Abstract: A drawer type circuit breaker comprises a drawer base and a circuit breaker body, wherein the circuit breaker body is rocked into and out of the drawer base, so that a main circuit of the circuit breaker body and the drawer base is switched on and switched off; a safety baffle is provided between the drawer base and the circuit breaker body to block a drawer base busbar or a bridge type contact of the drawer base; and a front-rear displacement device for the safety baffle to move toward a movement direction of the drawer base is provided on the safety baffle and the drawer base. According to the drawer type circuit breaker of the present invention, the front-rear displacement device is provided on the safety baffle and the drawer base, the safety baffle is displaceable front and back, and the drawer base busbar may penetrate out of the safety baffle.

Abstract: With a power supply control device, if semiconductor switches of a switch circuit are on and a relay contact is off, a controller determines whether or not a switch electric current detected by an electric current sensor is at least a threshold. If the controller has determined that the switch electric current is at least the threshold, then an electric current supply unit switches on the relay contact, and a drive circuit switches off the semiconductor switches. The controller changes the above-described threshold in accordance with the length of the lapse of time from when an electric current flows through the switch circuit.

Abstract: The key switch includes, a base, a button attached to the base so as to be capable of coming into contact with the base and separating from the base, and a coil spring disposed between the base and the button for urging the button in a direction separating from the base. The coil spring has at least an end turn portion formed at one end, a densely wound portion that is continuous with the end turn portion and compressed in an initial state in which the button is attached to the base so that adjacent windings come into contact with each other, and a coarsely wound portion which is continuous with the densely wound portion and in which a winding pitch is larger than that of the densely wound portion, and in the initial state, adjacent windings are separated from each other.

Abstract: A key module includes a bottom plate, a circuit layer, a key cap, a supporting structure, a touch member, and a flexible circuit board. The bottom plate has a first surface and a second surface opposite to each other. The circuit layer is disposed on the first surface and has a first opening. The key cap is disposed above the circuit layer and covers the first opening. The supporting structure is disposed between the bottom plate and the key cap. The touch member is disposed at the key cap. The flexible circuit board is electrically connected to the touch member and passes through the first opening to extend next to the second surface of the bottom plate. When the key cap moves downward relative to the bottom plate, a portion of the flexible circuit board located between the key cap and the bottom plate is bent.

Abstract: An electric lock includes a housing, a keypad module and a lock assembly. The keypad module is arranged on the housing. The keypad module includes a key panel, an electrode pad, a circuit board and a spacer. The key panel is marked with a plurality of key characters. The electrode pad is arranged on an inner side of the key panel, and the electrode pad has a plurality of key electrodes corresponding to the plurality of key characters respectively. The circuit board includes a plurality of key circuits. Each of the key circuits is configured to generate a key signal when contacting a corresponding key electrode. The spacer is configured to form a gap between each of the key circuits and the corresponding key electrode. The lock assembly is electrically connected to the keypad module for performing locking and unlocking operations according to the key signal.

Abstract: A keyboard includes a base plate, a hook structure, and a plastic engaging member. The base plate has a top surface. The hook structure is connected to the base plate and raised relative to the top surface. The plastic engaging member is located on the top surface and fixed to at least a part of the hook structure.

Abstract: The present invention provides a keyboard device, including a plurality of key structures, where each key structure includes a thin-film circuit board, a key frame, an elastic element and a press assembly. The key frame is arranged on the thin-film circuit board, and includes a frame body and a bottom plate that are of an integrally formed structure. The bottom plate is located between the frame body and the thin-film circuit board, and has a through hole, and the thin-film circuit board covers the through hole. The elastic element is arranged on the thin-film circuit board, and a part of the elastic element is located in the through hole in the bottom plate. The press assembly is arranged in the key frame, and the elastic element is located between the press assembly and the thin-film circuit board. The present invention further provides a keyboard device assembly method.

Abstract: A keyboard device includes a substrate, a connection hook, a keycap, and a connecting member. The substrate has a top surface including an assembly area. The connection hook is disposed on the assembly area and includes a fixed seat fixed on the substrate, a standing portion, and a reinforcement block. The standing portion is extending from the fixed seat and extending in a direction away from the fixed seat. A hook portion is laterally extending from a top end of the standing portion, the hook portion has a bottom edge. The reinforcement block is connected to the standing portion and the bottom edge. The keycap is disposed on the assembly area. The connecting member is connected between the keycap and the assembly area. The connecting member includes a shaft slidably pivoted at the bottom edge. An inner side of the shaft includes an avoidance groove corresponding to the reinforcement block.

Abstract: A keyboard device includes a substrate, keycaps, and a frame. The substrate has a top surface and a bottom surface and includes a welding-fixing portion. The welding-fixing portion includes a through hole and an arch-shaped bridge member. The arch-shaped bridge member is connected in the through hole and divides the through hole into partition holes. The arch-shaped bridge member has an arch portion and bridge bases. The arch portion protrudes from the top surface to form a recessed portion. The frame is disposed on the top surface and includes hollow holes respectively corresponding to the keycaps. The frame includes a welding member, and the welding member includes welding posts and a welding-fixing base. The welding posts respectively pass through spaces between the edge portion of the through hole and the arch-shaped bridge member. The welding-fixing base is received and fixed in the through hole and the recessed portion.

Abstract: A keyboard device includes a substrate, a membrane circuit board, a flexible printed circuit board, a first fixing board, and a second fixing board. The substrate includes a top surface, a bottom surface, and a side edge. The substrate further includes an offset protrusion protruding from the top surface and forms a recessed area on the bottom surface. The membrane circuit board is disposed on the top surface. The membrane circuit board includes an outlet area correspondingly disposed on the offset protrusion. The flexible printed circuit board is disposed on the bottom surface. The flexible printed circuit board includes a fixed portion, a folded portion, and an electrical connection end. The fixed portion is received in the recessed area. The first fixing board is correspondingly disposed on the offset protrusion. The second fixing board is correspondingly received in the recessed area and assembled with the first fixing board.

Abstract: A key structure and a keyboard using the same are disclosed. The key structure includes a bottom plate, a keycap, a lifting mechanism, a backlight module, a fixer and a fixing portion. The lifting mechanism pivotally connects the bottom plate and the keycap. The backlight module is disposed on the bottom plate and is provided with a through hole, a first surface and a second surface opposite to the first surface. The through hole is extended to the second surface from the first surface. The fixer presses the first surface. The fixing portion presses the fixer on the bottom plate.

Abstract: A circuit structure includes a light-transmissive insulation layer, a patterned conductive layer and an electronic component. The patterned conductive layer is disposed on the light-transmissive insulation layer. The electronic component is disposed on the patterned conductive layer and electrically connected to the patterned conductive layer.

Abstract: A limit switch may be provided with a switch body having a contact mechanism inside, and an operation unit connected to the switch body. The operation unit comprises an elastic part that energizes the operation lever from the first motion position towards the return position via the pivoting shaft and the first cam, and energizes the operation lever from the second motion position toward the return position via the pivoting shaft and the second cam, a first cam's pivoting restriction part that restricts the pivoting of the first cam in a first direction in which the operation lever moves from the return position to the second motion position, and a second cam's pivoting restriction part that restricts the pivoting to the second cam in a second direction in which die operation lever moves from the return position to the first motion position.

Abstract: A switch device that includes a switch, a casing, side wall portions extending in a first direction from the casing, front and back wall portions extending in the first direction from the casing, a dust-proof portion extending from the back wall portion, and an operation knob including an upper surface portion swingable in a second direction perpendicular to the first direction and a third direction opposite to the second direction and covers the dust-proof portion, and a back surface portion extending in a fourth direction opposite to the first direction from the back end of the upper surface portion and faces a part of the dust-proof portion, wherein the side wall portions, the front wall portion, and the back wall portion form a substantially rectangular shape, the side wall portions, the front wall portion, and the dust-proof portion form another substantially rectangular shape greater than the substantially rectangular shape.

Abstract: A disconnect switch assembly includes first and second disconnect switches with each of the first and second disconnect switch including a housing, a fixed main contact in the housing, and a movable main contact in the housing in cooperating alignment with the fixed main contact. Each of the movable main contacts is coupled to a (common) first actuator. A second actuator is coupled to the housing of the first disconnect switch and a third actuator is coupled to the housing of the second disconnect switch. The first actuator is configured to concurrently apply first and second motive forces (in opposing but in-line directions) to the movable contacts of the first and second disconnect switches. The second and third actuators are configured to apply a motive force to the housings that is in a direction opposing a respective motive force applied by the first actuator to the movable main contacts.

Abstract: A vacuum interrupter including a first movable contact and electrode contained within a vacuum chamber, a second movable contact and electrode contained within the vacuum chamber, a first actuator operably coupled to the first movable contact, and a second actuator operably coupled to the second movable contact. The vacuum interrupter also includes a first bellows and first bellows plate operably coupled to the first movable electrode, as well as a second bellows and second bellows plate operably coupled to the second movable electrode. Additionally, the vacuum interrupter includes a first pressure chamber located between the first actuator and the vacuum chamber, and a second pressure chamber located between the second actuator and the vacuum chamber.

Abstract: In an embodiment a switching device includes a first fixed contact element, a second fixed contact element, a movable contact bridge, a movable shaft configured to move the contact bridge, wherein the contact bridge is arranged at an end of the shaft, wherein the shaft is movable to a first position at which the contact bridge contacts the first and second contact elements, and wherein the shaft is movable to a second position at which the contact bridge is arranged at a distance from the first and second contact elements and a setting device configured to set the distance between the contact bridge and the first and second contact elements in the second position, wherein the setting device is arranged at the end of the shaft, and wherein the switching device is configured to switch an electrical load.

Abstract: A latching relay includes first and second coils and a common plunger operatively connected therebetween such that activation of the first coil moves the plunger in a first direction and activation of the second coil moves the plunger in a second direction, opposite the first direction, the first and second directions lying in a first plane. A limit switch includes a common contact and first and second coil contacts, where a position of the common contact is alternately switched between electrical connection to either the first or second coil contact based on a position of the plunger. A slide toggle accessible by a user is operatively connected to the plunger and slideable together with the plunger such that actuation of the slide toggle by the user causes manual actuation of the plunger. The slide toggle is slideable in a second plane parallel to the first plane.

Abstract: A method of forming a microelectromechanical device is disclosed wherein a beam of the microelectromechanical device may deviate from a resting to an engaged or disengaged position through electrical biasing. The microelectromechanical device comprises a beam disposed above a first RF conductor and a second RF conductor. The microelectromechanical device further comprises at least a center stack, a first RF stack, a second RF stack, a first stack formed on a first base layer, and a second stack formed on a second base layer, each stack disposed between the beam and the first and second RF conductors. The beam is configured to deflect downward to first contact the first stack formed on the first base layer and the second stack formed on the second base layer simultaneously or the center stack, before contacting the first RF stack and the second RF stack simultaneously.

Abstract: An electrical arrangement for performing radio frequency isolation for microelectromechanical relay switches. A microelectromechanical relay switch comprises a beam configured to switch from a first position connected to an upper voltage source to a second position connected to a lower voltage source. The microelectromechanical relay switch further comprises at least one frequency isolation circuit or resistor disposed adjacent to the beam. The at least one frequency isolation circuit or resistor biases a direct current potential to allow for electrostatic actuation and further provides a path for transient electrical currents during switching.

Abstract: A light intensifier includes a semiconductor structure to multiply electrons and block stray particles. A thin gain substrate layer includes an electron multiplier region that is doped to generate a plurality of electrons for each electron that impinges on an input surface of the gain substrate layer and blocking structures that are doped to direct the plurality of electrons towards emission areas of an emission surface of the gain substrate layer. Respective ribs of a first plurality of ribs on the input surface of the gain substrate layer are vertically aligned with respective blocking structures, and respective blocking structures are vertically aligned with respective ribs of a second plurality of ribs at the emission surface. This alignment directs electrons along a path through the gain substrate layer to reduce noise. The support ribs provide mechanical strength to the gain substrate layer, improving robustness of the light intensifier while minimizing noise.

Abstract: A slow-wave circuit comprises: a waveguide comprising a meander-shaped part that transmits an electromagnetic wave and alternately repeats a first folded part and a second folded part folded onto the opposite side to the first folded part; and a beam hole that transmits an electron beam, extends in a predetermined direction, and penetrates the meander-shaped part, wherein the beam hole penetrates the meander-shaped part so that a part of the beam hole protrudes from the first folded part.

Abstract: An ion source includes a vacuum chamber having a cooling mechanism, an ion generation container for reacting an ionized gas with an ion material so as to generate ions, an extraction electrode for extracting ions generated in the ion generation container and generating an ion beam, and a shielding member provided inside and in the vicinity of an inner wall of the vacuum chamber, and having a main body made of a conductive metal for blocking deposition of an insulating material on the inner wall (10d) of the vacuum chamber. The main body of the shielding member has a plurality of protruding support portions that is in contact with the inner wall of the vacuum chamber for supporting the main body in a manner such that the main body is fitted at a distance from the inner wall of the vacuum chamber.

Abstract: A scanning electron microscope. The scanning electron microscope may include a sliding vacuum seal between the electron optical imaging system and the sample carrier with a first plate having a first aperture associated with the electron optical imaging system and resting against a second plate having a second aperture associated with the sample carrier. The first plate and/or the second plate includes a groove circumscribing the first and/or second aperture. The scanning electron microscope may include a detector movable relative to the electron beam. The scanning electron microscope may include a motion control unit for moving a sample carrier along a collision free path.

Abstract: A sample may be inspected by making particles traverse the sample. The particles that have traversed the sample hit a detector one-by-one. In response thereto, the detector provides a sequence of respective detection outputs. The sequence of respective detection outputs is processed so as to identify respective locations where respective incident particles have hit the detector. An image is generated on the basis of the respective locations that have been identified. In order to determine a location where an incident particle has hit the detector, an evaluation is made with regard to pre-established respective associations between, on the one hand, respective locations where incident particles have hit the detector and, on the other hand, respective detection outputs.

Abstract: A scanning electron microscope includes a spin detector configured to measure spin polarization of a secondary electron emitted from a sample, and an analysis device configured to analyze measurement data of the spin detector. The analysis device determines a width of a region where the secondary electron spin polarization locally changes in the measurement data. The analysis device further evaluates a strain in the sample based on the width of the region. With a configuration of the scanning electron microscope, it is possible to perform analysis of a strain in a magnetic material with high accuracy.

Abstract: A grounding cap module includes a main body, a frame portion, and a cap portion. The main body includes a first opening penetrating the main body and a grounding portion disposed on a periphery of the main body and configured to be electrically grounded. The frame portion is disposed on the main body and includes a second opening aligned with the first opening. The cap portion is disposed on the frame portion and covers the second opening, wherein the first opening, the second opening and the cap portion define a receiving cavity. A gas injection device and an etching apparatus using the same are also provided.

Abstract: A maintenance device has a cover and a fixing member. The cover is in a vacuum atmosphere during substrate processing, is formed to have a size corresponding to a boundary line between a first part and a second part of a processing container, which can be separated into the first part and the second part, or an opening surface separating the first part and the second part, and has airtightness, and visual transparency at least in a part. The fixing member fixes in an airtight manner the cover along the boundary line between the first part and the second part of the processing container or to the opening surface separating the first part and the second part.

Abstract: Radio frequency (RF) generators are disclosed. A RF generator may include a modulator configured to output a pulsed RF signal by modulating an RF carrier using a pulsed analog signal as a modulating signal. The modulating signal may be based on a file. The file may be received via a communication interface. The RF generator may further include an amplification stage configured to amplify the pulsed RF signal output by the modulator. RF generation systems and methods of generating a pulsed RF signal also disclosed.

Abstract: Radio frequency (RF) generators are disclosed. A RF generator may include an analog signal generator configured to generate a pulsed analog signal responsive to a digital pulsed waveform defined by one or more commands. The RF generator may also include a modulator configured to generate a pulsed radio frequency (RF) signal by modulating an RF carrier using the pulsed analog signal as a modulating signal. Further, the RF generator may include an amplification stage configured to amplify the pulsed RF signal output by the modulator. RF generation systems and methods of generating a pulsed RF signal also disclosed.

Abstract: In one embodiment, a method of impedance matching and controlling the power delivered to a plasma chamber is disclosed. A matching network includes a variable reactance element (VRE), the VRE having different positions for providing different reactances. Based on a determined parameter, the method determines potential new positions for the VRE that would have a threshold effectiveness in providing an impedance match between the RF source and the plasma chamber. A preferred position for the VRE is determined by determining the one of the potential new positions meeting the threshold effectiveness whose efficiency in delivering RF power from the RF input to the RF output would cause an RF power at the RF output to be closest to a desired RF power.

Abstract: This disclosure provides a reactor system that includes a microwave source configured to generate a microwave energy, one or more energy sources configured to generate a thermal energy and a field-enhancing waveguide (FEWG) coupled to the microwave source. The FEWG includes a field-enhancing zone having a cross-sectional area that decreases along a length of the FEWG. The field-enhancing zone includes a supply gas inlet configured to receive a supply gas, a reaction zone configured to generate a plasma in response to excitation of the supply gas by the microwave energy, a process inlet configured to inject a raw material into the reaction zone, and an afterglow region configured to combine the plasma and the raw material in response to the thermal energy. An outlet outputs a plurality of carbon-inclusive particles resulting from the combination of the plasma and the raw material. Electrodes can be positioned proximate to the reaction zone.

Abstract: Embodiments include a plasma processing tool that includes a processing chamber, and a plurality of modular microwave sources coupled to the processing chamber. In an embodiment, the plurality of modular microwave sources include an array of applicators that are positioned over a dielectric body that forms a portion of an outer wall of the processing chamber. The array of applicators may be coupled to the dielectric body. Additionally, the plurality of modular microwave sources may include an array of microwave amplification modules. In an embodiment, each microwave amplification module may be coupled to at least one of the applicators in the array of applicators. According to an embodiment, the dielectric body be planar, non-planar, symmetric, or non-symmetric. In yet another embodiment, the dielectric body may include a plurality of recesses. In such an embodiment, at least one applicator may be positioned in at least one of the recesses.

Abstract: Methods and apparatus for performing high energy atomic layer etching are provided herein. Methods include providing a substrate having a material to be etched, exposing a surface of the material to a modification gas to modify the surface and form a modified surface, and exposing the modified surface to an energetic particle to preferentially remove the modified surface relative to an underlying unmodified surface where the energetic particle has an ion energy sufficient to overcome an average surface binding energy of the underlying unmodified surface. The energy of the energetic particle used is very high; in some cases, the power applied to a bias used when exposing the modified surface to the energetic particle is at least 150 eV.

Abstract: A member for use in a plasma processing device of the disclosure includes a base material and a film containing yttrium oxide as a main component on the base material. An area occupancy of closed pores of the film is 0.2 area % or less, and a full width at half maximum of a diffraction peak on a (222) plane of yttrium oxide obtained by X-ray diffraction of the film is 0.25° or less. A plasma processing device according to the disclosure includes the member for use in a plasma processing device.

Abstract: Systems and methods may be used to produce coated components. Exemplary semiconductor chamber components may include an aluminum alloy comprising nickel and may be characterized by a surface. The surface may include a corrosion resistant coating. The corrosion resistant coating may include a conformal layer and a non-metal layer. The conformal layer may extend about the semiconductor chamber component. The non-metal oxide layer may extend over a surface of the conformal layer. The non-metal oxide layer may be characterized by an amorphous microstructure having a hardness of from about 300 HV to about 10,000 HV. The non-metal oxide layer may also be characterized by an sp2 to sp3 hybridization ratio of from about 0.01 to about 0.5 and a hydrogen content of from about 1 wt. % to about 35 wt. %.

Abstract: A member for use in a plasma processing device of the disclosure includes a base material, and a film of an oxide of a rare earth element on at least a part of the base material. A coefficient of variation of thickness of the film is 0.04 or less. A plasma processing device of the disclosure includes the member for use in a plasma processing device. In the member for use in a plasma processing device according to the disclosure, variation in film thickness is small.

Abstract: Described herein is a technique capable of suppressing sputtering on an inner peripheral surface of a process vessel when a process gas is plasma-excited in the process vessel. According to one aspect thereof, a substrate processing apparatus includes: a process vessel accommodating a process chamber where a process gas is excited into plasma; a gas supplier supplying the process gas into the process chamber; a coil wound around an outer peripheral surface of the process vessel and spaced apart therefrom, wherein a high frequency power is supplied to the coil; and an electrostatic shield disposed between the outer peripheral surface and the coil, wherein the electrostatic shield includes: a partition extending in a circumferential direction to partition between a part of the coil and the outer peripheral surface; and an opening extending in the circumferential direction and opened between another part of the coil and the outer peripheral surface.

Abstract: A substrate processing apparatus includes a chamber having a plasma processing space, a sidewall of the chamber having an opening for transferring a substrate into the plasma processing space; and a shutter disposed at an inner side than the sidewall and configured to open or close the opening, the shutter having a flow path for a temperature-controlled fluid.

Abstract: Embodiments described herein provide methods and apparatus used to control a processing result profile proximate to a circumferential edge of a substrate during the plasma assisted processing thereof. In one embodiment a substrate support assembly features a first base plate and a second base plate circumscribing the first base plate. The first and second base plates each have one or more respective first and second cooling disposed therein. The substrate support assembly further features a substrate support disposed on and thermally coupled to the first base plate and a biasing ring disposed on and thermally coupled to the second base plate. Here, the substrate support and the biasing ring are each formed of a dielectric material. The substrate support assembly further includes an edge ring biasing electrode embedded the dielectric material of the biasing ring and an edge ring disposed on the biasing ring.

Abstract: A stage includes an electrostatic chuck that supports a substrate and an edge ring; and a base that supports the electrostatic chuck. The electrostatic chuck includes a first region having a first upper surface and supports the substrate placed on the first upper surface; a second region having a second upper surface, provided integrally around the first region, and supports the edge ring placed on the second upper surface; a first electrode provided in the first region to apply a DC voltage; a second electrode provided in the second region to apply a DC voltage, and a third electrode to apply a bias power.

Abstract: A plasma processing apparatus includes a chamber; a substrate support having a lower electrode, an electrostatic chuck, and a heater; a radio frequency power supply; a DC power supply; a first controller; and a second controller. The first controller controls the radio frequency power supply to supply a pulsed radio frequency power to the lower electrode periodically with a cycle defined by a first frequency, and controls the DC power supply to apply a pulsed negative voltage to the edge ring periodically with the cycle. The second controller includes a heater controller that controls the power by obtaining a resistance value of the heater from sample values of a current and a voltage supplied to the heater. The first frequency is different from a second frequency that is a sampling frequency of the sample value of the current and the sample value of the voltage in the second controller.

Abstract: In some embodiments, a method for cleaning a processing chamber is provided. The method may be performed by introducing a processing gas into a processing chamber that has a by-product disposed along sidewalls of the processing chamber. A plasma is generated from the processing gas using a radio frequency signal. A lower electrode is connected to a first electric potential. Concurrently, a bias voltage having a second electric potential is applied to a sidewall electrode to induce ion bombardment of the by-product, in which the second electric potential has a larger magnitude than the first electric potential. The processing gas is evacuated from the processing chamber.

Abstract: Implementations described herein provide for thermal substrate processing apparatus including two thermal process chambers, each defining a process volume, and a substrate support disposed within each process volume. One or more remote plasma sources may be in fluid communication with the process volumes and the remote plasma sources may be configured to deliver a plasma to the process volumes. Various arrangements of remote plasma sources and chambers are described.

Abstract: The present invention relates to a method for the evaporation of a cathode by means of cathodic arc evaporation, wherein the focal spot of the arc is forced to a predetermined track on the cathode surface by means of temporally and spatially controllable magnetic fields, wherein a predetermined removal of material of the cathode surface is produced. The invention also relates to a device for carrying out the method according to the invention.

Abstract: Described herein is an ion pump system implementing an electronic ratchet mechanism produced by modulating a spatially varying electric potential distribution that can result in a net ionic current and voltage. The ion pumping membrane system includes an ion-permeable layer integrated with ion-selective membranes. The electric potential distribution within the ion-permeable layer is modulated through external stimuli. When immersed in solution, ions within the ion-permeable layer experience a time varying, spatially asymmetric electric field distribution resulting in ratchet-driven direction pumping, which can be used in applications such as desalination.

Abstract: The present invention provides a novel partial-pressure mass spectrometer calibration device, which is mainly composed of a fine adjustment valve, a piston pressure gauge, a sample preparation chamber, a plurality of high-purity gas cylinders, a capacitive film vacuum gauge, a first-stage sample inlet chamber, a second-stage sample inlet chamber, sampling chambers, a small hole, a calibration chamber, a separation gauge and air pumping systems, wherein the sample preparation chamber is connected with the piston pressure gauge and the capacitive film vacuum gauge; the sample preparation chamber is also connected with the plurality of high-purity gas cylinders which are connected in parallel via the fine adjustment valve; a plurality of sampling chambers with different volumes are connected in parallel between the sample preparation chamber and the first-stage sample inlet chamber; a plurality of sampling chambers with different volumes are connected in parallel between the first-stage sample inlet chamber and

Abstract: Known lipid molecules of a matrix are grouped into lipid classes and the lipid classes are further grouped into a pass-through group and a mobility separation group based on isobaric interferences. A separation system separates known lipid molecules from a matrix sample and an ion source ionizes the matrix sample. Two injections are performed. For the first injection a DMS device is put into passive mode, and for the second injection the DMS device is used to resolve isobaric interferences. A tandem mass spectrometer performs MRM scans of the pass-through group for the first injection and MRM scans of the mobility separation group for the second injection. A processor quantitates each lipid molecule in the matrix sample by comparing the MRM intensity values obtained for the first and second injections to MRM intensity and concentration values for known standards of the known lipid molecules of the matrix.

Abstract: A method of spectrometric analysis comprises obtaining one or more sample spectra for an aerosol, smoke or vapour sample. The one or more sample spectra are subjected to pre-processing and then multivariate and/or library based analysis so as to classify the aerosol, smoke or vapour sample. The results of the analysis are used for various surgical or non-surgical applications.

Abstract: The invention generally relates to systems and methods for mass spectrometry analysis of microorganisms in samples.