Abstract: A device suitable for sawing a workpiece, contains a wire web formed by a sawing wire or adapted to receive such a wire web, a forward feed instrument holding a semiconductor workpiece to be sawed and feeding the workpiece in the direction of the wire web, and a reservoir filled with a sawing suspension, the reservoir being arranged and filled such that at least the part of the sawing wire which is in engagement during the sawing process is immersed into the sawing suspension of the reservoir.

Abstract: This invention relates to a carbide wire blade that is suitable for use in sawing through subsea structures. The carbide wire blade employs a tungsten carbide cutter, a vibration dampening member, and the first cylindrical spacer, slideably mounted on a solid cylindrical body.

Abstract: A method for slicing an ingot may improve nanotopography at a surface of a wafer. In the method, an ingot is sliced into a plurality of wafers via a slurry while slurry is supplied to a moving wire. A first wire to form a first slicing portion at the wafer firstly slices one side of the ingot. A second wire secondly slices the remaining portion of the ingot to form a second slicing portion continued from the first slicing portion, wherein the first wire has a smaller diameter than that of the second wire.

Abstract: A method for slicing an ingot may improve nanotopography at a surface of a wafer. In the method, an ingot is sliced into a plurality of wafers via a slurry while slurry is supplied to a moving wire. A first wire to form a first slicing portion at the wafer firstly slices one side of the ingot. A second wire secondly slices the remaining portion of the ingot to form a second slicing portion continued from the first slicing portion, wherein the first wire has a smaller diameter than that of the second wire.

Abstract: This invention relates to an end supporting plate which can be attached to both ends of cylindrical ingot. By wire saw cutting, semiconductor wafers are sliced from the ingot attached with the end supporting plates. The end supporting plate has an elongated support surface. Maximum width of the support surface along a direction perpendicular to an axial direction of the plate is smaller than the length along the axial direction. The length of the support surface is approximately similar to a diameter of the ingot to which the end support plate is to be attached, whereas maximum width of the support is smaller than the diameter of the ingot.

Abstract: In a cutting method by a wire saw, in which a wire A at a wire array wound around work rollers 10 is made to reciprocate or travel in one direction at a high speed and numerous pieces of wafers are cut out in abutment of a workpiece B against the wire array, a receiving member 27 of a cassette type having numerous support wires 34 arranged at the same pitch as that of the wire at the wire array is disposed at a position immediately under the wire array for cutting the workpiece B; and wafers b cut out of the workpiece B by the wire A are contained in separation one from another between the support wires 34 in the receiving member 27. Thus, the wafers can be prevented from adhering to each other during a cutting operation, thus to be accurately cut, and further, the wafers can be prevented from being cracked during the cutting operation, thus to be efficiently separated one from another, so as to enhance wafer cleansing performance.

Abstract: A cutting apparatus that positions a wire saw driving device movably and appropriately at the desired site by freely moving an arm of a backhoe provided with a boom, which arm carries the wire saw driving device and is turnable and movable in upward, downward, leftward, rightward, forward, and backward directions, thus enabling cutting at sites too narrow in which to use a conventional machine. Cutting by use of a wire saw and by use of a disk blade can be alternately performed as needed.

Abstract: A method for slicing an ingot may improve nanotopography at a surface of a wafer. In the method, an ingot is sliced into a plurality of wafers via a slurry while slurry is supplied to a moving wire. A first wire to form a first slicing portion at the wafer firstly slices one side of the ingot. A second wire secondly slices the remaining portion of the ingot to form a second slicing portion continued from the first slicing portion, wherein the first wire has a smaller diameter than that of the second wire.

Abstract: The object of the present invention is to provide a method whereby it is possible to cut a single crystal ingot comparatively accurately while allowing resulting slices to have a flat surface, and to lengthen the life of the blade more than would be possible with conventional methods. A single crystal ingot 10a is arranged below a straightly running portion 18a of the blade which is made to run endlessly along a circuit such that the longitudinal axis of ingot 10a crosses at right angles with the straightly running portion 18a of the blade, thereby enabling the straightly running portion 18a of the blade to cut the ingot 10a perpendicularly.

Abstract: An ingot 3 of a hexagonal III-nitride crystal is cut using a wire array 21 composed of a wire 22. On this occasion, the ingot 3 is cut in such a manner that the ingot 3 is sliced with supply of an abrasive fluid while feeding at least one of the ingot 3 and wire 22 in a direction perpendicular to an extending direction B of the wire 22. During cutting the ingot 3, the extending direction B of the wire 22 is inclined at 3° or more to the {1-100} plane of the ingot 3.

Abstract: A wire saw (1; 100) for cutting a workpiece includes a device (21, 22, 24, 27) for setting, controlling and/or maintaining a predetermined or desired water content in at least part of the gaseous medium that contacts the slurry. With the wire saw according to the invention and the process carried out using this wire saw, it is possible to achieve consistently good surface properties of the resulting wafers over a prolonged period of use of a slurry.

Abstract: A guide pulley stand for wire saw use in stone quarries, for guiding the cutting wire when the wire saw unit is set up on the top of the object to be cut. The pivoting guide pulley stand comprises of a support base on the front end of the wire saw track, a guide pulley stand rotatably supported on the support base, and an adjustable stabilizing member rotatably connected to a swivel on the pulley stand to support the pulley stand upright and rigid on either the left side or the right side of the wire saw track.

Abstract: A method for the division of single crystals, in particular of GaAs, is provided in which a single crystal (1) to be cut into at least two parts and a cutting tool (2, 3; 8, 8a, 8b, 8c) are moved relative to one another in a direction of advancement (V) and wherein the single crystal (1) is oriented in such a way that a specified crystallographic orientation (K) lies in the cutting plane (T), characterized in that an angle (?) between the specified crystallographic direction (K) and the direction of advancement (V) is chosen in such a way that forces which act on the cutting tool during cutting in a direction at right angles to the cutting plane compensate one another.

Abstract: A sawing device includes a holding device (22) arranged so as to hold in the course of wire sawing the different sawed slices (23) substantially parallel and such that the width of the sawing gaps (24) is held constant. The device includes, for this purpose, holding members (25), for example in the form of a bar (30) whose resilient coating (31) is applied by springs (35) against a lower portion (26) of the slices (23) . There are thus obtained slices without undulations, striations, breakages and irregularities; moreover, the invention permits easy repair of the layer of wires after breakage of the wire.

Abstract: A graphite block cut into slabs by a sawing device comprising a plurality of generally parallel, spaced-apart blades with each of the blades having a plurality of cutting segments mounted thereon, each of the cutting segments comprising a continuous phase impregnated with a superabrasive material selected from one of natural diamond, synthetic diamond, cubic boron nitride, and combinations thereof; wherein each of the granite slabs as cut from the block has a surface roughness Ra of less than 500 ?-in, and with thickness variation of 2 mm or less from a nominal slab target.

Abstract: The present invention features a reciprocating wire saw particularly adapted or configured for cutting hard materials. In one aspect, the reciprocating wire saw comprises (a) a flexible wire; (b) a plurality of cutting segments fittable onto the flexible wire, wherein each of the cutting segments comprises an outer surface; and a (c) plurality of superabrasive particles braze bonded onto the outer surface of the cutting segments to form a cutting wire. In another aspect, the reciprocating wire saw comprises a plurality of superabrasive particles braze bonded directly to the wire itself to form a cutting wire. The cutting wire is unique in that it comprises a pre-determined superabrasive particle concentration and is configured to cut various materials, such as granite, in a reciprocating manner.

Abstract: A portable motor chain saw comprises a machine body (1) which a driving unit, a rear handle (2), a front handle which extends over the machine body, a guide bar (6), and a dog device (15) provided such that it can be pressed against the object to be worked by means of the machine, said dog device forming a center of rotation for turning the guide bar in the plane of the guide bar. The characterising features are that the dog member (15) is provided in front of the front handle (3), approximately on a level with that part (4) of the front handle which extends over the machine body, and is connected to the front handle, and that at least that part of the dog device which is provided to engage the object to be worked, consists of a polymeric material. Preferably, the height of the dog device over the guide bar corresponds to two to three times the vertical width of the guide bar.

Abstract: A graphite block cut into slabs by a sawing device comprising a plurality of generally parallel, spaced-apart blades with each of the blades having a plurality of cutting segments mounted thereon, each of the cutting segments comprising a continuous phase impregnated with a superabrasive material selected from one of natural diamond, synthetic diamond, cubic boron nitride, and combinations thereof; wherein each of the granite slabs as cut from the block has a surface roughness Ra of less than 500 ?-in, and with thickness variation of 2 mm or less from a nominal slab target.

Abstract: A wire sawing apparatus includes a wire, a wire feed roller, and two basic rollers. The three rollers have the same diameter and are arranged in such a manner that their axes of rotation are in parallel with one another. Cutting-positioning circumferential grooves are formed on the two basic rollers at axially paired same positions. Intermediate circumferential grooves are formed on the wire feed roller and arranged in the axial direction such that the axial position of each intermediate circumferential groove corresponds to an axially central position between two adjacent pairs of cutting-positioning circumferential grooves. The wire is spirally wound a plurality of turns on the three rollers while being fitted into the circumferential grooves.

Abstract: A horizontal frame saw is equipped with a plurality of generally parallel, spaced-apart blades for cutting granite. Each of the blades has a cutting edge with diamond cutting segments mounted thereon for engaging the granite with a swinging motion for cutting of the granite, wherein the segments have optimized/controlled segment variables for uniform wearing of the segments along each blade during cutting of granite. Segment variables include one or more of: spacing of segments along the length of the blade; diamond concentration in each segment; diamond grade (as measured by compressive fracture strength) in each segment; segment composition (bond, secondary abrasives); or segment dimensions.

Abstract: A stone slicer of slicing rough stone into stone plates having a predetermined thickness, which can improve productivity by reducing consumption of the rough stone by minimizing the thickness of a cut portion cut by a saw blade, and can reduce the treatment cost of sludge generated when the stone is sliced and prevent pollution due to the generated sludge.

Abstract: A wire saw and wafer stabilizing system are provided for holding wafer sections invariantly against vibration and unwanted movement during the sawing process. A stabilizing means is applied to the ends of partially defined wafer sections at an early stage when the wafer sections are partially cut through a silicon ingot or block of silicon material. The stabilizing means serves to stabilize the wafer sections immovably against vibration, oscillation, or unwanted contact during the subsequent sawing process. The stabilizing system also accelerates handling of the wafers after slicing is completed, facilitates the cleaning process, and allows for more rapid or automated placement of the wafers in cassettes. Wafers produced by the stabilizing system are characterized by a minimized total thickness variation, substantially uniform planarity, and substantially without bow or warp.

Abstract: A method of cutting a rare-earth alloy with a wire saw, obtained by fixing abrasive grains on a core wire with a resin layer, includes the step of moving the wire saw while a portion of the rare-earth alloy being machined with the wire saw is immersed in a coolant, which is mainly composed of water and has a surface tension of about 25 mN/m to about 60 mN/m at about 25° C., thereby cutting the rare-earth alloy. In the wire saw, an average distance between two of the abrasive grains, which are adjacent to each other in a length direction, is about 150% to less than about 400% of the average grain size of the abrasive grains, an average height of portions of the abrasive grains, protruding from the surface of the resin layer, is about 70% or less of the average grain size of the abrasive grains, and a thickness deviation percentage of the resin layer with respect to the core wire is about 40%.

Abstract: A movable machine, for example a saw, has a light construction using composite materials such as fiber reinforced resins and a closed cell foam. The saw may have a housing formed from multiple skins of the composite materials in which is located the closed cell foam. Metallic inserts may be used to bond to either or both of the foam and the composite skin to accept working components. A saw is also described which uses gears sharing the same support element.

Abstract: A method of producing a sintered rare earth magnetic alloy wafer comprises a step of using a cutter to slice a wafer of a thickness of not greater than 3 mm from a sintered rare earth magnetic alloy having ferromagnetic crystal grains surrounded by a more readily grindable grain boundary phase and a step of surface-grinding at least one cut surface of the obtained wafer with a grindstone to form at a surface layer thereof flat ferromagnetic crystal grain cross-sections lying parallel to the wafer planar surface. The method enables high-yield production of a sintered rare earth magnetic alloy wafer having flat surfaces.

Abstract: In the sawing process and device according to the invention, the pieces to be sawed are mounted on at least one support table and caused to bear against a layer of wires. Inclination structure in the form of wedges or pieces for angular adjustment by pivoting and blocking, are provided to mount the pieces obliquely with angles of inclination between one of their prismatic surfaces and a horizontal working plane. There is thus obtained a precise beginning of sawing with sawed slices of equal thickness and a careful end of cutting without chipping.

Abstract: A portable machine, for example a saw, has a light construction using composite materials such as fiber reinforced resins and a closed cell foam. The saw may have a housing formed from multiple skins of the composite materials in which in the closed cell foam. Metallic inserts may be used to bond to either or both of the foam and the composite skin to accept working components. A saw is also described which uses gears sharing the same support element.

Abstract: A method of cutting a rare-earth alloy with a wire 20, on which abrasive grains are fixed with a resin layer provided on the outer surface of a core wire, includes the steps of: providing a wire, of which the surface is coated with a lubricant including a glycol, by reeling the wire up in a pair of reel bobbins 40a and 40b; reeling the wire off one of the reel bobbins and letting the wire travel on a plurality of rollers 10a, 10b and 10c; and cutting the rare-earth alloy with the traveling wire while a portion of the rare-earth alloy being cut with the wire is supplied with a first coolant which is mainly composed of water. As a result, the life of a wire can be extended when a rare-earth alloy is cut with a wire saw machine using a coolant which is mainly composed of water.

Abstract: The present invention relates to a saw blade for cutting and finishing the surface of a work piece. The saw blade having a set of teeth disposed about the outer edge for making a cut in a work piece and an abrasive secured to the lateral surface of the saw blade. The abrasive extending laterally outwardly from the surface of the saw blade and providing a finishing effect on the work piece as the abrasive widens the cut beyond the cut of the saw blade teeth. A method for cutting and finishing a surface of a work piece utilizing a saw blade with an abrasive secured to a lateral surface of the blade and the abrasive extending beyond the cut of the saw blade teeth.

Abstract: A wire saw (10) for simultaneously slicing multiple, generally cylindrical monocrystalline ingots (14) into wafers. The wire saw includes a cutting head (16), an ingot support (12), and multiple generally parallel lengths of cutting wire (18) defining a cutting web (30). A slurry delivery system includes nozzles (34, 36, and 38) positioned for dispensing slurry along the wire web generally at lateral sides of each ingot. A process for simultaneously slicing at least two generally cylindrical semiconductor ingots into wafers includes mounting at least two ingots to a common ingot support, moving the ingot support relative to the cutting web so that the two ingots simultaneously press against the cutting web at cutting regions, and dispensing a liquid slurry to at least three locations on the wire web including two outermost sides of the cutting regions and a location between each pair of ingots.

Abstract: An apparatus and a method for determining the orientation of a crystallographic plane (100) relative to a crystal surface (2) are provided, in which the orientation is free from errors of adhesion of the crystal or contamination of the holders for the crystal. For this purpose, the angle which the crystal surface to be measured forms with a reference axis and the angle which the crystallographic plane forms with the reference axis are measured and subtracted. In a wire sawing apparatus with an X-Y positioning unit, next the desired correction is made with the aid of measurement of the orientation and at the same time the crystal is displaced in horizontal and vertical positions. As a result, there remains a further degree of freedom of rotation of the crystal in the cutting plane for achieving a cut which is free from forces perpendicular to the feed direction and wire direction, so that no tool deflection takes place or the cutting forces are minimal. Further, the precision of orientation is increased.

Abstract: The invention relates to a cable saw device (1) comprising a sawing cable (25) and a cable storage device (30) which is used for temporary accommodation of the sawing cable (25). The cable storage device (30) comprises several deflection rollers (5,6). At least two of said deflection rollers (5,6) are placed at a modifiable axial distance (A) from each other. The cable saw (25) is driven by several deflection rollers (5). Means for compensating the different speeds of the cable saw (25) are arranged between the driving deflection rollers (5).

Abstract: A diamond wire (1) is disclosed for cutting stone material comprising a support cable (2) with around it a plurality of cutting bushes (3) and a plurality of elastic means (5). The cuttting bushes (3) comprise: an hollow cylindric support (10); at least one diamond cutting sector (12) connected to an external surface of the support (10); and at least one non-diamond support/cutting sector (14) connected to the external surface of the support (10) and laterally connected to the cutting sector (12).

Abstract: A superabrasive wire saw having a plurality of individual coated superabrasive particles attached to a wire with an organic binder is disclosed and described. The superabrasive particle can be coated with a solidified coating of a molten braze alloy that is chemically bonded to the superabrasive particle. The organic binder can optionally contain filler materials and/or an organometallic coupling agent to improve the retention of coated superabrasive particles. The resulting superabrasive wire saws can be produced having diameters of less than 0.5 mm which significantly reduce kerf loss. Various methods for making and using such a superabrasive wire saw are additionally disclosed and described.

Abstract: A method for cutting a rare earth alloy using a wire with abrasive grains fixed to a core wire, including the step of cutting the rare earth alloy with the wire traveling in a state that a portion of the rare earth alloy to be cut with the wire is immersed in a coolant containing water as the main component, the coolant having a surface tension at 25° C. in a range of 25 mN/m to 60 mN/m.

Abstract: The apparatus, system and method for cutting crystal ingot provide techniques for cutting an ingot into wafers with a wire cutting apparatus utilizing wire with a diameter of less than 0.18 mm, such as 0.14 mm. The wire cutting apparatus also includes multiple rollers about which the wire is wrapped, and nozzles for applying slurry to the wire. One of the rollers is located on one side of the crystal ingot, while another roller is located on the other side of the crystal ingot. At least one nozzle is disposed proximate the first and second rollers. The nozzles collectively disperse slurry at a rate in the range of 40 to 60 liters per minute, such as 50 liters per minute, and at a viscosity of 42 to 62 centipose, such as 52 centipose.

Abstract: A sawing device includes a wire assembly (15) supported on wire-guiding rolls (11, 12) and pressed against a workpiece to be sawn (20) fixed on a support table (21). An oscillating device (23) produces a relative reciprocating movement between the workpiece and the wire assembly (15) around an oscillation axis (A) whereof the spatial position can be adjusted and programmed so that the oscillation axis (A) is at a programmable and adjustable distance from an effective axis of rotation (28) of the oscillating device (23).

Abstract: A method and apparatus for diamond wire cutting of metal structures, such as nuclear reactor vessels, is provided. A diamond wire saw having a plurality of diamond beads with beveled or chamfered edges is provided for sawing into the walls of the metal structure. The diamond wire is guided by a plurality of support structures allowing for a multitude of different cuts. The diamond wire is cleaned and cooled by CO2 during the cutting process to prevent breakage of the wire and provide efficient cutting. Concrete can be provided within the metal structure to enhance cutting efficiency and reduce airborne contaminants. The invention can be remotely controlled to reduce exposure of workers to radioactivity and other hazards.

Abstract: A method for cutting a rare earth alloy using a wire with abrasive grains fixed to a core wire, including the step of cutting the rare earth alloy with the wire traveling in a state that a portion of the rare earth alloy to be cut with the wire is immersed in a coolant containing water as the main component, the coolant having a surface tension at 25° C. in a range of 25 mN/m to 60 mN/m.

Abstract: A method for cutting a rare earth alloy using a wire with abrasive grains fixed to a core wire, including the step of cutting the rare earth alloy with the wire traveling in a state that a portion of the rare earth alloy to be cut with the wire is immersed in a coolant containing water as the main component, the coolant having a surface tension at 25° C. in a range of 25 mN/m to 60 mN/m.

Abstract: A method and apparatus for diamond wire cutting of metal structures, such as nuclear reactor vessels, is provided. A diamond wire saw having a plurality of diamond beads with beveled or chamfered edges is provided for sawing into the walls of the metal structure. The diamond wire is guided by a plurality of support structures allowing for a multitude of different cuts. The diamond wire is cleaned and cooled by CO2 during the cutting process to prevent breakage of the wire and provide efficient cutting. Concrete can be provided within the metal structure to enhance cutting efficiency and reduce airborne contaminants. The invention can be remotely controlled to reduce exposure of workers to radioactivity and other hazards.

Abstract: A multistage fine-hole machining device has lap stations for lapping an inner surface defining a through-hole of a workpiece. Each of the lap stations has a passing unit for passing wire through the through-hole of the workpiece, a supply unit for supplying a polishing material to the wire, and a sliding unit for effecting relative sliding movement between the workpiece and the wire while the wire is passed through the through-hole of the workpiece and is supplied with the polishing material to thereby lap the inner surface of the workpiece with the polishing material and enlarge the diameter of the through-hole. A transfer device successively transfers the workpiece to each of the lap stations to lap the inner surface of the workpiece at each of the lap stations during the lapping operation for successively enlarging the diameter of the through-hole to a preselected diameter.

Abstract: In the sawing process and device according to the invention, the pieces to be sawed are mounted on at least one support table and caused to bear against a layer of wires. Inclination structure in the form of wedges or pieces for angular adjustment by pivoting and blocking, are provided to mount the pieces obliquely with angles of inclination between one of their prismatic surfaces and a horizontal working plane. There is thus obtained a precise beginning of sawing with sawed slices of equal thickness and a careful end of cutting without chipping.

Abstract: The invention relates to a saw wire consisting essentially of a steel wire, an intermediate layer and a metallic binding phase into which diamond grains with an average diameter of 10 to 50 micrometers are inserted, characterized in that the metallic binding phase has a hardness of between 600 and 1100 HV 0.1 and consists of an inner layer and an outer layer which are arranged concentrically around the steel wire provided with the intermediate layer. The inner layer has a thickness of approximately between 10 and 25% of the average diamond grain diameter, while the thickness of the outer layer is such that the overall thickness of the metallic binding phase is 45-55% of the average diamond grain diameter and the diamond grains have an average interval of not more than 5 times their average diameter. Other fine particles with an average diameter of 1 to 6 micrometers are located between the diamond grains with an average diameter of 10 to 50 micrometers.

Abstract: The sawing device comprises a holding device (22) arranged so as to hold in the course of wire sawing the different sawed slices (23) substantially parallel and such that the width of the sawing gaps (24) is held constant. It comprises for this purpose holding members (25), for example in the form of a bar (30) whose resilient coating (31) is applied by springs (35) against a lower portion (26) of the slices (23).

Abstract: A device for deflecting a saw cable (13) of a cable saw and having a support (1) and at least one deflection member (2) securable to the support (1) and having two support arms (6), between which a deflection roller (3) is rotatably supported, and two guide surfaces (18) formed in the region of the deflection member (2) projecting beyond the deflection roller (3) for preventing the saw cable (13) from falling off of the deflection roller (3).

Abstract: A band saw with a complex coordination of a tilting motion and a translational motion between the workpiece and the band saw blade, so that a curved cut is made in the workpiece. The geometric parameters of the cut can be continuously adjusted. This makes it possible to optimize a contact length of the saw blade in the workpiece, which is an important factor in the cutting process. It is thus possible to saw workpieces made of stone and similar materials that are typically difficult to cut. The cut and the contact length of the saw blade can be tailored individually to each workpiece to be sawed. Thus, workpieces of different geometrical dimensions and different material properties, in particular with different material hardnesses, can be processed using the band saw according to the invention without having to undertake significant changes.

Abstract: An ingot is placed below parallel wires of a multiwire saw, and the wires are driven to run. The ingot is moved upward and cut by the wires to obtain wafers. The wires are displaced toward one side of cut surfaces of the wafers. By lowering the wafers as the wires remains displaced toward the one side of cut surfaces of the wafers, the wires are pulled out of the wafers without contacting the other side cut surfaces of the wafers. Thus, the multiwire saw does not cause any damage to major surfaces of the wafers and is used many times without cutting the wires.

Abstract: A saw chain for cutting aggregate material having cutting segments wherein diamonds are embedded in a matrix material, said cutting of an aggregate structure achieved by drawing the segment across the aggregate structure with the diamonds exposed so as to abrade away the aggregate material producing thereby a kerf. The diamonds initially being unexposed and requiring an initial abrasion of the matrix material surrounding the diamonds. The surface of the cutting head having a peak portion whereby minimal abrading of the matrix in the peak portion rapidly exposes diamonds to commence the abrasion of the aggregate.

Abstract: An apparatus for cutting green ceramic bodies, includes a traveling path for green ceramic bodies, beds for supporting green ceramic bodies at constant intervals in series along the traveling path, an arm on each side of the traveling path, two drive portions for moving respective arms perpendicularly relative to the traveling path, a drive portion for moving both arms in the same direction as the traveling path, a wire for cutting green ceramic bodies, extending between the arms, and wire supporting portions, on respective arms. Each wire supporting portion includes a servo motor with an axis of rotation, a magnet member around the axis of rotation, a bobbin having a conical surface around which wire is wound, and magnetically coupled to the axis of rotation by the magnet member, and a traversing mechanism for varying the position where the wire is wound around the length of the conical surface.