write voltage reaches a second predetermined voltage value is verified, if the write current reaches the second predetermined current value. The write voltage is increased, if the write voltage does not reach the second predetermined voltage value.

Abstract: A resistive memory and a data writing method for a resistive memory cell thereof are provided. The method includes: receiving and decoding a column address signal for generating a decoded result, and providing a word line voltage to a word line of the resistive memory cell; providing a constant current to one of a bit line and a source line of the resistive memory cell, and coupling a reference ground voltage to another one of the bit line and the source line of the resistive memory cell.

Abstract: A method includes applying a first voltage setting to a memory cell for a first period of time in response to a command for programming a first logical state to the memory cell, obtaining a first stored logical state of the memory cell after the applying the first voltage setting operation, and if the first stored logical state differs from the first logical state, applying a second voltage setting to the memory cell.

Abstract: An electronic device includes a first electrode, a second electrode spaced apart from the first electrode, a resistance variable element interposed between the first electrode and the second electrode, and a conductor arranged at least one of a first side and a second side of the resistance variable element to apply an electric field to the resistance variable element while being spaced apart from the resistance variable element, the first side facing the second side.

Abstract: There is provided a memory unit that comprises a plurality of memory cell groups, each memory cell group comprising a plurality of memory cells that are each operatively connected to a first local bit line and a second local bit line by respective first and second access transistors, and each memory cell being associated with a word line configured to control the first and second access transistors of the memory cell. The first and second local bit lines of each memory cell group being operatively connected to respective first and second column bit lines by respective first and second group access switches, the first group access switch being configured to be controlled by the second column bit line, and the second group access switch being configured to be controlled by the first column bit line.

Abstract: A ternary content-addressable memory (TCAM) that is implemented based on other types of memory (e.g., SRAM) in conjunction with processing, including hashing functions. Such a H-TCAM may be used, for example, in implementation of routing equipment. A method of storing routing information on a network device, the routing information comprising a plurality of entries, each entry has a key value and a mask value, commences by identifying a plurality of groups, each group comprising a subset number of entries having a different common mask. The groups are identified by determining a subset number of entries that have a common mask value, meaning at least a portion of the mask value that is the same for all entries of the subset number of entries.

Abstract: Dynamic tag compare circuits employing P-type Field-Effect Transistor (PFET)-dominant evaluation circuits for reduced evaluation time, and thus increased circuit performance, are provided. A dynamic tag compare circuit may be used or provided as part of searchable memory, such as a register file or content-addressable memory (CAM), as non-limiting examples. The dynamic tag compare circuit includes one or more PFET-dominant evaluation circuits comprised of one or more PFETs used as logic to perform a compare logic function. The PFET-dominant evaluation circuits are configured to receive and compare input search data to a tag(s) (e.g., addresses or data) contained in a searchable memory to determine if the input search data is contained in the memory. The PFET-dominant evaluation circuits are configured to control the voltage/value on a dynamic node in the dynamic tag compare circuit based on the evaluation of whether the received input search data is contained in the searchable memory.

Abstract: CPUs are not effective for search processing for information on a memory. Content-addressable memories (CAMs) are effective for information searches, but it is difficult to build a large-capacity memory usable for big data using the CAMs. A large-capacity memory may be turned into an active memory having an information search capability comparable to that of a content-addressable memory (CAM) by incorporating an extremely small, single-bit-based parallel logical operation unit into a common memory. With this memory, a super fast in-memory database capable of fully parallel searches may be realized.

Abstract: A non-volatile memory cell for storing a single bit is disclosed. The non-volatile memory cell includes an access transistor including a gate, a first body, a first source/drain node, and a second source/drain node. The non-volatile memory cell also includes a first floating gate storage transistor that has a third source/drain node, a second body, a fourth source/drain node, and a first floating gate including a first storage node. The third source/drain node is coupled to the second source/drain node. The non-volatile memory cell further includes a first capacitor, a second capacitor, and a second floating gate storage transistor. The first capacitor has a first plate coupled to the first storage node and an opposite second plate. The second floating gate storage transistor includes a fifth source/drain node, a third body, a sixth source/drain node, a second floating gate including a second storage node. The fifth source/drain node is coupled to the fourth source/drain node.

Abstract: Various embodiments comprise apparatuses such as those having a block of memory divided into sub-blocks that share a common data line. Each of the sub-blocks of the block of memory corresponds to a respective one of a number of segmented sources. Each of the segmented sources is electrically isolated from the other segmented sources of the block of memory. Additional apparatuses and methods of operation are described.

Abstract: Non-volatile memory including rows and columns of memory cells, the columns of memory cells including pairs of twin memory cells including a common selection gate. According to the disclosure, two bitlines are provided per column of memory cells. The adjacent twin memory cells of the same column are not connected to the same bitline while the adjacent non-twin memory cells of the same column are connected to the same bitline.

Abstract: A semiconductor memory device includes a memory cell array including a plurality of memory cells, connecting circuits including pass transistors coupled between global word lines and the plurality of memory cells, an address decoder coupled to block word lines coupled to gates of the pass transistors and the global word lines, and a control logic controlling the address decoder and applying a voltage pulse to the global word lines and the block word lines according to an operation state of the semiconductor memory device.

Abstract: A program method of a nonvolatile memory device includes a pre-program verify step for verifying a threshold voltage of a selected memory cell; a step of setting a bit line voltage of the selected memory cell according to the threshold voltage of the selected memory cell which is determined through the pre-program verify step; a step of applying a program voltage to the selected memory cell set with the bit line voltage; and a post-program verify step for verifying a programmed state of the selected memory cell applied with the program voltage.

Abstract: Disclosed are a semiconductor memory device, and an operating method thereof. The semiconductor memory device includes: a memory cell array including a plurality of memory cells; a peripheral circuit configured to perform a program pulse application operation and a verification operation on the memory cell array; a pass/fail check circuit configured to output a pass/fail signal according to a result of the verification operation; and a control logic configured to control the peripheral circuit to perform the program pulse application operation and the verification operation such that two or more program pulses are continuously applied during the program pulse application operation, and first and second verification operations are continuously performed during the verification operation.

Abstract: A multiple-bit-per-cell, page mode memory comprises a plurality of physical pages, each physical page having N addressable pages p(n). Logic implements a plurality of selectable program operations to program an addressed page. Logic select one of the plurality of selectable program operations to program an addressed page in the particular physical page using a signal that indicates a logical status of another addressable page in the particular physical page. The logical status can indicate whether the other addressable page contains invalid data. The first program operation overwrites the other addressable page, and the second program operation preserves the other addressable page. The first program operation can execute more quickly than the second program operation. The logic can also be applied for programming multiple-bit-per-cell memory not configured in a page mode.

Abstract: Systems, methods, and apparatus are disclosed for implementing memory cells having common source lines. The methods may include receiving a first voltage at a first transistor. The first transistor may be coupled to a second transistor and included in a first memory cell. The methods include receiving a second voltage at a third transistor. The third transistor may be coupled to a fourth transistor and included in a second memory cell. The first and second memory cells may be coupled to a common source line. The methods include receiving a third voltage at a gate of the second transistor and a gate of the fourth transistor that may cause them to operate in cutoff mode. The methods may include receiving a fourth voltage at a gate of the first transistor. The fourth voltage may cause a change in a charge storage layer included in the first transistor.