Abstract: A method and apparatus of cutting wafers by wire sawing is disclosed. In one embodiment, a wire sawing apparatus includes a horizontal ingot feeding wire slicing apparatus which includes a vertical wire web, in which sawing wires of the vertical wire web are located substantially in a vertical plane and move in a substantially vertical direction, a top outlet located in top position with respect to a work piece for applying fluid during sawing, and a chute located substantially below the work piece for receiving the fluid, wherein the work piece is impelled against the vertical wire web by horizontal movement and the fluid moves in a vertical direction against and into the work piece. The wire sawing apparatus further includes a frame for holding the horizontal ingot feeding wire slicing apparatus, and a control panel for operating the wire sawing apparatus.

Abstract: A portable boring machine for cutting holes in a cutting surface is provided. The portable boring machine includes a vacuum system to secure a front end of the portable boring machine to a cutting surface, a hydraulic boring sub-assembly, which includes a hole saw to cut holes in the cutting surface, a water cooling/lubrication system to provide cooling and/or lubrication to the hole saw during the cutting process, and a control system to control the operation of the portable boring machine. The portable boring machine also includes multiple power-driven wheels. The wheels are attached to a bottom portion of a frame and are powered by an engine, which is mounted within the frame.

Abstract: A tile cutting machine includes a tub having at least one sidewall and a bottom for holding water. An opening may be positioned in the sidewall and selectively covered by a door. A cutting head assembly includes a cutting device having a blade and a motor for powering the blade. The cutting device is selectively coupled with a rail assembly and movable there along. A tile supporting surface is located in the tub for supporting a tile to be cut. The tile supporting surface having areas of varying heights to accommodate tiles of various sizes.

Abstract: A jig (1) for cutting a brick or bricks, comprises a base (3) and alignment means (7, 9, 11, 13) arranged such that the brick or bricks can be laid out on the base (3) with part of the or each brick in contact with the alignment means (7, 9, 11, 13). The jig (1) further comprises guide means (35) operative to define a line to be cut along the brick or bricks, the brick or bricks being at least partially restrained and aligned by the alignment means (7, 9, 11, 13) in use such that a cutter can be guided by the guide means (35) to cut the brick or bricks along the defined line to be cut. The guide means (35) comprises an elongate guide element (43) mounted on a chassis, the chassis being adjustably mounted on the jig (1), the chassis comprising a plurality of spaced apart slots, the chassis being adjustably mounted on at least one finger (37) upstanding from the base (3) to enable the position of the chassis relative to the base (3) to be adjusted.

Abstract: Embodiments of the present invention are directed to a fixture assembly that is capable of holding work pieces such tiles of various sizes in various positions in a manner which enables freehand cutting. Various embodiments include a main fixture having a working top surface area that includes strategically placed cylindrical openings that are configured to receive easily manipulated tile holding clamps, various dogs that can be removably secured to the fixture in order to place tiles in a desirable position to be held during a cutting operations. The fixture is light weight and is easily transportable to a jobsite and has the capability of storing the clamps, dogs, marking instruments and the like.

Abstract: A table saw for cutting materials, such as, for example, porcelain tiles, ceramic tiles, stone and glass. The table saw includes a base and a working table slidably positioned on the base. The table saw further including a power tool detachably mounted to the base and having a separate utility apart from the table saw. The power tool including a cutting element that extends at least partially through a slot in the working table. The working table movable along the base and with respect to the cutting element.

Abstract: A thin veneer stone saw and related methods are provided. The thin veneer stone saw includes one or more circular saw blades. In an embodiment, two circular saw blades are arranged such that a masonry block, such as stone, may be sawed completely through in a single pass through the thin veneer stone saw. The stone may be delivered to, and processed through, the circular saw blades by a conveyor system. One of the circular saw blades may be centered below the top surface of the conveyor and protrude through a gap between two sections of the conveyor system. The other circular saw blade may be positioned entirely above the top surface of the conveyor system. The thin veneer stone saw may be operable to produce thin veneer stones in a variety of widths. The thin veneer stones may be used to form facade for a structure.

Abstract: A method and a device for cutting a workpiece in a wire saw is described, wherein a workpiece is fixed in a wire saw by means of a mounting beam. In the method according to the invention, the generation of a mark or a step on the cutting area along the cutting slit at the transition from the workpiece to the mounting beam is moved further to the edge of the cutting area or is avoided entirely. Therefor, the workpiece is held during the cutting operation in the wire saw by a mounting beam such that while one of the two piercing points lies on the surface of the workpiece and while simultaneously the other of the two piercing points lies on the surface of the mounting beam, the piercing point lying on the surface of the workpiece is the entry side piercing point.

Abstract: A tile saw includes a base, a frame, adjacent first and second rails disposed on the frame, and a table slidingly disposed on the first rail. The table has a bottom surface and an upper surface for supporting a workpiece. The second rail a bottom surface and an upper surface that faces the bottom surface of the table. First and second bearings are disposed on a first shaft connected to the table. The first bearing is disposed on the first rail, and the second bearing is disposed on the bottom surface of the second rail. The frame includes a support assembly and a saw assembly with a motor and cutting wheel. The motor and cutting wheel are supported by an arm so that the cutting wheel hangs above the upper surface of the table. The first rail and the second rail are positioned on one side of the cutting wheel.

Abstract: A tile saw includes a base, a frame assembly disposed on the base, a first rail disposed on the frame assembly, the first rail having a longitudinal axis, a table slidingly disposed on the first rail, a support assembly disposed on the base, a saw assembly supported by the support assembly, the saw assembly comprising a motor, a cutting wheel driven by the motor, the saw assembly being pivotable about a horizontal axis substantially parallel to the longitudinal axis, and a switch electrically connected to the motor and disposed on the support assembly so that, when the motor assembly is pivoted about the horizontal axis, the switch remains stationary.

Abstract: A platform minute adjustment, expansion and collection device for a stone cutter includes a water tank supported by a pair of racks, a pair of guide rods spacedly bridged on the racks, a first water collection plate and a second water collection plate, both of which are slantly disposed to a front rack, a platform having a pair of rotors on the lower side thereof and slidably engaged on the inner sides of the guide rod. The platform has a pair of expansion plates for enlarging its size and for cutting a large-sized working piece, and two minute adjusting devices mounted on the tops of the racks for displacing the platform slightly, such that the sawdust may be stopped scattering all over the working place.

Abstract: A platform minute adjustment, expansion and collection device for a stone cutter includes a water tank supported by a pair of racks, a pair of guide rods spacedly bridged on the racks, a first water collection plate and a second water collection plate, both of which are slantly disposed to a front rack, a platform having a pair of rotors on the lower side thereof and slidably engaged on the inner sides of the guide rod. The platform has a pair of expansion plates for enlarging its size and for cutting a large-sized working piece, and two minute adjusting devices mounted on the tops of the racks for displacing the platform slightly, such that the sawdust may be stopped scattering all over the working place.

Abstract: A saw includes a base and a pair of substantially parallel stationary rails coupled to the base and extending in a longitudinal direction. A saw supporting assembly is coupled to the base and includes an arm extending from the base and a cutting blade coupled to the arm. A table for supporting a workpiece has a pair of substantially parallel sliding rails fixedly coupled to the table. The sliding rails slide relative to the stationary rails so that the table is moveable between a cantilevered position where at least a portion of the sliding rails are not in contact with the stationary rails, and a non-cantilevered position where substantially the entire length of the sliding rails are in contact with the stationary rails.

Abstract: The invention relates to a device for manufacturing semiconductor material wafers with a sawing device for the sawing of slices attached to a saw holder, a pre-cleaning device arranged in the process direction downstream of the sawing device for pre-cleaning the surfaces of the slices hanging on the saw holder, and a degluing device arranged downstream in the process direction for detaching the slices from the saw holder.

Abstract: A tile saw guide apparatus comprising a right-angle triangle shaped guide body and an attachment structure. The right-angle triangle shaped guide body includes a tile receiving space accessible through a first non-hypotenuse edge of the right-angle triangle shaped guide body. A first tile engaging edge defining the tile receiving space extends substantially perpendicular to the first non-hypotenuse edge of the right-angle triangle shaped guide body. A second tile engaging edge defining the tile receiving space extends substantially perpendicular to a second non-hypotenuse edge of the right-angle triangle shaped guide body. The attachment structure is fixedly attached to the right-angle triangle shaped guide body. The attachment structure is configured for fixedly securing the guide body to a table of a tile saw and extends across the hypotenuse edge of the right-angle triangle shaped guide body.

Abstract: A wafer fixing apparatus is disclosed including a dicing stage structured to fix a semiconductor wafer. A die attach film is disposed on the dicing stage to attach the semiconductor wafer to the dicing stage. The die attach film attaches the semiconductor wafer to the dicing stage due to the tackiness of the die attach film. A wafer ring, which may be of a metallic material, is coupled to the dicing stage using a wafer ring attaching member.

Abstract: A tile shaping bench including an elongate guide extrusion having surfaces defining a channel adapted for receiving an edge of a tile, a first surface of the channel defined by a resilient surface, an elongate top extrusion positioned adjacent to the guide extension and including an elongate tile engaging surface, and an elongate clamp extrusion disposed below the top extrusion and including at least one operable clamp mechanism, the clamp mechanism operable to urge a tile against the elongate tile engaging surface of the top extrusion.

Abstract: When a plate-shaped material, such as a CSP substrate, that does not require exact precision is divided, a cutting machine is provided with not only first and second chuck tables, but also first and second cutting units. Then, each plate-shaped material, which is placed on a respective chuck table, is aligned immediately before it is cut, so that the Y-axis index control and the X-axis cutting movement control are established for cutting by the cutting units. A cutting portion is cut in the first direction by the first cutting unit according to the Y-axis index control and the X-axis cutting movement control, and subsequently a cutting portion is cut in the second direction by the second cutting unit. Hence, the cutting portions of the plate-shaped materials placed on the first and second chuck tables are cut by the first and second cutting units by sharing a role.

Abstract: This invention relates to an end supporting plate which can be attached to both ends of cylindrical ingot. By wire saw cutting, semiconductor wafers are sliced from the ingot attached with the end supporting plates. The end supporting plate has an elongated support surface. Maximum width of the support surface along a direction perpendicular to an axial direction of the plate is smaller than the length along the axial direction. The length of the support surface is approximately similar to a diameter of the ingot to which the end support plate is to be attached, whereas maximum width of the support is smaller than the diameter of the ingot.

Abstract: A tile saw includes a base, a frame assembly disposed on the base, a first rail disposed on the frame assembly, the first rail having a longitudinal axis, a table slidingly disposed on the first rail, a support assembly disposed on the base, a saw assembly supported by the support assembly, the saw assembly including a motor, a cutting wheel driven by the motor, the saw assembly being pivotable about a horizontal axis substantially parallel to the longitudinal axis, and a switch electrically connected to the motor and disposed on the support assembly so that, when the motor assembly is pivoted about the horizontal axis, the switch remains stationary.

Abstract: Disclosed herein is a dividing apparatus for dividing a plate-like workpiece, which is put on the top surface of a protective tape affixed to an annular frame and which has reduced strength along dividing lines. The apparatus includes a frame holder for holding the annular frame, a tape expander for expanding the protective tape, a detector for detecting the plate-like workpiece, a divider for pressing dividing lines to divide the workpiece into chips along the lines detected by the detector, a device for pushing up divided chips through the protective tape, and a device for picking up pushed up chips.

Abstract: A stone cutting system and method for cutting a stone sheet having a substantially planar surface utilizes a frame upon which a stone sheet to be cut can be positioned, a motor for supporting a cutting tool adjacent the stone sheet and for rotating the cutting tool, and an articulated arm assembly enabling the cutting tool to be moved to any of a number of coordinate positions across the surface of the stone sheet. By rotating and moving the cutting tool in cutting engagement with the stone sheet, material is removed from the stone sheet by the cutting tool.

Abstract: A cutting workstation which includes a cutter mounted on an arm type configuration. The arm configuration is slidably moveable relative to a divided work piece support table, the cutter moveable there between. Further, the cutter is capable of elevating the arm either above or below the worktable. Not only is the arm capable of being lengthened and shortened, but also it is also of capable of rotation producing a variety of miter cuts. The arm is also capable of rotating to a vertical axis to produce a chop cut motion. The bifurcated table or work piece support is capable of being rotated through a number of degrees relative to the cutter also producing mitered or angled cuts. The bifurcated worktable is also capable of being elevated above or below or at the level of the cutter. The cutter, if in the form of a circular cutter blade, is preferably provided with the conventional pivotal spring-loaded blade guard.

Abstract: An adjustable rack for a stone slab or plate glass has a base with adjustable poles positioned on the base, with the base also having a durable wood strip secured therein in order to support the stone slab thereon. Two adjustable racks are preferred for at least one stone slab. Three adjustable racks are preferred for at least one sheet of plate glass.

Abstract: The apparatus for cutting brick is an apparatus for cutting masonry material. The apparatus includes an assembly base, a lever operating assembly, an upper blade assembly, a lower blade assembly, and a table assembly. The lever operating assembly supports a system of levers allow an operator to apply a force which is ultimately applied to a pair of cutting chisels which cut the piece of masonry material. The apparatus may be comprised of two levers providing a force multiplier system. The upper chisel is moved by the lever operating system to separate the upper and lower chisel allowing material to be placed in the cutting apparatus, and to force the upper chisel towards the lower chisel to cut the material. The table assembly rests on resilient mounts. The table covers the lower chisel, but is lowered to expose the cutting edge of the chisel during a cutting operation.

Abstract: A table saw having a frame to support a powered saw blade, a work surface moveably mounted on the frame, the work surface having at least two portions with a space therebetween to allow the saw blade to pass between the two portions. The work surface portions are joined by at least two drive dogs moveably seated in aligned brackets, thereby holding the two portions in fixed relationship when the work surface is both stationary and moving. A pin extends from each drive dog into a keyway mounted on the frame with a portion of the keyway adjacent to the saw blade extending away from the saw blade, whereby a drive dog approaching the saw blade is withdrawn from one of the pair of brackets and from the space between the two portions while the remaining drive dog or drive dogs continue to maintain the two portions in fixed relationship.

Abstract: Techniques for singulating a substrate into a plurality of component parts is disclosed. The singulation techniques include generating a jet stream in order to cut through large components so as to produce smaller components. The techniques are particularly suitable for singulating surface mount devices such as chip scale packages, ball grid arrays (BGA), flip chips, lead less packages (QFN) and the like. The techniques are also suitable for singulating photonic devices.

Abstract: A cutting mechanism minute adjustment device for a stone cutter includes a framed base having a hollow interior rectangular support arm on a front corner including a sustaining plate fixed therein inserted into a rectangular receiving spaced under a left portion of a cutting mechanism with a L-shaped adjustable plate engaged therebetween. The adjustable plate has a rectangular through holes for passing through the support arm and a pair of adjustable slots engaged with a pair of screw holes under the cutting mechanism and releasably secured by a pair screws. The cutting mechanism further has a circular blade on a right side actuated by a motor therein and a screw hole in a left wall communicating to the rectangular space and a U-shaped slit in a top of the support arm. A lock has a threaded shank on front engaged into the screw hole and the receiving space of the cutting mechanism through the U-shaped slit of the support arm.

Abstract: A wheeled trolley carries various tools across an object to be worked. A track attaches directly to the work and simultaneously isolates the tool from the work. A standard connection to the trolley readily accommodates a variety of diverse tools, using a keyway or the like to ensure accurate and repeatable placement of the tools. A preferred contouring guide allows a tool to be moved through an arc, where the focal point of the arc may be set to produce an infinite variety of custom shapes, bevels or angles of cut. An upper stop is provided which readily sets the break line between surface finish and edge contour. An adjustable tool carriage allows control over both position and force, including preloading a work tool with force. Resilience is incorporated into the apparatus to accommodate diverse hardness and abrasion characteristics, and, in at least one embodiment, to enable the track to accurately follow a warped or sagging work piece.

Abstract: A casted concrete block surface-roughing machine having an in-line conveyor displaceable over a stationary horizontal support surface for slidingly supporting a lower surface of concrete blocks displaced thereon by the conveyor. At least two pairs of spaced-apart vertically supported conveyor belts are disposed to engage opposed side faces of the concrete blocks to displace them along the stationary horizontal support surface. One of the pairs of the conveyor belts engages the opposed side faces in a lower surface section thereof to expose an upper surface section thereof to be abraded by respective surface abrading devices. The other of the pairs of conveyor belts engage the opposed side faces in the upper surface section of the concrete block to expose the lower surface section thereof to be abraded by further respective surfaces abrading devices.

Abstract: A process id disclosed for structurally repairing and aesthetically filling, and mutually coupling slabs (1) and layers (2–4) into a block (5), comprising the steps of: heating, drying and impregnating the slabs (1) with resin; penetrating the resin through atmospheric pressure; inserting positive pressures; applying a liquid- or gas-tight sealing coating (6, 7, 8) around the block (5) to allow resin to flow around and inside the block (5), containing hydrostatic resin pressures and checking resin consumptions through a formwork; directly supporting through the block (5) the thrusts generated by pressure differentials; when preparing the block (5), assembling the stone slabs (1) independently from mutual thickness and distance between centers with other stone slabs (1).

Abstract: A rock cutter for splitting stones is disclosed which shows a support surface for holding the rock and a first blade and a second blade which may be positioned to hold the rock between the first and second blades and on the support surface along with a means for moving the first blade towards the second blade. The means for moving comprises a hydraulically driven piston having a piston arm to which the first blade is mounted. The rock cutter also has a cover which is used in conjunction with a means for receiving pieces of the rock after the rock is split.

Abstract: A wire saw (10) for simultaneously slicing multiple, generally cylindrical monocrystalline ingots (14) into wafers. The wire saw includes a cutting head (16), an ingot support (12), and multiple generally parallel lengths of cutting wire (18) defining a cutting web (30). A slurry delivery system includes nozzles (34, 36, and 38) positioned for dispensing slurry along the wire web generally at lateral sides of each ingot. A process for simultaneously slicing at least two generally cylindrical semiconductor ingots into wafers includes mounting at least two ingots to a common ingot support, moving the ingot support relative to the cutting web so that the two ingots simultaneously press against the cutting web at cutting regions, and dispensing a liquid slurry to at least three locations on the wire web including two outermost sides of the cutting regions and a location between each pair of ingots.

Abstract: A work table includes a work surface having two generally parallel bars extending across and above the work surface. Two sleeves are slidably connected to the two generally parallel bars, each sleeve of the two sleeves positioned around each bar of the two generally parallel bars. A power tool, such as a tile saw is connected between the two sleeves and thereby slides along the two bars. A channel is preferably positioned across the work surface and includes water or similar coolant/lubricant for the power tool. Handles are additionally positioned in the side of the work surface and are moveable between a retracted position within the work surface and an extended position away from the work surface. In the extended position, the handle includes a top edge generally flush with the work surface.

Abstract: A tile positioning device of a tile cutting machine includes a first piece slidably engaged with the gauge and a second piece is pivotably connected to the first piece. The second piece includes two protrusions and a right angle is defined between two surfaces of the two protrusions for clamping two sides of a tile and the tile can be rotated relative to the blade of the cutting machine by rotating the second piece. A third piece is optionally and pivotably connected to one of the two protrusions for adjusting the positioning of the tile.

Abstract: A saw includes a base having a first length extending generally along a first direction, a table disposed on the base, a saw unit disposed on the base, wherein one of the table and the saw unit is movable relative to the base along the first direction over a range which exceeds the first length. The saw may also include a first stationary rail connected to the base and extending generally along the first direction and a first movable rail engaging the first stationary rail and extending generally parallel to the first stationary rail, the first movable rail being connected to the one of the table and saw unit. Preferably, the first movable rail is slidingly received over the first stationary rail. The saw may also include a first rack disposed on the first movable rail, and a first pinion disposed on the base, wherein the first pinion meshes with the first rack so that the first movable rail moves along the first direction upon rotation of the first pinion.

Abstract: An automated stone burning apparatus, which precisely adjusts the burning operation and improves the throughput. The apparatus consists of a torch assembly that is mounted in proximity to a stone slab lying upon a roller bed. The torch assembly is movable both transversely and laterally (i.e., in orthogonal directions with respect to the stone slab). An electrical control system adjusts the speed and location of the torch during the burn process.

Abstract: It is an object of the present invention to provide a method for slicing a hard and brittle material having a crystal structure, such as a silicon ingot, and more particularly a hard and brittle material cutting method which solves the problem of worsening variance in thickness, nanotopography, and wafer warpage. The inventors perfected the present invention upon discovering that when retainer plates are bonded to or pressed against the ends of an ingot, and simultaneous slicing with a wire saw is performed along with the retainer plates, a portion of increasing variance in the warpage, nanotopography, and thickness will appear in the portions corresponding to the retainer plates, resulting in a decrease in variance in wafer warpage, nanotopography, and thickness at the ends of the targeted ingot.

Abstract: A method of forming a stone inlay in an abrasion-sensitive substrate, such as wood, by forming a depression in the substrate, mounting stone on a damping material capable of absorbing the abrasive energy applied to the stone in reducing the dimensions of the stone to fit the depression, cutting the inlay to size and inserting it into the substrate. The cut inlay/damping material composite may be sold separately as an article of manufacture.

Abstract: A worktable, which is incorporated with a cutting machine, includes a table body and a cutting end support. The table body has at least a guiding rail formed on an upper surface for guiding a cutting pathway of a saw blade wherein the guiding rail has an opening end portion extended from an edge of the table body. The cutting end support is mounted on the table body at the opening end portion of the guiding rail. The saw blade is adapted to cut through the cutting end support to form a cutting groove when the saw blade is suspendedly slid along the opening end portion of the guiding rail. Therefore, a bottom side of an edge portion of the work piece is substantially supported by the cutting end support when the saw blade cuts the edge portion of the work piece through the cutting groove.

Abstract: By preventing warping of chips when detaching individual chips from a dicing sheet, improvement in quality without cracks and in productivity is realized. A collet (115) used in a step of detaching chips (110) discretely divided as bonded to a dicing sheet (109) from the dicing sheet has a flat attraction surface made of a porous material of a size equal to or larger than the chip size. Alternatively, the collet may have a chip attraction groove containing poles, balls or hemispheres, for example, to prevent warping of chips. In the step of detaching each chip from the dicing sheet, a means for reducing the bonding force of the dicing sheet, such as heating device or cooling device, may be provided. Thus, warping or cracking can be prevented in a process of thinned semiconductor substrate. Additionally, since the means for reducing the bonding force of the dicing sheet is provided in a semiconductor manufacturing equipment, breakage or cracking of chips can be prevented more reliably.

Abstract: A wheeled trolley carries various tools across an object to be worked. A track attaches directly to the work and simultaneously isolates the tool from the work. A standard connection to the trolley readily accommodates a variety of diverse tools, using a keyway or the like to ensure accurate and repeatable placement of the tools. A preferred contouring guide allows a tool to be moved through an arc, where the focal point of the arc may be set to produce an infinite variety of custom shapes, bevels or angles of cut. An adjustable tool carriage allows control over both position and force, including preloading a work tool with force. Resilience is incorporated into the apparatus to accommodate diverse hardness and abrasion characteristics.

Abstract: The present invention provides a fixture for mounting a substrate to mounting tape on a film frame so as to retain the substrate to the film frame for dicing. A plurality of grooves for receiving a cutting saw extend longitudinally and transversely across the fixture to define die regions. The fixture also includes a plurality of apertures that align with the substrate and with dies to be cut from the substrate. The aligned apertures supply vacuum to the substrate to retain the substrate and cut dies in the fixture. When the dicing is completed, the vacuum is turned off and the individual dies can be readily removed from the fixture.

Abstract: The present invention provides a fixture for mounting a substrate to mounting tape on a film frame so as to retain the substrate to the film frame for dicing. A plurality of grooves for receiving a cutting saw extend longitudinally and transversely across the fixture to define die regions. The fixture also includes a plurality of apertures that align with the substrate and with dies to be cut from the substrate. The aligned apertures supply vacuum to the substrate to retain the substrate and cut dies in the fixture. When the dicing is completed, the vacuum is turned off and the individual dies can be readily removed from the fixture.

Abstract: A method for cutting thin film filter work pieces has two embodiments. In a first embodiment, an intermediate layer (13) binds an augmenting substrate (14) to a glass substrate (12) of the work piece (16) prior to cutting of the work piece. In a second embodiment, the work piece (23) comprises a glass substrate (22) which is thicker than a final desired thickness. After the work piece is cut, a surplus portion (222) of the glass substrate is removed. Both embodiments of the method increase the effective thickness of the work piece, which reduces the residual stress in the final thin film filter product, and reduces the risk of a film stack (11, 21) of the work piece peeling from the glass substrate during the cutting process.

Abstract: The invention relates, in one embodiment, to an arrangement configured to support a substrate during a dicing process. The substrate has thereon a first substrate side and a second substrate side. The first substrate side is smoother than the second substrate side. The arrangement includes a nest having a first nest side and a second nest side. The nest includes a grid which defines at least one nest opening. The nest opening has an opening area that is smaller than an area of a die diced from the substrate. The arrangement further includes a vacuum retainer plate having thereon at least one vacuum pedestal. The vacuum pedestal has an upper surface formed of a resilient material. The vacuum pedestal is configured to be disposed through the nest opening when the nest is mated with the vacuum retainer plate.

Abstract: A structurally improved stone cutter including a rectangular frame supported by a foldable stand, a rectangular sink in the frame, a rectangular platform having sliding devices on two end slidably engaged with a pair of guide rods of the frame, a brace secured to a corner of the frame for supporting a positioning plate on the top, a motor positioned on a top having a first wheel on one end, a tubular shaft releasably secured to an underside of the positioning plate opposite to the motor and having a spindle therein supported by bearings, a second wheel secured to one end of spindle, a fan cap and a saw blade secured to the other end of the spindle, a belt tensely wrapped on the first and second wheels, a blade guard positioned on the top of the saw blade and secured on one end to an outer lateral surface of the positioning plate and a working station having a L-shaped edge releasably engaged into the gap of the frame.

Abstract: In a method for producing wall panels, bricks (9) are partly cut at a cutting station, conveyed to a line-up path (5) and then masoned into wall panels. Bricks (9) to be cut are gripped by a transport and holding device (12; 12a; 34; 49; 66), transported to the cutting station (19, 20; 24a; 50) and cut at the cutting station (19, 20; 24a; 50) in the required cutting planes in the state as clamped in the transport and holding device.

Abstract: Various modifications to a cutting tool such as a tile saw are disclosed. One modification is the frame having a hollow cylindrical receptacle and the tool mounting structure having a cylindrical insert that is disposable within the hollow receptacle to allow one to swivel the tool in and out of position. Another modification is the tool holding bar being rotatable such that one can position the tool without loosening the brackets that attach the tool to the bar. Another modification is positioning the cutting-tray wheels inward of the tray edges to increase the tray's travel distance. Another modification is a retaining mechanism for selectively retaining the tray to the guide rails. This mechanism prevents tray tipping where the wheels-are inward of the tray edges.

Abstract: A V-cutter for use in forming V-shaped grooves (3) on a light guide panel (1) of the backlight unit for a liquid crystal display (LCD) is disclosed. The V-cutter may include a Z-axis lift piece (7) and a W-axis lift piece (8), each of which has a pin kit (10a, 10b) with a plurality of pins (9a, 9b) attached at the bottom thereof. The pins (9a, 9b) are preferably equal in number and spacing to the V-shaped grooves (3) to be formed. The lift pieces (7, 8) may be vertically actuated by a Z-axis controller (5) and a W-axis controller (6). The light guide panel (1) is preferably fixtured to a table (11). The lift pieces (7, 8) are configured to move with respect to the table (11) so that, through successive X-axis and Y-axis operations, the V-shaped grooves can be formed in perpendicular directions with only two reciprocating motions. As a result, the manufacturing cost of the light guide panels (1) is reduced.