Abstract: An apparatus and system for removing photoresist or other organic material from a substrate such as a semiconductor wafer is provided. The apparatus and system includes a chamber for partially immersing the substrate in a solvent (e.g., deionized water), a chamber for receiving an oxidizing gas (e.g., ozone), and a mechanism for rotating or otherwise moving the substrate through the solvent to coat a thin film of solvent over the organic component on the substrate surface and expose the solvent-coated substrate to the ozone gas.

Abstract: A glass sheet washing machine with a broken glass removal system includes a support, a liquid container or reservoir, a pump, a liquid applicator, and a liquid permeable member. The support supports a glass sheet being washed. The liquid reservoir is positioned below the support. The pump is coupled to the liquid reservoir. The liquid applicator is coupled to the pump. The liquid applicator applies the liquid from the liquid reservoir to wash the glass sheet. Excess liquid falls into the reservoir. The liquid permeable member is positioned between the support and the liquid reservoir to catch pieces of glass to inhibit the pieces of broken glass from falling into the liquid reservoir and is moved to remove the pieces from the glass washing machine.

Abstract: A cleaning apparatus and a cleaning method for cleaning a object are provided. In the cleaning apparatus, a drying chamber 42 and a cleaning bath 41 are separated from each other up and down, respectively. Thus, a space in the drying chamber 42 can be insulated from a space of the cleaning bath 41 through rotary doors 59a and a slide door 72. In the cleaning method, a cleaning process in the cleaning bath 41 is carried out while sealing it by the rotary doors 59a. On the other hand, a drying process in the drying chamber 42 is accomplished while sealing and closing it by the slide door 72. Consequently, there is no possibility that, during the drying process, the object is subjected to a bad influence from a chemical treatment.

Abstract: An apparatus for removing a photoresist from a substrate which includes a stripping bath chamber, a conveying unit conveying a substrate containing a photoresist through the stripping bath chamber, a photoresist stripper material supplying unit positioned to dispense the photoresist stripper material to the substrate while the substrate is disposed in the stripping bath chamber, an antifoaming agent supplying unit disposed in the stripping bath chamber dispensing an antifoaming agent toward the photoresist stripper material in the stripping bath chamber, an antifoaming agent storing unit communicating with the antifoaming agent supplying unit supplying the antifoaming agent thereto, and a stripper storing unit operatively connected to the stripper supplying unit supplying stored photoresist stripper material thereto.

Abstract: A cleaning apparatus capable of sufficiently removing foreign matters such as coating or labels from surfaces of crushed pieces of the collected polymeric mold product is provided. The cleaning apparatus includes a cleaning bath provided with a rotary shaft extending in the longitudinal direction and having a water supply port, a drainage port as well as an introduction port and a discharging port for polymeric pieces, screw sections having a screw provided on the rotary shaft and flow-path restricting sections having stationary plates standing upright from the inner surface of the cleaning bath to restricting the advancement of water caused by the screw, wherein at least part of a surface of the stationary plate is roughened.

Abstract: A semiconductor wafer cleaning apparatus comprises an outer tank, a cleaning tank provided within the outer tank, a wafer carrier provided within the cleaning tank, a plurality of jet nozzles directed toward the wafer carrier, a main pipe connected to the jet nozzles, a circulating pump connected to the main pipe and the outer tank for circulating a cleansing solution from the outer tank, through the main pipe, the jet nozzles, and the cleaning tank, and a filter for filtering the circulated cleansing solution.

Abstract: An instrument treatment station includes a station body having a first and second elongate and spaced channel walls. The channel walls define an elongate instrument channel therebetween. The station body defines an elongate drain channel in fluid communication with the instrument channel. The station body further defines a source port in fluid communication with the instrument channel for delivering a fluid flow into the instrument channel for treating an instrument therein. The instrument treatment station may accommodate arrays of aligned instruments.

Abstract: Workpieces requiring low levels of contamination, such as semiconductor wafers, are loaded into a rotor within a process chamber. The process chamber has a horizontal drain opening in its cylindrical wall. The chamber is closed via a door. A process or rinsing liquid is introduced into the chamber. The liquid rises to a level so that the workpieces are immersed in the liquid. The chamber slowly pivots or rotates to move the drain opening down to the level of the liquid. The liquid drains out through the drain opening. The drain opening is kept near the surface of the liquid to drain off liquid at a uniform rate. An organic solvent vapor is introduced above the liquid to help prevent droplets of liquid from remaining on the workpieces as the liquid drains off. The rotor spins the workpieces to help to remove any remaining droplets by centrifugal force.

Abstract: A system for processing a workpiece includes an inner chamber pivotably supported within an outer chamber. The inner chamber has an opening to allow liquid to drain out. A motor pivots the inner chamber to bring the opening at or below the level of liquid in the inner chamber. As the inner chamber turns, liquid drains out. Workpieces within the inner chamber are supported on a holder or a rotor, which may be fixed or rotating. Multi processes may be performed within the inner chamber, reducing the need to move the workpieces between various apparatus and reducing risk of contamination.

Abstract: Fixtures and methods for clamping workpieces in a workplace to enable the optimized exposure thereof to a stream or flow of a supercritical fluid. Provided is a rotatably indexable chuck or locator mounting the workpiece and enabling orientating the latter in specific static pitch position within a high pressure vessel in order to subject the workpiece to a full frontal exposure to the supercritical fluid stream within the vessel. This mounting arrangement facilitates an optimum positioning of the workpiece being processed in the flow path of the supercritical fluid stream while oriented in selectively indexed rotational positions.

Abstract: The object of this invention is to provide a semiconductor wafer cleaning apparatus designed to clean several wafers at the same time while rotating the wafers held in a horizontal, laid-down position. In an operation of this apparatus, a wafer feeding robot arm 20 feeds wafers 60 from a wafer cassette 10 to a wafer boat 50 and seats the wafers in the wafer boat while maintaining a horizontal, laid-down position of the wafers. The wafer boat 50, with the horizontally laid-down wafers 60, is vertically moved downward by a boat drive unit 40 to be immersed in a wafer cleaning liquid flowing in a wafer cleaning bath 30. Thereafter, the boat 50 is rotated within the wafer cleaning liquid, and so the wafers 60 are washed and cleaned by the wafer cleaning liquid while being maintained in the horizontal, laid-down position and being rotated horizontally.

Abstract: A substrate cleaning apparatus comprises an outer shell constructed such that the outer shell is selectively openable or hermetically closable to form a sealed space, an inner shell enclosed within the outer shell and having a holding member for holding a substrate, and a dispenser unit for feeding at least one of gas and liquid into the inner shell. Within the sealed space formed by the outer shell, a highly gas-tight space is formed by the inner shell to permit cleaning of the substrate within the highly gas-tight space. Also disclosed are a dispenser, a substrate holding mechanism and a substrate cleaning chamber, which are suitable for use with the substrate cleaning apparatus, and substrate cleaning processes making use of these dispenser, substrate holding mechanism and substrate cleaning chamber, respectively.

Abstract: A processor for rinsing and drying of semiconductor substrates includes a process vessel contained within an outer containment vessel. A diluted organic vapor creates a Marangoni effect flow along the surface of processing liquid contained within the process vessel. The process vessel includes porous walls that allow residual chemicals, organic species, and other unwanted materials to flow from the process vessel to the outer containment vessel. The porous walls allow for the maintenance of a stable surface tension gradient to sustain a consistent Marangoni force for even drying. Replacement processing fluid is preferably introduced to the process vessel to prevent the build up of organic species in the surface layer of the processing fluid.

Abstract: A high-pressure processing apparatus includes a processing vessel including a processing chamber formed therein to perform a certain process onto an object in the processing chamber; fluid feeding means which feeds a high-pressure fluid into the processing chamber; fluid discharging means which discharges the high-pressure fluid from the processing chamber; an agitating unit which is arranged in the processing chamber and is operative to flow the high-pressure fluid over the object by relative rotation to the processing vessel; a communicating channel which is formed in the processing vessel to communicate inside and outside of the processing chamber; a rotary driving member which is coupled to the agitating unit via a shaft portion provided in the communicating channel; and a sealing portion which is provided between the shaft portion and the processing vessel to disconnect the processing chamber from the rotary driving member.

Abstract: The present invention 10 discloses a device for cleaning and sanitizing objects such as food products 86, cartridge filter elements 64 and other such objects that could benefit from the advantages of being circumferentially sprayed with a fluid or a cleaning solution 119 or preferably a combination thereof. The present invention 10 comprises an inner and outer housing body 24, 44, a cover 26 for the housing body, a rotative central member such as a base, axle or shaft 42, a rotative drive means 60 for selectively rotating the rotative member 42, intake means 16 to introduce one or more fluids 119 or solutions individually or in combination into the interior of the housing body 24 including a means for further pressurizing and peripherally directing the resulting spray 130 towards a central point in a specific array, a containment means 66 for placement of such items therein, and an outlet means 18 to provide for the removal of fluid from the housing.

Abstract: A cleaning device for a probe needle of a probe card rarely causing abrasion and deformation of the tip of a probe needle and capable of improving a probe needle life as well as a washing liquid used therefor are obtained. The tip of a probe needle of a probe card is immersed in a washing liquid for a probe needle of a probe card which includes an aqueous solution containing phosphoric acid or an aqueous solution containing chromic acid anhydride and phosphoric acid. While the tip of the probe needle is immersed in the washing liquid, the washing liquid is vibrated by a vibration generating member.

Abstract: A processor for processing microelectronic workpieces includes a process vessel adapted to hold one or more microelectronic workpieces vertically within a rotatable fixture. A drive motor is coupled to the rotatable fixture to spin the rotatable fixture during processing. A processing fluid is introduced into the process vessel for processing of the microelectronic workpieces. The rotatable fixture is raised out of the processor for loading/unloading. The processor can be used to clean, plate, etch, strip, rinse, or dry microelectronic workpieces.

Abstract: The object of this invention is to provide a semiconductor wafer cleaning apparatus designed to clean several ten wafers at the same time while rotating the wafers held in a horizontal, laid-down position. In an operation of this apparatus, a wafer feeding robot arm 20 feeds wafers 60 from a wafer cassette 10 to a wafer boat 50 and seats the wafers in the wafer boat while maintaining a horizontal, laid-down position of the wafers. The wafer boat 50, with the horizontally laid-down wafers 60, is vertically moved downward by a boat drive unit 40 to be immersed in a wafer cleaning liquid flowing in a wafer cleaning bath 30. Thereafter, the boat 50 is rotated within the wafer cleaning liquid, and so the wafers 60 are washed and cleaned by the wafer cleaning liquid while being maintained in the horizontal, laid-down position and being rotated horizontally.

Abstract: An integrated circuit assembly cleaning apparatus and method allow a cleaning solution to completely fill spaces within an integrated circuit assembly. Such spaces include, for example, the thin space between the die and substrate of a flip-chip integrated circuit. The cleaning solution fills the space while the air initially occupying the space escapes. These actions are accomplished by first tilting the integrated circuit assembly from horizontal. The integrated circuit assembly is then immersed in the bath at a controllable rate to allow the cleaning solution to completely fill the space while the air in the space escapes.

Abstract: A system for processing a workpiece includes a head attached to a head lifter. A workpiece is supported in the head between an upper rotor and a lower rotor. A base has a bowl for containing a liquid. The head is movable by the head lifter from a first position vertically above the bowl, to a second position where the workpiece is at least partially positioned in the bowl. The bowl has a contour section with a sidewall having a radius of curvature which increases adjacent to a drain outlet in the bowl, to help rapid draining of liquid from the bowl. The head has a load position, where the rotors are spaced apart by a first amount, and a process position, where the rotors are engaged and sealed against each other. For rapid evacuation of fluid, the head also has a fast drain position, where the rotors are moved apart sufficiently to create an annular drain gap.

Abstract: A system for processing a workpiece includes a base having a bowl or recess for holding a liquid. A process reactor or head holds a workpiece between an upper rotor and a lower rotor. A head lifter lowers the head holding the workpiece into contact with the liquid. Sonic energy is introduced into the liquid and acts on the workpiece to improve processing. The head spins the workpiece during or after contact with the liquid. The upper and lower rotors have side openings for loading and unloading a workpiece into the head. The rotors are axially moveable to align the side openings.

Abstract: A machine for washing and drying equipment and in particular impermeable sports equipment includes a housing with an opening through which pieces of equipment are placed radially into compartments of a partitioned carrier. The carrier is rotatably mounted in a fixed drum, which receives washing liquid and then hot air for washing and drying the pieces of equipment. Partitions in the carrier can be adjusted to form small or large compartments, which receive one or more pieces of equipment and hold the pieces separate from those in other compartments during washing and drying.

Abstract: Provided is a parts washer that includes a multi-tiered basin, a cleaning fluid and a biological component, living within the fluid, that breaks down organic waste. The multi-tiered basin includes a sink member with a false bottom, and a support grid and filter are interposed between the false bottom and a bottom panel of the sink member. The false bottom, support grid, and filter are readily removable from the sink member. The tank is partially filled with the cleaning fluid and a pump and conduit assembly direct a flow of the cleaning fluid to the basin. The cleaning fluid discharged into the basin flows through a drain hole in the false bottom, through the filter and support grid, and then through a drain hole in the bottom panel of the sink member back into the tank for reuse. The cleaning fluid includes, at least, a surfactant that functions to remove organic waste from the parts being washed.

Abstract: A device for cleaning contact lenses, which device comprises a first chamber (1) provided with draining means (3,8), a second chamber (2) adapted to be fluidly communicable with the first chamber (1), a lens holder (20) adapted to be inserted in the first chamber (1) and agitating means (22-28) adapted to agitate the lens holder, wherein the device further comprises a valve (5) adapted to control fluid flow between the first chamber (1) and the draining means (3,8) and between the first (1) and second chambers (2). The valve (5) can be automatically controlled.

Abstract: A system for high-pressure drying of semiconductor wafers includes the insertion of a wafer into an open vessel, the immersion of the wafer in a liquid, pressure-sealing of the vessel, pressurization of the vessel with an inert gas, and then the controlled draining of the liquid using a moveable drain that extracts water from a depth maintained just below the gas-liquid interface. Thereafter, the pressure may be reduced in the vessel and the dry and clean wafer may be removed. The high pressure suppresses the boiling point of liquids, thus allowing higher temperatures to be used to optimize reactivity. Megasonic waves are used with pressurized fluid to enhance cleaning performance. Supercritical substances are provided in a sealed vessel containing a wafer to promote cleaning and other treatment.

Abstract: A system for processing a workpiece includes a base having a bowl or recess for holding a liquid. A sonic energy source, such as a megasonic transducer, provides sonic energy into a liquid in the bowl. A process reactor or head holds a workpiece between an upper rotor and a lower rotor. A head lifter lowers the head holding the workpiece into the liquid. Sonic energy is provided to the workpiece through the liquid, optionally while the head spins the workpiece. The liquid may include de-ionized water and an etchant.

Abstract: Provided is a parts washer that includes a multi-tiered basin, a cleaning fluid and a biological component, living within the fluid, that breaks down organic waste. The multi-tiered basin includes a sink member with a false bottom, and a support grid and filter are interposed between the false bottom and a bottom panel of the sink member. The false bottom, support grid, and filter are readily removable from the sink member. The tank is partially filled with the cleaning fluid and a pump and conduit assembly direct a flow of the cleaning fluid to the basin. The cleaning fluid discharged into the basin flows through a drain hole in the false bottom, through the filter and support grid, and then through a drain hole in the bottom panel of the sink member back into the tank for reuse. The cleaning fluid includes, at least, a surfactant that functions to remove organic waste from the parts being washed.

Abstract: A method and apparatus for high-pressure drying of semiconductor wafers includes the insertion of a wafer into an open vessel, the immersion of the wafer in a liquid, pressure-sealing of the vessel, pressurization of the vessel with an inert gas, and then the controlled draining of the liquid using a moveable drain that extracts water from a depth maintained just below the gas-liquid interface. Thereafter, the pressure may be reduced in the vessel and the dry and clean wafer may be removed. The high pressure suppresses the boiling point of liquids, thus allowing higher temperatures to be used to optimize reactivity. Megasonic waves are used with pressurized fluid to enhance cleaning performance. Supercritical substances are provided in a sealed vessel containing a wafer to promote cleaning and other treatment.

Abstract: An apparatus including a dispense line, a solvent line, and a solvent vapor bath having a purge section is disclosed. The purge section of the apparatus has a cleaning member disposed therein containing at least one dispense hole corresponding to the dispense line. The purge section contains a plurality of ports to receive the dispense line and the solvent line. The solvent line is directed toward the cleaning member when the dispense line extends through the dispense hole. A method of cleaning a dispense line is also disclosed. In the method, a solvent vapor bath comprising a purge region having a cleaning member disposed therein and containing at least one dispense hole is provided. The purge region contains a plurality of ports to receive the dispense line and a solvent line, the solvent line being directed toward the cleaning member when the at least one dispense line extends through the at least one dispense hole.

Abstract: A dump facility for RV sewage-containing tanks allows the tanks to be emptied in a simple and hygienic manner. A container which can receive a tank includes a connector for making a liquid tight seal with an outlet from the tank when it is received by the container. A flexible conduit is connected to the connector and transports sewage from the tank to a disposal location, and a spray head may be mounted to the connector to spray cleaning liquid into the tank within the container. The container is mounted for movement about a generally horizontal axis between the first position in which a tank may be readily inserted into the container, and a second position in which sewage from the tank may flow by gravity through the connector and the flexible conduit. Rotation of the tank about the axis may be provided manually or by a reversible powered element (such as a motor with associated sprockets and chain).

Abstract: A semiconductor substrate surface analysis pre-processing apparatus has a substrate section which holds a decomposition/collecting liquid that is caused to come into contact with the entire surface of a substrate to be surface-analyzed, a substrate transport section which holds the substrate to be surface-analyzed, and which moves the substrate between a substrate carrier and the substrate processing section, a supply and ejection means for the decomposition/collecting liquid, and a processing operation means that performs either ultrasonic or heat processing with respect to the substrate processing section.

Abstract: A rinsing apparatus comprising a rinsing sink for rinsing an article brought thereinto with a rinsing liquid which is continuously supplied thereinto, and a carrier for carrying an article to be rinsed. The rinsing sink is provided with a drain hole in the bottom wall of the sink. The carrier is adapted to move between a rinsing position where the article is positioned close to an inlet of the drain hole, thereby restricting a flow path from the sink to the drain hole so that the rinsing liquid continuously supplied into the sink fills and then overflows from the sink while a flow of the rinsing liquid through the restricted flow path is maintained, and a retracted position where the article is positioned out of the sink to allow the rinsing liquid to flow through the flow path into the drain hole without the restriction by the article.

Abstract: Provided is a parts washer that includes a multi-tiered basin, a cleaning fluid and a biological component, living within the fluid, that breaks down organic waste. The multi-tiered basin includes a sink member with a false bottom, and a support grid and filter are interposed between the false bottom and a bottom panel of the sink member. The false bottom, support grid, and filter are readily removable from the sink member. The tank is partially filled with the cleaning fluid and a pump and conduit assembly direct a flow of the cleaning fluid to the basin. The cleaning fluid discharged into the basin flows through a drain hole in the false bottom, through the filter and support grid, and then through a drain hole in the bottom panel of the sink member back into the tank for reuse. The cleaning fluid includes, at least, a surfactant that functions to remove organic waste from the parts being washed.

Abstract: An cleaning mechanism especially well suited for agricultural products in which the agricultural products are moved by a flow of water through a channel in which the water is agitated by vibration of the channel. The agitation of the water, together with contact with other products, dislodges dirt, rocks, and other debris from the products. The dislodged debris settles into troughs at the bottom of the channel. The washed agricultural products fall over a baffle at the end of the channel and are ready for packaging. In one embodiment of the invention, the cleaning system is conveyed through the agricultural field to clean the product immediately after harvest so that the agriculture product leaves the field in a wrapped or packaged state.

Abstract: An industrial part washer is disclosed having a washer housing with an upper chamber, a lower chamber, and a fluid passageway connecting the chambers together. A fluid drain is connected to a lower chamber for draining fluid from it while a pump pumps a cleaning fluid into the upper chamber. A flood valve is positioned in the fluid passageway between the upper and lower chambers and this valve is movable between an open and a closed position. Parts are sequentially moved into a position adjacent the washer housing and are selectively loaded into the lower chamber, washed and, following completion of a wash cycle, subsequently unloaded from the lower chamber. A valve control closes the flood valve during the loading and unloading operations of the part into the lower chamber so that, during the loading and unloading portions of the wash cycle, the upper chamber at least partially and preferably completely fills with the cleaning fluid.

Abstract: There is disclosed a pipette-washing device for use with an automatic biochemical analyzer. The pipette-washing device includes a wash fluid-ejecting block for ejecting a wash fluid toward pipette. An upwardly spreading groove is formed in the top surface of the body of the block and extends along the trajectory of the front end of the pipette. The groove is connected at its lower end with the vertical wash fluid channel. A lateral draining channel is formed in the body of the block and connected with the lower end of the vertical wash fluid channel. When the pipette moves, the front end of the pipette moves through the groove. The block is inclined at an angle to the vertical within a plane in which the groove extends.

Abstract: A rice washing apparatus comprising a rice washing apparatus body including a rice washing vessel portion and a carryout portion formed on an upper outer periphery of the rice washing vessel portion and a lid adapted to cover an upper opening portion of the carryout portion, the rice washing vessel portion including a nozzle port formed in a central area of a bottom portion thereof, a stream guide tube vertically supported at a central area within the rice washing vessel portion immediately above the nozzle port and between the nozzle portion and the lid with a space, and a drainage hole opening at an area in the vicinity of the nozzle port, the carryout portion including an outlet port, and switch means disposed between the lid and the rice washing apparatus body and adapted to selectively switch between a rice washing position for tightly closing the rice washing vessel portion and a carrying out position where the rice washing vessel portion is in communication with the carryout portion.

Abstract: A device for treating substrates includes a fluid container in which the substrates are contained during treatment. A nozzle system is connected to the sidewalls and/or bottom of the fluid container and includes a plurality of nozzles for introducing a fluid into the fluid container.

Abstract: Apparatus and method are provided for improved washing and drying of semiconductor wafers utilizing an enhanced "Marangoni effect" flow of liquid off of the wafers for superior prevention of watermarks (water spots) on integrated circuits (ICs) on the wafers. The apparatus includes a housing 12 which may be hermetically sealed, an open-top wash tank 60 within a lower part of the housing, a moveable rack 16 for holding the wafers either in the tank for washing or in an upper part of the housing for drying, apparatus 34 for supplying chilled (near freezing) de-ionized water (DIW) to a lower part of the tank, the DIW flowing within the tank and overflowing the top thereof, a pump 20 for draining overflowing DIW from the housing, and apparatus 40 for supplying to the housing organic vapor such as isopropyl alcohol (IPA) in a dry gas such as nitrogen. During wafer drying operation of the apparatus the pressure within the housing is kept at about one Torr or less.

Abstract: A paint roller cleaner assembly includes a clear cylindrical tube having a cap on one end for receiving a fluid supply line. Located at the other end of the tube is a connection means for detachably connecting a base having a plurality of legs for maintaining the paint roller cleaning assembly in an upright position. A spacer offsets the end of the paint roller from the inlet and outlet ports to ensure proper cleaning of the roller. The legs can be moved to accommodate the user to maintain the paint roller cleaner in an upright position.

Abstract: A plate-shaped article is immersed in a cleaning liquid filling a cleaning bath having an overflowing surface through which the cleaning liquid flows out, and is rinsed out. In the cleaning bath, streams mostly being directed away from a predetermined plane approximately perpendicular to the overflowing surface are formed. The plate-shaped article is then brought into the cleaning liquid having the stream maintaining a state where the plate-shaped article intersects the predetermined plane and the surfaces of the plate-shaped article are in approximately parallel to the streams mostly being directed away from the predetermined plane on the surface of the cleaning liquid.

Abstract: An ultrasonic cleaning nozzle comprises an ultrasonic vibrator, a case body and a nozzle cap. A chemical liquid supplied from a supply port is irradiated with ultrasonic waves by the ultrasonic vibrator, and thereafter sprayed from a spray port. The ultrasonic waves linearly advance in the chemical liquid, strike an inner wall of the nozzle cap, reflect and thereafter spray from the spray port with the chemical liquid. An ultrasonic wave irradiation surface of the ultrasonic vibrator and the inner wall of the nozzle cap are coated with high-purity SiC. The parts of the nozzle which are in contact with the chemical liquid and are struck by the ultrasonic waves have resistance against the ultrasonic waves and are corrosion resistant against the chemical liquid.

Abstract: A,method and an apparatus for cleaning semiconductor devices, in which water droplets are completely eliminated after the wafer is cleaned in the course of the semiconductor manufacturing process. In the method and apparatus, after the thin film is cleaned, a cut off valve cuts off the supply of cleaning solution to a cleaning container. At the same time, a first drain valve, second drain valve, and third drain valve respectively open a first drain path, a second drain path, and third drain path in serial order, with a predetermined time interval between each stage, thereby slowly draining the cleaning solution from the container. The cleaning solution is easily and nearly completely separated from the wafer due to the surface tension of the cleaning solution, and no large drops of the cleaning solution are left on the wafer.

Abstract: A semiconductor wafer cleaning apparatus includes an internal cleaning tank having an inlet for introducing and an outlet for removing a cleaning solution, and an external cleaning tank surrounding the internal cleaning tank and having a plurality of inlets and outlets for introducing and removing the cleaning solution. First and second circulation pumps each disposed in the middle of the first and second circulation pipes for connecting the inlet and outlet of the internal cleaning tank with the plurality of inlets and outlets of the external cleaning tank are also provided. A baffle plate may also be disposed within the internal cleaning tank for fixing and separating a cassette having a plurality of wafers contained therein from the bottom of internal cleaning tank.

Abstract: A method for rinsing wafers having residual chemical liquid adhering thereto with purified water is disclosed which is characterized by the steps of preparing a rinsing tank provided in the upper part thereof with an overflow discharge part for spent rinsing liquid and a head tank disposed above the rinsing tank, storing purified water for rinse in the head tank, setting in place in the rinsing tank a basket having a plurality of wafers stowed therein parallelly as suitably spaced in such a manner that the surfaces of the wafers may lie substantially vertically, feeding the purified water from the headtank to the rinsing tank by virtue of head, causing the purified water to flow upward from below the basket, and enabling the spent rinsing liquid to be discharged through the overflow discharge part in an amount equivalent to part or the whole of the purified water fed from the head tank.

Abstract: A method and device for the wet processing of substrates in a container are provided. At least one liquid is introduced via at least one liquid inlet into the container. A liquid overflow device is adapted to float on the surface of the liquid in the container. The overflow device is provided with openings for withdrawing liquid from the container. Accompanied by release or flooding of the substrates disposed in the container, the overflow device, together with the surface of the liquid, drops to below the substrates or is raised from the substrates.

Abstract: A wafer wet processing device which comprises a processing container containing side walls; means for introducing a processing solution to the lower portion of said container; means for removing the processing solution from the upper portion of said container; and a wafer carrier containing side walls and being open at the top and bottom thereof, said wafer carrier being slidably disposed within said processing chamber, wherein at least the lower portion of the side walls of said processing container is contiguous with the lower portion of the side walls of said wafer carrier so that the entirety of the processing solution is introduced within the wafer carrier.

Abstract: Methods and apparatus are providing for cleansing contaminants from substrates, such as semiconductor wafer handling implements, and thereby reduce the incidence of contamination of semiconductor devices being assembled upon the semiconductor wafers.In one aspect of the invention, a substrate such as a semiconductor cassette or other semiconductor wafer handling implement, is inserted into a chamber that is substantially isolated from a surrounding environment. A pressurized, and optionally purified, cleansing medium is directed against at least one surface of the substrate to dislodge contaminants from the substrate surface. Dislodged contaminants are evacuated with negative pressure from the chamber. In a preferred aspect of the invention, the cleansing medium is an inert gas, such as nitrogen, and is applied to the substrate at a pressure from about 10 p.s.i. to about 100 or more p.s.i.

Abstract: A fuzzy logic based control method adjusts the pump speed of a cleaning apparatus in which tubes or other article are located in a tank of cleaning solution. The tank has a circulation system with a discharge header for directing the cleaning solution at the tubes and a suction header for pulling fluid from the tank. The circulation system has a variable speed pump for circulating the fluid. A funnel directs the flow from the tubes towards the suction header. A fuzzy logic controller is used to determine when the pump speed may be stablized at a cleaning speed creating the proper flow of a cleaning solution through the tubes. The fuzzy logic controller utilizes a novel algorithm to determine the proper pump speed which uses fuzzy input variables for the input flow, the output flow, and the amplitude of the difference.

Abstract: An improved apparatus for cleansing a semiconductor wafer which is capable of effectively removing the foreign substances from the wafer mounting grooves formed in the boats and the outer surface of the boat, for thus enhancing the reliability of the products. The apparatus includes an outer tub having a first cleansing liquid supply tube for supplying a cleansing liquid therethrough and a discharge tube for discharging the cleansing liquid therethrough, an inner tub disposed within the outer tub, a baffle plate disposed within the inner tub for distributing the cleansing liquid supplied to a wafer, a boat disposed on the baffle plate, on which boat a wafer is mounted, a foreign substance extraction tube disposed in a wafer support position of the boat for introducing the foreign substances formed in the interior of the inner tub thereinto and for discharging the same to the outside, and a second cleansing liquid supply tube for supplying the cleansing liquid to the foreign substance extraction tube.