Abstract: An example method of operating an image forming apparatus includes measuring a toner concentration supplied to a developing apparatus and increasing a driving speed of the developing apparatus based on the toner concentration not reaching a target toner concentration. The toner concentration is measured in a state where the driving speed of the developing apparatus is increased, and, based on the toner concentration not reaching the target toner concentration based on the driving speed of the developing apparatus being increased, an operating state of the image forming apparatus is determined based on a remaining amount of toner.

Abstract: According to one embodiment, an image forming apparatus includes a storage portion, a first electrode, a second electrode, a measuring unit, a detected portion, an image forming unit, and a controller. The storage portion stores a recording material. The measuring unit measures a change of capacitance between the first electrode and the second electrode. The detected portion is located inside the storage portion and is capable of moving so that at least one of a distance to the first electrode and a distance to the second electrode changes. The image forming unit forms an image with the recording material. The controller controls supplying of the recording material to the storage portion in response to the change of the capacitance measured by the measuring unit.

Abstract: An image forming apparatus includes a developing device to contain a developer, the developer including a toner; a developer cartridge to supply the developer to the developing device; a toner concentration sensor to sense a toner concentration of the toner included in the developer contained in the developing device; and a controller. The controller controls, during a non-printing operation a sensor control voltage to adjust an output level of the toner concentration sensor, to control an output of the toner concentration sensor to satisfy a controlling condition, and detects an shape of the output of the toner concentration sensor after the controller controls the sensor control voltage to adjust the output level.

Abstract: A first mass flow controller is provided in an inert gas pipe for feeding nitrogen gas. A second mass flow controller is provided in a reactive gas pipe for feeding ammonia. A joint pipe communicatively connects a joint portion of the inert gas pipe and the reactive gas pipe to a chamber for treating a semiconductor wafer. The joint pipe is provided with a mass flowmeter. A detector detects gas leakage by comparing a total value of flow rates of nitrogen controlled by the first mass flow controller and of ammonia controlled by the second mass flow controller with a measurement value of a flow rate of a treatment gas, obtained by the mass flowmeter.

Abstract: An image forming device to and from which a developing unit in which a developer containing toner is filled is detachable and removable, comprises a hardware processor that: enables the developing unit to perform a stir operation of the developer filled in the developing unit as an initial operation of the developing unit; obtains a reference value of a toner density set in advance in time of a factory shipment of the developing unit at time the stir operation is performed; and compares a toner density received from the developing unit during the stir operation with the reference value to determine a stir condition of the developer.

Abstract: Disclosed is a developing device, which may include: a casing that stores developer containing toner; and a screw arranged inside the casing, wherein the screw includes: a rotary shaft; and a screw blade that is spirally arranged around the rotary shaft and conveys the toner from an upstream side to a downstream side by rotation of the rotary shaft, the screw blade includes a discontinuous region, a paddle extending in a radial direction of the rotary shaft is provided along an axial direction of the rotary shaft on a surface of the rotary shaft located in the discontinuous region, and a recess and a protrusion are provided at an edge side in a radial direction of the paddle.

Abstract: An image forming apparatus includes an image forming unit, an execution unit that executes dew condensation elimination operation for eliminating dew condensation in the image forming unit, a setting unit that sets a dew condensation prevention mode for executing the dew condensation elimination operation to an enabled state, a display unit, and a control unit that causes the display unit to display a warning screen and selects a type of image forming job to be restricted during execution of the dew condensation elimination operation in a case where the dew condensation prevention mode is set to an enabled state, wherein, in a case where an image forming job is received during execution of the dew condensation elimination operation, the control unit determines whether the received image forming job is executable based on the type of job selected.

Abstract: An image forming apparatus includes a developer unit, a toner container, a capacitance sensor, a toner amount detector, and a determining unit. The toner container is located to be removably attachable to the image forming apparatus. The toner container supplies a toner to the developer unit. The capacitance sensor is located on a supply passage for the toner from the toner container to the developer unit. The capacitance sensor detects an electric charge amount and a relative dielectric constant of the toner. The electric charge amount is an electric charge amount when the toner passes through the supply passage. The toner amount detector detects an amount of the toner passing through the supply passage based on the electric charge amount detected by the capacitance sensor. The determining unit determines whether the relative dielectric constant of the toner detected by the capacitance sensor is in a predetermined range.

Abstract: Each of the oscillation frequency of a first oscillation circuit performing oscillation in a state of including a coil and a capacitor and the oscillation frequency of a second oscillation circuit performing oscillation in a state of including a coil and a capacitor different from the coil and the capacitor of the first oscillation circuit is measured. Then, the difference of the measured oscillation frequencies is calculated and then the calculated difference is converted into a magnetic permeability or a dielectric permittivity. One sensor selectively detects a change in the magnetic permeability or a change in the dielectric permittivity of a subject material.

Abstract: An object of the invention is to accurately grasp the fluidity of a developer and give proper feedback to an image forming process. An image forming device has a developing unit developing a latent image by transferring a developer to an image carrier, a fluidity measuring unit measuring fluidity of the developer, a correction amount computing unit computing a fluidity correction amount for correcting the fluidity of the developer measured by the fluidity measuring unit, and a process control unit changing a process condition of an image forming process. The process control unit selects, on the basis of the fluidity of the developer corrected based on the fluidity correction amount, an image forming process of changing a process condition from a plurality of image forming processes.

Abstract: A developing device includes a rotatable developer carrying member, first and second chambers configured to accommodate developer supplied to the developer carrying member, and first and second rotatable feeding members provided in the first and second chambers, respectively. A first communication port permits feeding of the developer from the second chamber to the first chamber, and a second communication port permits feeding of the developer from the first chamber to the second chamber. In addition, a toner content detecting portion includes a planar detecting surface including at least a planar coil generating a magnetic field and detects the toner content. The detecting surface is provided in the first communication port above a bottom of the first communication port and is disposed substantially in a central portion of the first communication port.

Abstract: A powder amount detector includes a vibration plate secured to a powder container to contain powder and positioned at a predetermined position in a stationary state, a shaft to rotate inside the powder container, a contact member attached to the shaft, a vibration detector to detect vibration of the vibration plate, and a detection result processor to determine an amount of the powder in the powder container according to a detection result generated by the vibration detector. The contact member is to flip the vibration plate to cause the vibration plate to repeat elastic deformation and reversion to vibrate. The contact member is to exit an area opposed to the vibration plate after the contact member flips the vibration plate by the time the vibration plate returns to the predetermined position.

Abstract: A developing device includes a developer container for storing developer containing carrier and toner, the developer container including a first compartment and a second compartment in which the developer is stirred and fed, a developing roller, and a sensor including a coil. A pair of communication portion is disposed on both ends in a longitudinal direction of the compartments. In addition, a gap is formed between the first compartment and the second compartment, and a part of the first compartment adjacent to the gap is a cylindrical portion through which the developer passes. A flat cable as a coil passes through the gap and is wound around the cylindrical portion so as to form a winding by overlapping both end portions of the flat cable in a state where terminals of wires are shifted by one pitch.

Abstract: This disclosure relates to an electrostatic ink composition comprising: a liquid carrier, and particles dispersed in the liquid carrier, wherein the particles comprise a resin and a substantially spherical silver pigment; wherein the substantially spherical silver pigment constitutes at least 30 wt % of the solids of the electrostatic ink composition. Print substrates are also disclosed herein.

Abstract: A development device includes a developer accommodating part that accommodates a developer, a developer detection member that is rotatably supported inside the developer accommodating part and is for detecting an amount of the developer accommodated inside the developer accommodating part, a rotational drive member that rotates the developer detection member around an rotational axis, and a conductive contact member that is formed of a conducive material. Wherein, defining a rotary track through which the developer detection member passes while rotating, a free edge of the contact member is arranged within the rotary track such that the contact member comes in contact with the developer detection member once while the developer detection member makes one rotation, the free edge being distal from where the contact member is fixed.

Abstract: According to an aspect of the invention, an image processing device includes a storage that stores character information, which is information affecting legibility of a character, on a character-by-character basis, and circuitry configured to determine a toner saving ratio for each character contained in a to-be-printed image so that legibility of the character achieves a preset target value at the determined toner saving ratio by assessing the legibility of the character based on the character information.

Abstract: A method for thermal process in packaging assembly of semiconductor is disclosed. The high-pressure overheated vapor is injected into the process chamber. The overheated vapor becomes saturated vapor in atmosphere (1 ATM) immediately and generates condensed liquid film onto all the surface of semiconductor work and also the chamber walls as condensation phenomenon occurs. The process temperature of vapor condensation is very close to and never exceeds the boiling point of perfluorinated compounds (PFC). Therefore, the latent heat of the saturated vapor is transferred to semiconductor work through the surface of liquid film evenly and uniformly.

Abstract: An image forming apparatus includes an image bearing member, a developing device, a driving device, and a controller. The developing device includes a developing container, a first feeding member, a second feeding member, a developer carrying member, a content sensor, and a sealing member. Wherein when the controller executes an initializing operation for removing the sealing member from the first opening and the second opening while driving the first feeding member and the second feeding member, the controller provides notification of abnormality when the controller discriminates that an amount of the developer in the second chamber is larger than a predetermined amount at a predetermined timing on the basis of an output of the content sensor.

Abstract: The detection sensitivity of a variation in resonant frequency is increased, and thus a toner concentration is accurately detected. In a sensor device that includes an LC resonant circuit which outputs a pulse signal having a frequency corresponding to the toner concentration, a multiplier portion which multiplies the pulse signal output from the LC resonant circuit and a concentration detection portion which detects the toner concentration based on the pulse signal multiplied by the multiplier portion, the LC resonant circuit includes a detection coil and a capacitor and outputs a pulse signal having a frequency corresponding to the toner concentration. The multiplier portion multiplies the frequency of the pulse signal output from the LC resonant circuit. The concentration detection portion subtracts a predetermined offset pulse number from the pulse signal multiplied by the multiplier portion and detects the toner concentration based on the subtracted pulse number.

Abstract: Disclosed are apparatus and methods for supplying a constant flow of precursor gas to a processing chamber. The apparatus described, and methods of use, allow a precursor ampoule to be removed from the gas delivery system without interrupting the process.

Abstract: An image forming apparatus is provided with an image forming portion, a collecting duct, a toner collecting device, a toner collecting device, and a first control portion. Into the collecting duct, unnecessary toner generated in the image forming portion flows together with an airflow. The toner collecting device communicates with the collecting duct, has a path of the airflow formed therein, and collects, by using a filter, the toner together with the airflow generated by an airflow generating portion. The first control portion controls an operation condition of a vibrating operation of a vibrating portion that vibrates the filter, in accordance with at least one of setting conditions relating to environment of the image forming portion, a coverage rate of a toner image, the number of printed sheets, and an image density of the toner image.

Abstract: A deposition apparatus and a method of forming a thin film are provided. The deposition apparatus includes a reaction gas supply unit supplying a reaction gas, a buffer unit temporarily storing the reaction gas supplied from the reaction gas supply unit, and a deposition unit forming a thin film by using the reaction gas supplied from the buffer unit.

Abstract: High-purity polysilicon granules are prepared by depositing reaction gas on silicon granules in a fluidized bed reactor having: a reactor space comprising at least two zones lying one above the other, the lower zone weakly fluidized by introduction of a silicon-free gas into silicon granules in the lower zone by a plurality of individual dilution gas nozzles, and a second, reaction zone directly abutting the lower zone, the reaction zone heated via its outwardly bounding wall, introducing silicon-containing reaction gas as a vertical high speed gas jet into the reaction zone by reaction gas nozzle(s), forming local reaction gas jets surrounded by bubble-forming fluidized bed, gas decomposing leading to particle growth, wherein the reaction gas has fully or almost fully reacted to chemical equilibrium conversion before reaching the wall or bed surface.

Abstract: One or more aspects of this invention pertain to fabrication of electronic devices. One aspect of the present invention is a system for electroless deposition of metal on a substrate. According to one or more embodiments of the present invention, the system comprises a main subsystem in combination with one or more subsystems for electroless deposition on a substrate. Another aspect of the present invention is a method of making an electronic device. According to one or more embodiments of the present invention, the method comprises one or more processes. Descriptions according to one or more embodiments of the system and the processes are presented.

Abstract: A material gas concentration control system for keeping a concentration of a material gas in a mixed gas constant comprising a tank to accommodate the material, an inlet line to input a carrier gas for evaporating the accommodated material into the tank, and an outlet line to output the mixed gas consisting of the material gas evaporated in the tank and the carrier gas, and further comprising a first valve arranged in the inlet line, a concentration measuring part that measures the concentration of the material gas in the mixed gas, and a concentration control part that controls an open degree of the first valve so as to make the measured concentration of the material gas measured by the concentration measuring part become the previously determined set concentration.

Abstract: To prevent loss of control of a pressure of a source gas within a movable range of a control valve, a source gas concentration control system is provided. The system may include a first valve that is provided on an outlet line, a concentration measurement part that measures a concentration of the source gas in mixed gas, and a concentration control part that controls a stroke of the first valve such that the measured concentration of the source gas becomes equal to a predetermined concentration setting. The measured concentration may be measured in the concentration measurement part. The system may further include a temperature controller that controls a temperature inside the tank to meet a temperature setting, and a temperature setting part that sets the temperature setting of the temperature controller.

Abstract: Methods and apparatus for gas delivery are disclosed herein. In some embodiments, a gas delivery system includes an ampoule for storing a precursor in solid or liquid form, a first conduit coupled to the ampoule and having a first end coupled to a first gas source to draw a vapor of the precursor from the ampoule into the first conduit, a second conduit coupled to the first conduit at a first junction located downstream of the ampoule and having a first end coupled to a second gas source and a second end coupled to a process chamber, and a heat source configured to heat the ampoule and at least a first portion of the first conduit from the ampoule to the second conduit and to heat only a second portion of the second conduit, wherein the second portion of the second conduit includes the first junction.

Abstract: Methods, systems, and devices associated with surface modifying a semiconductor material are taught. One such method includes providing a semiconductor material having a target region and providing a dopant fluid layer that is adjacent to the target region of the semiconductor material, where the dopant fluid layer includes at least one dopant. The target region of the semiconductor material is lased so as to incorporate the dopant or to surface modify the semiconductor material. During the surface modification, the dopant in the dopant fluid layer is actively replenished.

Abstract: Disclosed is a method of providing a constant concentration of a metal-containing precursor compound in the vapor phase in a carrier gas. Such method is particularly useful in supplying a constant concentration of a gaseous metal-containing compound to a plurality of vapor deposition reactors.

Abstract: A developer nozzle is moved from a periphery of a wafer toward the central portion while an exposed substrate held at a spin chuck is being rotated about a vertical axis and while a developing solution is being discharged from the developer nozzle, and this way the developing solution is supplied to the surface of the wafer, the developer nozzle having a slit-like ejection port whose longitudinal direction is oriented to the direction perpendicular to the radial direction of the wafer. The movement speed of the nozzle is higher than a case where a nozzle with a small-diameter circular nozzle is used, and this enables a development time to be reduced. Further, the thickness of a developing solution on a substrate can be reduced, so that the developing solution can be saved.

Abstract: Methods, systems, and devices associated with surface modifying a semiconductor material are taught. One such method includes providing a semiconductor material having a target region and providing a dopant fluid layer that is adjacent to the target region of the semiconductor material, where the dopant fluid layer includes at least one dopant. The target region of the semiconductor material is lased so as to incorporate the dopant or to surface modify the semiconductor material. During the surface modification, the dopant in the dopant fluid layer is actively replenished.

Abstract: An apparatus and method for gas injection sequencing in order to increase the gas injection total pressure while satisfying an upper limit to the process gas flow rate, thereby achieving gas flow uniformity during a sequence cycle and employing practical orifice configurations. The gas injection system includes a gas injection electrode having a plurality of regions, through which process gas flows into the process chamber. The gas injection system further includes a plurality of gas injection plenums, each independently coupled to one of the aforesaid regions and a plurality of gas valves having an inlet end and an outlet end, where the outlet end is independently coupled to one of the aforesaid plurality of gas injection plenums. The gas injection system includes a controller coupled to the plurality of gas valves for sequencing the flow of process gas through the aforesaid plurality of regions.

Abstract: Systems for depositing material onto workpieces in reaction chambers and methods for removing byproducts from reaction chambers are disclosed herein. In one embodiment, the system includes a gas phase reaction chamber, a first exhaust line coupled to the reaction chamber, first and second traps each in fluid communication with the first exhaust line, and a vacuum pump coupled to the first exhaust line to remove gases from the reaction chamber. The first and second traps are operable independently to individually and/or jointly collect byproducts from the reaction chamber. It is emphasized that this Abstract is provided to comply with the rules requiring an abstract. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.

Abstract: A system for delivering a desired mass of gas, including a chamber, a first valve controlling flow into the chamber, a second valve controlling flow out of the chamber, a pressure transducer connected to the chamber, an input device for providing a desired mass to be delivered, and a controller connected to the valves, the pressure transducer and the input device. The controller is programmed to receive the desired mass from the input device, close the second valve and open the first valve, receive chamber pressure measurements from the pressure transducer, and close the inlet valve when pressure within the chamber reaches a predetermined level. The controller is then programmed to wait a predetermined waiting period to allow the gas inside the chamber to approach a state of equilibrium, then open the outlet valve at time=t0, and close the outlet valve at time=t* when the mass of gas discharged equals the desired mass.

Abstract: A system for delivering pulses of a desired mass of gas, including a chamber, a first valve controlling flow into the chamber, a second valve controlling flow out of the chamber. A controller is programmed to receive the desired mass for each pulse through an input interface, close the second valve and open the first valve, receive chamber pressure measurements from a pressure transducer, and close the first valve when pressure within the chamber rises to a predetermined upper level. The controller is also programmed to deliver pulses of gas using just the second valve, wherein, for each pulse, the second valve is opened until a calculated mass for the pulse equals the desired mass for the pulse. The first valve is not required to be opened and closed for each pulse and is, therefore, used less frequently and has an extended life.

Abstract: A supply system for a chambered doctor blade assembly makes possible the sequential use of water-based and non-water-based coating materials through automated functions programmed in a PLC that controls the system. A pair of pneumatically driven diaphragm pumps serve as supply pump and return pump between the doctor blade chamber and a coating reservoir A PLC controls the pulse rate of pneumatic pressure to the pumps to control the rate of flow of the coating material into, and out of the doctor blade chamber. An ultrasonic sensor mounted detects the liquid level in the trough collection area. The PLC is programmed to modify the pulse rate of the supply pump and return pump to maintain the liquid level in the trough collection area above the drain thereof and below the maximum tolerance.

Abstract: A system for delivering a desired mass of gas, including a chamber, a first valve controlling flow into the chamber, a second valve controlling flow out of the chamber, a pressure transducer connected to the chamber, an input device for providing a desired mass to be delivered, and a controller connected to the valves, the pressure transducer and the input device. The controller is programmed to receive the desired mass from the input device, close the second valve and open the first valve, receive chamber pressure measurements from the pressure transducer, and close the inlet valve when pressure within the chamber reaches a predetermined level. The controller is then programmed to wait a predetermined waiting period to allow the gas inside the chamber to approach a state of equilibrium, then open the outlet valve at time=t0, and close the outlet valve at time=t* when the mass of gas discharged equals the desired mass.

Abstract: Electroless plating systems and methods are described herein.

Abstract: A droplet formation method of a mixed liquid is a method that the droplets 71, 72 and 73 are each delivered from each capillary tip to form the droplet 74 of the mixed liquid consisting of a raw material liquid on a substrate by applying a pulse voltage between the raw material liquids stored for each of a plurality of capillaries 1, 2 and 3 and the substrate disposed opposite to each capillary tip. In addition, a droplet formation device of the mixed liquid is provided with a plurality of capillaries for realizing formation of the droplet 74 of the aforementioned mixed liquid, a substrate, a voltage applying device for applying a pulse voltage and a controller for controlling the voltage applying device.

Abstract: A method and an apparatus for measuring the amount (CW) of a coating (2) on a paper web (1). The amount (CA) of at least one component in the coating (2) on the paper web (1) is measured and the composition (CC) of the coating (2) to be transferred to the paper web (1) is determined. The amount (CW) of the coating (2) on the paper web (1) is determined on the basis of the amount (CA) of at least one component in the coating (2) on the paper web (1) and the composition (CC) of the coating (2) to be transferred to the paper web (1).

Abstract: A method for performing a predetermined process on a substrate having coating film formed thereon includes preparing a data base denoting a relationship between each of parameters and a processing time of a predetermined process and storing the data base in a control section. The parameters include the temperature of a disposing plate, a supply rate of an ammonia gas, and an amount of a water vapor contained in the ammonia gas. The method further includes inputting a preset specific time value of the process into the control section; calculating candidate values of the parameters to finish the predetermined process by the specific time value; and determining specific values of the parameters to be used, based on the candidate values.

Abstract: This invention provides a thin film deposition process making it possible to form a thin film having a desired composition with good reproducibility and high efficiency; a thin film deposition device therefore; a FTIR gas analyzer used in the thin film deposition process; and a mixed gas supplying device used in the thin film deposition process. The thin film deposition process comprises the steps of mixing a plurality of organic metal gases in a gas mixing chamber and supplying the mixed gas into a reaction chamber to deposit a thin film on a substrate positioned in the reaction chamber, wherein the mixture ratio between/among the organic metal gases supplied into the gas mixing chamber is measured with a FTIR gas analyzer fitted to either the gas mixing chamber or the reaction chamber and then on the basis of results of the measurement, the flow rates of the organic metal gases are individually adjusted.

Abstract: According to the present invention, in changing the concentration of a treatment solution supplied to a substrate, a volume of an existing treatment solution in a tank connected to a treatment solution supply section for supplying the treatment solution to the substrate is first measured. Based on this measured value, a minimum drain volume of the existing treatment solution to be drained out from the tank and a supply volume of either a treatment solution with a predetermined concentration or a diluting fluid to be supplied into the tank is calculated respectively in order to change the treatment solution in the tank to be in an intended volume and to have an intended concentration. Then, the calculated drain volume of the existing treatment solution is drained out from the tank. Meanwhile, the calculated supply volume of either the treatment solution with the predetermined concentration or the diluting fluid is supplied into the tank.

Abstract: A gas supply system for supplying a gas into a processing chamber for processing a substrate to be processed includes: a processing gas supply unit; a processing gas supply line; a first and a second processing gas branch line; a branch flow control unit; an additional gas supply unit; an additional gas supply line; a first and a second additional gas branch line; a flow path switching unit; and a control unit. Before processing the substrate to be processed, the control unit performs a pressure ratio control on the branch flow control unit while the processing gas supply unit supplies the processing gas. After the inner pressures of the first and the second processing gas branch line become stable, the control unit switches the pressure ratio control to a fixed pressure control, and then the additional gas supply unit supplies the additional gas.

Abstract: A coating film forming apparatus for forming a film by applying a coating solution to a substrate, which is provided with a cassette section, coating unit, developing unit, pre-treatment/post-treatment units and a main arm for transferring the substrate between the respective units. In the coating unit, provided is a coating section in which a resist is applied on the substrate in a manner of single stroke by intermittently moving the substrate in a Y-direction and by moving a nozzle in an X-direction, and provided is a reduced-pressure drying section for drying under reduced pressure the substrate after being applied, and further provided is equipment for removing the coating film adhered to a periphery of the substrate. Additionally, when the reduced-pressure drying section is arranged outside the coating unit, the main arm is covered with a cover so that the inside thereof is under a solvent atmosphere.

Abstract: A coating equipment managing system for controlling and monitoring a coating equipment of an automobile manufacturing line, comprising local installations which are provided in the manufacturing lines at a plurality of localities, and a central installation for receiving data from the plurality of local installations, wherein the local installation comprises a sensor installed in the coating equipment, a data acquisition unit for receiving signals from the sensor, a control unit for controlling the coating equipment, and a local communication unit; the central installation comprises a server unit and a central analysis unit; the local communication unit transmits the data from the data acquisition unit to the server unit by E-mail; the server unit transmits correction data for the coating equipment obtained from the analysis of the measured data by the central analysis unit to the local communication unit by E-mail; and the local communication unit converts the correction data into a control code and transmit

Abstract: An aging unit (DAC) for processing a wafer W having a coated film formed thereon includes a disposing plate, a temperature control circulating device for controlling the temperature of the disposing plate, a chamber, a gas supply mechanism for supplying an ammonia gas containing a water vapor into the chamber, an input section for inputting the processing time of the wafer W, and a control device for controlling the temperature of the disposing plate, the supply rate of the ammonia gas, and the amount of the water vapor contained in the ammonia gas so as to permit the processing of the wafer W to be finished in the processing time inputted into the input section.

Abstract: An apparatus for manufacturing a semiconductor device, comprising a process chamber which holds a substrate to be subjected to a prescribed process, a gas inlet pipe which introduces a process gas into the process chamber, a gas outlet pipe which discharges the gas from the process chamber to outside the process chamber, component-measuring devices which measure components of the gas in the process chamber or at least two different gases, concentration-measuring devices which measure concentration of each component of the gas in the process chamber, or the concentration of each component of at least two different gases, and a control device which adjusts the components of the process gas, the concentration of each component of the process gas and an atmosphere in the process chamber, on the basis of values measured by the composition-measuring device and concentration-measuring device.

Abstract: A system and method for real time deposition process control based on resulting product detection, where the system and method detect an amount of at least one reaction product in real time, while the deposition process is being performed, the detected amount of reaction product is compared with a reference amount, and a comparison result is fed back in real time to adjust a supply of one or more reactants. The system and method provide real time control over the deposition process and/or reduce the number of wafers produced that do not meet processing target values.

Abstract: In a coating apparatus for supplying a mixed solution of a resist solution and a thinner onto a wafer from a nozzle, the nozzle is connected to a mixed solution supply pipe, and the resist solution and the thinner are supplied to the mixed solution supply pipe from a resist solution supply pipe and a thinner supply pipe respectively through a junction pipe. The diameter of the junction pipe is set smaller than those of other supply pipes, whereby the resist solution and the thinner can be mixed efficiently in the junction pipe, and as a result the wafer is coated with the mixed solution so that a uniform film thickness can be obtained within the surface of the wafer.