Group Viii Metal Patents (Class 106/1.27)
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Publication number: 20030127015Abstract: Disclosed are electroless nickel plating composition including nickel, a reducing agent, a complexing agent, and an accelerator, wherein the accelerator is a mesoionic compound in an amount sufficient to accelerate the rate of deposition the compositionType: ApplicationFiled: October 24, 2002Publication date: July 10, 2003Applicant: Shipley Company, L.L.C.Inventors: Jochen Heber, Andre Egli
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Publication number: 20020170460Abstract: A metallic coating composition and vacuum metalization process for applying the coating composition on aluminum and steel substrates, for example on vehicle wheels, hub caps, bumpers and the like. The process is environmentally compatible and produces a decorative, wear-resistant chrome finish and comprises four stages: a cleaning or preparation stage, a base coat application stage, a two-step PVD stage, and a topcoat application stage. An organic epoxy, thermosetting powder base coat is applied to smooth the surface to a glass-like finish and to ensure adhesion of the metal coatings. A two part metal coating is applied via a PVD process, consisting of a Ni/Cr base and a Cr layer. A protective acrylic, thermosetting topcoat is applied to protect the metal coating layers.Type: ApplicationFiled: May 2, 2002Publication date: November 21, 2002Inventor: Gary D. Goodrich
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Patent number: 6475644Abstract: Radioactive coating solutions and sol-gels, and corresponding methods for making a substrate radioactive by the application of the radioactive coating solutions and sol-gels thereto. The radioactive coating solution comprises at least one carrier metal and a radioisotope, which may be soluble or insoluble, and may further comprise a reducing agent. The radioactive sol-gel comprises at least one metal alkoxide and a radioisotope, which may be soluble or insoluble. Methods of making a substrate radioactive by coating with radioactive coating solutions or sol-gels are also disclosed, including electrodeposition, electroless deposition, spin coating and dip coating. In a particular embodiment, the radioactive coating formed by the method is a composite coating. Radioactive substrates are also disclosed, comprising a substrate and one or more radioactive coatings, which coatings may be the same or different.Type: GrantFiled: August 31, 1999Date of Patent: November 5, 2002Assignee: Radiovascular Systems, L.L.C.Inventors: Janet M. Hampikian, Neal A. Scott
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Publication number: 20020152925Abstract: A process used during manufacture of printed circuit boards comprises protecting metal pads and/or through-holes to provide a tarnish-resistant and solderable coating. In the method, the pads and/or through-holes are bright-etched, metal plated, preferably by an immersion process, and treated with a tarnish inhibitor. The tarnish inhibitor may be incorporated into the immersion plating bath. The metal plating is usually with silver or bismuth and the pads and/or through-holes comprise copper.Type: ApplicationFiled: April 8, 2002Publication date: October 24, 2002Inventors: Andrew McIntosh Soutar, Peter Thomas McGrath
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Publication number: 20020150692Abstract: A process used during manufacture of printed circuit boards comprises protecting metal pads and/or through-holes to provide a tarnish-resistant and solderable coating. In the method, the pads and/or through-holes are bright-etched, metal plated, preferably by an immersion process, and treated with a tarnish inhibitor. The tarnish inhibitor may be incorporated into the immersion plating bath. The metal plating is usually with silver or bismuth and the pads and/or through-holes comprise copper.Type: ApplicationFiled: March 13, 2002Publication date: October 17, 2002Inventors: Andrew McIntosh Soutar, Peter Thomas McGrath
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Patent number: 6436479Abstract: Disclosed is a method of forming a nickel metal thin film, comprising the steps of coating a substrate with a solution for forming a nickel metal thin film, the solution being formed of an alcohol solution containing nickel ions and a reducible chelate type ligand having a hydrazone unit so as to form a gel film, and subjecting the resultant gel film to a heat treatment under an inert gas atmosphere.Type: GrantFiled: December 13, 2000Date of Patent: August 20, 2002Assignee: President of Gifu UniversityInventors: Yasutaka Takahashi, Yutaka Ohya, Takayuki Ban
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Publication number: 20020100391Abstract: There is provided an electroless Ni—B plating liquid for forming, a Ni—B alloy film on at least part of the interconnects of an electronic device having an embedded interconnect structure, the electroless Ni—B plating liquid comprising nickel ions, a complexing agent for nickel ions, a reducing agent for nickel ions, and ammonums (NH4+). The electroless Ni—B plating liquid can lower the boron content of the resulting plated film without increasing the plating rate and form a Ni—B alloy film having an FCC crystalline structure.Type: ApplicationFiled: November 28, 2001Publication date: August 1, 2002Inventors: Hiroaki Inoue, Kenji Nakamura, Moriji Matsumoto, Hirokazu Ezawa, Masahiro Miyata, Manabu Tsujimura
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Patent number: 6406611Abstract: An electrolytic plating process is provided for electrodepositing a nickel or nickel cobalt alloy which contains at least about 2% to 25% by atomic volume of phosphorous. The process solutions contains nickel and optionally cobalt sulfate, hypophosphorous acid or a salt thereof, boric acid or a salt thereof, a monodentate organic acid or a salt thereof, and a multidentate organic acid or a salt thereof. The pH of the plating bath is from about 3.0 to about 4.5. An electroplating process is also provided which includes electroplating from the bath a nickel or nickel cobalt phosphorous alloy. This process can achieve a deposit with high microyield of at least about 84 kg/mm2 (120 ksi) and a density lower than pure nickel of about 8.0 gm/cc. This process can be used to plate a deposit of essentially zero stress at plating temperatures from ambient to 70° C.Type: GrantFiled: December 8, 1999Date of Patent: June 18, 2002Assignees: University of Alabama in Huntsville, The United States of America as represented by the Marshall Space Flight CenterInventors: Darell E. Engelhaupt, Brian D. Ramsey
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Publication number: 20020014414Abstract: The use of alkali metal, alkaline earth metal, ammonium and substituted ammonium salts of alkyl and alkanol sulfonic acids as additives in pure metal and metal alloy sulfate electroplating baths has a number of unexpected benefits including wider useful current density range, improved appearance and in the case of tin improved oxidative stability. The metals and alloys include but are not limited to tin, nickel, copper, chromium, cadmium, iron, rhodium, ruthenium, iron/zinc and tin/zinc.Type: ApplicationFiled: May 21, 2001Publication date: February 7, 2002Inventors: Hyman D. Gillman, Brenda Fernandes, Kazimierz Wikiel
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Publication number: 20010050231Abstract: The disclosure relates to a process for forming a deposit on the surface of a metallic or conductive surface. The process employs an electrolytic process to deposit a mineral containing coating or film upon a metallic or conductive surface.Type: ApplicationFiled: March 23, 2001Publication date: December 13, 2001Inventors: Robert L. Heimann, William M. Dalton, John Hahn, David M. Price, Wayne L. Soucie
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Patent number: 6319308Abstract: The invention is directed to corrosion and wear resistant metallic coatings containing nickel, boron, particles. The coatings are preferably deposited on catalytically active substrates from an electroless coating bath containing nickel ions, a stabilizer, a metal ion complexing agent, particles and a borohydride reducing agent, at a pH of about 10 to about 14.Type: GrantFiled: December 21, 2000Date of Patent: November 20, 2001Inventor: Edward McComas
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Patent number: 6303231Abstract: The invention discloses a coating solution for use in forming Bi-based ferroelectric thin films containing Bi, metallic element A (at least one selected from the group consisting of Bi. Pb, Ba, Sr, Ca, Na, K and rare earth elements) and metallic element B (at least one selected from the group consisting of Ti, Nb, Ta, W, Mo, Fe, Co and Cr), wherein it contains metal alkoxides of Bi, metallic element A and metallic element B respectively, and contains composite metal alkoxides formed by any two or more of said metal alkoxides; and a ferroelectric thin film, a ferroelectric capacitor and a ferroelectric memory formed by the use of such coating solution, and a method for producing the same.Type: GrantFiled: September 8, 1999Date of Patent: October 16, 2001Assignees: Tokyo Ohka Kogyo Co., Ltd., Oki Electric Industry Co., Ltd.Inventors: Yoshihiro Sawada, Akira Hashimoto, Tetsuya Osaka, Ichiro Koiwa, Juro Mita, Yoshinori Maeno, Yukihisa Okada, Hiroyo Kato
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Patent number: 6290088Abstract: A corrosion resistant gas cylinder and gas delivery system includes an electroless nickel-phosphorous layer overlying the inner surface of a steel alloy cylinder. The nickel-phosphorous layer has a thickness of at least about 20 micrometers and a porosity of no greater than about 0.1%. The electroless nickel-phosphorous layer has a phosphorous content of at least about 10% by weight and a surface roughness of no greater than about 5 micrometers. Prior to introducing liquefied gas into the gas cylinder, a cleaning process is carried out using a two-step baking process to clean the surface of the nickel-phosphorus layer. The nickel-phosphorous layer substantially reduces the contamination of liquefied corrosive gasses stored in the gas cylinder by metal from the steel wall surface underlying the nickel-phosphorous layer.Type: GrantFiled: May 28, 1999Date of Patent: September 18, 2001Assignees: American Air Liquide Inc., Air Liquide Americas America Corporation, L'Air Liquide, Societe Anonyme pour l'Etude et l'Exploitation des Procedes Georges ClaudeInventors: Alan D. Zdunek, Eugene A. Kernerman, William Korzeniowski
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Patent number: 6284123Abstract: An electroplating formulation and process is provided for electroplating an iron layer onto an aluminum or aluminum alloy substrate. The method entails immersing an iron-containing anode and an aluminum containing cathode in an electroplating bath including boric acid in a concentration of at least about 50 grams per liter, and ferrous ions, and then applying electrical current to the cathode. A preferred electroplating bath solution includes the following: (1) Fe+2 having a concentration ranging from about 0.65 to about 2.5 moles per liter of solution; (2) at least one anion associated with the Fe+2 ion; (3) a reducing agent in an amount sufficient to prevent oxidation of Fe+2 to Fe+3; (4) Cl− in an amount sufficient to promote dissolution of the anode and increase the conductivity of the solution; (5) a wetting agent in an amount sufficient to prevent pitting of the aluminum electroplated surface; and (6) boric acid in a concentration of at least about 50 grams per liter.Type: GrantFiled: October 28, 1999Date of Patent: September 4, 2001Assignee: Briggs & Stratton CorporationInventors: John A. Cimermancic, Jerold J. Dallman
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Patent number: 6273943Abstract: An electroless composite plating solution comprising metal ions, a complexing agent for said metal ions, a hypophosphite serving as a reducing agent, a surface active agent, and a water-insoluble composite material, said surface active agent comprising a quaternary ammonium salt surface active agent which has two or more ethylene oxide groups and an alkyl group or a fluorine-substituted alkyl or alkenyl group, said quaternary ammonium salt surface active agent being cationic in nature or exhibiting substantially cationic properties under pH conditions of said plating solution.Type: GrantFiled: January 12, 2000Date of Patent: August 14, 2001Assignee: C. Uyemura & Co., Ltd.Inventors: Tadashi Chiba, Koji Monden
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Publication number: 20010012542Abstract: Disclosed is a method of forming a nickel metal thin film, comprising the steps of coating a substrate with a solution for forming a nickel metal thin film, the solution being formed of an alcohol solution containing nickel ions and a reducible chelate type ligand having a hydrazone unit so as to form a gel film, and subjecting the resultant gel film to a heat treatment under an inert gas atmosphere.Type: ApplicationFiled: December 13, 2000Publication date: August 9, 2001Inventors: Yasutaka Takahashi, Yutaka Ohya, Takayuki Ban
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Patent number: 6262129Abstract: A method of forming nanoparticles includes steps of forming a metal precursor solution from a transition metal, injecting the metal precursor solution to the surfactant solution, adding a flocculent to cause nanoparticles to precipitate out of solution without permanent agglomeration, and adding a hydrocarbon solvent to redisperse or repeptize the nanoparticles.Type: GrantFiled: July 31, 1998Date of Patent: July 17, 2001Assignee: International Business Machines CorporationInventors: Christopher Bruce Murray, Shouheng Sun
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Patent number: 6202885Abstract: A corrosion resistant gas cylinder and gas delivery system includes an electroless nickel-phosphorous layer overlying the inner surface of a steel alloy cylinder. The nickel-phosphorous layer has a thickness of at least about 20 micrometers and a porosity of no greater than about 0.1%. The electroless nickel-phosphorous layer has a phosphorous content of at least about 10% by weight and a surface roughness of no greater than about 5 micrometers. Prior to introducing liquefied gas into the gas cylinder, a cleaning process is carried out using a two-step baking process to clean the surface of the nickel-phosphorus layer. The nickel-phosphorous layer substantially reduces the contamination of liquefied corrosive gasses stored in the gas cylinder by metal from the steel wall surface underlying the nickel-phosphorous layer.Type: GrantFiled: May 28, 1999Date of Patent: March 20, 2001Assignees: American Air Liquide Inc., Air Liquide Americas America Corporation, L'Air Liquide, Societe Anonyme pour l'Etude et l'Exploitation des Procedes Georges ClaudeInventors: Alan D. Zdunek, Eugene A. Kernerman, William Korzeniowski
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Patent number: 6197366Abstract: According to the present invention, a metal paste comprising an organo- or inorganometallic compound of a metal that is a solid at ordinary temperature and belongs to group 3 through 15 of the periodic table, and an amino compound as medium, and which exhibits coatable viscosity, is provided. By using the metal paste, metal films of various types of metals or alloys can be formed inexpensively with an industrially simple process and apparatus even on various types of general-purpose, inexpensive substrates having a low softening point such as a glass, plastic, film and so forth, in addition to a ceramic substrate. In particular, the metal film can be formed easily in an ordinary pressure onto a printed wiring board or a substrate to be coated with a metal, which has a poor heat resistance.Type: GrantFiled: November 5, 1999Date of Patent: March 6, 2001Assignee: Takamatsu Research LaboratoryInventor: Hideki Takamatsu
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Patent number: 6183546Abstract: The invention is directed to corrosion and wear resistant metallic coatings containing nickel, boron, and thallium. The coatings are preferably deposited on catalytically active substrates from an electroless coating bath containing nickel ions, a mixture of thallium nitrate and thallium sulfate as a stabilizer, a metal ion complexing agent, and a borohydride reducing agent, at a pH of about 10 to about 14.Type: GrantFiled: November 2, 1998Date of Patent: February 6, 2001Assignee: McComas Industries InternationalInventor: C. Edward McComas
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Patent number: 6183545Abstract: An aqueous solution for the reductive deposition of metals comprising, besides water, (A) a phosphine of the general formula (1) in which R1, R2, and R3 denote lower alkyl groups, at least one of which being hydroxy-or amino-substituted lower alkyl group, and (B) a soluble compound of a metal or a compound of a metal solubilized through the formation of a soluble complex by said phosphine.Type: GrantFiled: June 28, 1999Date of Patent: February 6, 2001Assignee: Daiwa Fine Chemicals Co., Ltd.Inventors: Yoshiaki Okuhama, Takao Takeuchi, Masakazu Yoshimoto, Shigeru Takatani, Emiko Tanaka, Masayuki Nishino, Yuji Kato, Yasuhito Kohashi, Kyoko Kuba, Tetsuya Kondo, Keiji Shiomi, Keigo Obata, Mitsuo Komatsu, Hidemi Nawafune
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Patent number: 6179985Abstract: The use of alkali metal, alkaline earth metal, ammonium and substituted ammonium salts of alkyl and alkanol sulfonic acids as additives in pure metal and metal alloy fluoroborate electroplating baths has a number of unexpected benefits including wider useful current density range and improved appearance. The metals and metal alloys include but are not limited to tin, lead, copper, cadmium, indium, iron, tin/lead and tin/lead copper.Type: GrantFiled: March 19, 1999Date of Patent: January 30, 2001Assignees: Technic, Inc., Specialty Chemical Systems, Inc.Inventors: Hyman D. Gillman, Brenda Fernandes, Kazimierz Wikiel