Abstract: An inkjet printing system with a droplet measurement apparatus is described herein. The droplet measurement apparatus has a light source with a collimating optical system, an imaging device disposed along an optical path of the collimating optical system, and a droplet illumination zone in the optical path of the collimating optical system, the droplet illumination zone having a varying droplet illumination location, wherein the light source, the imaging device, or both are adjustable to place a focal plane of the imaging device at the droplet illumination location. The droplet measurement apparatus is structured to accommodate at least a portion of a dispenser of the printing system within the droplet illumination zone.

Abstract: An apparatus for discharging chemical liquid may include an ink jet head, a gantry and a control member. The ink jet head may include a plurality of nozzles capable of discharging chemical liquid onto a substrate. The gantry may hold the ink jet head to place the ink jet head over the substrate. The control member may control the ink jet head such that discharge times of the chemical liquid from the nozzles of the ink jet head may be changed.

Abstract: A repeatable manufacturing process uses a printer to deposits liquid for each product carried by a substrate to form respective thin films. The liquid is dried, cured or otherwise processed to form from the liquid a permanent layer of each respective product. To perform printing, each newly-introduced substrate is roughly mechanically aligned, with an optical system detecting sub-millimeter misalignment, and with software correcting for misalignment. Rendering of adjusted data is performed such that nozzles are variously assigned dependent on misalignment to deposit droplets in a regulated manner, to ensure precise deposition of liquid for each given area of the substrate. For example, applied to the manufacture of flat panel displays, software ensures that exactly the right amount of liquid is deposited for each “pixel” of the display, to minimize likelihood of visible discrepancies in the resultant display.

Abstract: An inkjet printer is disclosed that has a substrate support; a calibration module disposed adjacent to the substrate support and comprising a stage member; and a print assembly disposed across the substrate support, the print assembly comprising a printhead and a calibration imaging device positionable to face the stage member.

Abstract: A sensor system includes an eddy current sensor including at least one coil with excitation electronics coupled across the coil. An optical displacement sensor is secured to the eddy current sensor so that a vertical distance between the sensors is fixed. The optical displacement sensor is located on top of and concentric with the coil so that a measurement axis of the optical displacement sensor is collinear with an axis of symmetry of the coil. A computing device including a processor and memory is coupled to receive sensor data from the eddy current sensor and the optical displacement sensor that is adapted for analyzing the sensor data obtained from measuring a coated substrate including a coating layer on at least one side of a metal substrate to determine at least a thickness of the coating layer.

Abstract: [Problem] There is provided a colored stainless-steel product having excellent viewing-angle color tone discrimination and excellent corrosion resistance, in which a chemical coloration technique having sophisticated industrial color tone is used. [Solution] The product is a chemically-colored stainless-steel product having an uneven surface formed by a grinding treatment, wherein the 60-degree specular gloss [Gs (60 degrees)] of the uneven surface is 5 to 50. The grinding treatment is performed by a single sandblasting treatment or a combination of the sandblasting treatment and an electrolytic polishing treatment. The sandblasting treatment is performed with a projection material configured from inorganic particles having a Mohs' hardness of at least six.

Abstract: According to one embodiment of the present disclosure, there is provided a substrate processing apparatus comprising: a supply passage through which fluid supplied to a substrate flows; and a foreign substance detector including a channel forming part forming a portion of the supply passage, a light projector irradiating light to the channel forming part, and a light receiver receiving light emitted from the channel forming part as a result of irradiating light to the channel forming part by the light projector, the foreign substance detector being configured to detect a foreign substance in the fluid based on a signal obtained by the light that the light receiver receives, wherein the light projector and the light receiver in the foreign substance detector are disposed in areas that are not opposite to each other in areas in upper, lower, left, right, front and rear directions of the channel forming part.

Abstract: Embodiments of the present disclosure generally relate to evaporation sources used for physical vapor deposition of material onto substrates and more particularly for controlled coating of large substrates, such as vacuum deposition of copper, indium, gallium, selenium, tellurium, cadmium, or zinc on flexible substrates. Embodiments disclosed herein are able to control the evaporation rate of the source material during processing so as to obtain a uniform deposition across the width of the substrate as the complete length of a roll-to-roll substrate is moved past the evaporation source during processing.

Abstract: A method for manufacturing an organic light emitting display device includes forming a substrate insulating film an upper surface, a lower surface, and at least one of two side surfaces of a substrate and forming an organic light emitting diode (OLED) on the substrate on which the substrate insulating film is formed. An organic light emitting display device includes a substrate having a first surface, a second surface opposite to the first surface, and side surfaces that extend between the first surface and the second surface, a substrate insulating film disposed on the first surface, the second surface, and at least one of the side surfaces of the substrate, and an OLED disposed on one of the first surface or the second surface of the substrate including the substrate insulating film.

Abstract: A pre-fabricated assemblies and methods of use for coating substrates are described. The pre-fabricated assembly includes at least two layers in a stack, each layer includes at least one raw material. The raw material in each layer may be a dielectric material. One type of stack has one outer layer as an exposed layer. One type of stack has an exposed portion with each layer, and a portion of all layers is exposed. In use, a stack in a pre-fabricated assembly is positioned in a vacuum chamber system and energy is delivered sequentially to the exposed layer, removing at least a portion of each exposed layer. Each layer becomes an exposed layer and is deposited on the substrate in a sequential manner. The pre-assembled raw material stack is used to fabricate a multi-layered coating, such as a multi-layered coating for an optical or ophthalmic article.

Abstract: A compound thin film is obtained with a high deposition rate and consistent film quality in reactive sputtering. A thin film is formed by performing voltage monitoring control and gas flow rate monitoring control. The voltage monitoring control is control in which a gas flow rate is adjusted such that the value of a target voltage is brought closer to the value of a desired voltage by monitoring the target voltage in a first cycle time. The gas flow rate monitoring control is control in which the desired voltage for the target voltage is changed such that the value of the gas flow rate is brought closer to the value of a desired gas flow rate by monitoring the gas flow rate in a second cycle time.

Abstract: In certain embodiments, a system comprises a robot, a spray gun coupled to the robot and operable to spray a first predefined number of passes of a material onto a substrate at a first flow rate, and a measurement device operable to measure one or more properties of the material sprayed onto the substrate while the material is wet. The system further comprises an analyzer operable to determine a thickness of the wet material based on the one or more measured properties and calculate a second flow rate required to achieve a cured thickness of the material within a second predefined number of passes. The calculated second flow rate is based on the first predefined number of passes, an expected thickness of the wet material for one pass of the first predefined number of passes, the determined thickness of the wet material, and the first flow rate.

Abstract: Methods for detecting a coating on a surface of an intraocular lens delivery device and methods of manufacturing the device are provided. A method includes forming the coating on the device, the coating including a lubricious-enhancing component and a fluorescing component, illuminating the fluorescing component to cause the fluorescing component to emit a glow, and determining characteristics of the coating on the device based on the glow of the fluorescing component.

Abstract: A method and a device for the coating of running substrates moving along a run direction through a treatment zone, in which the vapor of a coating material is generated in a chamber, this vapor passing through g a treatment aperture towards the treatment zone where the coating material condenses on the surface of the substrates. The vapor flow through the treatment aperture is controlled by adjusting the extent to which the treatment aperture is shut off by at least one shutter, between an open position, in which the vapor flows through the treatment aperture towards the treatment zone, and a closed position, in which the vapor is prevented from flowing towards the treatment zone through the treatment aperture.

Abstract: Provided is a film forming apparatus including a placement stage; a processing container that defines a processing chamber which accommodates the placement stage and includes a first region and a second region; a gas supply section that supplies a precursor gas to the first region; and a plasma generation section that generates plasma of a reactive gas in the second region. The plasma generation section includes: at least one waveguide that defines a wave guiding path above the placement stage and above the second region, a microwave generator connected to the at least one waveguide, and a plurality of protrusions made of a dielectric material. The protrusions pass through a plurality of openings formed in a lower conductive part of the at least one waveguide to extend into the second region. The protrusions are arranged in a radial direction with respect an axis of the placement stage.

Abstract: An evaporation method in this disclosure is adapted for performing an evaporation process upon a surface of an evaporation target substrate. In an embodiment, an evaporation source plate is arranged to be heated by a heater so as to evaporate an evaporation material to its gaseous state, and then enable the gaseous evaporation material to travel passing through holes of a shutter device and thus spread toward the surface of the evaporation target substrate for depositing a film. Moreover, the evaporation method uses a transmission device for controlling the opening/closing of the holes, and there is a heating area formed at a position between the shutter device and the evaporation source plate for allowing the evaporation source plate, the plural holes, the heating area, the evaporation material and the heater to be arranged parallel to one another from the top to bottom.

Abstract: The present invention is provided with: a duct of which one end interconnects to a wiping nozzle (22, 23) and the other end is open; a first valve (17) that controls the actual gas pressure (P1?) of the wiping nozzle (22, 23); a second valve (18) that controls the gas flow rate (Q2) dissipating to outside the system from another branched duct; a wiping pressure setting unit (11) that sets the set gas pressure (P1) of the wiping nozzle (22, 23); a first valve aperture setter (13) that sets the valve aperture of the first valve (17); a second valve aperture setter (14) that sets the valve aperture of the second valve (18); and a computation processing unit (12) that presents to the first valve aperture setter (13) the valve aperture at which the gas pressure (P1?) matches a set gas pressure (P1), and presents to the second valve aperture setter (14) the valve aperture at which the total gas flow rate (QT) supplied from a gas supply device (15) becomes uniform.

Abstract: An apparatus and method for processing wafer-shaped articles utilizes at least first and second liquid-dispensing nozzles, wherein a first liquid-dispensing nozzle is positioned closer to an axis of rotation than the second liquid-dispensing nozzle. A liquid supply system supplies heated process liquid to the nozzles such that process liquid dispensed from the first nozzle has a temperature that differs by an amount within a predetermined range from a temperature of process liquid dispensed from the second liquid-dispensing nozzle.

Abstract: A device for applying a free-flowing medium to a continuously conveyed web, wherein the medium can be transferred to the web by a continuously rotating transfer (gravure) roll. An application head is provided in order to transfer the free-flowing medium to the circumference of the gravure roll. The application head includes a chamber which is open toward the circumference of the gravure roll and has an inlet and an outlet for the medium to be applied. The front outer face, in the direction of rotation, of the chamber is delimited by a front doctor blade and the rear outer face, in the direction of rotation, is delimited by a rear doctor blade. Both doctor blades are seated against the circumference of the gravure roll. The front doctor blade can be pressed against the circumference of the gravure roll by a pressing body with an adjustable pressing force.

Abstract: In one embodiment, a semiconductor manufacturing system includes a film forming apparatus configured to form a film on a surface of a wafer. The system further includes a gas supply module configured to supply at least a type of source gas for the film into the film forming apparatus. The system further includes a measurement module configured to measure a discharge amount of an exhaust gas from the film forming apparatus. The system further includes a controller configured to calculate a value corresponding to a surface area of the wafer based on the discharge amount of the exhaust gas from the film forming apparatus, and to control a supply amount of the source gas to the film forming apparatus based on the value corresponding to the surface area of the wafer.

Abstract: A system to fabricate hierarchical graded materials includes a reservoir to contain a material to be deposited, a print head connected to the reservoir to allow the print head to receive the material to be deposited, the print head having a mixing section, and an actuator connected to the print head, the actuator configured to actuate the print head in six axes of motion.

Abstract: A fluid discharging device that discharges fluid from a plurality of discharge openings towards a continuous sheet member which is continuously transported in a transporting direction. The fluid discharging device includes: a plurality of valves that correspond to the discharge openings and intermittently discharge the fluid from the discharge openings by opening and closing operations; and a controller that controls the opening and closing operations of each of the valves individually depending on a transportation amount of the continuous sheet member. The controller has a shared adjustment value that is represented by a value indicating the transportation amount, the controller shifts open-close timing of at least several valves of the a plurality of valves from a previously-determined open-close timing that the several valves are subject to, based on the shared adjustment value.

Abstract: An apparatus for dispensing flux-free solder comprises a dispenser head with a stamp to which ultrasound can be applied. Solder is dispensed by: A) moving the dispenser head above a next substrate place, B) lowering the stamp until the working surface of the stamp touches the substrate place or is located at a predetermined height above the substrate place, C) dispensing solder by: C1) advancing the solder wire until the solder wire touches the substrate place, in such a manner that the tip of the solder wire touches the substrate place within a recess of the stamp, C2) further advancing of solder wire to melt a predetermined quantity of solder, and C3) retracting the solder wire, D) moving the dispenser head to distribute the solder on the substrate place, and simultaneously applying ultrasound to the stamp, and E) raising the stamp.

Abstract: To provide a sample preparation device that is appropriate for the formation of a matrix film for MALDI through vacuum vapor deposition. A sample preparation device is provided with: a sample substrate support unit 23 for supporting a substance to be analyzed on a substrate S so that the substance faces a vapor deposition source 21 for a matrix substance J; a light amount measurement unit for irradiating a matrix film vapor deposited on the substrate S with measurement light diagonally and detecting the amount of measurement light that has transmitted through or has been reflected from the above-described matrix film diagonally; and an adhesion prevention means 23a for preventing the matrix substance that has flown off from the above-described vapor deposition source 21 from adhering to the above-described light amount measurement unit.

Abstract: The invention relates to a test glass changing system (10) for selectively coating and optically measuring a test glass (24, 24?) in a coating chamber (1) of a vacuum coating installation (3). In the coating chamber, a movable turntable (2) is used to guide substrates (7) on a path through a stream of a coating material. The test glass changing system (10) comprises a test glass holder (8, 8?) with a test glass plate (26) for holding the test glass (24, 24?), and a cover (28, 28?) for selectively covering the test glass plate (26). The test glass changing system (10) also comprises a rotary apparatus (34) for rotating the test glass plate (26) about an axis (51) which is oriented approximately parallel to the axis of rotation (5) of the turntable (2). The test glass holder (8, 8?) can be positioned on the turntable (2) and removed from the coating chamber (1) in the form of a unit.

Abstract: Reactor for producing silicon by chemical vapor deposition, the reactor comprising a reactor body that forms a container, at least one inlet for a silicon-bearing gas, at least one outlet, and at least one heating device as a part of or operatively arranged to the reactor, distinctive in that at least one main part of the reactor, which part is exposed for silicon-bearing gas and which part is heated for deposition of silicon on said part, is produced from silicon. Method for operation of the reactor.

Abstract: A method of forming an inductor in a crystal semiconductor layer is provided, including generating an ion beam, directing the ion beam to a surface of the crystal semiconductor layer, applying a magnetic field to the ion beam to generate a helical motion of the ions and forming a three-dimensional helical structure in the crystal semiconductor layer by means of the ions of the ion beam.

Abstract: A system for creating a reference mark on a honeycomb core is disclosed. The core has cells that pass from a top face to a bottom face. The system includes a support surface configured to position the honeycomb core, a mounting plate configured to move along a defined path proximate to the top surface of the honeycomb core when positioned on the support surface, and a first nozzle coupled to the mounting plate. The first nozzle is configured to apply a marking material to a portion of the top face of the honeycomb core as the mounting plate passes along the defined path.

Abstract: System for measuring thickness and lateral position of a transparent object. The system includes a camera having a sensor for receiving light, the camera including an objective lens for focusing on an object plane and having an optical axis and a field of view. A source of light is provided to illuminate a surface having variations in reflected light intensity. The surface is spaced apart from the objective lens and disposed at an angle with respect to the optical axis of the objective lens. A transparent object disposed fully or partially between the objective lens and the surface will shift the position of the object plane, the shift in object plane being proportional to the thickness of the object, and the transparent object, when partially inserted between the objective lens and the surface, will focus a fraction of the light on a lower plane, this fraction of light being proportional to the fraction of the lens field of view occupied by the transparent object that is related to lateral position.

Abstract: A coating equipment for composite membrane without diffusion pump and its thickness gauge for both thick and thin coatings comprises a coating equipment for composite membrane without diffusion pump and a thickness gauge for both thick and thin coatings. A vacuum pump system of the coating equipment for composite membrane without diffusion pump is a roots-type pump system. Compared to conventional diffusion pumps, roots-type pump have advantages of low energy consumption, stable performance, good vacuum-pumping effect, short starting time, etc.

Abstract: The system and method of the instant invention utilizes a color sensor in order to monitor and control the application of a coating to a substrate when such coating is transferred onto a substrate from a deposition source. Application of the coating to the substrate is terminated when the color sensor detects a pre-programmed end point evidencing the application of an appropriate coating determined by its color.

Abstract: A process of coating at least one substrate with a plurality of deposition sources, a method of tooling, a carrier unit and a deposition system are described. The systems and methods provide for or allow for exposing a first substrate portion 112a of said at least one substrate 112 to a first deposition source 118a through an aperture 122 of a carrier unit 110, 510, depositing a first layer 126a over the first substrate portion, said first layer including material from said first deposition source, varying a relative position between said at least one substrate and said aperture for exposing a second substrate portion of said at least one substrate, or another substrate, to a second deposition source, and depositing a second layer 126b over the second substrate portion 112b, said second layer including material from said second deposition source.

Abstract: Systems and methods for adjusting a moisture concentration of veneer are provided. In at least one specific embodiment, the method for adjusting a moisture concentration of a veneer can include estimating a moisture concentration of a veneer surface at one or more locations thereon. The method can also include comparing the one or more estimated locations to a minimum moisture concentration level. The method can also include moisturizing at least a portion of the one or more estimated locations that are below the minimum moisture concentration level to increase the moisture concentration thereof.

Abstract: A can coating machine control system includes a coating control signal that functions as a go/no-go signal based on a plurality of monitored conditions such as can in position, vacuum pressure, gun in position, guard in position and speed condition. Local pressure regulation of the coating material in the spray gun is provided along with optional control of the material temperature. Local pressure regulation allows for optional spray weight control based on a wrap number derived from speed and gun spray durations. A CAN to CAN network buffer is provided as well for primary network isolation. A gun control circuit may be used to select specific gun drive signals and to adjust gun drive signals based on real-time feedback of the actual spray duration.

Abstract: According to the present disclosure, it is possible to prevent particles from being generated and to improve substrate processing quality.

Abstract: A device for manufacturing a display device includes a deposition source; a deposition thickness calculator for calculating a deposition thickness of a deposition material deposited on a substrate; and a controller for controlling a power of a heater which heats the deposition source by comparing the deposition thickness calculated with a reference thickness. The controller controls the power of the heater either at least one time for each substrate on which the thin film is to be deposited or at regular intervals while the deposition material is deposited. Influence of measurement noise that is included in a quartz crystal sensor for measuring a deposition speed may be minimized, and distribution of deposition thickness of an organic light emitting material may be reduced, thereby increasing the yield of the deposition process and producing quality display devices.

Abstract: The invention provides an apparatus for manufacturing a cylindrical member comprising a cylindrical core body having an outer peripheral surface with a releasing property, the apparatus comprising: a film-forming device that forms a resin film in a region at a central portion from both ends in the axial direction of the outer peripheral surface of the core body; a judging device that judges the deterioration of the releasing property of regions continuous from the region where the resin film is to be formed in the region at the inner side from both ends in the axial direction of the outer peripheral surface of the core body, before the resin film is formed by the film-forming device; and a control device that controls the film-forming device such that the resin film is formed by exposing regions with an undeteriorated releasing property on both ends in the axial direction of the outer peripheral surface of the core body, in accordance with the results of judgment by the judging device.

Abstract: According to one embodiment, an imprinting apparatus includes an ejecting unit, a stage, a moving unit, and an observation unit. The ejecting unit ejects and drips a hardening resin material onto a substrate to be processed. The substrate to be processed is placed onto the stage. The moving unit relatively moves the ejecting unit and the stage. The observation unit observes the dripped hardening resin material and the pattern with the state in which the dripped hardening resin material and the pattern are overlaid on a plane, before the template is brought into contact with the hardening resin material.

Abstract: A laser cladding device for applying a coating to a part comprising a laser which can generate laser light, which is adapted to heat the coating and the part, a main body defining a laser light channel adapted to transmit the laser light to the part, a coating channel adapted to transmit the coating to the part, and a vacuum channel and a nozzle having an exit. The nozzle comprises a delivery port at one end of the laser light channel, a coating port at one end of the coating channel, and a vacuum port at one end of the vacuum channel, wherein the vacuum port is positioned generally adjacent the delivery port In operation the vacuum port draws a vacuum, pulling the coating towards the part.

Abstract: A wafer processing system includes at least one metrology chamber, a process chamber, and a controller. The at least one metrology chamber is configured to measure a thickness of a first layer on a back side of a wafer. The process chamber is configured to perform a treatment on a front side of the wafer. The front side is opposite the back side. The process chamber includes therein a multi-zone chuck. The multi-zone chuck is configured to support the back side of the wafer. The multi-zone chuck has a plurality of zones with controllable clamping forces for securing the wafer to the multi-zone chuck. The controller is coupled to the metrology chamber and the multi-zone chuck. The controller is configured to control the clamping forces in the corresponding zones in accordance with measured values of the thickness of the first layer in the corresponding zones.

Abstract: A hot melt adhesive system includes a melting unit configured to liquefy a bulk form of hot melt adhesive and deliver the liquefied hot melt adhesive to an application location. The melting unit includes a controller for establishing and/or verifying at least one system condition, such as temperatures associated with system operation. A machine reading unit is coupled with the controller and is capable of receiving information from a machine readable element and communicating the information to the controller for use in establishing and/or verifying the system condition. A method of operating the system includes scanning information on at least one system condition into the controller from a machine readable element, and using the scanned information during operation of the melting unit.

Abstract: The purpose of the invention is increasing the efficiency of utilizing an EL material and providing a deposition method and a vapor deposition apparatus which is one of the film formation systems which are excellent in throughput and uniformity in film thickness in forming an EL layer. According to the invention, evaporation is performed by moving or reciprocating an evaporation source holder in which a plurality of containers (crucible) each encapsulating an evaporation material are set only in an X direction while moving a substrate at regular intervals. Further, in the plurality of evaporation source holders, film thickness meters of adjacent evaporation sources are disposed alternately so as to sandwich the movement pathway of the substrate.

Abstract: A substrate treating system includes a coating apparatus having a resist coating unit, an exposing apparatus having an exposing machine and a heat-treating unit, and a controller for controlling the resist coating unit, exposing machine and heat-treating unit. The controller coordinates schedules of treatment in the coating apparatus and exposing apparatus, such that the coating apparatus can operate efficiently despite an increase in the processing time of the exposing machine.

Abstract: Silicon sintering method, without applying an external force, comprising placement of a silicon sample in a furnace, then heat treatment of this sample at, at least one temperature and at least one partial pressure of oxidising species to control the thickness of a silicon oxide layer on its surface.

Abstract: Disclosed is an apparatus and process for coating a component with aligning device. Alignments or checking of the spray cone take place within the coating apparatus via an optically transparent reference plate which is optically evaluated.

Abstract: A substrate processing method includes performing a deposition process of depositing a thin film on the substrate while depressurizing the inside of the processing chamber and introducing the gas thereinto; and, while the deposition process is being performed, irradiating light, which is transmitted through a monitoring window installed at the processing chamber, toward the inside of the processing chamber through the monitoring window, and monitoring a reflection light intensity of reflection light by receiving the reflection light through the monitoring window. The substrate processing method further includes measuring a temporal variation in the reflection light intensity during the deposition process and calculating a termination time of the deposition process based on a measurement value of the temporal variation; and terminating the deposition process by setting the termination time as an end point of the deposition process.

Abstract: A coating film (90) is formed by causing vapor deposition particles (91) discharged from a vapor deposition source opening (61) of a vapor deposition source (60) to pass through a space between a plurality of control plates (81) of a control plate unit (80) and a mask opening (71) of a vapor deposition mask in this order and adhere to a substrate, while the substrate (10) is moved relative to the vapor deposition mask (70) in a state in which the substrate (10) and the vapor deposition mask (70) are spaced apart at a fixed interval. A difference in the amount of thermal expansion between the vapor deposition source and the control plate unit is detected and corrected. It is thereby possible to form, at a desired position on a large-sized substrate, the coating film in which edge blur and variations in the edge blur are suppressed.

Abstract: An apparatus for depositing a material layer on a sample inside a vacuum chamber comprises a sample stage (100) for arranging at least one sample (103a, 103b, 103c, 103d); an evaporation source (101, 201), connected to a current source, for a thread-shaped evaporation material (102, 202); a quartz oscillator (105) for measuring the deposited material layer thickness; and an evaluation device (113) associated with the oscillator (105). An electronic control system (112) associated with the evaporation source (101, 201) is configured to deliver electric current in the form of at least two current pulses having a pulse length less than or equal to 1 s. The evaluation device (113) takes into account transient decay behavior of the oscillator (105) immediately after a current pulse to derive the material layer thickness deposited after each pulse. The invention further relates to a method that can be carried out using said apparatus.

Abstract: A can coating machine control system includes a coating control signal that functions as a go/no-go signal based on a plurality of monitored conditions such as can in position, vacuum pressure, gun in position, guard in position and speed condition. Local pressure regulation of the coating material in the spray gun is provided along with optional control of the material temperature. Local pressure regulation allows for optional spray weight control based on a wrap number derived from speed and gun spray-durations. A CAN to CAN network buffer is provided as well for primary network isolation. A gun control circuit may be used to select specific gun drive signals and to adjust gun drive signals based on real-time feedback of the actual spray duration.

Abstract: A substrate is first rotated at a first rotation speed, and a resist solution is applied. Rotation of the substrate is decelerated to a second rotation speed lower than the first rotation speed so that the substrate is rotated at the low speed to smooth the resist solution on the substrate. Rotation of the substrate is then accelerated to a third rotation speed higher than the second rotation speed, and a solvent for the coating solution and/or a dry gas are/is supplied to the resist solution on the substrate. The solvent gas is supplied to a portion of the resist solution on the substrate thicker than a set thickness, and the dry gas is supplied to a portion of the coating solution on the substrate thinner than the set thickness. This thins the thicker portion of the resist solution and thickens the thinner portion to uniform the resist solution.