Having Timer Patents (Class 118/699)
  • Patent number: 10545478
    Abstract: Disclosed is a substrate processing system including a substrate processing apparatus configured to execute a predetermined processing on a substrate accommodated in a processing container, an input receiving unit configured to receive an input of a set value for executing the predetermined processing, and a determination unit configured to determine whether or not the set value received by the input receiving unit is valid based on the set value received by the input receiving unit and a characteristic of the substrate processing apparatus.
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: January 28, 2020
    Assignee: Tokyo Electron Limited
    Inventor: Yuichi Takenaga
  • Patent number: 9401291
    Abstract: A coating apparatus includes: a slit nozzle including a retention chamber that retains the coating material; a moving mechanism that moves the slit nozzle; a pressure regulation unit that regulates a pressure inside the retention chamber; and a control unit that controls the moving mechanism and the pressure regulation unit to relatively move the slit nozzle with respect to the substrate while changing the pressure inside the retention chamber toward an atmospheric pressure from a negative pressure, wherein the control unit is configured to control the pressure regulation unit so that a change in the pressure inside the retention chamber in a start zone including a coating start position and an end zone including a coating end position becomes slower than a change in the pressure inside the retention chamber in a middle zone except the start zone and the end zone.
    Type: Grant
    Filed: October 28, 2014
    Date of Patent: July 26, 2016
    Assignee: Tokyo Electron Limited
    Inventors: Yuji Mimura, Tetsuya Maki, Shigeto Tsuruta, Tatsumi Oonishi, Daisuke Ikemoto, Takahiro Masunaga
  • Publication number: 20150128858
    Abstract: A coating apparatus includes: a slit nozzle including a retention chamber that retains the coating material; a moving mechanism that moves the slit nozzle; a pressure regulation unit that regulates a pressure inside the retention chamber; and a control unit that controls the moving mechanism and the pressure regulation unit to relatively move the slit nozzle with respect to the substrate while changing the pressure inside the retention chamber toward an atmospheric pressure from a negative pressure, wherein the control unit is configured to control the pressure regulation unit so that a change in the pressure inside the retention chamber in a start zone including a coating start position and an end zone including a coating end position becomes slower than a change in the pressure inside the retention chamber in a middle zone except the start zone and the end zone.
    Type: Application
    Filed: October 28, 2014
    Publication date: May 14, 2015
    Inventors: Yuji MIMURA, Tetsuya MAKI, Shigeto TSURUTA, Tatsumi OONISHI, Daisuke IKEMOTO, Takahiro MASUNAGA
  • Publication number: 20150107513
    Abstract: A system for processing a substrate include a processing chamber including a pedestal to support a substrate and a controller configured to a) supply precursor to the processing chamber; b) purge the processing chamber; c) perform radio frequency (RF) plasma activation; d) purge the processing chamber; and e) prior to purging the processing chamber in at least one of (b) or (d), set a vacuum pressure of the processing chamber to a first predetermined pressure that is less than a vacuum pressure during at least one of (a) or (c) for a first predetermined period.
    Type: Application
    Filed: December 23, 2014
    Publication date: April 23, 2015
    Inventors: Shankar Swaminathan, Hu Kang, Adrien LaVoie
  • Publication number: 20150111312
    Abstract: Provided are a deposition data processing apparatus, an apparatus and a method for manufacturing an organic EL device, which make it possible to check deposition states of constituent layers of each of organic EL elements that are continuously formed on a substrate being conveyed. The deposition data processing apparatus includes a scanning section configured to scan at least two of a plurality of constituent layers that constitute each of the organic EL elements; and a processor configured to accumulate data of the constituent layers scanned by the scanning section at a specific position in a longitudinal direction of the substrate as data of a specific one of the organic EL elements.
    Type: Application
    Filed: March 5, 2013
    Publication date: April 23, 2015
    Applicant: NITTO DENKO CORPORATION
    Inventors: Ryohei Kakiuchi, Satoru Yamamoto, Takayoshi Yamano
  • Publication number: 20150064345
    Abstract: A material deposition system includes a frame, a support coupled to the frame to support an electronic substrate during a deposit operation, a gantry coupled to the frame, and a deposition head coupled to the gantry. The deposition head is movable over the support by movement of the gantry. The deposition head includes a chamber to hold material, an actuator to push a volume of material out of the chamber, a needle extending from the chamber and terminating in a needle orifice, and at least two air jets located on opposite sides of the needle orifice. A desired volume of material is formed at the needle orifice in response to the actuator, and each of the at least two air jets produce a timed pulse of air to create a micro-droplet from the desired volume and to accelerate the micro-droplet to high velocity.
    Type: Application
    Filed: November 10, 2014
    Publication date: March 5, 2015
    Inventors: Kenneth C. Crouch, Kui-Chiu Kwok, Robert W. Tracy, Rita Mohanty, Thomas J. Karlinski, Scott A. Reid
  • Patent number: 8962063
    Abstract: A method of method of coating powdered medical agent onto a carrier particle for use in a dry powder inhaler may include applying ultrasonic energy to agglomerated powdered medical agent to deaggregate and aerosolize particles of the medical agent into particles having a desired average particle size, and coating at least one carrier particle with a desired amount of the deaggregated and aerosolized particles of the medical agent.
    Type: Grant
    Filed: August 27, 2010
    Date of Patent: February 24, 2015
    Assignee: ST.UNM
    Inventors: Hugh D. C. Smyth, Martin J. Donovan
  • Publication number: 20150027369
    Abstract: In an apparatus for treating a gas stream, a plasma generator comprises an electrode for energising a source gas to generate a plasma flare by application of a high voltage. An inlet allows the gas stream into the apparatus and directs it into the generated plasma. A scraper is fitted for reciprocating movement from a first position to a second position for scraping a surface to remove solid deposits accumulated on the surface.
    Type: Application
    Filed: July 11, 2012
    Publication date: January 29, 2015
    Applicant: Edwards Limited
    Inventor: Joanne WALSH
  • Publication number: 20150027368
    Abstract: A drug coating apparatus (100) for coating an implant (206) with a drug is described. The drug coating apparatus (100) includes a holding unit (102) having a top collet (202-1) for holding the implant (206) from a top end of the implant (206), and a bottom collet (202-2) to hold the implant (206) from a bottom end of the implant (206). The drug coating apparatus (100) includes at least one rotary drive (115) coupled to the holding unit (102) for rotating the top collet (202-1), the bottom collet (202-2) and the implant (206), and includes a spraying unit (104) to spray-coat the drug on the implant (206).
    Type: Application
    Filed: February 15, 2013
    Publication date: January 29, 2015
    Inventors: Rahul Mahendrakumar Gaywala, Vallabh Mohan Narola
  • Publication number: 20150024330
    Abstract: Provided are an apparatus and a method for controlling the heating of the base within a chemical vapour deposition chamber, which apparatus is applicable to an MOCVD reaction chamber.
    Type: Application
    Filed: March 21, 2013
    Publication date: January 22, 2015
    Applicant: Advanced Mirco-Fabrication Equipment Inc, Shanghai
    Inventors: Baoxia Tian, Steven Tianxiao Lee, Yingbin Liu, Quanyong Guo
  • Patent number: 8875652
    Abstract: A system for controlling a boundary of spreading liquid adhesive on a surface is disclosed. The system includes one or more ultra-violet (UV) sources configurable to emit UV light onto the liquid adhesive; and a control circuit coupled to the one or more UV sources and configured to control the one or more UV sources to selectively apply the UV light at selected locations on the liquid adhesive to cure the adhesive and prevent its further spread at those locations.
    Type: Grant
    Filed: September 14, 2011
    Date of Patent: November 4, 2014
    Assignee: Apple Inc.
    Inventors: Casey J. Feinstein, Kuo-Hua Sung, Ralf Horstkemper
  • Patent number: 8834631
    Abstract: A processing apparatus includes a processing chamber configured to accommodate a target object to be processed, gas supply paths provided in a corresponding relationship with the kinds of process gases supplied into the processing chamber, and valves respectively arranged in the gas supply paths to open and close the gas supply paths. The processing apparatus further includes valve drive units configured to independently drive the valves, sensor units configured to independently monitor opening and closing operations of the valves, and a control unit configured to determine operation statuses of the valves based on valve opening and closing drive signals transmitted to the valve drive units and/or valve opening and closing detection signals transmitted from the sensor units.
    Type: Grant
    Filed: January 16, 2013
    Date of Patent: September 16, 2014
    Assignee: Tokyo Electron Limited
    Inventors: Katsuhito Hirose, Toshio Miyazawa, Toshiharu Hirata, Toshimasa Tanaka
  • Patent number: 8790464
    Abstract: A mole delivery system and method provide pulses of known molar quantities as a function of the time duration of each pulse, which in turn is derived as a function of the ideal gas law. In one embodiment of the system, the system comprises: a chamber of known volume and controlled and known temperature; a pressure sensor to measure the pressure in the chamber; an outlet valve to a process tool; an inlet valve to charge the chamber with the delivery gas; and a control system configured and arranged so as to control the operation of the outlet valve, control the amount of each gas pulse by controlling the timing of the valve to the process tool.
    Type: Grant
    Filed: January 19, 2010
    Date of Patent: July 29, 2014
    Assignee: MKS Instruments, Inc.
    Inventor: Paul Meneghini
  • Patent number: 8785216
    Abstract: A substrate processing method which is capable of enhancing productivity in manufacturing product substrates. In process chambers of an etching apparatus, etching is carried out on a substrate as an object to be processed, and dummy processing is carried out on at least one non-product substrate before execution of the etching. A host computer determines whether or not the dummy processing is to be executed. The host computer determines whether or not the interior of each of the process chambers and is in a stable state, and omits the execution of the dummy processing when it is determined that it is in the stable state.
    Type: Grant
    Filed: February 24, 2011
    Date of Patent: July 22, 2014
    Assignee: Tokyo Electron Limited
    Inventors: Satoshi Yamazaki, Mitsuru Hashimoto
  • Patent number: 8746171
    Abstract: A substrate treating system includes a coating apparatus having a resist coating unit, an exposing apparatus having an exposing machine and a heat-treating unit, and a controller for controlling the resist coating unit, exposing machine and heat-treating unit. The controller coordinates schedules of treatment in the coating apparatus and exposing apparatus, such that the coating apparatus can operate efficiently despite an increase in the processing time of the exposing machine.
    Type: Grant
    Filed: August 14, 2008
    Date of Patent: June 10, 2014
    Assignee: Dainippon Screen Mfg. Co., Ltd.
    Inventor: Joichi Nishimura
  • Publication number: 20140148006
    Abstract: A liquid treatment apparatus of continuously performing a plating process on multiple substrates includes a temperature controlling container for accommodating a plating liquid; a temperature controller for controlling a temperature of the plating liquid in the temperature controlling container; a holding unit for holding the substrates one by one at a preset position; a nozzle having a supply hole through which the temperature-controlled plating liquid in the temperature controlling container is discharged to a processing surface of the substrate; a pushing unit for pushing the temperature-controlled plating liquid in the temperature controlling container toward the supply hole of the nozzle; and a supply control unit for controlling a timing when the plating liquid is pushed by the pushing unit. The temperature controller controls the temperature of the plating liquid in the temperature controlling container based on the timing when the plating liquid is pushed by the pushing unit.
    Type: Application
    Filed: August 31, 2011
    Publication date: May 29, 2014
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Takashi Tanaka, Yusuke Saito, Mitsuaki Iwashita
  • Publication number: 20140065730
    Abstract: An ion implantation system is provided having an ion implantation apparatus configured to provide a spot ion beam having a beam density to a workpiece, wherein the workpiece has a crystalline structure associated therewith. A scanning system iteratively scans one or more of the spot ion beam and workpiece with respect to one another along one or more axes. A controller is also provided and configured to establish a predetermined localized temperature of the workpiece as a predetermined location on the workpiece is exposed to the spot ion beam. A predetermined localized disorder of the crystalline structure of the workpiece is thereby achieved at the predetermined location, wherein the controller is configured to control one or more of the beam density of the spot ion beam and a duty cycle associated with the scanning system to establish the localized temperature of the workpiece at the predetermined location on the workpiece.
    Type: Application
    Filed: August 29, 2013
    Publication date: March 6, 2014
    Applicant: Axcelis Technologies, Inc.
    Inventors: Ronald N. Reece, Shu Satoh, Serguei Kondratenko, Andy Ray
  • Publication number: 20140060430
    Abstract: A semiconductor processing apparatus (1), comprising: a gas supply system (2), comprising at least one gas supply unit (100) including: a process gas source (110); a gas distribution manifold (150), including an annular gas distribution conduit (152) provided with an inlet (154) and a plurality of valved outlets (156a-c); a gas supply conduit (130, 132) fluidly connecting the process gas source (110) to the inlet (154) of the gas distribution manifold (150); a plurality of reactors (4a-c), each fluidly connected to a respective valved outlet (156a-c) of the gas distribution manifold (150), such that process gas from the process gas source (110) of the at least one gas supply unit (100) is selectively suppliable to a respective reactor of said plurality of reactors (4a-c) via the gas supply conduit (130, 132), the gas distribution manifold (150), and a respective valved outlet (156a-c).
    Type: Application
    Filed: September 4, 2012
    Publication date: March 6, 2014
    Inventors: Theodorus G.M. Oosterlaken, Radko Bankras
  • Publication number: 20140023791
    Abstract: Coating apparatus including a spray to provide a coating, a controller to control the spray to vary a spraying width of the spray, and a first roller to receive the coating and to smear the coating on a substrate.
    Type: Application
    Filed: July 23, 2012
    Publication date: January 23, 2014
    Inventors: Eyal Peleg, Doron Schlumm, Benji Ruhm
  • Patent number: 8616152
    Abstract: An apparatus for coating a stent comprises a coating solution reservoir, a stent support for carrying a stent adjacent the reservoir, transducers for generating waves through the coating solution, and a controller that controls timing at which the transducers are powered in order to eject a droplet of the coating solution.
    Type: Grant
    Filed: August 6, 2012
    Date of Patent: December 31, 2013
    Assignee: Abbott Cardiovascular Systems Inc.
    Inventor: Yung Ming Chen
  • Patent number: 8608852
    Abstract: Components and systems for controlling a process or chamber component temperature as a plasma process is executed by plasma processing apparatus. A first heat transfer fluid channel is disposed in a component subjacent to a working surface disposed within a plasma processing chamber such that a first length of the first channel subjacent to a first temperature zone of the working surface comprises a different heat transfer coefficient, h, or heat transfer area, A, than a second length of the first channel subjacent to a second temperature zone of the working surface. In embodiments, different heat transfer coefficients or heat transfer areas are provided as a function of temperature zone to make more independent the temperature control of the first and second temperature zones.
    Type: Grant
    Filed: May 19, 2011
    Date of Patent: December 17, 2013
    Assignee: Applied Materials, Inc.
    Inventors: Chetan Mahadeswaraswamy, Kallol Bera, Larry D. Elizaga
  • Publication number: 20130316077
    Abstract: Mechanically fluidized systems and processes allow for efficient, cost-effective production of silicon. Particulate may be provided to a heated tray or pan, which is oscillated or vibrated to provide a reaction surface. The particulate migrates downward in the tray or pan and the reactant product migrates upward in the tray or pan as the reactant product reaches a desired state. Exhausted gases may be recycled.
    Type: Application
    Filed: May 25, 2012
    Publication date: November 28, 2013
    Inventors: Mark W. Dassel, David A. Bressler
  • Publication number: 20130298827
    Abstract: A moveable dispenser assembly including is shown. The dispenser includes a reservoir having bonding adhesive therein including particles and a liquid carrier. The dispenser is moved to provide agitation to the dispenser for mixing the bonding adhesive into a homogeneous mixture of particles and the liquid carrier. An opening at an end of said dispenser dispenses the bonding adhesive onto a bonding location on the workpiece without removing the dispenser from the die attach apparatus. A one controller for sends a control signal that triggers moving of said moveable dispenser assembly for mixing said bonding adhesive before dispensing said volume of bonding adhesive onto said surface of said workpiece. The controller includes logic to control of movements such as oscillations to keep the bonding adhesive well mixed based on a comparing a parameter to be in a predetermined limit or range.
    Type: Application
    Filed: July 19, 2013
    Publication date: November 14, 2013
    Applicant: Texas Instruments Incorporated
    Inventors: Frank Yu, Eric Hsieh, Kevin Jin
  • Publication number: 20130206062
    Abstract: A solar cell extrusion printing system that uses a micro-extrusion printhead to print longer central gridlines and one or more pairs of shorter “side” gridlines such that end points of the gridline sets form step patterns on an octagonal (pseudo-square) substrate. The printhead includes a set of central nozzles that receive ink from a first valve by way of a first flow channel to print the longer central gridlines, and additional sets of side nozzles that receive ink from additional valves by way of additional flow channels to print the shorter “side” gridlines. The central nozzles have outlet orifices that offset in the process direction from side outlet orifices of the side nozzles. A start signal is simultaneously sent to the valves such that ink is substantially simultaneously extruded through both the central and side orifices, whereby the extruded ink produces gridline endpoints having the desired step pattern.
    Type: Application
    Filed: February 10, 2012
    Publication date: August 15, 2013
    Applicant: Palo Alto Research Center Incoproated
    Inventors: Corie Lynn Cobb, Scott E. Solberg
  • Publication number: 20130203267
    Abstract: A vapor deposition method and apparatus including at least two vessels containing a same first source chemical. A controller is programmed to simultaneously pulse to the reaction space doses or pulses of a gas from the vessels, each of the doses having a substantially consistent concentration of the first source chemical. The apparatus may also include at least two vessels containing a same second source chemical. The controller can be programmed to simultaneously pulse to the reaction space doses or pulses of a gas from the vessels containing the second source chemical, each of the doses having a substantially consistent concentration of the second source chemical. The second source chemical can be pulsed to the reaction space after the reaction space is purged of an excess of the first source chemical.
    Type: Application
    Filed: February 6, 2012
    Publication date: August 8, 2013
    Applicant: ASM IP HOLDING B.V.
    Inventors: Christophe Pomarede, Eric Shero, Mohith Verghese, Jan Willem Maes, Chang-Gong Wang
  • Publication number: 20130183443
    Abstract: A processing apparatus includes a processing chamber configured to accommodate a target object to be processed, gas supply paths provided in a corresponding relationship with the kinds of process gases supplied into the processing chamber, and valves respectively arranged in the gas supply paths to open and close the gas supply paths. The processing apparatus further includes valve drive units configured to independently drive the valves, sensor units configured to independently monitor opening and closing operations of the valves, and a control unit configured to determine operation statuses of the valves based on valve opening and closing drive signals transmitted to the valve drive units and/or valve opening and closing detection signals transmitted from the sensor units.
    Type: Application
    Filed: January 16, 2013
    Publication date: July 18, 2013
    Applicant: TOKYO ELECTRON LIMITED
    Inventor: TOKYO ELECTRON LIMITED
  • Patent number: 8467895
    Abstract: An operating method is disclosed for a processing system that comprises multiple process modules each adapted to perform substantially the same process upon a substrate. During process module conditioning as a preparatory step for executing a required process recipe, each time one process module completes conditioning, successive transfer of unprocessed substrates from a cassette to the process module is started on an associated substrate transfer route, and successive processes that use the process module are started for the unprocessed substrates. The processing system can be operated efficiently, even if the nonuniformity of the conditioning time required exists between process modules of the same specifications.
    Type: Grant
    Filed: October 6, 2006
    Date of Patent: June 18, 2013
    Assignee: Tokyo Electron Limited
    Inventors: Koichi Sekido, Hirofumi Yamaguchi, Bae Junghwan
  • Patent number: 8459203
    Abstract: A coating powder feed method, coating powder feeding device, electrostatic powder spraycoating apparatus containing such a coating powder feeding device. The invention includes a dense phase powder pump fitted with at least one feed chamber. A control signal to create a partial vacuum in the feed chamber is generated no earlier than simultaneously with, preferably by a predetermined delay time after, a control signal opening a powder intake valve of the feed chamber, as a result of which the beginning of partial vacuum buildup in the feed chamber shall take place no earlier than simultaneously with the initial opening of the powder intake valve or by a defined time delay after the opening of the powder intake valve.
    Type: Grant
    Filed: September 8, 2008
    Date of Patent: June 11, 2013
    Inventors: Felix Mauchle, Christian Marxer, Hanspeter Vieli
  • Publication number: 20130064967
    Abstract: A system for controlling a boundary of spreading liquid adhesive on a surface is disclosed. The system includes one or more ultra-violet (UV) sources configurable to emit UV light onto the liquid adhesive; and a control circuit coupled to the one or more UV sources and configured to control the one or more UV sources to selectively apply the UV light at selected locations on the liquid adhesive to cure the adhesive and prevent its further spread at those locations.
    Type: Application
    Filed: September 14, 2011
    Publication date: March 14, 2013
    Inventors: CASEY J. FEINSTEIN, Kuo-Hua Sung, Ralf Horstkemper
  • Publication number: 20120291703
    Abstract: An apparatus for coating a stent comprises a coating solution reservoir, a stent support for carrying a stent adjacent the reservoir, transducers for generating waves through the coating solution, and a controller that controls timing at which the transducers are powered in order to eject a droplet of the coating solution.
    Type: Application
    Filed: August 6, 2012
    Publication date: November 22, 2012
    Applicant: Advanced Cardiovascular Systems, Inc.
    Inventor: Yung Ming Chen
  • Publication number: 20120258570
    Abstract: A substrate processing apparatus includes a mounting stand, a cover opening and closing unit, a substrate checking unit, a substrate transfer mechanism, a substrate processing unit, and a controller. While the substrate processing unit is processing a substrate within a first substrate accommodation container mounted on the mounting stand, when a second substrate accommodation container is mounted on the mounting stand, the controller provides control to open the cover of a second substrate accommodation container and check a substrate within the second substrate accommodation container by means of the substrate checking unit, and when the substrate checking is terminated, the controller provides control to close the cover of the second substrate accommodation container.
    Type: Application
    Filed: March 30, 2012
    Publication date: October 11, 2012
    Applicant: HITACHI KOKUSAI ELECTRIC INC.
    Inventor: Makoto Shirakawa
  • Publication number: 20120258252
    Abstract: A wind turbine tower cleaning or coating apparatus is provided. The apparatus includes a frame which circumferentially extends at least partially around a wind turbine tower. A separator structure can be attached to the frame and extends between the frame and the wind turbine tower to position the frame at a predetermined distance away from the wind turbine tower. The separator structure can also include an attachment end which is attached to the frame and a slidabe end positionable near the wind turbine tower. A slider can be attached to the slidabe end of the separator structure and can slide on the surface of the wind turbine tower as the frame is raised and lowered on the wind turbine tower. A frame lift device can raise and lower the frame on the wind turbine tower. A plurality of sprayers can be positioned circumferentially along the frame and configured to selectively spray fluid onto the wind turbine tower.
    Type: Application
    Filed: April 5, 2011
    Publication date: October 11, 2012
    Inventors: Dustin Jensen, Broque L. Fraughton, Sonny K. Fraughton
  • Publication number: 20120244685
    Abstract: A semiconductor manufacturing apparatus includes: a plurality of reaction chambers into which wafers are introduced and deposition process is performed; a material gas supply mechanism that includes a plurality of material gas supply lines that respectively supply a material gas to the plurality of reaction chambers and a flow rate control mechanism that controls a flow rate of the marital gas in the material gas supply lines; a carrier gas supply mechanism that includes a plurality of carrier gas supply lines that respectively supplies a carrier gas into the plurality of reaction chambers; and a material gas switching mechanism that intermittently opens and closes the plurality of material gas supply lines respectively so that at least one of the plurality of material gas supply lines comes to be in an opened state at a same time, and sequentially switches the reaction chamber to which the material gas is supplied.
    Type: Application
    Filed: March 16, 2012
    Publication date: September 27, 2012
    Applicant: NUFLARE TECHNOLOGY, INC.
    Inventors: Kunihiko SUZUKI, Shinichi MITANI
  • Publication number: 20120207913
    Abstract: A method of method of coating powdered medical agent onto a carrier particle for use in a dry powder inhaler may include applying ultrasonic energy to agglomerated powdered medical agent to deaggregate and aerosolize particles of the medical agent into particles having a desired average particle size, and coating at least one carrier particle with a desired amount of the deaggregated and aerosolized particles of the medical agent.
    Type: Application
    Filed: August 27, 2010
    Publication date: August 16, 2012
    Applicant: STC UNM
    Inventors: Hugh D.C. Smyth, Martin J. Donovan
  • Patent number: 8225745
    Abstract: System and method for operating a material deposition system are disclosed. In one embodiment, the method can include periodically injecting a precursor into a vaporizer through an injector at the vaporizer, vaporizing the precursor in the vaporizer and supplying the vaporized precursor to a reaction chamber in fluid communication with the vaporizer, and shutting down the vaporizer and the reaction chamber after a period of time. The method can also include conducting maintenance of the injector at the vaporizer by using a vapor solvent rinse.
    Type: Grant
    Filed: February 2, 2011
    Date of Patent: July 24, 2012
    Assignee: Micron Technology, Inc.
    Inventors: Eugene P. Marsh, David R. Atwell
  • Publication number: 20120132397
    Abstract: Methods and systems for controlling temperatures in plasma processing chamber via pulsed application of heating power and pulsed application of cooling power. In an embodiment, temperature control is based at least in part on a feedforward control signal derived from a plasma power input into the processing chamber. In further embodiments, fluid levels in each of a hot and cold reservoir coupled to the temperature controlled component are maintained in part by a passive leveling pipe coupling the two reservoirs. In another embodiment, digital heat transfer fluid flow control valves are opened with pulse widths dependent on a heating/cooling duty cycle value and a proportioning cycle having a duration that has been found to provide good temperature control performance.
    Type: Application
    Filed: May 19, 2011
    Publication date: May 31, 2012
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Fernando M. Silveira, Hamid Tavassoli, Xiaoping Zhou, Shane C. Nevil, Douglas A. Buchberger, Brad L. Mays, Tina Tsong, Chetan Mahadeswaraswamy, Yashaswini B. Pattar, Duy D. Nguyen, Walter R. Merry
  • Publication number: 20120135610
    Abstract: A substrate processing system including a cleaning equipment; a resist coating equipment forming a resist layer on a surface of a substrate; an edge exposure equipment that exposes to light an edge portion of the resist layer formed on a peripheral edge of the substrate; a substrate transport mechanism; and a system controller. The system controller includes a waiting time monitor and a process controller. The waiting time monitor monitors a waiting time that is a time interval between the formation of the resist layer and start of the exposure of the edge portion of the resist layer. The process controller causes the substrate transport mechanism to transport the substrate into the cleaning equipment when the monitored waiting time exceeds a prescribed limit, removing the resist layer from the substrate. The process controller then causes the substrate transport mechanism to transport the substrate into the resist coating equipment.
    Type: Application
    Filed: November 18, 2011
    Publication date: May 31, 2012
    Applicant: LAPIS SEMICONDUCTOR CO., LTD.
    Inventor: Toshiyuki IDE
  • Patent number: 8176871
    Abstract: Disclosed is a substrate processing apparatus, including: a processing space to provide a space in which a substrate is to be processed; a heating member to heat the processing space; a gas supply member to supply at least first and second processing gases to the processing space; an exhaust member to exhaust an atmosphere in the processing space; and a control member to control at least the gas supply member and the exhaust member such that supply and exhaust of the first and second processing gases are alternately repeated a plurality of times so that the first and second processing gases are not mixed with each other in the processing space when forming a desired film on the substrate, and both the first and second processing gases are supplied to the processing space when coating a surface of an inner wall of the processing space with a desired film.
    Type: Grant
    Filed: March 28, 2007
    Date of Patent: May 15, 2012
    Assignee: Hitachi Kokusai Electric Inc.
    Inventors: Kazuyuki Okuda, Norikazu Mizuno
  • Publication number: 20120107486
    Abstract: The present invention provides a sealant coating device having a sealant receiving chamber and a nozzle formed on a lower portion of the sealant receiving chamber. The sealant coating device further has a heating device, and the heating device is installed around the sealant receiving chamber for heating a sealant material filled in the sealant receiving chamber. The present invention further provides a dispensing method of the sealant coating device, which has the following steps of: obtaining time during the sealant material stays in the sealant receiving chamber; calculating a target temperature of the sealant material according to the obtained time and a desired sealant viscosity value; heating the sealant material to the target temperature. The advantages of the present invention are to use the heating device to lower the sealant viscosity based on the characteristic of the sealant viscosity varied with the temperature.
    Type: Application
    Filed: November 5, 2010
    Publication date: May 3, 2012
    Applicant: SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Chengming He, Chien-Pang Lee, Yu-wu Huang
  • Publication number: 20120042827
    Abstract: A droplet discharge apparatus is configured to move a droplet discharge head and a weight measurement unit relative to each other so that the droplet discharge head is placed in a position that faces the weight measurement unit by controlling a weight measurement unit movement part and a weight measurement unit secondary movement. The droplet discharge apparatus is also configured to control the droplet discharge head to perform a weight measurement discharge for measuring a weight of the liquid material discharged from the droplet discharge head during the feed/removal period, which includes a period for feeding and removing the substrate from the stage, and a period in which the stage is moved in relative fashion by the stage movement unit for performing feeding and removal operations.
    Type: Application
    Filed: November 1, 2011
    Publication date: February 23, 2012
    Applicant: SEIKO EPSON CORPORATION
    Inventor: Kenji KOJIMA
  • Publication number: 20120006262
    Abstract: An apparatus including a vacuum chamber having a substrate holding unit that holds a substrate and a plasma electrode facing the substrate, a first gas supply unit that supplies a H2 gas to the vacuum chamber at a constant flow rate, a second gas supply unit that opens or closes a valve to turn on or off the supply of a SiH4 gas, a high-frequency power source that applies a high frequency voltage to the plasma electrode, a shield box that is connected to a ground so as to surround the plasma electrode outside the vacuum chamber, and a control unit that controls the valve such that the SiH4 gas is periodically supplied to the vacuum chamber and modulates the amplitude of high frequency power in synchronization with the opening or closing of the valve, and the valve is provided in the shield box.
    Type: Application
    Filed: September 20, 2011
    Publication date: January 12, 2012
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Mutsumi TSUDA, Masakazu TAKI
  • Publication number: 20110287172
    Abstract: A process gas supply cycle pattern that will adversely affect the result of processing is changed beforehand. Based on information supplied from a setting input section, a pattern computation section obtains the result of computation of a process gas supply cycle pattern that includes a rotation cycle of a substrate rotation mechanism, a supply cycle of a process gas, a supply time of the process gas, and a supply count of the process gas. Based on information supplied from the setting input section, a simulator simulates the shape of a supply region of the process gas to be supplied onto a substrate. A comparison section compares the result of computation of the process gas supply cycle pattern determined by the pattern computation section against the result of referencing of a process gas supply cycle pattern that adversely affects the result of processing and is obtained from a storage section.
    Type: Application
    Filed: May 20, 2011
    Publication date: November 24, 2011
    Applicant: Tokyo Electron Limited
    Inventor: Kazuhisa MATSUDA
  • Publication number: 20110265718
    Abstract: A plated film having a uniform film thickness is formed on a surface of a substrate. A semiconductor manufacturing apparatus includes: a holding mechanism for holding a substrate rotatably; a nozzle for supplying a processing solution for performing a plating process on a processing target surface of the substrate; a substrate rotating mechanism for rotating the substrate held by the holding mechanism in a direction along the processing target surface; a nozzle driving mechanism for moving the nozzle in a direction along the processing target surface at a position facing the processing target surface of the substrate held by the holding mechanism; and a control unit for controlling the supply of the processing solution by the nozzle and the movement of the nozzle by the nozzle driving mechanism.
    Type: Application
    Filed: July 12, 2011
    Publication date: November 3, 2011
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Kenichi Hara, Mitsuaki Iwashita, Takashi Tanaka, Takayuki Toshima, Takehiko Orii
  • Patent number: 8015940
    Abstract: A transfer flow is produced in accordance with a process recipe of a process to be carried out. In the transfer flow, a type of modules listed in accordance with a substrate transfer order is associated with a necessary staying time from when the substrate is transferred into a module by a substrate transfer unit to when the substrate is ready to be transferred back to the substrate transfer unit after the corresponding process is finished. A cycle limiting time is determined to be the longest necessary transfer cycle time among those obtained by dividing the necessary staying time by the number of the modules mounted in the coater/developer. The number of the modules to be used is determined to be a value obtained by dividing the necessary staying time by the cycle limiting time or a nearest integer to which the value is raised.
    Type: Grant
    Filed: October 9, 2008
    Date of Patent: September 13, 2011
    Assignee: Tokyo Electron Limited
    Inventors: Akira Miyata, Masanori Tateyama
  • Publication number: 20110174219
    Abstract: A mole delivery system and method provide pulses of known molar quantities as a function of the time duration of each pulse, which in turn is derived as a function of the ideal gas law. In one embodiment of the system, the system comprises: a chamber of known volume and controlled and known temperature; a pressure sensor to measure the pressure in the chamber; an outlet valve to a process tool; an inlet valve to charge the chamber with the delivery gas; and a control system configured and arranged so as to control the operation of the outlet valve, control the amount of each gas pulse by controlling the timing of the valve to the process tool.
    Type: Application
    Filed: January 19, 2010
    Publication date: July 21, 2011
    Inventor: Paul Meneghini
  • Publication number: 20110135820
    Abstract: After a solvent is discharged onto a substrate in a period from a time point t0 to a time point t1, rotation of the substrate is started at a time point t2. A resist liquid is discharged onto a center portion of a target surface of the substrate at a time point t3. A rotation speed of the substrate starts to decrease at a time point t4, and attains a first speed after a certain period of time. The discharge of the resist liquid is stopped at a time point t5. The rotation of the substrate is accelerated in a period from a time point t6 to a time point t7, and the rotation speed of the substrate attains a second speed at the time point t7. The rotation of the substrate is decelerated in a period from the time point t7 to a time point t8, and the rotation speed of the substrate attains a third speed at the time point t8.
    Type: Application
    Filed: October 6, 2010
    Publication date: June 9, 2011
    Inventors: Masanori IMAMURA, Akihiro HISAI, Hidetoshi SAGAWA
  • Publication number: 20110120371
    Abstract: Embodiments of the present system and method are useful for chemical deposition, particularly continuous deposition of thin films. Disclosed systems typically comprise a micromixer and a microchannel applicator. A deposition material or materials is applied to a substrate, such as an oxidized silicon substrate, a flexible substrate useful for forming flexible devices, such as flexible transistors, and combinations of different substrates. Uniform and highly oriented surface morphologies of films deposited using disclosed embodiments are clearly improved compared to films deposited by a conventional batch process. The process can be used to tailor the composition and morphology of the material deposited on a substrate. The present process can be used at low temperatures as a post-deposition, high-temperature annealing step is obviated.
    Type: Application
    Filed: November 22, 2010
    Publication date: May 26, 2011
    Inventor: Chih-hung Chang
  • Publication number: 20110052794
    Abstract: A method for vapor-phase growth of a thin film by introducing into a reaction chamber a raw material gas wherein a dilute impurity gas, having a mixture of impurity gas of which the flow-rate is controlled by a first flow-rate controlling mechanism and diluting gas of which the flow-rate is controlled by a second flow-rate controlling mechanism, of which mixture the flow-rate is controlled by a third flow-rate controlling mechanism is mixed with a main gas of which the flow-rate is controlled by a fourth flow-rate controlling mechanism, and vapor-phase growth is carried out by supplying the raw material gas to the reaction chamber while changing continuously and simultaneously with arithmetic control the flow-rates of the gases flowing through said first, second and third flow-rate controlling mechanisms so that the resistivity distribution is controlled and a required resistivity profile is achieved in the thickness direction of the thin film.
    Type: Application
    Filed: April 22, 2009
    Publication date: March 3, 2011
    Applicant: SHIN-ETSU HANDOTAI CO., LTD.
    Inventor: Toru Yamada
  • Publication number: 20110017137
    Abstract: A patch application system is provided comprising a powder application booth. The powder application booth comprises a powder block to temporarily house the powder prior to ejection, a nozzle insert to guide the powder onto the screw, a support stand to adjust the powder block to the appropriate position relative to the screw for a desired patch location and size, a powder cup to deliver the powder to the powder block. A programmable logic controller electronically coupled to the micro air-switch valve controls the duration the air-switch valve remains open. The entire process may be automated by including a screw hopper to temporarily store a plurality of screws, a bowl feeder receiving the screws and delivering the screws to a rotating disk, wherein the rotating disk passes the screws through a heating element and presents the heated screws to the powder application booth.
    Type: Application
    Filed: October 6, 2010
    Publication date: January 27, 2011
    Inventor: Terry J. Rowley
  • Patent number: 7840303
    Abstract: An apparatus for performing a coating weight control calculation and an apparatus for generating an activation timing of each process in coating weight control are separately managed. A strip welding point pass event, a completion event of scan measurement of a steel strip in a width direction by a coating weight gauge, and a constant period event are related respectively to activation timings of preset control, feedback control and feedforward control respectively of a coating weight. In a coating weight control apparatus and method, the activation timing generation apparatus is equipped with a function of calculating a timing of changing a pressure reference avoiding insufficient coating in accordance with response characteristics of a pressure as an operation terminal, and if a target coating weight is changed from thin coating to thick coating, generating a preset control activation reference in accordance with the calculation result.
    Type: Grant
    Filed: July 26, 2007
    Date of Patent: November 23, 2010
    Assignee: Hitachi, Ltd.
    Inventor: Masahiro Kayama