Abstract: A coater having a controllable pressurized process chamber for applying photoresist to a wafer is provided. The controllable pressurized process chamber reduces the evaporation of solvent in the photoresist during a spin-on process step. Reducing premature curing of the photoresist results in improved uniform planarization of the photoresist layer. Contaminants in the photoresist are also reduced by having an environmentally controllable process chamber. A housing having a upper and lower section forms a process chamber surrounding a wafer chuck. The upper housing section includes a solvent vapor opening for introducing pressurized solvent vapor into the process chamber and the lower housing section includes an exhaust opening. The upper housing section also includes an opening for introducing photoresist onto a wafer. A control device is coupled to the exhaust opening and a vacuum device for controlling the pressure in the process chamber.

Abstract: Prior to transfer of an wafer W, a mixed gas is being generated and exhausted, thereby fluctuation of concentration and temperature of a solvent component at the beginning of gas introduction into a chamber 3 is suppressed. A step of gelling after the wafer W is carried into an aging unit is divided into several steps. Until a temperature of the wafer W reaches a predetermined treatment temperature, an average concentration of the solvent component in a mixed gas is gradually raised relative to the temperature of the wafer W. Thereby, immediately after the wafer W is transferred into a sealed chamber, the gas of the solvent component is prevented from condensing.

Abstract: A liquid coating apparatus that is adapted for dispensing two or more different liquids and a method for using such apparatus are disclosed. In the apparatus, when two different liquids are dispensed in the same coating apparatus, two separate drain cups are utilized in which an upper drain cup is constructed in a toroidal shape and formed in two symmetrical halves such that they may be withdrawn from an operating position outwardly to allow a wafer platform and a liquid spray nozzle to be lowered into a lower drain cup for dispensing a second liquid material. The lower drain cup can be mounted concentrically with the upper drain cup. The present invention novel apparatus allows at least two different liquids to be processed in the same coating apparatus such that chemical reactions between the different liquids and the resulting particle formation and contamination problems can be avoided.

Abstract: An improved adhesive application assembly (70) for a labeling machine (2) includes an adhesive sprayer (76) which directs heated adhesive (88) towards labels (60) passing the adhesive application station (70). A moving heated adhesive shield (80) includes one or more windows (84), through which the adhesive is sprayed, surrounded by a heated overspray-intercepting surface (90). The intercepted adhesive is collected for reuse.

Abstract: An apparatus for exhausting coating materials used in the process of spin coating a top surface of a wafer, the wafer having an edge and a bottom surface that is supported and rotated by a rotatable chuck attached by a shaft to a spin motor. The apparatus includes a bowl having an exhausted drain configured to receive excess liquid and vapor from the spin coating and an assembly configured to maintain the drain at a negative pressure differential relative to the bowl. In a preferred embodiment, a baffle is attached to the bottom to limit the flow of the liquid and vapor into the drain to a predetermined direction.

Abstract: A resist processing system includes a sensor connected for detecting the surface level of the processing solution contained in an intermediate tank, and a controller connected for controlling the fluid pressure on the basis of the surface level detected by the sensor.

Abstract: An interface apparatus places, in a boat, plural wafers transported thereto one by one from an application apparatus for performing single wafer processing, then transports the boat having the wafers placed therein to a heating apparatus for subjecting plural wafers to a heat treatment process, and after completion of the heat treatment process, receives the boat. The interface apparatus includes a stage, a rotary table rotatably arranged on the stage for placing the boat thereon, and a positioning mechanism for turning the rotary table in a direction of displacement of the boat to permit the boat to be placed on the rotary table when the boat is being placed on the rotary table with the position thereof displaced from a reference position in a rotatable direction of the rotary table, and after completion of the placement, turning the rotary table in a direction opposite to the displacement direction to thereby position the boat at the reference position.

Abstract: Apparatus and process for coating a continuously advancing web with a dry or wet coating material on a conveyor belt. The apparatus having a hopper which contains an agitator, a brush and a knurled roll to accurately dispense the coating material to an applicator which is positioned on a carousel. By rotating the carousel, the coating in the form of stripes, bars or a uniform layer can be varied at angles 0° to 90° on the continuously advancing web.

Abstract: A track coater unit cup set for using in a wafer spin coating process comprises a hollow concave circular base cup, a hollow convex circular inner cup, and a hollow convex circular outer cup. The base cup has an inner circular groove with an inner groove wall and an eccentric outer circular groove with an outer circular groove wall. The inner cup capable of resting upon the base cup by engaging a downward protruding ring with the inner groove wall of the base cup on a meshing interface in between. The outer cup for shielding above top of the inner cup and capable of resting upon the base cup has a central top opening and a ring of inward tip extruding downward from an edge of the outer cup for forming the top opening. A stall-flow region is defined between the inward tip and adjacent insides of the outer cup. The meshing interface further includes at least a set of anchoring means for avoiding relative slipping between the base cup and the inner cup.

Abstract: A liquid dispense apparatus including a chuck having a support surface, a dispense nozzle directed toward the support surface, and a controller. The controller is connected to the dispense nozzle and the chuck and contains instructions which, when executed by the controller, perform the method including rotating the chuck at a first speed, dispensing a process liquid from the dispense nozzle, rotating the chuck at a reduced second speed, and distributing the process liquid while rotating the chuck at the reduced second speed.

Abstract: Apparatuses are disclosed for use in dispensing a process liquid onto a surface of a wafer. The apparatus may include a bowl having a bottom and a side defining an interior region. An air ring is disposed in the interior region to define an upper plenum in fluid communication with a lower plenum. The air ring may have at least one flow path therethrough to said lower plenum, preferably in the form of a plurality of holes in a circumferential groove. Also in a preferred embodiment, a top ring is provided to further define the upper plenum. A semiconductor wafer that has a liquid dispensed thereon, may be supported within the bowl to contact portions of the air ring to remove excess liquid migrating to the underside of the wafer. The excess liquid may be drained through the air ring into the lower plenum wherein it is removed by a drain. A solvent dispenser may be provided in the air ring to apply a solvent to the underside of the wafer.

Abstract: An apparatus and methods for use in spin coating a coating material onto a wafer. The apparatus includes a rotatable chuck capable of supporting the wafer and a bowl having a bottom and a side defining an interior region, the bottom containing an opening through which said rotatable chuck is movable and separable from the bowl. In a preferred embodiment the bottom has a raised cylindrical portion containing the opening and, the rotatable chuck is positioned within the opening so that the wafer is in close proximity to the raised portion of the bowl so as to prevent solvent vapors from escaping the bowl through the opening.

Abstract: An apparatus for exhausting coating materials used in the process of spin coating a top surface of a wafer, the wafer having an edge and a bottom surface that is supported and rotated by a rotatable chuck attached by a shaft to a spin motor. The apparatus includes a bowl having an exhausted drain configured to receive excess liquid and vapor from the spin coating and an assembly configured to maintain the drain at a negative pressure differential relative to the bowl. In a preferred embodiment, a baffle is attached to the bottom to limit the flow of the liquid and vapor into the drain to a predetermined direction.

Abstract: The present invention aims to form a thin coating film of even thickness within a short processing time under a curtailed consumption of coating liquid; where, a gas is spouted from nozzle 4 disposed facing to protection glass 2 of cathode ray tube, and a liquid containing fluorescent material is made to spout accompanied by the spouting gas, to be applied on protection glass 2 by shifting the positioning of protection glass 2 relative to nozzle 4 while spouting the liquid containing fluorescent material.

Abstract: A method and apparatus for making masking tape is provided. A hot melt or thermoplastic adhesive having no added foaming agents, blowing agents, or surfactants is applied to a paper backing having a moisture content, wherein the adhesive is at a temperature near or below the boiling point of water. The adhesive-coated tape is then advanced to a heating device and heat is applied thereto such that the moisture present in the tape is vaporized and dispersed throughout the adhesive to give the adhesive a foam-like quality.

Abstract: The present invention is a means and method for powder dusting various manufactured products such as extrusions, sheet materials, thin films, and piece parts. The powder dusting system includes a regenerative compressor which propels an air/dust mixture through a control valve body into a cone shaped filter where a majority of the air is filtered out. The remaining concentrated air/dust mixture enters a head component where head jets direct the air/dust mixture to the item that is being coated. The powder duster of the present invention also provides a method of coating manufactured products on both their interior and exterior surfaces.

Abstract: In a process and machine for coating a surface of an ophthalmic lens, the lens is manually loaded by the operator to a wash/dry station within an enclosure of the coating machine. Thereafter, the machine computer controls the entire process. The machine is closed to minimize the introduction of external contaminates into the machine. Positive pressure and filtration of air is initiated in the enclosure before washing the lens. The loaded lens is washed and dried at the wash/dry station. The dried lens is transferred to a coating station within the enclosure and coated. The coated lens is transferred to a curing oven within the enclosure and cured. The cured lens is then discharged from the curing oven and the machine for collection by the operator. The machine can simultaneously process three lenses, one in the wash/dry/coat section, one in the cure section and one at a pick-off station between the wash/dry/coat and cure sections of the machine.

Abstract: Apparatus for coating a surface of a semiconductor wafer includes at least one treatment module, a handling device that may access each of the treatment modules, and a host controller connected to the handling device and to each of the treatment modules. The treatment modules may include a coating assembly for coating the semiconductor wafer surface and may also include at least one thermal conditioning module. The host controller may control the handling device to move a semiconductor wafer relative to the treatment modules. The treatment modules may be disposed within opposing assemblies and may be removed from the assemblies without disabling the treatment modules remaining within the opposing assemblies.

Abstract: In a coating unit, a piezovalve driven by piezoelectric elements is used as an opening and closing valve 79. The use of the piezovalve which can nearly disregard delay time makes it possible to accurately control the time of working the opening and closing valve 79 and to finely control working speed thereof at the time of opening and closing the valve. Therefore, operation necessary for closing the valve can be slowly performed, thus appropriately preventing dripping of a resist solution and occurrence of bubbles in a resist solution by air which enters from a forward end of a resist nozzle 60.

Abstract: Apparatus and method for depositing fluids on both sides of a semiconductor wafer that has a central opening are provided. In one aspect, the apparatus includes a mandrel for holding the wafer and a motor coupled to the mandrel and that is operable to rotate the mandrel. The apparatus also includes means for dispensing a first volume of fluid on the semiconductor wafer and a second volume of fluid on the semiconductor wafer. According to the method, a semiconductor wafer is coupled to a rotatable mandrel. The mandrel is rotated to spin the semiconductor wafer and a semiconductor processing fluid is sprayed on the first and second sides of the semiconductor wafer.

Abstract: An atmospheric conditioning unit for supplying temperature- and humidity-controlled air to a chemical processing part (spin coater) is arranged immediately above a chemical processing part, between this chemical processing part and a heat treatment part (including a hot plate and a cool plate). Namely, the chemical processing part, the atmospheric conditioning unit and the heat treatment part are vertically arranged in a stacked manner. The atmospheric conditioning unit receives external air from an opening. A closed partition is provided to block air flow between the atmospheric conditioning unit and a transport area. The temperature- and humidity-controlled air supplied from the atmospheric conditioning unit to the spin coater forms a downflow in the spin coater, and thereafter rises through an opening and joins with the air flowing from the opening, to be introduced into the atmospheric conditioning unit again and reused.

Abstract: When applying a coating film by a spin coating method on a disc-shaped recording medium, the film thickness difference between the inner rim and the outer rim of the disc has to be suppressed. To this end, a coating liquid is supplied to a center portion of the disc-shaped recording medium and a rotary disc, as a center shaft of a rotary disc is inserted into a recess formed in a turntable on which the disc-shaped recording medium is set and the disc-shaped recording medium and a rotary disc are run in rotation. The coating liquid is spread under the centrifugal force caused by rotation for forming a coating film on the disc-shaped recording medium.

Abstract: Electroless plating of very thin metal films, such as copper, is accomplished with a spray processor. Atomized droplets or a continuous stream of an electroless plating solution are sprayed on a substrate. The electroless plating solution may be prepared by mixing a reducing solution and a metal stock solution immediately prior to the spraying. The deposition process may be carried out in an apparatus which includes metal stock solution and reducing reservoirs, a mixing chamber for forming the plating solution, optionally an inert gas or air (oxygen) source, a process chamber in which the solution is sprayed on the substrate and a control system for providing solutions to the mixing chamber and the process chamber in accordance with a predetermined program for automated mixing and spraying of the plating solution. The process can be used to form metal films as thin as 100 .ANG.

Abstract: A photoresist dispensing system used in a photoresist coating machine includes a pump, a sucking-back valve, a solenoid valve, a first pump speed controller, a second pump speed controller and a sucking-back speed controller. The pump is used to transport photoresist and spray a substrate. The sucking-back valve is used to suck back liquid photoresist from a transporting duct end. The solenoid is used to activate or inactivate the pump and the sucking-back valve. The first and the second pump speed controllers are separately coupled between the pump and the solenoid valve, and the sucking-back speed controller is coupled between the sucking-back valve and the sucking-back speed controller is coupled between the sucking-back valve and the route, where is between the pump and the second pump speed controller. Hence, the sucking-back valve produces a sucking force after the pump is inactivated and releases a sucking force after pump is activated.

Abstract: An apparatus for forming a coating film, comprises a spin chuck for supporting a substrate with one surface facing upward and rotating the substrate about a vertical axis, a first nozzle for supplying a solvent of a coating solution on the substrate, and a second nozzle for supplying the coating solution on a central portion of the substrate. The first and second nozzles are supported by a head such that the supported nozzle moves between a dropping position above the substrate and a waiting position offset from the substrate. The solvent and coating solution are diffused along the surface of the substrate by rotating the spin chuck.

Abstract: An apparatus for the coating of flat-form substrates, especially of printed circuit boards, solder masks and the like, wherein there is arranged between two coating stations a turning station for the printed circuit boards, which are conveyed on a transporter pathway through the coating stations and the turning station, wherein in the turning station (4) there are provided in the same plane as the incoming transporter pathway (2) receiving elements (5) located, spaced apart, opposite one another, which enter into engagement with the edge of a printed circuit board (11) or a holding element attached to the printed circuit board, it being possible to pivot those receiving elements (5) through 180.degree. so that, when the printed circuit board is discharged, they again lie in the plane of the onwards-leading transporter pathway (2').

Abstract: A coating apparatus according to the invention comprises a spin chuck for holding a substrate, resist solution tanks which contain a primary resist solution, a thinner tank which contains thinner, a confluence valve communicating with the thinner tank and the resist solution tanks, first pumps each for supplying the confluence valve with the primary resist solution from a corresponding one of the resist solution tanks, a second pump for supplying thinner from the thinner tank to the confluence valve, a mixer for mixing the primary treatment solution and thinner supplied from the confluence valve, a nozzle for applying a solution from the mixer, to the substrate held by the spin chuck, and a controller for controlling the first and second pumps to adjust the mixture ratio of the primary resist solution to be supplied from each of the resist solution tanks to the confluence valve, to thinner to be supplied from the thinner tank to the confluence valve.

Abstract: A coating apparatus of the present invention comprises coating solution supply sources for supplying a coating solution, a mounting table for holding a substrate to allow a surface to be coated to face upward, nozzles for pouring the coating solution toward the surface of the substrate to be coated, mounted on the mounting table, a pump chamber capable of swinging its volume and having a sucking port for introducing the coating solution from the coating solution supply source and a spurting port for spurting the coating solution and to be supplied toward the nozzle, pump driving mechanisms for increasing and decreasing an inner pressure of the pump chamber to introduce and spurt the coating solution into/from the pump chamber, a filter provided inside or at the upstream side of the pump chamber for filtrating the coating solution before the coating solution is spurted out from the pump chamber through the spurting outlet, a valve provided between the pump chamber and the nozzle for regulating a flow amount of

Abstract: A substrate processing apparatus has a simple structure in which the number of nozzles is reduced. In a mixer part, photoresist which is supplied from a photoresist supply through a lower arm portion of the nozzle arm is mixed with solvent which is supplied from a solvent supply through a pipe. Following this mixing, the photoresist and the solvent flow through an upper arm portion and are ejected from a nozzle toward a substrate. In the nozzle arm, a viscometer is disposed to the upper arm portion. The viscometer measures a viscosity of photoresist solution which is obtained by mixing in the mixer part. In accordance with the measurement from the viscometer, the quantity of solvent supplied from the solvent supply is controlled, thereby obtaining a photoresist solution having a desired viscosity.

Abstract: An improved adhesive station (70) for a labeling machine (2) includes an adhesive sprayer (76) which directs heated adhesive (88) towards labels (60) passing along the label path (14). A heated adhesive shield (80) includes a window (84), through which the adhesive is sprayed, surrounded by a heated overspray-intercepting surface (90). The intercepted adhesive is collected for reuse. One type of labeling machine (2) passes a continuous length of label material along the outer surface (34) of a label supporting and cutting assembly (28). The outer surface has a number of slots (50) through which outwardly-extending blades (48) pass to cut the label material into cut labels. Another type (2a) cuts the label from continuous label material using a rotary anvil (106), around which the label material passes, and a rotary die (114) registered with the rotary anvil.

Abstract: In the production of semiconductor devices, a pattern-wise exposed resist coating is developed with a developer to form a resist pattern corresponding to the pattern of exposure radiation on an article to be fabricated. The development being carried out with a developer consisting of one or more organic solvents, in at least two stages and in each stage of the development, the development is interrupted when a substantial permeation of the developer of a surface portion of the pattern-forming area of the resist pattern in which the resist pattern remains is completed, and the developed resist coating is dried between this stage and the following development stages. The development of the exposed resist coating is carried out by using a developing apparatus which comprises at least one set of developer-supplying system and rinsing solution-supplying system, and a conveyor means for guiding the article carrying the resist coating.

Abstract: The present invention provides a fluid delivery system for delivering fluid for a semiconductor manufacturing operation using a sensor to monitor fluid flow and stop fluid flow when gas bubbles or uneven fluid flow occurs. The system comprises: a fluid container 10 connected to a pressurized gas supply 18 by a gas supply tube 17; the fluid container 10 connected to a fluid feed tube 16; the fluid container 10 partially filled with a fluid 12; the fluid feed tube 16 having an inlet end 16A and an outlet end 40; a stop valve 20 connected in the fluid feed tube 16 between the fluid container 10 and the outlet end 40; an optical sensor 30 connected to the fluid feed tube 16; a control computer 39 for actuating the stop valve based on the analysis of the fluid by the optical sensor. The fluid flows from the fluid container 10 onto the wafer 50. The optical sensor 30 monitors the flow of the fluid and stops the flow of fluid when the fluid flowing past the optical sensor 30 contains gas bubbles or flows unevenly.

Abstract: An apparatus coats a semiconductor wafer with photoresist that is to be etched in the manufacture of the semiconductor. The apparatus includes a body having an open top, a spin chuck for revolving a wafer fixed thereon at a uniform rate, a bowl for preventing photoresist from spattering on the body and which is installed inside the body, a photoresist dispensing nozzle for spraying photoresist on the wafer, a side rinse nozzle for removing photoresist adhered to the peripheral edge of the wafer, a cover for opening/closing the top of the body, and a cleaning device associated with the cover for cleaning the bowl. The apparatus allows the bowl to be cleaned while the cover is closed and the bowl is still disposed inside the body. The cleaning device includes a sprinkler and a pump.

Abstract: An apparatus for applying a coating to the head-shank junction of externally threaded fasteners in an automated fashion. The fasteners are positioned, head down, on rotating part holders positioned about the periphery of a rotating disc. The part holders may be magnetic or other forms, and are adapted to maintain the fasteners in a generally fixed position during their movement. The fasteners are pre-heated at a heating station during their rotational movement on the disc. A dispenser is then used to apply the coating to the articles, in timed sequence to the movement of the articles. In this fashion, a coating can be applied to selected portions of the entire periphery of the head-shank junction. A method for applying a coating to the head-shank junction of externally threaded fasteners in an automated fashion also forms part of the present invention.

Abstract: In a resist deposition machine, an edge rinse mechanism comprising a cover covering and surrounding an exfoliating-agent discharging nozzle and having an opening formed at a position in the proximity of a peripheral edge portion of a wafer held on a vacuum chuck, and a forced-exhausting tube coupled to the cover. In an edge rinsing operation, the peripheral edge portion of the wafer is accommodated through the opening into an inside of the cover, and a resist exfoliating agent is discharged from the exfoliating-agent discharging nozzle to a peripheral portion of a resist film formed on the wafer held on the vacuum chuck, so that a dissolved resist material and the resist exfoliating agent are scattered into the inside of the cover, and forcibly exhausted from the cover through the forced-exhausting tube. Thus, it is possible to prevent the dissolved resist material and the resist exfoliating agent from adhering on a resist pattern formation zone of the resist film formed on the wafer.

Abstract: A solid thin film is formed from a layer of liquid material in such a manner as to fill a contact hole formed in a semiconductor structure; a semiconductor structure is firstly cooled rather than ambience, thereafter, liquid material is spread over the semiconductor structure, then the layer of liquid material is pressed so that the liquid material perfectly fills the contact hole, and, finally, the layer of liquid material is heated so as to form a solid layer from the layer of liquid material.

Abstract: In the manufacture of packets on which folding flaps or other packaging parts are connected to one another by glue, the latter is applied to the blank (10) of the packet by glue nozzles 16. When there is a temporary breakdown, the gluing unit (15) is moved into a waiting position remote from the rotary folding unit (11) and held here in an operating position in a phased manner by the release of glue portions.

Abstract: A processing apparatus comprises a resist coating machine for coating resist on the surface of a substrate, a resist removing machine for removing the unnecessary resist stuck to the peripheral portion of the substrate carried out of the resist coating machine, and a transport arm for transporting the substrate from the resist coating machine to the resist removing machine, wherein the resist removing machine comprises a substrate table on which the substrate brought in by the transport arm is placed, a nozzle for spraying a solvent on the peripheral portion to remove the unnecessary resist stuck to the peripheral portion of the substrate on the substrate table; a discharge machine for discharging the solvent used to dissolve and remove the unnecessary resist and the dissolved and removed resist, and an exhaust machine for exhausting the atmosphere under the substrate table downward.

Abstract: A substrate holding apparatus holds a rotating substrate without idly rotating the substrate and keeps the substrate in proper balance while the substrate is rotated. In a revolvable holding member, a column-shaped holding part is disposed on a top surface of a column-shaped supporting part, at an eccentric position with respect to a rotation axis of the supporting part. The revolvable holding member is supported by a rotation base for free rotation, and linked to a magnet holding part which incorporates a permanent magnet. On the other hand, a ring-shaped magnet which is disposed in a processing liquid collecting cup is freely driven by an air cylinder in a vertical direction. As the ring-shaped magnet is moved upward or downward and crosses a predetermined line as viewed in a positional relationship relative to the permanent magnet, which is at a height where the permanent magnet is disposed, the direction of a magnetic line of flux of the ring-shaped magnet is reversed.

Abstract: The present invention provides an apparatus and method for forming a protective film on a disc-shaped recording medium including providing a turntable having a center aperture, setting the disc-shaped recording medium having a center opening on the turntable with the center opening being aligned with the center aperture, covering at least the center opening of the disc-shaped recording medium with a rotating disc having a portion larger in diameter than the center opening of the disc-shaped recording medium, and supplying a protective film material to the center of the rotating disc and simultaneously rotating the turntable, the disc-shaped recording medium, and the disc to cause an outward radial flow of the protective film material off the disc and onto the disc-shaped recording medium so that the protective film is obtained and has a thickness with a small variation.

Abstract: A resist processing system includes a plurality of processing units each having a plurality of compartments stacked one upon the other in a vertical direction, a solution processing device arranged in a compartment positioned in a lower portion of the processing unit for applying a process solution to a substrate W while rotating the substrate, a heating device arranged in a compartment positioned in an upper portion of the processing unit for heating the substrate, a cooling device arranged in an intermediate compartment positioned between the compartment having the heating device arranged therein and the compartment having the solution processing device arranged therein for cooling the substrate, and a main arm mechanism arranged in each of the processing units and provided with a plurality of holders for transferring the substrate W into and out of each compartment, the holder being movable into and out of each of the compartments included in the processing unit, movable in a Z-axis direction, and swingabl

Abstract: A substrate is located within a deposition chamber, the substrate defining a substrate plane. A barrier plate is disposed in spaced relation above the substrate and substantially parallel thereto, the area of said barrier plate in a plane parallel to said substrate being substantially equal to said area of said substrate in said substrate plane, i.e. within 10% of said substrate area. The barrier plate has a smoothness tolerance of 5% of the average distance between said barrier plate and said substrate. A mist is generated, allowed to settle in a buffer chamber, filtered through a 1 micron filter, and flowed into the deposition chamber between the substrate and barrier plate to deposit a liquid layer on the substrate. The liquid is dried to form a thin film of solid material on the substrate, which is then incorporated into an electrical component of an integrated circuit.

Abstract: An apparatus and a method of dispensing process liquid from a liquid source onto a surface of a semiconductor wafer is disclosed in accordance with the present invention. The apparatus includes a nozzle having a bore with a longitudinal axis in fluid communication with the liquid source and a flow surface having a perimeter. The flow surface is oriented at a first angle relative to the axis and in fluid communication with the bore to dispense a sheet of process liquid from the perimeter onto a wafer surface. In a preferred embodiment, the nozzle is axisymmetric and includes a housing having a source portion connected to the liquid source and a dispense portion, and the bore traverses the source and dispense portions. An insert is provided having a first section disposed in the dispense portion of the bore adjacent to the source portion and a second section including the flow surface which is fully circumferential and continuous.

Abstract: A method of and an apparatus for coating a substrate with a polymer solution to produce a film of uniform thickness, includes mounting the substrate inside an enclosed housing and passing a control gas, which may be a solvent vapor-bearing gas into the housing through an inlet. The polymer solution is deposited onto the surface of the substrate in the housing and the substrate is then spun. The control gas and any solvent vapour and particulate contaminants suspended in the control gas are exhausted from the housing through an outlet and the solvent vapor concentration is controlled by controlling the temperature of the housing and the solvent from which the solvent vapor-bearing gas is produced. Instead the concentration can be controlled by mixing gases having different solvent concentrations. The humidity of the gas may also be controlled.

Abstract: An apparatus for forming a coating film, comprises a spin chuck for supporting a substrate with one surface facing upward and rotating the substrate about a vertical axis, a first nozzle for supplying a solvent of a coating solution on the substrate, and a second nozzle for supplying the coating solution on a central portion of the substrate. The first and second nozzles are supported by a head such that the supported nozzle moves between a dropping position above the substrate and a waiting position offset from the substrate. The solvent and coating solution are diffused along the surface of the substrate by rotating the spin chuck.

Abstract: An apparatus, for forming a film, includes an ink jet head having a plurality of nozzles for discharging a liquid, a rotating device for rotating about a rotary axis a coating-object substrate onto which liquid discharged from the ink jet head is deposited, a relatively moving device for moving the ink jet head and the coating-object substrate relatively to each other between a nearby region of the coating-object substrate near the rotary axis and a separate region of the coating-object substrate separate from the rotary axis, and a relative movement control device for controlling the relatively moving device so that an angular velocity of rotation by the rotating device is reduced responsively as a relative position of the ink jet head and the coating-object substrate therebetween makes relative movement from the nearby region toward the separate region, and an angular velocity of rotation by the rotating device is reduced responsively as the relative position of the ink jet head and the coating-object subst

Abstract: This chemical catcher is provided to collect chemical materials in the manufacturing process of the semiconductor device. In particular, this collects the remaining chemical materials for preventing the undesirable effects incurred by the remaining chemical materials after the chemical materials are practically used in the manufacturing process of the semiconductor device. This chemical catcher is mounted to a chemical injecting apparatus which injects the chemical in the manufacturing process of semiconductor, which is comprised of a chemical collecting means arranged in relation to an injection nozzle of the chemical injecting apparatus in order to collect the falling chemical from the injection nozzle, by which means the remaining chemical in the injection nozzle after the chemical injection process is effectively collected and therefore the production of semiconductor having poor quality is reduced.

Abstract: Disclosed is method and apparatus for distributing a chemical over the surface of a substrate. The method includes depositing the chemical on a portion of the surface of a substrate near the center of the substrate. The method further includes controlling the temperature of the surface of a substrate so that the viscosity of the chemical is calibrated to cause the chemical to be deposited on the surface of the substrate in a substantially uniform manner.

Abstract: A substrate treating apparatus for performing a predetermined treatment of a substrate in a spin, has a spin motor including a rotor having a hollow opening centrally thereof, and a stator disposed coaxially with the rotor and having a hollow opening centrally thereof. The rotor includes holders for supporting the substrate in three peripheral positions thereof. A support mechanism switches the holders between a position for supporting the substrate, and a position retracted therefrom. The opposite surfaces of the substrate supported by the holders are cleaned with a cleaning solution supplied through nozzles. The holders have a substrate supporting force derived from a weight and magnetism of the support mechanism, to support the substrate reliably. A guide is disposed in the hollow of the rotor, and connected to the rotor. The holders are arranged in a substrate treating space formed inwardly of the guide. The holders are arranged on the guide.

Abstract: In the present invention, a waste solution and a exhaust gas are guided together from a drain cup DC into a storing means through common discharge means. Naturally, the gas-liquid separation is performed within the storing means in place of performing the gas-liquid separation within the drain cup DC. Therefore, the waste solution is not solidified within the drain cup so as to plug the common discharge means. Also, a predetermined waste solution is kept stored in the storing means included in the coating apparatus of the present invention, making it possible to permit the surface of the stored waste solution to absorb the mist, and the waste solution is prevented from being solidified within the storing means. Further, since a minimum amount of the exhaust gas is kept discharged even during non-operation of the coating apparatus by using an exhaust gas damper whose degree of opening can be controlled, the waste solution stored in the storing means is prevented from being solidified.