Abstract: A printed circuit board for high-power components includes at least two dielectric layers. A thermally-conductive embedded layer is disposed between two of the dielectric layers and includes one or more internal coolant channels. Thermal vias extend from the embedded layer to an exterior surface of at least one of the dielectric layers. At least one of the dielectric layers in the printed circuit board has an exterior surface on which one or more high power components may be mounted. In some implementations, there are at least two dielectric layers on a same side of the embedded layer and high power components may be located inside the printed circuit board between two dielectric layers. Thermal resistance between the high-power components and the embedded layer is decreased in comparison to typical surface-mounted cold plates, resulting in more efficient heat dissipation. In some implementations the embedded layer is also an electrical ground plane.

Abstract: The present disclosure relates to extremely high frequency (“EHF”) systems and methods for the use thereof, and more particularly to board-to-board connections using contactless connectors.

Abstract: A packaged device has a die of semiconductor material bonded to a support. An electromagnetic shielding structure surrounds the die and is formed by a grid structure of conductive material extending into the support and an electromagnetic shield, coupled together. A packaging mass embeds both the die and the electromagnetic shield. The electromagnetic shield is formed by a plurality of metal ribbon sections overlying the die and embedded in the packaging mass. Each metal ribbon section has a thickness-to-width ratio between approximately 1:2 and approximately 1:50.

Abstract: A manufacturing method of a circuit substrate includes the following steps. A core layer having a core dielectric layer, a first patterned circuit layer and a second patterned circuit layer is provided. An electroless plating nickel layer is formed on the first patterned circuit layer and the second patterned circuit layer. The electroless plating nickel layer has a first thickness, and the first thickness is between 1 micrometer and 10 micrometers. A reducing process is performed on the electroless plating nickel layer so that the electroless plating nickel layer is thinned from the first thickness to a second thickness to form a thinned electroless plating nickel layer. The second thickness is between 0.01 micrometers and 0.9 micrometers. An electroless plating palladium layer is formed on the thinned electroless plating nickel layer. A surface metal passivation layer is formed on the electroless plating palladium layer.

Abstract: A circuit board structure with selectively corresponding ground layers includes a first ground layer, a second ground layer, and a dielectric layer arranged between the first ground layer and the second ground layer to define a ground layer height difference between the first ground layer and the second ground layer. The first ground layer includes a plurality of non-electromagnetic shield areas. The circuit board includes a plurality of conductor wires formed thereon and selectively classified and divided into a first group of conductor wires and the second group of conductor wires. The first-group conductor wires are arranged to correspond to and electromagnetically couple to the first ground layer, and the second-group conductor wires are arranged to correspond to and electromagnetically couple to the second ground layer through the non-electromagnetic shield areas respectively, so that impedance value control is achieved.

Abstract: An exemplary bridging inter-connector establishes electrical connections between conductors on a PCB and aligned conductors on a first board mounted to the PCB. A flexible non-conductive sheet covers at least a portion of these conductors. Separated conductive strips on the sheet that are dimensioned to align with and engage at least a portion of both the aligned conductors. A thin film of a bonding agent is disposed on the separated conductive strips and located to engage at least a portion of both aligned conductors to form a conductive connection.

Abstract: A circuit module includes a plurality of electronic components and a single-layer conductive package substrate. The single-layer conductive package substrate is adapted to physically support and electrically interconnect the electronic components. The substrate has a peripheral portion and an interior portion. The peripheral portion includes a plurality of peripheral contact pads coupled to corresponding electronic components. The interior portion includes a plurality of floating contact pads that are electrically isolated from the peripheral contact pads and are coupled to corresponding electronic components.

Abstract: A method for wiring differential signal lines and a PCB are disclosed. The wiring method includes: providing a rectangle-shaped glass fiber fabric formed of glass fibers which are woven and interlaced with each other and an adhesive filled therebetween; determining a wiring direction and obtaining a glass fiber bundle number of the glass fiber fabric in the wiring direction; equally dividing the glass fiber fabric into glass fiber units, and obtaining a width of each glass fiber unit according to a size of the glass fiber fabric in a direction perpendicular to the wiring direction and the number of the glass fiber units; determining a line distance and line widths of the differential signal lines; and according to the line distance and the line widths, forming the differential signal lines on a metal layer along the wiring direction to make the differential signal lines meet predetermined requirements.

Abstract: A wiring board and a method for manufacturing the same enabling simple and easy formation of a conductive pattern are provided. The method comprises a transferring step of bringing a resin composition containing a first compound inducing a low surface free energy and a second compound inducing a higher surface free energy than the first compound into contact with a master on which a desired surface free energy difference pattern is formed and curing to obtain a base material to which the surface free energy difference pattern is transferred; and a conductive pattern forming step of applying a conductive coating composition onto a surface of pattern transfer of the base material to form a conductive pattern.

Abstract: Disclosed is a method for producing a semiconductor device including a circuit board having a flexible resin layer that encapsulates a circuit component. The method may include a step of immersing a flexible substrate in an encapsulant, drying the encapsulant, and thereby encapsulating the circuit component with the encapsulant; and a step of curing the encapsulant, and thereby forming a flexible resin layer.

Abstract: This document describes techniques and apparatuses for connecting an electronic component to an interactive textile. Loose conductive threads of the interactive textile are collected and organized into a ribbon with a pitch that matches a corresponding pitch of connection points of the electronic component. Next, non-conductive material of the conductive threads of the ribbon are stripped to expose the conductive wires of the conductive threads. After stripping the non-conductive material from the conductive threads of the ribbon, the connection points of the electronic component are bonded to the conductive wires of the ribbon. The conductive threads proximate the ribbon are then sealed using a UV-curable or heat-curable epoxy, and the electronic component and the ribbon are encapsulated to the interactive textile with a water-resistant material, such as plastic or polymer.

Abstract: Soldering is performed with a high yield ratio even when extremely-thin wires are joined at an extremely-narrow pitch. Moreover, a bridge between conductive joint portions is reduced. A core wire 41 is placed on a preliminarily-soldered conductive joint portion 2. Then, the conductive joint portions 2 and the core wires 41 are covered with an optically-transparent sheet 30. Thus, the state in which the core wire 41 is placed on the conductive joint portion 2 is held. In this state, the optically-transparent sheet 30 is irradiated with light. A preliminary solder 3 is heated and melted to join the core wire 41 and the conductive joint portion 2 together.

Abstract: This is directed to a hook and receiving element combination for securing components forming the shell of an electronic device. The receiving element can include a beam connected to the outer shell component and operative to deflect as the hook element approaches the receiving element. To limit deflections of the outer shell component, the beam can be restrained at opposing ends in directions perpendicular to the beam length, but free to slide along the beam axis. In some embodiments, the receiving element can include a lip for guiding the deflection of the beam as the beam contacts the hook element. In particular, the lip can ensure that the beam deflects at an angle relative to the hook element motion such that a smaller hook element motion is required to engage the beam.

Abstract: A device for integrating a monitor in a case comprises a support element made from plastic material and having a recess which corresponds to a predetermined visible area of the monitor. The support element includes a plurality of apertures which are arranged at a predetermined distribution outside the recess for passing through positioning and/or retaining elements and placing the support element at a predetermined position on a sheet-metal case in which the support element can be received, and a frame section which projects from a base area of the support element on a rear side thereof and is arranged in sandwich design for receiving components of the monitor. The components of the monitor received in the frame section are adapted to be fixed to the support element, and the support element is adapted to be fixed to the at least one of positioning or retaining elements on the sheet-metal case.

Abstract: A controller (1) includes a primary molded portion (11) in which a resin molded body (10) is integrated with a bus bar (100) using a resin, causing one end of the bus bar (100) to function as a connector terminal which protrudes into connector portions (13) to (15), and configured to form electronic component disposition portions (16a) to (16d) in which an electronic component (40) is disposed and a power device disposition portion (17) in which a power device (50) is disposed, and a secondary molded portion (21) integrated with the electronic component (40), the power device (50), and the primary molded portion (11) in a state in which the electronic component (40) is disposed at the electronic component disposition portions (16a) to (16d) and the power device (50) is disposed at the power device disposition portion (17).

Abstract: A rollable display device includes a display panel having a flexible property, a roller configured to receive the display panel in a rolled-up configuration, and a handle coupled to an end portion of the display panel. The rollable display device further includes a housing configured to house the roller and the display panel in the rolled-up configuration. The housing includes an outlet, which the display panel passes through in an unrolled configuration, and a first coupling hole disposed apart from the outlet and is configured to receive the handle.

Abstract: A display device includes a flexible display panel, a roller for winding the flexible display panel, an elastic holder fixed to an edge of the flexible display panel and having a side parallel to the edge of the flexible display panel, and a tension applier set disposed at opposite ends of the elastic holder for tensioning the elastic holder.

Abstract: A coupling and fixing structure of a power module and a casing of a power supply includes a casing and three power modules. The casing is provided with three first raised studs and three second raised studs corresponding to the power modules respectively. Each power module has a positioning recess and a positioning hole corresponding to the respective first raised stud and the respective second stud. The positioning recess and the positioning hole of the power module are aligned with the first raised stud and the second raised stud of the casing respectively, and then the power module is slightly moved toward the first side to be positioned and locked. The present invention can enhance the operational efficiency of coupling and fixing effectively.

Abstract: A magnetically held diaper monitor comprises a power supply part and a control part. The power supply part comprises a lower shell, and a battery and a power circuit board embedded in the lower shell. The power circuit board is provided with a plurality of lower magnetic electrodes and two lower magnetic terminals. The control part comprises an upper shell and a control circuit board embedded in the upper shell. The control circuit board is provided with upper magnetic electrodes which are in one-to-one correspondence to the lower magnetic electrodes, and upper magnetic terminals which correspond to the lower magnetic terminals. A diaper sensor is clamped between the power supply part and the control part which are combined into a whole by attraction by means of a magnetic force and is connected to the control part via the magnetic electrodes. The control part obtains a power supply via the magnetic terminals.

Abstract: A display device is disclosed. The display device may include a display panel and cover. A first cover may be configured to be connected to the display panel and a second cover may be connected to the first cover to cover the display panel. The first cover and the second cover may cover a back side of the display panel. A plurality of first holders may be disposed on the first cover and a plurality of second holders may be disposed on the second cover corresponding to the plurality of first holders to couple the second cover to the first cover. The first cover may include a first frame and a second frame connected to each other. Distal ends of the first and second frames may have prescribed shapes configured to couple to each other to form a low profile cover for the display device.

Abstract: One example provides a method of manufacturing. The method comprises oxidizing, using plasma, a first surface of a substrate comprising a metal-material. The method further comprises cutting into the substrate through the oxidized first surface to expose a non-oxidized second surface of the substrate, the second surface not parallel to the first surface. The method further comprises disposing, using electrophoretic deposition, a coating layer over the exposed second surface to form an article having the oxidized first surface and the coated second surface.

Abstract: A structure includes a sheet metal antenna as a first member, a rear-surface-side housing as a second member including a through hole, and a sealing portion which seals the through hole. The second member includes a space. The sheet metal antenna includes an intermediate portion as a pass-through portion which passes through the space and the through hole. The space includes a first region, a second region located opposite to the first region with the intermediate portion being interposed, and a third region which lies from one main surface of the intermediate portion to the other main surface thereof while it is in contact with both of the first region and the second region, and the second member includes an injection path as a groove continuing to the first region.

Abstract: A hold down member can be surface mounted to a substrate, such that a post of the hold down member extends at least into an interposer. Accordingly, when an on board transceiver is placed in electrical communication with the interposer, a fastener can be inserted at least into the on board transceiver so as to attach to the post, thereby securing the on board transceiver to the interposer and the substrate.

Abstract: A power-supply device including: a casing having a space therein and formed by metal stamping or having a thickness ranging from 0.3 to 3.0 mm; and a circuit board disposed inside the casing, wherein the casing includes a casing portion having an opening, and a cover portion disposed to cover the opening of the casing portion, the casing portion has a through hole formed at a position corresponding to a connector terminal connected to the circuit board, and the cover portion includes a storage portion bulging outward from the casing, the storage portion storing either one of an electronic component provided to a face of the circuit board which faces the cover portion and an electronic component provided across the circuit board.

Abstract: The invention relates to a line for a server insert for connecting a power supply unit with a circuit board with distributor contacts. The line comprises a first current rail and a second current rail. The first current rail and the second current rail are arranged parallel to each other. Both current rails can be secured at connections of a power supply unit of a server insert and a circuit board with distributor contacts. The current rails have first connection elements, which are arranged in such a way that two lines can be connected with each other in order to form a point-symmetrical arrangement of lines. The invention further relates to an arrangement and a server insert.

Abstract: A lightweight server (LWS) chassis includes a chassis base having structural configuration that enables placement of the LWS chassis in a nested, stacked configuration with a second LWS chassis placed atop the LWS chassis and a third LWS chassis placed below the LWS chassis. Multiple LWS chasses can be stacked in a vertical space whose height is less than a sum of individual heights of each of the multiple LWS chasses.

Abstract: A structure of a server rack and sidecar combination. The structure may include; a server rack having an opening and a server door on a front side of the server rack; a sidecar mounted to a side of the server rack, the sidecar has an access area on a front side of the sidecar, wherein the server rack opening and the access area are accessible form a common side; an adapter mounted to the accessible common side, wherein the adapter does not restrict access to the server rack opening and the access area, the adapter has at least three vertical sides; and a cable management bar located within the at least three vertical sides.

Abstract: Provided are a rack mount server system, which has no damage to computation equipment even if a disorder occurs in a cooling device, which is easy to maintain, minimize power consumption, which has a simple structure, and which performs an efficient cooling, and a control method thereof. The system comprises: a rack housing; and a cooling zone which is placed in the rack housing, which stores a server, and which is forcibly cooled. The rack housing comprises a heat exchanger and an evaporator, which cool the cooling zone. The cooling methods of the cooling structure may be different in accordance with the internal temperature of the cooling zone and the external temperature of the cooling zone.

Abstract: A method of apparatus for immersion cooling electronic equipment including immersing the electronic equipment in a pressure-sealed tank containing a heat transfer fluid and including a vapor space fluidicly coupled to a condenser; operating the electronic equipment to generate heat and evaporate some of the heat transfer fluid, causing heat transfer fluid vapor to enter the condenser; condensing the heat transfer fluid vapor in the condenser to produce a condensate; returning the condensate to the tank; and increasing power consumption to increase heat generated by the electronic equipment and develop an increased pressure of the heat transfer fluid vapor to bring the apparatus into an equilibrium condition.

Abstract: An ultrathin heat dissipation structure includes a copper clad sheet, a cover, a number of bond blocks, and a phase-change material. The copper clad sheet is given containing grooves and a number of ribs round each containing groove. The containing grooves are formed by stamping. The copper clad sheet includes an insulation layer. The copper clad layer is inner surface of the containing groove. The bond blocks are arranged on the ribs and cover is pressed to the stamped copper clad sheet and secured using the bond blocks. The containing grooves form sealing cavities and the phase-change material in the sealed cavity gathers and transfers out any heat generated by components.

Abstract: A liquid cooling system includes a liquid cooling head, a fixing member and a radiator. The fixing member is disposed on the liquid cooling head. The radiator is disposed on the liquid cooling head through the fixing member. The radiator moves with respect to the liquid cooling head between at least two different positions through the fixing member.

Abstract: The present disclosure provides a system including a cooling rack for servers, a first enclosure, and a second enclosure. The first enclosure can be coupled to the cooling rack for servers and houses electronics. The second enclosure can be coupled to the cooling rack for servers beneath the first enclosure with a minimal sliding clearance in between the two enclosures. The second enclosure also holds an electronics cartridge and connects to the cooling rack for servers via a slide that enables the second enclosure to slide out from under the first enclosure so that the electronics cartridge can be removed from a top of the enclosure. Further, the second enclosure may contain a fluid to immerse components and absorb heat from the electronics cartridge.

Abstract: Self-cooling stretchable electrical circuits with a conduit forming an electrical component and containing electrically conductive liquid are disclosed. They are formed of a platform made of a stretchable material. At least one fluid conduit is formed in the platform and the conduit is formed into an electrical component and filled with the electrically conductive liquid metal. A portion of the conduit is positioned adjacent a heat sink while a pump circulates the liquid through the conduit wherein the metal is cooled at the heat sink.

Abstract: In order to efficiently cool a heat-generating semiconductor element, it is desirable to cool a power semiconductor element from both surfaces. Therefore, in order to cool multiple power semiconductor elements, it is an effective way to alternately arrange a semiconductor component having the incorporated semiconductor element and a cooling device. A power conversion device for handling a high-power voltage needs to ensure pressure resistance between semiconductor elements or circuits inside the device. It is an effective way to seal the semiconductor component with a sealing material such as a silicone gel. Therefore, it is necessary to install the semiconductor component or the circuit having the incorporated semiconductor element, in a case from which a liquid silicone gel prior to curing does not leak even if the gel is injected.

Abstract: The present technology provides a system for supplying fresh air to downstream components. The system comprises a housing with a first end and a second end, a first plurality of partitions disposed in the housing, and a second plurality of partitions disposed in the housing. The housing comprises a base portion and first and second opposing sidewalls extending from the first end to the second end. Each of the first plurality of partitions includes at least one first ventilation opening associated with each of the plurality of compartments. Each one of the second plurality of partitions comprises at least one partition duct extending through the plurality of partition rows and at least one second ventilation opening connecting the at least one partition duct to associated ones of the plurality of compartments.

Abstract: A data center system can include a mobile support structure; one or more enclosures for removable electronic equipment where the enclosures are housed by the support structure; a cooling system in fluid communication with the enclosures for cooling of the electronic equipment where the cooling system is housed by the support structure; and a power system operably connected to the electronic equipment and the cooling system for supplying power thereto where the power system comprises a generator housed by the support system. Other embodiments are disclosed.

Abstract: A blank cartridge includes an impedance portion to control a flow of cooling media through the blank cartridge to a plurality of computing components, and an actuator to change an impedance level of the impedance portion. The actuator receives a control signal to change the impedance level of the impedance portion based on a location of the plurality of computing components relative to the blank cartridge.

Abstract: A display device includes a display panel including a top surface and a bottom surface facing the top surface in a normal direction, a mold member including a seat surface and an outer surface, the bottom surface of the display panel being positioned on the seat surface of the mold member, an adhesion member between the bottom surface and the seat surface to fix the bottom surface to the seat surface, a heating wire contacting the adhesion member, and an accommodation member coupled to the mold member.

Abstract: A hollow shielding structure for different types of circuit elements is provided. The hollow shielding structure includes at least one element mounted on a printed circuit board (PCB), a shield dam surrounding the at least one element, and a shield cover is configured to be electrically coupled to an upper portion of the shield dam and cover the at least one element, with a gap formed between the at least one element and the shield cover.

Abstract: A circuit shielding structure, relating to a technical field of electronics, includes a substrate, wherein: at least one radio frequency component circuit is fixed on the substrate; a wave-absorbing material layer is embedded in the substrate; a shielding wall made of wave-absorbing material is arranged on the substrate and around the radio frequency component circuit; a conductive material layer covers the shielding wall; a closed space is formed among the substrate in which the wave-absorbing material layer is embedded, the shielding wall and the conductive material layer, and the radio frequency component circuit is sealed in the closed space, so that omnidirectional shielding is achieved.

Abstract: A noise current absorber including a pair of housing parts capable of housing each of the pair of magnetic bodies, wherein the pair of magnetic bodies forms an overall cylindrical shape or a ring shape when abutted against each other; an engaging portion and an engaged portion capable of maintaining a closed state of the pair of housing parts; and a wall molded integrally with at least a first housing part of the pair of housing parts, adjacent to an abutting surface of at least the first housing part against a second housing part of the pair of housing parts, the wall protruding to a side where the second housing part abuts.

Abstract: A conveyance robot apparatus of this disclosure includes: a plurality of modules arranged in a row in a first direction; a robot capable of moving each of the plurality of modules in the first direction; a pinion mounted on the robot; a plurality of racks which are respectively supported on the plurality of modules in a slidable manner in the first direction, are meshable with the pinion, and are arranged in a row in the first direction; and a rack connecting mechanism configured to connect adjacent racks each other with respect to the plurality of racks arranged in a row in the first direction, by making at least one of the racks positioned at one terminal end slide toward at least one of the racks positioned at another terminal end.

Abstract: In rotary head type component mounter, provided at two locations around rotary head are Z1-axis drive mechanism and Z2-axis drive mechanism that lower suction nozzles, and in a case in which the interval between two suction nozzles is a multiple two times or greater than the arrangement pitch of components in tray, component mounter performs consecutive simultaneous pickup operation repeatedly for a quantity corresponding to the quantity of component arrangement pitches between the two suction nozzles, the consecutive simultaneous pickup operation being that of lowering the two suction nozzles simultaneously such that two of the components on tray are picked up simultaneously, then rotating rotary head by one nozzle pitch, moving rotary head in the arrangement direction of the components on tray by one component arrangement pitch, and then lowering the next two suction nozzles simultaneously such that another two of the components on tray are picked up simultaneously.

Abstract: A component mounter for holding a component and for mounting the component on a surface of a board includes a head, a horizontal moving device, a vertical moving device, a mounting control device, and an imaging device. The imaging device is configured to image an imaging target by receiving incident light from the imaging target on an imaging element via an optical system. The optical system includes a first optical system configured to guide incident light from a direction of a side surface of a nozzle tip to a first region of the imaging element, and a second optical system configured to guide incident light from a direction of the surface of the board to a second region of the imaging element. The imaging device is configured to image an image via the first optical system and the second optical system.

Abstract: The control device controls an operation of a mounting head of an electronic component mounting machine. The control device is used when an electronic component is mounted on a printed circuit board including multiple divided boards by using the mounting head having multiple suction nozzles. In the control device, some of the multiple divided boards within the printed circuit board are set as one group based on positions of the multiple suction nozzles and positions of the multiple divided boards within the printed circuit board. In addition, in the control device, the multiple suction nozzles suck the electronic components to be mounted on the divided board within one group at the same time.

Abstract: A new and distinct cultivar of Metasequoia plant named ‘WAH-08AG’, characterized by its bright yellow-green colored foliage that transitions to greyed-orange in the fall, foliage that resists burning with increased temperature and sunlight, and moderately vigorous, compact, dense pyramidal growth habit, is disclosed.

Abstract: A new and distinct cultivar of Anemone plant named ‘APANFARRH’, characterized by its upright and compact plant habit; moderately vigorous growth habit; early and freely flowering habit; single-type flowers that are red purple in color and arranged in tight inflorescences; and good garden performance.

Abstract: A new and distinct Pericallis cultivar named ‘DPRIMBLUBR’ is disclosed, characterized by a very compact and mounded habit with dense branching, early flowering and tolerance for powdery mildew. Additionally all flowers are at the same height. The new variety is a Pericallis, normally produced as an outdoor garden or container plant.

Abstract: A new and distinct Pericallis cultivar named ‘DPRIMFUCHS’ is disclosed, characterized by a very compact and mounded habit and dense branching, early flowers and tolerance to powdery mildew. Additionally all flowers are at the same height. The new variety is a Pericallis, normally produced as an outdoor garden or container plant.

Abstract: A new and distinct Pericallis cultivar named ‘DPRIMDENIM’ is disclosed, characterized by a very compact and mounded habit and dense branching, early flowers and tolerance to powdery mildew. Additionally all flowers are at the same height. The new variety is a Pericallis, normally produced as an outdoor garden or container plant.