Abstract: Provided is a substrate processing apparatus. The substrate processing apparatus includes a swing nozzle that is arranged on one side of the support module, moves in a swing manner, and sprays a chemical solution to the substrate, a sensor arranged on one side of the swing nozzle to sense movement of the swing nozzle, an electromagnet and a magnet installed on the other side of the swing nozzle so as to be able to adjust spacing relative to each other, and a controller for receiving a sensing result of the sensor and performing a damping operation to the swing nozzle by providing power to the electromagnet to generate an attractive force or repulsive force between the electromagnet and the magnet.

Abstract: A method includes introducing a drill string including a bottom hole assembly into a wellbore, wherein the bottom hole assembly includes a mounted 3D printing sub-assembly. A wellbore is drilled with the bottom hole assembly, and at least a portion of a casing is printed with the 3D printing sub-assembly while drilling the wellbore. A related system includes a drill string having a length of drill pipe and a bottom hole assembly disposed at a distal end of the length of drill pipe. A 3D printing sub-assembly is mounted on the bottom hole assembly, wherein the printing sub-assembly includes a printer housing and a 3D printing head mounted at the printer housing. A control guides the 3D printing head to print at least a portion of a casing at a location radially away from the central longitudinal axis of the drill string.

Abstract: An optical fiber coating die assembly is provided. The optical fiber coating die assembly includes a housing defining a guide chamber having an inlet for receiving optical fiber and an outlet, a guide die located at the outlet of the guide chamber, and a sizing die. The optical fiber coating die assembly also includes a coating applicator disposed between the guide die and the sizing die, and a tube operatively coupled to the inlet of the guide chamber and axially aligned with the chamber to receive the optical fiber fed into the guide chamber and provide a barrier to air flow.

Abstract: A slide processing apparatus controls the temperature and orientation of a microscope slide carrying one or more specimens. The apparatus heats the specimen-bearing microscope slide while the slide is oriented to both facilitate adhesion between the specimens and the slide and control movement of the specimens relative to the microscope slide. A slide dryer of the apparatus conductively heats the specimens using a conductive slide heater that physically engages the microscope slide.

Abstract: The present invention relates to a light control system. The light control system comprising: a plurality of light sources each configured to emit light within a predetermined spectral range, each of the plurality of light sources being configured to illuminate a corresponding sub-portion of a space, a sensor configured to within the space, detect a location of a human or an animal; and a control engine configured to control the plurality of light sources based on the detected location of the human or the animal such that a sub-portion of the space in which the human or the animal is not present is exposed to the light within the predetermined spectral range at a predetermined threshold intensity. A method for exposing a sub-portion of a space with light within a predetermined spectral range at a predetermined threshold intensity is also provided.

Abstract: Methods of decellularization of tissue, such as mammalian tissue, are provided, along with methods of making an extracellular matrix (ECM) preparation. Systems and apparatus useful in performing the methods are also provided.

Abstract: A device includes a source for at least one liquid plastic component, and a metering device. The source is configured to intermittently supply the at least one liquid plastic component for the metering device. A buffer device with a variable buffer volume is between the source and the metering device, and the buffer device is connected to the source via an inlet opening and to the metering device via an outlet opening.

Abstract: Methods and apparatus for cleaning an atomic layer deposition chamber are provided herein. In some embodiments, a chamber lid assembly includes: a housing enclosing a central channel that extends along a central axis and has an upper portion and a lower portion; a lid plate coupled to the housing and having a contoured bottom surface that extends downwardly and outwardly from a central opening coupled to the lower portion of the central channel to a peripheral portion of the lid plate; a first heating element to heat the central channel; a second heating element to heat the bottom surface of the lid plate; a remote plasma source fluidly coupled to the central channel; and an isolation collar coupled between the remote plasma source and the housing, wherein the isolation collar has an inner channel extending through the isolation collar to fluidly couple the remote plasma source and the central channel.

Abstract: A mobile spray dispenser comprises a fluid circulation system and a heating unit. The fluid circulation system has a motorized pump capable of circulating fluid from a fluid reservoir in a high-pressure spray mode and a low-pressure recirculation mode, and of providing the fluid to a sprayer. The motorized pump draws lower power in the low-pressure recirculation mode than in the high-pressure spray mode. The heating unit is disposed within the fluid circulation system to heat the fluid to a target temperature, and comprises a primary heater and a boost heater. The primary heater is configured to be active during both the high-pressure spray mode and the low-pressure recirculation mode. The boost heater is in fluid series with the primary heater, and is configured to be active only during the low-pressure recirculation mode.

Abstract: A seal agent coating device is disclosed, comprising: a storage cavity, a nozzle, a connecting duct and a power driven component, wherein: the nozzle comprises a nozzle cavity and a mouth, the mouth being located at the lower part of the nozzle cavity and matching with the shape of the seal agent coating area of the substrate; the connecting duct interconnects the storage cavity and the nozzle cavity; the power driven component can squeeze the seal agent in the storage cavity into the nozzle cavity via the connecting duct, thereby squeezing it out via the mouth.

Abstract: A temperature control system for dispensing a fluid material from an applicator nozzle at a controlled temperature that includes at least one temperature control fluid conduit at least one fluid material supply conduit and at least one manifold device. The manifold device is in thermal communication with the temperature control fluid conduit and the fluid conduit and may also be in thermal communication with the fluid material supply conduit. At least one thermal adjustment device is in thermal contact with the manifold device. The thermal adjustment device includes at least one thermoelectric device such as at least one peltier circuit. The temperature control system also includes at least one sensor positioned proximate to the applicator nozzle that produces at least one signal actionable on the Peltier circuit device.

Abstract: A process for the inhibition of particulate emission during friction of heat-treated iron ore pellets includes the following steps: a) removal of heat-treated iron ore pellets at a temperature of 200° C.; and b) spraying of an alcohol by-product on pellets. The use of an alcohol by-product as an inhibitor of particulate emission is further described, with the alcohol by-product being sprayed on heat-treated iron ore pellets, which can partially or completely replace water during the handling, stacking, loading, and unloading of materials such as pellets, granules, fines, and other products from iron ore and other minerals. This process significantly reduces the emission of particulates in the an operational area.

Abstract: Various embodiments are directed to a system for managing an inventory comprising serialized products. A computer system may receive from an intake sensor a first tray identifier describing a first tray present on an intake transport system. The computer system may also associate the first tray identifier with a first serial identifier of a first product unit present on a product transport system and instructing the product transport system, by the computer system, to transport the first product unit to the first tray. Additionally, the computer system may instruct a robot to place the first tray containing the first product unit at a first bin selected from a plurality of robot-accessible bins.

Abstract: Various embodiments relate to application of a fluid to a substrate. The fluid is locally heated, for example, to obtain a desired thickness profile.

Abstract: An adhesive applying device includes a robot including a robot arm; a rotor set jig for setting thereat a rotor; a gun including a holder to which a cartridge containing the adhesive is mountable, the gun discharging the adhesive in the cartridge mounted to the holder and being mountable to an end of the robot arm; an electromagnetic valve that performs on/off switching control of supply of compressed air at a predetermined pressure into the cartridge mounted to the holder of the gun; a robot controller that controls an operation of the robot; and an upper-order controller that coordinates and controls the on/off switching control performed by the electromagnetic valve and the control of the operation of the robot performed by the robot controller.

Abstract: Disclosed are methods of lithography using a tip array having a plurality of pens attached to a backing layer, where the tips can comprise a metal, metalloid, and/or semi-conducting material, and the backing layer can comprise an elastomeric polymer. The tip array can be used to perform a lithography process in which the tips are coated with an ink (e.g., a patterning composition) that is deposited onto a substrate upon contact of the tip with the substrate surface. The tips can be easily leveled onto a substrate and the leveling can be monitored optically by a change in light reflection of the backing layer and/or near the vicinity of the tips upon contact of the tip to the substrate surface.

Abstract: Disclosed are a method and a system for processing wafers in fabricating a semiconductor device where disposing chemicals and wafer heating are needed for chemical reaction. A wafer is placed above a wafer heater such that a second surface faces the wafer heater, and heated from the second surface. A chemical layer is formed on an opposing first surface. The wafer heater is sized and configured to be capable of heating the entire second surface, and adapted to produce a locally differential temperature profile if needed. During heating, an actual temperature profile on the wafer may be monitored and transmitted to a computing system, which may generate a target temperature profile and control the wafer heater to adjust local temperatures on the wafer according to the target temperature profile. A supplemental heater for heating the chemicals may be used for finer control of the wafer temperature.

Abstract: A dispensing apparatus includes a dispensing unit having a main body, a channel through the main body, and a plurality of nozzles connected to the main body, the plurality of nozzles being configured to dispense fluid flowing in the channel, a gap sensor unit configured to determine size of gaps between adjacent nozzles in the dispensing unit, and a thermal expansion adjusting unit configured to thermally expand or contract the main body of the dispensing unit to adjust the gap size between adjacent nozzles to a predetermined size, based on the gap size determined by the gap sensor unit.

Abstract: Exemplary coating devices and methods are disclosed. An exemplary coating device may include an atomizer for applying a spray jet of a coating means or material to a component, at least one directing air nozzle for outputting shaping or directing air in order to shape the spray jet, and a temperature-control device for controlling the temperature of the directing air. The coating device may further include a control unit which activates the temperature-control device as a function of at least one operating variable of the atomizer in order to set a predetermined directing air temperature.

Abstract: A method and apparatus for processing a semiconductor substrate is described. The apparatus is a process chamber having an optically transparent upper dome and lower dome. Vacuum is maintained in the process chamber during processing. The upper dome is thermally controlled by flowing a thermal control fluid along the upper dome outside the processing region. Thermal lamps are positioned proximate the lower dome, and thermal sensors are disposed among the lamps. The lamps are powered in zones, and a controller adjusts power to the lamp zones based on data received from the thermal sensors.

Abstract: The purpose of the invention is increasing the efficiency of utilizing an EL material and providing a deposition method and a vapor deposition apparatus which is one of the film formation systems which are excellent in throughput and uniformity in film thickness in forming an EL layer. According to the invention, evaporation is performed by moving or reciprocating an evaporation source holder in which a plurality of containers (crucible) each encapsulating an evaporation material are set only in an X direction while moving a substrate at regular intervals. Further, in the plurality of evaporation source holders, film thickness meters of adjacent evaporation sources are disposed alternately so as to sandwich the movement pathway of the substrate.

Abstract: Coating rollers accepting liquid media provide liquid chemicals to substrates for depositing a thin coating layer on the flat substrates, such as semiconductors or panels. The liquid media is cooled to a life-preserving temperature while shielded from the thermal energy heating the substrates to prevent degrading the liquid media. Physical barrier or temperature barrier can be established in vicinities of the rollers to further limit exposing the liquid media to high temperature.

Abstract: A process for application of alcoholic derivative on heat treated pellets for inhibition of particulate emission is provided, and the process includes weighing the amount of heat treated pellets discharged from furnaces, measuring the temperature of the heat treated pellets discharged from furnaces, applying cooling fluid on the heat treated pellets until they reach temperatures below 140° C., and spraying the alcoholic derivative on the heat treated pellets. Also provided is a first device for applying cooling fluid that is capable of calculating a dosage of cooling fluid to be applied to the heat treated pellets, a second device for applying alcoholic derivative that is capable of calculating a dosage of alcoholic derivative to be applied to the heat treated pellets already cooled, and a carrier device that continuously communicates with the first device for applying cooling fluid and with the second device for applying alcoholic derivative.

Abstract: A system for creating a wood like appearance on a synthetic component including a sales client device, a network, computer instructions for creating a work order, a tray with scannable tray identifier to hold a synthetic component, a production client device connected to the network with computer instructions for applying a base coat, a glaze, and a top coat to the synthetic component as it automatically moves on a conveyer system a portion of which is connected to the production client device. A scannable tray identifier with a plurality of sensors link the tray identifier to the work order for authenticating and validating the location of the tray on the conveyor system, or initiating an alerting device. The system has a plurality of temperature control environments to simultaneously control heating of the synthetic component while spraying, drying and UV curing with spray treatment device.

Abstract: The present invention relates to a process of manufacturing a stretch composite, said method comprising: a) providing a first substrate in a machine direction, wherein said substrate has opposing first and second surfaces; b) providing a gravure printing roll having an exterior surface that comprises one or more cells wherein at least a portion of the surface is relatively cool; c) depositing a molten, non-adhesive, elastomeric composition onto the exterior surface of the gravure printing device which comprises a gravure printing roll, wherein said composition is characterized as having a peel force of less than about 3 N/cm; d) causing said composition to be pushed into said cells; and e) contacting said first surface of said substrate with said gravure printing roll and substantially completely transferring said elastomeric composition from said cells of said exterior surface on said gravure printing roll to said first surface; wherein said process is substantially free of tackifier.

Abstract: The invention is an immobilization apparatus comprising: a container (1) having a nozzle (4) formed for exhausting a solution; a charging means (PS, 5, 4) for charging the sample solution within the container; and an airflow generating means for generating airflow (Af) crashing into the sample solution. The immobilization apparatus is configured to operate the charging means and the airflow generating means simultaneously, atomize the solution into microparticulate substances charged while maintaining its activity and functionality by the electrostatic force due to the charge of the sample solution charged by the charging means and the crash energy due to the crash of the airflow generated by the airflow generating means into the sample solution, and exhaust it from the exhaust outlet (4), and the charged microparticulate substances are deposited on a substrate (7) by the electrostatic force.

Abstract: A material jet system, comprising a container for molten jet material (3) to be ejected, a heater (4) for melting and/or keeping molten said jet material, and a jetting unit (5, 6, 7) which is arranged to form and eject droplets (8) of said jet material. The system, moreover, comprises supply structures (2) which are arranged for providing an uninterrupted supply of said material, which comprises a metal in solid form (1), and which preferably have the shape of a wire, bar or tape. Furthermore the system comprises a structure for sealing the material in solid form and a pressure controller to control a heat insulating fluid pressure in the container.

Abstract: The present invention is a method of developing a resist film on a substrate using a developing solution at a predetermined temperature lower than room temperature, including a first cooling step of mounting and cooling the substrate on a cooling plate at a temperature lower than room temperature and higher than the predetermined temperature in a cooling apparatus; a second cooling step of then carrying the substrate into a developing apparatus and supplying a rinse solution at the predetermined temperature or lower onto the substrate to cool the substrate in the developing apparatus; a developing step of then supplying the developing solution onto the substrate and developing the resist film on the substrate to form a resist pattern in the resist film; and a cleaning step of then supplying a rinse solution at the predetermined temperature onto the substrate to clean a front surface of the substrate.

Abstract: A resist solution supply apparatus of the present invention includes: a resist solution supply source storing a resist solution therein; a supply tube for supplying the resist solution from the resist solution supply source to a coating nozzle; a filter provided in the supply tube for removing foreign matter in the resist solution; and a heating unit provided along the supply tube at a position closer to the resist solution supply source than the filter, for heating the resist solution in the supply tube to a predetermined temperature higher than room temperature to make a resist gel to aggregate to become coarse so that the coarse resist gel can be collected and removed by the filter.

Abstract: The temperature of a developing solution is varied depending on the type of resist or the resist pattern. The developing solution is applied while scanning a developer nozzle having a slit-shaped ejection port that has a length matching the width of the effective area of the substrate. After leaving the substrate with the developing solution being coated thereon for a predetermined period of time, a diluent is supplied while scanning a diluent nozzle, thereby substantially stopping the development reaction and causing the dissolved resist components to diffuse. A desired amount of resist can be quickly dissolved through the control of the developing solution temperature, while the development can be stopped before the dissolved resist components exhibit adverse effect through the supply of the diluent a predetermined timing, whereby achieving a pattern having a uniform line width and improved throughput.

Abstract: A system that incorporates teachings of the present disclosure may include, for example, an apparatus having a tube with an ingress opening to receive a liquid, and an egress opening to release the liquid, a conductor positioned in a conduit of the tube, the conductor and the conduit having dimensions to cause a surface tension of the liquid to prevent a constant flow of the liquid from the egress opening, and a power supply coupled to the conductor to apply a charge to the liquid to overcome the surface tension and form at the egress opening a single jet stream of the liquid applicable on a substrate to create a pattern. The single jet stream can be controllable in part by a viscosity of the liquid. Additional embodiments are disclosed.

Abstract: An apparatus for processing coating material includes a crucible having a receptacle for receiving coating material, a drive member having a drive shaft, a cover coupled to the drive shaft, and a monitor system including a light source and a camera module. The cover includes a flat surface, a slot defined in the flat surface, a first through hole and a second through hole respectively communicating with opposite ends of the slot. The drive shaft drives the cover to rotate between a closed position where the cover covers the receptacle, and the flat surface presses and flattens the coating material, and an open position where the cover is moved away from the receptacle. The light source is for emitting light through the first through hole to illuminate the coating material. The camera module is for capturing images of the illuminated coating material through the second through hole.

Abstract: Condensation adhesives are applied via a contactless system and method to a wood substrate, such as laminate beams. The adhesive is modified and applied in particular to a finger surface of a substrate via a contactless application device. The contactless application device has at least 2 nozzles for ejecting adhesive onto the substrate without contacting the substrate. The modified adhesive includes a condensation resin selected from the group of urea formaldehyde (UF) resin, melamine formaldehyde resin (MF), modified melamine formaldehyde resin (xMF) and phenol resorcinol formaldehyde resin (PRF) or combinations thereof, and optionally a hardener. The adhesive rheology is modified by at least one of: cooling to a temperature between 5 and 15° C., including into the adhesive a viscosity increasing substance, and/or including a thixotropic increasing substance in an effective amount to prevent sagging of the adhesive on the surface.

Abstract: A droplet discharge device includes a head for discharging a functional liquid, a driving voltage generation unit for generating a driving voltage to drive the head, first and second temperature acquisition units, a temperature difference computing unit, and a driving voltage correction unit. The first and second temperature acquisition units are configured to acquire temperature of the functional liquid in the head as first and second temperatures, respectively, when the head is in a head waiting state and in a head driven state, respectively. The temperature difference computing unit is configured to compute a temperature difference between the first and second temperatures. The driving voltage correction unit is configured to correct the driving voltage based on the temperature difference. The driving voltage generation unit is configured to generate the corrected driving voltage to the head when the head is in the head driven state.

Abstract: Various embodiments of methods and devices for coating stents are described herein.

Abstract: There is described an apparatus (1) for coating a cylinder (C), in particular a wiping cylinder of an intaglio printing press, with a plastic composition comprising inter alia heating means (6) for applying radiant heat to the cylinder throughout its length as the cylinder is rotated, the heating means including a plurality of discrete heating elements (60) distributed along the length of the cylinder and around at least part of the peripheral surface of the cylinder, the heating elements being arranged at least in separate columns (60a to 6Oh) disposed parallel to one another along the length of the cylinder. The apparatus further comprises a temperature sensing system (9) for measuring the surface temperature of the cylinder along the length of the cylinder and a processing unit coupled to the temperature sensing system (9) for controlling operation of the heating elements (60) as a function of the measured surface temperature and a desired temperature setting (tc).

Abstract: The present invention provides a method that can maintain the temperature of a wafer at a process temperature before a coating process is performed by supplying a photoresist. According to the present invention, a thinner which helps a diffusion of the photoresist is supplied onto the wafer before the photoresist is supplied. The thinner is supplied in a temperature-controlled state such that the wafer has the process temperature by the thinner.

Abstract: A method and a configuration provide dynamic control of a liquid supply for a moisturizing storage device for sealing glued edges of a envelope flap of letter envelopes. Once a measured value has been measured for a sealing liquid which is stored in the tank of a moisturizing apparatus, the type of sealing liquid that is used is qualitatively analyzed on the basis of the measured value and of at least one material parameter as a comparison value. The amount of liquid stored in the moisturizing storage device is then measured by at least one further measurement to allow dynamic control of the liquid supply to the moisturizing storage device as a function of the material parameter and of at least one measured value, which is related to the liquid consumption, in the result of the at least one measurement of the amount of liquid stored in the moisturizing storage device.

Abstract: An exemplary adhesive dispenser includes a container configured for supplying an adhesive, a plurality of nozzles configured for dispensing the adhesive, and a temperature controller connected between the container and the nozzles. The temperature controller has a chamber defined therein, and the chamber is configured for accommodating the adhesive. The container and each nozzle communicate with the chamber respectively. The temperature controller is configured for maintaining the adhesive therein in a predetermined temperature.

Abstract: Apparatus and method for control of epitaxial growth temperatures during manufacture of light emitting diodes (LEDs). Embodiments include measurement of a substrate and/or carrier temperature during a recipe stabilization period; determination of a temperature drift based on the measurement; and modification of a growth temperature based on a temperature offset determined in response to the temperature drift exceeding a threshold criteria. In an embodiment, a statistic derived from a plurality of pyrometric measurements made during the recipe stabilization over several runs is employed to offset each of a set of growth temperatures utilized to form a multiple quantum well (MQW) structure.

Abstract: Provided is a vacuum vapor deposition system, which enables a vapor deposition rate to be measured accurately and a film thickness to be controlled with higher accuracy. The vacuum vapor deposition system includes: a vacuum chamber; a substrate holding mechanism; a vapor depositing source; a film thickness sensor for monitoring; a control system including a temperature controller and a film thickness controller; and a film thickness sensor for calibration, in which a distance from one film thickness sensor whose measurement accuracy is to be enhanced, out of the film thickness sensor for monitoring and the film thickness sensor for calibration, to a center of the opening of the vapor depositing source, is smaller than a distance from another film thickness sensor to the center of the opening of the vapor depositing source.

Abstract: The coating instrument is provided with a coating head which has a plurality of head members, and in which a groove-like slot is formed, an adjustment unit accommodated in a recessed groove installed on a leading end face continuing to an outer face opposite to an inner face or to the inner face in the head member to adjust the width of the slot by pressing a side wall face of the recessed groove, and a controller for controlling a pressing force to the side wall face of the recessed groove by the adjustment unit. The adjustment unit is provided with a fluid pressure chamber into which a fluid is sealed, a pressing portion for pressing the side wall face of the recessed groove by the fluid pressure of the fluid pressure chamber, and an operating portion for allowing the fluid pressure of the fluid pressure chamber to change.

Abstract: A bubbler chamber assembly comprising one chamber or two or more chambers connected in series, all chambers being in substantially vertical orientation. A solid or liquid source of the compound is contained in the chamber or chambers. The ratio between the length of the chamber or combined length of chambers connected in series with respect to the direction of flow of the carrier gas through the chamber or chambers and the average diameter equivalent of the cross section of the chamber or chambers with respect to the direction of flow of the carrier gas through the chamber or chambers is not less than about 6:1.

Abstract: In the present invention, a substrate is first rotated at a first rotation speed, and a resist solution is applied to the rotated substrate. Subsequently, the rotation of the substrate is decelerated to a second rotation speed lower than the first rotation speed so that the substrate is rotated at the low speed to smooth the resist solution on the substrate. The rotation of the substrate is then accelerated to a third rotation speed higher than the second rotation speed, and a solvent for the coating solution and/or a dry gas are/is supplied to the resist solution on the substrate. In this event, the solvent gas is supplied to a portion of the resist solution on the substrate thicker than a set thickness, and the dry gas is supplied to a portion of the coating solution on the substrate thinner than the set thickness. This thins the thicker portion of the resist solution and thickens the thinner portion to uniform the resist solution.

Abstract: A method for operating a gluing system (10) for gluing blanks for producing and/or packaging cigarettes or other smokable objects, in which the blanks are conveyed along glue valves (11) of the gluing system (10), in which case, in order to control and/or regulate the glue valves (11), a superordinate master controller (13) respectively transmits values of at least one control and/or regulation parameter to individual controllers (15) which are assigned to the glue valves (11), are subordinate to the master controller (13) and are each connected to the superordinate master controller (13) via a suitable data connection, the subordinate controller (15) using said values to control and/or regulate the glue valve (11) assigned to it.

Abstract: There is provided a liquid application apparatus capable of performing stable application without providing a new mechanism, by efficiently removing an application liquid increased in viscosity and fixedly adhered to an abutting portion between an application member and a liquid supplying member. A liquid application apparatus includes an application member that applies a liquid supplied to an applied face to a printing medium by rotating an application roller and a liquid holding member that abuts against the applied face to form a liquid holding space for holding the liquid, and the amount of liquid that is held in the liquid holding space and makes contact with the application member in unit time is larger before an applying operation for applying the liquid to the printing medium than in the applying operation.

Abstract: A film forming apparatus which forms a film on a substrate by utilizing a chemical solution, including: a correlation data creating unit which creates a correlation data that is related to the quality of a chemical solution, from data that is related to the properties of the chemical solution including at least one of data on storage temperature for the chemical solution to be loaded and data on pressure applied to the chemical solution to be loaded; and a determining unit which determines whether or not the chemical solution holds expected quality thereof on the bases of the correlation data.

Abstract: A chemical vapor deposition reactor and method. Reactive gases, such as gases including a Group III metal source and a Group V metal source, are introduced into the chamber (10) of a rotating-disc reactor and directed downwardly onto a wafer carrier (32) and substrates (40) which are maintained at an elevated substrate temperature, typically above about 400° C. and normally about 700-1100° C. to deposit a compound such as a III-V semiconductor. The gases are introduced into the reactor at an inlet temperature desirably above about 75° C. and most preferably about 100°-350° C. The walls of the reactor may be at a temperature close to the inlet temperature. Use of an elevated inlet temperature allows the use of a lower rate of rotation of the wafer carrier, a higher operating pressure, lower flow rate, or some combination of these.

Abstract: An apparatus and a method for forming a sheath over an elongate member comprises an extruder that has an output to supply a melt material having a temperature. A heat exchanger connected downstream the output of the extruder removes heat from the melt material in a controlled manner. An elongate member, which may be a cable core, is supplied to a crosshead that is connected downstream the heat exchanger to surround the elongate member with a sheath of the melt material.

Abstract: A pressure relief system and a non-intrusive, low chatter pressure relief valve for use with such as system are disclosed. The pressure relief valve allows excess pressure in a pressurized fluid line to flow through a flow return line to a fluid reservoir when the fluid pressure exceeds the valve's pressure limit setting. The establishment of a uniform channel between the valve stem and the inner surface of a housing in which the valve stem is slidably located, as well as the use of a vent and sight tube to remove air from the top portion of the housing upon a spring being compressed during the opening of the valve, reduces the occurrence of pulsation and vibration when the valve is cycled between its open and closed positions. When the valve is in its closed position, the bottom end of the valve stem is in close proximity to the inner surface of the main fluid passageway in the pressurized fluid line, but does not intrusively interfere with the flow of fluid through the main fluid passageway.