Abstract: The apparatus, system and method for cutting crystal ingot provide techniques for cutting an ingot into wafers with a wire cutting apparatus utilizing wire with a diameter of less than 0.18 mm, such as 0.14 mm. The wire cutting apparatus also includes multiple rollers about which the wire is wrapped, and nozzles for applying slurry to the wire. One of the rollers is located on one side of the crystal ingot, while another roller is located on the other side of the crystal ingot. At least one nozzle is disposed proximate the first and second rollers. The nozzles collectively disperse slurry at a rate in the range of 40 to 60 liters per minute, such as 50 liters per minute, and at a viscosity of 42 to 62 centipose, such as 52 centipose.

Abstract: A method for separating slices from a hard brittle workpiece involves subjecting the workpiece to an advancing movement and pressing it onto wires of a wire web of a wire saw, the wires being under a defined wire tension and making contact with the workpiece over a cutting depth along a cutting contour. The wires are lifted off the cutting contour an number of times while the wire tension is kept substantially unchanged, with the aid of rolls of a roll system. The roll system comprises at least one roll that is moved onto the wire web and back, the roll system comprising at least two moveable rolls which flank the workpiece. A wire saw is suitable for carrying out the method.

Abstract: A wire saw and method for cutting wafers from a workpiece, in which a saw wire is guided multiple times around wire-guiding rolls. The wire-guiding rolls have a rotatable bearing arrangement and two adjacent wire-guiding rolls delimit a saw gate. The saw has ceramic sliding-contact bearings for rotatably bearing the wire-guiding rolls.

Abstract: A diamond wire (1) is disclosed for cutting stone material comprising a support cable (2) with around it a plurality of cutting bushes (3) and a plurality of elastic means (5). The cuttting bushes (3) comprise: an hollow cylindric support (10); at least one diamond cutting sector (12) connected to an external surface of the support (10); and at least one non-diamond support/cutting sector (14) connected to the external surface of the support (10) and laterally connected to the cutting sector (12).

Abstract: The invention relates to a saw wire consisting essentially of a steel wire, an intermediate layer and a metallic binding phase into which diamond grains with an average diameter of 10 to 50 micrometers are inserted, characterized in that the metallic binding phase has a hardness of between 600 and 1100 HV 0.1 and consists of an inner layer and an outer layer which are arranged concentrically around the steel wire provided with the intermediate layer. The inner layer has a thickness of approximately between 10 and 25% of the average diamond grain diameter, while the thickness of the outer layer is such that the overall thickness of the metallic binding phase is 45-55% of the average diamond grain diameter and the diamond grains have an average interval of not more than 5 times their average diameter. Other fine particles with an average diameter of 1 to 6 micrometers are located between the diamond grains with an average diameter of 10 to 50 micrometers.

Abstract: A wafer sawing apparatus comprises an electrically conductive chuck table surrounding a suction plate and tactile sensing lines formed on the upper surface of the suction plate. At least one end of each tactile sensing line is electrically connected to the table body. A controller controls the chuck table and a scribing blade. The controller is electrically connected to both elements. The controller comprises a tactile sensing unit connected to the table body for sensing contact of the scribing blade with the tactile sensing lines or the table body and an equipment stop unit for stopping the scribing blade. The controller further comprises a zero point adjusting unit for receiving a contact signal from the tactile sensing unit and for adjusting a zero point of the scribing blade, and a switching unit connecting the tactile sensing unit to the zero point adjusting unit or the equipment stop unit.

Abstract: An aqueous grinding fluid has compositions mainly consisting of 40.0-95.0 wt. % a polyalcohol and/or a polyalcohol derivative, 5.0-50.0 wt. % water, 0.1-3.5 wt. % bentonite, 0.1-5.0 wt. % cellulose and weight %, 0.5-10.0 wt. % mica and optionally a small amount of a surfactant or polar solvent. Bentonite, cellulose and mica are preferably added with such combination to adjust a viscosity of a slurry to 150-300 mPa.second as a value measured by a rotating cylinder type viscometer. The aqueous suspension is nonflammable and stabilized in dispersiveness and settleability-proof of abrasive grits as well as a viscosity for a long time, and facilitates washing and cleaning of sliced wafers and a grinding machine without radiation of stinks.

Abstract: The present invention is a cutting and processing method for cutting semiconductor materials such as silicon ingots, or machining grooves therein, using a wire saw, a purpose whereof is to obtain a method wherewith high-precision processed products can be stably obtained. By performing cutting processing using a slurry that is either a mixture of free abrasive particles and an oil base such as a mineral oil or a mixture of free abrasive particles and an aqueous solution base such as ethylene glycol material, the effects of improving cuttability, reducing residual processing distortion, suppressing process stress, and suppressing cutting heat can be enhanced, and it is possible to carry on cutting while eliminating the process stress (residual distortion) produced by cutting, and thus to cut low-distortion wafers.

Abstract: A device for deflecting a saw cable (13) of a cable saw and having a support (1) and at least one deflection member (2) securable to the support (1) and having two support arms (6), between which a deflection roller (3) is rotatably supported, and two guide surfaces (18) formed in the region of the deflection member (2) projecting beyond the deflection roller (3) for preventing the saw cable (13) from falling off of the deflection roller (3).

Abstract: A sawing wire is for the simultaneous cutting and lapping of a multiplicity of wafers from a hard brittle workpiece. The sawing wire exhibits torsion. There is also a method for cutting and lapping using the sawing wire.

Abstract: The wire sawing device includes two external wire guide cylinders (1, 2) having a diameter (D1) smaller than that (D2) of the two internal wire guide cylinders (3, 4). The external wire guide cylinders are driven in rotation by a power drive to cause the movement of the wires of a layer of wires (6), whilst the internal wire guide cylinders (3, 4) ensure only the function of guidance without driving the wires of the layer of wires. By the separation of the drive function from the guide function of the wire, substantial heating of the guiding wire guide cylinders can be avoided, which permits obtaining sawed pieces of high precision without undulations.

Abstract: A device for simultaneously separating a multiplicity of wafers from a hard brittle workpiece having a longitudinal axis, with a wire web made from saw wire and with an advancing device which brings about a translational relative movement, which is perpendicular to the longitudinal axis of the workpiece, between the workpiece and the wire web of the wire saw, in the course of which movement the workpiece is passed through the wire web, wherein the wire web is formed from a multiplicity of individual wires, and wherein there is a device for holding and rotating the workpiece about the longitudinal axis.

Abstract: There is provided a process for significantly reducing thickness variations and the deviations of the wafer's centerline from a reference plane in material cut with wire saws in a wire cutting apparatus by utilizing a sacrificial layer. The sacrificial layer prevents excessive kerf loss in slices or wafers at the wire entry and exit points. The process can be used to produce semiconductor wafers having greater uniformity in thickness.

Abstract: A wire-saw constituted by a rope-like core wire and a cylindrical coil-like saw-wire body wounded around the core wire, and a large number of abrasive grains firmly fixed to the saw-wire body by metal. Problems of conventional wire-saws, such as unstable working performance, a short tool life, low safety and low reliability, and so on, are solved.

Abstract: A method for separating slices from a hard brittle workpiece involves subjecting the workpiece to an advancing movement and pressing it onto wires of a wire web of a wire saw, the wires being under a defined wire tension and making contact with the workpiece over a cutting depth along a cutting contour. The wires are lifted off the cutting contour an number of times while the wire tension is kept substantially unchanged, with the aid of rolls of a roll system. The roll system comprises at least one roll that is moved onto the wire web and back, the roll system comprising at least two moveable rolls which flank the workpiece. A wire saw is suitable for carrying out the method.

Abstract: An apparatus for cutting green ceramic bodies, includes a traveling path for green ceramic bodies, beds for supporting green ceramic bodies at constant intervals in series along the traveling path, an arm on each side of the traveling path, two drive portions for moving respective arms perpendicularly relative to the traveling path, a drive portion for moving both arms in the same direction as the traveling path, a wire for cutting green ceramic bodies, extending between the arms, and wire supporting portions, on respective arms. Each wire supporting portion includes a servo motor with an axis of rotation, a magnet member around the axis of rotation, a bobbin having a conical surface around which wire is wound, and magnetically coupled to the axis of rotation by the magnet member, and a traversing mechanism for varying the position where the wire is wound around the length of the conical surface.

Abstract: A machine for cutting slabs from a block of stone-like material includes: a fixed support structure; at least two rollers mounted for rotation about their axes at opposite ends of the frame and having a means for translating them vertically, the axes of the rollers being horizontal; at least two cutting wires passing around the rollers in such a way that they lie in respective parallel planes, substantially orthogonal to the axes of the rollers; and means for adjusting the tension of each wire independently of one another.

Abstract: A saw cable guide (1) is provided with a stand (2) and at least two rotatable cable guide rollers (5, 9) mounted pivotably thereon. These are arranged with their pivot axes (8, 12) forming an angle with one another. The saw cable (19) is led around the stand (2) at a corresponding angle. A rotatable deflecting roller (13) is located on the stand (2). The rotatable deflecting roller (13) guides the cable during the deflection and may have a cable guide surface (15) with an oblique profiling (21).

Abstract: The present invention pertains to a cable saw (1) with a frame (2), a motor drive (7) and a driven cable storage unit (6) for the sawing cable (3) moved in a circulating manner. The drive (7) has a plurality of adjacent drive wheels (11, 12), around which the sawing cable is wound and which together are driven by a motor (8). The motor (8) and optionally an interposed gear (9) are removable by means of a change-over coupling (10). In addition, the cable saw (1) can be broken down into at least three basic components, namely, a main roller head (34), a frame unit (35), and a motor unit (36).

Abstract: A method for cutting a rare earth alloy according to the present invention includes the steps of: a) supplying slurry containing abrasive grains onto a wire; and b) machining the rare earth alloy with the abrasive grains, interposed between the wire and the rare earth alloy, by running and pressing the wire against the rare earth alloy. The slurry contains, as a main component, oil in which the abrasive grains are dispersed, and the viscosity of the slurry at 25° C. is in the range from 92 to 175 mPa·sec.

Abstract: A method for cutting up a workpiece which is in rod or block form by means of a saw, wherein the temperature of the workpiece is measured during the cutting, and the measurement signal is transmitted to a control unit, which generates a control signal which is used to control the temperature of the workpiece, or wherein the temperature of the workpiece is controlled during the cutting by a control signal based on a predetermined control curve.

Abstract: A wedge (6, 6′) intended to be inserted into a cutting slot is made in two parts (41, 42), the two parts (41, 42) comprising means (3) which allow them to slide one over the other, so as to produce a double wedge (6, 6′), the total thickness of which can vary between a maximum thickness value and a minimum thickness value.

Abstract: An abrasive wire provides an efficient cutting operation with high accuracy and a longer service life. Abrasive grains are provided around a core wire. The abrasive grains are bonded to the core wire by a light curing resin or an electron beam curing resin which can be cured within a few seconds. Accordingly, the curing operation can be performed while the core wire is moved in the direction of the longitudinal axis of the core wire. Thus, a long abrasive wire can be fabricated at reduced time and cost.

Abstract: A saw wire according to the invention has two parallel wire strings having a number of saw elements evenly distributed along the wire strings. A saw element includes a platform and a cutting plate. The platform has grooves intended to receive respective parallel wire strings and a groove which is open towards the bottom to receive a driving wheel and a pulley.

Abstract: A method for cutting a rare earth alloy of the invention using a wire having abrasive grains stuck thereon is disclosed. The method includes the step of cutting the rare earth alloy while supplying a cutting fluid having a predetermined kinematic viscosity between the wire and the rare earth alloy. The method further includes the step of varying the temperature of a supplied amount of fresh cutting fluid in order to control the kinematic viscosity of the cutting fluid.

Abstract: A method for cutting a rare earth alloy using a wire with abrasive grains fixed to a core wire, including the step of cutting the rare earth alloy with the wire traveling in a state that a portion of the rare earth alloy to be cut with the wire is immersed in a coolant containing water as the main component, the coolant having a surface tension at 25° C. in a range of 25 mN/m to 60 mN/m.

Abstract: An abrasive wire provides an efficient cutting operation with high accuracy and a longer service life. Abrasive grains are provided around a core wire. The abrasive grains are bonded to the core wire by a light curing resin or an electron beam curing resin which can be cured within a few seconds. Accordingly, the curing operation can be performed while the core wire is moved in the direction of the longitudinal axis of the core wire. Thus, a long abrasive wire can be fabricated at reduced time and cost.

Abstract: The wire sawing device includes two external wire guide cylinders (1, 2) having a diameter (D1) smaller than that (D2) of the two internal wire guide cylinders (3, 4). The external wire guide cylinders are driven in rotation by a power drive to cause the movement of the wires of a layer of wires (6), whilst the internal wire guide cylinders (3, 4) ensure only the function of guidance without driving the wires of the layer of wires. By the separation of the drive function from the guide function of the wire, substantial heating of the guiding wire guide cylinders can be avoided, which permits obtaining sawed pieces of high precision without undulations.

Abstract: Slurry useful for wire-saw slicing has viscosity adjusted to 400-700 mPa·second at a shear speed of 2/second and of 50-300 mPa·second at a shear speed of 380/second. The viscosity of slurry is measured using a cone and plate type viscometer which can measure viscosity at different shear speeds. Since the slurry sufficiently flows into inner parts of grooves formed in an ingot and consumed for wire-saw slicing due to the viscosity controlled in response to the shear speed, the ingot can be efficiently sliced to wafers or discs.

Abstract: A cutting machine has a blade mounted for reciprocating movement. A workpiece is rotated while the blade is reciprocated, and then the workpiece is rotated through smaller angles to complete the cut. A holder is attached to partially cut slices of the workpiece.

Abstract: A method for cutting a rare earth alloy of this invention includes cutting an object to be machined while supplying slurry containing dispersed abrasive grains between a wire and the object to be machined. The wire is driven with a drive member, at least a wire contact face of the drive member being composed of an organic polymer material. Cutting is carried out while a tension in a range between 14.7 N and 39.2 N is applied to the wire.

Abstract: The invention concerns a wire sawing device comprising at least a support table (35) bearing a piece to be sawed (34) urged against the set of wires layer (26, 27) two outer wire-guide rolls (10, 11) powered by motors (14, 15) and at least two inner wire-guide rolls (16, 17). The wire (18) is wound on the wire-guide rolls so as to constitute between the inner wire-guide rolls (16, 17) two cross sets of wires (26, 27) whereof the projecting wires are parallel and at a distance from a first space (31) and so as to be returned by the outer wire-guide rolls (10, 11) whereon is provided a second space (30) twice the first space (31). Such an arrangement enables a balanced distribution of forces on the inner wire-guides (16, 17), the surfaces of the sawed slices to be perfectly parallel, the shearing forces on the piece to be sawed (34) to be reduced, a decrease in the cutting pressure, a greater cutting speed and to improve the precision of the resulting slices.

Abstract: A holding strip is used to hold a semiconductor ingot during semiconductor wafer fabrication. The holding strip is formed from a semiconductor material, typically the same material used to form the ingot itself. The holding strip has a holding surface shaped to receive the ingot and at least one surface other than the holding surface, into which at least one notch is formed. The holding strip has a characteristic breaking strength that changes when a cut is formed through the holding surface and into the notch. In some embodiments, the notch has sides that are substantially parallel to each other, and in other embodiments, the notch has tapered sides. In alternative embodiments, the shape of the notch causes an abrupt change or a gradual change in the breaking strength of the holding strip as the cut penetrates into the notch. In either case, the notch can be shaped to cause a gradual change in breaking strength as the cut moves deeper into the notch.

Abstract: A method for cutting a multiplicity of disks from a hard brittle workpiece is by moving the workpiece at a defined feed rate through a wire web of a wire saw. In the method, the wire web is formed by a sawing wire which moves in a reciprocating manner and is covered with bonded abrasive grain. A cooling liquid is provided beneath the wire web, in which cooling liquid the sawing wire of the wire web is immersed when cutting off the disks. Also provided is a wire saw which is suitable for carrying out the method.

Abstract: A method for cutting a rare earth alloy according to the present invention includes the steps of: a) supplying slurry containing abrasive grains onto a wire; and b) machining the rare earth alloy with the abrasive grains, interposed between the wire and the rare earth alloy, by running and pressing the wire against the rare earth alloy. The slurry contains, as a main component, oil in which the abrasive grains are dispersed, and the viscosity of the slurry at 25° C. is in the range from 92 to 175 mPa.sec.

Abstract: An ingot support device for slicing silicon is produced by molding a molding material obtained by blending an acrylic resin or an unsaturated polyester resin and one or more inorganic fillers selected from the group consisting of aluminum hydroxide, barium sulphate, barium carbonate, calcium carbonate and silica. According to the present invention, there is provided an ingot support device for slicing silicon which can be produced easily at a low cost, which has enough strength to cope with the upsizing of the ingot block, has high adhesive properties with the ingot block, and has other further improved properties which are required of the ingot support device for slicing silicon.

Abstract: A method for precision cutting liquid soluble scintillator materials by an operator is disclosed, including the steps of providing a first run of a moving filament in operative proximity to cut the scintillator materials, concurrent with wetting at least the first run length of the moving filament with organic solvent, and engaging the wetted first run with the soluble scintillator materials for a time sufficient to create a kerf having cut surfaces with solvent thereon, with the kerf cut surfaces dissolved to reshape the kerf corners, and without the formation of surface hydrates. The wetting step is accompanied by providing a second run of the wetted filament in a reverse direction and engaging the scintillator materials. The first run and second run engaging steps are concurrent with tensioning the moving filament, producing kerfs through the scintillator materials, with organic solvent delivered onto kerf surfaces.

Abstract: A guide for a concrete cutting chain saw. The guide has multiple paired slots which receive a post of a bracket mounted to the chain saw. The slots provide multiple pivotal mounts for the chain saw. The chain saw is mounted on the guide with the post being received in a pair of slots. The multiple slots provide sequential pivotal mounts for moving the saw to complete the cut. The post is mountable on either end of the bracket so the guide may be mounted on either side of the cut line.

Abstract: A closed loop wire saw loop, a method for making the closed wire saw loop, and an apparatus and method for slicing a work piece, in particular, a polysilicon or single crystal silicon ingot, utilizing a closed loop of diamond impregnated wire in which the work piece (or ingot) is rotated about its longitudinal axis as the diamond wire is driven orthogonally to it and advanced from a position adjoining the outer diameter (“OD”) of the ingot towards its inner diameter (“ID”). In this manner, the diamond wire cuts through the work piece at a substantially tangential point to the circumference of the cut instead of through up to the entire diameter of the piece and single crystal silicon ingots of 300 mm to 400 mm or more may be sliced into wafers relatively quickly, with minimal ‘kerf” loss and less extensive follow-on lapping operations. The closed wire saw loop is made by squaring and welding the wire ends together and then twice heat treating the weld at about 1500 F.

Abstract: The drive equipment which becomes from the drive pulley is attached to the prop supported by the base stand. The drive pulley consists of a stator which is a fixed axis and annular rotor prepared in the perimeter of stator and a pulley part of ring state prepared in the perimeter of rotor. The wire saw which has a ring part sintered diamond abrasive particle in the wire rod such as wire etc. is arranged and winded in a groove portion formed in the perimeter of pulley part. The wire saw winded to the pulley part is made to run by carrying out the rotating drive of rotor by turning on electricity to drive pulley and contact the wire saw and cut the cut material which made to winded.

Abstract: An articulated lock for a saw rope (5) and including a first articulated member (1; 21) having a sleeve-shaped region for receiving an end of the rope (5) and a connection region (6; 26) formed of two, spaced from each other cheeks (7, 8; 27, 28), a second articulated member (2; 22) having a sleeve-shaped region for receiving another end of the rope (5), and a connection region (9; 29) formed as an eye-shaped portion and extending into a space defined by the two cheeks (7, 8; 27, 28) of the connection region of the first articulated member (1; 21); and a joining bolt (10; 30) extending through the bores (11; 31) formed in the two cheeks (7, 8; 27, 28) and the through-opening (12; 32) formed in the eye-shaped portion for pivotally connecting the first and second articulated members (1, 2; 21, 22) with each other, with the through-opening (12; 32) of the eye-shaped portion having at least in a region of the opposite side surfaces (13; 33) of the eye-shaped portion, a diameter exceeding the diameter of the joini

Abstract: A method for cutting a rare earth alloy of this invention includes cutting an object to be machined while supplying slurry containing dispersed abrasive grains between a wire and the object to be machined. The wire is driven with a drive member, at least a wire contact face of the drive member being composed of an organic polymer material. Cutting is carried out while a tension in a range between 14.7 N and 39.2 N is applied to the wire.

Abstract: A cutting member for cutting hard materials such as rock, concrete, etc., includes a support unit in the shape of a wire. The free ends of the wire are joined together to form an endless unit. Cutting elements are provided at regular distances from each other along the full length of the wire. Each cutting element is firmly connected to a cutting element carrier and supported on the wire and at least in the mounted condition is firmly connected to a rider for guidingly engaging a portion of a saw. Driver members are attached to the wire and the cutting element carriers are floatingly supported on the wire in functional engagement with the driver members.

Abstract: An object of the present invention is to provide a wire saw cutting method that is a method for cutting a plurality of silicon monocrystal ingots into wafers with a wire saw, wherewith high-precision cutting processing is possible, reducing wafer thickness and warping defects, etc. By shifting the positions of pieces of work in the cutting feed direction, providing time differentials to the cuts, and cutting the work sequentially, the work cut first is given the role of a wire guide, making it possible to stabilize the path of the wire. Thus cuts can be made in other ingots with the wire path stabilized, it becomes possible to reduce thickness and warping defects, and processing is made possible wherewith good wafer quality and stable yield are realized.

Abstract: An apparatus for cutting a substantially cylindrical work piece in a direction generally perpendicular to a longitudinal axis of the work piece includes a wire having a plurality of cutting elements affixed thereto and a wire drive mechanism for driving the wire across and through the work piece. The wire drive mechanism includes a capstan to move the wire orthogonally across a longitudinal axis of the work piece, a rotational drive to oscillate the wire around the longitudinal axis and an advancing drive to advance the wire perpendicularly through the longitudinal axis of the work piece. In a particular embodiment disclosed herein, the apparatus comprises imparts a substantially rocking motion to the wire drive mechanism about the longitudinal axis of the work piece and the cutting elements of the wire are impregnated diamonds.

Abstract: An articulated lock for a saw rope (5) and including a first articulated member (1; 21) having a sleeve-shaped region for receiving an end of the rope (5) and a connection region (6; 26) formed of two, spaced from each other cheeks (7, 8; 27, 28), a second articulated member (2; 22) having a sleeve-shaped region for receiving another end of the rope (5), and a connection region (9; 29) formed as an eye-shaped portion and extending into a space defined by the two cheeks (7, 8; 27, 28) of the connection region of the first articulated member (1; 21); and a joining bolt (10; 30) extending through the bores (11; 31) formed in the two cheeks (7, 8; 27, 28) and the through-opening (12; 32) formed in the eye-shaped portion for pivotally connecting the first and second articulated members (1, 2; 21, 22) with each other, with the through-opening (12; 32) of the eye-shaped portion having at least in a region of the opposite side surfaces (13; 33) of the eye-shaped portion, a diameter exceeding the diameter of the joini

Abstract: A diamond-set wire for cutting stony materials or the like, comprises a cable (5; 25) to which a series of abrasive units (3; 23) is connected. Each abrasive unit (3; 23) includes a cutting member (7; 27) which has at least one portion made of abrasive material (9; 29) disposed radially on the outside of the cable (5; 25), the portions of the cutting members (7; 27) made of abrasive material (9; 29) being spaced apart along the cable (5; 25). Each abrasive unit (3; 23) is anchored to the cable (5; 25) by means of a plastics or elastomeric filling material (18; 38) interposed between the unit and the cable (5; 25). The adjacent abrasive units (3; 23) are arranged in contact with one another.

Abstract: A device for simultaneously separating a multiplicity of wafers from a hard brittle workpiece having a longitudinal axis, with a wire web made from saw wire and with an advancing device which brings about a translational relative movement, which is perpendicular to the longitudinal axis of the workpiece, between the workpiece and the wire web of the wire saw, in the course of which movement the workpiece is passed through the wire web, wherein the wire web is formed from a multiplicity of individual wires, and wherein there is a device for holding and rotating the workpiece about the longitudinal axis.

Abstract: An ingot 9 is sliced to wafers by a wire 5 which travels around grooved rollers 1 to 3. A tension applied to the wire 5 is detected by tension sensors 21, while vertical displacement of dancer rollers 19 is detected by position sensors 20. At least one of a fluctuation gap of the tension, a fluctuating velocity of the tension, an acceleration of the fluctuation, vertical movement of the dancer rollers 19, a velocity of the vertical movement and acceleration of the vertical movement is calculated from the detection results, and compared with a threshold in a calculating circuit 23 to judge a sign predicting abnormal increase of the tension. When the predicting signal appears, a command signal is outputted from the calculating circuit 22 to a controller 23 to stop operation of a wire-sawing machine or to relax the wire 5. Since rupture of the wire 5 is prevented in bud, a wire-sawing machine is efficiently driven for slicing the ingot 9 with a high productivity.

Abstract: A wire saw for cutting shaped articles from a workpiece, having at least two wire webs made from sawing wire, which are used for cutting off the shaped articles and which lie one above the other at a distance h and are tensioned between wire-guide rollers. The wire webs are formed by one or more adjacent and parallel wire segments. In this wire saw, no wire segment covers any other wire segment congruently when the wire webs are viewed from above. The invention also relates to a process for cutting a workpiece with the wire saw.