Abstract: The invention provides a device for holding a substrate during deposition processes that includes a rotation member rotatable about a first, central axis, and a plurality of substrate holders positioned on the rotation member, the substrate holders being rotatable about second axes. In another aspect, the invention provides a method of applying a substantially uniform coating on a substrate including the steps of providing a device of the invention; mounting a substrate onto the substrate mounts; providing at least one substrate coating station in spaced relation to the substrate mounts; rotating the rotation member about a central axis to position one or more of the substrate mounts at the substrate coating station; supplying the coating through the nozzle; moving the nozzle of the coating station in a direction parallel to the substrate at a predetermined rate to apply a uniform coating on the substrate; and rotating the substrate mounts about the second axes during the coating process.

Abstract: Thermal processing unit sections each with ten tiers and coating processing unit sections each with five tiers are disposed around a first main wafer transfer section and a second main wafer transfer section, and in the thermal processing unit section, the influence of the time required for substrate temperature regulation processing on a drop in throughput can be reduced greatly by transferring the wafer W while the temperature of the wafer W is being regulated by a temperature regulation and transfer device.

Abstract: A pizza sauce dispenser simultaneously dispenses and spreads a precisely controlled amount of sauce onto a pizza dough base without manually handling the sauce or the dough during operation. The dispenser includes a selectively rotatable disc and an arm that selectively extends over the disc. At lease one nozzle is supported by the arm and selectively dispenses the sauce onto the dough. A control mechanism controls: (1) a selected rate and direction of disc rotation; (2) a selected pivot rate and direction of the arm; and/or (3) a selected rate of dispensing sauce through the nozzle. In use, with pizza dough placed on the disc, the disc is rotated and the arm pivoted over the dough so that the nozzle traverses a path from the outside edge of the dough to the center of the dough or vice versa. Sauce thus is deposited in a spiral or other desirable pattern.

Abstract: A spin chuck on which a wafer is mounted is divided into a plurality of regions concentrically in a radial direction, and different temperatures are set for each of the regions so that the temperature gradually increases from the outer periphery to the center. The wafer is placed on this spin chuck, and a processing solution is applied to the wafer and spread over the wafer by centrifugal force, whereby the vaporization of a solvent of the processing solution which is spread on the outer periphery of the wafer is suppressed, and hence the timing of drying of the processing solution within the surface of the wafer can be made uniform. Consequently, a coating film with a uniform thickness within the wafer surface can be obtained.

Abstract: A process and system for applying an adhesive to a core during the production of rolled paper products is disclosed. The system of the present invention is generally directed to the use of pumping devices that meter out constant volumetric amounts of an adhesive onto a core through a plurality of adhesive applicators simultaneously. The systems includes, for instance, a positive displacement pump system in which a fluid at substantially constant pressure is fed to a pumping device for dispensing the adhesive to a plurality of adhesive applicators in constant volumetric amounts.

Abstract: A coating apparatus includes a first dynamic mixing system having a plurality of first coating components that are substantially free of effect pigments and a second dynamic mixing system having a plurality of second coating components having effect pigments. A first directional control device is connected to the first and second dynamic mixing systems. A plurality of reservoirs are connected to the first directional control device. A second directional control device is connected to the reservoirs. A plurality of applicators are connected to the second directional control device.

Abstract: Apparatus for spraying paint on a can or can top includes a carrier for the article, the carrier being formed of with a pedestal, a shaft extending upwardly from the pedestal, and an adapter mounted on the shaft. The adapter engages the article and causes it spin as the carrier spins at the spray painting station. Further, a bottom plate of the apparatus is formed with a slot through which the carrier shaft extends, thereby shielding lower portions of the apparatus from inadvertent spraying.

Abstract: A treatment solution supply apparatus according to the present invention is a treatment solution supply apparatus for supplying a treatment solution onto a substrate which is disposed in a predetermined processing position on a mounting portion, comprising a treatment solution supply nozzle for supplying the treatment solution onto the substrate and a nozzle holder for releasably holding the treatment solution supply nozzle. The treatment solution supply nozzle is disposed in a predetermined stand-by position and the nozzle holder is movable in three dimensions. The movability of the nozzle holder in three dimensions makes it possible to finely adjust the position of the treatment solution supply nozzle and thereby, supply the treatment solution accurately to an appropriate position on the substrate.

Abstract: In this disclosure, air flow is formed above chemical liquid film and a move of the chemical liquid is generated by making the air flow into a contact with the surface of chemical liquid. Further, a negative pressure is generated in a space between a processing object substrate and a plate by rotating the plate. Consequently, uniformity of processing of chemical liquid is improved, so that liquid removing step can be carried out effectively. As a result, yield rate of chemical liquid treatment can be improved.

Abstract: Prior to transfer of an wafer W, a mixed gas is being generated and exhausted, thereby fluctuation of concentration and temperature of a solvent component at the beginning of gas introduction into a chamber 3 is suppressed. A step of gelling after the wafer W is carried into an aging unit is divided into several steps. Until a temperature of the wafer W reaches a predetermined treatment temperature, an average concentration of the solvent component in a mixed gas is gradually raised relative to the temperature of the wafer W. Thereby, immediately after the wafer W is transferred into a sealed chamber, the gas of the solvent component is prevented from condensing.

Abstract: An apparatus for the coating treatment comprises a coating section for coating a substrate with a process solution, a heating section for heating the substrate coated with the process solution, and a recovery section for recovering at least a part of the solvent vapor contained in the hot exhaust gas discharged from the heating section. The recovery section includes a cooling apparatus, and the hot exhaust gas containing a solvent vapor generated from the substrate when the substrate is subjected to a heating treatment is passed through the cooling apparatus so as to cool and condense at least a part of the solvent vapor contained in the hot exhaust gas so as to recover the solvent in the form of a liquid.

Abstract: In one aspect, the invention includes a method of improving uniformity of liquid deposition when a liquid is spin-coated over a non-circular substrate. The substrate is retained on a platform and spun. The circular platform includes a plurality of shaping members pivotally connected to the platform. The plurality of shaping members are biased by spinning the platform to form a platform surface with a circular periphery. In another aspect, the invention includes a substrate coating apparatus. Such apparatus comprises a non-circular substrate support configured to support a substrate with a planar surface and non-circular periphery. The apparatus further comprises a motor configured to spin the substrate support. A plurality of shaping members are pivotally connected with the substrate support and each shaping member has a curved outer side surface.

Abstract: The invention provides a device for holding a substrate during deposition processes that includes a rotation member rotatable about a first, central axis, and a plurality of substrate holders positioned on the rotation member, the substrate holders being rotatable about second axes. In another aspect, the invention provides a method of applying a substantially uniform coating on a substrate including the steps of providing a device of the invention; mounting a substrate onto the substrate mounts; providing at least one substrate coating station in spaced relation to the substrate mounts; rotating the rotation member about a central axis to position one or more of the substrate mounts at the substrate coating station; supplying the coating through the nozzle; moving the nozzle of the coating station in a direction parallel to the substrate at a predetermined rate to apply a uniform coating on the substrate; and rotating the substrate mounts about the second axes during the coating process.

Abstract: A solvent of a resist solution is dropped from a solvent supply nozzle onto the surface of a semiconductor wafer held by a spin chuck. The semiconductor wafer is rotated by the spin chuck to spread the resist solution over the entire surface of the semiconductor wafer W. Simultaneously, the resist solution is dropped from a resist solution supply nozzle onto the semiconductor wafer and spread following the solvent. During the processing, the processing space is isolated from the outer atmosphere by closing a lid of a processing vessel and a sprayed solvent is supplied into the processing space. The processing space is thus filled with the mist of solvent. In the processing space supplied with the solvent, evaporation of the solvent from the resist solution is suppressed. A film of the resist solution is formed with a uniform film thickness to the edge of the semiconductor wafer W.

Abstract: A sealant dispensing system is disclosed which is capable of applying sealant material to irregularly shaped, i.e., non-circular, closure members. To accomplish this, the closure member is loaded onto a rotary chuck in a conventional manner. The sealant applying gun, however, is moveable relative to the end. In this manner, through a combination of rotation of the closure member and movement of the gun, the gun is able to follow the outline of a closure member of any shape. In order to allow non-circular closure members to be loaded onto a chuck, the chuck must first be stopped. After the closure member is loaded, chuck rotation is then initiated. In order to allow this selective chuck rotation, the chuck may be attached to a servo motor. An electromagnet may be located in proximity to each chuck of the sealant dispensing system.

Abstract: An apparatus and method for use with powdered resin feeders provides a continuous stream of powder to a plurality of threaded or non-threaded fasteners. In one preferred embodiment, the apparatus generates a gravity induced powder stream at the free end of a discharge conduit which is intersected by a series of fasteners carried on a conveyor. A vacuum nozzle is positioned adjacent to the powder stream and the conveyor. Both the vacuum nozzle and the free end of the discharge conduit are adjustably positionable relative to the path of the fasteners carried on the conveyor.

Abstract: An apparatus for application of a chemical process to a workpiece in which movement and precise location of the workpiece within the apparatus is accomplished by means of a single linear actuator and two locator components. A sequence of liquid solutions may be applied to a surface of the workpiece during processing, and a sequence of controlled atmospheres may be provided within a reaction chamber of the apparatus to thereby facilitate implementation of chemical processes that utilize both liquid-phase and gas-phase reactions in concert.

Abstract: A substrate processing method and apparatus capable of uniformly supplying a processing liquid to a substrate surface in substrate processing such as development processing without exerting an influence on the physical properties of the processing liquid and without damaging the substrate. A rotating blade is disposed above the horizontally placed substrate so as to face the substrate. The processing liquid is supplied to the surface of the substrate, and the rotating blade is rotated while being kept out of contact with the processing liquid to induce a gas current. The gas current forms a mass of processing liquid having an internal circulating current on the substrate surface below the rotating blade.

Abstract: Method and apparatus for applying a protective coating to the surfaces of air vents in a vented brake rotor wherein the method include the steps of rotating the rotor, directing coating material along with a stream of air toward the inlets of the vents to flood the vents with coating material to the surface, applying a suction to the outlets of the vents to remove and recover the excess material, and curing the coating. The apparatus includes fixtures for mounting the rotors that are driven to rotate the rotors during the coating operation, and for automatic operation a conveyer for advancing the rotors through a vent coating station, an exterior coating station for coating exterior rotor surfaces, and a curing station.

Abstract: The apparatus of the present invention for forming a coating film on a substrate by applying a coating liquid to the substrate comprises: a spin chuck for holding the substrate; a motor for rotating the spin chuck; and a nozzle for dropping the coating liquid on the center surface of the substrate. The nozzle included a spiral groove or a plurality of fins for giving a gyrating force to the dropped coating liquid.

Abstract: An apparatus for processing a substrate by supplying a process liquid to a substrate to be processed in a photolithographic process, comprises a cup, a washing control plate for washing an inner surface of the cup, a spin chuck for rotating the washing control plate or the substrate while holding the washing control plate or the substrate substantially horizontally in the cup, a solvent supply mechanism for supplying a solvent capable of dissolving the process liquid, onto the washing control plate or the substrate held by the spin chuck, a process liquid supply mechanism for supplying the process liquid onto the substrate held by the spin chuck, and a control section for selecting either a solvent to be supplied to the substrate or a solvent to be supplied to the washing control plate and controlling the solvent supply mechanism in accordance with the solvent selected.

Abstract: Methods of dispensing process liquid to provide a uniform layer of the liquid on a surface are disclosed in accordance with the present invention. The methods include dispensing a process liquid on the surface and rotating the surface at a first speed to distribute an effective amount of the process liquid to substantially wet the surface. The method further includes rotating the surface at a second speed to distribute an effective amount of the process liquid to produce a layer of the process liquid on the surface. In a preferred embodiment for dispensing photoresist onto the surface of a semiconductor wafer, the method includes rotating the wafer at the first speed prior to dispensing the photoresist onto the surface. The preferred method further includes decelerating the wafer from the first to the second speed during the dispensing of the photoresist and terminating the dispensing process after the second speed is reached.

Abstract: In one aspect, the invention includes a method of improving uniformity of liquid deposition when a liquid is spin-coated over a non-circular substrate. The substrate is retained on a platform and spun. The circular platform includes a plurality of shaping members pivotally connected to the platform. The plurality of shaping members are biased by spinning the platform to form a platform surface with a circular periphery. In another aspect, the invention includes a substrate coating apparatus. Such apparatus comprises a non-circular substrate support configured to support a substrate with a planar surface and non-circular periphery. The apparatus further comprises a motor configured to spin the substrate support. A plurality of shaping members are pivotally connected with the substrate support and each shaping member has a curved outer side surface.

Abstract: An improved shield for preventing the contamination of a wafer back from resist is combined with process steps that further prevent this contamination. The shield is located where vortex like air currents could otherwise deposit the resist vapor on the wafer back. The shield has the general shape of a cylinder that is open at the top and closed at the bottom. The bottom provides an attachment to a conventional part of the wafer coater and also forms part of the shield. The sides are arranged to extend close to the wafer back at a radius just less than the radius of the wafer. In the improved process, the spindle of the wafer chuck is not rotated at more than 1200 revolutions per minute in any of the wafer spinning operations, and the conventional step of washing the wafer back with a solvent is performed only at the end of the other operations.

Abstract: A sealant dispensing system is disclosed which is capable of applying sealant material to irregularly shaped, i.e., non-circular, closure members. To accomplish this, the closure member is loaded onto a rotary chuck in a conventional manner. The sealant applying gun, however, is moveable relative to the end. In this manner, through a combination of rotation of the closure member and movement of the gun, the gun is able to follow the outline of a closure member of any shape. In order to allow non-circular closure members to be loaded onto a chuck, the chuck must first be stopped. After the closure member is loaded, chuck rotation is then initiated. In order to allow this selective chuck rotation, the chuck may be attached to a servo motor. An electromagnet may be located in proximity to each chuck of the sealant dispensing system.

Abstract: An applicator includes a slot and a reservoir which extends from the slot and has a shape which generally conforms to the slot. The reservoir is configured to contain a liquid therein. A piston which conforms to the reservoir is configured to move in the reservoir to thereby urge the liquid in the reservoir toward the slot.

Abstract: A system and method is provided that facilitates the application of a uniform layer of photoresist material spincoated onto a semiconductor substrate (e.g wafer). The present invention accomplishes this end by utilizing a measurement system that measures the thickness uniformity of the photoresist material applied on a test wafer by a nozzle, and then adjusting the viscosity of the photoresist material by varying the ratio in a solvent/resist mixture, and/or adjusting the temperature of the mixture. A system and method that employs a plurality of nozzles is also provided that disperses resist at different annular regions on a wafer to facilitate the application of a uniform layer of photoresist material spincoated onto the wafer. The system and method utilize a measurement system that measures the thickness and thickness uniformity of each layer of photoresist material applied at each annular region of the wafer.

Abstract: A semiconductor processor for spray coating wafers or other semiconductor articles. The processor has a compartment in which are mounted a wafer transfer, coating station and thermal treatment station. The coating station has a spray processing vessel in which a movable spray-head and rotatable wafer holder. The spray station has coating viscosity control features. An ultrasonic resonating spray-head is precisely supplied with coating from a metering pump. The heat treatment station heat cures the coating and then cools the wafer. The system allows coatings to be applied in relatively uniform conformational layers upon irregular surfaces.

Abstract: A mechanism for effectively dispensing liquid onto a surface of an IC (Integrated Circuit) wafer with minimized back-splash. A nozzle includes a liquid chamber that fills up with the liquid to be dispensed onto the surface of the IC wafer, and the nozzle includes a plurality of nozzle passages. A nozzle passage carries and directs the liquid from the liquid chamber toward the surface of the IC wafer to provide a respective liquid stream from a respective location on the nozzle to a respective spot on the surface of the IC wafer as the IC wafer is spinning. A nozzle passage is disposed within the nozzle at a respective angle with respect to the surface of the IC wafer such that the respective liquid stream from the nozzle passage is directed toward a velocity vector at the respective spot on the surface of the IC wafer where the respective liquid stream hits the surface of the IC wafer. For example, the respective angle of the nozzle passage with respect to the surface of the IC wafer may be 45°.

Abstract: In a solution treatment apparatus, a nozzle for discharging a treatment solution toward a substrate held by a spin chuck includes a discharge opening for discharging the treatment solution on a surface of the substrate. A collision body against which the treatment solution discharged from the nozzle collides is disposed between the discharge opening of the nozzle and the substrate. Since the collision body is disposed between the discharge opening and the substrate, even when the discharge pressure of the treatment solution is high, the discharged treatment solution once collides against the collision body so that the discharge speed on reaching the substrate is reduced, damage to the substrate is eased, and the amount of air entering into the discharged treatment solution is decreased. Accordingly, no micro-bubble occurs.

Abstract: A shuttle feed passage 7 is provided in each functional processing station from a coating booth 1 to an after-heating booth 6 for performing a series of operations from coating to baking and drying. A conveyance frame 12 is fed to each of the booths 1-6 using a shuttle feed method, and conveyance of the workpiece W is stopped to perform the coating operation and the like. An empty conveyance frame 12 from which the coated workpiece W is removed is circulated through a self-propelled feed passage 9. A carriage 39 of the conveyance frame 12 is caused to travel outside the booth 1, and the supporting arm 13 of the conveyance frame 12 is caused to travel inside the booth, wherein the supporting arm is caused to rotate around the axis.

Abstract: Apparatus for coating rotatable objects to be coated include a mechanism for forwarding a plurality of rotatable objects to be coated. The objects to be coated are forwarded rotatingly to receive paint flowing in a curtain form. Paint flowed down is accumulated for re-use. A gravitational shift of paint applied on the objects which is flowable after coating is used to rotate the objects and change an angle of the objects with respect to a horizontal plane so as to control movement of the flowable paint.

Abstract: An apparatus for forming a coating film, comprising a process section for applying a series of processes for forming a coating film to a substrate, and a common transfer mechanism for transferring a substrate in the process section, in which, the process section comprises a cooling unit for cooling a substrate, a coating unit for applying a coating solution containing a first solvent to the substrate to form a coating film, an aging unit for changing the coating film formed in the coating unit to a gel-state film if the coating film is formed in a sol state, a solvent exchange unit for bringing a second solvent, which differs from the first solvent in composition, into contact with the coating film to replace the first solvent contained in the coating film with the second solvent, a curing process unit for heating and cooling the substrate under an atmosphere low in oxygen concentration, thereby curing the coating film, and a heating unit for heating the coating film formed on the substrate.

Abstract: A machine for applying sauce to a pizza crust rapidly and accurately. The crust is placed on a turntable, is centered by stationary platforms having terraced surfaces, and the turntable raises the crust to beneath a plurality of nozzles. The nozzles are mounted to cylinder blocks in which cylindrical cavities are formed. Pistons are slidably mounted in the cavities, and are drivingly linked to a linear prime mover to be displaced upwardly and downwardly to pump sauce into and out of the cavities. Check valves control the flow of sauce from the source of sauce to the crust through the nozzles. The pistons are selectively linked to the linear prime mover for reducing the area onto which the sauce is dispensed, for accommodating smaller and larger pizza crusts.

Abstract: A photoresist dispensing device for use in applying a metered amount of photoresist on a wafer comprises, a photoresist storage tank, a nozzle for spraying the photoresist on the wafer, a feeder unit for drawing a metered amount of the photoresist out of the storage tank and discharging it through the nozzle, a pneumatic control unit for controlling the operation of the feeder unit with the use of pressurized air; and a filter disposed in between the storage tank and the feeder unit for removing alien matters present the photoresist.

Abstract: The present invention is a treatment solution discharge apparatus having a main body with a solution storage portion being formed therein, for discharging a treatment solution in the solution storage portion onto a substrate from discharge ports provided in the main body, and has a first treatment solution supply pipe and a second treatment solution supply pipe for supplying the treatment solution to the aforementioned solution storage portion from an outside of the main body, a first temperature control pipe in which a fluid for controlling temperature flows and which is disposed over an outer circumference of the first treatment solution supply pipe, and a second temperature control pipe in which the fluid for controlling temperature flows and which is disposed over an outer circumference of the second treatment solution supply pipe, and the first temperature control pipe is connected to one end portion of a solution storage portion temperature control pipe disposed in the solution storage portion, and the

Abstract: Temperature regulation is performed at a buffer cassette in which a wafer is temporarily housed before and after being delivered to/from an aligner, or at an inlet-side delivery stage of a portion for delivering a wafer to the aligner, in reference with a state of temperature regulation of the wafer in the aligner, so that the temperature of the wafer can be more accurately regulated on a temperature regulating plate in the aligner in a shorter time. Therefore, circuit patterns can be accurately transferred, and throughput can be improved by speeding up the processing.

Abstract: A coating and developing apparatus for coating a substrate with a plurality of color resists and for developing it after exposure, comprises: a scrubbing unit for scrubbing the substrate; a coating unit having a plurality of resist discharge nozzles for respectively discharging a plurality of color resists on the scrubbed substrate; and a developing unit for developing the substrate coated with the color resists after exposure. Accordingly, reduction in size of apparatus and space savings can be achieved, and manufacturing cost can also be reduced.

Abstract: An apparatus for forming a photoresist film including a photoresist coating unit for coating a photoresist on a wafer, a first chamber in which a nitrogen gas of high pressure and low temperature is dispersed for planarizing the surface of the photoresist film formed on the wafer, the first chamber connected to the photoresist coating unit, and a second chamber in which a dried nitrogen gas of high temperature is dispersed for removing a solvent contained within the photoresist film and baking the photoresist film, the second chamber connected to the first chamber. During the baking process in the second chamber, heat is transferred from the photoresist film to the wafer by dispersing the dried nitrogen gas of high temperature from a nozzle at the upper side of the second chamber.

Abstract: From an adhesive substance application device, correctly formatted adhesive substance applications are applied on a continually conveyed web or on continually conveyed objects by means of a transfer roller that is provided with corresponding format parts. In order to be able to provide the transfer roller in a simple manner with accurately contoured format parts or blocks, the latter are applied or sprayed on the the transfer roller in the form of a hardenable liquid.

Abstract: An apparatus for applying a hardenable or curable liquid coating, such as “varnish” to workpieces, such as electric motor rotor or stator conductor windings comprises a rotary table having plural workpiece supports mounted on the table circumferentially spaced and radially outwardly projecting. Rotatable stator grippers or rotor support heads are mounted at each support and are drivenly engaged with a drive mechanism, including a drive shaft assembly which is operably connected to a ring gear disposed centrally on the table and coaxial with the axis of rotation of the table. The ring gear is drivenly connected to a variable speed drive motor. Electric alternator stator members may be mounted at each support by a releasable pneumatically actuated gripper assembly which is mounted for rotation by a retractable friction wheel connected to the drive shaft assembly.

Abstract: In this disclosure, air flow is formed above chemical liquid film and a move of the chemical liquid is generated by making the air flow into a contact with the surface of chemical liquid. Further, a negative pressure is generated in a space between a processing object substrate and a plate by rotating the plate. Consequently, uniformity of processing of chemical liquid is improved, so that liquid removing step can be carried out effectively. As a result, yield rate of chemical liquid treatment can be improved.

Abstract: A closed space is formed in a reduced pressure drying station, and the closed space is brought to a vacuum state. In this state, an EB unit irradiates a wafer mounted on a hot plate with an electron beam to foam an insulating film material. Subsequently, the hot plate is raised to a predetermined temperature, and drying processing is performed under a reduced pressure. As described above, since the foaming processing is performed in the reduced pressure drying station, bubbles remain in the insulating film, so that the existence of the bubbles can decrease the relative dielectric constant.

Abstract: An apparatus (1) for balancing a rotating body by material addition is disclosed which comprises dispensing means for supplying a balancing material to be applied to the rotating body, the balancing material consisting in a semifluid product (6) susceptible of being dried, as a not yet polymerized resin, and the apparatus comprising a dispensing unit (7) for dispensing measured quantities (9) of the not yet polymerized resin on the rotating body, and a stabilizing unit (14) for catalyzing the polymerization of the resin after dispensing of the same.

Abstract: In a solution treatment apparatus, a nozzle for discharging a treatment solution toward a substrate held by a spin chuck includes a discharge opening for discharging the treatment solution on a surface of the substrate. A collision body against which the treatment solution discharged from the nozzle collides is disposed between the discharge opening of the nozzle and the substrate. Since the collision body is disposed between the discharge opening and the substrate, even when the discharge pressure of the treatment solution is high, the discharged treatment solution once collides against the collision body so that the discharge speed on reaching the substrate is reduced, damage to the substrate is eased, and the amount of air entering into the discharged treatment solution is decreased. Accordingly, no micro-bubble occurs.

Abstract: An apparatus is provided for treating particulate material with a coating medium, in particular for sugarcoating or film-coating pharmaceutical or food preformed pieces. The apparatus comprises a container drivable to rotate about a rotation axis, a spraying device for spraying the material with the coating medium and supplying means for supplying process air. The container comprises a bottom and an upstanding wall where the rotation axis of the container is substantially vertical and where an inclined return surface is arranged in the container. The return surface extends from an upper region of the container in the direction of an inner diameter region of the bottom.

Abstract: An apparatus for forming a panel surface film of a cathode ray tube is provided with a faceplate having an opening for supporting the cathode ray tube in such a manner that the panel surface of the cathode ray tube is exposed when inserted in the opening and is directed downward, a base member, a bearing, provided for the base member, for rotatably supporting the faceplate, and a torque transmission mechanism, coupled to a torque source, for transmitting torque of the torque source to the faceplate through the bearing. The bearing includes an outer ring having a circular inner shape, an inner ring rotatably fitted within the outer ring, rolling elements arranged between the outer ring and the inner ring, a coupling section which is formed on one of the outer and inner rings and to which the faceplate is coupled, and a fixing section which is formed on another one of the outer and inner rings and which is fixed to the base member.

Abstract: A coating and developing apparatus for coating a substrate with a plurality of color resists and for developing it after exposure, comprises: a scrubbing unit for scrubbing the substrate; a coating unit having a plurality of resist discharge nozzles for respectively discharging a plurality of color resists on the scrubbed substrate; and a developing unit for developing the substrate coated with the color resists after exposure. Accordingly, reduction in size of apparatus and space savings can be achieved, and manufacturing cost can also be reduced.

Abstract: Methods and apparatuses for efficiently forming a homogeneous glass layer having uniform thickness and a homogeneous metal layer having uniform thickness are provided. A workpiece is accommodated in a screened container which is rotatable in a predetermined direction. The workpiece in the container is sprayed with an atomized glass slurry or an atomized metal slurry while the container is rotated in order to form a green glass layer or a green metal layer on the workpiece. Simultaneously, hot air is supplied to the workpiece so as to dry the green glass layer or the green metal layer. Thus, the workpiece, typically a ferrite core, can be provided with a homogeneous layer having a uniform thickness. A method for manufacturing an electronic component using the above-described methods and apparatuses is also provided.

Abstract: A vacuum overspray controller reduces or eliminates the overspray incident to the non-contact spray application of a coating material onto a moving, porous substrate. The vacuum assisted overspray controller exposes a first surface of the porous substrate to a vacuum pressure via one or more orifices in its peripheral surface. As a result, particles of coating material that would otherwise contribute to the overspray instead are preferentially received and retained by the second surface of the porous substrate.