Abstract: An apparatus for etching a substrate includes (a) a nozzle system including at least one nozzle through which acid solution containing at least hydrofluoric acid is sprayed onto the substrate, (b) a mover which moves at least one of the nozzle system and the substrate relative to the other in a predetermined direction in such a condition that the substrate and the nozzle system face each other, (c) a filter system which filters off particles out of the acid solution having been sprayed onto the substrate, and (d) a circulation system which circulates the acid solution having been sprayed onto the substrate, to the filter system, and further, to the nozzle system from the filter system.

Abstract: A dishwasher apparatus includes a dish rack having a wire member, and a feed tube for a spray arm rotatably disposed beneath the dish rack. An intensive washing zone is provided in a region of the dish rack, the intensive washing zone including a rod-shaped pipe element attached to the wire member and having an outlet nozzle. A pipe branch for the intensive washing zone is provided, the pipe branch being disposed in a region of the feed tube and communicating with the pipe element via a T-piece. An actuator is provided that cooperates with the pipe element so as to enable the intensive washing zone to be activated and deactivated.

Abstract: Embodiments of the present invention generally relate to an apparatus and a method for cleaning a semiconductor substrate after a polishing process. Particularly, embodiments of the present invention relates to an apparatus and method for cleaning a substrate using pressurized fluid. One embodiment of the present invention comprises two rollers to support and rotate a substrate in a substantially vertical orientation, a pressure wheel to apply a force to engage the substrate with the two rollers, and a swinging nozzle configured to dispense a pressurized fluid towards the substrate.

Abstract: The present invention provides a nozzle device comprising a substantially cylindrical nozzle body and a cup member which is arranged within the cylinder of the nozzle body and jets out fluid droplets from the tip thereof while being driven to turn, wherein two or more fluids including a detergent and a gas are mixed and jetted out of the tip of the nozzle in order to achieve sufficient cleaning of a single wafer without a re-adhesion of contamination or destruction of the pattern of the wafer. Therefore, the fluid droplets can be controlled to a smaller size than the conventional double-fluid cleaning system or high pressure jet system.

Abstract: The substrate processing apparatus according to the present invention includes: a substrate rotating mechanism holding a substrate in a horizontal attitude and rotating the substrate around an axis passing through the center of the substrate; a processing liquid supply mechanism supplying a processing liquid to a central portion of the upper surface of the substrate rotated by the substrate rotating mechanism; a counter member arranged to be opposed to the upper surface of the substrate rotated by the substrate rotating mechanism; and a liquid film extending mechanism moving the counter member from a position opposed to the central portion of the substrate to a position opposed to a peripheral edge portion of the substrate in parallel with the supply of the processing liquid by the processing liquid supply mechanism and extending a liquid film of the processing liquid covering the central portion of the substrate toward the peripheral edge of the substrate due to the movement.

Abstract: Accurate coating and developing having high intrasurface uniformity is achieved by suppressing the influence of components of a resist that may be eluted while a substrate coated with the resist is processed by immersion exposure. A coating unit coats a surface of a substrate with a resist. then, a first cleaning means including a cleaning nozzle cleans the substrate and then the substrate is subjected to an exposure process. Since only a small amount of components of the resist dissolves in a transparent liquid layer formed on the substrate for exposure, an exposure process can form lines in accurate line-widths. Consequently, a resist pattern of lines having accurate line-widths having high intrasurface uniformity can be formed on the substrate by developing the exposed resist.

Abstract: A method and system utilizing a mobile cleaning unit for providing cleaning of heat exchanger tube bundles. The mobile cleaning unit utilizes a pressurized seal positioned about top door of the cleaning enclosure to provide a fluid and vapor lock of the cleaning enclosure. An oxygen purging system of the cleaning enclosure, the cleaning fluid reservoir, and the control panels provides additional safety. The mobile cleaning unit can use cleaning fluid produced at the facility site and return the cleaning fluid to the facility site for reprocessing after the heat exchanger tube bundles are cleaned.

Abstract: An apparatus and method for cleaning polymer film are provided and include a support assembly for supporting the polymer film to be cleaned, the support assembly being constructed and arranged to move the polymer film for cleaning, and at least one nozzle disposed adjacent the polymer film for providing CO2 to the polymer film for dislodging particulate matter from the polymer film and the at least one aperture, and for cleaning thereof.

Abstract: A cleaning device and a cleaning method for a container capable of continuously performing a cleaning treatment, and a tank. The cleaning device includes a jetting member which jets a fluid in the container; a movement unit which relatively moves the jetting member along an axial direction of the container with respect to the container so that the jetting member is inserted into the container from a mouth part of the container; and a switching unit which switches the jetting member from one function to another function. The switching unit switches a nozzle for a cleaning liquid, a nozzle for blowing and a nozzle for drying in order.

Abstract: A method and device for treating substrates, and a nozzle unit therefore. A liquid film is formed on a local surface area of a substrate that is to be treated by means of a nozzle unit comprised of at least on elongated nozzle arrangement and an ultrasonic or megasonic transducer arrangement disposed adjacent to the nozzle arrangement. The transducer arrangement is composed of a plurality of transducers having different resonant frequencies. At least a portion of the transducer arrangement is brought into contact with the liquid film, and ultrasound or megasound is introduced into the liquid film by the transducer arrangement.

Abstract: This invention concerns a component for a painting facility which is contaminated with paint during operation of the painting facility, e.g. a grating, a hanger, a cover and similar, characterized in that it is coated with a plasma polymeric coating containing oxygen, carbon and silicon.

Abstract: An improved nozzle assembly for a dishwasher is provided. The nozzle assembly includes first and second nozzles rotatably installed adjacent to corresponding first and second racks so as to selectively spray water in first and second directions. One of the nozzles includes a device for manually setting the spraying direction, including a fixed central piece and first and second nozzle sections. The fixed central piece is in communication with a water circulator, and supplies water to the first and second nozzle sections. An open end of each nozzle section is rotatably coupled to an open end of the fixed central piece, and the first and second nozzle sections may be rotated using a manual setting device so as to direct a spray of water in different directions.

Abstract: Described herein is a dish-washing machine, in which there is provided: at least one supporting structure; a washing station, defined by one or more washing arms; a rinsing station, defined by one or more rinsing arms and by at least two attachment assemblies for attachment of the rinsing arms, which are positioned on opposite sides of the washing arms; and reversible movement means for displacing a dish rack from the washing station to the rinsing station.

Abstract: A wafer processing system has a moveable drain assembly having multiple drain rings. The drain rings may be spaced apart sufficiently to allow a process fluid applicator to move between them. Each drain ring provides a separate drain path, optionally in a separate recirculation loop carrying a single process fluid. The drain rings may be sequentially moved into position to collect process fluid moving off of the workpiece. As a result, process fluids may be more uniformly applied and used process fluids can be separately removed, collected, and either recycled or processed for disposal. Mixing of used process fluids is largely avoided. A lower process fluid outlet allows for processing the back side of the wafer as well, without flipping the wafer.

Abstract: Substrate cleaning apparatus and method capable of preventing adhesion of particles to a substrate irrespective of being hydrophilic or hydrophobic are provided. Although a cleaning liquid ejected from a two-fluid nozzle 36 rebounds from a cup CP and scatters in the form of mist toward the center side of a wafer W, a rinsing liquid is supplied from a rinse nozzle 35 to form a water film 51 on the wafer W. Owing to the presence of the water film 51, the surface of the wafer W is protected from adhesion of particles contained in the mist. It is possible to prevent the particles in the mist from adhering to the wafer W and also possible to prevent a bad influence on the wafer W.

Abstract: Provided is an apparatus for cleaning and drying a substrate by applying a plurality of chemicals and gases to the substrate. The apparatus may include: a substrate support member including a chuck receiving a substrate; a first nozzle member injecting a drying fluid onto a top surface of the substrate for drying the substrate; a low cover including an opened top and enclosing the chuck; and an upper cover selectively closing the opened top of the low cover so as to dry the substrate in a closed space. Therefore, the apparatus dries a substrate more efficiently and protects the substrate from being contaminated by foreign pollutants. Furthermore, generation of an undesired oxidation layer on the substrate can be prevented.

Abstract: A method for manufacturing an article having polymeric residue that is to be removed during the manufacture of the article is disclosed. The article is introduced into a controlled environment of a processing tool having one or more processing chambers. Free radicals are generated from one or more reactant gases and introduced into at least one of the one or more processing chambers where they react with the polymeric residue. A cryogenic cleaning medium is supplied into at least one of the one or more processing chambers where the cryogenic cleaning medium removes the polymeric residue present after the free radicals react with the polymeric residue. The reactant gases are selected to facilitate removal of the polymeric residue with the cryogenic cleaning medium. The cryogenic cleaning medium is supplied with a pulsating flow via a nozzle implement that sweeps across the article.

Abstract: A device having at least one cleaning unit for cleaning installations, especially for the production and/or processing of food stuffs or pharmaceuticals is provided. The device may include a cleaning unit that is configured to move within the installation to be cleaned. The cleaning unit may also be provided with one or more nozzles with rotatable nozzle tips configured to rotate as cleaning agent flows through the nozzle tip.

Abstract: An automatic cleaning apparatus and/or method for periodically cleaning a filling machine during a filling cycle without the need for human interaction to initiate the cleaning process. In some embodiments, a controller automatically initiates a cleaning sequence at predetermined intervals. The predetermined intervals can be a time interval, such as every thirty minutes for example, or based upon filling characteristics, such as after a predetermined number of containers are filled or a predetermined amount of product has flowed through the filling machine. In some embodiments, the controller performs many operations during the cleaning process. For example, the controller can prevent containers from entering the filling machine and control the operation of a cleaning manifold. Upon completion of the cleaning operation, the controller waits a predetermined period while filing operations commence before automatically initiating the next cleaning operation.

Abstract: A fluid delivery device for delivering fluid to the backside of a substrate while minimizing waste is provided. The device includes an inner cylindrical tube having a top opening and a bottom opening. An upper cap overlying a top portion of the inner cylindrical tube is included. The upper cap is moveably disposed over the inner cylindrical tube. The upper cap includes a top with at least one hole defined therein. The top includes a sidewall extending therefrom. A system and a method for reducing an amount of a cleaning chemistry applied to a backside of a wafer during a cleaning operation are also provided.

Abstract: Device and process for cleaning a circulating belt, the device using a cleaning device having at least one nozzle. The process includes feeding a pressurized fluid to the at least one nozzle, and subjecting the circulating belt to the pressurized fluid via the at least one nozzle. The pressurized fluid has a temperature in a range of between approximately 90° C. and approximately 160° C.

Abstract: An apparatus and method for cleaning surfaces of semiconductor wafers utilizes streams of gaseous material ejected from a gas nozzle structure to create depressions on or holes through a boundary layer of cleaning fluid formed on a semiconductor wafer surface to increase the amount of gaseous material that reaches the wafer surface through the boundary layer.

Abstract: A waste heat recovery system includes: a tank; heat exchange pipes connected with one another in the form of a ‘S’ shape in multiple steps inside the tank and having city water flow pipes bound up into a bundle; circulation leading plates mounted between the heat exchange pipes for inducing a flow of waste water; movable nozzles mounted on the circulation leading plates and connected with a high pressure water pipe for spraying high pressure water onto the surface of the heat exchange pipe or having a brush for cleaning the surface of the heat exchange pipe; a nozzle driving part for driving the movable nozzle by means of a driving motor; and waste water inlet and outlet for flowing hot waste water from the upper portion to the lower portion of the tank and city water inlet and outlet for flowing city water from the lower portion to the upper portion of the tank.

Abstract: Disclosed is a nozzle for injecting sublimable solid particles, which is capable of minimizing consumption of the carrier gas and also maximizing cleaning efficiency. The nozzle comprises a base block having a space in which carrier gas is supplied through a gas supplying pipe; a sub-block having a space in which cleaning medium decompressed by a regulator is supplied through a cleaning medium supplying pipe; a first venturi block having a venturi path for adiabatically expanding the carrier gas supplied from the space of the base block, and a cleaning medium injection path communicating the venturi path and the space of the sub-block and the carrier gas passed through the venturi path; and a second venturi block having a venturi path for adiabatically expanding the mixed gas of the carrier gas and the cleaning medium.

Abstract: Methods and systems for preparing a substrate implementing a surface tension reducing process are provided. In one example, a substrate preparation system includes a chuck which fingers for edge gripping the substrate. The chuck is hollow to provide simultaneous access to both active and backside surfaces of the substrate, and is configured to rotate the substrate. The system includes dispense arms positioned over the substrate surfaces. The dispense arms are capable of moving between a center region and a periphery of the substrate surfaces, and each dispense arm includes a pair of supply lines for delivering fluids over the substrate surfaces. A connection couples the upper dispense arm with the lower dispense arm so that the dispense arms synchronously move between the center region and the periphery of the substrate, and remain aligned on opposite surfaces of the substrate.

Abstract: A substrate treatment apparatus comprises a treatment vessel, a substrate holder for rotating the substrate in a horizontal plane in the treatment vessel, a nozzle unit arranged in an upper part of the treatment vessel such that a liquid is downwardly fed, a feed line for feeding the liquid to the nozzle unit, and a chamber enclosing therein the apparatus in its entirety. The nozzle unit is constructed in a form of a bar such that as viewed in plan, the liquid ejected from the nozzle unit reaches the substrate with an area range having a length not smaller than a diameter of the substrate and a width smaller than the diameter of the substrate.

Abstract: A cleaning apparatus includes upper and lower nozzle assemblies supplying a cleaning liquid to edge and bottom sections of a semiconductor substrate. The upper nozzle assembly has a first nozzle supplying the cleaning liquid onto the edge section, and second and third nozzles supplying a nitrogen gas for preventing the cleaning liquid from moving into a center portion of the semiconductor substrate. The cleaning liquid supplied to the edge section flows from the edge section towards a side section of the semiconductor substrate due to the rotation of the semiconductor substrate. An ultrasonic wave generator is provided above the edge section for generating ultrasonic waves. The ultrasonic waves are applied to the cleaning liquid supplied onto the edge and bottom sections, thereby improving the cleaning efficiency. The cleaning apparatus has a guide to guide the cleaning liquid supplied to the edge section toward the side section.

Abstract: A work washing apparatus including a transfer unit for controlling forward and rearward movements of a work, a table moved by the transfer unit, carrying out the washing of the work from upper and lower surfaces thereof and provided with water/air pipes, an upper surface washing unit provided on an upper surface of the transfer unit and having upper surface washing nozzles which make planetary movements by utilizing rational movements of the nozzles on their own axes and an orbital movement of the washing unit, side surface washing units provided on both side surfaces of the transfer unit and having side surface nozzles which make planetary movements by utilizing rotational movements of the nozzles on their own axes and an orbital movement of the upper surface washing unit, a lower washing unit provided on a lower surface of the transfer unit and having lower surface washing nozzles which make planetary movements by utilizing rotational movements of the nozzles on their own axes and an orbital movement of the

Abstract: In the drying step of the single wafer type substrate cleaning system for cleaning wafers not stored in a cassette, in a sealed cleaning housing, a spin drying treatment is applied to the wafer when the wafer is supported and rotated at high speed while an inert gas for preventing oxidation is supplied to the face of the wafer, and the amount of the inert gas to be supplied to the face of the wafer is larger at the outer peripheral portion of the wafer than that supplied at the center thereof, thereby preventing oxidation on the face of the wafer effectively while optimizing the benefits of the single wafer type cleaning system.

Abstract: The substrate processing apparatus is provided with a gas-liquid mixing nozzle for generating a process liquid mist by mixing a liquid and a pressurized gas, to discharge the process liquid mist to a substrate at high speeds. The liquid may be remover liquid, intermediate rinse liquid or deionized water. The reaction products which having been generated on the substrate in etching process is removed at high speeds with the flow of the mist, whereby the quality of the process is improved.

Abstract: A cleaning apparatus for a lens defining opposed top and bottom surfaces and a peripheral edge. The cleaning apparatus comprises a rotatable base having a plurality of arms pivotally connected thereto and rotatable therewith. The arms are configured to releasably engage the peripheral edge of the lens. The cleaning apparatus further comprises a means for propelling a heated medium towards at least one of the top and bottom surfaces of the lens while the lens is being spun by the rotation of the base and the arms.

Abstract: An apparatus for cleaning re-usable filters, the re-usable filter having an axis, the apparatus. The apparatus includes a source of cleaning fluid; a receptacle for dirty cleaning fluid; a mount for holding the re-usable filter, the mount spinning about the filter's axis; a nozzle for directing a spray of cleaning fluid against the filter; a pump for delivering cleaning fluid from the source of cleaning fluid to the nozzle; and a cover for enclosing the apparatus.

Abstract: A system and method for processing an edge of a substrate includes an edge roller and a first proximity head. The first proximity head being mounted on the edge roller. The first proximity head capable of forming a meniscus and including a concave portion and multiple ports opening into the concave portion. The concave portion being capable of receiving an edge of a substrate and the ports including at least one process liquid injection port, at least one vacuum port and at least one surface tension control port.

Abstract: A fluid delivery device for delivering fluid to the backside of a substrate while minimizing waste. The device includes an inner cylindrical tube having a top opening and a bottom opening. An upper cap overlying a top portion of the inner cylindrical tube is included. The upper cap is moveably disposed over the inner cylindrical tube. The upper cap includes a top with at least one hole defined therein. The top includes a sidewall extending therefrom. A system and a method for reducing an amount of a cleaning chemistry applied to a backside of a wafer during a cleaning operation are also provided.

Abstract: The invention concerns an apparatus for cleaning the edge of a wafer that may be relatively simply constructed with low cost, and prevent the wafer from being re-contaminated by the edge cleaning, thus resulting in increase of the yield rate of wafers. The apparatus includes a cleaning agent ejection nozzle body provided on a side part of a chuck for ejecting a particulate cleaning agent (CO2 particles) towards the side and the edge portions of the wafer held and rotated by the chuck, and a nozzle body carriage for moving the nozzle body between rest and cleaning positions.

Abstract: A method and apparatus comprising a wafer platform which rotates a semiconductor wafer at a predetermined speed while being moved in a linear motion with respect to a stationary water jet nozzle spraying a water or fluid jet onto the wafer during a wafer scrubbing process. The coupled rotary and linear motions of the wafer facilitates through washing or rinsing of the wafer surface and spreads impact energy of water or fluid sprayed onto a wafer surface over a large surface area on the wafer, resulting in a substantial reduction of particles remaining at the center of the wafer after the wafer scrubbing operation and preventing or minimizing the likelihood of impact damage to the wafer during the wafer scrubbing process. In another embodiment, the water or fluid jet nozzle moves along a horizontal axis while the spinning wafer remains stationary.

Abstract: Semiconductor wafer (11) are uniformly and thoroughly cleaned of particulate and organic contaminants by sweeping the wafer with a hydraulic broom that sprays cleaning solution onto the wafer. The broom contains an aspirating nozzle (3) for connection to a source of pressurized gas, such as nitrogen, and to a source of cleaning fluid, such as acetone, wherein cleaning fluid aspirated by the gas stream is expressed through the nozzle outlet to impact the surface of the wafer, dislodging particulate matter and dissolving organic contaminants. A programmed controller (9) controls movement of the hydraulic broom relative to the wafer to ensure that the entire surface is cleaned and permits a variety of sweeping patterns.

Abstract: A single wafer cleaning apparatus that includes a rotatable bracket that can hold a wafer, a rinse fluid having a first surface tension, a second fluid having a second surface tension lower than the first surface tension, a first nozzle capable of applying the rinse fluid at a first location on the wafer positioned in the bracket, second nozzle capable of applying the second fluid at a second location on the wafer where the second location is inboard of the first location, and the first nozzle and the second nozzle are capable of moving across the wafer to translate the first location and the second location from the wafer center to the wafer outer edge.

Abstract: A dishwasher having a wash chamber or tub including a sump and a side wall. A pump is fluidly connected with the sump and a supply tube is supported adjacent the tub side wall and receives wash liquid from the pump, the supply tube has a manifold portion including a plurality of outlet openings. A coupling retainer is connected to the supply tube and has a plurality of funnel shaped coupling ports corresponding in number and spacing to the outlet openings of the supply tube. Each of the coupling ports includes a center opening which is provided with a sealing surface. A valve member supports a plurality of valve elements for sealing the outlet openings and is captured between the coupling retainer and the supply tube such that the valve elements generally align with the coupling parts.

Abstract: An automatic wine barrel washing apparatus is disclosed. The apparatus includes a base portion having a plurality of horizontal and vertical support members, a top portion mounted on said base portion. The top portion comprises a plurality of spaced apart roller support plates, and a plurality of sinks disposed within the top portion. Each of the sinks include a drain and drain lines. Motorized wash tubes having heads are provided, each of wash tube heads adapted for insertion into a wine barrel through the wine barrel bung hole. The wash tubes are in fluid communication with a source of pressurized water. Wash tube elevation means selectively raise and lower the wash tubes, and wash tube rotating means rotate the wash heads during a wash cycle. A barrel wash cycle is controlled by a PLC or microprocessor.

Abstract: An apparatus for chemically treating a metal part which includes an immersion tank containing a liquid chemical treatment solution, a conveyor conveying parts over the immersion tank, immersing and removing the part and at least one spray nozzle assembly located above the immersion tank which is supported on a track extending to a side wall of the tank and permitting maintenance of the spray nozzle assembly without draining the tank.

Abstract: A method and an apparatus for removing a liquid, i.e a wet processing liquid, from a surface of at least one substrate is disclosed. A liquid is supplied on a surface of substrate. Simultaneously or thereafter besides the liquid also a gaseous substance can be supplied thereby creating at least locally a sharply defined liquid-vapor boundary. The gaseous substance and the liquid can be selected such that the gaseous substance is miscible with the liquid and when mixed with the liquid yields a mixture having a surface tension lower than that of the liquid. According to the invention, the substrate is subjected to a rotary movement at a speed to guide said liquid-vapor boundary over said substrate thereby removing said liquid from said substrate.

Abstract: An apparatus and a method for cleaning wafers with contact holes or via holes are provided. The apparatus for cleaning wafers comprises a first arm, a second arm, a fixing device, a rotating device and a spraying device. The fixing device, disposed on the first arm, fixes the wafer in a manner such that a surface of the wafer, with contact holes or via holes, faces downward. The rotating device, disposed above the fixing device, rotates the fixing device. The spraying device, disposed on the second arm in a manner such that the spraying device is located beneath the fixing device, sprays the water upwards to the surface of the wafer. By the apparatus and method according to the invention, the possibility of native oxide remaining in the contact holes or the via holes is greatly reduced. In addition, the removal of defects from the surface of the wafer is enhanced.

Abstract: Substrate cleaning apparatus and method capable of preventing adhesion of particles to a substrate irrespective of being hydrophilic or hydrophobic are provided. Although a cleaning liquid ejected from a two-fluid nozzle 36 rebounds from a cup CP and scatters in the form of mist toward the center side of a wafer W, a rinsing liquid is supplied from a rinse nozzle 35 to form a water film 51 on the wafer W. Owing to the presence of the water film 51, the surface of the wafer W is protected from adhesion of particles contained in the mist. It is possible to prevent the particles in the mist from adhering to the wafer W and also possible to prevent a bad influence on the wafer W.

Abstract: A cryogenic cleaner for and a method of performing cleaning of a surface that must be substantially free of contaminants has a resiliently mounted nozzle for spraying a cryogenic cleaning medium on the surface. The nozzle is driven in an oscillatory manner at a predetermined amplitude and frequency so the nozzle spray is delivered in a manner to provide pulsing of the spray and to provide as “snow plow” effect on contaminants as the spray delivers the cleaning medium against the surface. The surface is transported past the nozzle, and the cleaning occurs in an enclosed controlled environment.

Abstract: The invention provides an apparatus and method for cleaning or etching wafers. The invention further provides a megasonic transducer designed to apply mechanical vibrations to a layer of fluid in contact with a wafer. The electromechanical transducer is housed in a quartz or sapphire lens which is chemically compatible with the layer of fluid, and sealed to protect the housing interior from fluids and chemical fumes. An electrical power source produces a signal that is sent to the transducer to generate a megasonic wave. The wave travels between the lens and the wafer, through the layer of fluid, dislodging small particles from the wafer which are then removed in the fluid stream. In one embodiment of the present invention, a wafer to be cleaned is placed on a rotatable support below a transducer assembly. A fluid is introduced through the transducer assembly to provide a layer of fluid between the lens and wafer.

Abstract: An apparatus for cleaning castings includes a cleaning cabinet having a rotary clamping device which clamps a casting to be cleaned upon a freely rotatable plate in the cabinet. An elongate lance having a high pressure nozzle at its inner end projects into the cabinet and delivers a high pressure water jet against the casting at a pressure of 1,000 psi to 40,000 psi. A spherical bearing pivotally and rotatably mounts the lance on a vertically reciprocal carriage. A pair of pneumatic cylinder and piston units are connected to lance and are differentially operated with respect to actuation times and length of piston stroke to thereby produce random movement of the lance during the cleaning operation.

Abstract: An improved process for cleaning a semiconductor wafer surface during manufacture to remove metallic contaminants without the use of robotics and without risk of scanning droplets falling from the wafer, in a faster time than with a manual process using a vacuum wand, comprising: a) positioning a wafer on a rotating plate pivotably mounted above a platform; b) contacting the wafer with a metals scanning solution droplet from the tip of a drop probe, the solution being adhered in a bottom portion of the drop probe above the wafer in a material of a surface tension sufficiently higher than the surface tension on the wafer, the drop probe being pivotably connected to a pivot arm which upon pivoting or turning one notch enables droplet sweeping of metal contaminants on a concentric circle on the wafer on the rotating plate; c) successively turning the pivot arm a sufficient number of notches to enable completion of wafer droplet sweepings through concentric circles to reach the edge of the wafer until all of t

Abstract: The present invention is directed to a method, system, and apparatus for applying megasonic energy to the surface of a workpiece for the removal of contaminants. A nozzle dispenses a stream of deionized water or other cleaning fluid at a radial position on the surface. A stepping motor moves the arm over the surface, in a step-wise manner, allowing megasonic energy to be applied in a uniform manner. The workpiece is rotated at low speeds to provide a more uniform application. Chemical solutions may optionally be added to dissolve contaminants or change the Zeta potential of the contaminants to make particles easier to detach and suspend. A high-RPM dry spin cycle further removes cleaning fluid and suspended contaminants, preventing them from reattaching. The present invention is compatible with numerous types of workpieces including 12″ semiconductor wafers.

Abstract: A nozzle that extends telescopically upward is used to elevate a wafer without contacting the wafer. The nozzle includes a stationary hollow cylinder, closed at its lower end and open at its upper end, within which a spool is disposed to slide vertically. In its lowest position the spool is spaced from the closed bottom of the cylinder, and purified water is supplied under pressure to the space. A passage extends vertically through the spool, and the water is discharged at the upper end of the spool from the passage. As a wafer is lowered toward the upper end of the spool, the wafer partially impedes the discharge, increasing the pressure in the space below the spool. The increased pressure drives the spool and the wafer upward, but the wafer never comes into contact with the wafer because the discharge of water creates a protective cushion between them.