Group Viii Metal Patents (Class 106/1.27)
  • Patent number: 10358724
    Abstract: The present invention provides an electroless nickel plating solution supplying high flexibility to a plated layer and having improved stability. The electroless nickel plating solution according to an embodiment of the present invention is an electroless nickel plating layer using an electroless nickel plating method. The electroless nickel plating solution comprises: a nickel metal salt providing a nickel ion for plating, and containing sulfamic acid nickel; a reducer reducing the nickel ion for plating; a complexing agent forming a complex together with the nickel ion for plating; and a cyan-based stabilizer providing stability of the electroless plating solution and preventing the generation of pits in a flexible nickel plated layer.
    Type: Grant
    Filed: July 1, 2014
    Date of Patent: July 23, 2019
    Assignee: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY
    Inventors: Hongkee Lee, Junmi Jeon
  • Patent number: 10358734
    Abstract: A nickel solution for forming a film that can suppress generation of hydrogen gas between a solid electrolyte membrane and a substrate while the solid electrolyte membrane and the substrate are brought into contact with each other. The pH of the nickel solution for forming a film is in the range of 4.2 to 6.1. The nickel solution for forming a film further contains a pH buffer solution that has a buffer function in the range of the pH and does not form insoluble salts or complexes with the nickel ions during formation of the film.
    Type: Grant
    Filed: October 2, 2014
    Date of Patent: July 23, 2019
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Motoki Hiraoka, Hiroshi Yanagimoto, Yuki Sato, Yoshitaka Shimmei, Kensuke Akamatsu
  • Patent number: 10066303
    Abstract: The invention relates to a substrate having at least one main surface comprising at least one non-noble metallic bonding landing pad covered by a capping layer thereby shielding the non-noble metallic bonding landing pad from the environment. This capping layer comprises an alloy, the alloy being NiB or CoB and containing an atomic concentration percentage of boron in the range of 10% to 50%.
    Type: Grant
    Filed: February 27, 2015
    Date of Patent: September 4, 2018
    Assignees: IMEC VZW, GLOBALFOUNDRIES INC.
    Inventors: Eric Beyne, Joeri De Vos, Jaber Derakhshandeh, Luke England, George Vakanas
  • Patent number: 9975110
    Abstract: A method for producing metal catalyst nanoparticles with a predetermined and/or narrow particle size distribution, and/or a predetermined size, wherein the method comprising a first quenching step and a second quenching step, which may, at least in part, determine the obtained metal catalyst nanoparticles' particle size distribution and/or size.
    Type: Grant
    Filed: November 23, 2016
    Date of Patent: May 22, 2018
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Nam Hawn Chou, Ryan K. McKenney
  • Patent number: 9732434
    Abstract: Disclosed herein are systems and methods for electroplating nickel which employ substantially sulfur-free nickel anodes. The methods may include placing a semiconductor substrate in a cathode chamber of an electroplating cell having an anode chamber containing a substantially sulfur-free nickel anode, contacting an electrolyte solution having reduced oxygen concentration with the substantially sulfur-free nickel anode contained in the anode chamber, and electroplating nickel from the electrolyte solution onto the semiconductor substrate placed in the cathode chamber. The electroplating systems may include an electroplating cell having an anode chamber configured for holding a substantially sulfur-free nickel anode, a cathode chamber, and a substrate holder within the cathode chamber configured for holding a semiconductor substrate. The systems may also include an oxygen removal device arranged to reduce oxygen concentration in the electrolyte solution as it is flowed to the anode chamber.
    Type: Grant
    Filed: April 18, 2014
    Date of Patent: August 15, 2017
    Assignee: Lam Research Corporation
    Inventor: Bryan L Buckalew
  • Patent number: 9610533
    Abstract: An adsorption-desorption material, in particular, crosslinked organo-amine polymeric materials having a weight average molecular weight of from about 500 to about 1×106, a total pore volume of from about 0.2 cubic centimeters per gram (cc/g) to about 2.0 cc/g, and an adsorption capacity of at least about 0.2 millimoles of CO2 adsorbed per gram of adsorption-desorption material, and linear organo-amine polymeric materials having a weight average molecular weight of from about 160 to about 1×106, a total pore volume of from about 0.2 cubic centimeters per gram (cc/g) to about 2.0 cc/g, and an adsorption capacity of at least about 0.2 millimoles of CO2 adsorbed per gram of adsorption-desorption material. This disclosure also relates in part to processes for preparing the crosslinked organo-amine materials and linear organo-amine materials.
    Type: Grant
    Filed: July 6, 2015
    Date of Patent: April 4, 2017
    Assignee: ExxonMobil Research and Engineering Company
    Inventors: Dennis G. Peiffer, David C. Calabro, Quanchang Li, Mobae Afeworki, Stephen M. Cundy
  • Patent number: 9579639
    Abstract: The present invention is directed, at least in part, to a process for improving the efficiency of a photocatalyst (a semiconductor photocatalyst) by tethering (depositing) a metal (e.g., metal ions of a late transition metal, such as nickel) to the semiconductor (photocatalyst) surface through the use of an organic ligand. More specifically, 1,2-ethanedithiol (EDT) functions as an excellent molecular linker (organic ligand) to attach a transition metal complex (e.g., nickel (Ni2+ ions)) to the semiconductor surface, which can be in the form of a cadmium sulfide surface. The photocatalyst has particular utility in generating hydrogen from H2S.
    Type: Grant
    Filed: September 4, 2014
    Date of Patent: February 28, 2017
    Assignees: SAUDI ARABIAN OIL COMPANY, KING ABDULLAH UNIVERSITY OF SCIENCE AND TECHNOLOGY
    Inventors: Kazuhiro Takanabe, Tayirjan Isimjan, Weili Yu, Silvano Del Gobbo, Wei Xu
  • Patent number: 9533248
    Abstract: An adsorption-desorption material, in particular, crosslinked organo-amine polymeric materials having a weight average molecular weight of from about 500 to about 1×106, a total pore volume of from about 0.2 cubic centimeters per gram (cc/g) to about 2.0 cc/g, and an adsorption capacity of at least about 0.2 millimoles of CO2 adsorbed per gram of adsorption-desorption material, and linear organo-amine polymeric materials having a weight average molecular weight of from about 160 to about 1×106, a total pore volume of from about 0.2 cubic centimeters per gram (cc/g) to about 2.0 cc/g, and an adsorption capacity of at least about 0.2 millimoles of CO2 adsorbed per gram of adsorption-desorption material. This disclosure also relates in part to processes for preparing the crosslinked organo-amine materials and linear organo-amine materials.
    Type: Grant
    Filed: July 6, 2015
    Date of Patent: January 3, 2017
    Assignee: EXXONMOBIL RESEARCH AND ENGINEERING COMPANY
    Inventors: Dennis G. Peiffer, David C. Calabro, Quanchang Li, Mobae Afeworki, Stephen M. Cundy
  • Patent number: 9533249
    Abstract: An adsorption-desorption material, in particular, crosslinked organo-amine polymeric materials having a weight average molecular weight of from about 500 to about 1×106, a total pore volume of from about 0.2 cubic centimeters per gram (cc/g) to about 2.0 cc/g, and an adsorption capacity of at least about 0.2 millimoles of CO2 adsorbed per gram of adsorption-desorption material, and linear organo-amine polymeric materials having a weight average molecular weight of from about 160 to about 1×106, a total pore volume of from about 0.2 cubic centimeters per gram (cc/g) to about 2.0 cc/g, and an adsorption capacity of at least about 0.2 millimoles of CO2 adsorbed per gram of adsorption-desorption material. This disclosure also relates in part to processes for preparing the crosslinked organo-amine materials and linear organo-amine materials.
    Type: Grant
    Filed: July 6, 2015
    Date of Patent: January 3, 2017
    Assignee: ExxonMobil Research and Engineering Company
    Inventors: Dennis G. Peiffer, David C. Calabro, Quanchang Li, Mobae Afeworki, Stephen M. Cundy
  • Patent number: 9506159
    Abstract: Provided are robust paint coating systems on metal-coated plastic substrates and processes for forming such material systems as decorative components. An organometallic adhesion promoter is applied to a metal-coated plastic substrate. The metal coating comprises chromium (Cr), nickel (Ni) or combinations thereof. The organometallic adhesion promoter comprises (i) a transition metal selected from the group consisting of: zirconium (Zr), titanium (Ti), chromium (Cr), and combinations thereof, (ii) a first ligand complexed to the transition metal comprising an organofunctional group, and (iii) a second ligand complexed to the transition metal having a hydrolysable functional group. Then, one or more organic paint precursor materials are applied thereon.
    Type: Grant
    Filed: April 22, 2014
    Date of Patent: November 29, 2016
    Assignee: SRG Global, Inc.
    Inventor: Elena Sebe
  • Publication number: 20150110965
    Abstract: The present invention relates to aqueous plating bath compositions for deposition of nickel and nickel alloys utilizing novel stabilising agents possessing a carbon-carbon triple bond and a functional group to enhance the bath performance.
    Type: Application
    Filed: May 31, 2013
    Publication date: April 23, 2015
    Applicant: Atotech Deutschland GmbH
    Inventors: Heiko Brunner, Jan Picalek, Iulia Bejan, Carsten Krause, Holger Bera, Sven Rückbrod
  • Patent number: 8961670
    Abstract: The present invention relates to aqueous, alkaline plating bath compositions for electroless deposition of ternary and quaternary cobalt alloys Co-M-P, Co-M-B and Co-M-B—P, wherein M is selected from the group consisting of Mn, Zr, Re, Mo, Ta and W which comprise a propargyl derivative as the stabilizing agent. The cobalt alloy layers derived there from are useful as barrier layers and cap layers in electronic devices such as semiconducting devices, printed circuit boards, and IC substrates.
    Type: Grant
    Filed: January 9, 2013
    Date of Patent: February 24, 2015
    Assignee: Atotech Deutschland GmbH
    Inventors: Holger Bera, Heiko Brunner
  • Patent number: 8936672
    Abstract: Disclosed are various methods, kits, and compositions in the field of electroless nickel plating and chemical polishing. An electroless nickel plating composition may include a surfactant-brightener; a coupler; a bismuth metallic stabilizer; and organosulfur stabilizer and a bismuth complexer. Prior to plating, a substrate may be polished with a polishing composition that includes a surface blocker and a surface leveler. When practiced in accordance with the preferred teachings described herein, the electroless nickel plating composition is capable of providing a mirror-bright, lustrous finish, and has good leveling properties. The composition may be made without lead or cadmium.
    Type: Grant
    Filed: May 29, 2013
    Date of Patent: January 20, 2015
    Assignee: Accu-Labs, Inc.
    Inventors: Peter Tremmel, Orville Broch, Stephen Brent Cornwell
  • Patent number: 8858693
    Abstract: An electroless plating bath composition for plating particulate matter is provided. The plating bath composition includes a metal-containing component and a reducing component. The particulate matter is plated with at least one metal layer including at least two metals by electroless metal deposition in order to provide cutting and grinding tools with improved wear resistance.
    Type: Grant
    Filed: January 11, 2012
    Date of Patent: October 14, 2014
    Assignee: OMG Electronic Chemicals, LLC
    Inventor: Stephen E. Penik, Jr.
  • Publication number: 20140150689
    Abstract: The present invention relates to an aqueous plating bath composition for depositing a nickel phosphorous alloy having a phosphorous content in the range of 5 to 12 wt. %. The plating bath comprises a sulfur-containing organic stabilizing agent.
    Type: Application
    Filed: July 4, 2012
    Publication date: June 5, 2014
    Applicant: ATOTECH DEUTSCHLAND GMBH
    Inventors: Boris Alexander JANSSEN, Holger BERA, Sebastian WEISSBROD, Britta SCHAFSTELLER
  • Patent number: 8734579
    Abstract: An aqueous solution containing divalent iron ions having improved storage stability such that the oxidation over time of divalent iron ions in the aqueous solution containing divalent iron ions to trivalent iron ions is suppressed and the occurrence of the precipitation of iron (III) hydroxide is prevented for long periods. The aqueous solution contains divalent iron ions having improved storage stability characterized in that it contains divalent iron ions and a hydroxylamine salt as a reducing agent and has a pH of 3.0 or lower. The pH is preferably 2.2 or lower and more preferably 1.2 or lower.
    Type: Grant
    Filed: October 25, 2010
    Date of Patent: May 27, 2014
    Assignee: JX Nippon Mining & Metals Corporation
    Inventors: Masaomi Murakami, Junnosuke Sekiguchi
  • Patent number: 8715403
    Abstract: The invention relates to an acidic, aqueous, chromium-free composition (A) for the anti-corrosive treatment of steel and/or galvanized steel surfaces comprising metal ions (M) selected from ions at least of the elements nickel, cobalt, molybdenum, iron or tin and a multi-stage method applying the composition (A) for the anti-corrosive pre-treatment of metal components which have steel and/or galvanized steel surfaces. The invention further relates to metal surfaces of zinc or iron having a passive layer system comprising at least 30 mg/m2 nickel and at least 10 mg/m2 zircon, titanium and/or hafnium and sulfur, wherein nickel is present in metallic form at up to at least 30 At. %, obtainable in a method according to the invention.
    Type: Grant
    Filed: May 31, 2012
    Date of Patent: May 6, 2014
    Assignee: Henkel AG & Co. KGaA
    Inventors: Jan-Willem Brouwer, Frank-Oliver Pilarek, Jens Krömer, William E. Fristad, Helene Maechel
  • Patent number: 8663376
    Abstract: A surface treatment solution for autodeposition coating treatment of a metallic material, which is an aqueous solution comprising at least one tannin, at least one crosslinking agent having a crosslinking group capable of thermosetting reaction with a phenolic hydroxyl group and/or a phenolic nucleus, ferric ions, soluble type elemental fluorine, and an oxidizing agent, wherein the solids mass concentration ratio of the tannin to the crosslinking agent is in the range of from 1:1 to 1:10, the molar concentration of the soluble type elemental fluorine is at least 3-fold the molar concentration of the ferric ions, and the pH of the solution is from 2 to 6.
    Type: Grant
    Filed: December 1, 2010
    Date of Patent: March 4, 2014
    Assignee: Henkle AG & Co. KGaA
    Inventors: Takaomi Nakayama, Hideki Takakuwa, Takahiro Fujino
  • Patent number: 8632628
    Abstract: One aspect of the present invention is a deposition solution to deposit metals and metal alloys such as for fabrication of electronic devices. According to one embodiment, the deposition solution comprises metal ions and a pH adjustor. The pH adjustor comprises a functional group having a general formula (R1R2N)(R3R4N)C?N—R5 where: N is nitrogen; C is carbon; and R1, R2, R3, R4, and R5 are the same or different and represent hydrogen, alkyl group, aryl group, or alkylaryl group. Another aspect of the presented invention is a method of preparing deposition solutions. Still another aspect of the present invention is a method of fabricating electronic devices.
    Type: Grant
    Filed: October 29, 2010
    Date of Patent: January 21, 2014
    Assignee: Lam Research Corporation
    Inventor: Artur Kolics
  • Patent number: 8623764
    Abstract: Compositions and methods for forming metal films on semiconductor substrates are disclosed. One of the disclosed methods comprises: heating the semiconductor substrate to obtain a heated semiconductor substrate; exposing the heated semiconductor substrate to a composition containing at least one metal precursor comprising at least one ligand, an excess amount of neutral labile ligands, a supercritical solvent, and optionally at least one source of B, C, N, Si, P, and mixtures thereof; exposing the composition to a reducing agent and/or thermal energy at or near the heated semiconductor substrate; disassociating the at least one ligand from the metal precursor; and forming the metal film while minimizing formation of metal oxides.
    Type: Grant
    Filed: July 21, 2010
    Date of Patent: January 7, 2014
    Assignee: Lam Research Corporation
    Inventor: Mark Ian Wagner
  • Patent number: 8617301
    Abstract: Compositions and methods for depositing elemental metal M(0) films on semiconductor substrates are disclosed. One of the disclosed methods comprises: heating the semiconductor substrate to obtain a heated semiconductor substrate; exposing the heated semiconductor substrate to a composition containing a metal precursor, an excess amount of neutral labile ligands, and a supercritical solvent; exposing the metal precursor to a reducing agent and/or thermal energy at or near the heated semiconductor substrate; reducing the metal precursor to the elemental metal M(0) by using the reducing agent and/or the thermal energy; and depositing the elemental metal M(0) film while minimizing formation of metal oxides.
    Type: Grant
    Filed: January 30, 2007
    Date of Patent: December 31, 2013
    Assignee: Lam Research Corporation
    Inventor: Mark Ian Wagner
  • Patent number: 8585811
    Abstract: An aqueous nickel phosphorus tin alloy electroless plating bath and process for depositing a nickel phosphorus tin alloy onto a substrate, particularly an aluminum substrate for memory disk applications, wherein the nickel phosphorus tin alloy deposit provides enhanced thermal stability, as defined by the inhibition of crystallization and suppression of magnetization upon high temperature annealing when compared to typical NiP deposits.
    Type: Grant
    Filed: August 22, 2011
    Date of Patent: November 19, 2013
    Assignee: OMG Electronic Chemicals, LLC
    Inventors: Aurora Marie Fojas Nye, Jerry G. Du, Robert C. Andre
  • Patent number: 8460534
    Abstract: The invention relates to a treatment solution for producing substantially chromium(VI) free black conversion layers on alloy layers containing zinc, the solution comprising the following: (i) at least one first carboxylic acid having 1 to 8 carbon atoms, the acid containing no polar groups with exception of the carboxyl group and being a monocarboxylic acid, (ii) at least one second carboxylic acid having 1 to 8 carbon atoms, comprising at least one further polar group that is selected from —OH, —SO3H, —NH2, —NHR, —NR2, —NR3+, and —COOH (wherein R is a C1-C6 alkyl group), (iii) 20 to 400 mmol/l Cr3+ and (iv) 50 to 2000 mmol/l NO3?. The invention further provides a method for the black passivation of surfaces containing zinc, wherein the surface to be treated is immersed into such a treatment solution.
    Type: Grant
    Filed: January 15, 2008
    Date of Patent: June 11, 2013
    Assignee: Atotech Deutschland GmbH
    Inventors: Jaroslava Krizova, Vaclav Kriz, Jiri Kloubek, Björn Dingwerth
  • Patent number: 8420035
    Abstract: The invention relates to a coating composition for diesel oxidation catalysts or a combination of diesel oxidation catalysts and diesel particle filters, said coating composition comprising a combination of a noble metal on a metal oxide, with the exception of cerium oxide, and a zeolite doped with iron. The invention also relates to a catalyst provided with the coating according to the invention, and to a method for treating the exhaust gas of diesel internal combustion engines.
    Type: Grant
    Filed: November 27, 2008
    Date of Patent: April 16, 2013
    Assignee: Sued-Chemie IP GmbH & Co. KG
    Inventors: Gerd Maletz, Volker Kurth, Andreas Bentele, Klaus Wanninger, Arno Tissler
  • Patent number: 8328919
    Abstract: One embodiment of the present invention is a method of electroless deposition of cap layers for fabricating an integrated circuit. The method includes controlling the composition of an electroless deposition bath so as to substantially maintain the electroless deposition properties of the bath. Other embodiments of the present invention include electroless deposition solutions. Still another embodiment of the present invention is a composition used to recondition an electroless deposition bath.
    Type: Grant
    Filed: March 24, 2010
    Date of Patent: December 11, 2012
    Assignee: Lam Research Corporation
    Inventor: Artur Kolics
  • Patent number: 8317909
    Abstract: The present invention provides compositions and processes for preparing metallic ions for deposition on and/or into conductive substrates, such as metals, to substantially eliminate friction from metal to metal contact. It is used in the aqueous embodiment to form new metal surfaces on all metal substrates. The processes form stable aqueous solutions of metal and metalloid ions that can be adsorbed or absorbed on and/or into conductive substrates. The aqueous solutions consist of ammonium alkali metal phosphate salts, and/or ammonium alkali metal sulfate salts mixed with a water soluble metal or metalloid salt from Group I through Group VIII of the periodic table of elements. The aqueous solutions allow for a nano deposition of the metal ions on and/or into the surfaces of conductive substrates. The surfaces created by the deposited metal ions will provide metal passivation and substantially eliminate friction in metal-to-metal contact without the use of hydrocarbon based lubricants.
    Type: Grant
    Filed: March 9, 2010
    Date of Patent: November 27, 2012
    Assignee: DFHS, LLC
    Inventor: Frank G. Defalco
  • Patent number: 8308858
    Abstract: Embodiments as described herein provide methods for depositing a material on a substrate during electroless deposition processes, as well as compositions of the electroless deposition solutions. In one embodiment, the substrate contains a contact aperture having an exposed silicon contact surface. In another embodiment, the substrate contains a contact aperture having an exposed silicide contact surface. The apertures are filled with a metal contact material by exposing the substrate to an electroless deposition process. The metal contact material may contain a cobalt material, a nickel material, or alloys thereof. Prior to filling the apertures, the substrate may be exposed to a variety of pretreatment processes, such as preclean processes and activations processes. A preclean process may remove organic residues, native oxides, and other contaminants during a wet clean process or a plasma etch process. Embodiments of the process also provide the deposition of additional layers, such as a capping layer.
    Type: Grant
    Filed: January 18, 2010
    Date of Patent: November 13, 2012
    Assignee: Applied Materials, Inc.
    Inventors: Michael P. Stewart, Timothy W. Weidman, Arulkumar Shanmugasundram, David J. Eaglesham
  • Patent number: 8293334
    Abstract: The invention relates to a method for a preliminary metallizing treatment of galvanized or zinc alloy-coated steel surfaces or joined metallic parts that at least partly have zinc surfaces, in a surface treatment encompassing several process steps. In the disclosed method, metallic coats of especially a maximum of 100 mg/m2 of molybdenum, tungsten, cobalt, nickel, lead, tin, and/or preferably iron are produced on the treated zinc surfaces. Another embodiment of the invention relates to an uncoated or subsequently coated metallic part which has been subjected to the disclosed preliminary metallizing treatment as well as the use of such a part for making bodies during the production of automobiles, building ships, in the construction industry, and for manufacturing white products.
    Type: Grant
    Filed: November 18, 2009
    Date of Patent: October 23, 2012
    Assignee: Henkel AG & Co. KGaA
    Inventors: Karsten Hackbarth, Wolfgang Lorenz, Eva Wilke, Marcel Roth, Reiner Wark, Michael Wolpers, Guadalupe Sanchis Otero, Christian Rosenkranz, Peter Kuhm, Kevin Meagher
  • Patent number: 8292993
    Abstract: Disclosed is an electroless nickel plating bath not containing harmful metal species. In the electroless nickel plating bath, there are contained at least an iron ion source and an iodide ion source. With the use of the electroless nickel plating bath containing at least the iron ion source and the iodide ion source, it is possible to suppress decomposition of the plating bath without using harmful metal species to stabilize the plating bath.
    Type: Grant
    Filed: November 30, 2009
    Date of Patent: October 23, 2012
    Assignee: C. Uyemura & Co., Ltd.
    Inventors: Hiromu Inagawa, Daisuke Hashimoto, Shinji Ishimaru, Masayuki Kiso
  • Publication number: 20120156387
    Abstract: The present invention relates to an electrolyte for the electroless deposition of a metal layer on a substrate, wherein the electrolyte is free of heavy metal stabilizers, cyanides, selenium compounds and sulfur compounds comprising sulfur in an oxidation state between ?2 and +5, and in which instead a ?-amino acid is used as stabilizer. In particular, the inventive electrolyte can comprise 3-aminopropionic acid, 3-aminobutyric acid, 3-amino-4-methylvaleric acid, and 2-aminoethane-sulfonic acid. Furthermore, the invention is directed to a method for the electroless deposition of metal layers utilizing an inventive electrolyte as well as the use of ?-amino acids as stabilizer in electrolytes for the electroless deposition of metal layers in general.
    Type: Application
    Filed: July 6, 2010
    Publication date: June 21, 2012
    Applicant: ENTHONE INC.
    Inventors: Franz-Josef Stark, Christoph Werner
  • Patent number: 8192607
    Abstract: An electrolytic composition for the deposition of a matt metal layer onto a substrate and deposition process where the composition comprises a source of metal from the group consisting of Cr, Mn, Fe, Co, Ni, Cu, Zn, Ru, Rh, Pd, Ag, In, Sn, Sb, Re, Pt, Au, Bi, and combinations thereof; a substituted or unsubstituted polyalkylene oxide or its derivative as an emulsion and/or dispersion former; and a compound comprising fluorated or perfluorated hydrophobic chains or which is a polyalkylene oxide substituted quaternary ammonium compound as wetting agent; wherein the electrolytic composition forms a microemulsion and/or dispersion.
    Type: Grant
    Filed: July 7, 2008
    Date of Patent: June 5, 2012
    Assignee: Enthone Inc.
    Inventors: Andreas Königshofen, Danica Elbick, Christoph Werner, Wolfgang Clauberg, Peter Pies, Andreas Möbius
  • Patent number: 8187499
    Abstract: The invention is related to a composition destined to protect steels against corrosion by utilization of the steel's own rust as a passivating element, the rust being removed from the steel and/or being synthetically prepared and agglutinated with a resin, where the resin can have or cannot have as an electric conductivity promoter material an intrinsically conductor polymer (ICP), in this case polyaniline, in its conducting form (emeraldine salt) or non conducting (emeraldine base), besides filler(s) and a dispersant oil.
    Type: Grant
    Filed: February 14, 2007
    Date of Patent: May 29, 2012
    Assignees: IPQM-Instituto de Pesquisas da Marinha, COPPE/UFRJ-Coordenacao dos Programas de Pos Graduacao de Engenharia da Universidade Federal do Rio de Janeiro
    Inventors: Saint-Clair Dantas Oliveira Santos, Luiz Roberto Martins De Miranda, Bluma Guenther Soares, Paulo Roberto Araújo Martins
  • Patent number: 8182594
    Abstract: An electroless nickel plating liquid capable of forming an underbarrier metal for metal bumps or solder bumps by electroless nickel plating with a uniform film thickness on silicon wafers composed of multiple IC chips contains a water-soluble nickel salt, a reducing agent, a complexing agent, and a pH buffer, wherein_lead ion is contained at 0.01-1 ppm, cobalt ion is contained at 0.01-1 ppm, and a sulfur compound is contained at 0.01-1 ppm.
    Type: Grant
    Filed: September 26, 2006
    Date of Patent: May 22, 2012
    Assignee: Nippon Mining & Metals Co., Ltd.
    Inventors: Eiji Hino, Masashi Kumagai
  • Publication number: 20120103229
    Abstract: An object of the present invention is to provide an aqueous solution containing divalent iron ions having improved storage stability such that oxidation over time of divalent iron ions in the aqueous solution containing divalent iron ions to trivalent iron ions is suppressed and occurrence of the precipitation of iron (III) hydroxide is prevented for long periods. The present invention relates to an aqueous solution containing divalent iron ions having improved storage stability characterized in that it comprises divalent iron ions and a hydroxylamine salt as a reducing agent and has a pH of 3.0 or lower. The pH is preferably 2.2 or lower and more preferably 1.2 or lower.
    Type: Application
    Filed: October 25, 2010
    Publication date: May 3, 2012
    Applicant: JX Nippon Mining & Metals Corporation
    Inventors: Masaomi Murakami, Junnosuke Sekiguchi
  • Publication number: 20120104331
    Abstract: One aspect of the present invention is a deposition solution to deposit metals and metal alloys such as for fabrication of electronic devices. According to one embodiment, the deposition solution comprises metal ions and a pH adjustor. The pH adjustor comprises a functional group having a general formula (R1R2N)(R3R4N)C?N—R5 where: N is nitrogen; C is carbon; and R1, R2, R3, R4, and R5 are the same or different and represent hydrogen, alkyl group, aryl group, or alkylaryl group. Another aspect of the presented invention is a method of preparing deposition solutions. Still another aspect of the present invention is a method of fabricating electronic devices.
    Type: Application
    Filed: October 29, 2010
    Publication date: May 3, 2012
    Inventor: Artur KOLICS
  • Patent number: 8152914
    Abstract: Described is a new process for applying a metal coating to a non-conductive substrate comprising the steps of (a) contacting the substrate with an activator comprising a noble metal/group IVA metal sol to obtain a treated substrate, (b) contacting said treated substrate with a composition comprising a solution of: (i) a Cu(II), Ag, Au or Ni soluble metal salt or mixtures thereof, (ii) 0.05 to 5 mol/l of a group IA metal hydroxide and (iii) a complexing agent for an ion of the metal of said metal salt, wherein an iminosuccinic acid or a derivative thereof is used as said complexing agent.
    Type: Grant
    Filed: April 24, 2008
    Date of Patent: April 10, 2012
    Assignee: Atotech Deutschland GmbH
    Inventors: Sigrid Schadow, Brigitte Dyrbusch, Carl Christian Fels
  • Patent number: 8147601
    Abstract: This invention is directed to a process for electrolessly metallizing an article, as well as to a plating bath and the subsequent plated substrate. The process comprises contacting the surface of an article with an electroless metallizing bath which may be essentially free of toxic and/or heavy metals.
    Type: Grant
    Filed: December 7, 2010
    Date of Patent: April 3, 2012
    Assignee: Surface Technology, Inc.
    Inventors: Michael Feldstein, Thomas Stephen Lancsek, Jijeesh Jose Thottathil
  • Patent number: 8137447
    Abstract: Disclosed is an electroless plating solution exhibiting a good plating metal filling performance even for larger trenches or vias of several to one hundred and tens of ?m, in a manner free from voids or seams, and allowing maintenance of stabilized performance for prolonged time. The electroless plating solution contains at least a water-soluble metal salt, a reducing agent for reducing metal ions derived from the water-soluble metal salt, and a chelating agent. In addition, the electroless plating solution contains a sulfur-based organic compound as a leveler having at least one aliphatic cyclic group or aromatic cyclic group to which may be linked at least one optional substituent. The aliphatic cyclic group or the aromatic cyclic group contains optional numbers of carbon atoms, oxygen atoms, phosphorus atoms, sulfur atoms and nitrogen atoms.
    Type: Grant
    Filed: June 25, 2009
    Date of Patent: March 20, 2012
    Assignee: C. Uyemura & Co., Ltd.
    Inventors: Teruyuki Hotta, Takahiro Ishizaki, Tomohiro Kawase, Masaharu Takeuchi
  • Patent number: 8048284
    Abstract: Disclosed are metal plating compositions for plating a metal on a substrate. The metal plating compositions include compounds which influence the leveling and throwing performance of the metal plating compositions. Also disclosed are methods of depositing metals on a substrate.
    Type: Grant
    Filed: April 2, 2008
    Date of Patent: November 1, 2011
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Erik Reddington, Gonzalo Urrutia Desmaison, Zukhra I. Niazimbetova, Donald E. Cleary, Mark Lefebvre
  • Patent number: 8012251
    Abstract: There is provided an electroless plating bath which makes it possible to form a diffusion barrier layer of a Re-based alloy, having a uniform thickness regardless of the shape and size of a workpiece, on the surface of a Ni-based alloy by a relatively simple method. The electroless plating bath for forming a Ni—Re—B alloy, containing not less than 50 at % of Re, on a substrate by electroless plating, has a pH of 6 to 8 and includes a metal supply source component containing Ni2+ and ReO4? at an equal equivalent in the range of 0.01 to 0.5 mol/L, a complexing agent component containing citric acid and at least one other organic acid, and a reducing agent component containing dimethylamine-borane.
    Type: Grant
    Filed: March 28, 2008
    Date of Patent: September 6, 2011
    Assignee: Ebara Corporation
    Inventor: Hiroshi Yakuwa
  • Patent number: 8012334
    Abstract: Disclosed are metal plating compositions and methods. The metal plating compositions provide good leveling performance and throwing power.
    Type: Grant
    Filed: April 2, 2008
    Date of Patent: September 6, 2011
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Erik Reddington, Gonzalo Urrutia Desmaison, Zukhra I. Niazimbetova, Donald E. Cleary, Mark Lefebvre
  • Publication number: 20110195278
    Abstract: The present invention is directed to the fabrication of rigid memory disks, including a metal plating composition which impedes deposition of non-metallic particles during a plating process. The plating composition includes at least one sulfated fatty acid ester additive, or mixtures or salts thereof, of formula: wherein R1 is selected from the group consisting of OH, OCH2, OCH2CH3, C1-C7 alkyl, linear or branched; R2 selected from H and C1-C7 alkyl, linear or branched; m=1 to about 5; n=2 to about 30; o=0 to about 10; M+ is a metal or pseudo metal ion or H+. The additive has a zeta potential which impedes deposit of non-metallic particles. The invention is further directed to a method for electroless plating utilizing the additive composition in a bath with at least a stabilizing agent, complexing agent and reducing agent and source of metal ions.
    Type: Application
    Filed: October 16, 2009
    Publication date: August 11, 2011
    Applicant: ATOTECH DEUTSCHLAND GMBH
    Inventors: Kevin Schell, Grant Keers, Shakeel Akhtar
  • Patent number: 7988774
    Abstract: Systems and methods for electroless deposition of a cobalt-alloy layer on a copper surface include a solution characterized by a low pH. This solution may include, for example, a cobalt(II) salt, a complexing agent including at least two amine groups, a pH adjuster configured to adjust the pH to below 7.0, and a reducing agent. In some embodiments, the cobalt-alloy is configured to facilitate bonding and copper diffusion characteristics between the copper surface and a dielectric in an integrated circuit.
    Type: Grant
    Filed: August 10, 2010
    Date of Patent: August 2, 2011
    Assignee: Lam Research Corporation
    Inventors: Algirdas Vaskelis, Aldona Jagminiene, Ina Stankeviciene, Eugenijus Norkus
  • Patent number: 7875110
    Abstract: An electroless plating composition comprising succinic acid, potassium carbonate, a source of cobalt metal ions, a reducing agent, and water is provided. An optional buffering agent may also be included in the composition. The composition may be used to deposit cobalt metal in or on semiconductor substrate surfaces including vias, trenches, and interconnects.
    Type: Grant
    Filed: February 16, 2010
    Date of Patent: January 25, 2011
    Assignee: Micron Technology, Inc.
    Inventors: Rita J. Klein, Adam J. Regner, III
  • Patent number: 7850770
    Abstract: The present invention relates to the use of ternary nickel-containing metal alloys of the NiMR type (where M=Mo, W, Re or Cr, and R=B or P) deposited by an electroless process in semiconductor technology. In particular, the present invention relates to the use of these deposited ternary nickel-containing metal alloys as barrier material or as selective encapsulation material for preventing the diffusion and electromigration of copper in semiconductor components.
    Type: Grant
    Filed: April 22, 2004
    Date of Patent: December 14, 2010
    Assignee: BASF Aktiengesellschaft
    Inventor: Alexandra Wirth
  • Publication number: 20100304562
    Abstract: Systems and methods for electroless deposition of a cobalt-alloy layer on a copper surface include a solution characterized by a low pH. This solution may include, for example, a cobalt(II) salt, a complexing agent including at least two amine groups, a pH adjuster configured to adjust the pH to below 7.0, and a reducing agent. In some embodiments, the cobalt-alloy is configured to facilitate bonding and copper diffusion characteristics between the copper surface and a dielectric in an integrated circuit.
    Type: Application
    Filed: August 10, 2010
    Publication date: December 2, 2010
    Applicant: Lam Research Corporation
    Inventors: Algirdas Vaskelis, Aldona Jagminiene, Ina Stankeviciene, Eugenijus Norkus
  • Patent number: 7794530
    Abstract: Systems and methods for electroless deposition of a cobalt-alloy layer on a copper surface include a solution characterized by a low pH. This solution may include, for example, a cobalt(II) salt, a complexing agent including at least two amine groups, a pH adjuster configured to adjust the pH to below 7.0, and a reducing agent. In some embodiments, the cobalt-alloy is configured to facilitate bonding and copper diffusion characteristics between the copper surface and a dielectric in an integrated circuit.
    Type: Grant
    Filed: December 22, 2006
    Date of Patent: September 14, 2010
    Assignee: Lam Research Corporation
    Inventors: Algirdas Vaskelis, Aldona Jagminiene, Ina Stankeviciene, Eugenijus Norkus
  • Patent number: 7786011
    Abstract: Compositions and methods for forming metal films on semiconductor substrates are disclosed. One of the disclosed methods comprises: heating the semiconductor substrate to obtain a heated semiconductor substrate; exposing the heated semiconductor substrate to a composition containing at least one metal precursor comprising at least one ligand, an excess amount of neutral labile ligands, a supercritical solvent, and optionally at least one source of B, C, N, Si, P, and mixtures thereof; exposing the composition to a reducing agent and/or thermal energy at or near the heated semiconductor substrate; disassociating the at least one ligand from the metal precursor; and forming the metal film while minimizing formation of metal oxides.
    Type: Grant
    Filed: January 25, 2008
    Date of Patent: August 31, 2010
    Assignee: Lam Research Corporation
    Inventor: Mark Ian Wagner
  • Patent number: 7780772
    Abstract: An electroless deposition chemical system includes an electroless solution including a metal component, and a strongly adsorbed species component having a concentration less than a concentration of the metal component.
    Type: Grant
    Filed: November 25, 2006
    Date of Patent: August 24, 2010
    Assignee: Lam Research Corporation
    Inventors: Artur Kolics, Igor Ivanov
  • Patent number: 7758681
    Abstract: A cobalt-based alloy electroless plating solution according to the present invention comprises a cobalt precursor, a tungsten precursor, a phosphorus precursor, a reducing agent, a complexing agent, a pH regulator and a stabilizer, in which the reducing agent is dimethylamine borane (DMAB) or borohydride and the stabilizer is one or more compounds selected from a group consisting of imidazole, thiazole, triazole, disulfide and their derivatives; and which is stable enough for long-term reuse and prevents deterioration of metal thin-film quality by inhibiting the formation of a precipitate.
    Type: Grant
    Filed: December 29, 2006
    Date of Patent: July 20, 2010
    Assignee: LG Chem, Ltd.
    Inventors: Sang-chul Lee, Min-kyoun Kim, Min-jin Ko