Temperature Responsive Patents (Class 118/666)
  • Patent number: 10704142
    Abstract: Embodiments of the present disclosure are directed to a quick disconnect resistance temperature detector (RTD) heater assembly, that includes a first assembly comprising a pedestal, a pedestal shaft, an adapter, one or more heater power supply terminals, and at least one RTD, and a second assembly comprising a rotating module having a central opening, and a cable assembly partially disposed in the central opening and securely fastened to the rotating module, wherein the first assembly is removably coupled to the second assembly, wherein the cable assembly includes one or more power supply sockets that receive the heater power supply terminals when the first and second assemblies are coupled together, and wherein the cable assembly includes one or more spring loaded RTD pins that contact the at least one RTD disposed in the first assembly when the first and second assemblies are coupled together.
    Type: Grant
    Filed: July 27, 2017
    Date of Patent: July 7, 2020
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Muhannad Mustafa, Muhammad M. Rasheed, Mario Dan Sanchez, Yu Chang, William Kuang, Vinod Konda Purathe, Manjunatha Koppa
  • Patent number: 10685832
    Abstract: There is provided a technique that includes a metal container including a process chamber configured to process a substrate, a substrate mounting plate rotatably installed in the container and having a plurality of substrate mounting surfaces circumferentially arranged at an upper surface thereof, a heater configured to heat the substrate mounted on each of the plurality of substrate mounting surfaces, a heat attenuator installed between the heater and the container, a gas supply part configured to supply a gas to the process chamber, and a support part configured to rotate the substrate mounting plate.
    Type: Grant
    Filed: August 30, 2019
    Date of Patent: June 16, 2020
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventors: Tetsuaki Inada, Naofumi Ohashi, Shun Matsui
  • Patent number: 10645757
    Abstract: An atmosphere of ammonia that absorbs infrared light in a wavelength band overlapping with the measurement wavelength band of a radiation thermometer is formed in a chamber in which a semiconductor wafer is thermally treated. A filter that selectively transmits infrared light having a wavelength not overlapping with the absorption wavelength band of ammonia is installed between an optical lens system and a detector of the radiation thermometer to avoid influence of the infrared light absorption by ammonia. A conversion table corresponding to the installed filter is selected from a plurality of conversion tables representing a correlation between energy of infrared light incident on the radiation thermometer and temperature of a black body, and is used at the radiation thermometer. Accordingly, the temperature of the semiconductor wafer can be accurately measured in the atmosphere of ammonia.
    Type: Grant
    Filed: September 13, 2017
    Date of Patent: May 5, 2020
    Assignee: SCREEN HOLDINGS CO., LTD.
    Inventor: Yoshio Ito
  • Patent number: 10361099
    Abstract: An electronic device manufacturing system includes a motion control system for calibrating a gap between surfaces of process chamber or loadlock components by moving those component surfaces into direct contact with each other. The component surfaces may include a surface of a substrate and/or a substrate support and a surface of process delivery apparatus, which may be, e.g., a pattern mask and/or a plasma or gas distribution assembly. The motion control system may include a motion controller, a software program executable by the motion controller, a network, one or more actuator drivers, a software program executable by the one or more actuator drivers, one or more actuators, and one or more feedback devices. Methods of calibrating a gap via direct contact of process chamber or loadlock component surfaces are also provided, as are other aspects.
    Type: Grant
    Filed: June 23, 2017
    Date of Patent: July 23, 2019
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Mohsin Waqar, Marvin L. Freeman
  • Patent number: 10263186
    Abstract: A method of making a bulk heterojunction organic photovoltaic cell by glancing angle deposition. As the disclosed method relies on a trajectory of incident vapor flux that is not parallel to the substrate normal, micro and nano-scale columnar structures of thin films can be grown on the substrate. There is also disclosed a method of forming a donor-acceptor heterojunction by depositing at least one additional organic material over the columnar structures.
    Type: Grant
    Filed: July 27, 2010
    Date of Patent: April 16, 2019
    Assignee: The Regents of the University of Michigan
    Inventors: Stephen R. Forrest, Ning Li
  • Patent number: 10204807
    Abstract: An apparatus for processing a wafer includes a process chamber, a wafer support, a heat source, and a movable device. The wafer support is in the process chamber. The heat source is in the process chamber. The movable device contacts the heat source, in which the movable device is movable with respect to the wafer support.
    Type: Grant
    Filed: June 7, 2017
    Date of Patent: February 12, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: You-Hua Chou, Min-Hao Hong, Kuan-Chung Chen
  • Patent number: 10166715
    Abstract: A method of applying protective sheeting of polymer material to a pipeline extending along a longitudinal axis and having a cutback bounded at opposite axial ends by two end portions of respective protective coatings of polymer material, the method including directly heating the free faces of the end portions; extruding and simultaneously winding about the pipeline a protective sheeting wide enough to cover the cutback and the end portions; and compressing the protective sheeting against the pipeline, the end portions included.
    Type: Grant
    Filed: October 24, 2014
    Date of Patent: January 1, 2019
    Assignee: SAIPEM S.p.A.
    Inventor: Momtchil Kaltchev
  • Patent number: 10082847
    Abstract: A temperature of a component within the portable computing device (PCD) may be monitored along with a parameter associated with the temperature. The parameter associated with temperature may be an operating frequency, transmission power, or a data flow rate. It is determined if the temperature has exceeded a threshold value. If the temperature has exceeded the threshold value, then the temperature is compared with a temperature set point and a first error value is then calculated based on the comparison. Next, a first optimum value of the parameter is determined based on the first error value. If the temperature is below or equal to the threshold value, then a present value of the parameter is compared with a desired threshold for the parameter and a second error value is calculated based on the comparison. A second optimum value of the parameter may be determined based on the second error value.
    Type: Grant
    Filed: May 29, 2014
    Date of Patent: September 25, 2018
    Assignee: QUALCOMM Incorporated
    Inventors: Vijay Raman, Amy Derbyshire, Christopher Medrano, Shiju Abraham Mathew, Ronald Frank Alton, Jon James Anderson
  • Patent number: 10014171
    Abstract: Described herein is a technique capable of improving the productivity of manufacturing of a semiconductor device in a method of processing a film by repeating different processes. A method of manufacturing a semiconductor device may include: (a) loading a substrate into a process vessel; (b) forming a first layer by supplying a first gas into the process vessel by a gas supply unit while maintaining the substrate at a first temperature by a temperature control unit; and (c) forming a second layer different from the first layer by supplying a second gas different from the first gas into the process vessel by the gas supply unit while maintaining the substrate at a second temperature different from the second temperature by the temperature control unit.
    Type: Grant
    Filed: June 22, 2017
    Date of Patent: July 3, 2018
    Assignee: Hiatchi Kokusai Electric, Inc.
    Inventors: Yukinori Aburatani, Shin Hiyama, Tsuyoshi Takeda, Naofumi Ohashi
  • Patent number: 9990853
    Abstract: A material detection system mountable to a ground vehicle. The material detection system includes a first range determination system (RDS) that includes a first electromagnetic radiation (EMR) emitter configured to emit first EMR behind the ground vehicle within a first field of view (FOV), a first EMR receiver that is configured to receive first EMR reflections, and a first RDS processing device configured to generate first RDS data that identifies distances to reflective surfaces based on the first EMR reflections. A processing device is coupled to the first range determination system and is configured to determine, based at least in part on the first RDS data, that material exists on the road. The processing device is also configured to determine a location of the material, and cause the location to be communicated to a computing device that maintains a map that identifies locations of material larger than a predetermined threshold.
    Type: Grant
    Filed: March 2, 2016
    Date of Patent: June 5, 2018
    Assignee: Lockheed Martin Corporation
    Inventors: David E. Simon, John A. Haddon, Dale D. Rowley
  • Patent number: 9978626
    Abstract: Carrier wafers are used to hold thin and ultra-thin substrates such as semiconductor components, for example. The carrier wafer of the invention has a plurality of electrodes insulated on all sides (floating electrodes). This plurality of floating electrodes, but at least 50 floating electrodes, are located next to one another with reference to the plane of the first surface of the carrier wafer. Each of these floating electrodes can be charged, for example by means of Fowler-Nordheim tunnels or by the injection of hot charge carriers, in particular of hot electrons or hot holes. Also provided are a method for holding a flexible substrate by means of a carrier wafer of this type and a method for the manufacture of a carrier wafer of this type.
    Type: Grant
    Filed: July 31, 2015
    Date of Patent: May 22, 2018
    Assignee: Fraunhofer-Gesellschaft zur Foederung der angewandten Forschung e.V.
    Inventors: Christoph Kutter, Christof Landesberger, Dieter Bollmann
  • Patent number: 9957617
    Abstract: A deposition system which is configured to enable improved temperature uniformity of a heated substrate may include a susceptor provided in a chamber to hold a substrate, a reflection housing provided outside the chamber, a heating module including light sources provided in the reflection housing, and a reflection control module provided in the reflection housing between the heat sources and the chamber. The reflection control module may be configured to reflect light, which propagates along a first trajectory from the light sources toward a center region of the substrate, to propagate along a second trajectory toward an edge region of the substrate, thereby providing improved substrate irradiance uniformity and thus improved substrate temperature uniformity. Improved substrate temperature uniformity may result in improved thickness uniformity of layers provided on the substrate in a deposition process.
    Type: Grant
    Filed: February 22, 2016
    Date of Patent: May 1, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Bongjin Kuh, Beom Seok Kim, Woocheol Jeong, Sunghwi Cho, Woosung Ha
  • Patent number: 9922856
    Abstract: The present invention relates to a support comprising: an electrically conductive biased table (10) connected to a high voltage power supply (12) and supported on an electrically insulating stand (40); an electrically insulating substrate carrier (20) in the form of a cylinder, its top face presenting a bearing plane designed to receive a substrate (50); legs (15) standing on the biased table (10) in order to support the bottom face of the substrate carrier (20); and at least one electrically conductive connection (201, 202, 203, 31, 30) for connecting the bearing plane to the biased table (10). The support is remarkable in that the substrate carrier (20) incorporates a heating resistance (26).
    Type: Grant
    Filed: February 4, 2015
    Date of Patent: March 20, 2018
    Assignee: ION BEAM SERVICES
    Inventors: Frank Torregrosa, Laurent Roux
  • Patent number: 9861028
    Abstract: A seed treater provides enhanced seed coating capabilities and performance. The seed and/or treatment fluid may be heated for improving vaporization and absorption by the seed. Air may be injected in the seed treater to provide heat, dehumidified air, and to provide vaporization enhancement, and component cleaning functions. The functions may be controlled by a control processor based on recipes and may be changed dependent upon sensed or input environmental conditions such as temperature and humidity.
    Type: Grant
    Filed: July 14, 2016
    Date of Patent: January 9, 2018
    Assignee: Bayer CropScience, LP
    Inventors: Greg A. Reineccius, Ron Reichert
  • Patent number: 9601751
    Abstract: A method of annealing a thin film deposited on a substrate. According to the method, the thin film deposited on the substrate is provided. The provided thin film is irradiated with electromagnetic radiation until a predetermined crystal quality of the thin film is achieved. The spectral band of the electromagnetic radiation is selected such that the thin film is substantially absorptive to the electromagnetic radiation and the substrate is substantially transparent to the electromagnetic radiation.
    Type: Grant
    Filed: September 27, 2013
    Date of Patent: March 21, 2017
    Assignee: Apple Inc.
    Inventors: Lili Huang, Richard M. Mank
  • Patent number: 9355776
    Abstract: Embodiments of a capacitor assembly for coupling radio frequency (RF) and direct current (DC) power to an electrode and substrate support incorporating same are provided herein. In some embodiments, the capacitor assembly includes a first conductive plate to receive RF power from an RF power source, the first conductive plate including a central bore; at least one capacitor coupled to the first conductive plate and surrounding the central bore; and a second conductive plate electrically coupled to the first conductive plate via the at least one capacitor, the second conductive plate including an input tap to receive DC power from a DC power source and at least one output tap to couple the RF and DC power to an electrode.
    Type: Grant
    Filed: April 9, 2014
    Date of Patent: May 31, 2016
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Carl Johnson, Les Wojnowski, Lawrence A. Ringor, Jeffrey Ludwig
  • Patent number: 9314811
    Abstract: Disclosed is a coating apparatus including flow coating and roll-coating that may be used for uniform sol-gel coating of substrates such as glass, solar panels, windows or part of an electronic display. Also disclosed are methods for substrate preparation, flow coating and roll coating. Lastly, systems and methods for curing sol-gel coatings deposited onto the surface of glass substrates using high temperature air-knives, infrared emitters and direct heat applicators are disclosed.
    Type: Grant
    Filed: May 11, 2015
    Date of Patent: April 19, 2016
    Assignee: Enki Technology, Inc.
    Inventors: Brenor L. Brophy, Peter R. Gonsalves, Sina Maghsoodi, Thomas E. Colson, Yu S. Yang, Ze'ev R. Abrams
  • Patent number: 9267208
    Abstract: A time-dependent substrate temperature to be applied during a plasma process is determined. The time-dependent substrate temperature at any given time is determined based on control of a sticking coefficient of a plasma constituent at the given time. A time-dependent temperature differential between an upper plasma boundary and a substrate to be applied during the plasma process is also determined. The time-dependent temperature differential at any given time is determined based on control of a flux of the plasma constituent directed toward the substrate at the given time. The time-dependent substrate temperature and time-dependent temperature differential are stored in a digital format suitable for use by a temperature control device defined and connected to direct temperature control of the upper plasma boundary and the substrate. A system is also provided for implementing upper plasma boundary and substrate temperature control during the plasma process.
    Type: Grant
    Filed: October 4, 2013
    Date of Patent: February 23, 2016
    Assignee: Lam Research Corporation
    Inventor: Rajinder Dhindsa
  • Publication number: 20150112631
    Abstract: The present disclosure provides apparatus and methods for monitoring and controlling filaments used in hotwire semiconductor processing and for monitoring integrity of filaments in a hotwire processing chamber. Embodiments of this disclosure may use real time voltage and current feedback signals provided by the power supply, known attributes, for example resistivity, of filament, filament geometries, for example diameter and length, and filament assembly configurations as input, to derive filament temperature in real time. Embodiments of the present disclosure are capable of continuously derive accurate temperatures of the filament assembly in a hotwire processing chamber after the filament assembly has changed geometries due to normal usage by using the measured cold resistance of the wire periodically before the process starts.
    Type: Application
    Filed: September 30, 2014
    Publication date: April 23, 2015
    Inventor: Paul STEFFAS
  • Patent number: 8991332
    Abstract: Systems and apparatus are disclosed for adjusting the temperature of at least a portion of the surface of a reaction chamber during a film formation process to control film properties. More than one portion of the chamber surface may be temperature-modulated.
    Type: Grant
    Filed: February 27, 2009
    Date of Patent: March 31, 2015
    Assignee: Applied Materials, Inc.
    Inventors: Satheesh Kuppurao, David K. Carlson, Manish Hemkar, Andrew Lam, Errol Sanchez, Howard Beckford
  • Patent number: 8986494
    Abstract: A plasma processing apparatus includes a temperature measuring unit; airtightly sealed temperature measuring windows provided in a mounting table, for optically communicating to transmit a measurement beam through a top surface and a bottom surface of the mounting table; and one or more connection members for connecting the mounting table and a base plate, which is provided in a space between the mounting table and the base plate. In the plasma processing apparatus, a space above the mounting table is set to be maintained under a vacuum atmosphere, and a space between the mounting table and the base plate is set to be maintained under a normal pressure atmosphere, and each collimator is fixed to the base plate at a position corresponding to each temperature measuring window, thereby measuring a temperature of the substrate via the temperature measuring windows by the temperature measuring unit.
    Type: Grant
    Filed: February 2, 2010
    Date of Patent: March 24, 2015
    Assignee: Tokyo Electron Limited
    Inventors: Tatsuo Matsudo, Chishlo Koshimizu, Jun Abe
  • Patent number: 8989899
    Abstract: A transfer system according to an embodiment includes a robot and a determination unit. The robot includes robot hands that hold a workpiece in a thin plate shape and that are located at different heights. The determination unit determines the robot hands that hold the workpiece based on a combination of temperature of the workpiece to be held by each of the robot hands.
    Type: Grant
    Filed: September 10, 2012
    Date of Patent: March 24, 2015
    Assignee: Kabushiki Kaisha Yaskawa Denki
    Inventors: Ryuji Ando, Kazunori Hino, Shinichi Katsuda
  • Patent number: 8980044
    Abstract: A plasma reactor having a reactor chamber and an electrostatic chuck having a surface for holding a workpiece inside the chamber includes inner and outer zone backside gas pressure sources coupled to the electrostatic chuck for applying a thermally conductive gas under respective pressures to respective inner and outer zones of a workpiece-surface interface formed whenever a workpiece is held on the surface, and inner and outer evaporators inside respective inner and outer zones of the electrostatic chuck and a refrigeration loop having respective inner and cuter expansion valves for controlling flow of coolant through the inner and outer evaporators respectively. The reactor further includes inner and outer zone temperature sensors in inner and outer zones of the electrostatic chuck and a thermal model capable of simulating heat transfer through the inner and outer zones, respectively, between the evaporator and the surface based upon measurements from the inner and outer temperature sensors, respectively.
    Type: Grant
    Filed: August 12, 2010
    Date of Patent: March 17, 2015
    Assignee: BE Aerospace, Inc.
    Inventors: Paul Lukas Brillhart, Richard Fovell, Hamid Tavassoli, Douglas A. Buchberger, Jr., Douglas H. Burns, Kallol Bera, Daniel J. Hoffman, Kenneth W. Cowans, William W. Cowans, Glenn W. Zubillaga, Isaac Millan
  • Patent number: 8968512
    Abstract: Provided is a temperature adjusting mechanism, which can keep deviation of a temperature of a portion in contact with the temperature adjusting mechanism to be small by controlling the temperature accurately at a high speed. A semiconductor manufacturing apparatus using such temperature adjusting mechanism is also provided. A cooling jacket (6) is provided with a cooling channel (61), and a heat lane (62). The heat lane (62) is provided with a heat receiving section (63), and a heat dissipating section (64), and seals a two-phase condensable working fluid (hereinafter referred to as the working liquid) in an annular narrow tube alternately folds back and forth therebetween. The heat dissipating section (64) is a portion to be cooled by the cooling channel (61), and the heat receiving section (63) is a portion having a temperature higher than that of the heat dissipating section (64).
    Type: Grant
    Filed: June 30, 2009
    Date of Patent: March 3, 2015
    Assignee: Tokyo Electron Limited
    Inventor: Shinya Nishimoto
  • Patent number: 8960123
    Abstract: Disclosed are coating apparatus including flow coating and roll-coating that may be used for uniform sol-gel coating of substrates such as glass, solar panels, windows or part of an electronic display. Also disclosed are methods for substrate preparation, flow coating and roll coating. Lastly systems and methods for skin curing sol-gel coatings deposited onto the surface of glass substrates using a high temperature air-knife are disclosed.
    Type: Grant
    Filed: December 23, 2013
    Date of Patent: February 24, 2015
    Assignee: Enki Technology, Inc.
    Inventors: Brenor L. Brophy, Sina Maghsoodi, Patrick J. Neyman, Peter R. Gonsalves, Jeffrey G. Hirsch, Yu S. Yang
  • Patent number: 8961691
    Abstract: A disclosed film deposition apparatus includes a susceptor having in one surface a substrate receiving portion provided rotatably in a chamber; a heating unit including plural independently controllable heating portions, thereby heating the susceptor; a first reaction gas supplying portion for supplying a first reaction gas; a second reaction gas supplying portion for supplying a second reaction gas; a separation area between a first process area where the first reaction gas is supplied and a second process area where the second reaction gas is supplied, the separation area including a separation gas supplying portion for supplying a first separation gas in the separation area, and a ceiling surface opposing the one surface to produce a thin space; a center area having an ejection hole for ejecting a second separation gas along the one surface; and an evacuation opening for evacuating the chamber.
    Type: Grant
    Filed: August 31, 2009
    Date of Patent: February 24, 2015
    Assignee: Tokyo Electron Limited
    Inventors: Hitoshi Kato, Kazuteru Obara, Manabu Honma
  • Publication number: 20150044387
    Abstract: The present invention relates to a powder-coating apparatus for coating objects, comprising an application device which is designed to apply powder coating to regions of the object that are to be coated; and comprising an irradiation device which has at least one electromagnetic radiation source, which is designed to direct electromagnetic radiation onto areas of the object that are to be coated with powder coating and which is designed to thus cross-link the powder coating onto the coated regions. The present invention further relates to a powder-coating method for coating objects by means of a powder-coating apparatus according to the invention.
    Type: Application
    Filed: January 30, 2013
    Publication date: February 12, 2015
    Applicant: Robert Bosch GmbH
    Inventors: Alexander Klonczynski, Jens Koenig, Thomas Kretschmar, Sonja Dudziak
  • Patent number: 8950470
    Abstract: Preferably, obtaining internal and external thermal measurement values of a sealed process chamber allows a control system to generate a control signal based on a comparison of the internal and external thermal measurement values to the predetermined value. The control signal is provided to a fluid handling system, wherein the fluid handling system modulates flow of a first fluid around the exterior of the sealed process chamber. The control signal is further provided to a closed loop heat exchange system, wherein the closed loop heat exchange system modulates flow of a second fluid within an interior cavity of the sealed process chamber based on the control signal. The control signal is still further provided to an open loop heat exchange system, wherein the open loop heat exchange system modulates flow of a third fluid within the interior of cavity of the sealed process chamber.
    Type: Grant
    Filed: December 30, 2010
    Date of Patent: February 10, 2015
    Assignee: Poole Ventura, Inc.
    Inventors: Mark R. Erickson, Aaron L. Dingus, Arthur W. Custer, III, Henry J. Poole, Nader Jamshidi
  • Publication number: 20150024330
    Abstract: Provided are an apparatus and a method for controlling the heating of the base within a chemical vapour deposition chamber, which apparatus is applicable to an MOCVD reaction chamber.
    Type: Application
    Filed: March 21, 2013
    Publication date: January 22, 2015
    Applicant: Advanced Mirco-Fabrication Equipment Inc, Shanghai
    Inventors: Baoxia Tian, Steven Tianxiao Lee, Yingbin Liu, Quanyong Guo
  • Publication number: 20140356985
    Abstract: A temperature controlled substrate support assembly used for processing a substrate in a vacuum chamber of a semiconductor processing apparatus. The substrate support assembly comprises a top plate for supporting the substrate. A base plate is disposed below the top plate wherein the base plate comprises a cavity in an upper surface of the base plate. A cover plate is disposed between the top plate and the base plate. At least one thermoelectric module is in the cavity in the upper surface of the base plate wherein the at least one thermoelectric module is in thermal contact with the top plate and the base plate, and the at least one thermoelectric module is maintained at atmospheric pressure.
    Type: Application
    Filed: June 3, 2013
    Publication date: December 4, 2014
    Applicant: Lam Research Corporation
    Inventors: Anthony Ricci, Henry Povolny
  • Publication number: 20140308433
    Abstract: Described herein are methods and systems for the manufacture of composite articles, wherein a composite article is manufactured using a filamentary material and a liner, comprising: providing a material in heat transfer relation with the inner surface of said liner; applying uncured filamentary material to the outer surface of said liner; and heating a portion of said material in heat transfer relation with the inner surface of said liner, wherein heating said portion of said material effects cure of said composite article. Also in the methods and systems herein, a composite article is manufactured using a filamentary material wound on a liner, comprising, a material in heat transfer relation with the inner surface of said liner; heating means operable to heat a portion of said material in heat transfer relation with the inner surface of said liner, wherein heating said portion of said material effects cure of said composite vessel.
    Type: Application
    Filed: August 13, 2012
    Publication date: October 16, 2014
    Inventor: Joseph Ouellette
  • Publication number: 20140295095
    Abstract: A method and apparatus for the continuous powder coating of a non-conductive profile produced in a continuous forming process, such as pultrusion or extrusion, such that the profile is powder coated while on the profile forming machine and before the subject segment of the continuous profile is severed from the continuous profile on the forming machine (i.e. in-line).
    Type: Application
    Filed: April 2, 2013
    Publication date: October 2, 2014
    Inventors: Robert Langlois, Jeffrey Sugar, Gary Sugar
  • Patent number: 8846501
    Abstract: The invention relates to a method for equipping a process chamber in an apparatus for depositing at least one layer on a substrate held by a susceptor in the process chamber, process gases being introduced into the process chamber through a gas inlet element, in particular by means of a carrier gas, the process gases decomposing into decomposition products in the chamber, in particular on hot surfaces, the decomposition products comprising the components that form the layer. In order to improve the apparatus so that thick multi-layer structures can be deposited reproducibly in process steps that follow one another directly, it is proposed that a material is selected for the surface facing the process chamber at least of the wall of the process chamber that is opposite the susceptor, the optical reflectivity, optical absorptivity and optical transmissivity of which respectively correspond to those of the layer to be deposited during the layer growth.
    Type: Grant
    Filed: June 8, 2010
    Date of Patent: September 30, 2014
    Assignee: Aixtron SE
    Inventor: Gerhard Karl Strauch
  • Patent number: 8833296
    Abstract: A dispensing apparatus includes a dispensing unit having a main body, a channel through the main body, and a plurality of nozzles connected to the main body, the plurality of nozzles being configured to dispense fluid flowing in the channel, a gap sensor unit configured to determine size of gaps between adjacent nozzles in the dispensing unit, and a thermal expansion adjusting unit configured to thermally expand or contract the main body of the dispensing unit to adjust the gap size between adjacent nozzles to a predetermined size, based on the gap size determined by the gap sensor unit.
    Type: Grant
    Filed: November 9, 2010
    Date of Patent: September 16, 2014
    Assignee: Samsung Display Co., Ltd.
    Inventors: Jae-Seok Park, Yun-Mi Lee
  • Patent number: 8807077
    Abstract: Exemplary coating devices and methods are disclosed. An exemplary coating device may include an atomizer for applying a spray jet of a coating means or material to a component, at least one directing air nozzle for outputting shaping or directing air in order to shape the spray jet, and a temperature-control device for controlling the temperature of the directing air. The coating device may further include a control unit which activates the temperature-control device as a function of at least one operating variable of the atomizer in order to set a predetermined directing air temperature.
    Type: Grant
    Filed: June 20, 2008
    Date of Patent: August 19, 2014
    Assignee: Durr Systems GmbH
    Inventors: Alexander Meissner, Frank Herre, Marcus Frey, Torsten Block, Michael Baumann
  • Patent number: 8785891
    Abstract: An observation window is provided for use with a spray booth during a spray coating process where the observation window is located in a position to permit an operator to observe the spray coating process. The observation window is controlled to provide light transmission in the window suitable for the specific spray process being performed. The control can be automatic or operator controlled. The window is adapted to have a different light transmission during different spray processes such as plasma spray and HVOF spray.
    Type: Grant
    Filed: April 17, 2012
    Date of Patent: July 22, 2014
    Assignee: United Technologies Corporation
    Inventor: John E. Markowski
  • Publication number: 20140199490
    Abstract: An apparatus for depositing a coating on one or more parts (21) has: a chamber (22); a part holder (64) for carrying the part(s); a bias voltage source (94) coupled to the part(s) to apply a bias voltage to the part(s); a source (34) of the coating material; a plurality of temperature sensors (76); and a plurality of leads (90) passing outputs of the temperature sensors out from the chamber. A temperature monitoring system (150) has a temperature data processor (300). At least one fiber optic link (223) couples the temperature data processor to the temperature sensors so as to electrically isolate the temperature data processor from the bias voltage.
    Type: Application
    Filed: March 17, 2014
    Publication date: July 17, 2014
    Applicant: UNITED TECHNOLOGIES CORPORATION
    Inventors: Richard S. Mullin, Anatoly Kuzmichev, Igor V. Belousov, Yuriy G. Kononenko, Oleg G. Pankov, Dmitriy Ryzhikov
  • Patent number: 8772055
    Abstract: A method and apparatus for processing a semiconductor substrate is described. The apparatus is a process chamber having an optically transparent upper dome and lower dome. Vacuum is maintained in the process chamber during processing. The upper dome is thermally controlled by flowing a thermal control fluid along the upper dome outside the processing region. Thermal lamps are positioned proximate the lower dome, and thermal sensors are disposed among the lamps. The lamps are powered in zones, and a controller adjusts power to the lamp zones based on data received from the thermal sensors.
    Type: Grant
    Filed: March 12, 2013
    Date of Patent: July 8, 2014
    Assignee: Applied Materials, Inc.
    Inventors: Joseph M. Ranish, Paul Brillhart, Jose Antonio Marin, Satheesh Kuppurao, Balasubramanian Ramachandran, Swaminathan T. Srinivasan, Mehmet Tugrul Samir
  • Publication number: 20140154402
    Abstract: Silicon sintering method, without applying an external force, comprising placement of a silicon sample in a furnace, then heat treatment of this sample at, at least one temperature and at least one partial pressure of oxidising species to control the thickness of a silicon oxide layer on its surface.
    Type: Application
    Filed: October 14, 2011
    Publication date: June 5, 2014
    Applicants: Commissariat A L'energie Atomique ET Aux Energies Alternatives, Universite Joseph Fourier
    Inventors: Jean-Marie Lebrun, Jean-Michel Missiaen, Celine Pascal, Jean-Paul Garandet, Florence Servant
  • Patent number: 8726837
    Abstract: A system for monitoring a process inside a high temperature semiconductor process chamber by capturing images is disclosed. Images are captured through a borescope by a camera. The borescope is protected from high temperatures by a reflective sheath and an Infrared (IR) cut-off filter. Images can be viewed on a monitor and can be recorded by a video recording device. Images can also be processed by a machine vision system. The system can monitor the susceptor and a substrate on the susceptor and surrounding structures. Deviations from preferred geometries of the substrate and deviations from preferred positions of susceptor and the substrate can be detected. Actions based on the detections of deviations can be taken to improve the performance of the process. Illumination of a substrate by a laser for detecting deviations in substrate geometry and position is also disclosed.
    Type: Grant
    Filed: June 23, 2008
    Date of Patent: May 20, 2014
    Assignee: Applied Materials, Inc.
    Inventors: Kailash K. Patalay, Craig Metzner, David K. Carlson
  • Patent number: 8703392
    Abstract: The present disclosure involves a method of fabricating a semiconductor device. The method includes providing a substrate having a material layer formed thereon; depositing a photoresist layer on the material layer, the photoresist layer having a vertical dimension; exposing a region of the photoresist layer to radiation, the exposed region having a horizontal dimension, wherein a first ratio of the vertical dimension to the horizontal dimension exceeds a predetermined ratio; and developing the photoresist layer to remove the exposed region at least in part through applying a developer solution containing a first chemical and a second chemical, wherein: the first chemical is configured to dissolve the exposed region of the photoresist layer through a chemical reaction; the second chemical is configured to enhance flow of the first chemical that comes into contact with the photoresist layer; and an optimized second ratio exists between the first chemical and the second chemical.
    Type: Grant
    Filed: September 4, 2012
    Date of Patent: April 22, 2014
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yu-Lun Liu, Chia-Chu Liu, Kuei-Shun Chen, Chung-Ming Wang, Ying-Hao Su
  • Patent number: 8696814
    Abstract: A disclosed film deposition apparatus includes a process chamber inside which a reduced pressure space is maintained; a gas supplying portion that supplies a film deposition gas to the process chamber; a substrate holding portion that is made of a material including carbon as a primary constituent and holds a substrate in the process chamber; a coil that is arranged outside the process chamber and inductively heats the substrate holding portion; and a thermal insulation member that covers the substrate holding portion and is arranged to be separated from the process chamber, wherein the reduced pressure space is separated into a film deposition gas supplying space to which the film deposition gas is supplied and a thermal insulation space defined between the substrate holding portion and the process chamber, and wherein a cooling medium is supplied to the thermal insulation space.
    Type: Grant
    Filed: November 29, 2007
    Date of Patent: April 15, 2014
    Assignees: Tokyo Electron Limited, Rohm Co., Ltd.
    Inventors: Eisuke Morisaki, Hirokatsu Kobayashi, Jun Yoshikawa, Ikuo Sawada, Tsunenobu Kimoto, Noriaki Kawamoto, Masatoshi Aketa
  • Patent number: 8692166
    Abstract: A device for heating a substrate with light from a flash lamp having a semiconductor switch connected in series to the flash lamp. After triggering of a trigger electrode of the flash lamp, a first drive signal and a second drive signal are output from a gate circuit. The time period when the semiconductor switch is on due to the second drive signal is longer than the time period that the semiconductor switch is on by the first drive signal. Then, the semiconductor switch is switched on and off by the first drive signal and the substrate temperature is increased to a temperature, which is lower than the desired temperature to be targeted, and is maintained a that temperature for a short time, after which the surface temperature of the substrate is increased to the desired target temperature.
    Type: Grant
    Filed: February 19, 2013
    Date of Patent: April 8, 2014
    Assignee: Ushio Denki Kabushiki Kaisha
    Inventor: Takehiko Yokomori
  • Patent number: 8683943
    Abstract: A disclosed plasma process apparatus is disclosed that applies a plasma process to an object to be processed, including a cylindrical processing container configured to be evacuatable to vacuum, a holding unit configured to hold plural objects to be processed and inserted into and to be extracted from the cylindrical processing container, a gas supplying unit configured to supply a gas into the processing container, an activating unit configured to be located along a longitudinal direction of the processing container and to activate the gas by plasma generated by a high frequency power, a cylindrical shield cover configured to surround a periphery of the processing container and to be connected to ground for shielding from high frequency, and a cooling device configured to cause the cooling gas to flow through a space between the cylindrical shield cover and the cylindrical processing container during the plasma process.
    Type: Grant
    Filed: April 28, 2010
    Date of Patent: April 1, 2014
    Assignee: Tokyo Electron Limited
    Inventors: Naomi Onodera, Kiyohiko Gokon, Jun Sato
  • Patent number: 8673080
    Abstract: A temperature controlled showerhead for chemical vapor deposition (CVD) chambers enhances heat dissipation to enable accurate temperature control with an electric heater. Heat dissipates by conduction through a showerhead stem and fluid passageway and radiation from a back plate. A temperature control system includes one or more temperature controlled showerheads in a CVD chamber with fluid passageways serially connected to a heat exchanger.
    Type: Grant
    Filed: July 29, 2008
    Date of Patent: March 18, 2014
    Assignee: Novellus Systems, Inc.
    Inventors: Henner Meinhold, Dan M. Doble, Stephen Lau, Vince Wilson, Easwar Srinivasan
  • Patent number: 8596336
    Abstract: Apparatus for controlling the temperature of a substrate support may include a first heat transfer loop and a second heat transfer loop. The first heat transfer loop may have a first bath with a first heat transfer fluid at a first temperature. The second heat transfer loop may have a second bath with a second heat transfer fluid at a second temperature. The first and second temperatures may be the same or different. First and second flow controllers may be provided for respectively providing the first and second heat transfer fluids to a substrate support. One or more return lines may couple one or more outlets of the substrate support to the first and second baths for returning the first and second heat transfer fluids to the first and second baths.
    Type: Grant
    Filed: June 3, 2008
    Date of Patent: December 3, 2013
    Assignee: Applied Materials, Inc.
    Inventors: Richard Fovell, Paul Brillhart, Sang In Yi, Anisul H. Khan, Jivko Dinev, Shane Nevil
  • Patent number: 8578877
    Abstract: The present invention provides a spin coater including a rotation table that rotatably holds the disc substrate, a spin-cup that surrounds the outer circumference of a disc substrate held on the rotation table, a dripping unit configured to drip an ultraviolet-curable resin composition onto the surface of the disc substrate, a rotating unit configured to rotate the disc substrate via the rotation table to spread the ultraviolet-curable resin composition over the surface of the disc substrate, a heating unit configured to heat the ultraviolet-curable resin composition on the disc substrate, and a temperature controlling unit configured to control a reaching temperature of the spin cup which is increased by the heating unit each time the ultraviolet-curable resin composition is spread, so as to be constant over multiple spin coating processes.
    Type: Grant
    Filed: April 1, 2008
    Date of Patent: November 12, 2013
    Assignee: Ricoh Company, Ltd.
    Inventor: Yukitoshi Tajima
  • Patent number: 8544410
    Abstract: The invention is an immobilization apparatus comprising: a container (1) having a nozzle (4) formed for exhausting a solution; a charging means (PS, 5, 4) for charging the sample solution within the container; and an airflow generating means for generating airflow (Af) crashing into the sample solution. The immobilization apparatus is configured to operate the charging means and the airflow generating means simultaneously, atomize the solution into microparticulate substances charged while maintaining its activity and functionality by the electrostatic force due to the charge of the sample solution charged by the charging means and the crash energy due to the crash of the airflow generated by the airflow generating means into the sample solution, and exhaust it from the exhaust outlet (4), and the charged microparticulate substances are deposited on a substrate (7) by the electrostatic force.
    Type: Grant
    Filed: November 6, 2008
    Date of Patent: October 1, 2013
    Assignees: Fuence Co., Ltd., Hit Co., Ltd.
    Inventors: Akihiko Tanioka, Kozo Inoue, Kazuya Nitta, Masaru Tamaru
  • Patent number: 8518480
    Abstract: The present invention is a method of developing a resist film on a substrate using a developing solution at a predetermined temperature lower than room temperature, including a first cooling step of mounting and cooling the substrate on a cooling plate at a temperature lower than room temperature and higher than the predetermined temperature in a cooling apparatus; a second cooling step of then carrying the substrate into a developing apparatus and supplying a rinse solution at the predetermined temperature or lower onto the substrate to cool the substrate in the developing apparatus; a developing step of then supplying the developing solution onto the substrate and developing the resist film on the substrate to form a resist pattern in the resist film; and a cleaning step of then supplying a rinse solution at the predetermined temperature onto the substrate to clean a front surface of the substrate.
    Type: Grant
    Filed: January 11, 2011
    Date of Patent: August 27, 2013
    Assignee: Tokyo Electron Limited
    Inventors: Norifumi Sato, Yukio Kiba, Tetsushi Miyamoto, Kazuhisa Hasebe
  • Patent number: 8507296
    Abstract: A substrate processing method in a processing chamber, has: accommodating a substrate into a processing chamber; and processing the substrate in the processing chamber on the basis of a correlation of a preset temperature of a heating device, a flow rate of fluid supplied by a cooling device and a temperature deviation between the center side of the substrate accommodated in the processing chamber and the outer peripheral side of the substrate while the substrate accommodated in the processing chamber is optically heated from an outer periphery side of the substrate at a corrected preset temperature by the heating device and the fluid is supplied to the outside of the processing chamber at the flow rate based on the correlation concerned to cool the outer peripheral side of the substrate by the cooling device.
    Type: Grant
    Filed: March 13, 2009
    Date of Patent: August 13, 2013
    Assignee: Hitachi Kokusai Electric Inc.
    Inventors: Masaaki Ueno, Masakazu Shimada, Takeo Hanashima, Haruo Morikawa, Akira Hayashida