Abstract: A susceptor for supporting a semiconductor wafer during deposition of a layer on a front side of the semiconductor wafer, the semiconductor wafer having a diameter D and, at its edge, a notch having a depth T, comprising: a ring-shaped placement area having an internal diameter d for the placement of the semiconductor wafer in the edge region of a rear side of the semiconductor wafer, wherein, with the semiconductor wafer having been placed, the relationship (D?d)/2<T is satisfied; and a protrusion of the area for the placement of semiconductor wafer in the region of the notch of the semiconductor wafer extending the placement area inward, and which completely underlays the notch of the semiconductor wafer.

Abstract: A substrate etching apparatus includes: a cassette to receive a substrate that has finished a previous process, and transfer the substrate; a first robot to take the substrate out of the cassette; a second robot to receive the substrate from the first robot and move the substrate mounted thereon vertically up and down; an etching cassette comprising a support to support the substrate and a holder to fix the substrate loaded from the second robot; a cassette fixing unit to fix at least one or more etching cassettes and being rotated at a pre-set angle to allow the substrate to be disposed perpendicular to the ground; and an etching unit to etch the substrate disposed perpendicular to the ground by the cassette fixing unit.

Abstract: A substrate holder for holding a semiconductor substrate for processing in a molecular beam epitaxy system, the substrate including a front side, an opposite backside for epitaxial growth, and an outer edge extending between the front side and the backside, the substrate holder including a body comprising a central opening extending from a backside to a top side of the body, an inner ring surrounding the central opening, and a substrate support lip extending from the inner ring into the central opening, and at least one tensioning device operatively attached to the body and including a cam member and a spring in contact with a portion of the cam member, wherein the spring has a elongated portion and at least two contact portions extending from opposite ends of the elongated portion for contacting the outer edge of the substrate.

Abstract: A coating system is provided with a coating robot (14a to 14d) including a coating apparatus (38) configured to coat a coated object (12) structured by swingably connecting at least two members (18, 20) to a body (12), an opener robot (16) configured to swing said two members (18, 20) in a direction away from the body (12) at different timings, a first displacement mechanism (32) configured to displace the coating robot (14a to 14d) along a first guide member (28), and a second displacement mechanism (34) configured to displace the opener robot (16) along a second guide member (30), the opener robot (16) including a hooking member (48) which is hooked on the two members (18, 20) at the different timings. The first guide member (28) and the second guide member (30) are arranged in different heights so that the opener robot (16) and the coating robot (14a to 14d) are arranged in different heights.

Abstract: A clam shell wafer holder includes a base and a lid pivotally connected with the base by an integral hinge. The base includes a rotatable wafer support, and the lid includes a universal frame and a pin holder attachment spaced inwardly from the frame. Only two contact pins are formed in a wafer-facing surface of the pin holder attachment. The contact pins are manually aligned with and contact two points on a wafer when the lid is closed against the base. A method for holding a wafer for plating is provided using the disclosed holder apparatus.

Abstract: A coating having a smooth orange peel morphology is formed on an adluminal surface of a stent, concurrently with the formation of a coating having a rough rice grain morphology on an abluminal surface of the stent. During the formation of the two coatings, a mandrel is placed adjacent to the adluminal surface of the stent but does not generally contact the adluminal surface.

Abstract: A system, nozzle assembly, and method for coating a stent with a solvent and polymer are provided. The polymer can include a therapeutic substance or a drug. The polymer and solvent can be discharged from separate tubes disposed within another tube carrying moving air. The polymer and the solvent mix together when they are discharged and are atomized by the air. The ends of the tubes can be concentric with each other. The ends of the tubes can also be positioned relative to each other to prevent accumulation of polymer at the ends of the tubes.

Abstract: A system and method for coating an endoprosthesis involves an applicator capable of delivering a coating substance to the endoprosthesis without spraying. The applicator may have a tube or die through which a coating substance is moved upwards by capillary action or by means of a pump so as to form an accumulation of the coating substance at an upper portion of the applicator. The endoprosthesis can be lowered onto the accumulation, then axially translated or rotated in order to transfer the coating substance to selected portions of the endoprosthesis. The applicator is lowered and/or the endoprosthesis is raised in order to form gaps in the coating. Selective coating of abluminal or luminal surface of the endoprosthesis may also be performed by allowing the surface to skip on a liquid surface of a pool of the coating substance.

Abstract: A workpiece holder for fluid processing a workpiece including a transportable frame, a flexible member connected to the frame and defining at least one retaining feature, and a ring comprising at least one engagement feature engageable with the at least one retaining feature of the flexible member, wherein the flexible member is flexed to provide a force to the at least one engagement feature to cause the ring to form a barrier to fluid entry with the workpiece.

Abstract: The transporting device according to the invention, in particular for transporting sheet-like substrates through a coating installation, comprises transporting rollers which are rotatably mounted on both sides and horizontally arranged transversely in relation to the transporting direction, the uppermost surface lines of the transporting rollers defining the transporting plane, and is characterized in that the end parts of the transporting rollers have a smaller diameter than the middle part of the transporting rollers and in that baffles which are mounted displaceably in the axial direction of the transporting rollers between a first position and a second position are arranged between the end parts of the transporting rollers and the transporting plane. The fact that the baffles are mounted in an axially displaceable manner has the effect of considerably extending the cleaning intervals of the transporting device.

Abstract: Aspects of the present disclosure may include an apparatus for enclosing a thin wafer to prevent damage during an on-going manufacture of integrated circuit chip(s) on or in the thin wafer, and methods of utilizing the apparatus. The apparatus may include a lower support assembly and an upper retainer assembly which retains a thin wafer therebetween, wherein the lower support assembly and the upper retainer assembly may be coupled together by a magnetic attractive force.

Abstract: A painting stand for supporting vehicle body panels during the painting operation includes a base moveable upon a plurality of rolling casters and having a vertically extending upright member which in turn supports a generally T-shaped member. The T-shaped member is pivotally joined to the upper end of the vertical upright member and includes a plurality of horizontally disposed telescoping sliders and attachment arms. The upwardly extending portion of the T-shaped member includes a moveable sleeve supporting a further attachment arm. The attachment arms engage the vehicle body panel.

Abstract: A wafer susceptor and a chemical vapor deposition apparatus. In one embodiment, the chemical vapor deposition apparatus includes a chamber, a susceptor, a heater and a gas supply system. The susceptor is disposed within the chamber and is rotatable around a rotation axis, wherein an upper surface of the susceptor is suitable for carrying a plurality of wafers, and a middle region of a lower surface of the susceptor is set with a first cavity. The heater is disposed under the susceptor and is used to heat the wafers on the susceptor. The gas supply system is used to introduce a reactive gas into the chamber.

Abstract: An exemplary wet coating system includes a coating chamber, an annealing chamber, an unloading chamber, and a mechanical arm. The coating chamber is configured for allowing a substrate being wet coated therein. The unloading chamber is configured for allowing the substrate being unloaded therein. The annealing chamber is interposed between and communicated with the coating chamber and the unloading chamber and is configured for allowing the substrate being annealed therein. The communicated coating chamber, annealing chamber, and unloading chamber are vacuumized. The mechanical arm is configured for holding the substrate and moving the substrate across the coating chamber, the annealing chamber, and the unloading chamber.

Abstract: The present invention relates to a printed elapsed time-temperature indicating labels and to a method of indicating the elapse of a predetermined period of time and/or temperature. More' specifically the present invention relates to a device that measures and visually indicates the passage of a predetermined period of time and the various components of which can be formed by inexpensive printing methods and by lamination of one or more printed layers, which can be activated at point of use. The present invention is intended to provide a solution to the longstanding problems of providing an indication of the exposure of foodstuffs to unacceptable time and/or temperature conditions.

Abstract: A system for handling masked substrates comprising a chamber having a pedestal for supporting a substrate, and a chuck for supporting a mask in relation to a substrate. The system may include an alignment system operable to confirm alignment of the mask and the substrate. A method of positioning a mask on a substrate in a chamber comprises supporting the mask with a chuck disposed in the chamber and supporting the substrate with a pedestal disposed in the chamber. The method may further comprise aligning one or more reference points on the mask with one or more reference points on the substrate and positioning the mask on the substrate using at least one of the chuck and the pedestal.

Abstract: A successive deposition apparatus by which a reduction in the luminous efficiency of a light-emitting element can be suppressed even in high-speed deposition of a light-emitting layer thereof is provided. The apparatus includes: a second deposition chamber; a third deposition chamber coupled to the second deposition chamber; a transfer unit for transferring a substrate from second deposition chamber to third deposition chamber; plural third deposition sources arranged in the substrate transfer direction in the second deposition chamber; and a fourth and fifth deposition sources alternately arranged in the transfer direction in the third deposition chamber. In the third deposition chamber, the fourth deposition source is placed nearest to the second deposition source. The fourth deposition source contains a host material, and the fifth deposition source contains a dopant material. The HOMO level of a material of the third deposition source is adjusted to that of the host material.

Abstract: An alignment tool is used to ensure proper alignment of a component on a rotating gear relative to a non-rotating platter. The alignment tool includes a first arm member coupled to a locating feature on the gear, and a second arm member that is coupled to the first arm member such that the second arm member is movable relative to the first arm member. When the first arm member is coupled to the locating feature, the second arm member locates off the platter to verify proper alignment. The second arm member is cannot be fitted to the platter when there is improper alignment.

Abstract: A tool for harvesting polycrystalline silicon-coated rods from a chemical vapor deposition reactor includes a body including outer walls sized for enclosing the rods within the outer walls. Each outer wall includes a door for allowing access to at least one of the rods.

Abstract: The process for producing silicon carbide single crystals of the present invention comprises a step for growing single crystals of silicon carbide on a silicon carbide seed crystal by supplying a sublimed gas of a silicon carbide source material to the silicon carbide seed crystal arranged on a pedestal, wherein a spacing member composed of silicon carbide is arranged between the pedestal and the silicon carbide seed crystal, the spacing member is non-adhesively held on the pedestal by a supporting member, the silicon carbide seed crystal is adhered to the surface of the spacing member on the opposite side of the pedestal, and the spacing member and the supporting member are relatively arranged so that the adhesive surface of the spacing member adhered with the silicon carbide seed crystal is separated by 5 mm or more in the vertical direction from the lowest position of the supporting member.

Abstract: A substrate processing apparatus including a holder for rotatably holding a substrate; a coating solution supply nozzle for supplying a coating solution onto a front surface of the substrate to be processed held by the holder; a treatment chamber housing the holder and the coating solution supply nozzle; a cooling device which cools the substrate before the coating solution is supplied to the substrate, to a predetermined temperature; a heating devices which heats the substrate coated with the coating solution to a predetermined temperature; and a transferer that transfers the substrate between the treatment chamber, the cooling device and the heating device, wherein the treatment chamber, the cooling device and the heating device are partitioned from ambient air, and wherein at least the treatment chamber is connected to a gas supply mechanism having a supply source of a gas having a kinematic viscosity coefficient higher than that of air.

Abstract: There is provided an in-line type film-forming apparatus that can prevent a substrate from being dropped out of a carrier and convey the carrier at high speed.

Abstract: A processing chamber and a method for centering a substrate therein is provided. In one embodiment, the processing chamber includes a chamber body, a support structure, lift pins, alignment pins and restriction assemblies. The support structure has an upper surface and is disposed in the chamber body. The lift pins, alignment pins and restriction assemblies are disposed on the upper surface. The lift pins are applied for bearing the substrate. Each of the alignment pins has a conical contact surface which can be extended from the upper surface to contact the edges of the substrate to provide lateral forces to center the substrate on the lift pins. Additionally, when the alignment pins and the lift pins are retracted, the substrate is lowered and placed between the restriction assemblies disposed on the upper surface to prevent the substrate from inadvertently moving laterally from the centered position.

Abstract: There is provided a ceramic substrate supporting member configured to support a ceramic substrate at a tip portion thereof and used for forming a ceramic member coat on the ceramic substrate to manufacture a ceramic member in a reaction furnace. The ceramic substrate supporting member includes a core formed of graphite, and a supporting member coat formed at a surface including at least the tip portion with a pyrolytic carbon layer interposed between the core and the supporting member coat.

Abstract: Substrate carrier having multiple emissivity coefficients for thin film processing and more particularly for support of a substrate during a deposition process epitaxially growing a film on the substrate. A front side of the carrier has a first carrier surface upon which the substrate is to be disposed, the first carrier surface having a first emissivity coefficient different than a second emissivity coefficient of a second carrier surface adjacent to the first carrier surface. Selection of the second emissivity coefficient independent of the first emissivity coefficient may modify an amount of energy radiated from the second carrier surface during processing of the substrate. In one embodiment, the second carrier surface has a second emissivity coefficient which is lower than the first emissivity coefficient to reduce heat loss from the carrier surface while maintaining high efficiency energy transfer between the carrier and a substrate.

Abstract: A torch (1) for thermal spraying of surface coatings, of the type that comprises a head (3) and a bracket (2) for the head (3), in which the head (3) pivots relative to the bracket (2). The invention also relates to the coatings obtained using the torch, whether of polymer, metal or ceramic materials, on any substrate coated thereby, whether of polymer, metal or ceramic or composite materials. The invention is applicable to different types of thermal spray torches, using plasma spray, combustion spray, High Velocity Oxygen Fuel (HVOF), or Low Velocity processes.

Abstract: A stent mandrel fixture for supporting a stent during the application of a coating substance is provided.

Abstract: A method for sticking, a container, a pocket tape, a method for the production of a pocket tape, a device for the production of a pocket tape, a method for the production of an adhesive tape, an adhesive tape and a device .for the production of an adhesive tape, regarding sticking a pocket into a container to receive an article, through use of adhesive in adhesive zones that are spaced from one another by non-adhesive zones.

Abstract: An exemplary apparatus for applying deglossing paint on a peripheral inactive portion of a lens is provided. The apparatus includes a platform, a holder and a printing device. The platform includes a worktable, and a supporting member extending from the worktable and having a cantilever portion suspending above the worktable. The holder is mounted on the worktable, and is configured for holding one or more lenses thereon. The printing device is supported by the cantilever portion, and includes a stamper facing toward the lens. The stamper is capable of having the deglossing paint stained thereon and applying the deglossing paint on the peripheral inactive portion by bringing the deglossing paint into contact with the peripheral inactive portion.

Abstract: A method for the production and control of plates for electronics comprising a first step in which a plate is positioned, by means of positioning means, in a loading station; a second step in which the plate is disposed in a deposition station associated with a unit for depositing metal, or other material, in which the metal is deposited on the plate, in order to generate on the plates metal tracks, according to a pre-determined and desired topological disposition; a third step in which the plate is disposed in an exit station and a detection means is activated so as to detect the presence of defects in the plate; and a fourth step in which the plate is discharged from the exit station. In the first step the detection means is activated to identify defects in the plate disposed in the loading station. In the second step the deposition unit is activated in order to deposit the metal on the plate when in the first step the detection means has not detected any defect in the plate.

Abstract: A coating apparatus includes a liquid film forming mechanism configured to form a liquid film of a process liquid for preventing a contaminant derived from a coating liquid from being deposited or left on a back side peripheral portion of a substrate. The liquid film forming mechanism includes a counter face portion facing the back side peripheral portion of the substrate and a process liquid supply portion for supplying the process liquid onto the counter face portion. The coating apparatus further includes a posture regulating mechanism disposed around the substrate holding member and configured to damp a vertical wobble of the peripheral portion of the substrate being rotated. The posture regulating mechanism includes delivery holes arrayed in a rotational direction of the substrate and configured to deliver a gas onto a back side region of the substrate on an inner side of the peripheral portion.

Abstract: A mechanism for adjusting an orientation of an electrode in a plasma processing chamber is disclosed. The plasma processing chamber may be utilized to process at least a substrate, which may be inserted into the plasma processing chamber in an insertion direction. The mechanism may include a support plate disposed outside a chamber wall of the plasma processing chamber and pivoted relative to the chamber wall. The support plate may have a first thread. The mechanism may also include an adjustment screw having a second thread that engages the first thread. Turning the adjustment screw may cause translation of a portion of the support plate relative to the adjustment screw. The translation of the portion of the support plate may cause rotation of the support plate relative to the chamber wall, thereby rotating the electrode with respect to an axis that is orthogonal to the insertion direction.

Abstract: A spin chuck rotating a substrate utilizing a centrifugal force while holding one surface of the substrate with a substrate holding section to apply a film material to another surface of the substrate. The substrate holding section includes a tapered peripheral part having a peripheral edge where a substrate holding surface and a back surface thereof are connected. The other surface of the substrate and the back surface of the substrate holding section smoothly continue with each other with the holding surface of the substrate holding section kept in contact with the other surface of the substrate.

Abstract: A system for treating objects transported by at least one transport carriage and immersed into at least one treatment container, in which a treatment medium can be applied. The transport carriage comprises at least one swivel arm connected to the chassis in an articulated manner, on which swivel arm the object can be fastened. A hydraulically operating piston-cylinder unit having a first working chamber is provided to drive the swivel arm and provide weight balancing. The first working chamber is made smaller during the downward motion of the swivel arm and is connected to a first pressure accumulator. The second working chamber of the piston-cylinder unit, made larger during the downward motion of the swivel arm, is connected to a source for pressurized hydraulic fluid and can be drained during the downward motion of the swivel arm. The pressure of the fluid in the accumulator is swivels the swivel arm and object upward if the pressure in the second working chamber is sufficiently low.

Abstract: The present invention generally includes a shadow frame with alignment inserts that may permit the shadow frame to be properly aligned on the susceptor. The shadow frame may have one or more alignment inserts. The alignment inserts may be coupled to a cavity formed in the bottom surface of the shadow frame. The alignment inserts may be shaped to receive an alignment button that may be present on the susceptor. Thus, as the susceptor raises to the processing position and retrieves the shadow frame, the shadow frame may align properly on the susceptor.

Abstract: A substrate processing system for processing an essentially vertically oriented substrate is described.

Abstract: A sample table which stably holds a semiconductor wafer by maintaining smoothness of a contact surface via a lapping process and forming the contact surface to have an approximate recess shape, and a microwave plasma processing apparatus including the sample table.

Abstract: An apparatus for transporting strip-like material, has a treatment roller and at least one transporting or strip-gliding roller. The at least one transporting or strip-guiding roller is arranged upstream or downstream of the treatment roller, and comprises a twisting roller having an axis of rotation which encloses an angle other than 0° in relation to an axis of rotation of the treatment roller. The twisting roller rotates the course taken by the strip-like material in relation to the course defined by the surface of the treatment roller.

Abstract: A method is provided of processing substrate holder material for a substrate holder on which on a first side of said substrate holder a semiconductor substrate is to be placed for layered deposition of various semiconductor materials on the semiconductor substrate using induction heating. The method includes the operations of determining a first electrical resistivity at at least one measuring position on said substrate holder material, comparing said first electrical resistivity with a second reference electrical resistivity and adapting said substrate holder material in correspondence with said comparison. Also a substrate holder is provided which is processes by such a method.

Abstract: The present invention comprises an automated apparatus capable of spray depositing polyelectrolytes via the LbL mechanism with minimal or no human interaction. In certain embodiments, the apparatus sprays atomized polyelectrolytes onto a vertically oriented substrate. To counteract the effects of irregular spray patterns, the substrate is preferably slowly rotated about a central axis. In certain embodiments, the apparatus also includes a forced pathway for the droplets, such as a pathway created by using a vacuum. In this way, a thicker or three-dimensional substrate can be coated. In certain embodiments, the apparatus is designed so as to be scalable. Thus, through the use of multiple instantiations of the apparatus, a large or irregularly shaped substrate can be coated. Rolls of textile can therefore be coated using the apparatus. Additionally, the present invention includes a method to uniformly coat a substrate, such as a hydrophobic textile material, using aqueous solutions of polyelectrolytes.

Abstract: A substrate processing system (100) includes a first automated substrate transfer line or main transfer line (20) configured to transfer wafers (W) over the entire system and to transfer wafers to and from respective process sections, and a second automated substrate transfer line or auxiliary transfer line (30) configured to transfer wafers (W) inside a photolithography process section (1a). The auxiliary transfer line (30) is disposed as a transfer mechanism independent of the main transfer line (20). An OHT (31) is configured to travel around on the auxiliary transfer line (30) having a loop shape, so as to transfer wafers (W) to and from and among the respective process apparatuses in the photolithography process section (1a).

Abstract: The present invention relates to: a jig for semiconductor production which is used for a CVD device in a semiconductor production process and contains a jig base and an SiC coating film formed on the jig base, in which the SiC coating film has a surface area ratio (surface area S2/surface area S1) between an apparent surface area S1 as calculated on the assumption that the surface is flat and free from unevenness and an actual surface area S2, of from 1.4 to 3.2; and a method for producing the jig for semiconductor production.

Abstract: A method and device for wet treatment of plate-like articles includes, a chuck for holding a single plate-like article having an upwardly facing surface for receiving liquid running off a plate-like article when being treated with liquid, wherein the chuck is outwardly bordered by a circumferential annular lip. The chuck has an outer diameter greater than the greatest diameter of the plate-like article to be treated, and a rotatable part with an upwardly facing ring-shaped surface for receiving liquid running off the circumferential lip of the chuck. The rotatable part is rotatable with respect to the chuck, the ring-shaped surface is coaxially arranged with respect to the circumferential annular lip, the inner diameter of the ring-shaped surface is smaller than the outer diameter of the chuck, and the distance d between the lip and the upwardly facing ring-shaped surface is in a range from 0.1 mm to 5 mm.

Abstract: A thin film deposition apparatus to remove static electricity generated between a substrate and a mask, and a method of manufacturing an organic light-emitting display device using the thin film deposition apparatus.

Abstract: Described is a rotary pan (1) of the type comprising a central hollow cylindrical body (3) with end portions (4, 4?) shaped substantially like truncated cones, and mixing/deflecting means (7) attached to at least one inside surface of the pan (1) itself; the peripheral inside cylindrical surface (5) of the hollow body (3) comprises an extended zone (A) defined by a uniform distribution of through holes (6) and at least one zone (B) within the zone (A) forming an area by which the mixing/deflecting means (7) are attached or fixed to the peripheral surface (5).

Abstract: An automatic dispensing machine adapted for dosing adhesive to a product includes a base frame having a flat operating platform, at least two positioning apparatuses disposed on the operating platform for securing the product respectively, a sliding support slidably mounted onto the base frame and capable of being driven to slide above the positioning apparatuses, and a storage container vertically slidably mounted onto the sliding support by means of a container stand for storing the adhesive and capable of being driven by the sliding support to suspend over another one of the positioning apparatuses from one of the positioning apparatuses for dosing the adhesive to the product. When the automatic dispensing machine processes the product positioned in another positioning apparatus, the former processed product secured on one positioning apparatus can be simultaneously disassembled therefrom and another product is repositioned to the one positioning apparatus.

Abstract: A coating apparatus includes a driving unit configured to rotate a substrate holding member about a vertical axis to spread a coating liquid supplied on a front side central portion of a substrate toward a front side peripheral portion of the substrate by a centrifugal force. The apparatus is provided with a wobble damping mechanism including a gas delivery port and a suction port both disposed to face a back side of the substrate and configured to damp a wobble of the substrate being rotated by delivering a gas from the delivery port and sucking the gas into the suction port.

Abstract: An apparatus for weighing a stent includes a buffer for storing a stent support with a stent mounted thereon, a stent mounting and dismounting assembly that mounts and dismounts the stent from the stent support, a robotic arm for moving the stent support with the stent between the buffer and the stent mounting and dismounting assembly, and a scale assembly for weighing the stent. The stent mounting and dismounting assembly moves the stent into the scale assembly after the stent has been dismount from the stent support.

Abstract: Susceptor and chemical vapor deposition (CVD) apparatus including the same. The susceptor includes: a plurality of susceptor slices that form a disk when combined together; and at least one pocket disposed on an upper surface of each of the plurality of susceptor slices and containing a member on which a material is to be deposited, wherein, a connection part is formed between side surfaces of neighboring susceptor slices and allows the plurality of susceptor slices to be combined to each other in a separable/detachable manner.

Abstract: A glass substrate-holding tool employed during the production of a reflective mask blank for EUV lithography includes an electrostatic chuck and a mechanical chuck. A caught and held portion of a glass substrate caught and held by the electrostatic chuck, and pressed portions of the glass substrate pressed by the mechanical chuck are located outside a quality-guaranteed region on each of a film deposition surface and a rear surface of the glass substrate. The sum of a catching and holding force applied to the glass substrate by the electrostatic chuck and a holding force applied to the glass substrate by the mechanical chuck is at least 200 kgf. A pressing force per unit area applied to the glass substrate by the mechanical chuck is at most 25 kgf/mm2.