Abstract: An improved portable cleaning system for use in cleaning heat exchanger tube bundles, fin-fans, towers and other elongated components. The cleaning system comprises a cleaning unit having a cleaning enclosure that receives and cleans the component and a control unit that controls the operation of the system. The cleaning unit has a cleaning enclosure defining a chamber sized and configured to receive the component through a sealable lid. A roller assembly rotates the component while a spray assembly sprays cleaning fluid over and into the rotating component. The cleaning fluid is heated in the chamber using surface heating elements attached to heat transfer plates along sections of the chamber walls. A vapor recovery system captures and treats toxic vapors. In use, the cleaning system is transported to a facility to clean the components on-site using cleaning fluid supplied by the facility and discharging waste to the facility.

Abstract: A wash element for washing one or more reusable fluid manipulators is provided comprising at least one nozzle for connection to a fluid pump to generate a fluid jet and at least one deflector surface positioned to deflect the fluid jet towards a washing zone for receiving at least a portion of the fluid manipulator. The deflector surface is being shaped to broaden the fluid jet. The invention further relates to a wash station having a cavity provided with one or more wash elements. The invention yet further relates to an automated system for manipulating fluids comprising at least one wash station and a controller set up to control washing the fluid manipulator. In a process for washing the reusable fluid manipulator at least a portion of the fluid manipulator is moved in a washing zone, a fluid jet of washing fluid is generated and directed onto a deflector surface shaped to broaden and deflect the fluid jet towards the washing zone.

Abstract: Suppressed is damage of a semiconductor wafer due to charging of a cleaning liquid used in a single wafer type wafer cleaning step. A chemical solution discharged from a tip of a cleaning nozzle is brought into contact with protrusions of wafer chucks to thereby let static electricity of the chemical solution go to the wafer chucks, and subsequently, the cleaning nozzle is moved above the wafer to supply the chemical solution onto a top surface of the wafer, thereby suppressing abnormal discharge (damage) of the wafer due to charging of the chemical solution.

Abstract: A substrate cleaning device and a substrate cleaning method reduces liquid drops remaining on a substrate to prevent the irregular heating of the substrate by a heating process due to liquid drops or water marks remaining on the substrate. A cleaning liquid is poured through a cleaning liquid pouring nozzle onto the surface of a substrate such that a region onto which the cleaning liquid is poured moves from a central part toward the circumference of the substrate. A gas is jetted radially outward at a region on the surface of the substrate behind a region onto which the cleaning liquid is poured with respect to the rotating direction of the substrate. The gas forces a liquid film of the cleaning liquid flowing on the surface of the substrate to flow in a circumferential direction and a radially outward direction.

Abstract: A test probe is configured to provide conductive contact with a surface on application of the probe to the surface. The probe includes a probe body having a proximal and distal end, a probe tip located at the distal end of the probe body, the probe being configured such that, when the probe tip is applied to the surface, the probe tip is moved to rotate about its axis, whereby the shaft tip can rotatably remove oxidation and/or contamination debris from between the shaft tip and the surface.

Abstract: An apparatus and a method are provided for accurately analyzing and evaluating a degree of contamination on a chamfered part without mixing impurities from parts other than the chamfered part into chemicals. At a position in which, on a front plane flat part of a semiconductor wafer, a boundary region bordering the chamfered part can come into contact with the chemicals, a radius direction position of the chemicals (a distance between a chemicals center and a wafer center) is determined, scanning is performed in a circumference direction, and the chemicals including impurities are collected. Then, at a position that can be brought into contact with the both chamfered part of the semiconductor wafer and the boundary region, a radius direction position of the chemicals is determined, scanning is performed in the circumference direction and the chemicals including impurities are collected.

Abstract: Provided is a method including the steps of: carrying out a storage process by causing a processing jig, which has a supply opening for supplying a first processing liquid, to be positioned such that a storage space section into which the supply opening is open is sandwiched by the processing jig and the process-target surface, and by storing the first processing liquid in the storage space section; and carrying out a rotation process by supplying the first processing liquid onto the process-target surface from the supply opening, while supplying a second processing liquid onto the outer peripheral part, in a state where the process-target object is being rotated, in the step for carrying out the rotation process, the processing jig being moved along a direction which is not a direction along which the process-target object is being rotated.

Abstract: The present invention provides a method, apparatus, and system for efficient, high throughput, consistent cleaning of soil from the root system of a plant. In one embodiment, the method generally comprises positioning a plant adjacent a sprayer assembly having at least one nozzle angled so as to impact the root system at a predetermined position, providing a stream of water from a reservoir through the nozzle of the sprayer assembly, and rotating at least one of the root system and the nozzle relative to the other to remove the soil from the root system. The present invention further describes a recycling system adapted to recycle water expended during the cleaning process to minimize losses and to capture and return dislodged soil to the field from which the plant is extracted.

Abstract: A control mechanism of a cleaning apparatus is preset to control the apparatus for a cleaning process or a rinsing process to include delivering a process liquid, which is corresponding one of a cleaning liquid and a rinsing liquid, from a back surface liquid supply nozzle through a liquid delivery port, thereby forming a liquid film on the back surface of a substrate, and then once stopping and then re-starting delivery of the process liquid from the back surface liquid supply nozzle, thereby forming a liquid film also on a portion around the liquid delivery port, so as to process the portion around the liquid delivery port as well as the substrate.

Abstract: A substrate cleaning device and a substrate cleaning method reduces liquid drops remaining on a substrate to prevent the irregular heating of the substrate by a heating process due to liquid drops or water marks remaining on the substrate. A cleaning liquid is poured through a cleaning liquid pouring nozzle onto the surface of a substrate such that a region onto which the cleaning liquid is poured moves from a central part toward the circumference of the substrate. A gas is jetted radially outward at a region on the surface of the substrate behind a region onto which the cleaning liquid is poured with respect to the rotating direction of the substrate. The gas forces a liquid film of the cleaning liquid flowing on the surface of the substrate to flow in a circumferential direction and a radially outward direction.

Abstract: Method for drying a surface of a disc-shaped article includes covering the surface with a rinsing liquid, whereby a closed liquid layer is formed, and removing the rinsing liquid, wherein the rinsing liquid containing at least 50 wt. % water and at least 5 wt. % of a substance, wherein the substance lowers the surface energy of water, wherein the removing of the liquid is initiated by blowing gas onto the closed liquid layer, whereby the closed liquid layer is opened at on discrete area.

Abstract: The invention relates to a method of cleaning tubes, in which the tube is at least partially filled with a cleaning medium, wherein a cleaning medium is atomized, in which case the droplets of cleaning medium are accelerated, at least in part, essentially in the direction of a center axis of the tube.

Abstract: A substrate treatment apparatus includes: substrate holding unit which horizontally holds a substrate; a rotating unit which rotates the substrate held by the substrate holding unit about a vertical axis; and a first nozzle having a first opposing face to be opposed to a region of a lower surface of the substrate inward of a peripheral portion of the substrate in spaced relation to the lower surface of the substrate during rotation of the substrate by the rotating unit and a treatment liquid spout provided in the first opposing face for filling a space defined between the lower surface of the substrate and the first opposing face with a treatment liquid spouted from the treatment liquid spout to keep the space in a liquid filled state.

Abstract: A cooling gas is discharged from a cooling gas discharge nozzle toward a local section of a front surface of a substrate on which a liquid film is formed. And then the cooling gas discharge nozzle moves from a rotational center position of the substrate toward an edge position of the substrate along a moving trajectory while the substrate is rotated. As a result, of the surface region of the front surface of the substrate, an area where the liquid film has been frozen (frozen area) expands toward the periphery edge from the center of the front surface of the substrate. It is therefore possible to form a frozen film all over the front surface of the substrate while suppressing deterioration of the durability of the substrate peripheral members since a section receiving supply of the cooling gas is limited to a local area on the front surface of the substrate.

Abstract: A method of processing bone material using supercritical fluids is disclosed. The method comprises placing the bone material in a processing chamber, adding supercritical fluid to the processing chamber, pulsing the supercritical fluid in the processing chamber, and rinsing the bone material. A processing system for processing bone material using supercritical fluids in accordance with the present invention comprises a processing chamber for housing the bone material, a vat for storing a processing fluid, a pump, a heating element, a flow path, a tank, and a solvent port.

Abstract: Aspects of the invention generally provide methods and apparatus for cleaning adhesive residual on a photomask substrate. In one embodiment, the apparatus includes a processing cell, a support assembly configured to receive a photomask substrate disposed thereon disposed in the processing cell, a protection head assembly disposed above and facing the support assembly, and a head actuator configured to control the elevation of the protection head assembly relative to an upper surface of the support assembly. A cleaning device is provided and positioned to interact with the photomask substrate disposed on the support assembly.

Abstract: The invention is directed to semi-solid food product metering devices that typically have two counter rotating feed rollers with ends to entrain the semi-solid food product and has an at least one actuating device. The two feed rollers have two roller end plates at each end of the feed rollers, one being at a distal end of the rollers and the other at a proximal end of the rollers relative to the at least one actuating device with an at least one support bar. The feed rollers make a positive seal with the end plates. The semi-solid food product metering device of the invention has an open position and an operating position where the at least one support bar supports the two roller end plates in position while in the operating position and operating the semi-solid food product metering device, and allowing for lateral movement of the end plates away from the ends of the feed rollers to allow access to the gap between the feed roller ends and the roller end plates in the open position.

Abstract: A spin chuck rotatably holds a semiconductor wafer, while resist is dropped on a surface of the semiconductor wafer through a resist application nozzle and thus applied thereon, and before the resist applied on the wafer dries, a cleaning liquid is supplied through a bevel cleaning nozzle to a portion of the wafer located at a peripheral portion thereof in a vicinity of a beveled portion to remove the resist adhering to the beveled portion. Thereafter, a film of the resist that is formed on the surface of the wafer is dried.

Abstract: The object of the invention is a device for cleaning the core engine of a jet engine, having a supply unit, which provides the cleaning medium, a nozzle unit, which is configured for feeding the cleaning medium into the core engine, and a line connection (10) between the supply unit and the nozzle unit. The invention provides that the nozzle unit has a means for the rotationally fixed connection to the fan shaft of the jet engine, and that a rotary coupling (5) is provided between the nozzle unit and the line connection (10). The object of the invention is further an arrangement of such a device and a turbo fan jet engine, and a method for cleaning the core engine of a jet engine using the device.

Abstract: After the rinsing processing is completed, the rotation speed of the substrate is reduced from 600 rpm to 10 rpm to form a puddle-like DIW liquid film. After the supply of DIW is stopped, the control unit waits for a predetermined time (0.5 seconds) so that the film thickness t1 of the puddle-like liquid film becomes approximately uniform. Then, IPA is discharged to a central part of the surface of the substrate at a flow rate of 100 (mL/min) for instance. By the supply of IPA, DIW is replaced with IPA at the central part of the surface of the substrate to form a replaced region. Further, after three seconds of IPA supply, the rotation speed of the substrate is accelerated from 10 rpm to 300 rpm. This causes the replaced region to expand in a radial direction of the substrate so that the entire surface of the substrate is replaced with the low surface-tension solvent.

Abstract: A device is disclosed for cleaning dental trays at least partly filled with a molding material. The device has a container, a pump for placing a cleaning liquid under pressure, and a spray nozzle for spraying the pressurized cleaning liquid into the container. A method is also disclosed for cleaning dental trays at least partly filled with a molding material.

Abstract: Embodiments of the invention generally provide apparatus and method for detecting and controlling edge bevel removal of a semiconductor substrate. One embodiment of the present invention provides an apparatus for inspecting a rotating substrate. The apparatus comprises a substrate support configured to support the rotating substrate on a back side and rotate the substrate about a central axis, and a sensor positioned above the substrate support, the sensor being configured to inspect a front side of the rotating substrate while moving simultaneously radially across the substrate.

Abstract: A rinsing liquid supplier includes a temperature adjuster. The temperature adjuster cools DIW to a temperature lower than room temperature. This temperature adjuster cools down DIW to a temperature not more than 10 degrees centigrade for instance, and cooling down to an even lower temperature of 5 degrees centigrade or below is more preferable. Meanwhile, the temperature adjuster maintains DIW at not less than 0 degrees centigrade, which prevents freezing of the DIW. The cooled DIW supplied to a rinsing liquid pipe is discharged from the rinsing liquid discharge nozzle toward the top surface of the substrate, to thereby form a liquid film. Further, the cooled DIW is discharged toward the rear surface of the substrate from the liquid discharge nozzle via the liquid supply pipe, to thereby form the liquid film on the rear surface. Since the liquid films are already cooled, they are frozen in a short time when the cooling gas is discharged toward the top surface and the rear surface of the substrate.

Abstract: An apparatus and associated method are provided for treating a workpiece with a cryogenic impingement fluid. A fixture supports the workpiece in an upright position and operably connects an electrical component of the workpiece to a power source in the supported position. A cryogenic impingement fluid applicator sprays a stream of the cryogenic impingement fluid against the supported workpiece and laterally moves the stream in accordance with a predetermined path. A shield deflects the stream of cryogenic impingement fluid to prevent the stream from contacting at least a part of the workpiece as the stream is moved along the predetermined path.

Abstract: After a rinse process on a wafer W is performed by feeding pure water to the surface of the wafer W at a predetermined flow rate while rotating the wafer W in an approximately horizontal state, a feed amount of the pure water to the wafer W is reduced, and a pure-water feed point is moved outward from the center of the wafer W. In this manner, the wafer W is subjected to a spin dry process while forming a liquid film in a substantially outer region of the pure-water feed point.

Abstract: What is contemplated is a printing cylinder washer having a removable or portable drive assembly, or a series of portable drive assemblies of different lengths to accommodate different sizes of print rollers. The drive assemblies have a drive mechanism enabled by a dynamic flow of cleaning solution within the washer reservoir. What is also contemplated is the use of an elevation system, an agitation platform, under-immersion spray bars, an ultrasonic wave cleaning system, and a hatch or door equipped with a thermal breaker in conjunction with the hydro-driven portable drive assembly. What is also contemplated is a method of washing printing rollers within the above-described printing cylinder washer by aligning a nozzle with the drive assembly.

Abstract: A liquid processing method includes: placing a plate adjacently to at least one of surfaces of a target substrate, and supplying a process liquid into a gap between the plate and the target substrate, thereby forming a liquid film of the process liquid; subjecting the target substrate to a process using a state with the liquid film of the process liquid thus formed; and supplying a gas to the liquid film, thereby breaking the liquid film, after finishing the process.

Abstract: A system and method of cleaning a substrate includes a megasonic chamber that includes a transducer and a substrate. The transducer is being oriented toward the substrate. A variable distance d separates the transducer and the substrate. The system also includes a dynamically adjustable RF generator that has an output coupled to the transducer.

Abstract: A produce cleaning machine provides baskets for holding large and small produce items and water sprayers for directing water jets onto the produce from above and below. One basket is motorized to rotate to more evenly clean the produce, while a further basket can be rolled in and out of the machine to make loading and unloading easier. The force of the spray is adjustable and the rotational speed of the motor is as well to provide for special handling of the produce. Rotation after cleaning is used to help dry the produce, and ultraviolet emission is used to sanitize the produce.

Abstract: A wash cylinder or chamber for an automated cleaning station to clean an object or a person's body part includes nozzles on the interior of the cylinder, the nozzles of one embodiment comprising an increasing roll angle providing a novel spray pattern. Additionally, embodiments of the invention include fluid guidance and conveyance structures, angled nozzles, sealing structures, finger guards, nozzle ribs, wash chamber seating mechanisms and drains, and nozzle inlays having a plurality of nozzles. Also disclosed are methods of washing an object or body part using a wash cylinder or chamber and methods of assembling a wash cylinder or chamber.

Abstract: A cleaning method of cleaning a surface of a substrate that is processed by a developing process. The method includes pouring a cleaning liquid onto a central part of the substrate. A dry area that is not wetted with the cleaning liquid is created in a central part of the substrate by stopping pouring the cleaning liquid or by shifting a cleaning liquid pouring position to which the cleaning liquid is poured from the central part while the substrate holding device is rotating. The dry area is expanded outward from the central part of the substrate by rotating the substrate holding device at a rotating speed not lower than 1500 rpm without pouring the cleaning liquid onto the dry area. The cleaning liquid is poured onto an outer area contiguously surrounding the dry area on the surface of the substrate.

Abstract: Disclosed is a liquid processing apparatus and a liquid processing method that can prevent a processing liquid from being left on a lift pin after a drying-out process of a substrate, thereby preventing the processing liquid from being attached to the back surface of the substrate after the liquid processing. The liquid processing apparatus of the present disclosure includes a holding plate that supports a substrate, a lift pin plate provided above the holding plate having a lift pin that supports the wafer from a lower side, and a processing liquid supply unit that supplies the processing liquid to the back surface of the wafer. The processing liquid supply unit is provided with a head part configured to close a penetrating hole of the lift pin plate. The processing liquid supply unit and the lift pin plate are configured to be elevated with respect to the holding plate.

Abstract: In one embodiment, a method for cleaning a substrate in a cleaning module is disclosed. The method includes an operation that receives the substrate into a first level of the cleaning module. In another operation, the substrate is spun while contemporaneously applying a cleaning fluid to top and bottom surfaces of the substrate. In yet another operation, the substrate is spun at a second level of the cleaning module. The method also includes an operation to dry the substrate in an enclosed cavity at a third level of the cleaning module.

Abstract: A method of using a wash cylinder or chamber for a cleaning station to clean an object or a person's body part includes nozzles on the interior of the cylinder, the nozzles of one embodiment comprising an increasing roll angle providing a novel spray pattern. Additionally, embodiments of the invention include methods of using fluid guidance and conveyance structures, angled nozzles, sealing structures, finger guards, nozzle ribs, wash chamber seating mechanisms and drains, and nozzle inlays having a plurality of nozzles. Also disclosed are methods of washing an object or body part using a wash cylinder or chamber and methods of assembling a wash cylinder or chamber.

Abstract: A substrate having a liquid film formed by pre-processing unit is transported by a substrate transport robot from the pre-processing unit to a freeze processing unit disposed away from the pre-processing unit. In the freeze-processing unit, the liquid film is frozen. This causes the adhesion power of contaminants adhering to the surface of the substrate reduce, and therefore the contaminants is detached from the surface of the substrate. Subsequently, the substrate which was subjected to the freezing process, is transported from the freeze processing unit to a post-processing unit which is disposed away from the pre-processing unit and the freeze processing. In the post-processing unit, a cleaning liquid is supplied to the frozen film on the rotating substrate, thereby easily removing the contaminants adhering to the substrate together with the frozen film.

Abstract: The substrate cleaning method of and the substrate cleaning apparatus for removing contaminants such as particles adhering to a surface of a substrate attain a high throughput and effectively remove the particles and the like. To clean the back surface Wb of the substrate W, DIW cooled down to a temperature near its freezing point and cooling gas which is at a lower temperature than the freezing point of the DIW are discharged toward the center of the lower surface of the substrate which rotates. When thus cooled DIW flows along the back surface Wb of the substrate W, the particles and the like adhering to the substrate are removed.

Abstract: A substrate liquid cleaning process is disclosed by utilizing a substrate liquid processing apparatus having, inter alia, a rotating mechanism that rotates a substrate to be cleaned, a peripheral edge cleaning mechanism that cleans the peripheral edge of the substrate by a rotating cleaning body, and a cleaning solution supply mechanism that supplies the cleaning solution to the substrate. The substrate liquid cleaning process is performed by contacting the rotating cleaning body to a peripheral edge of a rotating substrate while supplying a cleaning solution. The rotational direction of the substrate and the cleaning body is set to be an opposite direction so that the proceeding direction of the substrate and the cleaning body becomes the same at a contacting portion where the substrate and the cleaning body are contacted. A rotational speed ratio of the substrate and the cleaning body is set to be about 1:1˜3.5:1.

Abstract: A reusable filter cartridge having a symmetrical structure, the reusable filter cartridge comprising a tubular outer pipe having perforations arranged therein. A tubular inner pipe having perforations is arranged therein, and has a smaller diameter than the diameter of the outer pipe such that an annulus is formed between the outer and inner pipes. A filtering media is disposed in the annulus between the outer and inner pipes. A first and second lid is provided, each being secured at opposite ends of the outer and inner pipes; one of the lids having a central opening therein for water to flow out of or into the inner pipe. The reusable filter cartridge further comprises a coupling arrangement for coupling the filter cartridge with a rotating element of a cleaning device so that the filter media can be cleaned by rotation of the filter cartridge around its axis inside the cleaning device.

Abstract: The present invention provides a rinsing method capable of satisfactorily rinsing the surface of a resist film regardless of the condition of the surface of the resist film so that development defects caused by residuals produced by development may be reduced. A rinsing method of rinsing a substrate processed by a developing process for developing an exposed pattern comprises the steps of discharging a rinsing liquid onto a central part of the substrate processed by the developing process and coated with a developer puddle while the substrate is stopped or rotated (step 5), stopping discharging the rinsing liquid in a state where the developer puddle remains at least in a peripheral part of the substrate (step 6), and rotating the substrate at a high rotating speed to shake the developer remaining on the substrate off the substrate together with the rinsing liquid (step 7).

Abstract: In a dry process after a cleaning process using a cleaning-liquid nozzle and a rinse process using a side rinse nozzle are performed on a wafer W, the wafer W is turned, feeding of pure water to a center point of the wafer W from a pure-water nozzle is started, and substantially at the same, injection of a nitrogen gas from a gas nozzle to a center portion of the wafer W at a point at an adequate distance apart from the center of the wafer W is started. Next, while the pure-water nozzle is caused to scan toward the periphery of the wafer W, the gas nozzle is caused to scan toward the periphery of the wafer W in an area radially inward of the position of the pure-water nozzle after the gas nozzle passes the center of the wafer W.

Abstract: Depending on the actual operating situation and the composition of the fuels used for driving the internal combustion engine, contamination of the moving blades, of the guide device and of the turbine casing parts occurs sooner or later in the exhaust gas turbine. According to the invention, a small quantity of cleaning fluid is fed continuously or cyclically into the exhaust gas flow of an exhaust gas turbine and is directed onto the components to be cleaned. The small quantity of cleaning fluid can be fed in with unchanged operation of the internal combustion engine, such that the exhaust gas turbine can be cleaned or kept clean within the entire operating range of the internal combustion engine. Fluctuations in the power output of the internal combustion engine on account of requisite cleaning of the exhaust gas turbine therefore do not occur. Furthermore, the formation of thermostress cracks in the critical turbine casing parts is largely avoided.

Abstract: Tubular labels and contaminants can be removed from containers and/or bottles of plastic material to be recycled, by subjecting the containers and/or bottles to a first weak mechanical washing and slow centrifugating action, followed by a separation step for separating the removed labels and contaminants from the containers. The containers are subsequently subjected to a second strong mechanical washing and fast centrifugating action for the removal from the containers and/or bottles of any residual labels and contaminants.

Abstract: An apparatus for wet processing individual wafers comprising; a means for holding the wafer; a means for providing acoustic energy to a non-device side of the wafer; and a means for flowing a fluid onto a device side of the wafer.

Abstract: The present invention relates to a system and method for cleaning a paint roller. The system according to the present invention includes: a roller holder; an attachment shaft, where the attachment shaft securely attaches to the roller holder; and a means to rotate the attachment shaft and spindle holder assembly at variable speeds. The means to rotate includes a hand held power tool.

Abstract: A substrate (W) is processed with the use of a process liquid such as a deionized water. Then, a first fluid which is more volatile than the process liquid is supplied to an upper surface of the substrate (W) from a fluid nozzle (12) to form a liquid film. Next, a second fluid which is more volatile than the process liquid is supplied to the upper surface of the substrate (W) from the fluid nozzle (12), while the wafer (W) is being rotated. During this supply operation, a supply position (Sf) of the second fluid to the substrate (W) is moved radially outward from a rotational center (Po) of the substrate (W). As a result, it is possible to prevent the generation of particles on the substrate (W) after it is dried by using the first and second fluids.

Abstract: In a substrate cleaning method and a substrate cleaning method according to the present invention, a brush 3 is brought into contact with a substrate W while rotating the same, and a cleaning position Sb of the brush 3 is moved relative to the substrate W from a center part of the substrate W toward a peripheral part thereof. A process fluid formed of liquid droplets and a gas is sprayed by a two-fluid nozzle 5 onto the substrate W, and a cleaning position Sn of the two-fluid nozzle 5 is moved relative to the substrate W from a center part of the substrate W toward a peripheral part thereof. During the movement of the cleaning position Sb of the brush 3 from the center part of the substrate W toward the peripheral part thereof, the cleaning position Sb of the two-fluid nozzle is positioned nearer to a center P0 than the cleaning position Sb of the brush 3. Since contaminations of the brush are prevented from adhering again to the wafer, it can be avoided that the wafer W is contaminated.

Abstract: Cleaning compounds, apparatus, and methods to remove contaminants from a substrate surface are provided. An exemplary cleaning compound to remove particulate contaminants from a semiconductor substrate surface is provided. The cleaning compound includes a viscous liquid with a viscosity between about 1 cP to about 10,000 cP. The cleaning compound also includes a plurality of solid components dispersed in the viscous liquid, the plurality of solid components interact with the particulate contaminants on the substrate surface to remove the particulate contaminants from the substrate surface.

Abstract: A device for liquid treatment of a defined area of a wafer-shaped article, especially of a wafer, in which a mask is kept at a defined short distance to the wafer-shaped article such that liquid can be retained between the mask and the defined area of the wafer-shaped article by capillary forces.

Abstract: An apparatus for cleaning substrates includes a substrate support that is configured to support a plurality of substrates horizontally as spaced regularly one above the other, a rotating device for rotating the substrate support and a liquid supply system for dispensing cleaning liquid onto the substrates. The substrate support has a base plate and support rods extending upright on the base plate. The support rods include fixed rods and at least one movable rod. The movable rods is movable between an open position to provide a passage that allows the substrates to be placed between the support rods, and a closed position at which the substrates are held by and between the support rods. Once the substrates are supported in this way, the substrates are rotated. Then, the cleaning liquid, such as a chemical solution(s) followed by a rinsing liquid, is dispensed onto all of the substrates as the substrates are being rotated.

Abstract: During the processing of substrates, the substrate surface may be subjected to a cleaning process using supercritical CO2. Surface matter may remain, for example, because it is only minimally soluble in the supercritical CO2. For example, an oxidation cleaning process causes the substrate structure to cleave at several points leaving smaller fragments of oxidized residue behind. This residue has only minimal solubility in supercritical CO2 due to the polar constituents resulting from oxidation. The method thus further includes processing the substrate with supercritical CO2 and a functionalizing agent that can react with the smaller fragments and/or other less soluble components. These functionalized components are rendered more soluble in supercritical CO2 and are more easily removed than their predecessors.