Abstract: Embodiments of this disclosure provide a terminal capability identifier operation method and a communications device. The operation method includes: performing a first operation related to terminal capability identifier, where the first operation related to terminal capability identifier includes at least one of the following: deleting or suspending a terminal capability identifier; changing a first-type terminal capability identifier in a terminal context to a second-type terminal capability identifier; or transmitting operation information of terminal capability identifier.

Abstract: Methods, systems, and devices for wireless communications are described for communications between a user equipment (UE) and a base station via one or more relays. The UE and base station may establish a direct connection according to a first UE capability, and the UE may identify one or more relays that are in proximity to the UE and that may be used for relaying communications between the UE and the base station. The UE may provide a capability indication of a second UE capability to the base station that indicates transmission parameters associated with at least one relay, which the base station may use to communicate with the UE via the relay. The base station may select which UE capability to use for communications, which may result in either direct communications with the UE or a connection via the relay.

Abstract: The present disclosure describes methods and apparatus for remote sensing with data science. The methods and apparatus have many applications including monitoring the quality of grain during storage and/or transport. The present disclosure describes a way to collect temperature and other environmental data to describe and predict quality of stored grains, current and future, based on a myriad factors including fumigation, external temperature and humidity, in storage grain temperature and humidity.

Abstract: A data collection system includes a cart to carry one or more data collection devices, the cart having a body with a top surface; a first compartment cut through a thickness of the body, the first compartment to receive a first data collection device; and an opening to receive a handle, the handle can be used to maneuver the cart; a computing device in wireless communication with the first data collection device; the computing device receives data from the first data collection device, the data related to a floor surface.

Abstract: A method of allocating resources in a mobile telecommunications system, the resources being for a relay node to operate as a terminal-to-terminal relay for a device-to-device communication between a first terminal and a second terminal. The method includes: allocating first resources for the first terminal to communicate via the relay node for the device-to-device communication; allocating second resources for the second terminal to communicate via the relay node for the device-to-device communication; notifying the first terminal of the allocated first resources; notifying the second terminal of the allocated second resources; and the first and second terminals exchanging messages for the device-to-device communication via the relay node and using the first and second resources, respectively.

Abstract: Provided herein are method and apparatus for configuration of a Reference Signal (RS) and a Tracking Reference Signal (TRS). An embodiment provides a method for a user equipment (UE), including determining a number of slots for a Tracking Reference Signal (TRS), wherein the number of slots is based on a subcarrier spacing of a bandwidth part (BWP) in a current component carrier for the UE; and receiving TRS based on the number of slots and a quasi co-location (QCL) relationship of the TRS, wherein the QCL relationship indicates that the TRS is Quasi-Co-Located (QCLed) with a Synchronization Signal (SS) block or a Channel State Information Reference Signal (CSI-RS).

Abstract: A remote follow spot system includes a remote controller that has separately movable parts that are movable in two orthogonal directions, and a display attached to one of said two separately movable parts. The display receives a video feed from a controlled light, that is controlled to move in the same directions as remote controller. The display hence shows the field of view where the light is pointing. In this way, an operator of the follow spot can control the light without physically being near the light.

Abstract: A cooktop appliance or heating element, as provided herein, may include a thermostat within the heating zone of the heating element. The thermostat may include a base and a top cap held on the base. The heat transfer disk may be joined to the thermostat at the top cap.

Abstract: A heating component comprising a housing, at least one heating component and at least one connecting member; the heating component is disposed within the housing, and the connecting member is disposed on at least one side of the outer wall of the housing; the connecting member is assembled to the housing; the connecting member comprises a slot and a slot wall; the slot wall is located on the periphery of the slot; at least a part of the slot wall is outwardly recessed; the heating component comprises at least one chamber, and the chamber comprises a space formed between the slot wall and the outer wall of the housing; the connecting member comprises a first connecting port and a second connecting port; the first connecting port is connected to the chamber, and the second connecting port is also connected to the chamber; the first connecting port is connected to the second connecting port through the chamber.

Abstract: A terminal pin, in particular for a terminal unit for the electrical contacting of a heating conductor of an exhaust-gas heater of an exhaust-gas system of an internal combustion engine, includes a pin body which is elongate in the direction of a pin body longitudinal axis and which has an outer connection region for the connection of a voltage supply line to the terminal pin, a cooling region, a leadthrough region for the electrically insulated leadthrough of the pin body through a pin support of a terminal unit, and an inner connection region for the connection of the terminal pin to a heating conductor of an exhaust-gas heater, a cooling surface formation being provided in the cooling region.

Abstract: Devices, systems and methods for coupling sensors to intelligent electronic devices (IED's), e.g., an electrical power meter, via various communication media for electrical utility submetering are provided. The present disclosure provides a mechanism for coupling an IED to another desired device, e.g., a circuit breaker, using modular connectors (e.g., a RJ-45 connector, fiber optic connectors, etc.) and fiber-optic cables. The present disclosure also provides for coupling devices using modular connectors via wired or wireless connectivity.

Abstract: Operating an electrical load controller includes determining a firing angle at which to fire a switching circuit of the electrical load controller, the firing angle corresponding to a firing delay time. In some aspects, the operating includes selecting a control signal pulse duration between a fixed duration and a variable duration, and controlling the supply of AC power to the load based on the selected control signal pulse duration. In some aspects, the operating includes detecting whether a voltage sag is present in the AC waveform and the selecting is based on determining that voltage sag is present in the AC waveform.

Abstract: A lighting fixture includes a fixture housing. A circuit board is positioned in the fixture housing. The circuit board includes a driver circuit. A plurality of light emitters are disposed on the circuit board. The light emitters are operatively connected to the driver circuit to produce a light output. A temperature sensor is disposed on the circuit board, the temperature sensor configured to measure a temperature of the circuit board and output a signal. The driver circuit is configured to reduce the light output in response to the signal from the temperature sensor.

Abstract: The LED electronic display board system according to the present invention comprises first to Mth sub-controllers 2-1, 2-2, . . . , 2-M (here, N and M are a natural number), each of which comprises first to Nth LED modules 1-1, 1-2, . . . , 1-N, to control the first to Nth LED modules 1-1, 1-2, . . . , 1-N; and a main controller 3 which is connected to the first to Mth sub-controllers 2-1, 2-2, . . . , 2-M to control the first to Mth sub-controllers 2-1, 2-2, . . . , 2-M, wherein the first to Mth sub-controllers 2-1, 2-2, . . . , 2-M each further comprise a constant current roller 20 and a variable resistance block 21, and the constant current controller 20 adjusts a resistance value of the variable resistance block 21 according to a signal of the main controller 3 to adjust the size of current.

Abstract: The present disclosure provides a light-emitting diode lamp designed to replace an incandescent filament bulb for illumination purposes in a transportation vehicle and a light-emitting diode circuit associated therewith.

Abstract: This LED driving device comprises: a DC/DC controller which controls an output stage for supplying an output voltage to an LED; and a current driver which generates an output current of the LED, wherein the current driver performs PWM dimming by turning on the output current in accordance with an LED-current-on period of a PWM dimming signal and turning off the output current in accordance with an LED-current-off period of the PWM dimming signal, and the DC/DC controller includes a feedback control unit which performs feedback control for outputting a switching pulse to the output stage so as to make a cathode voltage of the LED equal to a reference voltage, and a pulse addition control unit which performs pulse addition control for adding a predetermined pulse number of additional switching pulses at a time of switching between the LED-current-on period and the LED-current-off period.

Abstract: A method for controlling an amount of power delivered to an electrical load may include controlling an average magnitude of a load current towards a target load current that ranges from a maximum-rated current to a minimum-rated current in a normal mode, and controlling the average magnitude of the load current below the minimum-rated current in a burst mode. The burst mode may include at least one burst-mode period that comprises a first time period associated with an active state and a second time period associated with an inactive state. During the burst mode, the method may include regulating a peak magnitude of the load current towards the minimum-rated current during the active state, and stopping the generation of at least one drive signal during the inactive state to control the average magnitude of the load current to be less than the minimum-rated current.

Abstract: The present invention refers to a detector device for detecting a status of at least a first electronic element of an automotive lighting device. This detector device comprises a status detection unit configured to detect a status of the at least first electronic element and to generate a reference signal which depends at least on the status of the first electronic element. It also comprises a comparison signal generator configured to generate a comparison signal and a comparison unit configured to generate a pulse-width modulation signal by comparing the reference signal with the comparison signal.

Abstract: A control attachment configured to provide power to a load is described. The control attachment may comprise a first plurality of contact elements configured to be coupled to a power adapter; a plurality of openings on a first surface and having a second plurality of contact elements configured to receive a power signal and a neutral signal, wherein the plurality of openings are adapted to receive prongs of a plug; a ground contact element adapted to be coupled to a ground contact element of the power adapter; and a transformer coupled to receive the power signal and generate a low voltage signal; wherein the second plurality of contact elements is coupled to the first plurality of contact elements.

Abstract: A lighting device includes: a light emitting unit that emits illumination light; and a control unit that controls an intensity of the illumination light. The control unit controls the intensity of the illumination light in each of a period of no change during which the control unit keeps the intensity of the illumination light constant and a period of change during which the control unit changes the intensity of the illumination light as time passes. The period of no change is longer than the period of change.

Abstract: Apparatuses, methods, systems, and techniques for providing special effects wirelessly using a device plugged into a standard electrical outlet are provided. Example embodiments provide an apparatus and associated software applications for remote and live control of special effects (hereinafter a “Remote Special Effects System,” or “RSES”) using special effect (SE) devices such as individually addressable LEDs, LED strips, fog and smoke machines, and the like. The example RSES described herein comprises one or more SE controller devices that each plug into a standard electrical outlet and are each connected to one or more SE devices. Each SE controller is wirelessly connected to the Internet (or other wide area network) so that it can respond to DMX (or other protocol) commands sent by a remote application by issuing corresponding commands specific to the connected SE device to cause synchronized special effects to occur to an ad-hoc created zone of SE controllers.

Abstract: In one embodiment of the invention, there is provided a tool for annealing a magnetic stack. The tool includes a housing defining a heating chamber; a holding mechanism to hold at least one wafer in a single line within the heating chamber, a heating mechanism to heat the at least one wafer; and a magnetic field generator to generate a magnetic field whole field lines pass through the single line of wafers during a magnetic annealing process; wherein the holding mechanism comprises a wafer support of holding the single line of wafers between the heating mechanism and the magnetic field generator.

Abstract: Disclosed is an article for use with an apparatus for heating smokable material to volatilize at least one component of the smokable material. The article includes a carrier having plural thermally-conductive portions, on which are locatable respective discrete quantities of smokable material. Between the portions of the carrier, the carrier is shaped to form a thermal barrier for inhibiting heat conduction from one or more of the portions of the carrier towards another of the portions of the carrier in use.

Abstract: A cooking appliance includes a cabinet that defines a cooking chamber. A magnetron is mounted within the cabinet and is in communication with the cooking chamber to direct a microwave thereto. An induction heating coil is mounted within the cabinet and is in communication with the cooking chamber to direct a magnetic field thereto. A turntable is rotatably mounted in the cooking chamber above the induction heating coil. A motor is operatively coupled to the turntable and is mounted within the cabinet outside of the cooking chamber below and adjacent to the induction heating coil. The motor is operatively coupled to the turntable by a non-magnetic rotation hub extending through the induction heating coil.

Abstract: The present invention discloses that a plasma aerosol device includes a gas tunnel, a dielectric barrier discharge module, and a liquid tunnel. The invention uses a mechanism similar to a dielectric barrier discharge (DBD) electrode system, thus to enable generating a plasma active water mist which riches in free radicals such as reactive nitrogen species (RNS) and reactive oxygen species (ROS). Therefore, this invention is able to be used in medical, sterilization, agriculture and preservation industries.

Abstract: An array of non-thermal plasma emitters is controlled to emit plasma based on application of an electric current at desired frequencies and a controlled power level. A power supply for an array controller includes a transformer that operates at the resonant frequency of the combined capacitance of the array and the cable connecting the array to the power supply. The power into the array is monitored by the controller and can be adjusted by the user. The controller monitors reflected power characteristics, such as harmonics of the alternating current, to determine initiation voltage of the plasma and/or resonant frequency plasma emitters. The array of non-thermal plasma emitters may be used in therapeutic, diagnostic, and/or medical sanitization applications, including for treatment of infectious diseases using the disclosed protocols.

Abstract: Techniques are provided herein for dynamic pressure control of a heat sink. In one example embodiment, an apparatus includes a Ball Grid Array (BGA) device, a heat sink thermally coupled to the BGA device, and a pressure control assembly configured to dynamically control a pressure of the heat sink on the BGA device based on a temperature associated with the BGA device. The pressure control assembly includes a Shape Memory Alloy (SMA) washer configured to apply a first amount of the pressure when the SMA washer is in a first state, and a second amount of the pressure when the SMA washer is in a second state.

Abstract: Disclosed are aspects of apparatuses and methods of fitting a cooling device to a circuit board for cooling a high-power electronic component mounted on the circuit board. Cooling apparatuses, and arrangement thereof, are also described. The method provides the cooling device with a cooling surface having a cooling area for thermally connecting to a to-be-cooled surface of the electronic component. Fixing elements are provided for moving the cooling surface towards the circuit board. A distance position “d” of the to-be-cooled surface from the circuit board is determined, and on this basis spacer elements are selected to be interposed between the cooling device and the circuit board to limit the movement by the fixing elements to a position where the cooling area is in proximity to the to-be-cooled surface.

Abstract: The storage device unit includes: a substrate having a main surface and having a plurality of wiring layers stacked together; and a storage device that has a plate shape having a first surface and is disposed on the substrate, the first surface facing the main surface. The plurality of wiring layers includes a heat-generating layer having a heat-generating circuit.

Abstract: An electrical device according to the present invention has a case (1), a metallic heat sink plate (4) disposed an opening portion (OP) of the case and a circuit board (5) arranged on the heat sink plate. The heat sink plate (4) is interposed between a capacitor (2) and the circuit board (5) so that the circuit board (5) is separated from the capacitor (2) by not only the resinous case (1) but also the metallic heat sink plate (4). Thus, electromagnetic space noise generated from the capacitor (2) is shielded or reduced by the metallic heat sink plate (4) whereby a malfunction of the circuit board (5) is prevented from occurring due to electromagnetic space noise generated from the capacitor (2).

Abstract: Enhanced components and assemblies for connector-less radio frequency (RF) interconnect systems are provided. One example includes two circuit boards each with a broadside coupling feature comprising a tapered circuit board trace having a terminal portion. The circuit boards are positioned in close proximity to establish a desired gap, and a dielectric material is positioned within the gap between circuit boards. The broadside coupling features of the circuit boards are then configured to convey RF signals over the gap without electrical contact.

Abstract: A branch coupler includes a first branch, comprising an input end, an isolation end, a first transmission line, a first branch line and a second branch line, the input end is electrically connected to the isolation end through the first transmission line, the first branch line is electrically connected to input end, and second branch line is electrically connected to the isolation end; a second branch, comprising a first output end, a second output end, a second transmission line, a third branch line and a fourth branch line, the first output end and the second output end are connected through second transmission line, the third branch line is connected to the first output end, and the fourth branch line is connected to the second output end; the first branch line is connected to the third branch line, and the second branch line is connected to the fourth branch line.

Abstract: The present disclosure provides a circuit board arrangement comprising a main board comprising at least one longitudinal cutout, at least one reinforcing plate arranged in the at least one longitudinal cutout and mechanically coupled to the main board, wherein the plane of main extension of the main board is arranged perpendicular to the plane of main extension of the at least one reinforcing plate. Further, the present disclosure provides a differential probe circuit and a respective method.

Abstract: The present disclosure relates to phase shifters, antennas, and base stations. One example phase shifter includes a cavity, a built-in printed circuit board (PCB), and a stress relief portion. The stress relief portion is connected to the PCB, and the stress relief portion is configured to reduce a stress generated due to different coefficients of thermal expansion (CTE) of the cavity and the PCB.

Abstract: A pre-soldered circuit carrier includes a carrier having a metal die attach surface, a plated solder region on the metal die attach surface, wherein a maximum thickness of the plated solder region is at most 50 ?m, the plated solder region has a lower melting point than the first bond pad, and the plated solder region forms one or more intermetallic phases with the die attach surface at a soldering temperature that is above the melting point of the plated solder region.

Abstract: An example electronic device includes a housing, a first board and a second board disposed in an interior of the housing and disposed to face each other in a first direction, an interposer extending to surround an interior space between the first board and the second board, a first conductive layer disposed to face the first board and including a first conductive area, a second conductive layer disposed to face the second board and including a second conductive area, an insulation layer disposed between the first conductive layer and the second conductive layer, a first insulation part disposed between the first conductive layer and the first board and covering the first conductive area, a second insulation part disposed between the second conductive layer and the second board and covering the second conductive area, a first plating area extending from the first conductive layer to the second conductive layer, on a first side surface of the insulation layer, and a second plating area extending from the first

Abstract: According to certain embodiments, an electronic device comprises: a housing including a first support member; a cover member coupled with and facing the first support member; a second support member coupled with and facing the first support member; a printed circuit board assembly disposed to face the first support member, the printed circuit board assembly having a part disposed between the first support member and the cover member and another part disposed between the first support member and the second support member; wherein the printed circuit board assembly comprises: a first circuit board including a first part disposed between the first support member and the cover member, and a second part disposed between the first support member and the second support member; a second circuit board disposed to at least partially face the first part and disposed between the first circuit board and the cover member; and an interposer board disposed to correspond to at least a part of an edge of the second circuit boa

Abstract: Devices are disclosed that include a wideband millimeter wave (mmW) via transition design for multilayer printed circuit boards (MLBs). In various instances embodiments, a via is dimensioned to provide impedance matching to stripline tracing connected at the end of the via. Impedance matching in the via may eliminate the need for an impedance matching section on the stripline tracing. In some instances, the dimensions of the via pad diameter and the via keepout diameter are selected to tune a via transition structure to selected frequencies and/or frequency bandwidths.

Abstract: A display device includes a display panel including a first surface and a second surface opposite to the first surface, the second surface having a first area and a second area surrounding the first area, a conductive sheet disposed on the second surface of the display panel and including a first conductive line disposed in the first area and extending in a first direction and a conductive layer disposed in the second area, a first circuit board bending from the first surface to the second surface to be connected to a first end of the first conductive line, and a second circuit board spaced apart from the first circuit board in the first direction, the second circuit board bending from the first surface to the second surface to be connected to a second end opposite to the first end of the first conductive line.

Abstract: In accordance with at least one aspect of this disclosure, a system includes a reinforcement structure configured to seat in an air gap between one or more solder balls of a ball grid array of a surface mount packaging component. The reinforcement structure is configured and reduce bending of the circuit board during acceleration of the circuit board.

Abstract: An electronic component (1) is connected to a conductive track (2) on a flexible substrate (3). A connection layer (4) of a composition comprising a thermoplastic material (TPM1) is provided on the conductive track (2). The connection layer (4) has at least one cutout (5) aligned to overlap the conductive track (2). A thermosetting material (TSM1) in liquid state is used to fill the cutout (5). The electronic component (1) is provided on top of the connection layer (4). By applying heat, a temperature of the connection layer (4) is raised to above a softening temperature of the thermoplastic material (TPM1). Pressure is applied to form a mechanical connection. By the application of heat (H) a temperature of the thermosetting material (TSM1) is raised above its thermosetting temperature for solidifying the thermosetting material (TSM1) and forming an electrical connection (E).

Abstract: Method for forming a metal film includes forming an oxide layer on a to-be-treated surface of a to-be-treated object by bringing the to-be-treated surface into contact with a reaction solution containing fluorine and an oxide precursor, removing fluorine in the oxide layer, supporting a catalyst on the oxide layer by bringing the oxide layer into contact with a catalyst solution, and depositing a metal film on the oxide layer by bringing the oxide layer into contact with an electroless plating liquid.

Abstract: A solder paste stencil includes, in one embodiment, a substrate defining solder apertures, each aperture wall of each of the solder apertures is coated with a coating material that reduces wetting of a solder paste relative to the aperture walls.

Abstract: A bonding apparatus includes a vacuum holder and a thermal head. The vacuum holder is configured to attach a non-bonding area of a printed circuit board. A side of the vacuum holder has a first lower sidewall, a first upper sidewall, and a first connection surface adjoining the first lower sidewall and the first upper sidewall. The thermal head is adjacent to the vacuum holder and configured to hot press a bonding area of the printed circuit board. A side of the thermal head proximal to the vacuum holder has a second lower sidewall, a second upper sidewall, and a second connection surface adjoining the second lower sidewall and the second upper sidewall. The second connection surface overlaps at least a portion of the first connection surface, and a height of the second lower sidewall is greater than a height of the first lower sidewall.

Abstract: The present invention relates to a housing for a multifunctional electronic device and a method for preparing the same. The housing comprises an upper cover and a lower cover fixed together to form an internal space, wherein the upper cover comprises a first layer formed of a first thermoplastic material, said first layer having a thickness in the range of 0.8 mm to 1.5 mm and comprising at least two functional components integrated thereon; the lower cover comprises a second layer formed of a second thermoplastic material, said second layer having a thickness in the range of 2 mm to 4 mm; and the housing for the multifunctional electronic device comprises at least 90 wt % of the thermoplastic materials, relative to the total weight of the housing.

Abstract: The electronic device includes: a substrate having an electronic circuit formed therein; a housing for housing the substrate; and a connector disposed on the substrate and serving as an interface between outside and inside of the housing. The substrate has a main circuit pattern portion that forms a main circuit and a frame ground pattern portion that forms a frame ground. The main circuit pattern portion and the frame ground pattern portion are disposed so as not to overlap each other on the substrate and in the substrate. A terminal of the connector is disposed in the frame ground pattern portion.

Abstract: An electronic unit includes: a case; a circuit board; and a cover, wherein a portion of a connector, which is provided on the circuit board, to be connected to a mating connector is exposed to the outside through a through hole of the cover, a first clearance portion and a second clearance portion are provided in at least one of a portion located between the cover and the case at a position of the opening and a portion located between the cover and the connector at a position of the through hole, a clearance in the first clearance portion is larger than a clearance in the second clearance portion, the second clearance portion is located on an inner side of the case relative to the first clearance portion, and the first clearance portion extends and reaches the second clearance portion while maintaining a constant clearance.

Abstract: An electronic device is provided. The electronic device includes a display forming the front surface of the electronic device, a housing in which the display is seated and which at least forms a first side surface of the electronic device, an opening provided in the first side surface formed by the housing, a printed circuit board disposed adjacent to the first side surface, a connecting interface disposed on the PCB so as to be electrically connected to an external connector when the external connector is inserted through the opening, and a reinforcement member disposed on the PCB so as to surround the side surface of the connecting interface without covering the top surface of the connecting interface.

Abstract: Provided is a power conversion device, including: a casing that has a front surface with an opening; an insertion component including an insertion portion; and a gasket. The casing has an inner wall surface being in contact with the gasket and a casing-side guide surface. The insertion portion has an outer peripheral surface being in contact with the gasket and an insertion component-side guide surface. When a distance in the insertion direction between the front surface and an end of the casing-side guide surface, which is closer to the front surface in the insertion direction, is represented by L1 and a distance between an inner surface of the gasket in the insertion direction and a distal end of the insertion component-side guide surface in the insertion direction is represented by L2, the distance L2 is set larger than the distance L1.

Abstract: According to an embodiment of the present disclosure, an electronic device comprise a housing including a mounting hole in which a battery module is mounted and a printed circuit board disposed adjacent to the mounting hole and electrically connected with the battery module, wherein the battery module include a battery cell having a connector projecting in a first direction, a terminal circuit including at least one connecting terminal electrically connected with the connector, a supporting case disposed at a side of the battery cell, seating the terminal circuit therein, and having an opening to expose at least part of the connecting terminal of the terminal circuit, and at least one upper film unit disposed facing a surface of the supporting case to protect the battery cell or the terminal circuit. According to the present disclosure, an electronic device including a battery module eliminates the need for an FPCB, leading to cost savings and simplified assembly.