Abstract: A method for vapor-phase growth of a thin film by introducing into a reaction chamber a raw material gas wherein a dilute impurity gas, having a mixture of impurity gas of which the flow-rate is controlled by a first flow-rate controlling mechanism and diluting gas of which the flow-rate is controlled by a second flow-rate controlling mechanism, of which mixture the flow-rate is controlled by a third flow-rate controlling mechanism is mixed with a main gas of which the flow-rate is controlled by a fourth flow-rate controlling mechanism, and vapor-phase growth is carried out by supplying the raw material gas to the reaction chamber while changing continuously and simultaneously with arithmetic control the flow-rates of the gases flowing through said first, second and third flow-rate controlling mechanisms so that the resistivity distribution is controlled and a required resistivity profile is achieved in the thickness direction of the thin film.

Abstract: A patch application system is provided comprising a powder application booth. The powder application booth comprises a powder block to temporarily house the powder prior to ejection, a nozzle insert to guide the powder onto the screw, a support stand to adjust the powder block to the appropriate position relative to the screw for a desired patch location and size, a powder cup to deliver the powder to the powder block. A programmable logic controller electronically coupled to the micro air-switch valve controls the duration the air-switch valve remains open. The entire process may be automated by including a screw hopper to temporarily store a plurality of screws, a bowl feeder receiving the screws and delivering the screws to a rotating disk, wherein the rotating disk passes the screws through a heating element and presents the heated screws to the powder application booth.

Abstract: An apparatus for performing a coating weight control calculation and an apparatus for generating an activation timing of each process in coating weight control are separately managed. A strip welding point pass event, a completion event of scan measurement of a steel strip in a width direction by a coating weight gauge, and a constant period event are related respectively to activation timings of preset control, feedback control and feedforward control respectively of a coating weight. In a coating weight control apparatus and method, the activation timing generation apparatus is equipped with a function of calculating a timing of changing a pressure reference avoiding insufficient coating in accordance with response characteristics of a pressure as an operation terminal, and if a target coating weight is changed from thin coating to thick coating, generating a preset control activation reference in accordance with the calculation result.

Abstract: A method for finishing a surface of a metal component is carried out in a receptacle containing a quantity of non-abrasive media. The component is at least partially immersed in the media and a quantity of active finishing chemistry is supplied. The chemistry forms a relatively soft conversion coating on the surface. By inducing high energy relative movement between the surface and the media the coating can be continuously removed. The method may be carried out in a drag finishing machine.

Abstract: A line striper 10 is equipped with additional features: including a speed/distance sensor 1 delivering high resolution and recognizing reverse movement. Also included is a built in programmable control 2 for setting parking stall or road line parameters including a measuring system. A device 3 applies paint marks (dots), or equivalent onto a surface. The striper 10 can hold a paint can 5 as a means of marking. An electrical thumb switch 4 is provided at the left handle bar. A speed compensating control provides intelligence to advance and retard the timing of actuation of the dot marking apparatus providing accuracy at any speed or direction.

Abstract: A plasma processing apparatus is provided with a replacement time detecting unit, which detects the status of residual charges which attract a semiconductor wafer and detects a time when an electrostatic chuck is to be replaced, at a time when a direct voltage application from a direct current source is stopped and the semiconductor wafer is brought up from the electrostatic chuck.

Abstract: A microdeposition system and method includes a head with a plurality of nozzles. A controller generates nozzle firing commands that selectively fire the nozzles to create a desired feature pattern. Configuration memory stores voltage waveform parameters that define a voltage waveform for each of the nozzles. A digital to analog converter (DAC) sequencer communicates with the configuration memory and the controller and outputs a first voltage waveform for a first nozzle when a nozzle firing command for the first nozzle is received from the controller. A resistive ladder DAC receives the voltage waveforms from the DAC sequencer. An operational amplifier (opamp) communicates with the resistive ladder DAC and amplifies the voltage waveforms. The nozzles fire droplets when the voltage waveforms received from the opamp exceed a firing threshold of the nozzle.

Abstract: A thin-film phosphor layer can be formed by an improved deposition method involving: (1) forming a phosphor powder layer that is substantially uniformly deposited on a substrate surface; and (2) forming a polymer binder layer to fill gaps among loosely packed phosphor particles, thereby forming a substantially continuous layer of thin film.

Abstract: Methods and apparatus for generating electronic records of marking operations for underground facilities/utilities. Electronic records of marking information may be logged/stored in local memory of a marking device, formatted in various manners, processed and/or analyzed at the marking device itself, and/or transmitted to another device (e.g., a remote computer/server) for storage, processing and/or analysis. In one example, multiple pieces of geo-location data (e.g., from a GPS receiver) are collected and logged per actuation of a marking device (e.g., a trigger-pull to dispense marking material). A computer-generated image or other visual representation of the marking operation may be electronically rendered in a display field based on logged marking information, essentially in real time as the marking operation is conducted, and/or recreated thereafter based on one or more stored electronic records.

Abstract: A plasma of a gas containing an impurity is produced through a discharge in a vacuum chamber, and a plurality of substrates are successively doped with the impurity by using the plasma, wherein a plasma doping condition of a subject substrate is adjusted based on an accumulated discharge time until the subject substrate is placed in the vacuum chamber.

Abstract: A method for forming a resin film is provided in which a liquid material is cured by shifting irradiation of light from a central side to an outer circumferential side of a substrate during or after spreading a liquid material on the substrate by rotation, in which the light is annular, and an inner diameter and an outer diameter of the annular light are increased concentrically in relation to a central axis of rotation as irradiation time progresses, so that the annular light shifts from the central side to the outer circumferential side of the substrate.

Abstract: A film of uniform thickness can be formed on the entire surface of a substrate. A processing solution supply apparatus includes: a nozzle provided with a supply hole for discharging a plating solution toward a processing surface of a substrate held in a substantially horizontal direction; a temperature controller for accommodating therein the plating solution in an amount necessary for processing a preset number of substrates, for controlling a temperature of the accommodated plating solution up to a preset temperature; a heat insulator disposed between the nozzle and the temperature controller, for maintaining the plating solution, whose temperature has been controlled by the temperature controller, at the preset temperature; and a transporting mechanism for transporting the plating solution, whose temperature has been controlled up to the preset temperature by the temperature controller, toward the supply hole of the nozzle via the heat insulator.

Abstract: In a plasma reactor employing source and bias RF power generators, plasma is stabilized against an engineered transient in the output of either the source or bias power generator by a compensating modulation in the other generator.

Abstract: A method is disclosed for scraping a roll surface rotating in a molten metal coating process comprising traversing a support assembly to one side, lifting the arms attached to said the assembly to a fully retracted position to disengage scraper blades from contact with a roll surface; initiating a scrape cycle by means of a trigger signal; lowering the arms and scraper blades in the mid-point of the sink roll; increasing the pressure reference from lifting pressure to approximately zero; energizing one or more directional valves; increasing the pressure value gradually to a preselected pressure; extending the cylinder in a controlled manner to engage the scraper head gently on to the sink roll; moving the engaged scraping head at controlled, predetermined speed from the sink roll mid point to the fully traversed out position; stopping the traversing means upon reaching the fully traversed out portion; and lifting the scraper head from the roll surface by removing pressure from the cylinder; then repeating the

Abstract: Described is a method for manufacturing a display including a substrate on which a structure, such as, for instance, a matrix structure in relief, is provided, which structure bounds a number of areas, wherein, with the aid of an inkjet printhead, substantially in each area an amount of liquid is deposited, wherein with the aid of at least one sensor a measurement is performed on the substrate to determine the position of a respective area, and on the basis of the thus determined position the printhead is controlled to deliver an amount of liquid at the correct place. Also described is an apparatus for carrying out the method, a substrate for use in the method and a display obtained with the method.

Abstract: A method and an apparatus for manufacturing a semiconductor wafer are provided for improving a quality of the semiconductor wafer, and further, for improving a quality of a semiconductor device manufactured by using the semiconductor wafer, by preventing warping from being generated at a stage of a placing step, at the time of performing heat treatment to a semiconductor wafer substrate. The placing process is performed by a placing means so that a time when a temperature difference between a wafer front surface temperature and a wafer rear surface temperature becomes maximum, and a time when warping is generated in the wafer are prior to a time when the wafer is brought into contact with lift pins or a susceptor (i.e., a time after the temperature is at an upper limit value of an infrared temperature region at 600° C.), and the lift pins are brought into contact with the wafer rear surface.

Abstract: An operating method is disclosed for a processing system that comprises multiple process modules each adapted to perform substantially the same process upon a substrate. During process module conditioning as a preparatory step for executing a required process recipe, each time one process module completes conditioning, successive transfer of unprocessed substrates from a cassette to the process module is started on an associated substrate transfer route, and successive processes that use the process module are started for the unprocessed substrates. The processing system can be operated efficiently, even if the nonuniformity of the conditioning time required exists between process modules of the same specifications.

Abstract: Sprinkling head (2) for sprinkling powder (4) on a glass plate (6). The sprinkling head comprises a frame (8) and one or more delivering devices (16) for delivering a powder to the transparent plate. The one or more delivering devices are mechanically coupled to the frame and comprise: a container (17) for containing a pigmented powder; an outlet unit (20) for delivering the power onto the transparent plate, the outlet unit comprising an opening (22) through which the powder is delivered onto the transparent plate; a vibratable feed channel (26) for feeding the powder from the container to the outlet unit when the feed channel is in a vibrational state, in which state the feed channel vibrates with respect to the frame so that the powder is sprinkled, via the opening, onto the plate, and an actuator (28) for bringing the feed channel into the vibrational state.

Abstract: In a method for using a film formation apparatus for a semiconductor process, process conditions of a film formation process are determined. The process conditions include a preset film thickness of a thin film to be formed on a target substrate. Further, a timing of performing a cleaning process is determined in accordance with the process conditions. The timing is defined by a threshold concerning a cumulative film thickness of the thin film. The cumulative film thickness does not exceed the threshold where the film formation process is repeated N times (N is a positive integer), but exceeds the threshold where the film formation process is repeated N+1 times. The method includes continuously performing first to Nth processes, each consisting of the film formation process, and performing the cleaning process after the Nth process and before an (N+1)th process consisting of the film formation process.

Abstract: A patch application system is provided comprising a powder application booth. The powder application booth comprises a powder block to temporarily house the powder prior to ejection, a nozzle insert to guide the powder onto the screw, a support stand to adjust the powder block to the appropriate position relative to the screw for a desired patch location and size, a powder cup to deliver the powder to the powder block. A programmable logic controller electronically coupled to the micro air-switch valve controls the duration the air-switch valve remains open. The entire process may be automated by including a screw hopper to temporarily store a plurality of screws, a bowl feeder receiving the screws and delivering the screws to a rotating disk, wherein the rotating disk passes the screws through a heating element and presents the heated screws to the powder application booth.

Abstract: An apparatus for cyclical depositing of thin films on semiconductor substrates, comprising a process chamber having a gas distribution system with separate paths for process gases and an exhaust system synchronized with operation of valves dosing the process gases into a reaction region of the chamber.

Abstract: A system and method which implements a preferred embodiment of the present invention detects the endpoint of a process by monitoring changes in chamber pressure in real time. The endpoint of a process may be detected for processes that produce measurable changes in chamber pressure. For example, chemical reactions conducted within the chamber, such as during a cleaning process, may result in changes to chamber pressure. As the chamber is cleaned, the chamber pressure is maintained using an evacuation conductance modulating device, such as a throttle valve, to prevent gaseous by-products of the cleaning process from changing the chamber pressure. As the cleaning process progresses, less contaminants exist and less by-product evolves. As a result, if the throttle valve position is held constant, then variables, such as a decrease in the rate of change in chamber pressure, can be used to detect the endpoint of the process.

Abstract: A coating process method in which a coating liquid is discharged onto the surface of a target substrate to be processed while rotating the target substrate so as to expand the coating liquid radially outward on the target substrate and, thus, to form a coated film comprises the step of detecting that the actual discharging of a coating liquid from a coating liquid discharging nozzle is started, and the step of controlling based on a signal of the detection at least one of the driving timing of a pump for allowing the coating liquid to be discharged from the coating liquid discharging nozzle, the operation timing of a valve mounted to a pipe for supplying the coating liquid into the coating liquid discharging nozzle, and the rotation starting or stopping timing of the target substrate.

Abstract: A system and method for depositing films on a substrate is described. One embodiment includes a vacuum chamber; a split conductor housed inside the vacuum chamber; a magnetron configured to generate a power signal that can be applied to at least a portion of the split conductor; a power supply configured to provide a power signal to the magnetron, the power signal including a plurality of pulses; and a pulse control connected to the power supply, the pulse control configured to control the duty cycle of the plurality of pulses, the frequency of the plurality of pulses, and the contour shape of the plurality of pulses.

Abstract: A microdeposition system (20) and method includes a head with a plurality of nozzles (230). A controller (22) generates nozzle firing commands that selectively fire the nozzles to create a desired feature pattern. Configuration memory stores voltage waveform parameters that define a voltage waveform (280) for each of the nozzles. A digital to analog converter (DAC) sequencer communicates with the configuration memory and the controller and outputs a first voltage waveform for a first nozzle when a nozzle firing command for the first nozzle is received from the controller (22). A resistive ladder DAC receives the voltage waveforms from the DAC sequencer. An operational amplifier (opamp) communicates with the resistive ladder DAC and amplifies the voltage waveforms. The nozzles fire droplets when the voltage waveforms received from the opamp exceed a firing threshold of the nozzle (230).

Abstract: The present invention aims to provide a viscous fluid application device which allows improving manufacturing efficiency of semiconductor packages without deteriorating application position accuracy and decreasing designing flexibility. The device includes: an application unit (101) which applies viscous fluid to a substrate 140a; an application head (100) having a supply unit (102) which supplies the viscous fluid to the application unit (101); an X axis unit (110); a Y axis unit (120); a Z axis unit (130); a substrate carrying unit (140); a head height detection sensor (150); and a control unit (160). The supply unit (102) moves in the Y direction in cooperation with a movement in the Y direction of the application unit (101), and remains unmoved irrespective of a movement in the X and Z direction of the application unit (101).

Abstract: An apparatus and method for measuring an amount of condensable material which outgas during cure of organic thin films. The apparatus includes a hotplate placed in a chamber having a removeable liner and means for cooling the liner. The method includes: weighing the liner, sequentially placing multiple substrates on said hotplate, and then weighing the liner again.

Abstract: A heat treatment apparatus and method for curing a layer of a processable material on a substrate. The apparatus includes a residual gas analyzer that communicates with a process space in which the layer is heated to cure the processable material. A controller, which is electrically connected to the residual gas analyzer, is operable to adjust a bake time for the layer in relation to a concentration of a gas species evolved from the processable material.

Abstract: The invention is based on the object of reducing the heating of substrates during plasma enhanced chemical vapor deposition. For this purpose, a method and an apparatus for coating substrates by means of plasma enhanced vapor deposition are provided, in which at least part of the surroundings of the substrate surface of a substrate to be coated is evacuated and a process gas with a starting substance for the coating is admitted, wherein the coating is deposited by a plasma being ignited by radiating in electromagnetic energy in the surroundings of the substrate surface filled with the process gas.

Abstract: A coating apparatus includes a container and a perforated plate separating a plenum from a coating chamber. A gas supply system delivers a gas to the plenum in a sufficient amount for passage of the gas through the plate and suspension of a powder in a fluidized condition in the chamber. The gas supply system preferably includes a primary portion for continuously delivered gas and a controllable pulsing portion for supplementing the gas from the primary portion. In a first mode of operation, the gas from the pulsing portion is cycled to provide variation in the fluidized volume. In a second mode, the pulsing portion delivers relatively long pulses of gas to mix the fluidized powder.

Abstract: An apparatus for performing a coating weight control calculation and an apparatus for generating an activation timing of each process in coating weight control are separately managed. A strip welding point pass event, a completion event of scan measurement of a steel strip in a width direction by a coating weight gauge, and a constant period event are related respectively to activation timings of preset control, feedback control and feedforward control respectively of a coating weight. In a coating weight control apparatus and method, the activation timing generation apparatus is equipped with a function of calculating a timing of changing a pressure reference avoiding insufficient coating in accordance with response characteristics of a pressure as an operation terminal, and if a target coating weight is changed from thin coating to thick coating, generating a preset control activation reference in accordance with the calculation result.

Abstract: The purging of photoresist from a supply device of semiconductor coating equipment is automatically executed in a controlled manner. The equipment employs a plurality of photoresist bottles for storing the same kind of photoresist. A plurality of supply pipes are respectively connected to the photoresist bottles, respectively. A valve system selectively opens and closes the supply pipes in response to control signals generated by a main controller. A dispense pump forces the photoresist in the open supply pipe through a nozzle. A purge start button issues a purge start command signal to the controller when the button is pressed. The controller then controls the valve system and the dispense pump so as to automatically purge the photoresist according to a sequence effected using a timer.

Abstract: A plasma processing device comprising a gas injection system is described, wherein the gas injection system comprises a gas injection assembly body, a consumable gas inject plate coupled to the gas injection assembly body, and a pressure sensor coupled to a gas injection plenum formed by the gas injection system body and the consumable gas inject plate. The gas injection system is configured to receive a process gas from at least one mass flow controller and distribute the process gas to the processing region within the plasma processing device, and the pressure sensor is configured to measure a gas injection pressure within the gas injection plenum. A controller, coupled to the pressure sensor, is configured to receive a signal from the pressure sensor and to determine a state of the consumable gas inject plate based upon the signal.

Abstract: In drying a coating liquid such as a resist applied to a substrate under reduced pressure, a coating film in a peripheral portion tends to lose good shape regardless of duration of a drying period, and it is difficult to set an appropriate exhaust flow rate. After the substrate is loaded in an airtight container, a pressure is reduced from atmospheric pressure to a pressure slightly higher than the vapor pressure of a solvent, for example. Then, the solvent actively evaporates from the coating liquid. Here, evacuation is performed initially based on a first flow rate set value Q1, and thereafter, it is performed based on a second flow rate set value larger than Q1. Rounding of the surface in the peripheral portion is corrected by evacuation based on Q1, and more active evaporation of a solvent component is attained by switching to Q2.

Abstract: The purging of photoresist from a supply device of semiconductor coating equipment is automatically executed in a controlled manner. The equipment employs a plurality of photoresist bottles for storing the same kind of photoresist. A plurality of supply pipes are respectively connected to the photoresist bottles, respectively. A valve system selectively opens and closes the supply pipes in response to control signals generated by a main controller. A dispense pump forces the photoresist in the open supply pipe through a nozzle. A purge start button issues a purge start command signal to the controller when the button is pressed. The controller then controls the valve system and the dispense pump so as to automatically purge the photoresist according to a sequence effected using a timer.

Abstract: A polyimide processing tool for coating polyimide on a semiconductor wafer is provided with a pause time monitoring means for monitoring the duration of the polyimide processing tool's wafer-transfer robot's pause time. The wafer-transfer robot transfers wafers from polyimide apply tool to polyimide cure bake oven and monitoring the duration of the pause helps prevent undesirably long pauses between polyimide apply of the uncured polyimide and the curing step.

Abstract: A mass transfer system offers the simultaneous transfer and time-saving efficiencies transfer techniques, while also offering the flexibility of prior-art free techniques. A mass transfer mechanism and an associated software control mechanism are equipped with the ability to retract a plurality of lifting arms (6), in a manner so select which of the processing stages (2) the lifting arms (6) will address for each transfer step, while omitting those steps for which transfer is not yet required.

Abstract: A coated film forming method is capable of readily forming a coated film of a thermoplastic material on a coated region of an inner peripheral surface of a cylinder. A nozzle, through which a molten paste of a thermoplastic material kept molten is discharged, is disposed toward an inner peripheral surface of a cylinder. The nozzle is moved along a rotational central line of the cylinder while rotating the cylinder and discharging the molten paste from the nozzle. Centrifugal force acting on the cylinder being rotated leads to spreading of the molten paste applied to the inner peripheral surface of the cylinder. Viscosity of the molten paste, a rotational speed of the cylinder and a speed of movement of the nozzle are set so as to keep the molten paste discharged from the nozzle from being scattered to a region other than the coated region.

Abstract: A sensor, such as a mass spectrometer, capable of detecting the presence of materials in a sampled gas is interconnected with a processing chamber of a vacuum manufacturing tool. The sensor includes a timing circuit which is activated only if certain levels of specific materials are detected. Furthermore, the timer is set to run a predetermined time interval after activation so as to discriminate between known transient processing conditions and the presence of impurities which can greatly influence the manufacturing process. When the timer exceeds the predetermined time duration, an output signal can alert the process operator or automatically shutdown the manufacturing tool.

Abstract: A coating apparatus for applying a coating liquid to a printing substrate. The apparatus includes a rotatable first roll, and a rotatable second roll positioned adjacent to the first roll and defining with the first roll a first nip through which the printing substrate passes. The apparatus also has a metering device for applying a layer of coating liquid onto the second roll, which in turn transfers the coating liquid to the printing substrate. The apparatus further has a controller that communicates with at least the second roll, wherein the controller performs the steps of determining whether the idle time of the second roll is longer than a predetermined threshold, setting a pre-spin flag if the idle time of the second roll is longer than a predetermined threshold, and directing the second roll to perform a pre-spin upon the presence of the pre-spin flag.

Abstract: In the chemical vapor deposition apparatus, a substrate stage for mounting a substrate is provided inside a reaction chamber of the apparatus. A source gas inlet for introducing a source gas and exhaust outlets and for exhausting the source gas are provided. Exhaust outlet valves provided for exhaust outlets are open and shut successively with time. The direction of the flow of source gas relative to the fixed substrate varies with time. The present chemical vapor deposition apparatus allows the improved evenness of film thickness, the composition ratio, and the like within the substrate surface as well as the reduction of particles of foreign substance generated inside the reaction chamber.

Abstract: A method of preventing tar, asphalt and related material from sticking to paving equipment involves spraying a release agent concentrate diluted with water contemporaneously with spraying, utilizing a carbonator pump capable of about 1 gallon per minute pumping rate at about 200 psi, an appropriately-sized motor, a pushbutton momentary contact switch, a timing relay capable of switching the motor on and running it for about 1-2 minutes, a spray gun and appropriately-sized nozzle, appropriate fittings and hoses, and such optional ancillary devices as solenoid valves, particulate screens and freeze protection. The major advantages of the instant invention are that it is simple and economical to build, very robust, and is capable of delivering a good spray pattern at relatively high concentrations of viscous release agents.

Abstract: The invention relates to a method and apparatus for growing a thin film onto a substrate, in which method a substrate placed in a reaction space (21) is subjected to alternately repeated surface reactions of at least two vapor-phase reactants for the purpose of forming a thin film. According to the method, said reactants are fed in the form of vapor-phase pulses repeatedly and alternately, each reactant separately from its own source, into said reaction space (21), and said vapor-phase reactants are brought to react with the surface of the substrate for the purpose of forming a solid-state thin film compound on said substrate. According to the invention, the gas volume of said reaction space is evacuated by means of a vacuum pump essentially totally between two successive vapor-phase reactant pulses.

Abstract: An apparatus for applying a coating solution to a surface of a substrate to form a coating film of desired thickness thereon. The apparatus includes a rotary supporting device for supporting and spinning the substrate in horizontal posture, a solvent spraying device for spraying a solvent to the substrate, a coating solution supplying device for supplying the coating solution to the substrate, a storage device for storing a processing program stipulating varied points and periods of time, a timer acting as a reference for each point or period of time stored in the storage, and a controller operable to perform controls based on the points and periods of time and with reference to the timer.

Abstract: A method for controlling spacer width in a semiconductor device is provided. A substrate having a gate formed thereon is provided. An insulative layer is formed over at least a portion of the substrate. The insulative layer covers the gate. The thickness of the insulative layer is measured. A portion of the insulative layer to be removed is determined based on the measured thickness of the insulative layer. The portion of the insulative layer is removed to define a spacer on the gate. A processing line for forming a spacer on a gate disposed on a substrate includes a deposition tool, a thickness metrology tool, and automatic process controller, and a spacer etch tool. The deposition tool is adapted to form an insulative layer over at least a portion of the substrate. The insulative layer covers the gate. The thickness metrology tool is adapted to measure the thickness of the insulative layer.

Abstract: To provide a coating apparatus which is capable of making short a lag time up to action of a valve and making operate a discharging pump and a valve with the best timing. By employing electric-air regulators ER1 and ER2 of small size and high response speed as a speed controller for controlling a switching speed of a switching valve AV or a suck-back valve SV, total flowing course is made short, thereby a time lag up to operation of a valve is made short. Further, by detecting the pressure of a resist liquid being discharged from a discharging pump 120 by a pressure sensor 123, and by controlling the operation of each device of a discharging pump 120, a switching valve AV, and a suck-back valve SV through a controller 180, a discharging pump 120, a switching valve AV, and a suck-back valve SV can be operated with the best timings, and generation of particles due to dripping of a resist liquid at a tip end of a resist nozzle 60 is prevented from occurring.

Abstract: A method for making an aerogel film includes the steps of performing a gelation reaction of a metal alkoxide on a substrate to prepare a substrate with a wet-gel film, and converting the wet-gel film into an aerogel film by a supercritical or sub-critical drying process of the substrate with the wet-gel film, wherein the degree of gelation of the wet-gel film is controlled to be a predetermined value at the start of the supercritical or sub-critical drying process. Aerogel films having uniform qualities are produced by the supercritical or sub-critical drying process in one lot.

Abstract: An apparatus and method for controlling the opening of a solenoid actuated valve in a sealant dispensing gun are disclosed. A proximity sensor is provided adjacent a portion of the needle valve stem in order to sense when the needle valve has reached its open position. A dispense timer is initiated when the proximity sensor indicates that the needle valve has reached its open position. In this manner, the needle valve may be maintained in its open position for the desired dispense time only without regard to the response time of the solenoid device. Also disclosed is an apparatus and method for adjusting the valve open limit of a sealant dispensing device which incorporates a solenoid or motor actuated valve open limit device. A flow sensor is located in-line with the sealant supply path of a dispensing gun in order to monitor the dispense weight during each valve open cycle. A moving average of the dispense rates may then be calculated and compared to predetermined limits.

Abstract: An apparatus for applying a coating to the head-shank junction of externally threaded fasteners in an automated fashion. The fasteners are positioned, head down, on rotating part holders positioned about the periphery of a rotating disc. The part holders may be magnetic or other forms, and are adapted to maintain the fasteners in a generally fixed position during their movement. The fasteners are pre-heated at a heating station during their rotational movement on the disc. A dispenser is then used to apply the coating to the articles, in timed sequence to the movement of the articles. In this fashion, a coating can be applied to selected portions of the entire periphery of the head-shank junction. A method for applying a coating to the head-shank junction of externally threaded fasteners in an automated fashion also forms part of the present invention.

Abstract: A powder coating system for difficult to handle powders includes a powder hopper containing fluidized powder particles, a pump body connected to the hopper and having an inlet in communication with the hopper, an ejector nozzle mounted to the pump body and aimed at an outlet thereof, a second nozzle mounted to the pump body and aimed at the inlet thereof and a powder application device for receiving powder particles from the outlet of the pump body and spraying them onto an article to be coated. The ejector nozzle sprays pressurized air toward the outlet to transport powder particles along a flow path which extends from the powder hopper into the pump body via the inlet and then out of the pump body via the outlet. The second nozzle sprays air pulses at the inlet in a direction opposite the particle flow along the flow path caused by the ejector nozzle. This spray from the second nozzle creates microvibrations in the inlet of the pump body to eliminate powder particle adherence and cohesion thereat.