Abstract: A method and apparatus for providing multiple spray zones to different subportions of a silverware basket within the wash chamber of a dishwasher.

Abstract: A method of processing a substrate. In one embodiment, the invention can be a method of processing a substrate comprising: supporting the substrate in a horizontal orientation; rotating the substrate; providing a fluid dispensing apparatus adjacent a surface of the substrate, the fluid dispensing apparatus comprising a body having an outer surface and a first conduit terminating as a first hole in the outer surface of the body and a second conduit terminating as a second hole in the outer surface of the body, the first hole oriented at a non-normal angle relative to the substrate and offset a first radial distance from a rotational center-point of the substrate; and ejecting liquid out of the first hole into contact with the substrate at the rotational center-point and ejecting liquid out of the second hole into contact with the substrate at a second radial distance from the rotational center-point.

Abstract: A cleaning apparatus for cleaning a hair-cutting portion of an electric hair-cutting device includes a cleaning-liquid basin for receiving the hair-cutting portion of the electric hair-cutting device in a central area such that the hair-cutting portion is at least partially immersed in the cleaning liquid. The electric hair-cutting device is cleaned by generating a cleaning-liquid flow revolving within the basin around the central area of the basin, the hair-cutting portion being at least partially immersed in the cleaning liquid. The liquid flow effectively entrains debris away from the hair-cutting portion.

Abstract: A substrate processing method includes jetting at least one fluid from a fluid nozzle toward a rotating substrate surface while moving the fluid nozzle from a center toward a periphery of the rotating substrate. The fluid nozzle is moved from the center of the substrate to a predetermined point at a constant initial movement speed. The fluid nozzle is subsequently moved from the predetermined point at a movement speed V(r) which satisfies the following relational expression: V(r)×r?=C (constant), where V(r) represents the movement speed of the fluid nozzle when it passes a position corresponding to a position on the substrate surface at a distance “r” from the center of the substrate, and ? represents a power index.

Abstract: A method for carrying out a controlled cooling thermal processing of aluminium billets or other metal materials to be extruded, characterized in that said billets, at a temperature of about 560° C., are arranged one at a time on a horizontally arranged cradle, including locking jaws, said cradle, with a billet arranged therein, being rotatively driven through 90° about a horizontal pivot pin thereby performing a partial controlled immersion, at one end portion thereof, into a water basin having a temperature equal to or slightly larger than an environment temperature.

Abstract: A cleaning apparatus for a power driven buffing pad includes a wash plate mounted in a cleaning solution reservoir that provides agitating and cleaning contact with the pad mounted on an operating driver. The wash plate can be reciprocated vertically by the operator against a biasing arrangement to operate a pump to deliver cleaning solution from the reservoir to the face of the pad in contact with the wash plate.

Abstract: Provided are a liquid processing apparatus and a liquid processing method that can optimize the state of air flow at an upper side of a substrate according to each liquid process performed during a substrate liquid processing. A liquid processing apparatus for performing a substrate liquid processing includes a support member configured to horizontally supporting the substrate; a gap forming member configured to form an annular gap between the gap forming member and an outer circumferential part of the support member; an upper liquid supplying member configured to supply a processing liquid to the substrate from an upper side; a cup configured to surround the annular gap and receive the processing liquid swept away from the rotating substrate through the annular gap; and an elevating mechanism configured to elevate the gap forming member.

Abstract: An apparatus for treating a wafer-shaped article, comprises a spin chuck for holding a wafer-shaped article in a predetermined orientation, at least one upper nozzle for dispensing a treatment fluid onto an upwardly facing surface of a wafer-shaped article when positioned on the spin chuck, and at least one lower nozzle arm comprising a series of lower nozzles extending from a central region of the spin chuck to a peripheral region of the spin chuck. The series of nozzles comprises a smaller nozzle in a central region of the spin chuck and a larger nozzle in a peripheral region of the spin chuck. In the method according to the invention, a heated liquid is supplied through the series of nozzles so as to supply more heat to peripheral regions of a wafer than to central regions.

Abstract: An apparatus and associated method are provided for treating a workpiece with a cryogenic impingement fluid. A fixture supports the workpiece in an upright position and operably connects an electrical component of the workpiece to a power source in the supported position. A cryogenic impingement fluid applicator sprays a stream of the cryogenic impingement fluid against the supported workpiece and laterally moves the stream in accordance with a predetermined path. A shield deflects the stream of cryogenic impingement fluid to prevent the stream from contacting at least a part of the workpiece as the stream is moved along the predetermined path.

Abstract: Disclosed are a cleaning apparatus and a cleaning method, which can collect a chemical liquid without reducing the throughput after a substrate is subjected to a cleaning treatment and dried by using a drying solvent, such as IPA. The disclosed cleaning apparatus carries out a chemical liquid cleaning treatment, a rinsing treatment, and a drying treatment with IPA, in order, on a wafer W while rotating wafer W, and includes a cleaning liquid supply device for supplying a cleaning liquid for cleaning the drain cup and the drain tube to the drain cup in a state where the cleaning liquid is not supplied to the wafer. Also, the apparatus further includes a control unit for controlling respective components of the cleaning apparatus. The control unit, after the cleaning treatment and then the rinsing treatment of wafer W, at the time when the drying treatment is performed by IPA, controls the cleaning liquid to be supplied to the drain cup.

Abstract: The present invention discloses a sterilizable washing machine using ultraviolet radiation, and a sterilizable washing method in the same. The sterilizable washing machine includes a cabinet (2) having an inlet for putting the laundry into the washing machine, a door (50) installed at the cabinet (2), for opening and closing the inlet of the cabinet (2), a tub (6) installed in the cabinet with a buffing function and containable wash water, a drum (8) rotatably installed inside the tub (6) for performing washing, a gasket G installed between the inlet of the cabinet (2) and the tub (6), for sealing the gap between the door (50) and the tub (6), and an ultraviolet light source (20) installed at the gasket (6), for radiating ultraviolet rays into the drum (8).

Abstract: In a liquid processing apparatus configured to remove, from a substrate including a first film and a second film formed above the first film, the first film and the second film, a first chemical-liquid supply part supplies, to a substrate W, a first liquid for dissolving the first film, a second chemical-liquid supply part supplies a second chemical liquid for weakening the second film, and a fluid supply part serving also as an impact giving part gives a physical impact to the second film so as to break the second film and supplies a fluid for washing away debris of the broken second film. A control device controls the respective parts such that, after the second liquid has been supplied and then the fluid has been supplied from the fluid supply part, the first chemical liquid is supplied.

Abstract: A spin base is caused to rotate at a number of revolutions of from 250 rmp to 350 rpm (first number of revolutions), and at the same time, a cleaning solution is supplied to a holding surface of a spin base while the upper end of a processing cup is placed below the holding surface. Thus, an outer upper surface of the processing cup is cleaned with the cleaning solution scattered from the holding surface. Then, the spin base is caused to rotate at a number of revolutions of from 350 rpm to 450 rpm (second number of revolutions) higher than the first number of revolutions, and at the same time, a cleaning solution is supplied onto the holding surface. Thus, a partition plate outside the processing cup is cleaned with the cleaning solution scattered from the rotating holding surface.

Abstract: Disclosed is a liquid processing apparatus including first and second cups installed so as to surround a rotation holding unit of a substrate and guide a processing liquid scattered from the rotating substrate downwards. A first driving unit and a second driving unit elevate the first cup and the second cup between a position receiving the processing liquid and the lower position thereof. A controller controls that the first cup and the second cup are ascended at the same time by transferring the driving force of the first driving unit while the first cup or a first elevating member thereof is overlapped with the second cup or a second elevating member thereof from the lower side by setting the ascending speed of the first cup to be higher than the ascending speed of the second cup when the first and second cups are ascended at the same time.

Abstract: A surface of a substrate can be dried cleanly after liquid-processed by a liquid processing method and a liquid processing apparatus. The liquid processing method includes forming a liquid film of a rinse solution on an entire surface of a substrate having thereon a hydrophobic region by supplying, onto a central portion of the surface of the substrate, the rinse solution for rinsing a chemical liquid supplied on the substrate at a first flow rate while rotating the substrate at a first rotation speed; forming a stripe-shaped flow of the rinse solution on the surface of the substrate by breaking the liquid film formed on the entire surface of the substrate; and moving a discharge unit configured to supply the rinse solution toward a periphery of the substrate until the stripe-shaped flow of the rinse solution is moved outside the surface of the substrate.

Abstract: In accordance with one aspect of the present exemplary embodiment, a portable air filter cleaning device is provided. The device comprises a support frame including at least two legs and a rotatable air filter receiving frame defining a perimeter. The rotatable air filter receiving frame is supported by the support frame. A tube having a first end adapted to receive a water line and a second end including a plurality of outlets is also provided. The second end of the tube is oriented to direct water from the outlets toward the air filter receiving frame perimeter so that water ejected from the outlets impacts a washable air filter mounted upon the air filter receiving frame and causes rotation thereof.

Abstract: A substrate processing apparatus and a substrate processing method are capable of restraining or preventing the generation of streaky particles on a substrate surface by excellent removal of a rinsing liquid therefrom. The substrate processing apparatus has a substrate inclining mechanism for inclining a substrate held by a substrate holding mechanism. After a rinsing liquid has been supplied onto a substrate to form a liquid mass, the substrate is inclined at a small angle by the substrate inclining mechanism. Then, the liquid mass is downwardly moved without being fragmented and then falls down without leaving minute droplets on the substrate top. Thereafter, the substrate is returned to a horizontal posture and then dried.

Abstract: A substrate cleaning method that includes: a step in which, while a substrate holder is being continuously rotated, a to-be-discharged position of the cleaning liquid on the substrate is changed to an eccentric position deviated from the central part of the substrate, and a gas is discharged from a gas nozzle to the central part of the substrate so as to form a dried area of the cleaning liquid under a condition in which a shortest distance between an edge of a cleaning liquid flow output from the cleaning-liquid nozzle and an edge of a gas flow output from the gas nozzle is set between 9 mm and 15 mm.

Abstract: A method for removing the edge bead from a substrate by applying an impinging stream of a medium that is not a solvent for the material to be removed. The medium is applied to the periphery of the substrate with sufficient force to remove the material. Also an apparatus to perform the inventive method.

Abstract: A method for cleaning a diffusion barrier over a gate dielectric of a metal-gate transistor over a substrate is provided. The method includes cleaning the diffusion barrier with a first solution including at least one surfactant. The amount of the surfactant of the first solution is about a critical micelle concentration (CMC) or more. The diffusion barrier is cleaned with a second solution. The second solution has a physical force to remove particles over the diffusion barrier. The second solution is substantially free from interacting with the diffusion barrier.

Abstract: A liquid processing apparatus includes: a hollow holding plate configured to hold an object to be processed; a hollow outer rotational shaft fixedly connected to the holding plate; a rotary drive part configured to rotate the outer rotational shaft; and a lift pin plate disposed in a hollow space of the holding plate, and having a lift pin configured to support the object to be processed. Inside the lift pin plate, a cleaning-liquid supply part configured to supply a cleaning liquid is extended. Connected to the lift pin plate is a lifting member configured to locate the lift pin plate on an upper position and a lower position. When located on the lower position, the lift pin plate receives a force of the rotary drive part for rotating the outer rotational shaft so that the lift pin plate is rotated.

Abstract: A method for processing a photomask for semiconductor devices. The method includes providing a partially completed mask structure, which has a backside and a face. The face includes a substrate material, a light blocking layer overlying the substrate material, and an overlying patterned photoresist layer overlying the light blocking layer. The method includes supporting the backside of the mask structure to maintain the mask structure in place and maintaining the face of the patterned photoresist layer in a direction parallel to a gravitational force and toward the gravitational force. The method includes rotating the mask structure in an annular manner as the patterned photoresist layer of the mask structure is being maintained in the direction parallel to the gravitational force and toward the gravitational force.

Abstract: A nozzle for discharging droplets of a processing liquid for processing a substrate has a main body including a supply port, a drain port, a processing liquid flow passageway connecting the supply port and the drain port, and a plurality of discharge ports from which the processing liquid is discharged. The processing liquid flow passageway includes a plurality of branch flow channels, which branch out between the supply port and the drain port and collect together between the supply port and the drain port. The plurality of discharge ports form a plurality of columns respectively corresponding to the plurality of branch flow channels; and are aligned along and connected to the corresponding branch flow channels. A piezo element applies vibration to the processing liquid flowing through the plurality of branch flow channels.

Abstract: A method for megasonic processing of an article. In one aspect, the invention may be a method of processing semiconductor wafers comprising: supporting the semiconductor wafer substantially horizontally; positioning a rod-like probe above an upper surface of the semiconductor wafer in an orientation other than normal to the upper surface of the substrate; applying a fluid to the upper surface of the semiconductor wafer so that a film of the fluid is formed between at least a portion of the rod-like probe and the upper surface of the semiconductor wafer; and vibrating the rod-like probe to transmit energy to the upper surface of the semiconductor wafer via the film of the fluid to loosen particles on the upper surface of the semiconductor wafer.

Abstract: There is provided a substrate processing apparatus capable of stably holding a substrate and properly processing the substrate. The substrate processing apparatus is an apparatus that processes a substrate while rotating the substrate, with a place surface of the substrate being oriented in a horizontal direction. The substrate processing apparatus comprises a table including a rotatable base plate having a plurality of projecting members projected outward, and a rotation driving mechanism that rotates the base plate. The table can rotatably hold the substrate such that the projecting members contact the substrate from below with a gap formed between the substrate and the table. The substrate processing apparatus further comprises a pressure adjusting apparatus including a suction duct line having one end thereof being opened to the gap, and a suction mechanism connected to the other end of the suction duct line.

Abstract: Some embodiments include methods of removing particles from over surfaces of semiconductor substrates. Liquid may be flowed across the surfaces and the particles. While the liquid is flowing, electrophoresis and/or electroosmosis may be utilized to enhance transport of the particles from the surfaces and into the liquid. In some embodiments, temperature, pH and/or ionic strength within the liquid may be altered to assist in the removal of the particles from over the surfaces of the substrates.

Abstract: After a substrate is cleaned, a liquid supply nozzle moves outward from above the center of the substrate while discharging a rinse liquid with the substrate rotated. In this case, a drying region where no rinse liquid exists expands on the substrate. When the liquid supply nozzle moves to above a peripheral portion of the substrate, the rotational speed of the substrate is reduced. The movement speed of the liquid supply nozzle is maintained as it is. Thereafter, the discharge of the rinse liquid is stopped while the liquid supply nozzle moves outward from the substrate. Thus, the drying region spreads over the whole substrate so that the substrate is dried.

Abstract: A substrate cleaning method that includes: a step in which, while a substrate holder is being continuously rotated, a to-be-discharged position of the cleaning liquid on the substrate is changed to an eccentric position deviated from the central part of the substrate, and a gas is discharged from a gas nozzle to the central part of the substrate so as to form a dried area of the cleaning liquid under a condition in which a shortest distance between an edge of a cleaning liquid flow output from the cleaning-liquid nozzle and an edge of a gas flow output from the gas nozzle is set between 9 mm and 15 mm.

Abstract: A device for cleaning a fixed abrasive polishing pad includes a main body having a surface facing the polishing pad, an inlet coupled to an end of the main body and configured to supply a cleaning liquid, an inject orifice coupled to the inlet for injecting the cleaning liquid and being provided on the surface of the main body, an outlet coupled to the end of the main body, and a recycle orifice coupled to the outlet, and being provided on the surface of the main body.

Abstract: The present invention is to provide a cleaning method to a process for fabricating a semiconductor. The method comprises steps as follows: A semiconductor substrate is first provided. An atomized spray are then continually supplied for a first time interval to clean the semiconductor substrate; and a water film is formed on the surface of the semiconductor substrate at or before a start point of the first time interval to buffer the impact imposed by the atomized spray, wherein the water film is preserved for a second time interval at least partially overlaps the first time interval.

Abstract: Disclosed is a liquid treatment apparatus for processing a lower surface of the substrate. The apparatus includes a first nozzle disposed below a lower surface of the substrate retained by the substrate retaining unit to eject a treatment liquid towards the lower surface of the substrate, the first nozzle having a plurality of first ejection ports, which are arrayed from a position opposing a central portion of the substrate retained by the substrate retaining unit to a position opposing a peripheral portion of the substrate retained by the substrate retaining unit. An ejecting direction of the treatment liquid ejected from the first ejection port is inclined towards a rotation direction of the substrate rotated by the rotational driving unit.

Abstract: Disclosed are a liquid processing apparatus and a liquid processing method that can improve substitutability of an atmosphere in a processing chamber to prevent an atmosphere with, for example, a chemical liquid which is scattered during liquid-processing of a substrate from remaining in the processing chamber. In the liquid processing apparatus, an arm standby unit is installed adjacent to a processing chamber and an arm retreating from the processing chamber stands by in the arm standby unit. An elevating/descending cup peripheral case having a cylindrical shape is disposed around a cup in the processing chamber and when the cup peripheral case is disposed at an upper location, a region inside the cup peripheral case is isolated from the outside. An opening through which the arm passes is installed on the cup peripheral case.

Abstract: The present invention provides an apparatus and a method for an ultraviolet cleaning tool. The cleaning tool includes ultraviolet source spaced apart from a surface having contaminant particles. The ultraviolet source can create ozone between the surface and the ultraviolet source which breaks the chemical bonds between particles and the surface. The apparatus includes a gas feed which introduces a gas to aid the chemical bond. Additionally, the gas feed can introduce a gas to remove the particles from the surface.

Abstract: Methods and apparatuses for cleaning a surface of a substrate are presented. The method comprises positioning a substrate at a controllable distance from a piezoelectric transducer, supplying a cleaning liquid between the substrate and the transducer, applying an oscillating acoustic force to the cleaning liquid by actuating the transducer, and moving the transducer relative to the substrate. The method further comprises, while moving the transducer relative to the substrate, measuring a value that indicates a distance between a surface of the substrate and the transducer, comparing the measured value to a desired value, and adjusting the distance between the surface and the transducer so that the measured value is maintained substantially equal to the desired value. The measured value may be the distance between the surface of the substrate and the transducer or a phase shift between an alternating current and voltage applied to the transducer.

Abstract: Disclosed is a substrate cleaning method for prevent damage to a pattern formed on a substrate. The substrate cleaning method includes cleaning the substrate by striking cleaning particulates carried in a flow of dry air or inert gas against a surface of the substrate, and removing the cleaning particulates.

Abstract: A filter cleaning system for cleaning a filter element is provided. The filter cleaning system includes a set of pulse nozzles and a compressed air supply, which rotate together during a cleaning cycle to release pulse blasts at predetermined time intervals to clean the filter element.

Abstract: Disclosed herein are a dryer and a method of controlling a cleaning operation thereof that are capable of supplying moisture into a drying chamber of the dryer to wet contaminants in the drying chamber and blowing air to the wetted contaminants to remove the contaminants. The method includes supplying moisture into a drying chamber to wet contaminants in the drying chamber and removing the contaminants wetted by the moisture.

Abstract: A cleaning material is applied to a surface of a substrate. The cleaning material includes one or more polymeric materials for entrapping contaminants present on the surface of the substrate. A rinsing fluid is applied to the surface of the substrate at a controlled velocity to effect removal of the cleaning material and contaminants entrapped within the cleaning material from the surface of the substrate. The controlled velocity of the rinsing fluid is set to cause the cleaning material to behave in an elastic manner when impacted by the rinsing fluid, thereby improving contaminant removal from the surface of the substrate.

Abstract: A wet processing apparatus holds on a stage a substrate to be processed and carries out a wet treatment by rotating the stage. The substrate is held by the stage, with the center of the substrate being offset from the rotation center of the stage, using a Bernoulli chuck which causes an inert gas to flow to a back surface of the substrate, so that the substrate is eccentrically rotated along with the rotation of the stage. A first gas supply passage which is used for the Bernoulli chuck is provided at a rotation shaft portion in the stage and the stage is also provided with second gas supply passages which communicate with the first gas supply passage to thereby introduce the inert gas to the back surface of the substrate. The second gas supply passages are axisymmetric with respect to a central axis of the substrate.

Abstract: An apparatus is provided for cleaning paint rollers and/or brushes. It comprises a roller cover/brush holder that may be coupled to a drill or other power tool, and a container and cap assembly. Advantageously, the container accommodates the holder and a roller cover or paintbrush with a minimal effective volume of cleanser. The cap closes and substantially seals the container to contain spray or spillage during high-speed rotation of the holder within the container. In use, the container is filled with cleanser, such as soapy water, and the roller is spun for several minutes. The container is drained, then refilled with rinse water and the process is repeated as needed. The roller or brush may be spun dry after cleaning, or between wash and rinse cycles. The apparatus provides effective cleaning with a reduced volume of water or cleanser and requires minimal clean-up.

Abstract: Various methods and apparatus for simultaneously cleaning two single-sided hard memory disks is provided. The two disks are placed in concentric contact merge orientation such that the outwardly facing surface of each disk, which has memory storage capabilities, may be simultaneously cleaned by equipment designed to clean one double-sided disk. Conversely, no effort is expended in cleaning the abutting inactive surfaces of the disks.

Abstract: A substrate processing apparatus includes a substrate holding unit that horizontally holds a substrate in non-contact with a major surface of the substrate, a processing liquid supply unit that supplies a processing liquid to the major surface of the substrate held by the substrate holding unit, and a hydrophilic surface placing unit that places an annular hydrophilic surface along a peripheral portion of the major surface of the substrate held by the substrate holding unit such that the hydrophilic surface comes into contact with a liquid film of the processing liquid held on the major surface of the substrate.

Abstract: A cleaning method of a semiconductor wafer includes the following steps. A semiconductor wafer is provided. A cleaning solution is sprayed to the semiconductor wafer. The semiconductor wafer is driven to spin along a first direction for a first time. The semiconductor wafer is driven to spin along a second direction for a second time. The cleaning method can effectively clean the semiconductor wafer. A cleaning device for cleaning a semiconductor wafer is also provided.

Abstract: A substrate processing apparatus includes a substrate holding member configured to rotate along with a wafer (W) held thereon and a drain cup (51) configured to surround the wafer (W). A cleaning process is performed by rotating the wafer (W) while supplying a process liquid onto the wafer (W), and then a rinsing process is performed by rotating the wafer (W) in a similar way while supplying a rinsing liquid onto the wafer (W). The rinsing process is performed by first adjusting a rotational speed of the wafer (W) to be the same as the rotational speed used in the cleaning process while supplying the rinsing liquid, and then raising a liquid level of the rinsing liquid inside the drain cup (51) by decreasing the rotational speed of the wafer (W) or increasing a flow rate of the rinsing liquid, and raising a reach position of the rinsing liquid on the outer sidewall of the drain cup (51) by increasing the rotational speed of the wafer (W).

Abstract: A method for removing scum in a tub of an electronically controlled drum washing machine. The method includes alternately rotating a drum following a main washing cycle and pumping liquid out of the drum, pumping a liquid out of the drum for between 30 seconds to 15 minutes following a main washing cycle and pumping liquid out of the drum, regulating a level of water following a main washing cycle and pumping liquid out of the drum by: introducing a quantity of water into the drum which is sufficient to cover all water channels, and rinsing over a short period of time t2. The method further including pumping liquid out of the drum while the drum is moved at a low rotational speed following a main washing cycle and pumping liquid out of the drum.

Abstract: Herein disclosed is a device and a method for liquid treatment of a disc-like article comprising rotating a disc-like article, dispensing liquid onto the disc-like article when rotated, collecting liquid, which is flung off the disc-like article when rotated, providing a plate arranged parallel to the disc-like article and facing the disc-like article when rotated, and directing gas parallel to the plate across the plate.

Abstract: A wafer W is processed by supplying a two-fluid, high pressure jet water, or mega-sonic water onto the wafer W, while rotating the wafer W in an essentially horizontal state. After supply of the cleaning fluid is stopped, the wafer W is dried by rotating the wafer W at a higher speed than that used in supplying the cleaning fluid. No rinsing process using purified water is performed in a period after stopping supply of the cleaning fluid and before rotating the substrate at the higher speed.

Abstract: An improved portable cleaning system for use in cleaning heat exchanger tube bundles, fin-fans, towers and other elongated components. The cleaning system comprises a cleaning unit having a cleaning enclosure that receives and cleans the component and a control unit that controls the operation of the system. The cleaning unit has a cleaning enclosure defining a chamber sized and configured to receive the component through a sealable lid. A roller assembly rotates the component while a spray assembly sprays cleaning fluid over and into the rotating component. The cleaning fluid is heated in the chamber using surface heating elements attached to heat transfer plates along sections of the chamber walls. A vapor recovery system captures and treats toxic vapors. In use, the cleaning system is transported to a facility to clean the components on-site using cleaning fluid supplied by the facility and discharging waste to the facility.

Abstract: A method for controlling operation of a washing machine is provided. The method may include performing heated washing courses at different temperatures while also selectively controlling an operating rate of a driving motor to enhance sterilizing effects on items being washed while protecting against damage to the items being washed. Performing these heated washing courses may include selecting an infant clothes oriented washing program from a plurality of washing programs, and performing a washing operation in accordance with one of a plurality of operating modes associated with the selected infant clothes oriented washing program, including controlling at least one of a washing course temperature or an operating rate of a driving motor of the washing machine.

Abstract: A process chamber for processing semi-conductor wafers. The chamber includes at least one rotor within the process chamber. The rotor is adapted to receive and/or process semi-conductor wafers. The top of the process chamber also includes a tiltable rim. This rim tilts from a non-inclined position to an inclined position. The wafers may be loaded into and unloaded from the process chamber when the rim is in its inclined position.