Abstract: A dishwasher is disclosed for the batch-wise washing of wash items. In at least one embodiment, the dishwasher includes a wash chamber, which is arranged to accommodate wash items and in which at least one sprayer for spraying out washing liquid and rinsing liquid are disposed; a wash tank, which is arranged to contain washing liquid which during a wash phase shall be supplied to the wash chamber via the at least one sprayer; a recirculating rinse tank, which is arranged to contain used rinsing liquid which during a rinse phase shall be supplied to the wash chamber via the at least one sprayer; a supplier for supplying final-rinse liquid which during a final-rinse phase shall be supplied to the wash chamber via the at least one sprayer; a collecting device, which is arranged to collect liquid which has been sprayed out into the wash chamber via the at least one sprayer; and a pump, which is arranged to pump used rinsing liquid from the collecting device to the recirculating rinse tank.

Abstract: A substrate cleaning device and a substrate cleaning method reduces liquid drops remaining on a substrate to prevent the irregular heating of the substrate by a heating process due to liquid drops or water marks remaining on the substrate. A cleaning liquid is poured through a cleaning liquid pouring nozzle onto the surface of a substrate such that a region onto which the cleaning liquid is poured moves from a central part toward the circumference of the substrate. A gas is jetted radially outward at a region on the surface of the substrate behind a region onto which the cleaning liquid is poured with respect to the rotating direction of the substrate. The gas forces a liquid film of the cleaning liquid flowing on the surface of the substrate to flow in a circumferential direction and a radially outward direction.

Abstract: The present invention relates to a dishwasher. A dishwasher includes a washing tub in which dishes are placed, a steam generator that generates steam and a nozzle part in which a flow direction of the steam is diverted at least one time to allow the steam exhausted to the washing tub.

Abstract: In particular a porous substrate (FS) like a fabric. Process to clean a substrate, comprising a step of subjecting the substrate to an air-water spray (SPR), generated using a spraying means (N) comprising an air passage (OPA) and a water passage (OPW), wherein air is greater than 90% by volume of the spray, the air velocity is greater than 80 m/s and wherein said air passage does not coaxially surround said water passage. Device to clean soiled fabric (FS) comprising a feed water container (CW) and an air compressor (AC) in fluid communication with a spray nozzle (N) comprising an air passage and a water passage, said device being capable of generating an air pressure in the range of 1 to 3 bar (absolute) and an air velocity greater than 80 m/s at the exit of said nozzle; and the air is greater than 90% volume of said spray, and wherein said air passage does not coaxially surround said water passage. An external mix spray nozzle is especially preferred in the device.

Abstract: A wash system for cleaning the exposed surfaces of a contaminant collection device that includes a source of pressurized cleaning solution and a rinse appliance. The rinse appliance includes a first flow path that is adapted to direct the pressurized cleaning solution against a plurality of interior surfaces of a sampling head of the contaminant collection device and a vacuum tube that couples the sampling head to a collection chamber of the contaminant collection device. The rinse appliance may also include a second flow path that is adapted to direct the pressurized cleaning solution against a plurality of interior surfaces of the collection chamber and a separator filter installed therein. The rinse appliance further includes a dipping tank adapted to receive the cleaning solution after passing through one of the first and second flow paths.

Abstract: A cleaning/drying apparatus including a vapor area where vapor of an organic solvent inside the cleaning/drying apparatus is generated, an ejecting part configured to eject the organic solvent onto a cleaning/drying target, a first detecting part configured to determine whether the temperature of the cleaning/drying target is a first temperature equivalent to a temperature of the vapor in the vapor area, a second detecting part configured to determine whether the temperature of the cleaning/drying target is a second temperature enabling the organic solvent to condense on a surface of the cleaning/drying target, and a cleaning/drying control part configured to drive the ejecting part to eject the organic solvent when the first detecting part detects that the temperature of the cleaning/drying target is the first temperature and stop the ejection when the second detecting part detects that the temperature of the cleaning/drying target is the second temperature.

Abstract: A fluid dispensing system for a dishwasher is disclosed, wherein the dishwasher comprises a housing, a wash chamber enclosed by the housing, and a door for accessing the wash chamber. The dispensing system, in particular, comprises a fluid reservoir for containing a wash aid (such as detergent or a rinse aid) which may be used to treat dishes in the dishwasher wash chamber during a dish cleaning cycle. The system further comprises a pump for dispensing a predetermined quantity of the wash aid from the reservoir into the dishwasher wash chamber and into the reservoir from a supply reservoir one or more times during the dish cleaning cycle. A dual purpose check valve is provided for controlling fluid flow in two opposing directions between the pump and the fluid reservoir. The dual purpose check valve comprises a duckbill valve portion for controlling fluid flow in a first direction, and an umbrella valve portion for controlling fluid flow in an opposing second direction.

Abstract: The present invention relates to a dishwasher. A dishwasher includes a washing tub in which dishes are placed, a steam generator that generates steam and a nozzle part in which a flow direction of the steam is diverted at least one time to allow the steam exhausted to the washing tub.

Abstract: In a substrate cleaning method and a substrate cleaning method according to the present invention, a brush 3 is brought into contact with a substrate W while rotating the same, and a cleaning position Sb of the brush 3 is moved relative to the substrate W from a center part of the substrate W toward a peripheral part thereof. A process fluid formed of liquid droplets and a gas is sprayed by a two-fluid nozzle 5 onto the substrate W, and a cleaning position Sn of the two-fluid nozzle 5 is moved relative to the substrate W from a center part of the substrate W toward a peripheral part thereof. During the movement of the cleaning position Sb of the brush 3 from the center part of the substrate W toward the peripheral part thereof, the cleaning position Sb of the two-fluid nozzle is positioned nearer to a center P0 than the cleaning position Sb of the brush 3. Since contaminations of the brush are prevented from adhering again to the wafer, it can be avoided that the wafer W is contaminated.

Abstract: A parts washer having a cleaning chamber and a receptacle into which parts to be cleaned are placed. The receptacle is rotatably mounted within the cleaning chamber and is rotated by a drive device. One or more spray manifolds are provided, each having a plurality of spray jets arranged to spray cleaning fluid onto the parts in the receptacle. The spray manifolds are moveably mounted within the cleaning chamber and are coupled to the drive device such that the drive device causes reciprocating motion of the spray manifolds.

Abstract: An apparatus (100) for spraying an etchant solution on a preformed printed circuit board (30) includes a number of feed pipes (40) for supplying the etchant solution and a number of nozzles (45) mounted on the feed pipes. Each of the feed pipes has a middle portion (402) and two end portions (401). The middle portions of the feed pipes are located on a first plane and the end portions of the feed pipes are located on a second plane parallel to the first plane. The number of nozzles are mounted on the middle portion and the two end portions of each feed pipe. The number of nozzles are in fluid communication with the feed pipes.

Abstract: A method includes spinning a semiconductor wafer about an axis normal to a major surface of the wafer. The wafer is translated in a direction parallel to the major surface with an oscillatory motion, while spinning the wafer. A material is sprayed from first and second nozzles or orifices at respective first and second locations on the major surface of the wafer simultaneously while spinning the wafer and translating the wafer.

Abstract: A water treatment device is provided, which has a reverse osmosis device with a raw water supply line, with a pure water discharge line and with a concentrate outflow. The raw water supply line is connected to a mixing device which is designed to set the mixing temperature of the raw water delivered to the reverse osmosis device. The mixing device has a hot water inflow and a cold water inflow.

Abstract: Disclosed are a substrate processing apparatus and a substrate processing method to efficiently remove a resist residue of a substrate surface by using sulfuric acid without hydrogen peroxide solution that is not stable in a high temperature, or by using sulfuric acid together with hydrogen peroxide solution that is not stable in a high temperature. The substrate processing apparatus to process a substrate by using a first processing liquid including sulfuric acid and a second processing liquid including water includes a liquid-film forming device to form a liquid film of the first processing liquid maintained at a temperature higher than room temperature on at least one surface of the substrate, and a vapor/mist supply device to supply vapor or mist of the second processing liquid on the surface of the substrate on which the liquid film of the first processing liquid is formed.

Abstract: The present invention provides a nozzle device comprising a substantially cylindrical nozzle body and a cup member which is arranged within the cylinder of the nozzle body and jets out fluid droplets from the tip thereof while being driven to turn, wherein two or more fluids including a detergent and a gas are mixed and jetted out of the tip of the nozzle in order to achieve sufficient cleaning of a single wafer without a re-adhesion of contamination or destruction of the pattern of the wafer. Therefore, the fluid droplets can be controlled to a smaller size than the conventional double-fluid cleaning system or high pressure jet system.

Abstract: Disclosed is a system and method to monitor and count particles removed from a component. The particle monitoring system includes a jet spray device, a snow generator, a particle collection device, and a particle counter. The jet spray device includes an outlet that is disposed locally relative to the component. The snow generator is operable to generate cleaning snow comprising a stream of ice particles, wherein the cleaning snow is emitted from the outlet of the jet spray device onto the component to cause the ejection of particles from the component. The particle collection device includes a collector that is disposed locally around the component to collect particles ejected from the component. The particle counter is coupled to, and in fluid communication with, the particle collection device. The particle counter is operable to detect and count particles ejected from the component.

Abstract: A system and method whereby on-line cleaning of black oil heater tubes and delayed coker heater tubes may be effectuated by injecting a high pressure water charge through the tubes during normal process operations so as to prevent tube fouling and heater downtime. The high pressure water charge begins the on-line cleaning process once it enters the heater tube by undergoing intense boiling and evaporation. The cleaning occurs by two methods—a scrubbing action and a shocking action. The scrubbing action occurs because of the complete turbulence caused by the water charge's intense boiling within the heater tubes. The shocking action is caused by the expansion and contraction of the heater tubes resulting from the colder water charge flowing through the heater tubes which is then followed by the hotter process fluid flowing through the heater tubes.

Abstract: A dishwashing machine includes a tub having an interior that holds a first liquid and a booster tank that includes a housing and at least one heater disposed within the housing. The booster tank is at least partially disposed within the interior of the tub such that at least a portion of the booster tank is at least partially submerged within the first liquid, whereby the first liquid is heated by the booster tank. A dishwashing machine includes a tub containing a liquid therein and a wash pump assembly that includes a pump housing; an inlet in the pump housing; an outlet in the pump housing; and a pump having a motor that pumps the liquid from the tub through the pump housing via the inlet to a device that sprays the liquid within a dishwasher via the outlet. The liquid is heated by means of a heater which is disposed either in proximity to the inlet, in proximity to the outlet, and/or in the spray device before the liquid is pumped out of the spray device.

Abstract: Device for cleaning a gas turbine engine, and in particular an engine of turbofan type. The present invention further relates to a method for cleaning such an engine. The device comprises a plurality of nozzles arranged to atomize cleaning liquid in the air stream in an air inlet of the engine up-stream of a fan of the engine. According to the invention, a first nozzle is arranged at a position such that the cleaning liquid emanating from the first nozzle impinges the surfaces of the blades substantially on the pressure side; a second nozzle is arrange at a position such that the cleaning liquid emanating from the second nozzle impinges the surfaces of the blades substantially on the suction side; and a third nozzle is arranged at a position such that the cleaning liquid emanating from the third nozzle passes substantially between the blades and enters an inlet of the core engine.

Abstract: An apparatus and method are provided to treat for example a semiconductor wafer substrate wherein a delivery means for heat, a cryogen, and a fluid chemical reactant, is disposed in a chamber in which the substrate is disposed for at least one surface of the substrate to be cleaned in the chamber. The chamber may also consist of a plurality of stations for chemically treating, providing cryogen to the substrate to effect such cleaning and heating. Air is provided in the chamber in a laminar flow substantially parallel to the surface being treated to remove displaced material from the surface and prevent redeposition of the material on the substrate surface.

Abstract: A substrate treatment apparatus for removing an unnecessary substance from a surface of a substrate. The apparatus is provided with: an oxidation liquid supply mechanism for supplying an oxidation liquid having an oxidative effect to the substrate surface; a physical cleaning mechanism for physically cleaning the substrate surface; and an etching liquid supply mechanism for supplying an etching liquid having an etching effect to the substrate surface. It is preferred to physically clean the substrate surface while supplying the oxidation liquid to the substrate surface.

Abstract: One embodiment of the present invention includes an apparatus for washing a product with a fluid. The tank may receive a plurality of product, such as fruits and vegetables, into the fluid and be configured to receive a moving conveyor, having a first end, a second end, a first section, and a second section. The conveyor may have a plurality of protruding panels being structured and arranged on the conveyor to push the product through the fluid in the tank and to lift the product from the fluid in the tank to the second end of the conveyor. At least one first nozzle may be positioned substantially above the conveyor and configured to deliver the fluid onto the product as the product is pushed by the plurality of panels. The fluid delivered from the at least one first nozzle may rotate the product in the fluid in the tank.

Abstract: Apparatuses, and related methods, for processing a workpiece that include a particular barrier structure that can overlie and cover a workpiece. Apparatuses, and related methods, for processing a workpiece that include a particular movable member that can be positioned over and moved relative to a workpiece. Apparatuses, and related methods, for processing a workpiece that include a particular ceiling structure that can overlie a processing chamber. Nozzle devices, and related methods, that include a particular annular body. Nozzle devices, and related methods, that include a particular first, second, and third nozzle structure.

Abstract: An apparatus and a method for cleaning a semiconductor wafer including performing a first cleaning process for removing particles from the semiconductor wafer by injecting a cleaning gas in the chamber and on the semiconductor wafer and then performing a second cleaning process after the first cleaning process by generating an electric field in the chamber and over the semiconductor wafer.

Abstract: A method for activating the surface of a base material and an apparatus thereof, which is suited to be utilized for pretreatment in electrochemical treatment such as, for example, electroplating or the like, in which the surface of a base material such as metal can be subjected to degreasing treatment and oxide film removing treatment simultaneously, efficiently and rationally, in which productivity can be enhanced and the equipment cost can be reduced, and in which a waste solution can be rationalized so that the solution can be reutilized and the environmental pollution can be prevented. A method for activating the surface of a base material in which the surface of a member to be treated is subjected to degreasing treatment or oxide film removing treatment. Pressurized carbon dioxide is dissolved in a predetermined quantity of water, thereby preparing an oxide film removing solution having a predetermined acidic concentration.

Abstract: An automated MicroSampling dissolution testing system that is constructed of a base; a plurality of vessels mounted on an invertible, temperature controlled bath manifold; a cleaning manifold; a stirring and sampling assembly for each vessel; an integrated image capture device, a plurality of hydrodynamic, nonresident sampling probes; a non-resident dispensing manifold; a novel fluid handling system; a MicroSampler; a sample transfer mechanism; and a sample and filter storage apparatus.

Abstract: A vending machine and a hose controller system for vending machines wherein the dispenser hose is axially and torsionally controlled to facilitate slight twisting, thereby minimizing applicator tool resistance, and making it easier for users to operate the remote vending tool on the hose distal end. The elongated reinforced applicator hose terminates at the controller, which bridges the hose between the outdoors and the cabinet interior. The controller has an angulated bracket mounted within the vending machine cabinet. A collar assembly secured on the bracket top above a hose feed-through orifice has a terminator, a bushing, and a cooperating yoke that are coaxially secured. The terminator anchors the hose end and is seated within the yoke. A rigid lug projects radially from the yoke. A rigid restrictor surmounts the collar assembly and limits rotation by contact with the lug.

Abstract: An apparatus and a method for cleaning a wafer are described. A chamber has a substrate support. A nozzle is disposed above the substrate support to spray de-ionized water droplets. The nozzle is coupled to a source of de-ionized water and a source of nitrogen. The nozzle is configured to mix the de-ionized water and the nitrogen outside the nozzle to have independent flow rate control of the two fluids for an optimized atomization in terms of spray uniformity in droplet size and velocity distributions. The nozzle to wafer distance can be adjusted and tuned to have an optimized jet spray for efficiently removing particles or contaminants from a surface of a wafer without causing any feature damage.

Abstract: The present invention is directed to the creation and delivery of foam to displace the vapor space of an enclosed structure of residual material suspended in the vapor space to the outside. The foam accumulates in the enclosed structure to urge the residual material suspended in the vapor space to exit the enclosed structure via an exhaust duct.

Abstract: A mobile or stationary waste container cleaning system used for residential, commercial and industrial waste, garbage, trash, storage or operations containers or receptacles. Other applications include, but are not limited to cleaning of chemical drums, grease dumpsters (e.g. behind restaurants), rain barrels and non-uniform residential, commercial or industrial dumpsters or waste containers. The container cleaning system can alternatively be used for rural areas, farms or ranches. The system uses multiple spray nozzles.

Abstract: The present invention relates to an instantaneous mixing device for injection/extraction cleaning machines and in particular to an instantaneous mixing device with a pre-spray functionality of the type equipped with at least one washing accessory (13) and/or at least one pre-washing accessory (30) connected at the outlet to a hydraulic circuit (20), the device (10) comprising: at least one spray pump (12) connected to the hydraulic circuit (20); at least one tank for water (15) and at least one tank for a chemical product (16), connected to the hydraulic circuit (20); at least one mixing element (14) with a Venturi effect connected downstream of the at least one water tank (15) and at least one tank for a chemical product (16). The at least one pre-washing element (30) preferably comprises a spray hole having greater dimensions with respect to the hole of the spray nozzle of the at least one washing accessory (13).

Abstract: An automatic cart wash apparatus. The automatic cart wash apparatus provides improved cleaning of stock carts on a regular basis over manual cleaning by store employees. The automatic cart wash apparatus includes three main stages: a debris removal (vacuum) stage, a cleaning (wash, sanitize, rinse) stage, and a drying stage. The debris removal stage uses forced air and/or suction to remove solid and generally non-soluble waste, such as a paper or other trash and debris, from a stock cart. The cleaning stage uses a selection of detergents, sanitizing agents, and rinse agents to remove soluble or sticky waste, such as food and liquids, and to kill germs, viruses, and bacteria present on the cart. The drying stage removes excess liquids from the cart making it ready for use by the next customer.

Abstract: A device and method for cleaning paint accessories and particularly roller covers and/or other paint accessories simultaneously or individually. A spray head has a fluid inlet engageable to a source of fluid and a fluid collection chamber in communication with the fluid inlet. A plurality of spray apertures are radially spaced within the spray head to be adjacent the nap of a roller cover during use. A sealing surface positioned within the radius of the spray apertures seals off an end of the roller cover. A housing having an inner cavity for receiving a roller cover has a diameter sized to create cleansing fluid flow through the nap of a roller cover. A plurality of outlet apertures in communication with the inner cavity are radially spaced to be adjacent a nap portion of a roller cover during use. A plurality of decreased diameter nestable sleeves adapted to fit in the housing are also provided to accommodate variously circumferentially dimensioned paint rollers.

Abstract: A soft spray nozzle discharging a cleaning mist is vertically directed and fixed to an arm. A rinse nozzle discharging rinsing deionized water for suppressing obstruction is vertically fixed to the arm at a prescribed distance from the soft spray nozzle. During cleaning, it follows that both nozzles discharge detergents while keeping relative layout relation. Therefore, the discharged cleaning mist and rinsing deionized water do not interfere with each other before reaching the substrate but the used detergents are entirely horizontally splashed and recovered in a cup. Thus, the cleaning mist is prevented from scattering and adhering to the periphery.

Abstract: This invention includes a circuit board cleaning apparatus comprising a circuit board support structure configured to receive a circuit board for cleaning. A plurality of spray openings is oriented to spray cleaning fluid onto said circuit board as received by the support structure. The spray openings are mounted above the support structure for movement relative to the support structure across the circuit board during cleaning of the circuit board. Additional and/or other apparatus are disclosed, as are inventive methods using such apparatus and other apparatus.

Abstract: A device for washing and storing machinery is provided. This device includes a storage apparatus and a washing apparatus formed integrally with the storage apparatus. The storage apparatus further includes: a housing defining an internal chamber therein; a base attached to the bottom portion of the housing, wherein the base further includes at least one aperture formed therein; a debris tray attached to the base, wherein a portion of the tray is positionable beneath the aperture formed in the base; and a door for gaining access to the internal chamber, wherein the door further includes a floating upper portion and a lower portion connected to the base. The washing apparatus further includes: a plurality of directional sprayers, wherein the plurality of directional sprayers are located within the housing and the base; and plumbing for connecting the plurality of sprayers to one another and to a source of pressurized fluid.

Abstract: The substrate processing apparatus is provided with a gas-liquid mixing nozzle for generating a process liquid mist by mixing a liquid and a pressurized gas, to discharge the process liquid mist to a substrate at high speeds. The liquid may be remover liquid, intermediate rinse liquid or deionized water. The reaction products which having been generated on the substrate in etching process is removed at high speeds with the flow of the mist, whereby the quality of the process is improved.

Abstract: A cleaning apparatus is provided for cleaning an inner surface of a container. A spray head is arranged for operable fluid communication with a fluid pump and has a nozzle configured to disperse liquid in a mist. A mount carries the spray head and is removably supportable on a container having an inner surface to be cleaned. When removably supported on a container, the mount supports the spray head in a position within the container where the spray head can coat the inner surface of the container with mist.

Abstract: An ion sampling method for wafer provides a wafer in a sampling chamber, wherein the wafer surface that is going to be sampled faces upward; spraying an extraction liquid continuously on the wafer surface to form a liquid film thereon; keeping the thickness of the film constant for dissolving the ion contaminants in the extraction liquid; and collecting the extract solution at the bottom of the sampling chamber.

Abstract: A wafer cleaning apparatus with multiple wash-heads is applied in chemical and mechanical polishing process after wafer cleaning. The wafer cleaning apparatus device includes a supporting base, which supporting base comprises a driving device and at least one fluid pipe. A rotation module is also included in the wafer cleaning apparatus. The top side of the rotation module is connected with the driving device. Besides, the rotation module comprises multiple wash-heads and at least one nozzle. The bottom side of wash-head here is contacted with the surface of the wafer. By using driving device, the rotation module can be wholly driven. Also, multiple wash-heads can rotate individually along a cleaning path for cleaning wafer. The fluid was jetted from nozzle and assistant to clean wafer through fluid pipe. The prior art of single wafer wash-head is easily to reform a cleaning dead angle in wafer cleaning process.

Abstract: A circuit board processing system includes a wash tank configured to contain cleaning fluid, and a positioning subsystem configured to immerse a set of circuit boards into the wash tank. The system further includes a flow control subsystem having (i) a first set of nozzles disposed within the wash tank, (ii) a second set of nozzles disposed within the wash tank, and (iii) a controller. The controller is configured to direct the cleaning fluid through the first set of nozzles to provide a flow of the cleaning fluid in a first direction relative to the set of circuit boards. The controller is further configured to direct the cleaning fluid through a second set of nozzles to provide a flow of the cleaning fluid in a second direction relative to the set of circuit boards after providing the flow of the cleaning fluid in the first direction.

Abstract: A method of washing a vehicle and apparatus therefore is disclosed. In one aspect, a wheel washing apparatus is pivotable about a vertical axis. In another aspect, wheels of the vehicle are applied a selective treatment, different from a side of the vehicle.

Abstract: Provided are a nozzle and a related substrate treatment apparatus. The substrate treatment apparatus includes a process chamber, a supporting member disposed in the process chamber to support substrates, and a nozzle disposed in the process chamber to supply treatment fluid. The nozzle includes an outer tube along which a plurality of spraying holes are formed and which has a first end that is closed and an inner tube inserted into the outer tube through a hole formed on a second end of the outer tube.

Abstract: A high pressure water stream (14) is discharged onto a surface to be cleaned. An ozone/water stream (16) is discharged on the same surface for sanitizing the surface. The high pressure water and ozone/water streams (14, 16) are discharged simultaneously along closely adjacent paths that are either parallel (FIG. 3) or concentric (FIG. 2). The water pressure is at least about 100 p.s.i. and is preferably between 100 p.s.i. and 1000 p.s.i. The nozzles that discharge the streams (14, 16) may be movable relative to the object(s) that receives the high pressure water and ozone/water (FIG. 1) Or, they may be fixed and the object may be movable relative to them (FIG. 4).

Abstract: A dish-cleaning appliance comprising a sink having a bowl defining a wash chamber with an open top for providing access to the wash chamber. A liquid recirculation system is provided for spraying liquid throughout the wash chamber. A drain conduit can be provided, alone or in combination with the recirculation system, for draining liquid from the wash chamber when the drain is closed. A fill control system is provided to ensure that the dishwashing cycle is not started with liquid in the wash chamber and that the sink drain is properly closed. One or more sensors can be provided for enabling the fill control system. The sensors can be located within the drain above the location where the drain is plugged.

Abstract: A high pressure water stream(14) is discharged onto a surface to be cleaned. An ozone/water stream(16) is discharged on the same surface for sanitizing the surface. The high pressure water and ozone/water streams(14,16) are discharged simultaneously along closely adjacent paths that are either parallel (FIG. 3) or concentric (FIG. 2). The water pressure is at least about 100 p.s.i. and is preferably between 100 p.s.i. and 2000 p.s.i. The nozzles that discharge the streams (14,16) maybe movable relative to the object(s) that receives the high pressure water and ozone/water (FIG. 1). Or, they may be fixed and the object may be movable relative to them (FIG. 4).

Abstract: A method for processing a substrate is provided which includes generating a fluid meniscus on the surface of the vertically oriented substrate, and moving the fluid meniscus over the surface of the vertically oriented substrate to process the surface of the substrate.

Abstract: A cleaning device for use in the production of semiconductor components comprises two feed devices with which a fluid medium is guided across a respective surface of an object to be cleaned so that different faces of the object are simultaneously cleaned. At least two gas feeding devices, having one means each for directing a gas flow onto the surface of the object to be cleaned, open into a cleaning chamber supplying a pressurized cleaning gas. At least two extraction means are connected to the outside of the cleaning chamber for discharging the gas fed to the cleaning chamber. The object can be introduced into the cleaning chamber through at least one gap. At least two ionization means are used to ionize the gas and the particles that are present in the cleaning chamber. One ionization means each is mounted between a direction means and an extraction means.

Abstract: A dish-cleaning appliance comprising a sink having a bowl defining a wash chamber with an open top for providing access to the wash chamber. A liquid recirculation system is provided for spraying liquid throughout the wash chamber. A drain conduit can be provided, alone or in combination with the recirculation system, for draining liquid from the wash chamber when the drain is closed. A fill control system is provided to ensure that the dishwashing cycle is not started with liquid in the wash chamber and that the sink drain is properly closed. One or more sensors can be provided for enabling the fill control system. The sensors can be located within the drain above the location where the drain is plugged.

Abstract: A cleaning apparatus includes upper and lower nozzle assemblies supplying a cleaning liquid to edge and bottom sections of a semiconductor substrate. The upper nozzle assembly has a first nozzle supplying the cleaning liquid onto the edge section, and second and third nozzles supplying a nitrogen gas for preventing the cleaning liquid from moving into a center portion of the semiconductor substrate. The cleaning liquid supplied to the edge section flows from the edge section towards a side section of the semiconductor substrate due to the rotation of the semiconductor substrate. An ultrasonic wave generator is provided above the edge section for generating ultrasonic waves. The ultrasonic waves are applied to the cleaning liquid supplied onto the edge and bottom sections, thereby improving the cleaning efficiency. The cleaning apparatus has a guide to guide the cleaning liquid supplied to the edge section toward the side section.