Abstract: Disclosed is a dicing machine for cutting a CSP plate into pellets and for transferring and putting them in a transport tray. The pick-up-and-transport means picks a selected pellet from a diced CSP plate to carry and put the so selected pellet in an allotted cell in a transport tray. On the way to the transport tray storage area, there is cleaning means for wiping and removing minute pieces of debris if any from the rear side of each pellet. The cleaning means includes a wiper in the form of rotary sponge roll, which is wet with washing liquid, and is rotated to expose its clean surface to each pellet all the time.

Abstract: A stone cutter includes a working station separated at center by a partition to form a water sink and a motor compartment. The motor has a shaft inserted through the partition entered into the water sink and connected to a disk saw. A water trough in four sides of the working station. A pair of rulers having the serrations on outer edge on opposite side and a rail formed on the other side of the working station. A bar pivoted with a dividing circle slidably inserted into the rail for cutting the angled working pieces. A slidable guide slides between the rulers for cutting the rectangular working pieces. And a second working plate can be sloped on the motor compartment for cutting the oblique edge of the working pieces in different angle less than 90 degrees.

Abstract: A tile cutting guide arrangement includes a cutting table, slidably supported on the supporting frame, having a main cutting channel wherein a saw blade of a power saw machine is arranged to overhanging travel along the main cutting channel, and a tile guider slidably mounted on the cutting table. The tile guider includes a plurality of rip guides spacedly formed thereon wherein each rip guide has a guiding edge, which is 45 degrees with respect to the main cutting channel, adapted for guiding an edge of a tile on the cutting table, so as to align a diagonal of the tile with the main cutting channel of the cutting table.

Abstract: An about vertical tile cutting saw having a structure that orientates the ceramic tile for cutting in an about vertical plane and wherein the saw blade cutting means is disposed rearward of the ceramic tile to the cut, thereby allowing for use of the tile saw in close quarters.

Abstract: A saw includes a base having a first length extending generally along a first direction, a table disposed on the base, a saw unit disposed on the base, wherein one of the table and the saw unit is movable relative to the base along the first direction over a range which exceeds the first length. The saw may also include a first stationary rail connected to the base and extending generally along the first direction and a first movable rail engaging the first stationary rail and extending generally parallel to the first stationary rail, the first movable rail being connected to the one of the table and saw unit. Preferably, the first movable rail is slidingly received over the first stationary rail. The saw may also include a first rack disposed on the first movable rail, and a first pinion disposed on the base, wherein the first pinion meshes with the first rack so that the first movable rail moves along the first direction upon rotation of the first pinion.

Abstract: This invention is an improved structure for saw clip. On the working desk, there is a lead trough. On the pivot of this working desk, there is a block section for items to wait to be sawed. A top pusher block, when moved onwards, can be used to fix the items so that the sawing process can go smoothly. Among the parts of this invention, there is a sliding trough on top of the block and the sliding trough and the lead trough go across each other. Moreover, a lead screw goes through both the sliding trough and lead trough. The lead screw can be adjusted to be at any position in the lead trough to change how the block is placed. Then, the block can be screwed tightly so that it will not turn upon receiving the pushing force from clipping.

Abstract: A saw includes a base having a first length extending generally along a first direction, a table disposed on the base, a saw unit disposed on the base, wherein one of the table and the saw unit is movable relative to the base along the first direction over a range which exceeds the first length. The saw may also include a first stationary rail connected to the base and extending generally along the first direction and a first movable rail engaging the first stationary rail and extending generally parallel to the first stationary rail, the first movable rail being connected to the one of the table and saw unit. Preferably, the first movable rail is slidingly received over the first stationary rail. The saw may also include a first rack disposed on the first movable rail, and a first pinion disposed on the base, wherein the first pinion meshes with the first rack so that the first movable rail moves along the first direction upon rotation of the first pinion.

Abstract: The invention relates, in one embodiment, to an arrangement configured to support a substrate during a dicing process. The substrate has thereon a first substrate side and a second substrate side. The first substrate side is smoother than the second substrate side. The arrangement includes a nest having a first nest side and a second nest side. The nest includes a grid which defines at least one nest opening. The nest opening has an opening area that is smaller than an area of a die diced from the substrate. The arrangement further includes a vacuum retainer plate having thereon at least one vacuum pedestal. The vacuum pedestal has an upper surface formed of a resilient material. The vacuum pedestal is configured to be disposed through the nest opening when the nest is mated with the vacuum retainer plate.

Abstract: A foldable and transportable stone cutting system has been invented for cutting and shaping stones in a field, construction sites and the like, among others. The stone cutter system is so designed that a major cutting portion, e.g., the upper guillotine element, may be folded down during a transportation process. This improved stone cutter system has made a remote or on-site construction work more feasible and at the same time has enhanced its safety during its transportation because of its foldability. This foldable and transportable stone cutting system possesses the towable characteristics needed and the needed safety features. Relevant methods and other disclosures on how the system works and how the unique design has achieved folding capability and towability are also discussed.

Abstract: A holding strip is used to hold a semiconductor ingot during semiconductor wafer fabrication. The holding strip is formed from a semiconductor material, typically the same material used to form the ingot itself. The holding strip has a holding surface shaped to receive the ingot and at least one surface other than the holding surface, into which at least one notch is formed. The holding strip has a characteristic breaking strength that changes when a cut is formed through the holding surface and into the notch. In some embodiments, the notch has sides that are substantially parallel to each other, and in other embodiments, the notch has tapered sides. In alternative embodiments, the shape of the notch causes an abrupt change or a gradual change in the breaking strength of the holding strip as the cut penetrates into the notch. In either case, the notch can be shaped to cause a gradual change in breaking strength as the cut moves deeper into the notch.

Abstract: Disclosed is a CSP plate holder for use in dicing a CSP plate into individual pellets and in transporting and putting them in a transport tray. The CSP plate holder is composed of a flat plate for sucking and fixedly holding a CSP plate thereon. The flat plate has pellet areas each allotted to each of the individual pellets. Each pellet area has a through hole for sucking and fixedly holding the pellet while the CSP plate is being diced. Each pellet area has at least one suction hole for sucking and fixedly holding the pellet while the CSP plate is being transported. The flat plate has duct passages permitting the suction holes to communicate with a suction source for applying a suction force to the pellet. In addition, the flat plate has at least one minute through hole made in each pellet area.

Abstract: A device for cutting a row of interconnected rectangular plate-shaped workpieces into a plurality of individual rectangular units, includes a machine bed, and a sliding member disposed slidably on the machine bed and movable along a straight path. A rectangular work seat is disposed rotatably on the sliding member, and is rotatable about a vertical axis on the sliding member. The work seat has four sides, a length and a width. A mounting frame is disposed around the work seat, and defines a rectangular hole therein, which has four sides that are respectively parallel to the four sides of the work seat, and a length and a width that are respectively and slightly larger than those of the work seat. An adhesive sheet has an adhesive top surface with an outer peripheral portion that is adhered to a bottom surface of the mounting frame. The interconnected workpieces are adhered to the top surface of the adhesive sheet so as to be cut while disposed inside the mounting frame.

Abstract: A holding unit is provided to support an ingot in a semiconductor wafer sawing machine, which minimizes the instability of a blade during a sawing process. The holding unit is formed from substantially the same material as an ingot resting thereon. The holding unit includes a top surface for receiving an ingot, a bottom surface, a pair of side walls, and a cavity formed in the holding unit. The cavity forms a plurality of break points in the holding unit. When contacted by the blade, the holding unit fractures at the break points to minimize the chipping of the wafer.

Abstract: A holding unit is provided to support an ingot in a semiconductor wafer sawing machine, which minimizes the instability of a blade during a sawing process. The holding unit is formed from substantially the same material as an ingot resting thereon. The holding unit includes a top surface for receiving an ingot, a bottom surface, a pair of side walls, and a cavity formed in the holding unit. The cavity forms a plurality of break points in the holding unit. When contacted by the blade, the holding unit fractures at the break points to minimize the chipping of the wafer.

Abstract: A method of fabricating support members for wafer processing fixtures and the produce are disclosed. In the first step of the method, an elongate support member basic form is provided. The basic form has a substantially wedge-shaped cross-section and angular comers. A plurality of wafer-retaining slots are cut along one side of the support member basic form. The support member basic form can include a front surface and a rear surface, with at least one angular comer occurring on each of the surfaces. The comers have a larger radius on the rear than in the front. Attachment structures on terminal ends can be fixed to bases. The elongate support member basic form can be fabricated from an inert crystalline material, such as polycrystalline silicon or monocrystalline silicon.

Abstract: By preventing warping of chips when detaching individual chips from a dicing sheet, improvement in quality without cracks and in productivity is realized. A collet (115) used in a step of detaching chips (110) discretely divided as bonded to a dicing sheet (109) from the dicing sheet has a flat attraction surface made of a porous material of a size equal to or larger than the chip size. Alternatively, the collet may have a chip attraction groove containing poles, balls or hemispheres, for example, to prevent warping of chips. In the step of detaching each chip from the dicing sheet, a means for reducing the bonding force of the dicing sheet, such as heating device or cooling device, may be provided. Thus, warping or cracking can be prevented in a process of thinned semiconductor substrate. Additionally, since the means for reducing the bonding force of the dicing sheet is provided in a semiconductor manufacturing equipment, breakage or cracking of chips can be prevented more reliably.

Abstract: By preventing warping of chips when detaching individual chips from a dicing sheet, improvement in quality without cracks and in productivity is realized. A collet (115) used in a step of detaching chips (110) discretely divided as bonded to a dicing sheet (109) from the dicing sheet has a flat attraction surface made of a porous material of a size equal to or larger than the chip size. Alternatively, the collet may have a chip attraction groove containing poles, balls or hemispheres, for example, to prevent warping of chips. In the step of detaching each chip from the dicing sheet, a means for reducing the bonding force of the dicing sheet, such as heating device or cooling device, may be provided. Thus, warping or cracking can be prevented in a process of thinned semiconductor substrate. Additionally, since the means for reducing the bonding force of the dicing sheet is provided in a semiconductor manufacturing equipment, breakage or cracking of chips can be prevented more reliably.

Abstract: A tile saw includes a base, a frame supported on the base, a sliding table supported on the frame, an arm mounted to the frame, and a rotary saw mounted to the arm for cutting tile or other masonry products placed on the sliding table. The table includes rollers which ride inside substantially enclosed tracks on the frame. The substantially enclosed tracks prevent fluid from reaching the tracks and the rollers and prevent deposits of sludge from forming on the tracks and rollers and hampering the smooth movement of the sliding table. Also, because the rollers ride in enclosed tracks, the table is stable and does not tip relative to the tile saw. Also, the table can be easily removed from the tile saw when a locking assembly is unlocked. The base includes an integral reservoir and is hollow for increased rigidity. A blade guard pivots to a position to provide access to the saw blade, and includes an improved clamping mechanism.

Abstract: The invention relates, in one embodiment, to an arrangement configured to support a substrate during a dicing process. The substrate has thereon a first substrate side and a second substrate side. The first substrate side is smoother than the second substrate side. The arrangement includes a nest having a first nest side and a second nest side. The nest includes a grid which defines at least one nest opening. The nest opening has an opening area that is smaller than an area of a die diced from the substrate. The arrangement further includes a vacuum retainer plate having thereon at least one vacuum pedestal. The vacuum pedestal has an upper surface formed of a resilient material. The vacuum pedestal is configured to be disposed through the nest opening when the nest is mated with the vacuum retainer plate.

Abstract: The present invention provides a fixture for mounting a substrate to mounting tape on a film frame so as to retain the substrate to the film frame for dicing. A plurality of grooves for receiving a cutting saw extend longitudinally and transversely across the fixture to define die regions. The fixture also includes a plurality of apertures that align with the substrate and with dies to be cut from the substrate. The aligned apertures supply vacuum to the substrate to retain the substrate and cut dies in the fixture. When the dicing is completed, the vacuum is turned off and the individual dies can be readily removed from the fixture.

Abstract: A case for storing a grinding wheel which comprises an annular support member and a grinding means provided on the lower end face of the support member. The case includes a first case member and a second case member, the first case member and the second case member are connected to each other by a hinge member in such a manner that they can pivote relative to each other and selectively set to a close state for defining a closed storage space and to an open state for opening the storage space. A receiving means is provided on the first case member and a restricting means is provided on the second case member. The support member is held between the receiving means and the restricting means, and the grinding wheel is stored in the storage space, without allowing the first case member and the second case member to contact with the grinding means.

Abstract: A method of forming a support for supporting the underside of a semiconductor wafer having a circuit side, an underside, and a street index that defines dice on the semiconductor wafer, at least during dicing of the semiconductor wafer, is provided. The method includes providing a support having a surface for supporting the underside of the semiconductor wafer and forming at least one recess in the surface corresponding to the street index of the semiconductor wafer.

Abstract: A method is for simultaneously cutting off a multiplicity of wafers from a hard, brittle workpiece which has a longitudinal axis and a peripheral surface. The workpiece is guided, by means of a translational relative movement, directed perpendicular to the longitudinal axis, between the workpiece and a wire web of a wire saw with the aid of a feed device, through the wire web which is formed by a sawing wire. The workpiece is rotated about the longitudinal axis while the wafers are being cut off. There is also a wire saw which is suitable for carrying out the method and has a device for holding and for rotating the workpiece about the longitudinal axis.

Abstract: A method of fabricating support members for wafer processing fixtures and the produce are disclosed. In the first step of the method, an elongate support member basic form is provided. The basic form has a substantially wedge-shaped cross-section and angular corners. A plurality of wafer-retaining slots are cut along one side of the support member basic form. The support member basic form can include a front surface and a rear surface, with at least one angular corner occurring on each of the surfaces. The corners have a larger radius on the rear than in the front. Attachment structures on terminal ends can be fixed to bases. The elongate support member basic form can be fabricated from an inert crystalline material, such as polycrystalline silicon or monocrystalline silicon.

Abstract: A portable masonry saw comprises an upper frame assembly; a lower frame assembly secured to the upper frame assembly; a gasoline engine for driving a cutting blade of the saw, secured to a mounting deck; connected to the upper frame assembly; resilient supports on the bottom of the lower frame assembly for securely supporting the saw on the floor of a work area in a stationary position during a cutting operation; a plurality of wheels on the bottom of the lower frame assembly for transporting the apparatus when it is tilted to a and a transport position. The combined vertical height of the upper and lower frame assemblies is such that an operator may readily operate the saw to cut masonry materials and transport the saw on the wheels from a kneeling position. Resilient, vibration damping material is also provided between the upper frame assembly and the mounting deck to facilitate cleaner cuts.

Abstract: A stone cutter has a sink standing upon a callapible support, a frame disposed on the sink including an upright at a corner portion and a guide rod longitudinally secured in the frame, a platform including a tubular slider of splined inner periphery sliding on the guide rod and plurality of pulleys on the other side slidable on the frame, a housing including a sleeve sleeved on the upright of the frame, a switch, an indicator transversely disposed in the housing positioned opposite to the sleeve, a saw blade secured to an axis of the motor and a casing covering the upper portion of the saw blade having one end rotatably secured to the housing and a pair of water suppliers on two side to provide water to clean the dust from a working piece during the operation of the stone cutter.

Abstract: A saw apparatus for cutting a work piece includes a circular saw blade, a saw blade drive mechanism including a motor drivably connected to the saw blade and having a motor pulley, and including a blade mounting structure, a saw table including a housing with a housing side wall, and a housing top wall having a blade passing opening and being hingedly secured to and resting on the housing side wall, a housing partition defining a drive mechanism chamber and a blade mounting chamber within the housing having a drive mechanism chamber bottom wall sealingly joined to the housing side wall, and a cooling liquid contained within the blade mounting chamber, so that the blade mounting mechanism includes a blade axle extending through the housing partition between the blade mounting chamber and the drive mechanism chamber, and the blade protrudes up through the blade passing opening and down into the cooling liquid, and a blade axle pulley is secured to the blade axle, passes through the housing partition, and a belt

Abstract: An apparatus for dicing a semiconductor wafer having a circuit side, an underside, and a street index that defines dice on the semiconductor wafer is disclosed. The apparatus includes a support having a surface for supporting the underside of the semiconductor wafer and at least one recess in the surface corresponding to the street index of the semiconductor wafer.

Abstract: A method of dividing a semiconductor wafer into dice, wherein the semiconductor wafer has a circuit side, an underside, and at least one street index that defines the dice, is disclosed. The method includes placing the underside of the wafer on a support having a surface and at least one recess in the surface corresponding to the at least one street index of the wafer, aligning the street index of the semiconductor wafer with the at least one recess in the surface, and dividing the semiconductor wafer along the at least one street index.

Abstract: A splitter for splitting stone, concrete, wood and the like comprising a frame (21), a first splitter blade (24) moveable relative to the frame (21), a second splitter blade (23), and hydraulically actuatable means (26, 27) for pulling the first splitter blade (24) towards the second splitter blade (23) to effect said splitting. The hydraulically actuatable means (26, 27) preferably acts on end portions of the first blade (24) to provide increased leverage for the splitting operation. The first blade (24) is preferably provided with centering means (32, 28, 29, 31) for urging the first blade (24) into a central position when it has been moved to one side during the splitting operation.

Abstract: An apparatus and method is disclosed for uniformly deglazing and finishing flat and arcuate surfaces of transmission and other automotive parts. A tapered part support engages a central opening of parts from different models and manufacturers having different size openings. Smaller parts are held in place without tightening or loosening clamps. Larger parts are simply and easily stabilized by a hold down. Operation of a power tool on the working surface of the parts continually rotates the part and part support with respect to a hand held power finishing tool. Working surfaces are thereby uniformly deglazed and roughened for replacement. High productivity is provided with an inexpensive low maintenance tool that even small shops can afford.

Abstract: A method of transferring a semiconductor die from a wafer containing a plurality of semiconductor dice. There is provided a semiconductor wafer having a top side and an opposing bottom side and a plurality of dice formed therein, each die containing a portion of the top side and the opposing bottom side. The wafer is removably secured to a support and the wafer is operated upon to form individual dice on the support. The support is preferably a flexible film. A tool is disposed between the support and the bottom side of a the die by creating a vacuum between the tool and the bottom side to cause adherence of the die to the tool and the die is removed from the support with the tool and placed in a die carrier with the top side facing the carrier and the vacuum is then released. The film, when flexible, is stretched to separate the dice from each other and create streets between adjacent dice so that the tool can be disposed under the die from the street.

Abstract: An apparatus for manufacturing a plurality of wafers by slicing a cylindrical ingot with a wire saw. The apparatus includes a measuring device for measuring the crystal orientation of the ingot; an adhering device for adhering a support to the surface of the ingot based on the orientation where the support includes an intermediate plate and a support plate, where the support plate is adapted to fit the wire saw, and where the adhering device includes an auxiliary adhering element for adhering the intermediate plate to the surface of the ingot and an adhering element for adhering the support plate to the intermediate plate; a dryer for drying and solidifying an adhesive applied between the ingot and the intermediate plate and an adhesive applied between the intermediate plate and the support plate; and the wire saw for slicing the ingot into the plurality of wafers while the ingot is supported on the support.

Abstract: A tool is provided for cross-sectioning an integrated circuit in a hands-free mode of operation. The tool comprises an enclosure or cage having a passageway through which a sample—such as an integrated circuit, which may be encased in epoxy or some other substance—is brought into contact with an abrasive surface such as a milling disk. A wall or plate of the enclosure is adjustable in order to accommodate a variety of sample sizes, including both dies and packages. During the grinding or polishing of the sample the rotation of the milling disk helps stabilize the sample against the adjustable wall and one or more other walls of the enclosure. The enclosure is situated at a selectable position along a frame or guide that is mounted above the milling disk. Releasable connectors are used to secure the enclosure in a selected position yet allow it to be relocated as the milling disk becomes worn.

Abstract: A manual appliance for cutting tiles, has a carriage (4) which slides above a base (1) which receives a tile to be cut. The carriage (4) has a cutting wheel (19) and a breaking head (23). The breaking head (23) is able to respond to a control means (34), in order to adopt either an idle retracted position so that the wheel comes into contact with and score the tile placed on the base (1), or, a working position in which only the breaking member comes into contact with the top face of the tile. The carriage has a handle (21) for exerting a bearing force on the wheel (19) when it scores the tile, and a bearing force on only breaking member (23) when it is in its working position.

Abstract: A frame assembly for a cutting apparatus includes a frame and a saw-motor mounting structure that is removably attachable to the frame. Therefore, a craftsperson can break down the frame assembly to allow easy transport of the cutting apparatus. Another apparatus includes a frame, motorized tool, item tray, and coolant pan. The frame has a coolant-pan slot, and the motorized tool is attachable to the frame. The item tray is movably mounted to the frame, and the coolant pan is slidably mounted within the coolant-pan slot. Therefore, a craftsperson can adjust the position of the coolant pan to catch coolant that dribbles off the item in the item tray. In addition, a cutting/routing apparatus includes a frame, a saw-motor mounting structure, a saw, a router mounting structure, a router, and a cutting/routing tray. The saw-motor mounting structure is attachable to the frame, and the saw is mountable to the saw-motor mounting structure.

Abstract: A work piece such as a semiconductor ingot is positioned and bonded to a work piece bonding block by a bonding jig which is provided separately from a wire saw in such a manner that the central axis of the work piece and respective horizontal and vertical surfaces of the work piece bonding block come into parallel to each other. Then, the work piece bonding block is positioned and mounted at a mounting jig which is provided on a cutting-feeding table of the wire saw and which has horizontal and vertical reference surfaces perpendicularly intersecting a cutting plane, so that the central axis of the work piece automatically and perpendicularly intersects the cutting plane.

Abstract: A cover for covering a processing chamber, in which a plurality of grooved rollers of a wire saw is arranged, is composed of an outside cover and an inner cover. The outside cover covers the plurality of grooved rollers, and the inner cover covers an ingot. This prevents slurry and cutting chips from scattering to the outside of the wire saw while it is slicing the ingot. When the ingot is attached and detached, a winch opens the outside cover and a cylinder apparatus opens the inner cover to expose the processing chamber.

Abstract: A method and apparatus for preparing end faces of integrated circuit chips using a cutting machine having a straight blade. The apparatus is a wedge shaped block having one surface angled at the desired angle to be imparted to the end face. The one surface has an alignment member thereon for aligning the chip on the top surface, and at least one locating member at the end of the block for positioning the end of the chip relative to the cutting blade. The block has a plurality of bores therein for applying suction to hold the chip on the one surface during cutting with the blade. The method includes the steps of placing a foot or feet on the chip, placing the chip on the block and aligning it and locating it, and applying a force thereto to hold it fixedly in position.

Abstract: An apparatus for holding and cutting an metal tree casting includes a frame having a vertically shiftable cutting blade assembly mounted thereon. A horizontally disposed clamp is mounted on a pivot support for pivoting the clamp horizontally about a vertical axis. The clamp is provided with clamping jaws for clamping the metal casting tree and is rotatable about a horizontal axis. A carriage is mounted on a transverse slide assembly and pivotally supports the pivot support thereon. A longitudinal slide assembly is connected with the transverse slide assembly and cooperates therewith for permitting transverse and longitudinal movement of the clamp and metal tree clamped thereby.

Abstract: A compact tile saw which is especially adaptable for cutting of large-sized tiles wherein the table supporting the tile is movable towards the cutting saw, while at the same time the cutting saw is positionable in one of two positions of either being stationary or in moving in unison towards the table supporting the tile to be cut.

Abstract: A method of dicing a semiconductor wafer having a bottom side and a circuit side along a plurality of street indices. The method includes applying an adhesive to the bottom side of the wafer, placing the bottom side of the wafer on a chuck or a spacer having a plurality of recesses therein, aligning the street indices on the wafer with recesses in the chuck or spacer, and dicing the wafer along the street indices.

Abstract: A saw with a compact frame that permits the cutting of large workpieces and that can be repeatedly operated repeatedly without requiring manual activation of an on/off switch. A special pivoting support arm pivots outwardly away from a motor assembly to allow the cutting of large workpieces while allowing the size of the saw to remain relatively compact and portable. An automatic power switch mechanism also is provided to automatically turn on the saw motor upon the placement of a workpiece adjacent to the saw blade. The saw table can be slid beyond the frame for the cutting of large workpieces.

Abstract: An apparatus or machine is disclosed for automatic establishing and cutting the corner lines in a piece of stone. The machine includes two pairs of saw blades, each pair disposed on opposite sides of the stone. The saw blades are adjustable in two directions with respect to each other to properly locate the saw blades with respect to the four corners of the stone. Laser light sources are positioned to provide light beams down onto the piece of stone at the precise location of the outer edge of the saw blade. The laser light sources assist the machine operator in properly positioning the stone with respect to the saw blades. Once the stone is properly located, the saw blades are moved into cutting engagement with the stone. After the four corner lines of the stone have been cut, these corner lines precisely establish the dimensions of the rectangles on the top and bottom stone surfaces, and the four vertical corner lines connecting the two rectangles.

Abstract: A system for the profile machining of slabs (23) of marble, stone, glass and the like, using templates (31), comprises a plurality of mechanically adjustable pneumatically operating distance pieces or supporting blocks (1). Each distance piece or supporting block is adjustable for height by means of a screw (8) and nut (6) arrangement and is provided with suction seals (11) on its end surface to support the slab, (15, 16) on an annular step to fix the machining template, and (3) on its base to fix the assembly of slab and distance piece firmly to the workbench, as the slab is being machined. All the suction seals (3, 11, 15, 16) are connected to suction tubes (24) that terminate in a connecting nipple that is connected to a pneumatic vacuum source.

Abstract: A wafer cutting chuck for reducing wear and damage to a cutting blade. The chuck has a surface for supporting a wafer. The chuck also has a plurality of recesses in its surface to accommodate a cutting blade of a wafer spindle and blade assembly. The recesses are at least as wide as the cutting blade and they correspond to street indices on the wafer. Preferably, the chuck is constructed of a metal, a ceramic, or silicon. In a most preferred embodiment of the present invention, the recesses include ports which are connected to a vacuum pump. The ports allow a vacuum, created by the vacuum pump, to pull an adhesive tape from the wafer, so that the cutting blade of the wafer spindle and blade assembly does not contact the adhesive tape.

Abstract: The bench for machining elongate objects such as strips of marble and the like comprises a generally boxlike body having a surface over which a portable profiling machine can be moved and a side comprising means for holding elongate objects or strips or the like in position by means of a plurality of pneumatic suction inlets which, by the action of low pressure, hold the elongate object stably during its machining.

Abstract: A ceramic tile cutter is provided with at least one auxiliary base which is fastened pivotally with one longitudinal side of a base of the ceramic tile cutter such that the upper surface of the auxiliary base is lower than the crest of a ridged portion of the base. The auxiliary base can be swiveled to give an added width to the base so as to facilitate the locating of an oversize ceramic tile on the base of the ceramic tile cutter.

Abstract: A wafer cutting chuck for reducing wear and damage to a cutting blade. The chuck has a surface for supporting a wafer. The chuck also has a plurality of recesses in its surface to accommodate a cutting blade of a wafer spindle and blade assembly. The recesses are at least as wide as the cutting blade and they correspond to street indices on the wafer.Preferably, the chuck is constructed of a metal, a ceramic, or silicon. In a most preferred embodiment of the present invention, the recesses include ports which are connected to a vacuum pump. The ports allow a vacuum, created by the vacuum pump, to pull an adhesive tape from the wafer, so that the cutting blade of the wafer spindle and blade assembly does not contact the adhesive tape.

Abstract: A stone tile finishing system includes an apparatus and a group of different tools usable in the apparatus for various tile finishing operations. The apparatus itself has a motor, a tool mount rotated by the motor and a tile support movable relative to the motor. The tool mount has capacity to receive any one of the different tools. The motor is swingably held within the apparatus by a height adjustable motor mount which enables moving of the motor to different working positions relative to the tile support for carrying out the various tile finishing operations.