Abstract: A combination fluid and air washing apparatus for washing a vehicle's viewing surface. The apparatus includes a housing, a nozzle assembly with at least one fluid nozzle and at least one air nozzle corresponding to each of fluid nozzles. A shaft is pivotally attached to the housing. The fluid and air nozzles are adjacently attached to the shaft and point towards the vehicle viewing surface. The air nozzle points lower on the vehicle viewing surface than the fluid nozzle. A pressured lines provides pressured air to the washing apparatus. The air compressor provides pressured air to the fluid reservoir forcing the fluid through the fluid nozzle and the air compressor simultaneously provides pressured air through the line to the air nozzle. Thus, the vehicle's viewing surface with the fluid and the fluid washes the vehicle's viewing surface and the air dries the vehicle's viewing surface.

Abstract: To clean the inside and outside of a container capable of containing dust-free objects for carrying, a cleaning apparatus is used within a clean room or a housing in which the cleaning apparatus is installed. The clean room or housing is kept highly cleaned. By the cleaning apparatus, the container is separated into a container body and a lid, the separated container body and lid are subject to cleaning conducted by cleaning means. Coupling means allows the cleaned container body and lid to be coupled again into the container. This coupling operation is performed automatically, the inside of the container that has already been cleaned will not be spoiled in its clean level.

Abstract: The substrate processing apparatus is provided with a gas-liquid mixing nozzle for generating a gas-liquid mixture by mixing a liquid and a pressurized gas, to discharge the gas-liquid mixture to a substrate at high speeds. The mixture process is conducted in an open space out of the nozzle, and change in the supply pressure of the gas does not affect the supply of the liquid. The reaction products which having been generated on the substrate in etching process is removed at high speeds with the flow of the gas-liquid mixture, whereby the quality of the process is improved.

Abstract: A centrifugal processor includes an elongated inlet and outlet in fluid communication with a rotor housing having an eccentric bowl. A rotor having fan blades and adapted to hold flat media is rotatably disposed within the rotor housing. An intake gate is pivotably mounted to the rotor housing to swing about the rotor into a closed position during a rinse mode and into an open position during a drying mode. The gate has a wedge that is designed to almost contact the rotor when the gate is in the open position for drying. The geometry of the elongated inlet, outlet, and eccentric bowl, in combination with the design of the rotor and that of the intake gate, work together to create a cross flow fan having a flow path across the flat media and one that exposes the flat media to large volumes of incoming air only once.

Abstract: In a method for processing a workpiece to remove material from a first surface of the workpiece, steam is introduced onto the first surface under conditions so that at least some of the steam condenses and forms a liquid boundary layer on the first surface. The condensing steam helps to maintain the first surface of the workpiece at an elevated temperature. Ozone is provided around the workpiece under conditions where the ozone diffuses through the boundary layer and reacts with the material on the first surface. The temperature of the first surface is controlled to maintain condensation of the steam.

Abstract: The washing chamber includes a housing, a washing chamber interior for spray application of wash water and rinse water, and a water vapor vent for removal of water vapor from the washing chamber interior. The water holding tank is provided for holding wash water and rinse water from the washing chamber. The water vapor recovery line extends from the water vapor vent to an air and liquid water discharge. The water vapor recovery line comprises a condensing region for condensing water vapor present in the condensing region. A method for operating a dishwashing machine is provided.

Abstract: An apparatus for supplying a mixture of a treatment liquid and ozone for treatment of a surface of a workpiece, and a corresponding method are set forth. The preferred embodiment of the apparatus comprises a liquid supply line that is used to provide fluid communication between a reservoir containing the treatment liquid and a treatment chamber housing the workpiece. A heater is disposed to heat the workpiece, either directly or indirectly. Preferably, the workpiece is heated by heating the treatment liquid that is supplied to the workpiece. One or more nozzles accept the treatment liquid from the liquid supply line and spray it onto the surface of the workpiece while an ozone generator provides ozone into an environment containing the workpiece.

Abstract: A heat sterilization process for small, washed, and bagged articles such as vial stoppers includes a conditioning or air removal phase prior to sterilization. During the air removal phase, a substantial majority of the liquid moisture is removed from the bagged articles by introducing brief periods of dry, warm air to the autoclave chamber. The air is introduced in short bursts at the point of greatest vacuum while pressure pulsing the chamber during the air removal phase. The air is heated and injected into the chamber through a supply valve which is rapidly opened and closed while the chamber is maintained within a preselected vacuum range between the pressure pulses. The result is a greatly reduced time for a complete sterilization and drying process.

Abstract: A wafer dryer system which is suitable for drying rinse water from substrates in the event of a system malfunction or failure during or after rinsing of the substrates. The wafer dryer system typically includes a pair of drying chambers, each of which is fitted with at least one nitrogen gas inlet, at least one IPA gas inlet and an exhaust opening. A wafer boat which holds multiple wet wafers from an interrupted rinsing process typically in a wet bench system is placed in one of the chambers, after which the chamber is filled with hot nitrogen gas and mixed IPA gas to dry the wafers in the wafer boat. Upon resumption of operation of the wet bench system from which the wafers were taken or upon availability of a second wet bench system, the dried wafers are removed from the chamber for continued rinsing, as necessary.

Abstract: In a substrate processing apparatus for use in performing a reduced-pressure pull up drying method, a liquid drainage pipe (46) for draining a drainage liquid containing an organic solvent from a processing chamber (26) including therein a processing bath (10) for rinsing a substrate (W) with water is provided with a buffer tank (50) inserted therein for separation between the drainage liquid and an organic solvent vapor. A vapor discharge pipe (62) is connected in communication with an interior space of the buffer tank, and is provided with pressure regulating valves (64a, 64b) inserted therein for regulating pressure in the processing chamber at a fixed pressure higher than atmospheric pressure.

Abstract: A cleaning apparatus and a cleaning method for cleaning a object are provided. In the cleaning apparatus, a drying chamber 42 and a cleaning bath 41 are separated from each other up and down, respectively. Thus, a space in the drying chamber 42 can be insulated from a space of the cleaning bath 41 through rotary doors 59a and a slide door 72. In the cleaning method, a cleaning process in the cleaning bath 41 is carried out while sealing it by the rotary doors 59a. On the other hand, a drying process in the drying chamber 42 is accomplished while sealing and closing it by the slide door 72. Consequently, there is no possibility that, during the drying process, the object is subjected to a bad influence from a chemical treatment.

Abstract: A cleaning processing apparatus, which is one embodiment of a liquid processing apparatus for performing a liquid processing by supplying a predetermined process liquid to a target object to be processed such as a semiconductor wafer while rotating the target object, comprises a rotor for holding wafers W, a slidable process section for housing the rotor, and a cleaning liquid spurting nozzle for supplying a predetermined cleaning liquid to the wafers W. A housing for housing the slidable process section is of a hermetic structure so as to be substantially shielded from the outside.

Abstract: An apparatus has a hand-cleaning volume sized to receive a gloved or ungloved human hand. The apparatus includes a mechanical-cleaning device and a chemical-cleaning device, operated sequentially to remove particles and chemical contaminants such as organics. The mechanical-cleaning device has a pressurized gas source positioned to direct a flow of pressurized activated gas into the hand-cleaning volume, and a gas-source vent communicating with the hand-cleaning volume to remove the pressurized activated gas after it has passed over the hand. The chemical-cleaning device has an activating nebulizer operable to emit an activated cleaning mist into the hand-cleaning volume so that the activated cleaning mist contacts the hand in the hand-cleaning volume. The hand is cleaned by directing a flow of pressurized ionized gas over the hand, and thereafter flowing a mist of activated cleaning solution over the hand. The cleaning solution preferably includes hydrogen peroxide.

Abstract: The substrate processing apparatus is provided with a gas-liquid mixing nozzle for generating a gas-liquid mixture by mixing a liquid and a pressurized gas, to discharge the gas-liquid mixture to a substrate at high speeds. The mixture process is conducted in an open space out of the nozzle, and change in the supply pressure of the gas does not affect the supply of the liquid. The reaction products which having been generated on the substrate in etching process is removed at high speeds with the flow of the gas-liquid mixture, whereby the quality of the process is improved.

Abstract: An apparatus for supplying a mixture of a treatment liquid and ozone for treatment of a surface of a workpiece, and a corresponding method are set forth. The preferred embodiment of the apparatus comprises a liquid supply line that is used to provide fluid communication between a reservoir containing the treatment liquid and a treatment chamber housing the workpiece. A heater is disposed to heat the workpiece, either directly or indirectly. Preferably, the workpiece is heated by heating the treatment liquid that is supplied to the workpiece. One or more nozzles accept the treatment liquid from the liquid supply line and spray it onto the surface of the workpiece while an ozone generator provides ozone into an environment containing the workpiece.

Abstract: An apparatus for supplying a mixture of a treatment liquid and ozone for treatment of a surface of a workpiece, and a corresponding method are set forth. The preferred embodiment of the apparatus comprises a liquid supply line that is used to provide fluid communication between a reservoir containing the treatment liquid and a treatment chamber housing the workpiece. A heater is disposed to heat the workpiece, either directly or indirectly. Preferably, the workpiece is heated by heating the treatment liquid that is supplied to the workpiece. One or more nozzles accept the treatment liquid from the liquid supply line and spray it onto the surface of the workpiece while an ozone generator provides ozone into an environment containing the workpiece.

Abstract: An enclosure 23A that defines a drying chamber 23 is configured of a pair of enclosing elements 23c and 23d and a base element 23b. When wafers enter or leave the drying chamber 23, the enclosing elements 23c and 23d are lifted upward by vertical air cylinders 42 to separate them from the base element 23b. The enclosing elements 23c and 23d are then moved in directions that mutually separate them. To dry wafers within the drying chamber 23, the enclosing elements and the base element 23b are mutually engaged to form a hermetic seal, in the opposite sequence. The present invention reduces the dimensions of the drying chamber without impeding the work of moving wafers into and out of the drying chamber. This makes it possible to reduce the internal volume of the drying chamber, achieving a reduction is the consumption of drying gas, an improvement in the drying efficiency, and a reduction in overall size of the apparatus.

Abstract: A method for cleaning an object to be processed in which the atmosphere in a drying chamber is replaced by an inert gas prior to placing an object to be cleaned from an external environment into the chamber. The object is then transported by an elongated retaining member from the drying chamber through a lower opening in the chamber into a processing bath disposed below the chamber. The object is then cleaned in the processing bath. The object is then transported from the processing bath to the drying chamber where it is dried by filling the atmosphere of the drying chamber with organic solvent. The cleaning process in the cleaning bath is carried out while the bath is screened by a nitrogen-gas curtain. The method also includes opening a lid of the chamber prior to insertion of the object into the chamber and closing the lid after insertion of the object, as well as the opening and closing of the lower opening in the chamber.

Abstract: A machine for carrying out a process of treating small parts with a liquid treatment medium, especially for coating the small parts or for chemically deburring the small parts, has a closable container which includes a drum to receive the parts. The drum is rotatingly drivable and adjustable between an inclined axis position and a vertical axis position. The process includes filling the drum with small parts and evacuating the closed container. Filling the container with a treatment medium, with the internal pressure set to a value in excess of the steam pressure of the most liquid component of the treatment medium. Inclining the drum to its inclined axis position and rotatingly driving the drum at a low speed. Ventilating the container and setting the drum to its vertical position.

Abstract: In a method for rinsing and drying a semiconductor workpiece in a micro-environment, the workpiece is placed into a rinser/dryer housing. The rinser/dryer housing is rotated by a rotor motor. The rinser/dryer housing defines a substantially closed rinser/dryer chamber. Rinsing and drying fluids are distributed across at least one face of the semiconductor workpiece by the action of centrifugal force generated during rotation of the housing. A fluid supply system is connected to sequentially supply a rinsing fluid followed by a drying fluid to the chamber as the housing is rotated.

Abstract: An apparatus for operative cleaning and preparation of dental handpieces is made as an integrated unit having holding stubs (6) for receiving the handpieces inside a treating chamber (1, 30), which is designed in a pressure resisting manner and with heating means (12, 56) such that it is directly usable for autoclave treatment of the handpieces. Through the holding stubs (6) and in accordance with a control program it is possible to supply warm water and oil to the respective channels in the handpieces. The apparatus may appear as a table unit (32) holding all what is required for a complete cleaning lubrication and sterilization cycle.

Abstract: A cleaning apparatus and a cleaning method for cleaning an object are provided. In the cleaning apparatus, a drying chamber 42 and a cleaning bath 41 are separated from each other up and down, respectively. Thus, a space in the drying chamber 42 can be insulated from a space of the cleaning bath 41 through rotary doors 59a and a slide door 72. In the cleaning method, a cleaning process in the cleaning bath 41 is carried out while sealing it by the rotary doors 59a. On the other hand, a drying process in the drying chamber 42 is accomplished while sealing and closing it by the slide door 72. Consequently, there is no possibility that, during the drying process, the object is subjected to a bad influence from a chemical treatment.

Abstract: The present invention 10 discloses a portable device for cleaning eyeglasses 16. A transparent enclosure 14 is provided having an upper chamber 18 for cleaning the eyeglasses, a lower left chamber 30 which may be removable for containing the cleaning solution 31 and a lower right chamber housing a pump 36 which is powered by batteries 56 and controlled by a microprocessor 58. The pump 36 circulates cleaning solution 31 through a plurality of apertures 60 in the floor 62 of the upper chamber which creates a spray 64 on the eyeglasses 16. A fan 72 with heating coil 74 then circulates warm air over the eyeglasses 16 in order to dry them.

Abstract: A production line includes a centralized cleaning/drying station for cleaning a wafer by using an HF cleaning solution or a non-HF cleaning solution and subsequently drying the wafer based on the desired cleaning/drying conditions, and a transport system for transporting the wafer between each processing station and the centralized cleaning/drying station. The production line has a large flexibility for selecting the cleaning/drying conditions for the wafer with a reduced system size.

Abstract: A method and an apparatus for removing a liquid, i.e. a wet processing liquid, from at least one surface of at least one substrate is disclosed. A liquid is supplied on a surface of substrate. Simultaneously or thereafter the liquid or the substrate is locally heated to thereby reduce the surface tension of said liquid. By doing so, at least locally a sharply defined liquid-ambient boundary is created. According to one aspect of the invention, the substrate is subjected to a rotary movement at a speed to guide said liquid-ambient boundary over the surface of the substrate thereby removing said liquid from said surface.

Abstract: Biofilm and debris can be removed from the interior and exterior surfaces of small bore tubing by passing an aqueous cleaning solution of water, one or more surfactants and preferably a source of hydrogen peroxide, optionally including small inert solid particles, together with a gas under pressure, to create a turbulent flow within the tubing that loosens the biofilm and debris so that they can be flushed from the tubing. When the exterior surfaces of tubing are to be cleaned, the tubing is inserted in a sleeve fitted with an adaptor that provides a pressure-tight seal between the tubing and the sleeve.

Abstract: A method for cleaning an object to be processed in which the atmosphere in a drying chamber is replaced by an inert gas prior to placing an object to be cleaned from an external environment into the chamber. The object is then transported by an elongated retaining member from the drying chamber through a lower opening in the chamber into a processing bath disposed below the chamber. The object is then cleaned in the processing bath. The object is then transported from the processing bath to the drying chamber where it is dried by filling the atmosphere of the drying chamber with organic solvent. The cleaning process in the cleaning bath is carried out while the bath is screened by a nitrogen-gas curtain. The method also includes opening a lid of the chamber prior to insertion of the object into the chamber and closing the lid after insertion of the object, as well as the opening and closing of the lower opening in the chamber.

Abstract: A wafer dry cleaning method and apparatus capable of eliminating or suppressing adhesion of dust and particles on dried wafer surfaces while minimizing generation of water marks thereon. To achive this, the wafer dryer apparatus is configured including a surface cleaning/drying chamber structure which houses therein a set of spaced-apart silicon wafer workpieces. The dry chamber is operatively associated with a vacuum evacuation device for retaining the interior of this chamber at low pressures required. A water-drain device is provided for forcing water content separated off from the wafer surfaces to drain out of the drying vessel. During such wafer drying process, the wafers may be driven rotating at high speeds to thereby accelerate centrifugal spin-off of residual drops of water on wafer surfaces. Preferably, a chosen purge gas may be fed into the chamber during wafer rotation.

Abstract: Disclosed for cleaning an anesthesia spirometry absorber circuit is a cleaning and drying apparatus which includes an adapter for introducing fluids into the exhalation valve after the exhalation valve dome has been removed, a proportionating disk, to be inserted in place of the prior art exhalation valve disk, for directing fluids from the exhalation valve simultaneously into the spirometry valve and into the spigot end of the exhalation valve, a shunt for connecting the exhalation valve spigot end to the inhalation valve spigot end, and a collector for gathering fluids exiting from the spirometry valve and inhalation valve. The collector is insertable between the top cap and bottom cap in place of the removable absorbent canisters of the absorber circuit. An air blower-heater is disclosed for introducing air into the adapter to dry the absorber circuit. The air blower-heater is configured to rest within and to be supported by the adapter, which is securely attachable atop the exhalation valve.

Abstract: A cleaning device for automobile bodies has a cleaning chamber having a base structure and a roof structure. A transport device is provided on which vehicle bodies are transported in a transport direction through the cleaning chamber. The cleaning chamber has operating modules detachably connected to the base structure. The operating modules have lateral nozzle modules having lateral compressed air nozzles directing a stream of compressed air onto the vehicle bodies. The operating modules also have top nozzle modules having a top compressed air nozzle directing a stream of compressed air onto the automobile bodies. A vacuum device is provided for removing the compressed air from the cleaning chamber.

Abstract: An apparatus for supplying a mixture of a treatment liquid and ozone for treatment of a surface of a workpiece, and a corresponding method are set forth. The preferred embodiment of the apparatus comprises a liquid supply line that is used to provide fluid communication between a reservoir containing the treatment liquid and a treatment chamber housing the workpiece. A heater is disposed to heat the workpiece, either directly or indirectly. Preferably, the workpiece is heated by heating the treatment liquid that is supplied to the workpiece. One or more nozzles accept the treatment liquid from the liquid supply line and spray it onto the surface of the workpiece while an ozone generator provides ozone into an environment containing the workpiece.

Abstract: In a cleaning method and a cleaning apparatus of a silicon substrate, after wet cleaning or etching of the substrate having a silicon surface is carried out, and during or after a pure water rinse of the substrate, an oxide film with a thickness of 10 to 30 Å is formed on the silicon surface by rinsing the substrate by pure water added with an oxidizer, and then the substrate is dried. Since drying is carried out after the oxide film is formed on the silicon surface, the occurrence of a water mark can be prevented.

Abstract: In a spin dryer for semiconductor wafers, the wafer is held beneath a platen with its active side (i.e., the side containing the components or circuitry) facing upward. One or more nozzles spray rinse water on the top surface of the wafer and the wafer is rotated to remove the excess rinse water, thereby drying the wafer. A splash guard adjacent the edge of the wafer insures that the excess rinse water thrown off by the spinning wafer is deflected downward where it cannot again come into contact with the active side of the wafer. The platen is rotated dry at the same time, with no rinse water being splashed back onto the active side of the wafer. The spin dryer also includes a separate section which cleans and dries the end-effector of the robot which inserts the wafer into the spin dryer while the wafer is being dried.

Abstract: Apparatus for treating substrates, such as silicon wafers (1), wherein the substrates are immersed for some time in a bath (2) containing a liquid (3) and are taken therefrom so slowly that practically all of the liquid remains in the bath (2). The substrates (1) are brought from the liquid (3) directly into contact with a vapor of an organic solvent which is mixed with a carrier gas and introduced from gas leads (17) having outlet nozzles (18). The vapor is miscible with the liquid (3) to yield a mixture having a surface tension lower than that of the liquid, and which does not condense on the substrates. No drying marks with organic or metallic residues or other contaminations remain on the substrates (1).