Abstract: A solar photovoltaic module laminate for electric power generation is provided. A plurality of solar cells are embedded within module laminate and arranged to form at least one string of electrically interconnected solar cells within said module laminate. A plurality of power optimizers are embedded within the module laminate and electrically interconnected to and powered with the plurality of solar cells. Each of the distributed power optimizers capable of operating in either pass-through mode without local maximum-power-point tracking (MPPT) or switching mode with local maximum-power-point tracking (MPPT) and having at least one associated bypass switch for distributed shade management.

Abstract: A method comprises providing an expanded metal article having a plurality of first segments intersecting a plurality of second segments thereby forming a plurality of openings. The expanded metal article has a surface comprising a plurality of solder pads. A semiconductor material with a top surface and a bottom surface is provided, the bottom surface having a plurality of silver pads and the top surface serving as a light-incident surface of the photovoltaic cell. At a plurality of soldering locations, a majority of the plurality of solder pads on the surface of the expanded metal article is electrically coupled with the plurality of silver pads on the bottom surface of the semiconductor material. Also disclosed is a photovoltaic cell resulting from this method.

Abstract: A solar cell module includes a plurality of solar cells including a first solar cell and a second solar cell adjacent to each other, wherein each of the plurality of solar cells including at least one first current collector and at least one second current collector, wherein the at least one first current collector and the at least one second current collector being positioned on a non-light incident surface of each of the plurality of solar cells, which is opposite to a light incident surface of each of the plurality of solar cells, an insulating film having a conductive pattern part positioned on the insulating film, wherein the conductive pattern part including a first pattern which is connected to the at least one first current connector 161 of the plurality of solar cells and a second pattern which is connected to the at least one second current connector of the plurality of solar cells, wherein the first pattern being spaced apart from the second pattern; and an insulating sheet between the an insulatin

Abstract: Methods, systems, and devices are disclosed for photoconductive switch package configurations. In some aspects, a photoconductive switch package includes of a wide bandgap photoconductive material (e.g., GaN, ZnO, diamond, AlN, SiC, BN, etc.), a source for energetic photons (e.g., a laser), a mechanism to couple the laser into the switch, and a mechanism for high voltage to enter and leave the switch package. In some implementations, the disclosed photoconductive switch packages can be configured as a three terminal device, e.g., similar to transistors, with one of the terminals being laser input or the voltage input to the laser system.

Abstract: An object is to provide a semiconductor device including a thin film transistor with excellent electrical characteristics and high reliability and a method for manufacturing the semiconductor device with high mass productivity. A main point is to form a low-resistance oxide semiconductor layer as a source or drain region after forming a drain or source electrode layer over a gate insulating layer and to form an oxide semiconductor film thereover as a semiconductor layer. It is preferable that an oxygen-excess oxide semiconductor layer be used as a semiconductor layer and an oxygen-deficient oxide semiconductor layer be used as a source region and a drain region.

Abstract: The present invention discloses a transferring method, a manufacturing method, a device and an electronics apparatus of micro-LED. The method for transferring micro-LEDs comprises: forming a mask layer on the backside of a laser-transparent original substrate, wherein micro-LEDs are formed on the front-side of the original substrate; bringing the micro-LEDs on the original substrate in contact with preset pads on a receiving substrate; and irradiating the original substrate from the original substrate side with laser through the mask layer, to lift-off micro-LEDs from the original substrate.

Abstract: An optoelectronic semiconductor chip (1) is provided which has a semiconductor body comprising a semiconductor layer sequence (2) with an active region (20) provided for generating and/or receiving radiation, a first semiconductor region (21) of a first conduction type, a second semiconductor region (22) of a second conduction type and a cover layer (25). The active region (20) is arranged between the first semiconductor region (21) and the second semiconductor region (22) and comprises a contact layer (210) on the side remote from the active region. The cover layer (25) is arranged on the side of the first semiconductor region (21) remote from the active region (20) and comprises at least one cut-out (27), in which the contact layer (210) adjoins the first connection layer (3). The cover layer is of the second conduction type. Furthermore, a method is provided for producing optoelectronic semiconductor chips.

Abstract: A light emitting diode includes: a substrate; a semiconductor stack disposed on the substrate and including a lower semiconductor layer, an upper semiconductor layer and an active layer interposed between the lower semiconductor layer and the upper semiconductor layer, the semiconductor stack having an isolation groove exposing the substrate through the upper semiconductor layer, the active layer and the lower semiconductor layer; a first electrode pad and an upper extension portion electrically connected to the upper semiconductor layer; a second electrode pad and a lower extension portion electrically connected to the lower semiconductor layer; a connecting portion connecting the upper extension portion and the lower extension portion to each other across the isolation groove; a first current blocking layer interposed between the lower extension portion and the lower semiconductor layer; and a second current blocking layer interposed between the second electrode pad and the lower semiconductor layer.

Abstract: A light-emitting device comprises a substrate having a top surface and a plurality of patterned units protruding from the top surface; and a light-emitting stack formed on the substrate and having an active layer with a first surface substantially parallel to the top surface, wherein one of the plurality of patterned units comprises a plurality of connecting sides constituting a first polygon shape in a top view of the light-emitting device, wherein the one of the plurality of patterned units comprises a vertex and a plurality of inclined surfaces respectively extending from the plurality of connecting sides, the plurality of inclined surfaces commonly joining at the vertex in a cross-sectional view of the light-emitting device, the vertex being between the top surface of the substrate and the first surface of the active layer, and the plurality of inclined surfaces comprises a second polygon shape in the cross-sectional view of the light-emitting device.

Abstract: A lateral light emitting diode device includes: a substrate; an n-type GaN layer disposed on the substrate; an activation layer disposed on the n-type GaN layer; a p-type GaN layer disposed on the activation layer; a current spreading layer disposed on the p-type GaN layer; a p-electrode disposed on the current spreading layer; a MESA region formed by removing portions of the current spreading layer, the p-type GaN layer, the activation layer, and the n-type GaN layer; a transparent window layer disposed on the n-type GaN layer in the entire or part of the MESA region; a plurality of contact plugs which is in contact with the n-type GaN layer through the transparent window layer; and an n-electrode disposed on the transparent window layer to connect the plurality of contact plugs to each other.

Abstract: An LED die includes a luminescent sapphire layer affixed to LED semiconductor layers. The luminescent sapphire absorbs a portion of the primary light and down-converts the primary light to emit secondary light. A phosphor layer may be added. The luminescent sapphire may comprise luminescent sapphire particles in a binder forming a mixture deposited over the LED semiconductor layers. Alternatively, the luminescent sapphire comprises a pre-formed tile that is affixed over the LED semiconductor layers. Alternatively, the luminescent sapphire comprises a luminescent sapphire growth substrate on which is epitaxially grown the LED semiconductor layers. After the LED die is formed, the luminescent characteristics of the sapphire may be adjusted using optical conditioning and/or annealing to tune the die's overall emission.

Abstract: A package, includes a cup-shaped resin component having a bottom surface and side walls that surround the bottom surface, an opening which is opened at an upper part of the side walls, a pair of leads exposed on part of the bottom surface, and a reflective film, the resin component having a 3-D shape defined by an X axis, a Y axis and a Z axis, the outer surface of the side walls that has a recess which is recessed in the Z axis direction and arranged in a position corresponding to the opening, and the reflective film being disposed in the recess.

Abstract: A semiconductor device directly joins electrodes of a semiconductor element to electrodes of a metal substrate and has good yield, connection reliability, good mass productivity, and superior heat dissipation efficiency. A method for producing the semiconductor device that directly joins the electrodes of the metal substrate to the electrodes of the semiconductor element includes forming an electrode separating groove in an element mounting position on a main surface of the metal substrate at a predetermined depth. The semiconductor element is mounted to extend over the electrode separating groove. The metal substrate is ground from a surface reverse to the main surface of the metal substrate up to a position reaching the electrode separating groove.

Abstract: A piezoelectric thin film contains potassium sodium niobate represented by general formula (K1-xNax)NbO3 and CaTiO3, wherein the lattice spacing calculated from the diffraction peak of the (001) plane in an X-ray diffraction profile of the piezoelectric thin film is 3.975 ? or less, and the ratio I101/I001 of the diffraction peak intensity I101 of the (101) plane to the diffraction peak intensity I001 of the (001) plane in the X-ray diffraction profile of the piezoelectric thin film 3 satisfies the relationship log10(I101/I001)??2.10.

Abstract: A piezoelectric element includes a first electrode, a second electrode, and a thin piezoelectric layer. The thin piezoelectric layer is provided between the first electrode and the first electrode, and is formed of a perovskite type compound oxide which contains potassium, sodium, and niobium. In the piezoelectric layer, in an X-ray diffraction pattern obtained by ??2? measurement, peaks derived from a (002) plane and a (200) plane are provided in a range in which 2? is from 45° to 47°, a peak position of the peak on a high angle side among the peaks satisfies 46.0°?2??46.5°, and a difference of 2? between the peak on the high angle side and the peak on a low angle side is greater than 0.60°.

Abstract: A piezoelectric/electrostrictive material is composed of Mn and a compound of Pb(Zn, Nb)O3—Pb(Ni, Nb)O3—Pb(Zr, Ti)O3. A ratio of a molar amount of Mn relative to a sum of respective molar amounts of Ni, Zn, Ti, Zr, Nb and Mn is at least 0.001 to no more than 0.015. A ratio of a molar amount of Nb relative to a sum of respective molar amounts of Ni and Zn is at least 2.007 to no more than 2.125.

Abstract: A manufacturing method of an epitaxial thin film piezoelectric element includes: providing a substrate; forming a bottom electrode layer on the substrate by epitaxial growth process; forming a first piezoelectric layer that has c-axis orientation on the bottom electrode layer by epitaxial growth process; forming a second piezoelectric layer that has c-axis orientation and different phase structure from the first piezoelectric layer on the first piezoelectric layer by epitaxial growth process; and forming a top electrode layer on the second piezoelectric layer. The thin film piezoelectric element has good thermal stability, low temperature coefficient and high piezoelectric constant.

Abstract: A magnetoresistive random access memory (MRAM) structure includes a bottom electrode structure. A magnetic tunnel junction (MTJ) element is over the bottom electrode structure. The MTJ element includes an anti-ferromagnetic material layer. A ferromagnetic pinned layer is over the anti-ferromagnetic material layer. A tunneling layer is over the ferromagnetic pinned layer. A ferromagnetic free layer is over the tunneling layer. The ferromagnetic free layer has a first portion and a demagnetized second portion. The MRAM also includes a top electrode structure over the first portion.

Abstract: There is provided an workpiece etching method executed in manufacturing a magneto-resistive effect element, the workpiece including first and second multilayer films, the first multilayer film including first and second magnetic layers and a tunnel barrier layer formed between the first and second magnetic layers, and the second multilayer film being a multilayer film constituting a pinning layer in the magneto-resistive effect element. The method includes: etching the first multilayer film; generating plasma of a first gas including hydrocarbon and noble gases inside a chamber of a plasma processing apparatus to etch the second multilayer film inside the chamber; and generating plasma of a second gas including gas containing carbon and oxygen, an oxygen gas and a noble gas and not containing hydrogen inside the chamber to remove a carbon-containing deposit formed on the workpiece in the generating the plasma of the first gas.

Abstract: A conductive-bridging random access memory and a method for fabricating a conductive-bridging random access memory are provided. The conductive-bridging random access memory includes a bottom electrode layer on a semiconductor substrate, an electrical resistance switching layer on the bottom electrode layer, an electron-capturing layer on the electrical resistance switching layer, a barrier layer on the electron-capturing layer, an ion source layer on the barrier layer, and a top electrode layer on the ion source layer. The electron-capturing layer includes electron-capturing material, and the electron affinity of the electron-capturing material is at least 60 KJ/mole.

Abstract: According to one embodiment, a memory device includes a stacked body. The stacked body includes first and second electrodes, and an oxide layer provided between the first and second electrodes. The second electrode includes a semiconductor layer, and a metal-containing region including at least one of first or second metallic element and being provided between at least a portion of the semiconductor layer and at least a portion of the oxide layer. The first metallic element includes at least one selected from Pt, Pd, Ir, Ru, Re, and Os. The second metallic element includes at least one selected Ti, W, Mo, and Ta. The stacked body has first and second states. The first state is obtained by causing a current to flow in the stacked body from the second toward first electrode. The second state is obtained by causing a current to flow from the first toward second electrode.

Abstract: An organic light-emitting device includes: a first electrode; a second electrode facing the first electrode; and an organic layer between the first electrode and the second electrode, wherein the organic layer includes an emission layer including a compound represented by Formula 1: An organic light-emitting device using the compound of Formula 1 may have high efficiency, low voltage, high luminance, and long lifespan.

Abstract: A novel substance with which an increase in life and emission efficiency of a light-emitting element can be achieved is provided. A carbazole compound having a structure represented by General Formula (G1) is provided. Note that a substituent which makes the HOMO level and the LUMO level of a compound in which a bond of the substituent is substituted with hydrogen deep and shallow, respectively is used as each of substituents in General Formula (G1) (R1, R2, Ar3, and ?3). Further, a substituent which makes the band gap (Bg) and the T1 level of a compound in which a bond of the substituent is substituted with hydrogen wide and high is used as each of the substituents in General Formula (G1) (R1, R2, Ar3, and ?3).

Abstract: Novel iridium complexes with 5-member heteroaryl ring fused quinoline ligands are disclosed. These complexes are useful as phosphorescent emitters in OLEDs with improved emission properties.

Abstract: The invention refers to quantum dots (QDs) composite particles and their preparation method, photoelectric elements and photoelectric equipment. The preparation method of QDs composite particles comprises: coating the surface of metal nanoparticles (MNPs) with silica; modifying the silica coated MNPs through amination to make the surface of the silica have amino functional groups; and combining the carboxyl-functionalized QDs with amino-functionalized silica coated MNPs, thereby preparing the QDs composite particles. The preparation method can enhance the fluorescent efficiency of QDs.

Abstract: An electrically conductive OLED carrier includes in this order a glazing substrate; an electrode arranged in a metal grid made up of strands; an electrically insulating light extraction layer under the metal grid; and a layer partially structured in its thickness. The layer of refractive is of index n3 of 1.7 to 2.3, and is located on the light extraction layer. The partially structured layer is formed from a region structured with cavities at least partially containing the metal grid; and from another region, called the low region, located on the light extraction layer. The separation H between the surface of the structured region called the high surface, and therefore that furthest from the substrate, and the surface of the metal grid called the upper surface, and therefore that furthest from the substrate is, in absolute value, smaller than or equal to 100 nm.

Abstract: The present invention provides a double-sided organic lighting emitting diode (OLED) display device, which comprises a first display element, a second display element, a first encapsulation layer, and a second encapsulation layer. The first encapsulation layer extends from one side or two sides of the first baseplate, and curvedly overlaps on the first emitting portion. The second encapsulation layer extends from one side or two sides of the second baseplate, and curvedly overlaps on the second emitting portion. The first encapsulation layer and the second encapsulation layer both are closely encapsulated with at least one of the first baseplate and the second baseplate by sealant, respectively.

Abstract: A flexible display panel and a display device are provided. The flexible display panel includes: a first flexible substrate, a second flexible substrate, and an inorganic layer located between the first flexible substrate and the second flexible substrate; where there are a plurality of grooves and/or through-holes in the inorganic layer; and the first flexible substrate contacts the second flexible substrate through the grooves and/or the through-holes. In this way, the grooves and/or the through-holes are arranged in the inorganic layer so that the first flexible substrate can contact with the second flexible substrate through the grooves and/or the through-holes to thereby increase the contact area between the second flexible substrate and the inorganic layer so as to alleviate the risk of the organic layer being stripped off the inorganic layer in the flexible display panel being bent and deformed.

Abstract: An improved switching material for forming a composite article over a substrate is disclosed. A first volume of nanotubes is combined with a second volume of nanoscopic particles in a predefined ration relative to the first volume of nanotubes to form a mixture. This mixture can then be deposited over a substrate as a relatively thick composite article via a spin coating process. The composite article may possess improved switching properties over that of a nanotube-only switching article. A method for forming substantially uniform nanoscopic particles of carbon, which contains one or more allotropes of carbon, is also disclosed.

Abstract: A display device includes a substrate, a semiconductor layer disposed on the substrate, a first insulating layer disposed on the semiconductor layer, a first conductive layer disposed on the first insulating layer and electrically connected to the semiconductor layer via a first contact hole, which is defined through the first insulating layer, a second insulating layer disposed on the first conductive layer, and a second conductive layer disposed on the second insulating layer and electrically connected to the first conductive layer via a second contact hole, which is defined through the second insulating layer, where the first and second contact holes overlap each other, and a residual layer, which includes a portion of the second insulating layer, is disposed in the first contact hole.

Abstract: A multicolor light-emitting element in which light-emitting layers emitting light of different colors are stacked and color adjustment is easily made is provided. A multicolor light-emitting element which is inexpensive and has favorable emission efficiency is provided. A light-emitting element in which at least two light-emitting layers emitting light of different colors are formed in contact with each other and the light emitted from the two light-emitting layers is obtained from exciplexes is provided. In addition, the light-emitting element in which the exciplexes emit delayed fluorescence is provided.

Abstract: An organic light-emitting device includes a substrate, an anode on the substrate, a hole transport region on the anode, an emission layer on the hole transport region, an electron transport region on the emission layer, and a cathode on the electron transport region, wherein the electron transport region includes an electron injection layer including a first material including at least one of a halide of an alkali metal, and a second material including at least one of a lanthanide metal and a alkaline earth metal, and wherein the cathode contacts the electron injection layer and includes a first metal including at least one of silver, gold, platinum, copper, manganese, titanium, cobalt, nickel, and tungsten, and a second metal including at least one of a lanthanide metal and an alkaline earth metal, wherein an amount of the first metal is equal to or greater than that of the second metal.

Abstract: An organic light-emitting diode (OLED) display device and a method of fabricating the same can reduce resistance of a cathode by forming an auxiliary electrode. Also, such OLED display device and method can prevent damage on a pad electrode due to an etchant during patterning of an anode by applying a protective structure to the pad electrode of a pad area and by including the pad electrode exposed from a plurality of pad electrode layers.

Abstract: An exemplary embodiment may provide an organic light emitting diode that includes a first electrode including a concave part or a convex part, an organic light emitting layer disposed on the first electrode, and a second electrode disposed on the organic light emitting layer. Further, the exemplary embodiment may provide an organic light emitting device including the organic light emitting diode.

Abstract: Provided is a display apparatus. The display apparatus includes a display panel, a back cover disposed on a rear side of the display panel, the back cover having a curved shape of which both ends protrude forward, and a fixing part fixing the back cover to maintain the curved shape of the back cover. The display panel is curved in a shape corresponding to that of the back cover.

Abstract: A display device includes a display panel, and a protective member disposed outside the display panel. The circuit layer includes a display area and a non-display area, and a first bending line and a second bending line crossing the first bending line are defined are defined in the non-display area. The non-display area includes: a first non-display area bent from the display area with respect to the first bending line; a second non-display area bent from the display area with respect to the second bending line; and a corner non-display area bent from the second non-display area with respect to the first bending line and bent from the first non-display area with respect to the second bending line. A slit is defined in the protective member, and the slit overlap at least a part of the first bending line and the second bending line.

Abstract: Provided are an encapsulation film, an organic electronic device comprising the same, and a method of manufacturing the organic electronic device. When the organic electronic device is encapsulated using the encapsulation film, an excellent moisture barrier property may be realized, and as reflection or scattering of light is prevented by absorbing and blocking internal or external light, external defects of the organic electronic device may be prevented.

Abstract: An organic light-emitting diode (OLED) display device, a manufacturing method thereof and a display device are disclosed. The OLED device includes: a first substrate; an OLED disposed on the first substrate; at least one encapsulation layer disposed on the OLED; a bonding layer disposed on the at least one encapsulation layer; and a second substrate disposed on the bonding layer. A concave-convex structure is provided on at least one surface of the at least one encapsulation layer. The OLED display device can reduce the damage of moisture and oxygen on the OLED device and improve the moisture and oxygen resistance of the OLED device.

Abstract: The present disclosure relates to an OLED encapsulation method and an OLED encapsulation structure. The OLED encapsulation method combines the frame glue encapsulation technology and the thin film encapsulation technology. By adopting the frame glue to block the organic layer and to limit the dimension of the organic layer, each of the organic layers can be completely covered by the inorganic layer arranged thereon. At the same time, the inorganic layers may be manufactured by the same mask, which reduces the number of the mask so as to reduce the cost. The OLED encapsulation structure combines the frame glue encapsulation technology and the thin film encapsulation technology. By adopting the frame glue to block the organic layer and to limit the dimension of the organic layer, each of the organic layers can be completely covered by the inorganic layer arranged thereon. At the same time, the inorganic layers may be manufactured by the same mask, which reduces the number of the mask so as to reduce the cost.

Abstract: An organic EL display device 1 includes a flexible plastic substrate 10, an organic EL element 4 on the plastic substrate 10, and to sealing film 2 provided on the plastic substrate 10 to cover the organic EL element 4. The sealing film 2 includes a first sealing layer 25 on a surface of the plastic substrate 10, a stress relief layer 26 on a surface of the first sealing layer 25, and a second sealing layer 27 on a surface of the stress relief layer 26. Compressive stress of the first sealing layer 25 is lower than compressive stress of the second sealing layer 27.

Abstract: Methods for forming an OLED device are described. An encapsulation structure having organic buffer layer sandwiched between barrier layers is deposited over an OLED structure. The buffer layer is formed with a fluorine-containing plasma. The second barrier layer is then deposited over the buffer layer. Additionally, to ensure good adhesion, a buffer adhesion layer is formed between the buffer layer and the first barrier layer. Finally, to ensure good transmittance, a stress reduction layer is deposited between the buffer layer and the second barrier layer.

Abstract: An organic EL element including an anode; a light-emitting layer above the anode; a first interlayer on the light-emitting layer, the first interlayer including a fluoride of a first metal that is an alkali metal or alkaline earth metal; a second interlayer on the first interlayer, the second interlayer including a second metal that has a property of cleaving a bond between the first metal and fluorine in the fluoride; a cathode on the second interlayer; and a sorption layer above the cathode, the sorption layer including a third metal that has a property of taking up and holding at least one of moisture and oxygen. A thickness D1 of the first interlayer and a thickness D2 of the second interlayer satisfy 5%?D2/D1?25%.

Abstract: An organic light emitting device includes: a substrate (200), and a first electrode layer (201), a second electrode layer (202), a color conversion layer (206), a first light emitting layer (203), and a second light emitting layer (204) that are stacked on the substrate (200), wherein the first light emitting layer (203) is disposed between the first electrode layer (201) and the second electrode layer (202), the first light emitting layer (203) emits the first emission light under electric excitation; the first electrode layer (201) is a transparent electrode layer, the first color conversion layer (206) is disposed at one side of the first electrode layer (201) away from the second electrode layer (202); the second light emitting layer (204) is disposed between the first light emitting layer (203) and the second electrode layer (202), the second light emitting layer (204) emits the second emission light under electric excitation; and a peak wavelength of the first emission light is larger than a peak wavele

Abstract: A display device includes a light emitting diode disposed on a substrate, a thin film encapsulation layer covering the light emitting diode, a polarization layer disposed on the thin film encapsulation layer. The thin film encapsulation layer includes a plurality of phase retardation layers.

Abstract: A display device includes a substrate, a first electrode, an organic light-emitting layer, a second electrode, a phase matching layer, and at least one light-absorbing layer. The substrate includes a plurality of pixel regions and a non-pixel region. The non-pixel region is arranged between adjacent pixel regions. The first electrode is arranged in each pixel region. The organic light-emitting layer is arranged on the first electrode. The second electrode is arranged on the organic light-emitting layer. The phase matching layer is arranged on the second electrode. The at least one light-absorbing layer is arranged on the phase matching layer. A thickness of the second electrode in the non-pixel region is different than a thickness of the second electrode in the pixel regions.

Abstract: The invention relates to an organic light-emitting component which has an organic functional layer stack (3) having at least one light-emitting layer, which is designed to generate light during operation of the component, a transparent first electrode (2) and a transparent second electrode (4), which are designed to inject charge carriers into the organic functional layer stack (3) during operation, and a heat distribution layer (9), which is applied over the electrodes (2, 4) and the organic functional layer stack (3) and which has at least one plastic layer (10) and a highly heat conductive layer (11), wherein the heat distribution layer (9) has at least one transparent sub-region (91) and at least one non-transparent sub-region (92).

Abstract: Apparatus, systems, and methods described herein relate to the manufacture and use of single pouch battery cells. In some embodiments, an electrochemical cell includes a first current collector coupled to a first portion of a pouch, the first current collector having a first electrode material disposed thereon, a second current collector coupled to a second portion of the pouch, the second current collector having a second electrode material disposed thereon, and a separator disposed between the first electrode material and the second electrode material. The first portion of the pouch is coupled to the second portion of the pouch to enclose the electrochemical cell.

Abstract: A battery is provided with a lid member that closes a case, a collector terminal member having an insert-through part, an insulator that electrically insulates the lid member and the collector terminal member, and a gasket that provides a seal between the lid member and the collector terminal member. The lid member has a protrusion protruding downward in the vertical direction from the bottom. A gasket is in the same position as the protruding section in an inside-outside direction, which is perpendicular to the vertical direction, and has a sealing part pressed by the protruding section. At least one gap exists in the vicinity of the seal section in a different position to the seal section in the inside-outside direction, and at least portions of the gaps are enclosed by the gasket and the collector terminal member.

Abstract: A secondary battery packing case structure is provided, where a first joint portion that protrudes outward and a first embedded block are formed on a side surface of the case, a second joint portion that protrudes outward and a second embedded block are formed on another side surface opposite to the foregoing surface, and the first joint portion and second joint portion of the case are in a diagonally symmetric state, the first embedded block and the second embedded block are in a diagonally symmetric state, and the second connector group of the case may be correspondingly connected to a first connector group of another same case in an inserted manner; and connector groups on two joint portions of the case are respectively electrically connected to two electrodes of an internal battery pack.

Abstract: A battery system for use with outdoor power equipment includes a base including a positive terminal, a negative terminal, and a battery receptacle electrically coupled to the positive terminal and the negative terminal, wherein the positive terminal and the negative terminal are spaced apart by a distance substantially the same as a standard distance between terminals of a standard lead-acid battery, and a lithium-ion battery removably attached to the battery receptacle, wherein when attached, the lithium-ion battery is electrically coupled to the positive terminal and the negative terminal via the battery receptacle.