Centrifugal Force And/or Rotated Work Body Patents (Class 134/33)
  • Patent number: 10395949
    Abstract: The substrate drying apparatus includes a rinse agent nozzle configured to eject a rinse agent to the substrate while moving away from a center of the substrate relative to the substrate, a drying gas nozzle configured to spout a drying gas to the substrate while moving away from the center of substrate relative to the substrate with movement of the rinse agent nozzle, a liquid area sensor and a dried area sensor configured to sense a surface of the substrate around an interface of the rinse agent by moving away from the center of the substrate with movement of the rinse agent nozzle and the drying gas nozzle, and a control unit configured to control a drying condition based on the sensing results of the liquid area sensor and the dried area sensor.
    Type: Grant
    Filed: April 15, 2015
    Date of Patent: August 27, 2019
    Assignee: Ebara Corporation
    Inventor: Tomoatsu Ishibashi
  • Patent number: 10395951
    Abstract: In a method of cleaning a substrate, a protecting liquid may be sprayed to a surface of the substrate from a first position in a first spray direction. Cleaning droplets may be injected on to the surface of the substrate. The protecting liquid may be sprayed to the surface of the substrate from a second position different from the first position in a second spray direction. For example, the protecting liquid may be always sprayed from the central portion toward the edge portions in the substrate so that the protecting liquid on the substrate may have a uniform thickness.
    Type: Grant
    Filed: February 24, 2017
    Date of Patent: August 27, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seok-Hoon Kim, Kyoung-Seob Kim, Dong-Chul Kim, Hyo-San Lee
  • Patent number: 10357806
    Abstract: The inventive concepts provide an apparatus for treating a substrate. The apparatus includes a housing proving an inner space in which a substrate is treated, a spin head supporting and rotating the substrate in the housing, an injection unit comprising a first nozzle member spraying a first treatment solution to the substrate put on the spin head, and a controller controlling the first nozzle member. The first nozzle member includes a body, a vibrator, a pump, and a power source.
    Type: Grant
    Filed: June 23, 2015
    Date of Patent: July 23, 2019
    Assignee: SEMES CO., LTD.
    Inventors: Jong Han Kim, Yoon-Jong Ju, Yu Hwan Kim, Edwin Lee, Seong Soo Lee
  • Patent number: 10273622
    Abstract: A laundry washing machine and method automate the selection of a load type for a laundry washing machine during an initial fill phase of a wash cycle and based in part on weight and fluid level sensed by weight and fluid level sensors operatively coupled to a wash tub and after a selected amount of water has been dispensed into the wash tub.
    Type: Grant
    Filed: June 30, 2016
    Date of Patent: April 30, 2019
    Assignee: Midea Group Co., Ltd.
    Inventors: Phillip C. Hombroek, Christopher G. Hoppe
  • Patent number: 10247473
    Abstract: Embodiments of methods and apparatus for processing a substrate are provided herein. In some embodiments, an apparatus for processing a substrate includes a non-vacuum enclosure; at least one opening in the non-vacuum enclosure to insert a substrate into or remove a substrate from the non-vacuum enclosure; a movable substrate carrier, including a plurality of substrate holders, disposed within the non-vacuum enclosure to linearly move substrates disposed on the plurality of substrate holders; a heater to heat an interior of the non-vacuum enclosure; a gas supply to supply a gas to the interior of the non-vacuum enclosure; and a vent to exhaust the gas from the interior of the non-vacuum enclosure.
    Type: Grant
    Filed: January 21, 2015
    Date of Patent: April 2, 2019
    Assignee: APPLIED MATERIALS, INC.
    Inventor: Michael C. Kutney
  • Patent number: 10242863
    Abstract: A substrate processing apparatus for processing a wafer including a temporary substrate and a semiconductor device. The substrate processing apparatus includes a first half portion, a second half portion and a liquid supply unit. The first half portion includes a working platform. The second half portion includes an upper cover having a first surface and a plurality of second holes. The liquid supply unit provides a liquid. The wafer is placed on the working platform, and a second surface of the semiconductor device and the first surface are spaced by a distance sufficient for allowing the liquid to come into contact with the first surface when the liquid flows at the second surface to generate a suction force on the second surface. As such, a peel force is formed between the temporary substrate and the semiconductor device to cause the two to separate from each other.
    Type: Grant
    Filed: October 3, 2016
    Date of Patent: March 26, 2019
    Assignees: WET TECHNOLOGY CO., LTD.
    Inventor: Yi-Cheng Wang
  • Patent number: 10167589
    Abstract: A method for controlling a rinsing cycle of a washing machine is provided. The method may include a primary rinsing by supplying water into the inner tub until a water level in the outer tub becomes a preset circulating water level, wherein some of the water is supplied through a drawer in the washing machine that holds fabric softener, and a remaining amount of water is supplied by spraying the water supplied from the external water source through the direct water nozzle via a direct water supply hose, a secondary rinsing by spraying water into the inner tub through the circulating nozzle, and a third rinsing by spraying the water into the inner tub through the direct water nozzle while draining the outer tub.
    Type: Grant
    Filed: October 3, 2016
    Date of Patent: January 1, 2019
    Assignee: LG ELECTRONICS INC.
    Inventors: Naeun Kim, Hwanjin Jung, Sanghyun Lee, Bonkwon Koo, Sunho Lee, Dongwon Kim
  • Patent number: 10161074
    Abstract: A laundry washing machine and method utilize weight, fluid level and fluid property sensors to dynamically select a load type, control a wash cycle and control an amount of detergent dispensed during a wash cycle.
    Type: Grant
    Filed: June 30, 2016
    Date of Patent: December 25, 2018
    Assignee: Midea Group Co., Ltd.
    Inventors: Phillip C. Hombroek, Christopher G. Hoppe
  • Patent number: 10103020
    Abstract: A substrate processing apparatus includes a substrate holding part, a substrate rotating mechanism, a processing liquid supply part for supplying a processing liquid onto the substrate, a cup part for receiving the processing liquid spattering from the substrate being rotated, by its inner peripheral surface, a top plate disposed above the substrate, and a liquid film forming part for forming a rotating liquid film which rotates in the same direction as the substrate does, on the inner peripheral surface of the cup part, by supplying a liquid onto an upper surface of the top plate rotating in the same direction as the substrate rotates, in parallel with a processing of the substrate with the processing liquid. It is possible to prevent droplets caused by collision of the processing liquid spattering from the substrate against the cup part from being deposited on the substrate.
    Type: Grant
    Filed: March 3, 2015
    Date of Patent: October 16, 2018
    Assignee: SCREEN Holdings Co., Ltd.
    Inventor: Hitoshi Nakai
  • Patent number: 10077522
    Abstract: The present invention relates to a method for controlling a washing apparatus, and more particularly, to method for controlling a washing apparatus provided with an independently rotatable drum and a pulsator, comprising a step of draining further comprising a plurality of steps of draining a predetermined amount of rinsing water at a time; a middle step of dehydrating; and a step of supplying water, further comprising a plurality of steps of providing a predetermined amount of rinsing water at a time.
    Type: Grant
    Filed: April 26, 2011
    Date of Patent: September 18, 2018
    Assignee: LG ELECTRONICS INC.
    Inventors: Youngkee Oh, Deughee Lee, Changsik Kim, Taehyok Kwon
  • Patent number: 10043653
    Abstract: A method of cleaning and drying a semiconductor wafer including inserting a semiconductor wafer into a chamber of a cleaning tool, spinning the semiconductor wafer in a range of about 300 revolutions per minute to about 1600 revolutions per minute, and simultaneously spraying the semiconductor wafer with de-ionized water and a mixture of isopropyl alcohol and nitrogen.
    Type: Grant
    Filed: August 27, 2012
    Date of Patent: August 7, 2018
    Assignee: Taiwan Semiconductor Manufacturing Company
    Inventors: Wei-Cheng Chen, Ling-Sung Wang, Chih-Hsun Lin, Tzu kai Lin
  • Patent number: 9937533
    Abstract: Disclosed is a panel polishing device, comprising a polishing belt movable along a predefined direction and a spray head arranged above the belt. The spray head has a main body and a plurality of through-holes penetrating the main body in its thickness direction. Through-holes have outlets facing the belt and are arranged along a length direction of the spray head. The length direction of the spray head conforms to a movement direction of the belt. At least the through-holes on both sides of the main body are oblique outwardly with respect to the remaining through-holes. Also, the disclosure provides a panel cleaning equipment including the panel polishing device. In the device according to the disclosure, pressure of bi-component fluid is more widely applied onto belt and a larger belt is contacted with the panel, such that the panel is thoroughly cleaned without polishing blind regions on both sides thereof.
    Type: Grant
    Filed: May 31, 2016
    Date of Patent: April 10, 2018
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., HEFEI BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Laichao Ji, Jinjun Wang, Zhendong Wang, Rui Hu, Jingxin Mao, Tongtong Huang
  • Patent number: 9895711
    Abstract: A substrate liquid processing apparatus including: a substrate rotary-holding unit configured to rotate a substrate while holding the substrate; and a processing liquid supply unit configured to supply a processing liquid to a bottom surface of the substrate held by the substrate rotary-holding unit. The substrate rotary-holding unit includes: a base plate disposed spaced apart from the substrate below the substrate; a cover member supported by the base plate and disposed outside an outer periphery of the substrate; and a discharge port formed between the base plate and the cover member and configured to discharge an air stream occurring below the substrate. The support portion of the base plate and the cover member protrudes outwards from a top surface of the base plate to be connected to the cover member.
    Type: Grant
    Filed: January 25, 2016
    Date of Patent: February 20, 2018
    Assignee: Tokyo Electron Limited
    Inventors: Jian Zhang, Yoshifumi Amano, Eiichiro Okamoto, Yuki Ito
  • Patent number: 9887122
    Abstract: In an apparatus for treating a wafer-shaped article, a spin chuck is configured to hold a wafer-shaped article of a predetermined diameter. A non-rotating plate is positioned relative to the spin chuck such that the non-rotating plate is beneath and parallel to a wafer-shaped article when positioned on the spin chuck. A fluid dispensing nozzle passes through the non-rotating plate and terminates in a discharge end positioned above and adjacent to the non-rotating plate. The discharge end comprises a horizontal gas discharge nozzle configured to distribute gas radially outwardly across an upper surface of the non-rotating plate.
    Type: Grant
    Filed: May 6, 2016
    Date of Patent: February 6, 2018
    Assignee: LAM RESEARCH AG
    Inventors: Hongbo Si, Bhaskar Bandarapu, Andreas Gleissner, Bernhard Loidl
  • Patent number: 9765289
    Abstract: Methods and chemical solvents used for cleaning residues on metal contacts during a semiconductor device packaging process are disclosed. A chemical solvent for cleaning a residue formed on a metal contact may comprise a reactive inorganic component and a reactive organic component. The method may comprise spraying a semiconductor device with a chemical solvent at a first pressure, and spraying the semiconductor device with the chemical solvent at a second pressure less than the first pressure.
    Type: Grant
    Filed: August 29, 2012
    Date of Patent: September 19, 2017
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hui-Jung Tsai, Hung-Jui Kuo, Chung-Shi Liu
  • Patent number: 9764446
    Abstract: The invention suppresses generation of noises attributable to rotation of a rotary joint. A rotary joint includes a rotating body that rotates on a rotating axis A, a housing disposed so as to surround the rotating body, and at least one bearing disposed between the rotating body and the housing and adapted to support rotation of the rotating body. The rotary joint supplies fluids through fluid connection ports formed in the housing and fluid passages formed inside the rotating body to a polishing table having attached thereto a polishing pad for polishing a substrate or a holding portion that is adapted to hold the substrate while pressing the substrate against the polishing pad. At least one elastic member is interposed at least either between the rotating body and the at least one bearing or between the housing and the at least one bearing.
    Type: Grant
    Filed: April 9, 2015
    Date of Patent: September 19, 2017
    Assignee: EBARA CORPORATION
    Inventors: Hideo Aizawa, Tadakazu Sone, Masao Umemoto, Ryuichi Kosuge
  • Patent number: 9721817
    Abstract: Provided are an apparatus for measuring impurities on a wafer and a method of measuring impurities on a wafer. The apparatus includes: a wafer aligning device for aligning a wafer; a loading robot for moving and loading the aligned wafer; a rotation stage for rotating the loaded wafer; a scan robot for holding a natural oxide layer etching solution for the wafer and a metallic impurity recovery solution; and a container for receiving a predetermined etching solution and a recovery solution, wherein the scan robot removes an oxide layer on an edge region of the wafer.
    Type: Grant
    Filed: September 7, 2016
    Date of Patent: August 1, 2017
    Assignee: LG Siltron Inc.
    Inventor: Seung Wook Lee
  • Patent number: 9648999
    Abstract: A robot vacuum cleaner includes a housing and a brush roller disposed at a bottom of the housing. The brush roller is configured to be rotatable about a horizontal axle. A blade is disposed above the brush roller in stationary relation with respect to the housing. The horizontal axle is adjustable in height relative to the housing. The brush roller is spaced away from the blade in a lower position and is in engagement with the blade in an upper position.
    Type: Grant
    Filed: July 6, 2015
    Date of Patent: May 16, 2017
    Assignee: MIELE & CIE. KG
    Inventors: Carina Uphoff, Markus Thamm
  • Patent number: 9576787
    Abstract: A substrate treatment method includes a substrate holding unit which horizontally holds a substrate; a rotating unit which rotates the substrate held by the substrate holding unit about a vertical axis; and a first nozzle having an opposing face to be opposed to a lower surface of the substrate inward of a peripheral portion of the substrate in spaced relation to the lower surface of the substrate during rotation of the substrate by the rotating unit and a treatment liquid spout provided in the opposing face for filling a space defined between the lower surface of the substrate and the opposing face with a treatment liquid spouted from the treatment liquid spout to keep the space in a liquid filled state; wherein the treatment liquid spreads outwardly over the lower surface of the substrate and further, flows around to a peripheral portion of an upper surface of the substrate.
    Type: Grant
    Filed: April 9, 2014
    Date of Patent: February 21, 2017
    Assignee: SCREEN Holdings Co., Ltd.
    Inventors: Takuya Kishimoto, Koji Ando
  • Patent number: 9566618
    Abstract: A sputter target assembly comprising a Si target and a backing plate is provided wherein the backing plate is bonded to the target. The Si target comprises a smooth, mirror-like surface and has a surface roughness of less than about 15.0 Angstroms. Methods are provided for producing silicon target/backing plate assemblies wherein a silicon blank is processed to remove scratches from the blank surface resulting in a mirror like surface on the target, and a surface roughness of 15.0 Angstroms or less. The method comprises a first and second cleaning step with the first step being performed before the scratch removal step, and the second step being performed after the scratch removal.
    Type: Grant
    Filed: November 7, 2012
    Date of Patent: February 14, 2017
    Assignee: Tosoh SMD, Inc.
    Inventors: Yongwen Yuan, Eugene Y. Ivanov, Yang Liu, Phil Frausto, Weifang Miao
  • Patent number: 9570327
    Abstract: A substrate liquid treatment apparatus comprises a chuck (13) that holds and rotates a wafer, a back surface purging nozzle (15) that discharges a purge gas toward the back surface of the wafer, and a periphery purging nozzle 16 that discharges the purge gas onto the back surface of the wafer. The back surface purging nozzle has a slit-like opening part extending from a central side to a peripheral side of the substrate in a plan view. Vertical distance between the slit-like opening part and the substrate held by the substrate holding unit increases as approaching an end of the opening part on the central side of the substrate. The periphery purging nozzle discharges the purge gas, toward a central part of the substrate, toward a region on the back surface of the substrate, which region is located radially outside an end of the slit-like opening part of the back surface purging nozzle and radially inside an peripheral edge of the substrate.
    Type: Grant
    Filed: December 12, 2013
    Date of Patent: February 14, 2017
    Assignee: Tokyo Electron Limited
    Inventors: Masahiro Fukuda, Akihiro Kubo, Taro Yamamoto, Kenzi Yada, Atsushi Ookouchi
  • Patent number: 9566616
    Abstract: There is disclosed a substrate processing apparatus which is capable of detecting whether a substrate, such as a wafer, supported by a fluid is properly present in a predetermined processing position or not. The substrate processing apparatus includes at least one distance sensor configured to measure a distance between a scrubber and a hydrostatic support structure; and a processing controller configured to calculate a gap between the hydrostatic support structure and the surface of the substrate from a measured value of the distance and determine whether the gap falls within a predetermined range or not.
    Type: Grant
    Filed: June 25, 2014
    Date of Patent: February 14, 2017
    Assignee: Ebara Corporation
    Inventors: Tetsuji Togawa, Kenya Ito, Yu Ishii, Keisuke Uchiyama
  • Patent number: 9517494
    Abstract: A method for cleaning photomasks includes the following steps: provided a cleansing device having a scrubbing unit. The scrubbing unit having a saturated scrubbing surface is use to clean photomasks with the obliquely dispensed fluids. In such a fashion, loosened contaminants are removed. As least one oblique surface is formed on the peripheries of the scrubbing surface to form a channeling region such that fluids can instantly flow away from photomasks after cleaning to prevent re-contamination. The instant disclosure also provides a system for cleaning photomasks.
    Type: Grant
    Filed: February 8, 2013
    Date of Patent: December 13, 2016
    Assignee: GUDENG PRECISION INDUSTRIAL CO, LTD.
    Inventor: Yung-Chin Pan
  • Patent number: 9501697
    Abstract: A method for authenticating and/or identifying a security article that includes a transparent or translucent substrate and, on a side of a first face of the substrate, a first image. The method includes superimposing at least partially the first image of the article with a second image. The second image may be produced by an electronic imager. The second image may be situated on the side of a second face of the substrate that is opposite to the first face. The method permits observation of an authentication and/or identification information item of the security article during a change of the angle of observation of the first and second superimposed images.
    Type: Grant
    Filed: June 22, 2011
    Date of Patent: November 22, 2016
    Assignee: ARJOWIGGINS SECURITY
    Inventors: Henri Rosset, Philippe Dietemann
  • Patent number: 9299593
    Abstract: A method includes providing a wafer and providing a first spray bar spaced a distance from the wafer. A first spray is dispensed from the first spray bar onto a first portion (e.g., half) of the wafer. Thereafter, the wafer is rotated. A second spray is dispensed from the first spray bar onto a second portion (e.g., half) of the rotated wafer. In embodiments, a plurality of spray bars are positioned above the wafer. One or more of the spray bars may be tunable in separation distance and/or angle of dispensing.
    Type: Grant
    Filed: August 16, 2011
    Date of Patent: March 29, 2016
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ming-Hsi Yeh, Kuo-Sheng Chuang, Ying-Hsueh Chang Chien, Chi-Ming Yang, Chin-Hsiang Lin
  • Patent number: 9266153
    Abstract: A substrate processing apparatus includes: a storage tank configured to store a liquid; a substrate support unit configured to rotatably, horizontally support a substrate; and a plate driving unit configured to move the substrate support unit between an immersion position at which the substrate is immersed into the liquid stored in the storage tank, and a separation position located above the immersion position, at which the substrate is separated from the liquid stored in the storage tank. The substrate processing apparatus also includes a rotary drive unit configured to rotate the substrate supported by the substrate support unit, and liquid supply units configured to supply a liquid to the substrate that is being rotated by the rotary drive unit in the separation position.
    Type: Grant
    Filed: October 16, 2012
    Date of Patent: February 23, 2016
    Assignee: Tokyo Electron Limited
    Inventors: Shuichi Nagamine, Yusuke Hashimoto
  • Patent number: 9263304
    Abstract: Suppressed is damage of a semiconductor wafer due to charging of a cleaning liquid used in a single wafer type wafer cleaning step. A chemical solution discharged from a tip of a cleaning nozzle is brought into contact with protrusions of wafer chucks to thereby let static electricity of the chemical solution go to the wafer chucks, and subsequently, the cleaning nozzle is moved above the wafer to supply the chemical solution onto a top surface of the wafer, thereby suppressing abnormal discharge (damage) of the wafer due to charging of the chemical solution.
    Type: Grant
    Filed: July 19, 2011
    Date of Patent: February 16, 2016
    Assignee: Renesas Electronics Corporation
    Inventors: Kenji Kanamitsu, Takuya Koga, Kazutoshi Anabuki
  • Patent number: 9194074
    Abstract: Disclosed herein are a washing machine and a control method thereof. The control method effectively transmits high-concentration wash liquid to laundry, while minimizing the amount of water used, through washing using bubbles, and maximizes the increase in volume of the wash liquid rubbed on the inner circumferential surface of the drum using the generation of bubbles and the rotation of the drum to raise the water level of the wash liquid without additional water.
    Type: Grant
    Filed: April 13, 2009
    Date of Patent: November 24, 2015
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyun Sook Kim, Eun Suk Bang, Bo Ram Lee
  • Patent number: 9176387
    Abstract: The present disclosure provides a method of fabricating a semiconductor device. The method includes dispensing a liquid on a wafer. The method includes raising the wafer. The method includes lowering the wafer after the raising. The wafer is spun as it is lowered, thereby removing at least a portion of the liquid from the wafer. The present disclosure also provides an apparatus for fabricating a semiconductor device. The apparatus includes a wafer chuck that is operable to hold a semiconductor wafer and secure the wafer thereto. The wafer has a front surface and a back surface. The apparatus includes a dispenser that is operable to dispense a liquid to the front surface of the wafer. The apparatus includes a mechanical structure that is operable to: spin the wafer chuck in a horizontal direction; and move the wafer chuck downwards in a vertical direction while the wafer chuck is being rotated.
    Type: Grant
    Filed: January 21, 2014
    Date of Patent: November 3, 2015
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wei-Chieh Huang, Hung Chang Hsieh
  • Patent number: 9023155
    Abstract: An engine wash system for delivering wash liquid to an engine with a lift fan and a main engine, the lift fan including a plurality of inlet guide vanes and a nose cone, and the main engine connected to the lift fan by a shaft, the engine wash system includes a lift fan manifold to deliver wash liquid to the lift fan; and a main engine manifold to deliver wash liquid to the main engine, wherein the lift fan manifold and the main engine manifold can deliver the wash liquid simultaneously.
    Type: Grant
    Filed: July 31, 2012
    Date of Patent: May 5, 2015
    Assignee: EcoServices, LLC
    Inventors: Kurt Dorshimer, Robert M. Rice, Sebastian Nordlund, Wayne Zadrick
  • Publication number: 20150090302
    Abstract: A substrate processing apparatus includes a substrate holder, and a discharge head for peripheral area from which a fluid is discharge toward a surface peripheral area of the substrate held on the substrate holder. The discharge head for peripheral area includes multiple nozzles, and a support part that supports the nozzles integrally. The nozzles include a processing liquid nozzle from which a processing liquid is discharged toward the surface peripheral area, and a gas nozzle from which gas is discharged toward the surface peripheral area. The gas nozzle is placed upstream of a rotative direction of the substrate relative to the processing liquid nozzle.
    Type: Application
    Filed: September 16, 2014
    Publication date: April 2, 2015
    Inventors: Tomonori FUJIWARA, Nobuyuki SHIBAYAMA, Yukifumi YOSHIDA
  • Publication number: 20150090303
    Abstract: A system includes a plurality of nozzles, a pump configured to pump a fluid through the nozzles, and a manifold configured to arrange the plurality of nozzles to substantially match a shape of a workpiece. Each nozzle of the plurality of nozzles is configured to impinge upon a section of the workpiece with the fluid.
    Type: Application
    Filed: September 28, 2013
    Publication date: April 2, 2015
    Applicant: GENERAL ELECTRIC COMPANY
    Inventors: Jonathan Matthew Lomas, Michelle Fullerton Simpson
  • Publication number: 20150090694
    Abstract: A substrate processing apparatus and method includes, a plate that has a size equal to or larger than a principal face of the substrate, and has a horizontal and flat liquid holding face opposing the principal face of the substrate from below. A processing liquid supply unit supplies a processing liquid to the liquid holding face. A control unit controls the processing liquid supply unit and a movement unit to supply the processing liquid to the liquid holding face to form a processing liquid film, a contact step of bringing the principal face of the substrate and the liquid holding face close to each other to bring the principal face of the substrate into contact with the processing liquid film, and a liquid contact maintenance step of maintaining the processing liquid in contact with the principal face of the substrate.
    Type: Application
    Filed: September 7, 2012
    Publication date: April 2, 2015
    Inventors: Koji Hashimoto, Masahiro Miyagi, Mitsukazu Takahashi
  • Publication number: 20150090293
    Abstract: A method of washing a bulk container is provided. The method includes receiving the bulk container on a support surface and rotating the support surface and at least one washer arm relative to one another. The method further includes spraying a fluid from at least one nozzle disposed on the at least one washer arm. Rotating the support surface and the at least one washer arm relative to one another exposes a plurality of portions of an outer surface of the bulk container to the spray.
    Type: Application
    Filed: September 30, 2013
    Publication date: April 2, 2015
    Inventor: Lonny Shawn Lewis
  • Publication number: 20150079701
    Abstract: A manufacturing apparatus includes a chuck for contacting a peripheral portion of a workpiece. The apparatus includes a nozzle to eject a process fluid (liquid or gas) toward a first surface while the workpiece is in contact with the chuck. The apparatus also includes a plate having an opening configured such that a support fluid (liquid or gas) can be ejected toward a second surface of the workpiece while the workpiece is in contact with the chuck. In an example, the support fluid can be used to counteract a displacement of the interior portion in the direction perpendicular to the plane of the workpiece due to, for example, gravity and/or hydrostatic pressure of the process fluid.
    Type: Application
    Filed: February 28, 2014
    Publication date: March 19, 2015
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventor: Daisuke YAMASHITA
  • Patent number: 8980013
    Abstract: A substrate cleaning method that includes: a step in which, while a substrate holder is being continuously rotated, a to-be-discharged position of the cleaning liquid on the substrate is changed to an eccentric position deviated from the central part of the substrate, and a gas is discharged from a gas nozzle to the central part of the substrate so as to form a dried area of the cleaning liquid under a condition in which a shortest distance between an edge of a cleaning liquid flow output from the cleaning-liquid nozzle and an edge of a gas flow output from the gas nozzle is set between 9 mm and 15 mm.
    Type: Grant
    Filed: June 1, 2012
    Date of Patent: March 17, 2015
    Assignee: Tokyo Electron Limited
    Inventors: Kousuke Yoshihara, Yuichi Yoshida, Taro Yamamoto
  • Publication number: 20150068560
    Abstract: An apparatus for treating the surface of a microelectronic workpiece via impingement of the surface with at least one fluid and a method for operating the apparatus are described. In particular, the apparatus includes a treatment chamber defining an interior space to treat the microelectronic workpiece with at least one fluid within the treatment chamber, and a movable chuck that supports the workpiece within the treatment chamber. The apparatus further includes a workpiece translational drive system configured to translate the movable chuck between a workpiece load position and at least one processing position at which the workpiece is treated with the at least one fluid using at least one nozzle connected to at least one fluid supply, and a workpiece rotational drive system configured to rotate the microelectronic workpiece.
    Type: Application
    Filed: September 10, 2013
    Publication date: March 12, 2015
    Applicant: TEL FSI, Inc.
    Inventors: Mark GOLUCH, David C. ZIMMERMAN, Robert E. LARSON, Edward Deneen HANZLIK, Gregory Paul THOMES, Christina Ann RATHMAN
  • Patent number: 8974632
    Abstract: A method and device for processing wafer-shaped articles comprises a closed process chamber. A rotary chuck is located within the process chamber, and is adapted to hold a wafer shaped article thereon. An interior fluid distribution ring is positioned above the rotary chuck, and comprises an annular surface inclined downwardly from a radially inner edge to a radially outer edge thereof. At least one fluid distribution nozzle extends into the closed process chamber and is positioned so as to discharge fluid onto the annular surface of the fluid distribution ring.
    Type: Grant
    Filed: November 30, 2011
    Date of Patent: March 10, 2015
    Assignee: Lam Research AG
    Inventors: Ulrich Tschinderle, Andreas Gleissner, Michael Brugger
  • Publication number: 20150059808
    Abstract: Provided is an apparatus for processing a substrate including a spin head on which a substrate is placed, a container provided to surround the spin head, an upper nozzle member supplying a processing solution downwards, a bottom cleaning member located to be a certain distance from the bottom of the spin head, wherein the bottom cleaning member sprays a cleaning solution to the bottom of the spin head.
    Type: Application
    Filed: August 29, 2014
    Publication date: March 5, 2015
    Inventors: Jintack YU, Jae-Myoung LEE
  • Patent number: 8955530
    Abstract: A wafer chuck is cleaned using a cleaning cap to remove processing residue and particulate matter. The cleaning cap is configured to overlie and align with the wafer chuck and includes a base and a first roller connected to the base and having wound therearound a cleaning cloth. The cleaning cap further includes a second roller connected to the base and having attached thereto a free end of the cleaning cloth. During use, the cleaning cloth winds upon the second roller from the first roller when the second roller rotates about its axis. The cleaning cap can be positioned relative the wafer chuck by way of a manipulator to ensure the cleaning cloth contacts the wafer chuck with sufficient force. The cleaning cloth rubs the wafer chuck with both translational motion and rotational motion.
    Type: Grant
    Filed: January 18, 2011
    Date of Patent: February 17, 2015
    Assignee: Taiwan Semiconductor Manufaturing Company, Ltd.
    Inventors: Jui-Chun Peng, Heng-Jen Lee
  • Publication number: 20150040946
    Abstract: A device for removing impurities from shredded plastic has a first and second cleaning disk with first and second cleaning surfaces, the cleaning surfaces are opposite each other and delimit a cleaning gap. A drive device rotates the cleaning disks, and shredded plastic is fed between the cleaning disks. The cleaning surfaces have a plurality of cleaning ribs extending between an inner and outer edge of the cleaning surfaces, wherein at least one flank of the cleaning ribs is angled or curved relative to the axial direction of the respective cleaning disk, and a plurality of cleaning bars running transversally to the direction of extension of the cleaning ribs are arranged between at least some cleaning ribs neighboring each other.
    Type: Application
    Filed: July 13, 2012
    Publication date: February 12, 2015
    Inventors: Michael Hofmann, Alexander Gercke, Carsten Wermter
  • Patent number: 8944081
    Abstract: Disclosed are a liquid processing apparatus and a liquid processing method that can prevent a substrate in a processing chamber from being contaminated due to contamination attached to a cup. The liquid processing apparatus includes: a processing chamber in which a substrate holding unit holding a substrate and a cup placed around the substrate holding unit are installed; a nozzle for supplying a processing liquid to the substrate held by the substrate holding unit; and a cup cleaning unit cleaning the cup by supplying a cleaning liquid to the upper part of the cup. A concave portion is formed in the upper part of the cup and the cup cleaning units supply the cleaning liquid to the concave portion in the upper part of the cup.
    Type: Grant
    Filed: January 23, 2012
    Date of Patent: February 3, 2015
    Assignee: Tokyo Electron Limited
    Inventor: Jiro Higashijima
  • Patent number: 8940102
    Abstract: Some embodiments include methods of removing particles from over surfaces of semiconductor substrates. Liquid may be flowed across the surfaces and the particles. While the liquid is flowing, electrophoresis and/or electroosmosis may be utilized to enhance transport of the particles from the surfaces and into the liquid. In some embodiments, temperature, pH and/or ionic strength within the liquid may be altered to assist in the removal of the particles from over the surfaces of the substrates.
    Type: Grant
    Filed: June 27, 2012
    Date of Patent: January 27, 2015
    Assignee: Micron Technology, Inc.
    Inventors: Neil Joseph Greeley, Dan Millward, Wayne Huang
  • Patent number: 8932408
    Abstract: A method for cleaning a surface of a plate-like article includes the steps of: treating the surface with free flow cleaning, wherein liquid is dispensed through a dispense nozzle onto the surface in a continuous liquid flow, and treating the surface with spray cleaning, wherein liquid is directed through a spray nozzle towards the surface in form of droplets. The surface is treated with a spray cleaning step before the free flow cleaning step and a spray cleaning step after the free flow cleaning step.
    Type: Grant
    Filed: January 9, 2008
    Date of Patent: January 13, 2015
    Assignee: Lam Research AG
    Inventor: Reinhard Sellmer
  • Patent number: 8932407
    Abstract: A substrate cleaning method is used for performing scrub cleaning of a surface of a substrate. The substrate cleaning method includes rotating a roll cleaning member and a substrate respectively in one direction while keeping the roll cleaning member in contact with the substrate in a cleaning area, and supplying a cleaning liquid to a surface of the substrate to scrub-clean the surface of the substrate in the presence of the cleaning liquid in the cleaning area. The cleaning liquid is supplied initially to an inverse-direction cleaning area of the cleaning area where the relative rotational velocity between the roll cleaning member and the substrate is relatively high, and thereafter to a forward-direction cleaning area of the cleaning area where the relative rotational velocity between the roll cleaning member and the substrate is relatively low while the substrate makes one revolution on a central axis thereof.
    Type: Grant
    Filed: May 14, 2013
    Date of Patent: January 13, 2015
    Assignee: Ebara Corporation
    Inventor: Tomoatsu Ishibashi
  • Patent number: 8932672
    Abstract: A substrate processing apparatus comprises an indexer block, an anti-reflection film processing block, a resist film processing block, a development processing block, a resist cover film processing block, a resist cover film removal block, a cleaning/drying processing block, and an interface block. An exposure device is arranged adjacent to the interface block in the substrate processing apparatus. The exposure device subjects a substrate to exposure processing by means of an immersion method. In the edge cleaning unit in the cleaning/drying processing block, a brush abuts against an end of the rotating substrate, so that the edge of the substrate before the exposure processing is cleaned. At this time, the position where the substrate is cleaned is corrected.
    Type: Grant
    Filed: November 30, 2009
    Date of Patent: January 13, 2015
    Assignee: SCREEN Semiconductor Solutions Co., Ltd.
    Inventors: Koji Kaneyama, Masashi Kanaoka, Tadashi Miyagi, Kazuhito Shigemori, Shuichi Yasuda, Tetsuya Hamada
  • Patent number: 8920571
    Abstract: The present invention includes methods and materials for cleaning materials, particles, or chemicals from a substrate with a brush or pad. The method comprising: engaging a surface of a rotating wafer with an outer circumferential surface of a rotating cylindrical foam roller, the cylindrical foam roller having a plurality of circumferentially and outwardly extending spaced apart nodules extending from the outer surface, each nodule defining a height extending from the outer surface of the cylindrical foam roller to a substrate engagement surface of the nodule, the substrate engagement surface of one or more of the nodules having a rounded configuration; and positioning the cylindrical foam roller on the substrate such that the one or more nodules are positioned to have only the rounded substrate engagement surface contact the substrate such that no linear surface of the one or more nodules contacts the substrate.
    Type: Grant
    Filed: September 17, 2013
    Date of Patent: December 30, 2014
    Assignee: Entegris, Inc.
    Inventor: Briant Enoch Benson
  • Patent number: 8920577
    Abstract: A method of treating a substrate comprises, in one aspect, placing a substrate having material on a surface thereof in a treatment chamber; directing a stream of a liquid treatment composition to impinge the substrate surface; and directing a stream of water vapor to impinge the substrate surface and/or to impinge the liquid treatment composition. A preferred aspect of this invention is the removal of materials, and preferably photoresist, from a substrate, wherein the treatment composition is a liquid sulfuric acid composition comprising sulfuric acid and/or its desiccating species and precursors.
    Type: Grant
    Filed: September 1, 2010
    Date of Patent: December 30, 2014
    Assignee: Tel FSI, Inc.
    Inventors: David DeKraker, Jeffery W. Butterbaugh, Richard E. Williamson
  • Patent number: 8920572
    Abstract: A device for cleaning a fixed abrasive polishing pad includes a main body having a surface facing the polishing pad, an inlet coupled to an end of the main body and configured to supply a cleaning liquid, an inject orifice coupled to the inlet for injecting the cleaning liquid and being provided on the surface of the main body, an outlet coupled to the end of the main body, and a recycle orifice coupled to the outlet, and being provided on the surface of the main body.
    Type: Grant
    Filed: August 17, 2011
    Date of Patent: December 30, 2014
    Assignee: Semiconductor Manufacturing International (Shanghai) Corporation
    Inventor: Feng Chen
  • Patent number: 8916003
    Abstract: A wafer scrubber is disclosed, including a chamber, and a holder connecting to a spindle disposed in the chamber, wherein the holder supports a wafer, and the wafer spins to remove water on the wafer, and a meshed inner cup comprising a plurality of through holes disposed between the holder and a wall of the chamber, wherein the meshed inner cup receives water from a surface of the wafer and rotates around the spindle to release the water through the through holes.
    Type: Grant
    Filed: September 23, 2011
    Date of Patent: December 23, 2014
    Assignee: Nanya Technology Corporation
    Inventors: Jeng-Hsing Jang, Yi-Nan Chen, Hsien-Wen Liu