Abstract: Process for recovering one or both of copper and silver from a sulphidic feed containing iron, arsenic, copper and silver by pressure oxidizing an aqueous feed slurry of the sulphidic feed in a pressure vessel to form a liquid phase containing free sulphuric acid and aqueous copper sulphate, and to precipitate arsenic as solid iron arsenic compounds. The process includes operating the pressure vessel at a sufficiently low solids content to maintain a free acid level below 30 g/L in the liquid phase, and providing sufficient heat to maintain a temperature in the pressure vessel above 200° C. Copper metal is recovered from the liquid phase and/or silver may be recovered from the solids by cyanide leaching without the need for a jarosite destruction step.

Abstract: A process of treating complex sulfide concentrate includes the steps of roasting wet or slurried complex sulfide concentrate in a furnace at a temperature of at least 720° C. to obtain a calcine; smelting the calcine under inert or oxygen free atmosphere in a smelting furnace to obtain a matte, and optionally granulating the matte to obtain a granulated matte.

Abstract: A metal composition that includes a first metal; and a second metal containing a first transition metal element added to a first alloy having a melting point higher than a melting point of the first metal, and the second metal is an alloy capable of producing an intermetallic compound with the first metal.

Abstract: A high-strength dual-scale structure titanium alloy, a preparation method therefor, and an application thereof, belonging to the technical field of alloy processing. The composition system of the titanium alloy is Ti—Nb—Cu—Co—Al, the atomic percentage of the various elements being 58˜70% Ti, 9˜16% Nb, 4˜9% Cu, 4˜9% Co, and 2˜8% Al. The microstructure comprises a dual-scale coexistence of micro-crystal isometric bcc ?-Ti and ultra-fine crystal isometric bcc ?-Ti, and a dual-scale coexistence of micro-crystal strip fcc CoTi2 and ultra-fine crystal isometric fcc CoTi2, or an ultra-fine crystal strip fcc CoTi2 twin crystal is distributed along a boundary of a dual-scale substrate, the dual-scale substrate being a nano needle-shaped martensite ?? phase dispersed within micro-crystal bcc ?-Ti. The mechanical properties of the titanium alloy are significantly improved, and the titanium alloy may be used in fields such as aerospace and aviation, weaponry and sports equipment.

Abstract: Provided are a nickel-base alloy having high high-temperature strength, a turbine blade using same, and a method for producing an injection molded article of the nickel-base alloy. The nickel-base alloy contains: at least one metal element from among chrome, molybdenum, and niobium; nickel; aluminum; and carbon. The nickel-base alloy comprises a plurality of crystal grains and a plurality of precipitates. The areas between the individual crystal grains in the nickel-base alloy, i.e., the boundaries of the individual crystal grains serve as crystal grain boundaries. The crystal grains are crystals in which nickel is the primary component. The precipitates are precipitated on the crystal grain boundaries. The precipitates are carbides comprising: at least one metal element from among chrome, molybdenum, and niobium; and carbon. The carbides have a diameter of 0.1-10 ?m and an aspect ratio of 3 or more.

Abstract: An aluminum alloy is provided. The aluminum alloy has the following composition: 0.2 to 1.8 wt % of Si, 0.2 to 1.8 wt % of Mg, 0.3 to 2.5 wt % of Mn, 0.2 to 1.5 wt % of Fe, 0.05 to 0.75 wt % of Zr, and 0.03 to 0.18 wt % of Ti. The balance of the alloy is aluminum and impurities. The aluminum alloy may further optionally include one or more of the following elements: a maximum of 0.1 wt % of Cr, a maximum of 0.05 wt % of Cu, 0.2 to 1.8 wt % of Zn, and 0.02 to 0.5 wt % of Er. The aluminum alloy may further optionally include 0.01 to 0.2 wt % of a grain refiner containing Ti and B. The alloy is suitable for the production of components having elevated heat stability, especially for the production of components for the automobile industry, by extrusion, forging or casting in permanent molds.

Abstract: A high-strength aluminum alloy coating. The coating includes aluminum, 9R phase, fine grains, nanotwins, stacking faults, and a solute capable of stabilizing the 9R phase, the fine grains, and the stacking faults. A method of making a high-strength aluminum alloy coating on a substrate. The method includes, depositing the constituents of an aluminum alloy on a substrate such that the deposit forms a high-strength aluminum alloy coating containing 9R phase, fine grains, nanotwins, and stacking faults. A high-strength deformation layer in and on a casting of an aluminum alloy containing 9R phase, fine grains, nanotwins, stacking faults, and a solute capable of stabilizing the PR phase, the fine grains, and the stacking faults. A method of making a high-strength deformation layer in and on a casting of an aluminum alloy by deforming the alloy such that deformation layer contains 9R phase, fine grains, nanotwins, and stacking faults.

Abstract: An aluminum alloy including aluminum, about 2.5 to about 17.4 weight percent by weight magnesium, about 50 to about 3000 ppm calcium, and at least one of chromium up to about 0.2 percent by weight, zirconium up to about 0.2 percent by weight and manganese up to about 0.3 percent by weight.

Abstract: The present invention relates to an Al—Zn—Cu alloy comprising: 18 to 50 parts by weight of zinc; 0.05 to 5 parts by weight of copper; and the rest being aluminum, based on the total weight of the alloy, wherein a tensile strength is 230 to 450 MPa and an elongation is 2.75 to 10% in the cast state. According to the present invention, it is possible to provide an Al—Zn—Cu alloy having improved casting property, strength and elongation at the same time.

Abstract: An as-rolled type K55 electric resistance welded oil well pipe includes, in terms of % by mass, 0.30 to 0.50% of C, 0.05 to 0.40% of Si, 0.50 to 1.20% of Mn, 0 to 0.030% of P, 0 to 0.020% of S, 0.002 to 0.080% of Al, 0 to 0.0080% of N, 0 to 0.30% of Cu, 0 to 0.30% of Ni, 0 to 0.30% of Cr, 0 to 0.10% of Mo, 0 to 0.10% of V, 0 to 0.050% of Nb, 0 to 0.030% of Ti, 0 to 0.0100% of Ca, and the balance being Fe and impurities. In the pipe, a metallographic structure at a position of ¼ of a pipe thickness in an L cross-section at a base metal 90° position is a ferrite-pearlite structure in which prior ?-grains are flattened, includes grain boundary ferrite and intragranular ferrite, and has a rate of a total area of the grain boundary ferrite and the intragranular ferrite, of 10 to 30%.

Abstract: A high-strength multi-phase steel having minimum tensile strengths of 750 M:Pa and preferably having a dual-phase microstructure for a cold- or hot-rolled steel strip, in particular for lightweight vehicle construction is disclosed. The high-strength multi-phase steel has improved forming properties and a ratio of yield point to tensile strength of at most 73%. The high-strength multi-phase steel includes in mass %: C?0.075 to ?0.105; Si?0.600 to ?0.800; Mn?1.000 to ?0.700; Cr?0.100 to ?0.480; Al?0.010 to ?0.060; N 0.0020?0.0120; S?0.0030; Nb?0.005 to ?0.050; Ti?0.0050 to ?0.050; B?0.0005 to ?0.0040; Mo?0.200; Cu?0.040%; Ni?0.040 % the remainder iron, including typical elements accompanying steel that are not mentioned above, which represent contamination resulting from smelting.

Abstract: Disclosed is a manufacturing method for a seawater-resistant stainless clad steel including a cladding material made of stainless steel having a pitting index represented by Cr[mas %]+3.3Mo[mass %]+16N[mass %], of 35.0 or more and a microstructure in a surface portion thereof including, by area ratio, less than 2.0% of a ? phase. The method including the steps of performing a mechanical treatment from at least one of grindstone polishing and belt polishing and performing at least one of an electrolytic treatment in acid solutions or in neutral salt solutions, and a pickling treatment, to manufacture the stainless clad steel having dynamic friction coefficients in the rolling direction and in a direction at a right angle to the rolling direction, determined in accordance with JIS K 7125, both of 0.05 or less.

Abstract: An aluminum alloy including aluminum, about 6 to about 17.4 weight percent by weight magnesium, and at least one of chromium up to about 0.2 percent by weight, zirconium up to about 0.2 percent by weight and manganese up to about 0.3 percent by weight.

Abstract: An aspect of the present invention is a production method of a rolled sheet for cold-rolling, the method being characterized by including: a hot-rolling step for forming a rolled sheet by hot-rolling a pure titanium material while coiling; and an annealing step for annealing the hot-rolled sheet after the hot-rolling step, the coiling temperature in the hot-rolling step being 500° C. or less, and the annealing step being controlled so that the percentage area of recrystallized grains in the microstructure of the hot-rolled sheet after annealing is at least 90% and the mean grain size of the recrystallized grains is 5 ?m to 10 ?m.

Abstract: Provided are spraying powder that can suppress a decrease in the machinability of the resulting sprayed coating even under a high-temperature environment, and a method for depositing a sprayed coating using the same. The spraying powder is spraying powder for depositing a sprayed coating with an abradable property. The spraying powder includes NiCr-based alloy particles and h-BN particles. A NiCr-based alloy of the NiCr-based alloy particles contains 2 to 10 mass % of Si, and the content of the h-BN particles in the spraying powder is 4 to 8 mass %.

Abstract: A fully-dense, fluid tight, low friction coating system is described that is characterized by fluid impermeability and a reduced coefficient of friction. The coating system includes a fully dense, fluid tight underlying layer; and a low friction layer. Unlike conventional materials requiring a sealant, the coating systems of the present invention achieves better fluid tightness and maintains said fluid tightness along one or more sealing surfaces at higher service temperatures and service pressures than previously attainable. The constituents of the fully-dense, fluid tight, low friction coating system are physically and chemically compatible so as to not adversely impact lubricity, wear resistance and corrosion resistance during the service life of a component coated with the fully-dense, fluid tight, low friction coating system.

Abstract: The purpose is providing a vapor deposition mask with high rigidity which can evaporate a uniform thickness film. A vapor deposition mask including a mask body having a main opening, a side surface of the main opening, an upper surface intersecting the side surface, and a lower surface opposing the upper surface, a first insulator contacting the lower surface, and a second insulator contacting the upper and side surfaces, wherein the first insulator includes a first region inside the main opening, and a first opening in the first region, the second insulator includes a second region inside the main opening, and a second opening in the second region, the mask body is sandwiched between the first and second insulators, and one of the first and second insulators includes a region located inside the main opening more centrally than the other and not overlapping with the other and the mask body.

Abstract: According to the present disclosure, a process includes transporting of a foil structure in a coating region in a vacuum chamber, wherein the foil structure has a thickness of less than 40 ?m; and coating the foil structure by physical vapor deposition, which includes forming a gaseous coating material in the coating region; wherein the gaseous coating material includes carbon, such that a protective layer is formed that includes a carbon microstructure covering more than about 50% of the foil structure and having a fraction of pores or voids less than about 50%.

Abstract: To provide a ferroelectric film having improved uniformity in the composition of the film surface and the composition of the entire film, or a manufacturing method thereof. An aspect of the present invention is a ferroelectric film including a ferroelectric coated and sintered crystal film; and a ferroelectric crystal film formed on the ferroelectric coated and sintered crystal film, by a sputtering method, wherein the ferroelectric coated and sintered crystal film is formed by coating a solution having a metal compound containing, in an organic solvent, all of or a part of constituent metals of the ferroelectric crystal film and a partial polycondensation product thereof and by heating the same to be crystallized.

Abstract: An evaporation system is disclosed, inclueding a feeding device, an evaporation device, and a storage device, wherein the feeding device comprises a feeding device housing which defines a feeding space; a feeding port which is arranged on the feeding device housing; a discharge port which is arranged on the feeding device housing and is away from the feeding port; and a propelling unit which is at least partially embedded in the feeding space, and is configured to push a raw material in the feeding space to move from the feeding port to the discharge port; wherein the evaporation device is connected with the feeding device; and wherein the storage device is connected with the feeding port of the feeding device.

Abstract: The present disclosure provides an impregnation method that includes the steps of providing a workpiece to be impregnated, placing the workpiece in a bath of impregnating agent inside a vessel, and oscillating movement of a vibrating body inside the vessel during an impregnation period. The vibrating body creates oscillating pressure changes inside the bath by acting on the bath. the method further includes removing the workpiece from the bath after the impregnation period.

Abstract: A crucible, an evaporation device and an evaporation system are provided in embodiments of the disclosure, the crucible comprising a crucible body, which defines therein an accommodation chamber which is configured to accommodate a material to be heated, and the crucible further comprises a collector, which is located in the accommodation chamber and configured to collect impurities produced during an evaporation in the crucible and opens towards an upper portion of the accommodation chamber facing away from a bottom of the crucible body.

Abstract: A film formation apparatus is configured so as to be equipped with: a film-forming chamber for forming a thin film using plasma on a substrate at a film formation position; an abnormal discharge-detecting section for detecting an abnormal discharge of the plasma; an imaging device for imaging abnormal plasma, which is the plasma when an abnormal discharge is detected, or an abnormal substrate surface, which is the substrate surface on which a thin film is formed when an abnormal discharge is detected; and a storage unit for storing the images taken by the imaging device.

Abstract: A vapor deposition method for depositing different vapor deposition materials onto a vapor deposition target provided in a chamber is disclosed. A first vapor deposition material is heated, via a first heater, for a predetermined period for increasing a temperature of the first vapor deposition material. Based on the increased heat, vapor of the first vapor deposition material is ejected from a first vapor deposition source towards the vapor deposition target. After the predetermined period has elapsed and via a second heater, the second vapor deposition material is heated for increasing a temperature of a second vapor deposition material. Based on the increased heat, vapor of the second vapor deposition material is ejected from a second vapor deposition source towards the vapor deposition target. The first vapor deposition material contains an organic functional material, and the second vapor deposition material contains a metal material.

Abstract: A method of creating a layer of a target deposit-material, in a first target pattern, on a substrate surface. The substrate surface is placed in a vacuum and exposed to a first chemical vapor, having precursor molecules for a seed deposit-material, thereby forming a first substrate surface area that has adsorbed the precursor molecules. Then, a charged particle beam is applied to the first substrate surface area in a second target pattern, largely identical to the first target pattern thereby forming a seed layer in a third target pattern. The seed layer is exposed to a second chemical vapor, having target deposit-material precursor molecules, which are adsorbed onto the seed layer. Finally, a laser beam is applied to the seed layer and neighboring area, thereby forming a target deposit-material layer over and about the seed layer, where exposed to the laser beam.

Abstract: An apparatus and method for graphene film synthesis. The apparatus includes a quasi-enclosed substrate holder which includes one open side, a cap disposed over the one open side of the quasi enclosed substrate holder, and a substrate for graphene film synthesis located inside the quasi enclosed substrate holder. The method includes placing a substrate for graphene film synthesis inside of a quasi-enclosed substrate holder and generating a graphene film on the substrate via chemical vapor deposition, wherein the quasi enclosed substrate holder includes one open side and a cap disposed over the open side of the quasi enclosed substrate holder.

Abstract: Systems and methods for forming films on the surface of a substrate are described. The systems possess aerosol generators which form droplets from a liquid solution made from a solvent and a deposition precursor. A carrier gas may be flowed through the liquid solution and push the droplets toward a substrate placed in a substrate processing region. The droplets pass into the substrate processing region and chemically react with the substrate to form films. The temperature of the substrate may be maintained below the boiling temperature of the solvent during film formation. The solvent imparts a flowability to the forming film and enable the depositing film to flow along the surface of a patterned substrate during formation prior to solidifying. The flowable film results in bottom-up gapfill inside narrow high-aspect ratio gaps in the patterned substrate.

Abstract: In accordance with an exemplary embodiment, a substrate processing apparatus includes: a tube assembly having an inner space in which substrates are processed and assembled by laminating a plurality of laminates, each of which includes an injection part and an exhaust hole; a substrate holder configured to support the plurality of substrates in a multistage manner in the inner space; a supply line connected to one injection part of the plurality of laminates to supply a process gas; and an exhaust line connected to one of a plurality of exhaust holes to exhaust the process gas, and the substrate processing apparatus that has a simple structure and induces a laminar flow of the process gas to uniformly supply the process gas to a top surface of the substrate.

Abstract: Embodiments described herein include a susceptor for semiconductor processing including an oriented graphite plate that may have a thickness of at least 1 mm. The susceptor may have a support member, and the oriented graphite plate may be disposed on the support member. The support member may have a center thermal conduit and an edge thermal conduit, and may be substantially solid between the center thermal conduit and the edge thermal conduit.

Abstract: The present disclosure relates to a substrate processing apparatus and a substrate processing method using the same, the substrate processing method including: introducing a substrate into a chamber; processing the substrate while heating the substrate by using a heat source unit provided in the chamber; and reciprocating at least any one of the substrate and the heat source unit in an extending direction of the substrate. Thus, while the substrate is processed, the temperature of the substrate may be uniformly adjusted, and the efficiency of thermal processing of the substrate may thereby be improved.

Abstract: A non-line-of-sight (NLOS) coating process is provided for a substrate having first and second transverse surfaces where the second surface lacks a LOS for depositional processing. The NLOS coating process includes electroplating or electroless plating a crack-resistant interlayer coating to at least the second surface and applying a wear-resistant coating to the crack-resistant interlayer coating by electrolytic or electroless plating.

Abstract: An object of the present, invention is to provide a chemical conversion surface, treatment solution, that is capable of forming a chemical conversion film with excellent corrosion resistance and designability on articles having aluminum or aluminum alloy surfaces by using steps similar to those of known chemical conversion treatments without using hexavalent chromium, trivalent chromium, fluorine, or other components that create a significant burden on the environment. The present invention relates to a chemical conversion treatment solution for aluminum or aluminum alloys, comprising an alkaline aqueous solution containing a permanganic acid compound and at least one metal oxygen acid compound selected from the group consisting of vanadic acid compounds, molybdic acid compounds, tungstic acid compounds, zirconic acid compounds, and niobic acid compounds.

Abstract: A laminate includes: a substrate made of a metal or an alloy having a Vickers hardness of 120 HV or more and having irregularities on a surface of the substrate; and a film made of a metal or an alloy and formed on the surface of the substrate. The film forms metal bonding with the substrate.

Abstract: Various examples described herein provide for a substrate, or a method for preparing a substrate, including an aluminum layer and an anodized layer over a substrate. For instance, the substrate may comprise a substrate, a continuous aluminum layer formed over the substrate, and an anodized layer formed over the continuous aluminum layer.

Abstract: Provided is an etchant composition for a multilayered metal film comprising both a layer comprising copper and a layer comprising molybdenum, the etchant composition: being capable of etching en bloc a multilayered metal film comprising a layer constituted of copper or an alloy including copper as the main component and a layer constituted of molybdenum or an alloy including molybdenum as the main component; being effective in preventing the molybdenum layer from being undercut; making it easy to regulate the component concentrations so as to accommodate the cross-sectional shape control and cross-section; and being stable. Also provided are a method of etching using the etchant composition and a method for prolonging the life of the etchant composition.

Abstract: The present invention provides an etching liquid composition consisting of an aqueous solution that contains (A) 0.1 to 30 mass % of at least one type of oxidizing agent selected from among ferric ions and cupric ions; (B) 0.1 to 20 mass % of hydrogen chloride, and an etching method using it.

Abstract: The invention relates to a corrosion protection arrangement comprising an adhesive layer (11). The adhesive layer (11) contains at least one volatile corrosion inhibitor (12). The adhesive layer (11) sticks to a surface (23). The adhesive layer (11) bonds an outer layer (13) to the surface (23). The outer layer (13) has a multitude of orifices (14) for release of the volatile corrosion inhibitor (12). The outer layer (13) has protuberances (15) which project out of a plane (16) of the outer layer (13) by a height (17).

Abstract: A method of producing a cold rolled steel strip includes: subjecting a steel strip that has been cold rolled and subsequently continuously annealed to pickling by continuously feeding the steel strip into a mixed acid solution containing a first acid that is oxidizing and a second acid that is non-oxidizing to immerse the steel strip; and subsequently subjecting the steel strip to repickling by continuously feeding the steel strip into an acid solution containing a third acid that is non-oxidizing to immerse the steel strip. The concentration of the first acid in the mixed acid solution is lowered and the concentration of the second acid in the mixed acid solution is raised as the iron ion concentration in the mixed acid solution rises.

Abstract: A filter press device for electrolytic production of metal for electrodeposition of metal from solutions, constructed from a plurality of cells connected electrically and hydraulically in series. Each has alternating frames and ion-exchange membranes to form alternating anode and cathode compartments, allowing the free path of liquid. Anolyte or catholyte passes through each compartment. The electrolyzed product is discharged from the compartment in the form of metal or a metallic compound. The electrodes are designed with a vertical base plate acting as an anode with the respective anolyte in a cell unit and in the other, acting as a cathode with the respective catholyte in the adjacent cell unit. Completed the production cycle, the device is stopped, the cell is opened, allowing the metal deposition electrodes, cathodes, can be removed and replaced to start a new productive cycle or remain in place with automatic detachment of metal product.

Abstract: Systems and methods for basic leaching are provided. In various embodiments, a method is provided comprising leaching a slurry comprising a copper bearing material and an ammonia leach medium, adding copper powder to the slurry, separating the slurry into a pregnant leach solution and solids, and performing a solvent extraction on the pregnant leach solution to produce an loaded aqueous stream.

Abstract: Provided is a high purity tin (Sn) having an extremely low oxygen content. A high purity tin having a tin purity of 5N (99.999% by mass, provided that carbon, nitrogen, oxygen and hydrogen are excluded) or more, wherein the high purity tin has an oxygen content of less than 10 ppb by mass, as measured by elemental analysis using Dynamic-SIMS.

Abstract: Various examples are provided for vertically aligned ultra-high density nanowires and their transfer onto flexible substrates. In one example, a method includes forming a plurality of vertically aligned nanowires inside channels of an anodized alumina (AAO) template on an aluminum substrate, where individual nanowires of the plurality of vertically aligned nanowires extend to a distal end from a proximal end adjacent to the aluminum substrate; removing the aluminum substrate and a portion of the AAO template to expose a surface of the AAO template and a portion of the proximal end of the individual nanowires; depositing an interlayer on the exposed surface of the AAO template and the exposed portion of the individual nanowires; and removing the AAO template from around the plurality of vertically aligned nanowires embedded in the interlayer.

Abstract: The present disclosure relates to a copper foil that exhibits surprising low repulsive force characteristics; and to methods for manufacturing such copper foils. Typically, the copper foil has (a) a lightness L* value of the nodule untreated side, based on the L*a*b color system, in the range of 75 to 90 and (b) a normal tensile strength in the range of 40 kgf/mm2 to 55 kgf/mm2. The disclosure further relates to flexible printed circuit boards and electronic devices using the above-mentioned copper foils for forming conductive lines therein.

Abstract: The present disclosure relates to a copper foil that exhibits surprising low repulsive force characteristics; and to methods for manufacturing such copper foils. Typically, the copper foil has (a) a lightness L* value of the nodule untreated side, based on the L*a*b color system, in the range of 75 to 90 and (b) a normal tensile strength in the range of 40 kgf/mm2 to 55 kgf/mm2. The disclosure further relates to flexible printed circuit boards and electronic devices using the above-mentioned copper foils for forming conductive lines therein.

Abstract: [Problem] To provide a conductive member capable of suppressing an increase in contact resistance, and a production method therefor. [Solution] To solve the problem by providing a conductive member having a Ni plating layer 3 on the surface of contact parts 2 provided on a substrate 1, an arithmetic average roughness Sa of the surface of the Ni plating layer 3 being 20 nm or more. In the Ni plating layer 3, the full width half maximum of a peak at the position of a Ni (200) plane in an x-ray diffraction diagram is preferably 0.6 or less, and an indentation hardness HIT of the Ni plating layer 3 is preferably 5000 n/mm2 or less.

Abstract: The present invention deals with a process for deposition of indium or indium alloys and an article obtained by the process, wherein the process includes the steps i. providing a substrate having at least one metal or metal alloy surface; ii. depositing a first indium or indium alloy layer on at least one portion of said surface whereby a composed phase layer is formed of a part of the metal or metal alloy surface and a part of the first indium or indium alloy layer; iii. removing partially or wholly the part of the first indium or indium alloy layer which has not been formed into the composed phase layer; iv. depositing a second indium or indium alloy layer on the at least one portion of the surface obtained in step iii. v.

Abstract: A method for treating a surface of a brush holder apparatus, where the brush holder apparatus is configured for use in a dynamoelectric machine, includes an electropolishing step that electropolishes the surface of the brush holder apparatus. An anodizing step anodizes the surface of the brush holder apparatus. The electropolishing step is performed before the anodizing step.

Abstract: In a processing system for electroplating semiconductor wafers and similar substrates, the contact ring of the electroplating processor is removed from the rotor of the processor and replaced with a previously deplated contact ring. This allows the contact ring to be deplated in ring service module of the system, while the processor continues to operate. Wafer throughput is improved. The contact ring may be attached to a chuck for moving the contact ring between the processors and the ring service module, with the chuck quickly attachable and releasable to the rotor.

Abstract: Forming a transition zone terminated superconformal filling in a recess includes: providing an electrodeposition composition including: a metal electrolyte including a plurality of metal ions, solvent, and suppressor; providing the article including: a field surface and the recess that includes a distal position and a proximate position; exposing the recess to the electrodeposition composition; potentiodynamically controlling an electric potential of the recess with a potential wave form; bifurcating the recess into an active metal deposition region and a passive region; forming a transition zone; decreasing the electric potential of the recess by the potential wave form; progressively moving the transition zone closer to the field surface and away from the distal position; and reducing the metal ions and depositing the metal in the active metal deposition region and not in the passive region to form the transition zone terminated superconformal filling in the recess of the substrate.

Abstract: Instead of the renewal or purification of copper sulfate plating solutions performed based on the increase of defective products as an ex post facto measure or the empirical determination, a technique capable of managing copper sulfate plating solutions by assessing the aging of the copper sulfate plating solutions in an objective manner is provided. A method for managing a copper sulfate plating solution used for performing copper sulfate plating for a material to be plated, the method containing: measuring a concentration of impurities in the copper sulfate plating solution; and assessing aging of the copper sulfate plating solution from the concentration of the impurities.