Abstract: A coating apparatus and an operating method thereof that prevent damage to the nozzle of a spinless coater from impurities on a substrate during resin coating of the substrate, and impurities remaining on a stage at the bottom of the substrate. The coating apparatus comprises a stage, a nozzle, a nozzle cleaner, and a stage cleaner. A substrate is placed upon the stage. The nozzle discharges resin on the substrate to perform coating. The nozzle cleaner cleans the nozzle. The stage cleaner cleans the stage. The operating method includes removing a coated first substrate from atop a stage, cleaning the stage using a stage cleaner, introducing a second substrate to be coated onto the cleaned stage, and discharging resin through a nozzle onto the second substrate and coating the second substrate.

Abstract: There is disclosed a film forming method comprising continuously discharging a solution adjusted so as to spread over a substrate by a given amount to the substrate through a discharge port disposed in a nozzle, moving the nozzle and substrate with respect to each other, and holding the supplied solution onto the substrate to form a liquid film, wherein a distance h between the discharge port of the nozzle and the substrate is set to be not less than 2 mm and to be in a range less than 5×10?5 q? (mm) given with respect to a surface tension ? (N/m) of the solution, discharge speed q (m/sec) of the solution continuously discharged through the discharge port, and a constant of 5×10?5 (m·sec/N).

Abstract: The present invention provides a system and methodology for dummy-dispensing resist though a dispense head while mitigating waste associated with the dummy-dispense process. The dummy dispensed resist is returned to a reservoir from which it was taken. Between substrate applications, the dispense head can be positioned to dispense resist into a return line. The flow of resist from the dispense head keeps resist from drying at the dispense head. By funneling the dummy-dispensed resist into a return line with low volume, for example, waste from the dummy-dispensing process can be mitigated.

Abstract: The present invention provides a method and an apparatus capable of mass-producing an aligned CNT aggregate of a desired height through automatic control of a CVD apparatus according to a growth height of the aligned CNT aggregate. According to the present invention, an aligned carbon nanotube aggregate growing on a substrate is irradiated with a parallel ray, and the size of a resulting shadow is measured with a measurement section using a telecentric optical system, which acts as if it has an infinite focal length, so as to detect, in real time, a growth height of the aligned carbon nanotube aggregate being synthesized, and the synthesis of the aligned carbon nanotube aggregate is terminated when the growth height of the aligned carbon nanotube aggregate reaches a predetermined state.

Abstract: A droplet formation method of a mixed liquid is a method that the droplets 71, 72 and 73 are each delivered from each capillary tip to form the droplet 74 of the mixed liquid consisting of a raw material liquid on a substrate by applying a pulse voltage between the raw material liquids stored for each of a plurality of capillaries 1, 2 and 3 and the substrate disposed opposite to each capillary tip. In addition, a droplet formation device of the mixed liquid is provided with a plurality of capillaries for realizing formation of the droplet 74 of the aforementioned mixed liquid, a substrate, a voltage applying device for applying a pulse voltage and a controller for controlling the voltage applying device.

Abstract: A method and an apparatus for measuring the amount (CW) of a coating (2) on a paper web (1). The amount (CA) of at least one component in the coating (2) on the paper web (1) is measured and the composition (CC) of the coating (2) to be transferred to the paper web (1) is determined. The amount (CW) of the coating (2) on the paper web (1) is determined on the basis of the amount (CA) of at least one component in the coating (2) on the paper web (1) and the composition (CC) of the coating (2) to be transferred to the paper web (1).

Abstract: The apparatus and method use an optical feedback system to align a brush assembly with a stent strut. Once alignment is achieved, a coating is dispensed onto the stent strut via the brush assembly and the brush assembly is moved along the stent strut to coat the stent strut.

Abstract: The present invention is a coating treatment method of applying a water-soluble coating solution onto a substrate, including: a first step of supplying pure water to a central portion of the substrate in a manner that the pure water does not diffuse over an entire surface of the substrate; a second step of subsequently supplying the water-soluble coating solution to a central portion of the pure water on the substrate to form a mixed layer of the coating solution and the pure water, under the coating solution; and a third step of subsequently diffusing the mixed layer over the substrate to diffuse the coating solution over the entire surface of the substrate.

Abstract: An apparatus and method for processing elongated sheet material through a plurality of processing stations including a cooling station for lowering the temperature of the sheet material. The cooling station includes a plurality of individually controllable cooling zones each for controlling a portion of the transverse width of the sheet material during passage through the cooling zone. The cooling zones each include a plurality of cooling fluid directing spray nozzles and a sensor for sensing the temperature of the portion of the sheet material onto which cooling fluid has been directed by the respective cooling zone. A controller responsive to the temperature sensed at each cooling zone is operable for independently controlling the flow of cooling fluid to the fluid spray nozzles of each cooling zone based upon a preset temperature setting of the controller.

Abstract: A drawing apparatus is first adjusted so that a pattern is drawn on the photomask at a pattern position at which a position variation amount of the pattern position on a surface of the photomask due to distortion of the photomask that occurs when the photomask is held on a mask stage of an exposing apparatus is eliminated. Then, a position measuring device that measures the pattern position is adjusted so that the position variation amount is added to a result of measurement of the pattern position by the position measuring device. Finally, the pattern is drawn on the photomask by using the adjusted drawing apparatus and the pattern position of the pattern is measured by using the adjusted position measuring device.

Abstract: The present invention presents an improved upper electrode for a plasma processing system, wherein the design and fabrication of an electrode plate coupled to an upper assembly advantageously provides gas injection of a process gas with substantially minimal erosion of the electrode plate.

Abstract: A coloring structure manufacturing apparatus for manufacturing a coloring structure having a prescribed coloring characteristic, includes a film forming device which forms a transparent thin film with a thickness determined according to the coloring characteristic by coating a substrate with a liquid material, and a reflectance measuring device which measures a reflectance by irradiating the transparent thin film with detection light. The transparent thin film is formed such that two or more kinds of liquid materials having different refraction indexes are alternately applied to be laminated.

Abstract: The invention concerns a process for the layerwise production of a product comprising the steps of applying a layer of a hardenable material, wherein for example the process parameters of layer thickness and layer material are adjustable, selectively hardening predetermined regions of the applied layer on the basis of the geometrical data of the product, wherein for example the process parameters for the nature and level of the energy input are adjustable, repeating those steps until the geometry of the product has been produced in the form of hardened material, and finally removing the non-hardened material. Known processes suffer from the disadvantage that they do not afford variability in regard to the local properties of the product. The invention remedies that disadvantage insofar as at least one process parameter is altered during the production procedure in order to influence the grain size in a first region of the product in relation to a second region of the product.

Abstract: Apparatus for producing an object by sequentially forming thin layers of a construction material one on top of the other responsive to data defining the object, the apparatus comprising: a plurality of printing heads each having a surface formed with a plurality of output orifices and controllable to dispense the construction material through each orifice independently of the other orifices; a shuttle to which the printing heads are mounted; a support surface; and a controller adapted to control the shuttle to move back and forth over the support surface and as the shuttle moves to control the printing heads to dispense the construction material through each of their respective orifices responsive to the data to form a first layer on the support surface and thereafter, sequentially the other layers; wherein each printing head is dismountable from the shuttle and replaceable independently of the other printing heads.

Abstract: Apparatus for producing an object by sequentially forming thin layers of a construction material one on top of the other responsive to data defining the object, the apparatus comprising: a plurality of printing heads each having a surface formed with a plurality of output orifices and controllable to dispense the construction material through each orifice independently of the other orifices; a shuttle to which the printing heads are mounted; a support surface; and a controller adapted to control the shuttle to move back and forth over the support surface and as the shuttle moves to control the printing heads to dispense the construction material through each of their respective orifices responsive to the data to form a first layer on the support surface and thereafter, sequentially the other layers; wherein each printing head is dismountable from the shuttle and replaceable independently of the other printing heads.

Abstract: When a solution sprayed by a spray nozzle portion reaches one surface portion of a substrate, a thin film forming material contained the solution decomposes thermally because the substrate is heated to a prescribed temperature, and a thin film is formed on the one surface portion of the substrate. An imaging section obtains a prescribed information on the thickness of a thin film to be formed on one surface portion of the substrate, and a main control section controls a valve section based on the prescribed information from the imaging section. Since, based on the prescribed information on the thickness of a thin film to be formed on one surface portion of the substrate, the main control section allows the spraying nozzle portion to spray the solution therefrom, a thin film of the desired thickness can be formed with high accuracy.

Abstract: The present invention provides a processing system, a processing method and a program, which can readily control a gas flow rate. A vertical-type heating apparatus 1 includes a plurality of gas supply pipes 16 to 20 each adapted for supplying a processing gas into a reaction vessel 2 configured to contain therein semiconductor wafers W. For the gas supply pipes 16 to 20, flow rate control units 21 to 25 are provided, respectively, for controlling each flow rate. In a control unit 50, processing conditions including the flow rate of the processing gas and a film thickness-flow rate-relationship model indicative of a relationship between the flow rate of the processing gas and a film thickness, are stored.

Abstract: A coating solution is sprayed on a rotating wafer held horizontally from a nozzle provided above the wafer while the nozzle is travelling over the wafer from a wafer center to a wafer outer area, thus spirally spraying the coating solution on the wafer. The nozzle stops when the coating solution has reached the wafer outer area and the coating solution is sprayed in circle on the wafer outer area while the wafer is rotating. A coating solution including a component of a coating film and a solvent may be sprayed on a first area to be coated of the wafer and the coating solution and a solvent for the coating film may be sprayed on a second edge area located outside the first area of the wafer.

Abstract: A vapor deposition process for depositing TiO2 and a vapor desposition process for depositing SiO2 are alternately repeated in a multi-layer film forming process. A refractive index that a thin film formed by each vapor depositing will provide is individually determined prior to each relative vapor depositing, and vapor deposition control data is prepared based on such a refractive index. Each vapor deposition is controlled by using a relative vapor deposition control data thus prepared. Therefore, each vapor deposition process can be accurately controlled according to the refractive index of a thin film even if repeated vapor deposition processes change the refractive index. Accordingly, a multilayer film having desired optical characteristics can be formed.

Abstract: An apparatus for forming an alignment layer of a liquid crystal display device includes: an alignment material dropping unit with a head having a plurality of holes for dropping an alignment material on the substrate; an alignment material supply unit to supply the alignment material to the alignment material dropping unit; a scan unit to survey alignment material dropping from the head; and a monitor to display an image base upon scan data from the scan unit so that the discharge state of the plurality of holes in the head can be checked.

Abstract: When a coating film is formed on a substrate, the inplane uniformity of the thickness of the coating film is enhanced to improve through put. Above the substrate, there are provided main and auxiliary nozzles separately movable, and monitoring means for monitoring the state of the surface of the substrate to detect the occurrence of an uncoated region on the surface of the substrate. On the basis of previously prepared coating data, a coating liquid is spirally applied on the substrate by the main nozzle. Then, if the monitoring means detects the occurrence of the uncoated region in a coated region in which the coating liquid has been applied by the main nozzle, a control part detects whether it is required to supply the coating liquid to the uncoated region. If it is required, the coating liquid is supplied to the uncoated region by the auxiliary nozzle. On the other hand, the portion of occurrence of the uncoated region has been grasped by the control part.

Abstract: A method and apparatus for the unusually high rate deposition of thin film materials on a stationary or continuous substrate. The method includes the in situ generation of a neutral-enriched deposition medium that is conducive to the formation of thin film materials having a low intrinsic defect concentration at any speed. In one embodiment, the deposition medium is created by forming a plasma from an energy transferring gas; combining the plasma with a precursor gas to form a set of activated species that include ions, ion-radicals, and neutrals; and selectively excluding the species that promote the formation of defects to form the deposition medium. In another embodiment, the deposition medium is created by mixing an energy transferring gas and a precursor gas, forming a plasma from the mixture to form a set of activated species, and selectively excluding the species that promote the formation of defects.

Abstract: An advance process control (APC) system for a plasma process machine is provided, which includes at least an optical emission spectroscopy (OES) system and an APC analysis apparatus. The OES system is used for monitoring a testing object in the plasma process machine. The APC analysis apparatus is used for analyzing the data received from the OES system.

Abstract: An endpoint detection device, a plasma reactor with the endpoint detection device, and an endpoint detection method are provided. The endpoint detection device includes an OES data operation unit, a data selector, a product generator, an SVM, and an endpoint determiner. The OES data operation unit processes reference OES data by normalization and PCA. The data selector selects part of the linear reference loading vectors and selects part of the selected linear reference loading vectors. The product generator outputs at least one reference product value. The SVM performs regression and outputs a prediction product value. The endpoint determiner detects a process wafer etch or deposition endpoint and outputs a detection signal.

Abstract: An apparatus for wetting and coating ophthalmic lenses having a tank with a cleaning or coating solution and a handling system for sequentially moving a lens and the solution in relation to each other, to wet the lens. A master control module is coupled to the handling system and configured execution a wetting profile. The wetting profile moves the lens to obtain a generally consistent lens surface wetting speed so that the lens coating has a more uniform thickness. According to a method, lenses are wetted in a liquid bath. The lens is placed in a handling system which moves the lens with respect to the bath according to a wetting profile.

Abstract: A microdeposition system (20) and method includes a head with a plurality of nozzles (230). A controller (22) generates nozzle firing commands that selectively fire the nozzles to create a desired feature pattern. Configuration memory stores voltage waveform parameters that define a voltage waveform (280) for each of the nozzles. A digital to analog converter (DAC) sequencer communicates with the configuration memory and the controller and outputs a first voltage waveform for a first nozzle when a nozzle firing command for the first nozzle is received from the controller (22). A resistive ladder DAC receives the voltage waveforms from the DAC sequencer. An operational amplifier (opamp) communicates with the resistive ladder DAC and amplifies the voltage waveforms. The nozzles fire droplets when the voltage waveforms received from the opamp exceed a firing threshold of the nozzle (230).

Abstract: A spray assembly for applying a fluid material to a surface includes a first spray bar and a second spray bar, each of which is mounted for movement along an axis. Each spray bar includes a plurality of nozzles, each of which is associated with a valve that can be opened or closed. Each nozzle is adapted to dispense a fluid material in a defined spray pattern onto the surface. The nozzles are spaced along the length of the spray bar to which they are attached and disposed above the surface so that the spray pattern from any nozzle on a spray bar does not overlap the spray pattern of a longitudinally adjacent nozzle. The assembly also includes a source of fluid material, and a fluid circuit through which fluid material may be supplied to each of the nozzles. Components of the assembly are also provided for intercepting at least a portion of the spray from a nozzle of the second spray bar to prevent the spray pattern from such nozzle from overlapping with the spray pattern from a nozzle of the first spray bar.

Abstract: In order to detect an abnormality of semiconductor manufacturing apparatus, a biaxial coordinate system having first and second axes respectively assigned two different monitoring parameters selected from plural apparatus status parameters representing statuses of semiconductor manufacturing apparatus is prepared. As monitoring parameters, for example, a cumulative film thickness for deposition processes that have previously been performed in deposition apparatus and an opening of the pressure control valve located in a vacuum exhaust path to control the internal pressure of a reaction vessel are selected. Values of monitoring parameters obtained when the semiconductor manufacturing apparatus was normally operating are plotted on the biaxial coordinate system. A boundary between a normal condition and an abnormality status is set around a plot group.

Abstract: A process of manufacturing a semiconductor device utilizing a thermo-chemical reaction is started based on preset initial settings, a state function of an atmosphere associated with the thermo-chemical reaction is measured, a state of the atmosphere and a change thereof are analyzed based on measurement data obtained by the measurement, and then, analysis data obtained by the analysis is fed back to a manufacturing process.

Abstract: The invention relates to a device and method for controlling the operation of a thermal spray torch (12). The inventive device and method are characterized in that an on-board camera (54) and pyrometer (70) are used to measure the properties of the jet (16) and the temperature of the deposit (24) on the part (22) and in that the correction to be made to supply parameters of the torch (12) is deduced. Furthermore, the invention is characterized in that the corrected parameters are sent to the cabinet (30) that controls the torch (12).

Abstract: Aspects of the invention are directed to systems and methods for dispensing materials onto a substrate. In one aspect, a dispensing system includes a dispenser having a dispensing outlet positionable over a top surface of the substrate, the dispenser having a substantially vertical dispensing axis along which material from the dispenser is dispensed, and a vision system, coupled to the dispenser, the vision system being positionable to obtain images of the top surface of the substrate along an optical axis, wherein the vision system is constructed and arranged such that the optical axis intersects the dispensing axis.

Abstract: A method and apparatus for simultaneously coating and measuring a part. The apparatus includes a part support, a sprayer and a part measurer positioned adjacent to the part support and a display device positioned adjacent to the part support. The sprayer applies a coating to a section of the part while the part measurer continuously measures a dimension of the section of the part being coated. In one embodiment, an initial amount of coating and a final amount of coating are applied to the section of the part based on the dimension measurements and desired dimension of the part. In another embodiment, the amount of coating applied to the part is based on the desired coating thickness. As a result, the apparatus and method of the present invention significantly reduces the margin of error related to the application of coatings to parts.

Abstract: An apparatus and method use closed loop control processes to automatically adjust a command signal used to change an operating state of a fluid dispensing gun. Proportional, integral and/or derivative control processes are used to determine an operating parameter comprising on time compensation, off time compensation and/or a fluid pressure compensation. An adjustment is made to the operating parameter if a number of consecutive measurements of an adhesive bead characteristic are outside of a predetermined tolerance range. A sensor for producing a feedback signal is used to communicate a measurable difference between an actual and a desired bead characteristic. The feedback signal applied in real time is used when determining the operating parameter, reducing substrate waste and increasing efficiency.

Abstract: A liquid crystal dispensing system includes a liquid crystal material container to contain liquid crystal, the liquid crystal material container provided with a first code corresponding to liquid crystal information; a reading unit to read the recognition code; a discharge pump to draw in and discharge liquid crystal from the liquid crystal material container; and a nozzle to dispense liquid crystal from the discharge pump onto a substrate.

Abstract: An apparatus includes a housing defining a chamber in which an electric field is generated, and an internal member provided in the chamber. At least one part of the internal member is formed of a dielectric material. A process is executed in the chamber so that a dielectric deposit is formed on the at least one part of the internal member. An m1(d?1/dm1) value of the dielectric material and ?n m2(d?2/dm2) value of the dielectric deposit are set so that production of particles from the deposit is properly controlled. The term m1 is a mass density of the dielectric material, ?1 is a permittivity of the dielectric material, m2 is a mass density of the dielectric deposit, and ?2 is a permittivity of the dielectric deposit.

Abstract: The invention relates to a device and a method for control of the operation of a thermal projection torch (12), characterized in that the characteristics of the jet (16) and the temperature of the deposit (24) on the piece (22) are measured by means of a camera (54) and a combined pyrometer (70). The correction to be made to the supply parameters of the torch (12) are deduced therefrom and the corrected parameters are transmitted to the unit (30) controlling the torch (12).

Abstract: The invention relates to a device and method for controlling the operation of a thermal spray torch (12). The inventive device and method are characterised in that an on-board camera (54) and pyrometer (70) are used to measure the properties of the jet (16) and the temperature of the deposit (24) on the part (22) and in that the correction to be made to the supply parameters of the torch (12) is deduced. Furthermore, the invention is characterised in that the corrected parameters are sent to the cabinet (30) that controls the torch (12).

Abstract: The invention relates to a device and a method for control of the operation of a thermal projection torch (12), characterized in that the characteristics of the jet (16) and the temperature of the deposit (24) on the piece (22) are measured by means of a camera (54) and a combined pyrometer (70). The correction to be made to the supply parameters of the torch (12) are deduced therefrom and the corrected parameters are transmitted to the unit (30) controlling the torch (12).

Abstract: The present invention relates to a method for manufacturing a liquid crystal display utilizing the dispense-injection method, and it is an object of the invention to provide a method for manufacturing a liquid crystal display which allows an optimum quantity of liquid crystals to be dispensed on each substrate. At a dispense-injection step, in the case of a two-shot process for fabricating two liquid crystal display panels from a single glass substrate 80, the heights of support posts on two CF substrates 82 (let us call them surfaces A and B) having columnar spacers formed thereon are measured at a plurality of points (e.g., five locations indicated by numerals 1 through 5) on each of the surfaces A and B using a laser displacement gauge and an average value of the height is obtained. The support post height of the columnar spacers is thus measured in advance to control the quantity of dispensed liquid crystals based on the measured value.

Abstract: A reactant gas is supplied to a gas inlet port 40B of a reaction chamber 20A from a plurality of gas flow paths 36A. The number of gas flow paths 36A is five or more within a range of one side of the gas inlet port 40B divided in two at the center thereof. The pitch between adjacent gas flow paths 36A is 10 mm or more. A baffle 38 having a plurality of slit holes 38A is disposed upstream of the gas flow paths 36A. The gas flow rates of the respective gas flow paths 36A are adjusted by recurrent calculation using layer growth sensitivity data that defines the relation between the gas flow rates of the respective gas flow paths 36A.

Abstract: In a measurement mechanism for continuously measuring a thickness of a coating layer, provided in an apparatus for forming the coating layer on a conductive elongate base material in a coating treatment base station while the base material is fed, a sensing portion for measuring a capacitance value of the coating layer is arranged before and after the base station, and tension applied to the base material at the sensing portion is set to be greater than tension applied to the base material at the base station. Thus, in forming the coating layer on the elongate base material while the base material is continuously fed, variation in a feeding speed is suppressed, influence of sway of a measurement surface in a direction of thickness at the thickness sensing portion during feeding is minimized, and a thickness of the coating layer can be measured with higher accuracy.

Abstract: A substrate processing apparatus enable fouling due to deposit to be monitored in real time. To monitor deposit attached to an inner wall surface of a processing chamber in which processing is carried out on a substrate, a deposit monitoring apparatus of the substrate processing apparatus includes a sensor for measuring a capacitance between two conductors spaced apart from each other and both connected to the sensor. The capacitance between the conductors increases with increase in an mount of deposit and reflects the state of fouling due to deposit.

Abstract: A substrate processing apparatus capable of improving the degree of freedom for installation of a deposit monitoring apparatus component used for direct deposit analysis. A deposit monitoring apparatus of the substrate processing apparatus for monitoring deposit in a processing chamber in which a substrate is processed includes an optical fiber having a portion thereof exposed in the processing chamber. Incident light is emitted to the optical fiber from a light-emitting device connected to one end of the optical fiber, and light having passed through the optical fiber is received by a light-receiving device connected to another end of the optical fiber.

Abstract: In a film forming apparatus according to the aerosol deposition method, the thickness of a structure being formed can be controlled accurately. The film forming apparatus includes an aerosol generating part in which raw material powder is to be provided, a compressed gas cylinder and a pressure regulating part for introducing a gas into the aerosol generating part to blow up the raw material powder thereby generating an aerosol, a substrate holder for holding a substrate on which a structure is to be formed, a nozzle for spraying the aerosol generated in the aerosol generating part toward the substrate, and a sensor to be used for obtaining an amount of primary particles that have contributed to film formation by impinging on the substrate or the structure formed thereon from among the raw material powder contained in the aerosol sprayed from the nozzle.

Abstract: A carriage 5 is provided with an injection head 7 to discharge an amount of liquid drops according to the supplied driving pulses and a liquid material sensor 17 to detect the ink amount hit at a filter substrate at each pixel region. A main controller 31 determines a waveform of the driving pulses capable of discharging the short amount of liquid drops according to a level of a detection signal from the liquid material sensor 17 and outputs the determined information on the waveform of the driving pulses to driving signal generator 32. The driving signal generator 32 generates driving pulses according to the received information on the waveform and outputs it to the injection head 7. The injection head 7 adjusts an ink amount at the corresponding pixel region to the target amount of liquid material by injecting the short amount of liquid drops to the corresponding pixel region.

Abstract: A film formation apparatus by which a film thickness can be precisely measured and whether the film quality is good or bad can be confirmed in a process of performing film formation according to the aerosol deposition method. The film formation apparatus includes: an aerosol generating unit for generating an aerosol by dispersing a raw material powder by a gas; a holding unit for holding a substrate on which a structure is to be formed; a nozzle for injecting the aerosol generated by the aerosol generating unit toward the substrate; and a measurement unit for measuring an electric potential of a film formation surface on the substrate.

Abstract: A process for forming a thin film is described that enables automatic formation of thin films having constant optical properties reliably and in large quantities with excellent reproducibility suitable for mass production. An apparatus for performing the process is also described. Generally, a material for vapor deposition is vaporized by an electron gun and an antireflection film forms by vapor deposition on lenses held by a coat dome. The electric power applied to the electron gun is controlled so that the amount of transmitted or reflected light continuously measured by an optical film thickness meter during thin film formation is compared to a reference amount of measured light stored in a means for storing data until the measured and reference amounts of measured light are close to, or the same as, one another.

Abstract: The present invention provides a system which shortens the scanning time with an ink jet head for forming a pattern of filter elements of a color filter, picture element pixels of an electroluminescence (EL) device, or the like. An apparatus for producing a color filter can include a plurality of filter elements arranged on a substrate. The apparatus can further include a plurality of heads each having a nozzle row having a plurality of nozzles arranged, an ink supply device for supplying a filter element material to the heads, a carriage supporting the heads arranged thereon, a main scanning driving device for moving the carriage by main scanning in the X direction, and a sub-scanning driving device for moving the carriage by sub-scanning in the Y direction. The carriage supports the plurality of heads each of which is inclined at an in-plane inclination angle ?.

Abstract: In an ink jet apparatus for manufacturing a color filter 1, ink jet heads 22 having a plurality of nozzle 27 are disposed in a linear manner. Filter element member is ejected to a motherboard 12 from a plurality of nozzles 27 four times so as to form the filter element 3 in a predetermined thickness. By doing this, it is possible to prevent difference in the thickness in a plurality of the filter elements 3 and to equalize light transparency in planar manner. Thus, in an ejecting apparatus, a color filter can be formed in more common way at low cost and more efficiently. Also, it is possible to provide an ejecting apparatus which can equalize factors such as electrooptical characteristics of the electrooptical members, color displaying characteristics by the liquid crystal apparatuses, and illuminating characteristics by an EL surface.

Abstract: An apparatus for atomic layer deposition preventing mixing of a precursor gas and an input gas. From the apparatus a flow of the input gas is provided over a surface of the workpiece wherein a beam of the electromagnetic radiation is directed into the input gas in close proximity to the surface of the workpiece, but spaced a finite distance therefrom. The input gas is dissociated by the beam producing a high flux point of use generated reactive gas species that reacts with a surface reactant formed on the surface of the workpiece by a direct flow of the precursor gas flown from the dispensing unit. The surface reactant and reactive gas species react to form a desired monolayer of a material on the surface of the workpiece.