Abstract: A worktable assembly for tile cutter includes a first table having a first surface and a slot recessed on the first surface and extending along a processing axis, and a second table installed in the first table and including a main body and an insertion member protruding from the main body along the processing axis and extending into the slot and having an insertion surface flush with the first surface. The second table can move relative to the first table along the processing axis, so that the main body is close to or far from the first table. The present invention provides better support through the cooperation of the slot and the insertion member and helps prevent the tile from breaking during processing.

Abstract: There is provided a method of processing a wafer having devices formed in respective areas on a face side thereof that are demarcated by a plurality of crossing projected dicing lines on the face side. The method of processing a wafer includes a wafer unit forming step of forming a wafer unit having a wafer, a tape, and an annular frame, a dividing step of dividing the wafer along the projected dicing lines into a plurality of device chips, a pick-up step of picking up one at a time of the device chips from the wafer unit, and a measuring step of measuring the device chip picked up in the pick-up step. The method also includes a distinguishing step, before the pick-up step, of inspecting properties of the devices to distinguish acceptable devices and defective devices among the devices and storing distinguished results.

Abstract: A holding table manufacturing method includes forming a plurality of first grooves in a front surface of a plate-shaped body, forming a plurality of second grooves in a back surface of the plate-shaped body, laying, on one another, a plurality of the plate-shaped bodies formed respectively with a plurality of the first grooves and a plurality of the second grooves and uniting the plate-shaped bodies together to form a suction plate, and accommodating the suction plate in an accommodating recess of a frame body to form a holding table. The first grooves and the second grooves do not reach side surfaces of the plate-shaped body, the first grooves and the second grooves communicate with each other, and the thickness of the suction plate is larger than the depth of the accommodating recess.

Abstract: A porous chuck table for holding a plate-like workpiece under suction includes a porous plate having a porous structure, the porous plate having a holding surface for holding the workpiece under suction thereon, and a frame surrounding the porous plate and having a face side lying flush with the holding surface. The porous plate is at least made of spherical glass particles, adjacent ones of the glass particles are partly joined together, and interstices between adjacent ones of the partly joined glass particles function as pores through which a fluid can flow.

Abstract: Disclosed herein is a carrying mechanism that carries a plate-shaped workpiece in which a substrate larger than a wafer in area is stacked on a lower surface of the wafer. The carrying mechanism includes a carrying pad for covering an upper surface of the wafer, holding sections for holding the substrate on outside of the outer periphery of the wafer, and a water supply source for supplying water to the wafer. The carrying mechanism forms a predetermined gap between the lower surface of the carrying pad and the upper surface of the wafer, and carries the plate-shaped workpiece in a condition where the gap is supplied with a predetermined amount of water.

Abstract: A wafer processing method includes a modified layer forming step of applying a laser beam so as to focus the laser beam inside the wafer, and form a modified layer along each division line, a wafer supporting step of attaching an expandable dicing tape to the back side of the wafer and mounting the peripheral portion of the dicing tape to an annular frame before or after performing the modified layer forming step, a tape expanding step of expanding the dicing tape attached to the back side of the wafer, and an air blowing step of blowing air against the wafer in the condition where the dicing tape is expanded, thereby dividing the wafer into individual device chips along each division line where the modified layer is formed and also increasing the spacing between any adjacent ones of the device chips.

Abstract: An apparatus for cutting slab material comprising a working table to support the slabs to be cut during working; a working unit comprising disk cutting means and water-jet cutting means; and a unit for moving the working unit above the working table. The movement unit comprises a horizontal translation unit to move the working unit along two directions parallel to the working table and perpendicular to each other; a vertical translation unit to move the working unit along a direction perpendicular to the working table; a first rotation unit to rotate the working unit about a first axis, vertical and substantially perpendicular to the working table; and a second rotation unit to rotate the working unit about a second axis, inclined with respect to the first axis. Said disk cutting means and water-jet cutting means are integral and therefore the second rotation unit rotates simultaneously with the said cutting means.

Abstract: A semiconductor device manufacturing method comprising the steps of providing a matrix substrate having a main surface with plural device areas formed thereon, fixing plural semiconductor chips to the plural device areas respectively, then sealing the plural semiconductor chips all together with resin to form a block sealing member, dividing the block sealing member and the matrix substrate for each of the device areas by dicing, thereafter rubbing a surface of each of the diced sealing member portions with a brush, then storing semiconductor devices formed by the dicing once into pockets respectively of a tray, and conveying the semiconductor devices each individually from the tray. Since the substrate dividing work after block molding is performed by dicing while vacuum-chucking the surface of the block sealing member, the substrate division can be done without imposing any stress on an external terminal mounting surface of the matrix substrate.

Abstract: A semiconductor testing jig fixes a measurement target while it is held between a chuck stage and the measurement target. The semiconductor testing jig includes a base on which the measurement target is to be installed and which can be attached to the chuck stage. The base includes: a first main surface to become an installation surface for the measurement target; a second main surface opposite the first main surface and which is to contact the chuck stage; and a porous region containing a porous member. The porous region is provided selectively as seen in plan view, and penetrates through the base from the first main surface toward the second main surface.

Abstract: A stone saw for sawing rod-like drilling samples. The stone saw comprises a circular blade rotated by means of a rotation axle. A sample is fed against the blade and flushing fluid is sprayed on a sawing site. The stone saw further comprises collection means for collecting sawing sludge formed during sawing.

Abstract: A device (1) for positioning cutting particles (2a-c), including a receiver (4) that has a first receiving opening (5a) to receive a first cutting particle (2a), and a second receiving opening (5b) to receive a second cutting particle (2b), and comprising a unit or generator (7) for generating a holding force that affixes the cutting particles (2a; 2b) in the receiving openings (5a, 5b), and the holding force that affixes the first cutting particle (2a) in the first receiving opening (5a) can be adjusted independently of the holding force that affixes the second cutting particle (2b) in the second receiving opening (5b).

Abstract: Systems and methods are disclosed for connecting an ingot to a wire saw with an ingot holder, a bond beam, and a bar. The bar has an angled mating surface that engages a recessed surface formed in a slot of the bond beam. Mechanical fasteners are used to connect the tee bar to the ingot holder. The angle of the mating surface with respect to the recessed surface of the slot prevents deformation of the bond beam and prevents compromising the integrity of the adhesive bond between the ingot and the bond beam.

Abstract: A singulation apparatus includes a carrier having a plurality of singulation sites and a scribe line between each of the plurality of singulation sites and an adjacent singulation site. The carrier has a top surface configured to receive a semiconductor substrate thereon. Each of the plurality of singulation sites includes a deformable portion and at least one vacuum hole. The at least one vacuum hole and the deformable portion is configured to form a seal around the at least one vacuum holes when a force is applied. The present disclosure further includes a method of manufacturing semiconductor devices, especially for a singulation process.

Abstract: A cutting worktable includes a worktable body have a distal side located away from a cutting tool and a proximal side located adjacent to the cutting tool. The cutting worktable further includes a support frame assembly disposed at the proximal side of the worktable body and used to lift an object to be cut so that the object to be cut is placed on a top surface of the worktable body in an inclined posture. The support frame assembly includes a support roller for contacting the object to be cut and the worktable body is provided with a limiting structure for abutting against the object to be cut and limiting its position. The object to be cut can thus be inclined via the support frame assembly and fixed by the limiting structure. The limiting structure can be in the form of a plurality of placement grooves to achieve placement of the object to be cut at different angles relative to the cutting tool and worktable.

Abstract: The present invention provides a self-cleaning wiresaw cutting apparatus including a cleaning mechanism adapted to clean the components of the wiresaw before, during, or after a cutting process or to humidify the cutting region of the apparatus. The apparatus contains at least one dispenser adapted to dispense an aqueous fluid onto various components of the wiresaw.

Abstract: A saw system in one embodiment includes a base, a work support surface member supported by the base and including a work piece support surface defining a horizontal work piece support plane, and a plurality of wheels, each of the plurality of wheels engaged with at least one of the base and the work support surface member, wherein none of the plurality of wheels is attached to either the base or the work support surface member.

Abstract: A method and apparatus for cutting rigid, brittle articles such as tile used as a building material is improved by the capability to make both straight and curved cuts in tile on a single machine. The machine has both circular and plunge cutting tools and a table for moving the tile in both curved and straight lines in relation to the cutting tool, thereby achieving both curved and straight cuts.

Abstract: A saw system in one embodiment includes a base including a rail system, a table positionable on the rail system and including a work piece support surface defining a support plane, and a roller system attached to the table and configured to engage the rail system when the table is positioned on the rail system, the roller system including a helical actuator assembly configured such that rotational movement of an actuator rod from a first position to a second position causes at least one roller to move along a locking axis between a third position whereat the at least one roller is not engaged with the rail system and a fourth position whereat the at least one roller is engaged with the rail system, wherein the locking axis is substantially parallel to the support plane when the table is positioned on the rail system.

Abstract: A tile saw comprises a frame, a primary table moveably supported by the frame for supporting a work-piece to be cut, a water tray located under the primary table, a supporting arm mounted on the frame, and a cutting device supported by the supporting arm. The primary table also includes first and second connecting edges and a secondary table which may be removably attached, without the use of tools, to either the first or second connecting edge of the primary table. When the secondary table is attached, the supporting area for the work-piece is increased resulting in increased stability and increased cutting accuracy.

Abstract: The invention relates to a base (2) for restingly receiving tiles to be cut, comprising: a surface (13) for restingly receiving a tile; and a blade (4) for encountering a lower surface of the tile during a stage of scoring the tile. The rest surface (13) is provided with a depression or slit (12) of such dimensions as to contain a portion of a rotary cutting disc (14) of the tile when the tile is resting on the rest surface (13). The invention also relates to a tile-cutting machine (1), comprising the base (2). The invention further relates to a kit and a method for adapting a manual tile-cutting machine to use with a group comprising a rotary cutting disc (14).

Abstract: A support apparatus of slab materials includes a support structure, defining a horizontal work plane of a slab; a plurality of first supporting and sliding rollers of the slab on a first horizontal lying plane and a plurality of second supporting and sliding rollers of the slab on a second horizontal lying plane beneath the first lying plane. The first supporting and sliding rollers and the second supporting and sliding rollers are movable along a vertical direction with respect to the support structure, to bring the first and second lying plane beneath the, or at the, work plane and to load or withdraw a slab onto/from the work plane.

Abstract: A method and a plant are provided for calibrating surfaces of stone materials, suitable for working at least one slab (1) composed of an entry side and an exit side and of two parallel side edges; the slab (1) is pushed along the side edges through a conveyor belt and is subjected to the cutting action imparted by multiple tools equipped with a peripheral speed compatible with optimum cutting parameters for the stone material; the tools move along a predefined path along the surface of the slab (1), and the motion imparted by the conveyor belt and the predefined tool path is combined in order to completely cover the surface of the slab (1); the contact between the slab (1) and the tools is ensured simultaneously at least in one point on each of the two side edges of the slab (1).

Abstract: A method for efficiently machining magnets with curved surfaces is disclosed. The use of machining equipment capable of making curved cuts through magnetic material can allow significant cost and material savings, particularly when machining magnets with complementary surfaces. A process for using a series of cutting wires to simultaneously cut magnetic material into conformally shaped magnets is described.

Abstract: A carrier (13) for a silicon block (31) is designed to be firmly connected as part of a carrier arrangement (11), together with a lower carrier part (25), to the silicon block (31), and to be moved together therewith for machining by sawing, cleaning or the like. The underside of the carrier (13), which points towards the silicon block (31), has a plurality of channels (29), as does the lower carrier part (25) bonded thereto, the channels (29) in each case lying one above another. Water is introduced into the channels (29) in the carrier (13) from above and can run through sawing slots in the lower carrier part (25) between the wafers of the sawn-up silicon block (31) for cleaning purposes.

Abstract: Systems and methods are disclosed for connecting an ingot to a wire saw with an ingot holder, a bond beam, and a bar. The bar has an angled mating surface that engages a recessed surface formed in a slot of the bond beam. Mechanical fasteners are used to connect the tee bar to the ingot holder. The angle of the mating surface with respect to the recessed surface of the slot prevents deformation of the bond beam and prevents compromising the integrity of the adhesive bond between the ingot and the bond beam.

Abstract: A machine for machining materials in blocks or slabs includes: a) a tool-holder unit displaceable above an external working surface, in a parallel and orthogonal directions with respect to the working surface; b) a manipulator unit which is coupled to the tool-holder unit, and includes gripping means of a material in block or slab to be worked; wherein the gripping means are moveable between a first inoperative position, which is distal with respect to the working surface, and a second operative position, which is proximal with respect to the working surface. The gripping means are rotatable between the first inoperative position and the second operative position.

Abstract: An apparatus for machining an article (L) in the form of a slab or the like comprises—in addition to a rotary tool (24) associated with a spindle (22)—a nozzle (26) ejecting water at very high pressure. Both the rotary tool and the nozzle are supported by a carriage (20) sliding along a beam (18) in turn sliding along two shoulders (14) in a perpendicular direction. In the working area (12) and above a tank (30) normally filled with water, the article (L) is supported in a horizontal position not only by an interchangeable grid (32; 52), but preferably also by a disposable support (34) which prevent the rotary tool (24) from coming into contact with the grid. The disposable support is periodically replaced.

Abstract: A wire saw work piece support device (200) has a support surface (214, 314) adapted for supporting a work piece (100) being sawed by a wire saw (1) during sawing, the support surface (214, 314) defining a support plane. The wire saw work piece support device comprises: a solid support body (210); and at least one wire receiving volume (220, 230) for receiving therein a wire (10) of the wire saw 1 during sawing, the at least one wire receiving volume (220, 230) having a work piece side delimited by the support plane, and a base side delimited by a surface portion (224) of the solid support body (210), wherein the at least one wire receiving volume (220, 230) has a thickness between the work piece side and the base side of at least 60 mm in a direction orthogonal to the support plane.

Abstract: A tile saw includes a base, a frame assembly disposed on the base, a first rail disposed on the frame assembly, the first rail having a longitudinal axis, a table slidingly disposed on the first rail, a support assembly disposed on the base, a saw assembly supported by the support assembly, the saw assembly including a motor, a cutting wheel driven by the motor, the saw assembly being pivotable about a horizontal axis substantially parallel to the longitudinal axis, and a switch electrically connected to the motor and disposed on the support assembly so that, when the motor assembly is pivoted about the horizontal axis, the switch remains stationary.

Abstract: A corner jig for a masonry saw for fabricating a cut in a masonry unit (e.g., brick) such as to form a corner brick veneer may have a push block wherein its height is substantially equal to a length of a brick to be formed into the corner brick veneer. A lateral position of a cut guide is adjustable to regulate a thickness of the corner brick veneer. A height of the cut guide may also be substantially equal in length of the bring to be formed into the corner brick veneer. Once the cut guide and push block are mounted to the masonry saw, the brick is positioned within the corner jig and a first cut is made. The user's hands are out of the way so that the cut can be made safely without harming the operator. The brick is repositioned and a second cut is made in the brick to finish off the corner brick veneer. Once again, the user's hands are out of the way for safe operation of the masonry saw.

Abstract: An integrated wafer processing system and a method thereof is disclosed. In one embodiment, a wafer stack of sliced wafers includes a base, and a plurality of sliced wafers extending outwardly from the base, where the plurality of sliced wafers are obtained by slicing a portion of a work piece, where the base is an uncut portion which is the remaining portion of the work piece or a plate attached by welding to the plurality of sliced wafers and where the work piece is mono-crystalline or multi-crystalline silicon. Further, the wafer stack of sliced wafers are treated in-situ in cleaning and wet chemical tanks for processes such as damage etching, texturization and oxide etching and also treated in-situ in high temperature furnaces for processes such as diffusion and anti-reflection coating.

Abstract: Embodiments of the present invention are directed to a fixture assembly that is capable of holding work pieces such tiles of various sizes in various positions in a manner which enables freehand cutting. Various embodiments include a main fixture having a working top surface area that includes strategically placed cylindrical openings that are configured to receive easily manipulated tile holding clamps, various dogs that can be removably secured to the fixture in order to place tiles in a desirable position to be held during a cutting operations. The fixture is light weight and is easily transportable to a jobsite and has the capability of storing the clamps, dogs, marking instruments and the like.

Abstract: A tile cutting table device featuring a platform with foldable legs; four side panels pivotally attached to side edges of the platform, the side panels can pivot between a down position and an up position forming an enclosure around the top surface of the platform; a water inlet hole for fluidly connecting a water source to the device; a drainage hole disposed in the platform; a perforated tile cutting plate disposed on the top surface of the platform; a clamp bar positioned over the tile cutting plate, the clamp bar functions to clamp down on a tile to hold the tile in place during cutting procedures, the clamp bar is connected to a foot pedal which functions to move the clamp bar between an up position and a down position, wherein the clamp bar is biased in the up position caused by compression springs.

Abstract: A device for holding a substrate block to be sawed and for flushing the intermediate spaces formed by sawing the substrate block. It comprises two regions arranged parallel to the device longitudinal axis and above one another, the upper region being configured as an adapter region by means of which the device can be connected to a machine instrument, and the lower region being formed as a holding region which comprises a circumferentially closed or closable channel system which can be supplied with flushing liquid by means of closable supply openings and the bottom of which is opened in a slot-like fashion during the sawing of the substrate block so as to provide passage openings for the flushing liquid. A method for flushing intermediate spaces formed by sawing a substrate block using the above device.

Abstract: A cutting machine having a liquid lubrication delivery system. The machine includes a work-piece platform having an upper surface for supporting a work-piece thereupon. The work-piece platform can further include a main channel defining a recess in the upper surface. At least one liquid lubrication inlet for discharging liquid into the main channel can also be present on the work-piece platform. The at least one liquid lubrication inlet can be a plurality of liquid lubrication inlets.

Abstract: A row bar holder to hold a plurality of row bars containing reader heads for scanning operations is disclosed. The row bar holder includes: a base fixture having a length defining a y-axis and a width defining an x-axis, a plurality of separator walls formed on a top surface of the base fixture spaced from one another to separate the plurality of row bars containing reader heads, a plurality of grooves defined between the adjacent separator walls to receive the row bars, respectively, and a draw bar mountable within the base fixture, the draw bar having a plurality of draw bar walls that approximately align with the plurality of separator walls of the base fixture along the y-axis.

Abstract: The present method of grinding side ridge line portion and a side surface of concrete blocks having the flowing steps: providing a rotating shaft of the grinding machine to be rotationally supported by lower ends of two vertical bars facing each other in the direction in which a conveyor is advanced and suspended from a frame above the conveyor and positioning an axis of the rotating shaft to be laterally and above the conveyor, moving the concrete blocks to a position where it is ground by the conveyor and then positioning the concrete blocks to make side ridge line portions on the bottom surfaces thereof protrude from the conveyor, and grinding the side ridge line portions and/or side surfaces on the upper or the bottom surface of the concrete block by lowering the grinding machine suspended from above the concrete block, the side ridge line portions and/or the side surfaces of the concrete blocks are ground by abutting the grinding machine against the surface of concrete blocks, while at the same time rota

Abstract: A method for manufacturing semiconductor chips from a semiconductor wafer, including the steps of: fastening, on a first support frame, a second support frame having outer dimensions smaller than the outer dimensions of the first frame and greater than the inner dimensions of the first frame; arranging the wafer on a surface of a film stretched on the second frame; carrying out wafer processing operations by using equipment capable of receiving the first frame; separating the second frame from the first frame and removing the first frame; and carrying out wafer processing operations by using equipment capable of receiving the second frame.

Abstract: A thin veneer stone saw and related methods are provided. The thin veneer stone saw includes one or more circular saw blades. In an embodiment, two circular saw blades are arranged such that a masonry block, such as stone, may be sawed completely through in a single pass through the thin veneer stone saw. The stone may be delivered to, and processed through, the circular saw blades by a conveyor system. One of the circular saw blades may be centered below the top surface of the conveyor and protrude through a gap between two sections of the conveyor system. The other circular saw blade may be positioned entirely above the top surface of the conveyor system. The thin veneer stone saw may be operable to produce thin veneer stones in a variety of widths. The thin veneer stones may be used to form facade for a structure.

Abstract: The present invention provides a portable stone shaper resembling a tabletop jigsaw, this machine contains operational components germane to larger stone and tile cutters. Yet, in addition to its compact size, the Portable Stone Cutter embodies other unique design features. First, the base of the unit contains a two inch water tank and pump mechanism. This component facilitates proper lubrication, as well as safe and pristine finishes. Additionally, the device of the present invention is able to use virtually any type of common or specialized bits for cutting. Easily interchangeable, the versatility of the bit usage ensures that one has any bit needed for any job at all times. The Portable Stone Cutter can be sold with a standard bit selection and other bit designs made especially for this product are sold separately, as an aftermarket product. The device of the present invention operates on conventional one hundred ten volts, sixty hertz power and is connected to a standard power outlet.

Abstract: A tile saw includes a base, a frame assembly disposed on the base, a first rail disposed on the frame assembly, the first rail having a longitudinal axis, a table slidingly disposed on the first rail, a support assembly disposed on the base, a saw assembly supported by the support assembly, the saw assembly comprising a motor, a cutting wheel driven by the motor, the saw assembly being pivotable about a horizontal axis substantially parallel to the longitudinal axis, and a switch electrically connected to the motor and disposed on the support assembly so that, when the motor assembly is pivoted about the horizontal axis, the switch remains stationary.

Abstract: The invention relates to a base (2) for restingly receiving tiles to be cut, comprising: a surface (13) for restingly receiving a tile; and a blade (4) for encountering a lower surface of the tile during a stage of scoring the tile. The rest surface (13) is provided with a depression or slit (12) of such dimensions as to contain a portion of a rotary cutting disc (14) of the tile when the tile is resting on the rest surface (13). The invention also relates to a tile-cutting machine (1), comprising the base (2). The invention further relates to a kit and a method for adapting a manual tile-cutting machine to use with a group comprising a rotary cutting disc (14).

Abstract: Certain embodiments of the present technology provide systems and methods for delivering pressurized fluid to a rotary cutting blade. For example, in certain embodiments, a system for delivering pressurized fluid to a rotary cutting blade includes: a pump configured to receive fluid from a fluid source and pressurize the fluid; and a nozzle configured to receive pressurized fluid from the pump and deliver the pressurized fluid to a rotary cutting blade as an atomized fluid stream, wherein the pump pressurizes the fluid to a pressure sufficient to cause the fluid to be atomized when the fluid is passed through the nozzle. For example, in certain embodiments, a method for delivering pressurized fluid to a rotary cutting blade includes: delivering fluid to a pump; pressurizing the fluid using the pump; and delivering the pressurized fluid to a rotary cutting blade through a nozzle as an atomized fluid stream.

Abstract: The device (1) for wire sawing of a piece (10) to be sawed that is mounted on a support table (20) comprises fastening means (15, 26, 40) for fastening said piece (10) to be sawed to a carriage (18) apt to cooperate with a guide rail of said support table (20), said fastening means (15, 26, 40) consisting of a mounting plate (15) apt to be manufactured to which said piece (10) to be sawed is bonded, and of anchoring means (26, 40) for anchoring said mounting plate (15) directly on said carriage (18).

Abstract: A tile cutter which has increased cutting capability and with good portability at the same time, comprises a support frame, a saw unit mounted on the support frame, at least one rail and a worktable assembly. The at least one rail is fixed on the support frame and comprises a longitudinal axis. The worktable assembly comprises at least a first worktable and a second worktable, support surfaces of which are in the same plane. The second worktable is slidably installed on the first rail and the first worktable is installed on the second worktable.

Abstract: An apparatus for machining an article (L) in the form of a slab or the like comprises—in addition to a rotary tool (24) associated with a spindle (22)—a nozzle (26) ejecting water at very high pressure. Both the rotary tool and the nozzle are supported by a carriage (20) sliding along a beam (18) in turn sliding along two shoulders (14) in a perpendicular direction. In the working area (12) and above a tank (30) normally filled with water, the article (L) is supported in a horizontal position not only by an interchangeable grid (32; 52), but preferably also by a disposable support (34) which prevent the rotary tool (24) from coming into contact with the grid. The disposable support is periodically replaced.

Abstract: A method of manufacturing thin closure magnetic read/write heads, such as magnetic tape heads is provided. The method provides improved flexural strength of the closure so that the closure breakage during fabrication of the heads is mitigated and closure thickness is reduced. An array of chips is fabricated on a wafer. The array is closed, with a closure strip bonded to each row of the array. Closures span only the length of a row, so that the closures are not subjected to flexure during processing and breakage due to flexure is mitigated. Side bars are bonded to the array to form a column with dimensions similar to prior art columns. This allows columns manufactured by the invention to undergo additional processing using existing processes.

Abstract: A tile saw comprises a frame, a primary table moveably supported by the frame for supporting a work-piece to be cut, a water tray located under the primary table, a supporting arm mounted on the frame, and a cutting device supported by the supporting arm. The primary table also includes first and second connecting edges and a secondary table which may be removably attached, without the use of tools, to either the first or second connecting edge of the primary table. When the secondary table is attached, the supporting area for the work-piece is increased resulting in increased stability and increased cutting accuracy.

Abstract: A stone cutting device that utilizes first and second blade assemblies aligned within first and second support members. The first blade assembly is equipped with a source of hydraulic pressure that provides force to drive a blade downward. A second blade assembly meanwhile has a blade disposed within an opening of a table such that when a stone is placed on the table the blade does not contact the stone. Resilient members are placed underneath the table such that when pressure is applied from the blade of the first blade assembly the table and stone move downwardly to contact the blade of the second blade assembly thus providing pressure on either side of the stone in order to cut the stone or block.

Abstract: A device (1) for processing a slab of stone or stone-like material, comprises a support table (2), adapted for receiving slab, and a fixed guide rail (3) running in a first direction (X) along a side of the support table. The device further comprises an arm (4), extending in a cantilevered manner, in a second direction (Y) from the guide rail and across at least a portion of the support table. The arm is displaceable relative the guide rail in a third direction (Z). A method for processing a slab of stone or stone-like material is also disclosed.