Abstract: A method for removing particles from a semiconductor processing tool is provided. The method comprises providing a pick-up wafer for picking up particles from a semiconductor processing tool, inserting said pick-up wafer into said semiconductor processing tool and placing the pick-up wafer on a receiving member, applying an electrostatic charge to said pick-up wafer, leaving said pick-up wafer in said semiconductor processing tool for a predetermined dwell time; and removing said pick-up wafer from said semiconductor processing tool. Further, a method for processing semiconductor wafers is provided.

Abstract: In a cleaning device, the scraping up body and the rotating body rolling the adhesive roll are rotatably supported to the frame, and the adhesive roll is rotatably arranged on the scraping up body and the rotating body in parallel.

Abstract: A screen cleaning tool including a thin sheet of fiberous material made by a process that includes the steps forming fibers into a lacy pattern, compressing the pattern into a thin sheet, applying a curable adhesive to the fibers, and curing the adhesive and pre-moistening said thin sheet with an aqueous solution of materials selected from the group consisting of propylene glycol, polysorbate, aloe extract, 2-phenoxyethanol, methyl paraben, butyl paraben, ethyl paraben, propyl paraben, isobutyl paraben, and DL-alpha-tocopheryl acetate in order to make it available to be wiped over the surface of a screen.

Abstract: To clean contaminants on a substrate including a metal wiring formed thereon, a cleaning solution including diluted aqueous sulfuric acid solution is applied onto the substrate. Mega-sonic energy is applied to the cleaning solution on the substrate. The contaminants are removed from the substrate in accordance with the reaction between the diluted aqueous sulfuric acid solution and the contaminant while the mega-sonic energy is applied to the substrate. The corrosion of the metal wiring is prevented because of the cleaning solution including the diluted aqueous sulfuric acid solution. Additionally, the damage of the substrate is reduced because the mega-sonic energy is appropriately applied to the substrate.

Abstract: The present invention provides a cleaning sheet for cleaning a surface which includes an additive applied on at least one of the outer surfaces of the sheet. The additive can have a penetration value at 25° C. between 20 dmm and about 100 dmm. The additive can have a “relative tack” between 55% and 94%. The additive can be applied at a level between 0.1 g/m2 and about 2.3 g/m2. The cleaning sheet leaves low levels of residue on the surface which is cleaned with the sheet.

Abstract: The invention relates to the cleaning of contaminated accelerating or guiding electrodes of ion sources used for ion generation by desorption. A cleaning plate is used that has an outer contour similar to that of a standard sample support plate, and may be equipped with cleaning scrubbers that can be moved out when necessary to contact the electrodes. The scrubbers may include soft covers, and can carry out the cleaning by dry rubbing or with the help of high-boiling solvents for the matrix substances. The moving out of the cleaning scrubbers can be controlled by external light pulses from a laser or video camera spot light. Alternatively, the cleaning plate may be equipped with spray nozzles connected to a reservoir of cleaning fluid which is sprayed onto the electrodes, and the evacuation of the ventilated ion source chamber may be used to initiate the spraying.

Abstract: The invention relates to a degreasing composition in liquid, gel or foam form for degreasing and/or decontaminating solid surfaces.

Abstract: A lawn mower cleaning tool includes an elongated handle and a cleaning blade attached to one end of the handle. The handle has opposite ends, a longitudinal axis, and a length greater than the radius of the mower blade. An angled cleaning blade member attaches to one of the ends of the handle. The blade member includes a shank portion extending longitudinally from the handle and a scraping blade portion attached to the shank portion and diverging therefrom in a radial direction. Thus, the mower deck can be cleaned without the operator's hands entering into close proximity with the mower blade.

Abstract: A cleaning device for cleaning toilets, bathroom fixtures, and other surfaces. The device encloses a reservoir contained in a hollow handle for storing a cleaning solution, with a cap connected to one end of the handle and a base connected to the other end of the handle. A brush, sponge or other scrubber or cleaning surface is preferably attached to the base. A manually operated flow control mechanism opens a valve which seals at least one exit or dispensing orifice at or near the base of the reservoir, and thereby allows volume of cleaning solution to be dispensed at a reasonably fast, controlled rate of flow. In one embodiment, manually operated vacuum pressure release orifices are located at the opposite end of the reservoir from the exit orifice and are normally closed, but may be opened to minimize or eliminate any vacuum (subatmospheric pressure) in the reservoir, thereby aiding the flow of liquid from the reservoir through the exit orifice.

Abstract: Wafer holder cleaning devices, systems and methods that are capable of removing contaminants from a wafer holder. An embodiment includes a particle removal surface on the cleaning device. An embodiment of the surface is a brush. An embodiment includes moving the surface into contact with the wafer holder. An embodiment includes moving the surface into a close, non-contacting relationship to the wafer holder. An embodiment includes a vacuum removing the particles from the wafer holder. In an embodiment, the wafer holder is a spindle chuck. In an embodiment, the spindle chuck is in a fabrication station. In an embodiment, one of the cleaning device and wafer holder rotates.

Abstract: The present invention is directed to a cleaning apparatus and a method of for using the apparatus to remove foreign matter, e.g., dirt, dust, accumulated lubricant, moisture and the like, from the areas in and around a mechanical component having a void space. The cleaning apparatus includes an elongated flexible member terminated by first and second ends, and a tapered end disposed on at least one of the ends of the elongated member. The apparatus can be threaded into the void space and contacted with a surface of the void space.

Abstract: An apparatus and method are provided for removing contaminate particulate matter from substrate surfaces such as semiconductor wafers. The method and apparatus use a material, preferably a liquid curable polymer, which is applied as a sacrificial coating to the surface of a substrate containing contaminate particulate matter thereon. An energy source is used to dislodge the contaminate particulate matter from the surface of the wafer into the sacrificial coating so that the particles are partially or fully encapsulated and suspended in the sacrificial coating. The sacrificial coating is then removed. The coating is preferably formed into a film to facilitate removal of the coating by pulling (stripping) the film providing a cleaner substrate surface.

Abstract: The cleaning device may clean probe elements. The probe elements may be the probe elements of a probe card testing apparatus for testing semiconductor wafers or semiconductor dies on a semiconductor wafer or the probe elements of a handling/testing apparatus for testing the leads of a packaged integrated circuit. During the cleaning of the probe elements, the probe card or the handler/tester is cleaned during the normal operation of the testing machine without removing the probe card from the prober. The cleaning device may be placed within the prober or tester/handler similar to a wafer containing semiconductor dies to be tested so that the probe elements of the testing machine contact the cleaning medium periodically to remove debris and/or reshape the tips of the probe elements.

Abstract: A process of removing excess holefill material from a surface of an electronic substrate in which the holefill residue is contacted with a swelling agent followed by planarizing of the surface in the presence of an agent no stronger than a liquid having a pH of about 6 to about 8.

Abstract: Devices and methods of cleansing body parts are provided. A device for facilitating foot scrubbing includes a scrubbing surface and cleansing material extending through the scrubbing surface. The cleansing material is supported by a biased support to ensure that the top surface of the cleansing material extends sufficiently to be applied to the foot as the foot is slid over the device.

Abstract: A device for treating a stain is disclosed. The device includes a scrubber which has a backing with an inner surface and an outer surface. Extending from the outer surface of the backing is a plurality of scrubbing protrusions. Fastened to the inner surface of the backing is an absorber such as a sponge. The backing and scrubbing protrusions may be molded from a flexible, resilient material, with the scrubbing protrusions being conical in shape with rounded ends. The absorber may be compressed to remove liquid held therein by folding the device about itself such that the backing is over the absorber and applying pressure.

Abstract: A solid detergent dispenser for use with a dishwashing machine includes a chamber and a lid. The chamber is configured and arranged to receive a solid detergent having a particular composition. A water inlet receives water from a water source, and the water flows through a tunnel into the bottom of the chamber. The chamber is flooded with water from the bottom to ensure relatively constant erosion of the solid detergent, which ensures that a relatively constant concentration of the solid detergent is used in the dishwashing machine. A water outlet allows water to flow out of the chamber into the dishwashing machine. The water must flow into the chamber faster than it flows out of the chamber to ensure that the appropriate amount of dissolution of the solid detergent occurs. The only valve used in the preferred embodiment is a valve to control the amount of water flowing into the water inlet.

Abstract: A method of using a golf cleaning device includes providing a golf cleaning device comprising a cleaning portion made of an absorbent cleaning material, and a fastening portion connected to the cleaning portion; providing a horizontally extending support adjacent a golfer's waist; connecting the fastening portion of the golf cleaning device to the horizontally extending support adjacent a golfer's waist so that the cleaning portion hangs down from a golfer's waist area partway along a leg of the golfer; and cleaning a golf-related item with the cleaning portion of the golf cleaning device.

Abstract: The present invention is directed to a device and method for removing build-up on such measurement gauges. The inventive device and method involve a movable scraper that fits around a cylindrical shield of a measurement gauge and continuously removes the build-up on the shield. Movement of the scraper is accomplished by a magnetic coupling between a magnetic core attached to the scraper, which is inside a pipe or other piece of equipment, and solenoids that are installed on the outside of the pipe. The device and method of the invention ensure instantaneously correct readings from the measurement gauge and improve control and operation strategies of heat exchanges, with significant economic advantages.

Abstract: A dry aerosol carpet cleaning process comprising cleaning compositions, pads, and implements provide effective cleaning of carpets. The system includes (a) a cleaning implement (b) a disposable cleaning substrate attached to the cleaning implement, and (c) an aerosol canister to deliver a cleaning composition. The aerosol cleaning composition has unique cleaning properties when used with the cleaning implement and disposable cleaning substrate.

Abstract: A cleanling apparatus for removing contaminants from the surface of a substrate includes two parts: one which produces an aerosol including frozen particles and directs the aerosol onto the surface of the substrate to remove contaminants from the surface by physical force, and another part in which a fluid including a gaseous reactant is directed onto the surface of the substrate while the surface is irradiated to cause a chemical reaction between the reactant and organic contaminants on the surface, to chemically removing the organic contaminants. In the method of cleaning the substrate, the physical and chemical cleaning processes are carried out in a separate manner from one another so that the frozen particles of the aerosol are not exposed to the effects of the light used in irradiating the surface of the substrate. Therefore, the effectiveness of the aerosol in cleaning the substrate is maximized.

Abstract: The present invention provides a web of entangled synthetic fibers, wherein said fibers are eccentric bicomponent fibers. The present invention further provides a method of absorbing oil from foods comprising contacting a web of entangled, eccentric bicomponent fibers with oil-containing food prior to, during, or subsequent to preparation of such foods, especially but not limited to during or subsequent to cooking such foods wherein said web is exposed to temperatures at above about 120 C.

Abstract: An improved device for cleaning probe pins of a probe head assembly is presented. The device includes a first holding plate, a second holding plate and a cleaning cartridge. The first holding plate secures the probe head assembly. The second holding plate secures the cleaning cartridge in proximity to the first holding plate. The cleaning cartridge has a chamber. The chamber includes a cleaning solution and an absorbent pad located therein. The absorbent pad is saturated with the cleaning solution and prevents leakage of the cleaning solution out of the chamber. During cleaning operations, the first holding plate is positioned about the second holding plate such that the probe pins of a probe head extend into and contact the absorbent pad in the chamber. Once contact is established, the cleaning solution acts upon the probe pin tips to remove unwanted debris. A depth of penetration of the pins into the pad is controlled by a surface of the cartridge.

Abstract: A method for controlling and removing dust and other fine particles in a material comprising i) electrostatically charging carrier particles in powder form to give the carrier particles a minimum charge to mass ratio of +/−1×10−4 C/kg, ii) delivering the electrostatical charged carrier particles to the material, whereby the dust and other fine particles in the material agglomerate with the charged carrier particles and iii) removing the resultant agglomerates from the material (for example by vacuuming or brushing).

Abstract: A cleaning apparatus including: (1) a substantially hollow tubular body having a bore extending therein, (2) actuation means operably coupled to the body and including a plunger disposed within the body and (3) a cleaning head detachably coupled to the body, wherein actuation of the plunger ejects the cleaning head from the body.

Abstract: A method for selectively removing portions of a diffusion aluminide coating from a substrate is described. The coating is treated with an aqueous composition based on an acid having the formula HxZrF6, wherein x is an exemplary 2. The coating being removed is usually a noble metal-aluminide coating, and the substrate is typically a superalloy. Related compositions are also described.

Abstract: A method and apparatus are disclosed for improving a screen printing process by applying vibrational energy to assist in the print release, cleaning, and drying processes. The vibrational energy or acoustic pressure waves may be created by a transducer where the waves are transferred to the stencil or printable material through air or a vibrational interface medium. The vibrational energy in turn assists with separating the printable material from the side walls of the apertures of the stencil. The vibrational energy can further assist in the process of cleaning the stencil. The acoustic pressure can also be used in the drying process by having the waves impinge on the water droplets to atomize the droplets on the surface of the stencil. The technology can be used for the assembly of Printed Circuit Assemblies, Ball Grid Array IC Packages, Flip Chip, etc.

Abstract: A sealed packaging member includes a disposable wiping member for cleaning debris from a surface, such as, an eating utensil, a beverage container or a person's skin. The wiping member is sealed from exposure to the environment until unsealed by an associated operator. The wiping member may be saturated with purified water and contains no cleaning solution.

Abstract: This application claims the benefit of U.S. Provisional Application No. 60/402,897, filed Aug. 13, 2002. A foot and toe scrubber has an elongated handle and an elliptical, conical, rectangular, squarish or cylindrical scrubbing element attached at one end of the handle. The scrubbing element is an elliptical, conical, rectangular, squarish or cylindrical foam or sponge material having a plurality of grooves and/or cells providing an overall uneven, irregular surface. The foot and toe scrubber is configured so that the scrubbing element can be applied and moved between and about the toes, as well as other areas of the feet. Application of the scrubber head to, between, around and about the toes and otherwise on the feet is to clean between the toes and other areas of the feet.

Abstract: In a method and apparatus for cleaning the front surface of a mounted lens a web is moved to a lowered position against the lens. A first segment of the web is then slackened. The first segment of web is then rubbed against the lens. Following the rubbing the web is pulled taut while the web is still in the lowered position. A second segment of web can be wiped against the lens while the web is held taut. The first segment can be wet and the second segment dry.

Abstract: A method for cleaning vehicle windows by means of a wiper with a wiper strip (12), whose wiper lip (16) rests against the vehicle window. The wiper strip (12) is set into oscillations lateral to its longitudinal direction (20) during the wiping operation and/or shortly before it is begun.

Abstract: A system for recycling reusable resin mold products recovered from discarded apparatuses is disclosed. This recycling system includes a crushing system for crushing resin mold products one kind by one kind into crushed resinous pieces and packing the same in a bag, a classification system for irradiating a light beam to the resin in the bag and classifying the bags into respective kinds of resins based on a reflected beam therefrom, a cleaning system for separately cleaning the respective kind of crushed resinous pieces taken out of the bag to remove foreign matters adhered onto the surfaces of the crushed resinous pieces therefrom, and a recovery system for recovering the cleaned crushed resinous pieces.

Abstract: A cleaning apparatus (9) for cleaning a peripheral part of a substrate holds a peripheral part of a substrate (1) between the elastic porous member (29) of an upper cleaning roller (16) and an elastic porous member (30) of a lower cleaning roller (17). The power of a drive motor (13) is transmitted through a drive pulley (18), a belt (26) and a driven pulley (24) to a rotating shaft (17a) to rotate the lower cleaning roller (17), and is transmitted through a drive pulley (22), a belt (25) and a driven pulley (23) to a rotating shaft (16a) to rotate the upper cleaning roller (16) in a direction opposite the direction in which the lower cleaning roller (17) is rotated. A cleaning liquid is supplied through cleaning liquid supply nozzles (31) and cleaning liquid supply pipes (31a) into core members (27, 28). Then the cleaning liquid flows through connecting holes (35) formed in the circumferential walls of the core members (27, 28) and permeates the elastic porous members (29, 30).

Abstract: A foreign-matter removal capacity is improved in a cleaning process. When a wafer is cleaned while a brush is moved from the center of the wafer toward the outer circumference thereof, a discharge flow rate of cleaning liquid flowing into the brush is regulated so that the interval between the brush and the wafer is kept constant.

Abstract: The inventive method cleans residual titanium accumulations and other undesirable materials from a planarized surface of a wafer to produce a planarized surface with less than about fifty defects per wafer. After a metallic layer of material has been planarized using a CMP process, loose residual particles of undesirable material are removed from the planarized surface. The residual titanium accumulations remaining on the planarized surface are then detached from the planarized surface, which produces additional, new particles on the surface of the wafer. The additional particles produced by the detaching step are then scrubbed from the planarized surface until the planarized surface has less than approximately 50 defects per wafer.

Abstract: A cleaning system and a cleaning method is provided with a cleaning medium comprising a magnetic substance and a magnetic field generating device for applying a magnetic force to the magnetic substance in the cleaning medium so that the magnetic substance and the area to be cleaned are rubbed together. The area to be cleaned is cleaned by the rubbing action of the cleaning medium. The interior of the cleaned object not reachable by hands or instruments can be easily cleaned with this device. The cleaning medium, made of a magnetic substance, is guided into the interior of the cleaned object. The magnetic field generating device generates a magnetic field in the cleaning medium and thereby applies a force to the magnetic substance. By rubbing the magnetic substance on the inner wall surface of the area to be clean, the object can be cleaned efficiently.

Abstract: A method for cleaning top and bottom surfaces of a semiconductor substrate is provided. The method includes scrubbing top and bottom surfaces of the semiconductor wafer with top and bottom brushes, respectively. Top and bottom brushes are saturated and supplied with a scrubbing fluid. The top and bottom brushes are squeezed so as to press out excess scrubbing fluid by continuing to apply top and bottom brushes against top and bottom surfaces of the semiconductor substrate, respectively, but without supplying the scrubbing fluid. Top and bottom brushes are respectively moved away from the top and bottom surfaces of the semiconductor substrate. The top brush is rotated so as to prevent dripping onto the top surface of the semiconductor substrate. Top and bottom surfaces of the semiconductor substrate are rinsed using a rinse fluid while continuing to rotate the top brush that was squeezed to press out the excess scrubbing fluid.

Abstract: A new and improved footbrush device and method of using is disclosed for use in allowing a user to convenient means for cleaning the user's feet. The device comprises a wall hanger unit, an elongated handle, a bracket and a cleansing unit. The wall hanger unit is attachable to a wall. The elongated handle having a knob for slidably inserting and hanging in the open sleeve of the wall hanger unit. The bracket is attached to the distal end of the elongated handle. The cleansing unit is pivotally attached to the distal end of the bracket. The cleansing unit comprises a rigid base, a U-shaped cushion having two substantially parallel arms, and a brush sequestered between the two arms of the U-shaped cushion pad. The method of using the new and improved footbrush device comprises the steps of attaching, filing, hanging, lifting, obtaining, rotating, rubbing, scratching, sliding, turning, and twisting.

Abstract: A method and system for processing a wafer is disclosed. The method includes receiving a wafer having a process side and a backside. The method further includes removing un-wanted particles from the backside of the wafer to prevent gaps from forming between the backside of the wafer and a chucking surface. The method also includes performing a specific processing task on the process side of the wafer after cleaning the backside of the wafer.

Abstract: A cleaning chemistry for lowering defect levels on the backside of a semiconductor wafer after chemical mechanical planarization (CMP). In a preferred embodiment of the present invention, a cleaning chemistry comprising nitric acid, hydrofluoric acid, and phosphoric acid in solution with deionized water is applied to the wafer surface to be cleaned preferably while subjected to megasonic assist cleaning. The wafer is preferably then subjected to brush scrubbing and a deionized water rinse with megasonic assist cleaning.

Abstract: A floor-scrubbing machine is provided having a main body and a cleaning fluid delivery system. At least one rotatable brush having a brush body and bristles extending from the brush body is included. The brush is carried by the main body whereby the bristles of the brush engage the floor being scrubbed. A fluid distributor is provided to distribute cleaning fluid supplied to the fluid distributor to the brush. The brush defines a recess having a sidewall and at least one opening formed in the sidewall for distributing the cleaning solution radially outward.

Abstract: An object of the present invention is to provide washing liquid for semiconductor substrate capable of removing grinding grains of silica, alumina or the like in a polishing agent and polishing trashes of copper, and capable of leaving little organic substance due to an additive used for preventing corrosion of copper on the surface of a copper wiring after washing, while corrosion of copper is suppressed, and a method of producing a semiconductor device using this washing liquid. The object is achieved by washing liquid for a semiconductor substrate having a copper wiring, comprising a basic compound and at least one selected from the group consisting of sugar alcohols and saccharides.

Abstract: A method of using an electric stainbrush for cleaning inanimate surfaces is provided. The electric stainbrush includes a handle having a motor disposed therein, a head having a longitudinal axis, and a neck disposed between the handle and the head. First and second bristle holders are associated with the head. The first bristle holder oscillates or rotates. The second bristle holder reciprocates in generally the same direction as the longitudinal axis of the head but does not rotate or oscillate. The motor is operatively connected to the first and second bristle holders.

Abstract: A pipeline cleaning and renovating method of the present invention comprises introduction of abrasive particulates by pressurized air through the pipelines to remove the incrustation adhering to the inner surface of the pipelines. Water or other liquids are introduced into the pipelines to generate or increase a moisture content in a flow of the pressurized air. The air flow through the pipelines is controlled to induce a substantially helical flow pattern such that a substantial amount of abrasive particulates are driven by the air flow to move along the inner surface of the pipeline in order to efficiently remove the incrustation. After the pipelines are cleaned, a coating material is added into the pipelines and driven by the air flow in the substantially helical flow pattern to provide an even coating film on the cleaned inner surface of the pipelines. This method can be broadly applied to various types of pipelines and various diameters of the pipelines from 13 mm to 300 mm.

Abstract: Cleaning fluid is sprayed upwards from under a substantially horizontally-held object to be cleaned for cleaning the underside of the object. At this time, an accelerating fluid accelerates the cleaning fluid to change its spraying direction toward a surface of the object, then the cleaning fluid is sprayed onto the surface to be cleaned.

Abstract: Methods and compositions are disclosed for chemical mechanical polishing (CMP) of semiconductor substrates, post-CMP storage of semiconductor substrates and post-CMP cleaning of semiconductor substrates. The methods and compositions feature the use of surfactants and, in some cases, passivation agents. The methods and compositions are particularly suited to polishing, storing and cleaning semiconductor substrates comprising hydrophobic surfaces.

Abstract: Methods and compositions are disclosed for chemical mechanical polishing (CMP) of semiconductor substrates, post-CMP storage of semiconductor substrates and post-CMP cleaning of semiconductor substrates. The methods and compositions feature the use of surfactants and, in some cases, passivation agents. The methods and compositions are particularly suited to polishing, storing and cleaning semiconductor substrates comprising hydrophobic surfaces.

Abstract: A cleaning implement (100) comprising a cleaning support member (10), the cleaning support member (10) having a substantially flat bottom surface (13) and comprising fastening hooks (14) on the bottom surface (13); and a reversible cleaning pad (20) releasably attached to the bottom surface (13) of cleaning support member (10). The reversible cleaning pad (20) includes first and second sides, the first side of the cleaning pad (20) comprises a first cleaning web material (21) and the second side of the cleaning pad (20) comprises a second cleaning web material (22), both web materials (21, 22) being directly attachable to fastening hooks (14).

Abstract: The apparatus includes a sponge capable of having a fluid therein. The sponge has a first surface that can be placed in contact with the coating. High and low frequency transducers are positioned in contact with the second surface of the sponge. A method performing the invention includes the steps of providing a sponge having a first surface for contact with the substrate, providing ultrasonic transducers in contact with a second surface of the sponge opposite from the first surface, saturating the sponge with water to provide a path of water extending from the transducers to the substrate, and activating the transducers to generate (i) a low frequency acoustic field; and (ii) a high frequency acoustic field; and thereby (iii) micron-sized vapor or cavitation bubbles which impinge upon the paint on the substrate to remove the paint from the substrate.

Abstract: A method for cleaning a wafer with a drip nozzle being configured for use in a drip manifold that is oriented over a brush of a wafer cleaning system is provided. The drip nozzle has a first end and a second end with a passage defined there between where the passage includes a wall that extends longitudinally between the first end and the second end. An orifice is defined within the passage and located at the first end of the drip nozzle. The method includes inputting a fluid into the drip nozzle at an acute angle relative to a longitudinal extension of the wall and reflecting the fluid stream off an internal wall of the drip nozzle at least twice in a direction that is toward the second end. The method further includes outputting at least one substantially uniform drop from the second end of the passage.