Endless Patents (Class 125/21)
  • Patent number: 11389984
    Abstract: A cutting device of cutting a soft honeycomb mold body in a cutting direction perpendicular to an axial direction of the honeycomb mold body. A cutting device has a wire, a tension supply part and a pair of ultrasonic generators. The wire has a contact part which is stretched and in contact with the honeycomb mold body when the honeycomb mold body is cut. The tension supply part supplies tensile to the contact part when the honeycomb mold body is cut. The pair of ultrasonic generators have respective vibrator terminals arranged in contact with the contact part of the wire. The ultrasonic generators generate ultrasonic vibration in the cutting direction and supply the generated ultrasonic vibration directly to the wire.
    Type: Grant
    Filed: October 9, 2019
    Date of Patent: July 19, 2022
    Inventors: Itaru Kusano, Kazuhisa Ishimura, Masahiko Natsume, Kenichiro Naka
  • Patent number: 11260492
    Abstract: An apparatus (10) for machining a workpiece (12) comprises at least two machining elements (14a, 14b) and a rotating belt (16) for moving the machining elements (14a, 14b) relative to a workpiece (12) to be machined. The machining elements (14a, 14b) each comprise a main body (20a, 20b) and a first connecting element (22a, 22b) connected to the main body (20a, 20b), which first connecting element is connectable to a second connecting element (24a, 24b) complementary to the first connecting element (22a, 22b) and connected to the belt (16). The first connecting element (22a, 22b) comprises a rotary body (26a, 26b). The second connecting element (24a, 24b) has a connection area (28a, 28b) for connection with the rotary body (26a, 26b). When the rotary body (26a, 26b) is rotated in a first rotary direction (R1) the rotary body (26a, 26b) is connected to the connection area (28a, 28b).
    Type: Grant
    Filed: June 15, 2016
    Date of Patent: March 1, 2022
    Inventor: Georg Weber
  • Patent number: 10799967
    Abstract: In various aspects, the diamond wire saw apparatus disclosed herein includes a frame formed in a U-shape from a first rail and a second rail secured to a base, the first rail and the second rail being parallel to one another and perpendicular to the base. Several pulleys are disposed about the frame, and a diamond wire is engaged with the several pulleys to be cycled about the several pulleys. Some of the several pulleys traverse portions of the frame in opposing directions to maintain a selected tension in the diamond wire as the diamond wire is advanced while being cycled to cut a workpiece releasably engaged with the frame. The first rail, the second rail, and the base are formed in sections to be sized to correspondingly size an interior region of the frame to accommodate a workpiece by selective inclusion of sections in the first rail, the second rail, and the base.
    Type: Grant
    Filed: August 27, 2019
    Date of Patent: October 13, 2020
    Inventor: Nicholas J. T. Jenkins
  • Patent number: 10730152
    Abstract: There is provided a method of making a tool blade, in which a backing strip is provided, binding material in powder form is cascaded onto the backing strip, abrasive particles are provided and the binding material powder is heated by laser beam to form a binder layer which binds the abrasive particles to the backing strip. The laser beam is used to form discrete regions of binder layer as teeth. The binding material is typically braze material. A blade made according to the method is also provided.
    Type: Grant
    Filed: July 11, 2016
    Date of Patent: August 4, 2020
    Assignee: C4 Carbides Limited
    Inventors: Peter Nicolson, Jeremy Klein
  • Patent number: 10703015
    Abstract: A cutting bead (13) for a saw rope (15) comprises a geometrically defined cutting portion (2) and tapers from the geometrically defined cutting portion (2) contrary to a sawing direction. With such cutting beads (13), a saw rope (15) is formed. In a method for manufacturing a saw rope (15), a cutting element (1) with a geometrically defined cutting portion (2) and an abrasive element (6) with a geometrically undefined cutting portion (14) or a neutral element (8) are joined. With the cutting element (1) and the abrasive element (6) or the neutral element (8), a cutting bead (13) is formed. The cutting bead (13) is joined onto the support rope (16).
    Type: Grant
    Filed: December 11, 2017
    Date of Patent: July 7, 2020
    Inventors: Stefan Schwarte, Christoph Heise, Stefan Boehm
  • Patent number: 10596724
    Abstract: A workpiece holder for slicing the workpiece by a wire saw including a workpiece plate which is bonded and fixed to the workpiece through a pad plate, and a holder main body which supports the workpiece plate. The workpieces at an x axis direction and a direction vertical to the same is a y axis direction, the workpiece plate is bonded and fixed to the workpiece to correct a deviation of a crystal orientation axis of the workpiece in the x axis direction. The workpiece holder can adjust a tilt in the y axis direction of the workpiece by tilting the workpiece plate in the y axis direction. The workpiece holder can realize slicing an ingot conforming to specifications with rigorous orientation standards in an external setup manner without using a wire saw including an orientation adjustment mechanism for a single crystal ingot, and a method for slicing a workpiece.
    Type: Grant
    Filed: July 12, 2016
    Date of Patent: March 24, 2020
    Inventor: Shiroyasu Watanabe
  • Patent number: 10549401
    Abstract: A method of shaping a laminated glass structure comprising a flexible glass sheet having a thickness of no greater than about 0.3 mm laminated to a non-glass substrate by an adhesive layer is provided. The method includes cutting the laminated glass structure with an abrasive cutting jet including a pressurized cutting fluid and abrasive particles thereby forming a shaped laminated glass structure. A glass edge strength of a cut edge of the shaped laminated glass structure is at least about 20 MPa.
    Type: Grant
    Filed: April 29, 2015
    Date of Patent: February 4, 2020
    Inventors: Dominick John Forenz, Mark Lee Humphrey, Walter Jay McKendrick, Michael William Price, Gregg Lee Shugars
  • Patent number: 10526891
    Abstract: A device for cutting a block of stone that includes a support bar including a monolithic metallic plate. The device also includes a wear bar that is secured to the monolithic metallic plate and has a longitudinal slot, and a cutting belt positioned in the longitudinal slot of the wear bar and including a cutting surface to cut the stone. A method of cutting the stone is also disclosed.
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: January 7, 2020
    Assignee: Diamond Stone Technologies Inc.
    Inventors: Bryce Bennett, Gregory K. Smoot
  • Patent number: 10486333
    Abstract: A pressing head of the ingot slicing apparatus includes: a head main body in which a plurality of pneumatic supply ports configured to supply compressed air are formed so that pressure on each portion of the pressing head is separately controlled; pressing units installed on a lower end of the head main body, located to correspond to the pneumatic supply ports, and each configured to apply pressure to a side surface of an ingot by the compressed air supplied through each of the pneumatic supply ports; pneumatic correction units each installed on a lower surface of each of the pressing units and configured to control a pressure deviation between the plurality of pressing units; an adhesive plate installed to be in contact with lower side surfaces of the pneumatic correction units so that a lower surface of the adhesive plate is in direct contact with and presses the side surface of the ingot; and a coupling support unit configured to couple and support the head main body, the pressing units, the pneumatic corr
    Type: Grant
    Filed: July 10, 2017
    Date of Patent: November 26, 2019
    Assignee: SK Siltron Co., Ltd.
    Inventor: Su In Jeon
  • Patent number: 10431447
    Abstract: A polysilicon chip reclamation assembly includes a polysilicon cleaning apparatus configured to clean a plurality of bodies of polysilicon. Also included is a plurality of polysilicon chips generated from the bodies of polysilicon during cleaning thereof, wherein each of the plurality of polysilicon chips has a longest dimensional length ranging from 0.1 mm to 25.0 mm. Further included is a polysilicon apparatus drain line configured to route the plurality of polysilicon chips from the polysilicon cleaning apparatus to a main chip drain line, wherein the main chip drain line is oriented at a downward slope away from the polysilicon apparatus drain line. Yet further included is a fluid source fluidly coupled to the main chip drain line and configured to inject a fluid into the main chip drain line to drive the plurality of polysilicon chips through the main chip drain line.
    Type: Grant
    Filed: September 3, 2015
    Date of Patent: October 1, 2019
    Inventors: Jason L. Giardina, James C. Mundell, Nathaniel C. McIntee-Chmielewski
  • Patent number: 10399249
    Abstract: The wire saw device includes at least one wire, which is provided tightly to be capable of travelling in a direction crossing a workpiece to be cut, a workpiece holder, which is configured to hold the workpiece and to move the workpiece relative to the wire, slurry suppliers, which are configured to supply slurry to cut the workpiece from an upstream side in a travelling direction of the wire, and slurry collectors, which are configured to collect the slurry scattered due to contact with the workpiece. The slurry collector is configured to be movable in conjunction with the workpiece in the state where the slurry collector is disposed adjacent to the workpiece and also configured to be retractable with respect to the workpiece to be prevented from contacting the wire.
    Type: Grant
    Filed: May 11, 2016
    Date of Patent: September 3, 2019
    Inventors: Masaki Fukuda, Kazutaka Mizokami, Shinji Oota
  • Patent number: 10391673
    Abstract: A wire sawing apparatus of one embodiment comprises: a wire for cutting an ingot; an ingot conveyor unit for conveying the ingot to the wire; a nozzle for supplying slurry to the wire; and a dispersed slurry blocking unit disposed above the ingot sawed by the wire, so as to absorb at least a part of the slurry dispersed from the lateral sides of the ingot cut by the wire.
    Type: Grant
    Filed: January 7, 2016
    Date of Patent: August 27, 2019
    Assignee: SK SILTRON CO., LTD.
    Inventors: Ji Won Jeon, Sang Min An
  • Patent number: 10377053
    Abstract: A plurality of bushings are coupled to one another via a series of bolts to provide an interlocking, articulating cutter. The bolts have a cylindrical end and a convex end. The convex ends are seated inside a concave socket coupled to the bushings. The cylindrical ends are coupled to a convex nut seated inside another concave socket coupled to an adjacent bushing. The convex ends of the bolts are configured to articulate inside the seat of the concave sockets. A washer may be placed between the bushings to provide a desired amount of flexibility and/or rigidity. The outer surface of the bushing comprises a cutting structure, such as a milled or clad cutting structure.
    Type: Grant
    Filed: August 8, 2016
    Date of Patent: August 13, 2019
    Assignee: BISSO MARINE, LLC
    Inventors: William A. Bisso, IV, Tjerko Jurgens
  • Patent number: 10376972
    Abstract: Provided are a porous media bearing for a band saw, a band saw for cutting cant and a method of cutting cant using the band saw. The band saw has a continuous loop blade supported by a drive wheel and first and second support arms having porous media bearings. A location of a blade cutting section, an angle of the blade in relation to the cant being cut, and tension on the blade can be adjusted by moving the first and second support arms.
    Type: Grant
    Filed: February 15, 2018
    Date of Patent: August 13, 2019
    Inventor: Levi A. Pollard
  • Patent number: 10350788
    Abstract: Method for slicing a workpiece, including measuring a crystal axis orientation while holding a workpiece with a workpiece holder, setting the workpiece holder to a wire saw in such a manner that the measured crystal axis orientation is maintained, then adjusting a sliced plane orientation, pressing the workpiece against a wire row to slice the workpiece; the workpiece holder includes a portion slidable while holding the workpiece and a portion for fixing the slide portion, after measuring the crystal axis orientation, sliding the slide portion to move to the workpiece holder center in a manner that the measured crystal axis orientation is maintained, fixing the slide portion, setting the workpiece holder to the wire saw, then adjusting the sliced plane orientation, and slicing the workpiece. This enables an orientation measurement without limitation of distance between an orientation measuring instrument and plane to be measured can inhibit warpage deterioration and workpiece breakage.
    Type: Grant
    Filed: November 27, 2014
    Date of Patent: July 16, 2019
    Inventors: Atsuo Uchiyama, Hisakazu Takano, Masahito Saitoh, Hirotoshi Kouzu
  • Patent number: 10300628
    Abstract: A machine (12) for working slabs of natural stone, agglomerate or ceramic material comprises: a work bench (14) adapted to receive a slab to be machined; a machining head (16) comprising a spindle (18); and movement means (20) for moving the machining head (16) above the work bench (14). The spindle (18) comprises coupling means (40) which allow a diamond chain tool (42) to be operatively fixed.
    Type: Grant
    Filed: September 22, 2015
    Date of Patent: May 28, 2019
    Inventor: Dario Toncelli
  • Patent number: 10245661
    Abstract: A wire guide roll for use in wire saws for simultaneously slicing a multiplicity of wafers from a cylindrical workpiece is provided with a coating having a thickness of at least 2 mm and at most 7.5 mm of a material which has a Shore A hardness of at least 60 and at most 99, and which contains a multiplicity of grooves through which the sawing wire is guided, the grooves each having a curved groove base with a radius of curvature which is 0.25-1.6 times the sawing wire diameter, and an aperture angle of 60-130°. A multiplicity of wafers are simultaneously sliced from a cylindrical workpiece by a wire saw using such wire guide rolls.
    Type: Grant
    Filed: April 21, 2008
    Date of Patent: April 2, 2019
    Assignee: Siltronic AG
    Inventors: Anton Huber, Engelbert Auer, Manfred Schoenhofer, Helmut Seehofer, Peter Wiesner
  • Patent number: 10046405
    Abstract: The present invention relates to a wire cutting system and method for subsea cutting of large structures (6). The system includes two feeding towers (2) with feeding tower first ends secured into a seabed floor. A crossbeam (1) is located between the two feeding towers (2). Wire feeding trolleys (8) are connected to the feeding towers (2), whereby the wire feeding trolleys (8) are allowed to move a cutting distance along the feeding towers. A cutting wire (4) traverses between the wire feeding trolleys.
    Type: Grant
    Filed: November 26, 2015
    Date of Patent: August 14, 2018
    Assignee: Quanta Associates, L.P.
    Inventor: Harald Ramfjord
  • Patent number: 10011046
    Abstract: The present invention is a fixed-abrasive-grain wire including a core wire and abrasive grains fixed on a surface of the core wire, wherein an abrasive grain density is 1200 grains/mm2 or more, where the abrasive grain density is the number of the abrasive grains per unit area on the surface of the core wire, and 2% or less of all distances between centroids of the abrasive grains are equal to or shorter than an average circle equivalent diameter of the whole abrasive grains. There can be provided a fixed-abrasive-grain wire, a wire saw, and a method for slicing a workpiece that can suppress meandering of the fixed-abrasive-grain wire during slicing a workpiece and improve TTV and warp of wafers sliced from the workpiece.
    Type: Grant
    Filed: March 18, 2015
    Date of Patent: July 3, 2018
    Inventor: Tadahiro Kato
  • Patent number: 9987694
    Abstract: The present invention is a coping saw for performing a coping operation. The saw is operable in a first orientation for performing a first cut and in a second orientation for performing a coping second cut and comprises a handle having one or more power switches for activating and deactivating the drive system in both the first orientation and in the second orientation.
    Type: Grant
    Filed: February 6, 2017
    Date of Patent: June 5, 2018
    Inventor: Thomas J. Halsey
  • Patent number: 9931766
    Abstract: A method to make sawing beads by means of laser cladding is disclosed whereby metal matrix powder is molten by means of a laser beam on a rotating sleeve while diamonds are thrown in the molten metal pool. By carefully controlling the temperature of the molten metal pool at or above 1150° C. for less than 200 ms the internal graphitization of the diamonds can be limited. Although some of the diamonds in the sawing bead show internal graphitization it is demonstrated by the inventors that a sawing cord using the bead obtained by the method has an above standard sawing performance.
    Type: Grant
    Filed: April 2, 2014
    Date of Patent: April 3, 2018
    Assignee: NV BEKAERT SA
    Inventors: Jan Vaneecke, Tom Baekelandt, Roland Groenen
  • Patent number: 9766164
    Abstract: A sample preparation apparatus and method of preparing a rock sample using such an apparatus, as useful in connection with the digital numerical simulation of properties of the rock. The disclosed apparatus includes a fixably mounted diamond wire cutter. Three linear translation stages are coupled to a specimen holder. One of the translation stages moves the specimen in a direction parallel to the plane of the cutting wire. The other two translation stages move the specimen in different directions from one another, and when actuated together, advance the specimen into the wire for short distances in a direction out of the plane of the cutting wire. Short piecewise linear cuts are made in the specimen, to provide a sample of the desired shape with a small cross-section.
    Type: Grant
    Filed: October 8, 2015
    Date of Patent: September 19, 2017
    Assignee: BP Corporation North America Inc.
    Inventors: Dmitry Lakshtanov, Joanne Fredrich
  • Patent number: 9599253
    Abstract: A diamond wire saw and method provides a frame that includes a clamp that attaches to a target (e.g. piling, beam, tubular), an elongated toothed rack extending away from the mount and target, and a moving portion that carries the diamond wire and motor drives that advance the moving portion toward the target and along the toothed rack while driving the wire around roller guides.
    Type: Grant
    Filed: September 29, 2015
    Date of Patent: March 21, 2017
    Assignee: TETRA Technologies, Inc.
    Inventor: Galen R. Clark, II
  • Patent number: 9586254
    Abstract: A wire saw which has excellent cutting ability and which is not easily clogged by chips formed by cutting is provided. It has a body 6 having a first metal wire 1 which is made of a cobalt-based alloy, two second metal wires 2a and 2b which are made of a cobalt-based alloy, and three third metal wires 3a-3c which are made of a cobalt-based alloy and are wound on the first metal wire 1. The second metal wires 2a and 2b are helically wound on each of the third metal wires 3a-3c in opposite directions so as to cross each other. Cutting teeth are constituted by projections 8 which are formed by the crossing points of the two second metal wires 2a and 2b.
    Type: Grant
    Filed: October 17, 2012
    Date of Patent: March 7, 2017
    Assignee: TOKYO WIRE WORKS, LTD.
    Inventors: Hiroyoshi Yamada, Kazunari Mochizuki, Satoshi Shimura
  • Patent number: 9463041
    Abstract: Methods and apparatus are provided for selective surgical removal of tissue, e.g., for enlargement of diseased spinal structures, such as impinged lateral recesses and pathologically narrowed neural foramen. In some embodiments, a surgical tissue removal device includes a flexible elongate body that is adapted to conform with the target anatomy and a guidewire connector at the distal end region of the flexible elongate body configured to removably connect to the end of a guidewire so that the guidewire and flexible elongate body can be pulled distally. The body may have at least one blade edge, and the flexible elongate body may be a thin, flat, ribbon shaped flexible body that comprises a profile having a width that is substantially greater than a height.
    Type: Grant
    Filed: December 15, 2015
    Date of Patent: October 11, 2016
    Assignee: Amendia, Inc.
    Inventors: Jeffery L. Bleich, Edwin J. Hlavka, Vahid Saadat, David J. Miller, James R. Yurchenco
  • Patent number: 9457490
    Abstract: The invention relates to a wire saw having a saw wire drive sheave (2) for driving an endless saw wire, a motor having a motor output shaft directly or indirectly connected to the drive sheave (2) characterized in a at least one torsion suspension device (27), between the motor output shaft and the drive sheave (2), for dampening or absorbing torsion jerk/s to or from the endless saw wire (1).
    Type: Grant
    Filed: January 7, 2010
    Date of Patent: October 4, 2016
    Assignee: HUSQVARNA AB
    Inventors: Lars Öberg, Hiroshi Takeuchi
  • Patent number: 9346187
    Abstract: A method of manufacturing a silicon carbide substrate includes the steps of preparing an ingot of single crystal silicon carbide and obtaining a substrate by cutting the ingot. Then, in the step of obtaining a substrate, cutting proceeds in a direction ? in which an angle ? formed with respect to a <11-20> direction or a <1-100> direction of the ingot is 15°±5° in an orthogonal projection on a {0001} plane.
    Type: Grant
    Filed: May 31, 2012
    Date of Patent: May 24, 2016
    Inventor: Kyoko Okita
  • Patent number: 9248583
    Abstract: An abrasive article may include a substrate, a tacking film overlying the substrate, abrasive particles that may include a coating layer bonded to the tacking film such that a bond between the coating layer and the tacking film defines a metallic bonding region, and a bonding layer overlying the abrasive particles and the tacking film.
    Type: Grant
    Filed: December 30, 2011
    Date of Patent: February 2, 2016
    Assignees: Saint-Gobain Abrasives, Inc., Saint-Gobain Abrasifs
    Inventors: Yinggang Tian, Arup K. Khaund, Krishnamoorthy Subramanian, John Pearlman
  • Patent number: 9211634
    Abstract: An abrasive article including a substrate in the form of an elongated member having a core and a barrier layer in direct contact with an peripheral surface of the core. The barrier layer consists essentially of tin. A bonding layer is overlying the elongated substrate and abrasive particles are secured in the bonding layer.
    Type: Grant
    Filed: September 26, 2012
    Date of Patent: December 15, 2015
    Inventors: Paul W. Rehrig, Yinggang Tian, Arup K. Khaund
  • Patent number: 9079332
    Abstract: The present invention provides a method of resuming operation of a wire saw in which slicing of a workpiece is suspended and then resumed, including slicing the workpiece while detecting a traveling direction and a traveling speed of the reciprocating wire and recording them chronologically; and resuming the slicing while controlling the traveling direction and a traveling time in the traveling direction of the wire on a basis of a wire traveling history recorded until the suspending of the slicing of the workpiece such that the reciprocating cycle of the wire becomes continuous between before the suspending and after the resuming of the slicing of the workpiece. This method enables the slicing to be completed while the nanotopography of the sliced wafer is surely prevented from degrading, even when the slicing of the workpiece with a wire saw is suspended due to, for example, breaking of the wire.
    Type: Grant
    Filed: April 2, 2012
    Date of Patent: July 14, 2015
    Inventor: Koji Kitagawa
  • Publication number: 20150144120
    Abstract: The invention a fixed abrasive sawing wire comprising diamond particles held in a metallic retention layer on a steel wire. The steel wire has a diameter less than 300 ???. More than half of the diamond particles (102, 102?, 104, 104?, 104?, 104??) have a cubo-octahedral morphology as obtained in the diamond synthesis by high pressure at high temperature. 95% of the diamond particles have a size of 80 pm or less. The diamond particles predominantly show low elongation below or equal to 0.2 and are not obtained by crushing larger diamonds.
    Type: Application
    Filed: July 4, 2013
    Publication date: May 28, 2015
    Applicant: NV BEKAERT SA
    Inventors: Glauber Campos, José Spinnewyn
  • Patent number: 9028948
    Abstract: An abrasive article includes an elongated body, a bonding layer including a metal overlying a surface of the elongated body, and a coating layer including a polymer material overlying the boding layer. The abrasive article further includes abrasive grains contained within the bonding layer and coating layer, and wherein the bonding layer comprises an average thickness (tbl) at least about 40% of the average grit size of the abrasive grains.
    Type: Grant
    Filed: August 16, 2010
    Date of Patent: May 12, 2015
    Assignees: Saint-Gobain Abrasives, Inc., Saint-Gobain Abrasifs
    Inventors: Yinggang Tian, Ran Ding, Susanne Liebelt, Krishnamoorthy Subramanian
  • Patent number: 9010311
    Abstract: An apparatus, a system and a method may use a diamond-impregnated wire loop to cut an underwater pipeline. The apparatus may have a frame, a carriage attached to the frame and/or pulleys connected to the carriage. The diamond-impregnated wire loop may be connected to the pulleys. The carriage may move relative to the frame to direct the diamond-impregnated wire loop in a forward direction relative to the frame and/or through the pipeline.
    Type: Grant
    Filed: August 7, 2014
    Date of Patent: April 21, 2015
    Assignee: MacTech, Inc.
    Inventors: Steve Shae, Joel Kent Wittenbraker
  • Publication number: 20150090087
    Abstract: An aqueous coolant fluid for cutting or machining a semiconductor substrate, comprising at least one organic phosphorous containing acid or salt thereof, at least one polyol; and at least one surfactant, and a method of cutting a silicon ingot or wafer using the coolant fluid.
    Type: Application
    Filed: September 26, 2014
    Publication date: April 2, 2015
    Inventors: Jason Alexander Sherlock, Douglas E. Ward, Chun Lung Kuan
  • Patent number: 8991381
    Abstract: The present invention provides a method of cutting a workpiece efficiently with high accuracy by utilizing tension adjusters to approximate tension in a wire in a wire saw to a predetermined target tension while effectively reducing only tension in a winder-side wire. The method comprises a forward-driven cutting step of cutting a workpiece while moving a wire forward, a first switching step of reversing a driving direction of the wire, a backward-driven cutting step of cutting the workpiece while moving the wire backward, and a second switching step of reversing a driving direction of the wire and returning to the forward-driven cutting step, the steps being repeated in this order. In both switching steps, only tension in a winder-side wire is reduced by tension manipulators. A reduction in target wire tension therefor is performed after completion of deceleration of the wire in each switching step.
    Type: Grant
    Filed: February 8, 2010
    Date of Patent: March 31, 2015
    Assignee: Toyo Advanced Technologies Co., Ltd.
    Inventors: Jun Ohya, Tatsumi Hamasaki, Hiroyuki Yoshimura, Masaru Fukuman
  • Publication number: 20150083104
    Abstract: A method for simultaneously cutting a multiplicity of wafers from a cylindrical workpiece having an axis and a notch applied parallel to the axis in a lateral surface of the workpiece includes applying a cut-in beam on the workpiece where the cut-in beam has a head end and a foot end. The head end is inserted into the notch of the workpiece. The workpiece is held with a feed device so as to position an axis of the work piece parallel to the axes of cylindrical wire guide rollers of a wire saw. The cut-in beam is moved through a planar wire web, where the planar wire web has sections of wire arranged parallel to one another and perpendicular to the axes of the wire guide roller. The wire sections are moved the longitudinal wire direction in the presence of abrasives.
    Type: Application
    Filed: September 23, 2014
    Publication date: March 26, 2015
    Applicant: Siltronic AG
    Inventor: Georg Pietsch
  • Patent number: 8968054
    Abstract: A method for cooling a cylindrical workpiece during wire sawing includes applying a liquid coolant to a surface of the workpiece. The workpiece is made of semiconductor material having a surface including two end faces and a lateral face. The method includes sawing the workpiece with a wire saw including a wire web having wire sections arranged in parallel by penetrating the wire sections into the workpiece by an oppositely directed relative movement of the wire sections and the workpiece. Wipers are disposed so as to bear on the surface of the workpiece. The temperature of the workpiece is controlled during the wire sawing using a liquid coolant applied onto the workpiece above the wipers so as to remove the liquid coolant with the wipers bearing on the workpiece surface.
    Type: Grant
    Filed: December 30, 2011
    Date of Patent: March 3, 2015
    Assignee: Siltronic AG
    Inventors: Peter Wiesner, Anton Huber
  • Publication number: 20150053196
    Abstract: A device for cutting a block of stone that includes a support bar including a monolithic metallic plate, and a number of fluid ports attached to the plate. The device also includes a wear bar that is secured to the monolithic metallic plate and a lower longitudinal slot, and a cutting belt positioned in the lower longitudinal slot of the wear bar and including a downward-facing cutting surface to cut the block of stone. A method of cutting the stone block is also disclosed.
    Type: Application
    Filed: August 23, 2014
    Publication date: February 26, 2015
    Inventors: Bryce Bennett, Gregory K. Smoot
  • Patent number: 8960177
    Abstract: The present invention provides a wiresaw cutting method comprising cutting a workpiece with a wiresaw while applying an aqueous cutting fluid to the wiresaw from a recirculating reservoir of cutting fluid, monitoring at least one of a chemical property, a physical property, or both, and adjusting the chemical composition of the cutting fluid while cutting the workpiece to maintain the property being monitored. The present invention additionally provides an apparatus to perform the inventive method.
    Type: Grant
    Filed: December 21, 2009
    Date of Patent: February 24, 2015
    Assignee: Cabot Microelectronics Corporation
    Inventors: Steven Grumbine, Nevin Naguib Sant
  • Patent number: 8960178
    Abstract: A cutting chain for a hand-operated implement for cutting metal and mineral materials such as a stone cutter has central connecting links which are connected to one another by lateral connecting links. The central connecting links comprise first central connecting links which each have a drive tooth. The cutting chain has two central connecting links with drive teeth shaped differently to the drive teeth on the first central connecting links; or located a different distance from the leading drive teeth; or having no drive teeth. A hand-operated implement for cutting mineral materials has a drive motor which drives the cutting chain around a guide bar by a drive sprocket. The cutting chain is guided round part of the circumference of the drive sprocket and round a nose sprocket on the guide bar. The drive sprocket or nose sprocket have different first and second areas matched to the cutting chain.
    Type: Grant
    Filed: October 12, 2012
    Date of Patent: February 24, 2015
    Assignee: Andreas Stihl AG & Co. KG
    Inventors: Jochen Buchholtz, Matthias Schulz, Helmut Zimmermann
  • Patent number: 8955505
    Abstract: A chain bar unit for a wall saw is presented herein. The chain bar unit can include a bar configured to receive a circulating chain or wire around a perimeter of the bar. The chain bar unit also can include a driving gear for driving the chain or wire around the bar, the driving gear configured to be coupled to an output shaft of the wall saw. The chain bar unit further includes the bar being tapered from an end proximate to the driving gear to a distal end having a distal end radius, wherein a width of the bar at the proximate end, is at least two times the distal end radius of the distal end.
    Type: Grant
    Filed: February 3, 2012
    Date of Patent: February 17, 2015
    Assignee: Husqvarna AB
    Inventor: Andreas Jonsson
  • Publication number: 20150040884
    Abstract: A fixed abrasive grain wire saw that can improve precision of a cut plane of a workpiece and grinding efficiency and can prolong product life, a method of manufacturing the fixed abrasive grain wire saw, and a method of machining a workpiece by the fixed abrasive grain wire-saw. To fasten abrasive grains to an outer circumferential surface of a metal core wire, a plurality of transfer rollers, in each of which many tiny holes filled with an adhesive are formed, are used to transfer the adhesive to the outer circumferential surface of the core wire to form, on the outer circumferential surface, a plurality of rows of punctiform adhesive layers that are linearly arrayed in the axial direction at regular intervals. The abrasive grains are tentatively fastened to the adhesive layers, after which the abrasive grains are permanently fastened with a metal plated layer formed by electrolytic deposition.
    Type: Application
    Filed: May 31, 2012
    Publication date: February 12, 2015
    Applicant: READ Co., Ltd.
    Inventor: Yasuhiro Ueda
  • Patent number: 8881716
    Abstract: The present invention provides a wire saw which cuts a workpiece using a cutting wire and is capable of adjusting wire tension with high responsiveness. The wire saw includes first and second workpiece cutting units 1A and 1B. Each of the workpiece cutting units 1A and 1B includes a pair of guide rollers 10a and 10b around which a wire W is wound to form a workpiece-cutting wire group. The wire saw further includes a tension detector 18 which detects tension in the wire W between the workpiece cutting units 1A and 1B, and a control device 50. The control device 50 changes a rotational speed of the guide rollers 10a and 10b of at least one of the workpiece cutting units based on the tension detected by the tension detector 18 so as to keep the tension within an acceptable range.
    Type: Grant
    Filed: February 8, 2010
    Date of Patent: November 11, 2014
    Assignee: Toyo Advanced Technologies Co., Ltd.
    Inventors: Toyohiro Hoshiyama, Shoji Imakurusu, Hiroyuki Yoshimura, Tatsumi Hamasaki
  • Publication number: 20140326229
    Abstract: A method including providing a ceramic log (300) with a first end and an opposing second end; providing one or more cutting devices (100) comprised of a dual bladed cutting member (200); and removing material by cutting at least the first end with the dual bladed cutting member (200), wherein a first blade (210) of the dual bladed cutting member (200) provides a finished surface and a second blade (220) removes a percentage of scrap above the finished surface. An apparatus (100) for cutting a ceramic log (300).
    Type: Application
    Filed: December 14, 2012
    Publication date: November 6, 2014
    Inventors: Abraham D. Schuitman, Nestor A. Vasquez, Blake R. Stalder, James R. Ogle, Paul J. Sacchetti
  • Publication number: 20140318523
    Abstract: A method of making a glass forming apparatus with reduced weight includes forming a cavity in the glass forming apparatus and expanding the size of the cavity by abrasively removing material from the glass forming apparatus through application of a wire saw.
    Type: Application
    Filed: April 29, 2013
    Publication date: October 30, 2014
    Applicant: Corning Incorporated
    Inventor: Paul Maynard Schermerhorn
  • Patent number: 8869787
    Abstract: A hand-operated implement has a guide bar on which is fitted a cutting chain for cutting mineral and metal materials. The cutting chain is driven around the guide bar by a chain sprocket. The chain sprocket is arranged in a chain sprocket chamber which is delimited by a chain sprocket cover. A cutting element has an outer side facing a sidewall of the chain sprocket cover which lies in a first notional plane. The distance between the sidewall and the first notional plane measured perpendicular to the first notional plane and centrally between the top of the cutting element and the peripheral wall is less than approximately 0.8 cm over at least 30% of the section between a second notional plane containing the central axis of a fixing bolt on the guide bar and the exit opening at which the cutting chain leaves the chain sprocket chamber.
    Type: Grant
    Filed: October 12, 2012
    Date of Patent: October 28, 2014
    Assignee: Andreas Stihl AG & Co. KG
    Inventors: Hannah Thölking, Horst Otterbach, Helmut Zimmermann, Jens Kreutzer, Jonas Lank
  • Publication number: 20140311472
    Abstract: An abrasive article including a substrate as an elongated member, a first layer overlying the substrate, abrasive particles overlying the first layer, fillets connecting the first layer and the abrasive particles, a bonding layer overlying the abrasive particles, the first layer and the fillets, and the fillets have a fillet characteristic relative to an abrasive application, the fillet characteristic selected from the group consisting of tacking factor (tfl/tf), a fillet-to-particle factor (tf/dab), a fillet-to-bonding layer factor (tf/tbl), a contact factor (Ab/Af), a fillet size variance (Vf), and a combination thereof.
    Type: Application
    Filed: April 18, 2014
    Publication date: October 23, 2014
    Applicant: Saint-Gobain Abrasives, Inc.
    Inventors: Yinggang Tian, Paul W. Rehrig, Arup K. Khaund
  • Patent number: 8851059
    Abstract: The present invention provides a self-cleaning wiresaw cutting apparatus including a cleaning mechanism adapted to clean the components of the wiresaw before, during, or after a cutting process or to humidify the cutting region of the apparatus. The apparatus contains at least one dispenser adapted to dispense an aqueous fluid onto various components of the wiresaw.
    Type: Grant
    Filed: March 30, 2010
    Date of Patent: October 7, 2014
    Assignee: Cabot Microelectronics Corporation
    Inventors: Steven Grumbine, Carlos Barros, Ramasubramanyam Nagarajan
  • Patent number: 8844511
    Abstract: A method for slicing a plurality of wafers from a crystal includes providing a crystal of semiconductor material having a longitudinal axis, a cross section and at least one pulling edge. The crystal is fixed on a table and guided through a wire gang defined by sawing wire so as to form the wafers. The guiding is provided by a relative movement between the table and the wire gang such that entry sawing or exit sawing using the sawing wire occurs in a vicinity of the at least one pulling edge of the crystal.
    Type: Grant
    Filed: January 20, 2011
    Date of Patent: September 30, 2014
    Assignee: Siltronic AG
    Inventors: Maximilian Kaeser, Albert Blank
  • Publication number: 20140261368
    Abstract: The present invention provides a bandsaw cutting apparatus including an actuator configured to move static pressure pads forward and backward in a rotating direction of a blade, and a controller configured to control a movement distance and a movement speed of the static pressure pads to be moved by the actuator, wherein the ingot is cut by feeding the blade relatively downward toward and below the ingot while a rotating blade is guided with static pressure pads, and the movement of the static pressure pads is controlled with the controller. The apparatus can stably suppress a displacement of the blade during cutting, thereby cutting the ingot into blocks or sample wafers for crystal quality evaluation stably with good quality cut surface at a higher cutting rate and extending the lifetime of the blade.
    Type: Application
    Filed: October 15, 2012
    Publication date: September 18, 2014
    Inventor: Kazuya Nakagawa