Abstract: A coating device includes a chamber, an evaporative source, a coating holder, and a supporting structure. The evaporative source is positioned at the bottom of the chamber. The coating holder is positioned at the top of the chamber and includes concentric annular parts with different diameters, and drive devices connected to the annular parts correspondingly. The drive devices are configured to move the annular parts along axial directions of the annular parts. Each annular part includes a bottom board defining receiving holes for receiving lenses. The supporting structure is positioned at the top of the chamber and supports the drive devices.

Abstract: A method and apparatus for cleaning, drying, coating, baking etching and deposition of surfaces on glass substrate as it transitions thru and between small gaps between hydro-static porous media bearings. Due to the non-contact nature of the device extremely high pressures can be induced upon the work piece through various fluids without damage to the substrate, allowing the system to utilize the viscous nature of fluids to accomplish the desired cleaning, drying, coating, etching or baking. The process also allows for simultaneous and immediately sequential ordering of processes.

Abstract: The present disclosure provides a method and apparatus for coating a medical device.

Abstract: A hydrophobizing agent is supplied to a substrate and a surface of the substrate is hydrophobized. Thereafter, the substrate is dried. The substrate to be processed is maintained in a state of not contacting water until it is dried after being hydrophobized. Collapse of a pattern formed on the substrate surface is thereby suppressed or prevented.

Abstract: The present disclosure is directed to a susceptor support that includes a hub and a plurality of arms extending radially from the hub, where each arm has a terminal end positioned away from the hub. The susceptor support also includes a plurality of elongated rectangular tips formed at the terminal end of each arm, each tip having a length and a width, wherein the length is greater than the width.

Abstract: The present invention provides a description for an instrument for creating arrays of metal nanostructures allows on various substrates at the wafer scale. Embodiment methods permit for the formation of individual and arrays of metal alloys of nanostructures by bringing an array of liquid metal droplets droplet in contact with an array of metal patterns by using high precision manipulation mechanism. Top view and side view optical lenses are used to observe the manipulation process and also allow for aligning the metal droplets with film of solid metal patterns. As one example, this instrument is capable of pattering high aspect ratio nanostructures such as silver-gallium (Ag2Ga) nanowires onto prefabricated microstructures. This invention also describes a method for forming arrays of liquid metal droplets on the tip of micro structures by bringing a flexible membrane containing a liquid metal film, in contact with a pattern of microstructures.

Abstract: A sleeve is positioned over a radially-expandable rod assembly and a stent is positioned over the sleeve. A mandrel is inserted into the rod assembly to thereby press the sleeve against the inner surface of the stent and expand the stent. A coating (such as a solvent, a polymer and/or a therapeutic substance) is then applied to the outer (abluminal) surfaces of the stent, by spraying, for example. The sleeve advantageously prevents the coating material from being applied to inner (luminal) surfaces of the stent and also allows the coating material to be efficiently applied to the abluminal surfaces.

Abstract: The invention relates to a temporary device (1, 20) for spacing an opening element (6) with respect to a fixed element (3) of the vehicle body comprising a fixing plate for anchoring the device on the fixed element and a body which is connected to the fixing plate and forms an abutment (4) for supporting the opening element, wherein at least one part of the abutment is elastically deformable by forces produced by the opening element in the longitudinal direction thereof.

Abstract: In a substrate-processing apparatus for performing coating, baking and developing processes on a semiconductor substrate, a first processing block performs a coating process and a developing process. A second processing block is disposed opposite to the first processing block to heat-treat substrates. A main transfer block is disposed between the first and second processing blocks to transfer the substrates. A third processing block is disposed on one side of the main transfer block in a direction perpendicular to an arrangement direction of the first and second processing blocks to adjust a temperature of the substrates. An auxiliary transfer block is disposed adjacent to the second and third processing blocks to transfer the substrates between the second and third processing blocks. Thus, an overload of the main transfer block may be reduced.

Abstract: A coating and drying apparatus for the application of a coating substance to a stent and drying the stent is provided. The apparatus can include a cartridge. The cartridge can comprise a core, a plurality of stent mandrels, a first clutch, and a second clutch. The core can extend outwards from a circumference of the core. Each stent mandrel can be capable of supporting a stent. The first clutch can be coupled to the core and capable of being removeably coupled to a first shaft such that rotation of the first shaft enables rotation of the core. The second clutch can be coupled to the plurality of stent mandrels and capable of being removeably coupled to a second shaft such that rotation of the second shaft enables rotation of the stent mandrels.

Abstract: An exemplary film coating device includes a film coating holder and a film coating cover. The film coating holder includes a plurality of through holes defined therein for receiving workpieces to be coated. The film coating cover includes a first cover body and a second cover body. The first cover body includes a frame and a plurality of arms. A plurality of shelter pieces is set on the inner side of each arm. Each shelter piece is spatially arranged corresponding to one of the plurality of through holes. The second cover body is configured for covering the first cover body. The height of the second cover body is no less than that of the first cover body.

Abstract: An apparatus for electrostatically applying a powder material to substrates is disclosed. The apparatus comprises a plurality of platens, each platen being arranged to hold a plurality of substrates, wherein each platen comprises an electrically conducting platen base having a plurality of supports for supporting a plurality of substrates, an electrically conducting platen shield located on the platen base and having a plurality of holes arranged to align with the plurality of supports on the platen base, an insulating coating provided between the platen base and the platen shield, a conveyor for conveying the platens along a path, and an applicator for applying the powder material to the substrates.

Abstract: Various embodiments of methods and devices for coating stents are described herein.

Abstract: In one embodiment the disclosure relates to an apparatus for depositing an organic material on a substrate, including a source heater for heating organic particles to form suspended organic particles; a transport stream for delivering the suspended organic particles to a discharge nozzle, the discharge nozzle having a plurality of micro-pores, the micro-pores providing a conduit for passage of the suspended organic particles; and a nozzle heater for pulsatingly heating the micro-pores nozzle to discharge the suspended organic particles from the discharge nozzle.

Abstract: An assembling jig for lens module comprises a crutch, a mobile carrier and a pressing mechanism. The crutch includes a level mounting base and an erect support wall joined to one side of the mounting base. A firm carrier is fixed on the mounting base. The mobile carrier fixed on the firm carrier comprises a carrier base, several positioning blocks disposed around the top surface of the carrier base, the positioning blocks surrounding a restraining groove in which a PCB with a lens socket is received. The pressing mechanism disposed on the support wall includes a pressing member can move up and down and a drive gear connected to one end of the pressing member. This kind of lens module component assembling jig features in assembling lens component steadily and can be applied to different kinds of lens component. Thus it abates the cost of assembling the lens component.

Abstract: To provide a coating apparatus capable of automatically executing a series of steps of measuring the shape of a lens and applying a primer solution thereon, drying the primer solution and applying a photochromic coating solution thereon, and curing the coated solutions by the UV irradiation, liberating the operator from the work of setting the lenses piece by piece. A lens-feeding portion 2 is arranged upstream of the series of steps, the lens-feeding portion 2 having lens-holding units 22 in which a plurality of lenses are arranged straight in the horizontal direction and/or in the up-and-down direction, and a first lens sub-carrier means 31 for carrying the lenses held therein to the lens-measuring portion 3.

Abstract: A substrate support system comprises a substrate holder having a plurality of passages extending between top and bottom surfaces thereof. The substrate holder supports a peripheral portion of the substrate backside so that a thin gap is formed between the substrate and the substrate holder. A hollow support member provides support to an underside of, and is configured to convey gas upward into one or more of the passages of, the substrate holder. The upwardly conveyed gas flows into the gap between the substrate and the substrate holder. Depending upon the embodiment, the gas then flows either outward and upward around the substrate edge (to inhibit backside deposition of reactant gases above the substrate) or downward through passages of the substrate holder, if any, that do not lead back into the hollow support member (to inhibit autodoping by sweeping out-diffused dopant atoms away from the substrate backside).

Abstract: According to one embodiment, a printing medium holder includes a housing and holding section and a winding-shaft holding section. The housing and holding section is detachably attachable to a member holding section of a printing apparatus. The housing and holding section houses and holds a printing medium wound by rotation of a winding shaft member. The winding-shaft holding section is provided in the housing and holding section. The winding-shaft holding section detachably holds the winding shaft member.

Abstract: There is provided a substrate processing apparatus, including: a substrate holder that holds a plurality of substrates (wafers) in a state of being arranged in a lateral direction (approximately in a horizontal direction) approximately in a vertical posture; a processing tube that houses the substrate holder; a throat side sealing part (throat side mechanical flange part) that air-tightly closes an opening part of the processing tube; a rotation part that rotates the substrate holder in a peripheral direction of the substrates, with an arrangement direction (a direction in which the substrates are held) of the plurality of substrates as a rotation axis, wherein the substrate holder includes a fixing part (movable holding part) and a fixture holding part for fixing the substrates approximately in a vertical posture.

Abstract: In a lift pin and an apparatus for processing a substrate having the same, the lift pin includes a body inserted into a penetration hole of a susceptor on which the substrate is positioned and moving along the penetration hole upward and downward in a direction vertical to an upper surface of the susceptor, and a contact member secured to an upper portion of the body and comprising a soft material having hardness smaller than that of the substrate. Thus, the contact member of the lift pin makes contact with the substrate without scratches on a surface of the substrate, to thereby reduce substrate failures in the process.

Abstract: A susceptor for a plasma process apparatus, the susceptor having a graphite main body with a top surface for supporting at least one substrate, the top surface having a plasma sprayed aluminum oxide coating. A vacuum processing chamber, has a main chamber body, a showerhead provided at the ceiling of the chamber body, a pedestal provided inside the chamber body, and a susceptor coupled to the pedestal, the susceptor is made of a graphite main body having a top surface for supporting at least one substrate, the top surface having a dielectric coating such as, e.g., plasma sprayed aluminum oxide coating.

Abstract: A holding device adapted for holding a mask and a substrate during processing of the substrate is provided. The holding device includes a mask frame adapted for supporting the mask and a substrate carrier adapted for carrying the substrate to be processed. The substrate carrier has at least one recess adapted for receiving the mask frame which holds the mask.

Abstract: In a first aspect, a substrate carrier is provided that includes an enclosure adapted to be sealable and to house at least one substrate. The substrate carrier includes a first port leading into the enclosure and adapted to allow a flow of gas into the enclosure while the substrate carrier is closed. Numerous other aspects are provided.

Abstract: Wafer carriers and methods for moving wafers in a reactor. The wafer carrier may include a platen with a plurality of compartments and a plurality of wafer platforms. The platen is configured to rotate about a first axis. Each of the wafer platforms is associated with one of the compartments and is configured to rotate about a respective second axis relative to the respective compartment. The platen and the wafer platforms rotate with different angular velocities to create planetary motion therebetween. The method may include rotating a platen about a first axis of rotation. The method further includes rotating each of a plurality of wafer platforms carried on the platen and carrying the wafers about a respective second axis of rotation and with a different angular velocity than the platen to create planetary motion therebetween.

Abstract: A substrate processing apparatus is disclosed equipped with a transfer mechanism that transfers a substrate processed at a processing block to a carrier so that the increase of the number of transfer process is suppressed, improving the processing efficiency. The substrate processing apparatus is configured in such a way that, when a second-transfer module houses at least one substrate and a carrier that can house the at least one substrate is not placed in a carrier-placement unit, the at least one substrate is transferred to a buffer module. When the second transfer module houses at least one substrate and the carrier that can house the at least one substrate is placed in the carrier-placement unit, the at least one substrate is transferred to the carrier, regardless of whether or not a substrate is being transferred from the buffer module to the carrier.

Abstract: A dry-in/dry-out system is disclosed for wafer electroless plating. The system includes an upper zone for wafer ingress/egress and drying operations. Proximity heads are provided in the upper zone to perform the drying operations. The system also includes a lower zone for electroless plating operations. The lower zone includes an electroless plating apparatus that implements a wafer submersion by fluid upwelling method. The upper and lower zones of the system are enclosed by a dual-walled chamber, wherein the inner wall is a chemically inert plastic and the outer wall is a structural metal. The system interfaces with a fluid handling system which provides the necessary chemistry supply and control for the system. The system is ambient controlled. Also, the system interfaces with an ambient controlled managed transfer module (MTM).

Abstract: Various embodiments of methods and devices for coating stents are described herein.

Abstract: Provided is a method applicable to the production of silicon wafers having crystal orientation <100> or <110> and consisting in specifying wafer-supporting positions on the occasion of heat treatment in a vertical heat treatment furnace as well as a heat treatment jig for use in carrying out that method. It becomes possible to suppress the shear stress which contributes to the extension of the slip generated at each wafer-supporting element contact point as an initiation, suppress slip growth and thus markedly improve the yield of heat-treated silicon wafers. The heat-treated wafer obtained by using the supporting method and the heat treatment jig has few slip, in particular has no long and large slip, and is high in quality.

Abstract: One embodiment of the present invention provides a wafer-carrier system used in a deposition chamber for carrying wafers. The wafer-carrier system includes a base susceptor and a top susceptor nested inside the base susceptor with its wafer-mounting side facing the base susceptor's wafer-mounting side, thereby forming a substantially enclosed narrow channel. The base susceptor provides an upward support to the top susceptor.

Abstract: A stent mandrel fixture for supporting a stent during the application of a coating substance is provided. A method supporting a stent during the application of a coating substance is also provided.

Abstract: A method is specified for the production of a flexible circuit configuration, which allows the manufacturing of such flexible circuits on a carrier film cost-effectively and with high precision. For this purpose, the carrier film is fastened at the beginning of the method on a rigid frame, which encloses an inner area, and spans the inner area using an inner surface. After finishing of a layer structure and optionally additional method steps, structures for flexible circuit configurations which are created over the inner surface may be cut out easily by cutting the flexible circuit configurations out of the inner surface as a cutout. Through the fastening of the carrier film on the frame, it is ensured during the various method steps of the production of the flexible circuit configuration that the carrier film, which is flexible per se, always forms a level foundation for the various method measures, in particular the photolithographic structuring of layers of a layer structure.

Abstract: Various embodiments of methods and devices for coating stents are described herein.

Abstract: A support device is provided to hold a pre-mounted device, such as a stent mounted on a balloon of a delivery catheter, for insertion in a coating apparatus. The support device stabilizes, aligns and holds the pre-mounted stent assembly in order to allow correct location and rotation in relation to a coating applicator in a coating apparatus and to avoid damage during the coating process.

Abstract: A mounting assembly for a stent and a method of coating a stent using the assembly are provided.

Abstract: An apparatus for leveling an array of microscopic pens with respect to a substrate surface is provided. The apparatus includes an array of microscopic pens; a substrate having a substrate surface; a controllable arm comprising a spherical ball on an end thereof; a force sensor configured to measure a force exerted on the array or the substrate surface at each of the plurality of positions; one or more actuators configured to drive the array and/or the substrate to vary a relative distance and a relative tilting between the array and the substrate surface; and a controller configured to determine a planar offset of the array with respect to the substrate and initiate a leveling of the array with respect to the substrate based on the planar offset. Methods are also provided.

Abstract: A film coating holder includes a top cover, a plurality of annular parts, and a plurality of connecting pieces. The top cover defines a plurality of first holes for receiving workpieces therein. The plurality of annular parts is stacked on each other with progressively increasing radiuses. Each of the plurality of annular parts defines a plurality of second holes for receiving the workpieces, and the top cover is positioned on the annular part with a minimum radius. The plurality of connecting pieces connects the annular part with the minimum radius to the top cover and connects each two adjacent annular parts together.

Abstract: A system and related method for deposition of multiple thin film layers on photovoltaic (PV) module substrates includes a first processing side wherein the substrates are conveyed in a first direction for deposition of a first thin film layer on the substrates. A second processing side is operably disposed relative to the first processing side such that substrates exiting the first processing side are subsequently conveyed in a second direction through the second processing side for deposition of a second thin film layer on the first thin film layer. A first transfer station is operably disposed between the first processing side and the second processing side to receive the substrates from an exit of the first processing side and to introduce the substrates into an entry of the second processing side such that the substrates are continuously moved through the first and second processing sides for deposition of multiple thin film layers thereon.

Abstract: A magnetoresistive device has an MgO (magnesium oxide) layer provided between a first ferromagnetic layer and a second ferromagnetic layer. The device is manufactured by forming a film of the MgO layer in a film forming chamber. A substance whose getter effect with respect to an oxidizing gas is large is adhered to surfaces of components provided in the chamber for forming the MgO layer. The substance having a large getter effect is a substance whose value of oxygen gas adsorption energy is 145 kcal/mol or higher. Ta (tantalum), in particular, is preferable as a substance which constitutes the magnetoresistive device.

Abstract: A stent mandrel support for supporting a stent during the application of a coating substance is provided.

Abstract: A system or device for spin coating an implantable medical device, such as a stent, is disclosed. The device includes a coating table to support the stent, the stent being positioned on top of the coating table and supported on the table by a support fixture. The coating table has an axis of rotation. The axis of rotation of the table can intersect a center of the mass of the stent. A driving means can be provided for rotating the stent about the longitudinal axis of the stent and for rotating the coating table about the axis of rotation.

Abstract: A wafer holder including a wafer stage and a wafer stage outer-ring surrounding the wafer stage wherein the wafer stage has a diameter smaller than the diameter of a wafer loaded on the wafer stage, the wafer stage outer-ring has an inner diameter at the upper side of the outer-ring which is larger than the diameter of the wafer loaded on the wafer stage, and the upper surface of the outer-ring lies above the upper surface of the wafer loaded on the wafer stage.

Abstract: A method of processing a substrate includes physically contacting an exposed conductive electrode of an electrostatic carrier with a conductor to electrostatically bond a substrate to the electrostatic carrier. The conductor is removed from physically contacting the exposed conductive electrode. Dielectric material is applied over the conductive electrode. The substrate is treated while it is electrostatically bonded to the electrostatic carrier. In one embodiment, a conductor is forced through dielectric material that is received over a conductive electrode of an electrostatic carrier to physically contact the conductor with the conductive electrode to electrostatically bond a substrate to the electrostatic carrier. After removing the conductor from the dielectric material, the substrate is treated while it is electrostatically bonded to the electrostatic carrier. Electrostatic carriers for retaining substrates for processing, and such assemblies, are also disclosed.

Abstract: A method of fluid sealing a workpiece is provided. The method includes placing a workpiece on a ring, engaging at least one engagement feature of the ring with at least one retaining feature defined by the member and flexing the member to provide a force to the at least one engagement feature to cause the ring to form a barrier to fluid entry with the workpiece.

Abstract: An apparatus for producing RFID labels includes: a housing forming a shell of the apparatus; a feeding roller drive shaft configured to feed a base tape in which a RFID circuit element for producing a label provided with an IC circuit part storing information and a tag antenna for transmission and reception of information is arranged; an antenna for producing the label provided in the housing and configured to transmit and receive the information via radio communication with respect to the RFID circuit element for producing a label in a tag label tape with print; an antenna for acquiring information provided with the IC circuit part storing information and the tag antenna for transmission and reception of information and configured to transmit and receive the information via the radio communication with a RFID circuit element for acquiring information located outside the housing; and a shielding member provided so as to cover at least the side of the antenna for acquiring information of the antenna for produc

Abstract: A coating holder for holding a plurality of workpieces includes a rotating shaft, a first driving member, a plurality of hanging arms, a plurality of supporting trays, and a plurality of second driving members. The first driving member is configured for driving the rotating shaft to rotate. The hanging arms extend from the rotating shaft. Each hanging arm includes a free end distal from the rotating shaft. The supporting trays are configured for holding the workpieces. The second driving members are fixed in the respective free ends and are connected to the respective supporting trays. The second driving members are configured for driving the supporting trays to rotate.

Abstract: A position control device (21, 5) that controls a widthwise position of a flexible substrate 1 includes: a pair of upper nip rollers 21 (24, 25) that nip an upper edge portion of the flexible substrate, rotating shafts of the pair of upper nip rollers being inclined so that a rotation direction in a nipping portion thereof faces obliquely upward at a slight bias angle (?) with respect to a conveying direction of the flexible substrate; an upper support mechanism including a movable support member 26 and a fixed support member 27 that support the pair of upper nip rollers so that the pair of upper nip rollers can be rotated and brought close to, or withdrawn from each other; a spring 51 that biases, via the movable support member, one upper nip roller 25 of the pair of upper nip rollers in a direction of pressing against the other upper nip roller 24 of the pair of upper nip rollers; and drive means (56) for displacing the biasing member so as to adjust a nipping pressure of the pair of upper nip rollers.

Abstract: There is provided a substrate processing system having high maintainability by widening a gap between various processing apparatuses connected with side surfaces of transfer modules and capable of achieving sufficient productivity by avoiding deterioration in throughput. The substrate processing system for manufacturing an organic EL device by forming a multiple number of layers including, e.g., an organic layer on a substrate includes at least one transfer module configured to be evacuable and arranged along a straight transfer route. Within the transfer module, a multiple number of loading/unloading areas for loading/unloading the substrate with respect to a processing apparatus and at least one stocking area positioned between the loading/unloading areas are alternately arranged along the transfer route in series, and the processing apparatus is connected with a side surface of the transfer module at a position facing each of the loading/unloading areas.

Abstract: A thin film deposition apparatus that can be easily used to manufacture large-sized display devices on a mass scale and that improves manufacturing yield, and a method of manufacturing an organic light-emitting display device by using the thin film deposition apparatus.

Abstract: A substrate processing system includes a source unit configured to supply a deposition material to a substrate, a substrate holder configured to hold a substrate to receive the deposition material, a shadow mask comprising a frame that includes two opposing arms; and a crossbar configured to be mounted to the two opposing arms. The frame and the crossbar define a plurality of openings that allow the deposition material supplied by the source unit to be deposited on the substrate. A transport mechanism can produce relative movement between the shadow mask and the substrate.

Abstract: Provided is a susceptor 13 for manufacturing an epitaxial wafer, comprising a mesh-like groove 13b on a mount face on which a silicon substrate W is to be mounted, wherein a coating H of silicon carbide is formed on the mount face, and the coating has a surface roughness of 1 ?m or more in centerline average roughness Ra and a maximum height of a protrusion 13p generated in forming the coating H of 5 ?m or less. Thus, defects such as warping and slip as well as adhesion of the silicon substrate to the susceptor are prevented.