Abstract: The crystal orientation of a workpiece is determined and a tilt angle of the workpiece is adjusted based on the determined crystal orientation at the outside of a wire saw, and then the workpiece is attached to a workpiece feed table of the wire saw so that the slicing can be started.

Abstract: An ingot mounting block consists of an attachment block, a horizontal rocking block and a vertical rocking block. The horizontal rocking block is provided in such a manner to rock horizontally with regard to the attachment block. The vertical rocking block is provided in such a manner to rock vertically with regard to the attachment block. A semiconductor ingot is positioned at the top of the vertical rocking block and is secured thereto. During an alignment of a crystal orientation, the horizontal rocking block and the vertical rocking block are previously inclined at a predetermined angle with regard to the attachment block, and then they are attached to a work feed table of a wire saw.

Abstract: The process and device (1) for positioning several single crystals (2) on a support (3) for their simultaneous cutting in directions well defined relative to the crystal structure of each single crystal; they avoid the adjustment in the machine and minimize the cutting time by providing a positioning outside the machine about angles of rotation (d,g) obtained mathematically from measured and/or given data and which position each geometric single crystal in a plane perpendicular to the cutting direction (z'") whilst bringing the cutting plane of each single crystal (2) parallel to the cutting direction of the machine. The device for practicing the process comprises a frame (5), a gripping device (8) mounted rotatably on the frame and carrying single crystals (2) and a rotatable plate (11) adapted to maintain the cutting support (3) belonging both to the positioning device (1) and to the cutting machine.

Abstract: A wafer cutting chuck for reducing wear and damage to a cutting blade. The chuck has a surface for supporting a wafer. The chuck also has a plurality of recesses in its surface to accommodate a cutting blade of a wafer spindle and blade assembly. The recesses are at least as wide as the cutting blade and they correspond to street indices on the wafer. Preferably, the chuck is constructed of a metal, a ceramic, or silicon. In a most preferred embodiment of the present invention, the recesses include ports which are connected to a vacuum pump. The ports allow a vacuum, created by the vacuum pump, to pull an adhesive tape from the wafer, so that the cutting blade of the wafer spindle and blade assembly does not contact the adhesive tape.

Abstract: A semiconductor single crystal ingot cutting jig is shaped as a cylinder having a diameter approximately equal to an ingot diameter. A recess is provided at one end of the jig for receiving a head (or tail) of the ingot. An adhesive is provided in the recess so as to adhere the ingot to the jig when the head (or tail) of the ingot is inserted into the recess. Then, the ingot is fixed on a bed of a band-saw slicing machine. The head (or tail) of the ingot is fixed on the jig and thus will not overturn at the time just before finishing the cutting or at the end of cutting. This can prevent a blade of a band saw slicing machine from being damaged.

Abstract: The present invention generally relates to a process of and apparatus for manufacturing tile mosaics from at least two stone slabs, such as marble or granite slabs. The process comprises the steps of: a) cutting each of the two slabs into a matrix of pieces while maintaining the original orientation of the pieces, b) classifying the pieces of each matrix into two or more sets of pieces, c) intermixing a first set of pieces of one slab with a second set of pieces of another slab while maintaining the original orientation of the pieces, thereby forming the mosaic. The cutting apparatus comprises: a) a platen having a resilient layer for supporting the slab, b) a gantry table saw having a plurality of blades and a rotatable table for supporting the platen, and c) a hold-down rack for securing the slab and platen during cutting. At least two grippers are use to intermix at least one set of pieces from one slab with at least one set of pieces from a second slab to form the mosaic.

Abstract: A power driven workpiece infeed conveyor supports a honeycomb-stone-honeycomb laminate on edge for feeding to an elevator conveyor in a work station. A fixed rear vertical panel of vacuum pads and a forward movable vertical panel of vacuum pads are separated by a space into which the workpiece is lifted by the elevator conveyor. The forward movable panel is moved rearwardly to cause the vacuum pad panels to engage front and rear surfaces of the workpiece and a source of vacuum is connected to the vacuum pads. The elevator conveyor is then lowered so that the workpiece is supported solely by the vacuum pads. A driven horizontal cutter wire flight then moves downwardly through the entire vertical dimension of the stone slab center portion of the workpiece to cut the workpiece into two stone-honeycomb panels.

Abstract: An apparatus for cutting a plate (2) and processing the edges of the cut piece parts (7, 8, 9) has a plate-shaped receiving means (1) for a multiplicity of singly drivable rams (14, 14') adapted to be moved in and out. The rough plate (2) out of which the piece parts (7, 8, 9) are to be cut is placed on the rams (14) in their retracted position, and the piece part (8) whose edges (12, 13) are to be processed is moved away from the other piece parts (7, 9) and the remaining piece (10) by moving the rams (14') into the extended position, so that its edges (12, 13) are freely accessible.

Abstract: A power driven workpiece infeed conveyor supports a honeycomb-stone-honeycomb laminate on edge for feeding to an elevator conveyor in a work station. A fixed rear vertical panel of vacuum pads and a forward movable vertical panel of vacuum pads are separated by a space into which the workpiece is lifted by the elevator conveyor. The forward movable panel is moved rearwardly to cause the vacuum pad panels to engage front and rear surfaces of the workpiece and a source of vacuum is connected to the vacuum pads. The elevator conveyor is then lowered so that the workpiece is supported solely by the vacuum pads. A driven horizontal cutter wire flight then moves downwardly through the entire vertical dimension of the stone slab center portion of the workpiece to cut the workpiece into two stone-honeycomb panels.

Abstract: A gripping device for use in combination with a front-end loader for lifting and transporting heavy objects, comprising a slot-entering jaw means, second jaw means, jaw adjusting means to effect movement of one of said slot-entering jaw means and said second jaw means relative to other of said jaw means, and loader cooperation means by which said device is adapted to cooperate with the loader. The device is particularly useful for removing slabs of concrete from a pre-cut concrete floor, such as found in multi-storey parking garages, during demolition or rehabilitation.

Abstract: A localized heating apparatus and method for breaking an adhesive joint between a mounting block of a semiconductor material slicing apparatus and a semiconductor material ingot, provide a more localized, and therefore faster, heating and cooling of the mounting block which reduces the time required for the semiconductor material slicing process.

Abstract: An adjustable workpiece supporting frame is disclosed for use with an abrasive saw supported relative to a base pan. The frame is removably mounted to the base pan and includes a plurality of generally parallel rails extending generally horizontally of the pan and also generally longitudinally of the saw. A series of spaced free-turning rollers are mounted on the rails for supporting a workpiece thereon while enabling longitudinal adjustment of the workpiece relative to the saw. A workpiece fence extends above and is generally parallel to the parallel rails with rollers, and is supported by the frame. The workpiece fence is laterally adjustable relative to the saw for precise measured adjustment thereof. The adjustable workpiece supporting frame thus provides both lateral and longitudinal adjustment relative to the abrasive saw.

Abstract: A method and apparatus for cutting polycrystalline silicon rods which comprise applying pressing forces at at least two positions on a plane perpendicular to the longitudinal axis of a polycrystalline silicon rod at a plurality of positions symmetrical to said axis.

Abstract: A slicing apparatus is disclosed which slices a cylindrical ingot into disc-shaped wafers by a rotating blade. The slicing apparatus includes an ingot support device which is used to contact support the ingot at a position opposed to the position of the ingot to be sliced by the blade. Therefore, a rection force which is produced in the ingot slicing can be supported by the ingot support device, thereby eliminating any ill effects on the hold surface of the ingot.

Abstract: A marble and tile cutting apparatus and method wherein the apparatus comprises a support, a tray on the support moving between a cutting and a non-cutting position, the motor mounted on the support and rotary cutting blade driven by the motor to cut marble or tile material and wherein the improvement comprises a motor support wherein the motor may be moved laterally on the table support between preselected cutting positions and wherein the tray is characterized by a plurality of generally longitudinally preselected cutting grooves so as to permit the cutting blade to cut the marble or tile material in a cutting position with the grooves of the tray matching the preselected position of the transversely movable molding and cutting blade for each particular cutting position.

Abstract: A slicing apparatus includes: an annular plate-like rotary blade adapted to be rotated about an axle thereof and having an inner peripheral cutting edge; a table for carrying a work; a first work-feeding mechanism for moving the work on the table in a direction parallel to the axis of the rotary blade; and a second work-feeding mechanism for moving the table in a direction parallel to the opposite side of the blade so as to cause the work on the table to be sliced by the blade.

Abstract: A jig for use with masonry saws for supporting and cutting flat and brick-shaped masonry material such as bricks and tile. The jig includes a frame, a "V"-shaped material-supporting bed pivotally mounted on the frame and an adjustment mechanism for adjusting the angle of the "V"-shaped bed with respect to the frame. The adjustment mechanism includes a support bar pivotally affixed to the material-supporting bed at one end and adjustably attached to the frame by a bolt fastened to the opposite end of the support bar and extending through a horizontal slot in the frame to threadibly receive a wing nut.

Abstract: A composite panel consists of a natural stone layer (1) and a reinforcing layer (13) that has a fibre layer (2) embedded in synthetic resin, and at least one layer (3) of synthetic resin. The fibre layer (2) serves as tensile reinforcement and the layer (3) of synthetic resin serves as compression reinforcement for the natural stone layer (1), so that the composite panel can absorb both positive and negative bending moments. The synthetic resin layer (3) is reinforced, for example, with a fine-mesh glass fibre textile (6) that faces towards the tensile reinforcing fibre layer (2) and an adjacent glass fibre mat (8). In order to produce the composite panels, natural stone panels that have been cut to a greater thickness are coated on both sides with the reinforcing layer (13). A plurality of coated natural stone panels are then arranged so as to be equally spaced on their center planes, and then simultaneously divided.

Abstract: A cutting system for cutting heavy stone slabs wherein the heavy slabs are supported in a fixed horizontal position by means of a plurality of apertures which are adapted to receive a plurality of rollers, the rollers extending in an upward direction adapted to protrude through said apertures to support the heavy slab and to rotate said heavy slab in any direction so as to permit manipulation of said slab above the member. The cutting system also includes a multi-directional carriage for moving a cutting tool in any direction upon the surface of the heavy slab.

Abstract: The proposed device comprises a treatment unit (30) substantially made up of a feed guide (6) for the board and one or more rotating brushes (5) having their axes of rotation perpendicular to the board; this unit is followed by a flip-over assembly (31) and then by a second treatment unit (30) identical to the first. The treatment liquid reaches the center of each brush (5) through a duct. The brush assembly moves transversely; in addition each brush can have an orbital movement. The flip-over assembly (31) consists of a series of facing drive roller pairs (34) mounted on a carriage (32) that can be rotated at 180.degree. around an axis (33). These rollers (34) are such that they can rotate in two different directions.

Abstract: Spaced parallel circular tracks rotate 180 degrees on roller bearings. Matching openings through one edge of each track serve to admit a stone or heavy object into a receiving slot. Parallel roller conveyors line the top and bottom faces of the slot. A pivoting swing with a platform across the inside of the slot transfers the stone from one face to the other automatically when the apparatus is rotated. The center of gravity of the loaded turning apparatus coincides with the center of rotation thereby requiring very little turning power. A manual handle or motor drive shaft rotates the gear train to turn the apparatus. Transverse rollers permit entry and exit of the stone at opposite points on the circular track. Longitudinal rollers permit entry and exit of the stone from the same or opposite sides of the apparatus.

Abstract: A machine is provided which automatically cuts and polishes disks of marble and finishes the edges of those disks. A marble cutting saw blade and a marble polishing wheel are disposed on a track located in spaced separation from a turntable. The turntable includes a central supporting pedestal and peripheral spacers which may be selectively located on a support to bear against the underside of a marble slab just within the diameter of a round disk which is to be cut therefrom. The sawing and polishing assemblies are mounted on separate carriages which move longitudinally along the track. The sawing and cutting assemblies can be adjusted vertically by means of separate, power driven drives. The speed of rotation of the turntable can be altered. An arbor is preferably located on the track between the two carriages to project toward the turntable. The arbor stabilizes the marble slab as it rotates with the turntable.

Abstract: A work head for attracting and fixing an IC silicon wafer is comprised of an attracting disc and a base seat surrounding the periphery of the attracting disk. The attracting disc is of an inorganic substance shaped and sintered so that the upper layer of the attracting disc is composed of a porous body of porous grain and the lower layer the attracting body is formed with a slightly coarse body of porous grain.The base seat is made airtight, being formed and sintered with the same substance as the attracting disc. The attracting disc and the base seat are coupled with glass having a low melting point. The attracting disc is connected to a connecting hole drilled through the base seat and further to a water injecting hole and air sucking hole of a lower base. Before the wafer is attracted, water is injected from the injection hole for soaking the attracting surface. The surface tension of water transfers the wafer to the center of the attracting surface.

Abstract: A process and apparatus for supporting crystalline wafers utilizing the sion effect of flowing gas on the crystalline wafers. An almost point-like support of the crystalline wafer is achieved. Furthermore, the invention relates to a holding tool for carrying out the process, which tool has at the center of the holding face, a point-like projection.

Abstract: The apparatus forms one-to-one reticle images on a wafer. The apparatus includes means for holding a reticle containing an image pattern corresponding to the size of the desired wafer pattern. An illumination system substantially uniformly illuminates the reticle pattern. A one-to-one stationary projection optical system projects an image of the reticle pattern onto a predetermined focal plane. Suitable means such as a vacuum chuck holds the wafer. An alignment system steps and orients a wafer chuck to register markings on the individual sides of the wafer with the projected image of corresponding markings on the reticle. A fluid servo system acts on the chuck to hold at least a portion of the wafer in the predetermined focal plane of the projection optical system.

Abstract: Installation for the sawing of wafers of semiconductor material encompassing an alignment station (1), a sawing station (9), and a cleaning station (7). A handling device, provided to convey the wafers from one station to another, while ensuring a perfect positioning under the disc (11) of the saw, encompasses at least two supporting platforms (2, 13), of a mobile table (14) and a transfer angle-iron (15). Platforms (2) and (13) are provided to retain a wafer by suction, whether the platforms are carried by fixed support (6) or by mobile table (14).

Abstract: Apparatus for gripping slabs of stone and supporting the slab on its edge while it is cut into two planar laminae, comprises grippers in the form of oppositely arranged vacuum-operated suction cups which grip opposite faces of the slab to prevent relative movement of the partly-cut stone laminae during cutting thereof. One of the grippers is mounted for bodily vertical swinging movement toward and away from the slab about an axis disposed no higher than the lower edge of the slab.

Abstract: The present invention relates to a mitre guide jig adapted for use with a masonary saw. The jig comprises a body portion and an end portion to which the body portion is adjustably secured. The body portion includes a single flat work piece receiving face which is bordered by at least one raised side rail and which moves through a variety of tile cutting positions with adjustment of the body portion.

Abstract: A rock holding device, which can be mounted in a rock-saw vise in such a way that rocks gripped by this device are held firm and secure so they can be sliced by a lapidary (diamond-blade) saw. The device comprises a plate having slidably mounted thereon a finger with a first bevelled surface and bars fixedly mounted on the plate and having second and third bevelled surfaces facing the first bevelled surface.

Abstract: A chuck assembly for gripping and holding objects including a base, a face plate rotatably mounted on the base, and a plurality of arms pivotally connected to and extending outwardly from the face plate for swinging toward and away from each other. A threaded tube is secured to the face plate and a nut on the tube is operable to urge the face plate into frictional engagement with the base to secure it in a selected position. A threaded rod extends through the tube and has a semi-spherical washer pivotally mounted thereon. Connecting members extending inwardly from the arms engage portions of the washer. A nut on the threaded rod is operable to draw the washer toward the face plate to swing the arms toward each other. During swinging of the arms toward each other the washer may pivot on the rod to permit the arms to swing toward each other at different rates to grip and hold an asymmetrical object therebetween.