Abstract: This thermoelectric conversion module is formed by electrically connecting, by a conductive member, one end of an n-type thermoelectric conversion element having a negative Seebeck coefficient and having a half-Heusler structure to one end of a p-type thermoelectric conversion element containing an oxide having a positive Seebeck coefficient at a temperature of 25° C. or higher. The conductive member is connected to the n-type thermoelectric conversion element and the p-type thermoelectric conversion element through a connection layer containing a conductive metal comprising silver, and the connection layer is characterized by further containing an oxide to reduce the bond resistance between the n-type thermoelectric conversion element and/or the p-type thermoelectric conversion element.

Abstract: A trim module having a first heat exchanger; a second heat exchanger; and a thermoelectric cooler (TEC) module thermally coupled between the heat exchangers; a mix manifold conduit fluidly coupled to the inlet of the first heat exchanger; a zone supply conduit fluidly coupled to the outlet of the first heat exchanger; a cabin return conduit fluidly coupled to the inlet of the second heat exchanger; an exhaust conduit fluidly coupled to the outlet of the second heat exchanger, wherein the TEC module is configured to operate in a first mode or a second mode, depending on a temperature within the zone supply conduit and a target temperature, and in the first mode, the TEC module transfers thermal energy from the first heat exchanger to the second heat exchanger; and in the second mode the TEC module transfers thermal energy from the second heat exchanger to the first heat exchanger.

Abstract: A thermoelectric element according to an embodiment of the present invention comprises: a first metal substrate; a first resin layer disposed on the first metal substrate and in direct contact with the first metal substrate; a plurality of first electrodes disposed on the first resin layer; a plurality of thermoelectric legs disposed on the plurality of first electrodes; a plurality of second electrodes disposed on the plurality of thermoelectric legs; a second resin layer disposed on the plurality of second electrodes; and a second metal substrate disposed on the second resin layer, wherein the first resin layer comprises a polymeric resin and an inorganic filler and at least a part of side surfaces of the plurality of first electrodes are embedded in the first resin layer.

Abstract: Disclosed are a thermoelectric device and a manufacturing mold and manufacturing method thereof. The thermoelectric device includes at least one set of thermoelectric arm unit, wherein a first thermoelectric arm is provided with a first upper surface and a first lower surface opposite to the first upper surface; a second thermoelectric arm is provided with a second upper surface and a second lower surface opposite to the second upper surface; the second thermoelectric arm is seamlessly bonded with the first thermoelectric arm via an insulating adhesive layer; the first upper surface is flush with the second upper surface, and a first spacing groove is formed between adjacent positions of the first upper surface and the second upper surface; the first lower surface is flush with the second lower surface, and a second spacing groove is formed between adjacent positions of the first lower surface and the second lower surface.

Abstract: A sputter growth method for a crystalline ordered topological insulator (TI) material on an amorphous substrate, which is possible to use at a CMOS-compatible temperature. The process can be integrated into CMOS fabrication processes for Spin Orbit Torque (SOT) devices. The resulting material can include a thin film crystalline ordered TI layer, sputter deposited on an amorphous substrate, and an adjacent ferromagnetic (FM) layer in which spin-orbit torque is provided by the TI layer, for example to cause switching in magnetic states in a magnetic memory device.

Abstract: The thermocycling inspection device includes a holder-accommodating space 10 for accommodating the chip holder 50 therein, a thermocycling section 20 for heating and cooling the inspection chip 60, and a detector 30 for taking a picture of the inspection chip 60, and when the thermocycling section 20 heats or cools or when a picture is taken by the detector 30, the thermocycling section 20 is disposed on one side of the holder-accommodating space 10, the detector 30 is disposed on other side of the holder-accommodating space 10, and the holder-accommodating space 10 is formed such that an optical axis of the detector 30 and a sample introducing port 62 match with each other. According to this, polymerase chain reaction can be carried out, and inspection can be carried out using the inspection chip which carries out the polymerase chain reaction.

Abstract: To increase thermoelectromotive voltage of a thermoelectric conversion element with a magnetization direction, a temperature gradient direction, and an electromotive force direction orthogonal to each other. A thermoelectric conversion element 1 is formed by annularly winding a thermoelectric material which is radially magnetized and circumferentially generates an electromotive force in accordance with a temperature gradient in the axial direction thereof. Thus, the thermoelectric material is wound not linearly but annularly, so that a connection line for connecting a plurality of thermoelectric materials is not necessary. In particular, when the thermoelectric material is wound in a plurality of turns, the length per unit area of the thermoelectric material in the direction of the electromotive force can be significantly increased, making it possible to significantly increase thermoelectromotive voltage while suppressing increase in the size of the element.

Abstract: A method is provided for producing an electrically-powered device and/or component that is embeddable in a solid structural component, and a system, a produced device and/or a produced component is provided. The produced electrically powered device includes an attached autonomous electrical power source in a form of a unique, environmentally-friendly structure configured to transform thermal energy at any temperature above absolute zero to an electric potential without any external stimulus including physical movement or deformation energy. The autonomous electrical power source component provides a mechanism for generating renewable energy as primary power for the electrically-powered device and/or component once an integrated structure including the device and/or component is deployed in an environment that restricts future access to the electrical power source for servicing, recharge, replacement, replenishment or the like.

Abstract: A thermoelectric element according to an embodiment comprises: a first substrate; a first electrode part disposed on the first substrate; a thermoelectric semiconductor disposed on the first electrode part; second electrode parts disposed on the thermoelectric semiconductor; and a second substrate disposed on the second electrode parts, wherein the second substrate comprises: a first surface; and a second surface opposite to the first surface, the second electrode parts are disposed on the first surface, a terminal electrode part formed by extending at least one of the second electrode parts is disposed on the second surface, and the second substrate is formed between the terminal electrode part and the second electrode parts.

Abstract: A gas concentration device includes a first container, a second container, a pressure control device, and a path. The first container includes a first space surrounded by a first partition wall and stores a specimen, and a pressure inside the first space is reduced. The second container is airtightly connected to the first container by a first path and has a second space surrounded by a second partition wall and stores a gas flowing in from the first space. The pressure control device reduces a volume of the second space. A gas inside the second space is discharged through a second path.

Abstract: A thermal conduction unit includes a conductive via, a periphery conductor and an isolation material. The conductive via includes a first thermoelectric material. The periphery conductor encloses the conductive via and includes a second thermoelectric material. An end of the periphery conductor is electrically connected to an end of the conductive via. The isolation material is interposed between the conductive via and the periphery conductor.

Abstract: System, heaters, and heat transfer devices are disclosed. For example, a system for performing polymerase chain reaction includes a support member configured to receive a sample vessel and a heater that is positioned to affect a temperature of the sample vessel. The system additionally includes a heat transfer device disposed between the heater and the sample vessel. The heat transfer device illustratively includes anisotropic fibers axially aligned parallel to one another and positioned to conduct heat from the at least one heater toward the sample vessel in the axial direction of the anisotropic fibers. An exemplary heater includes a body defining one or more channels, a heating element positioned in the one or more channels, and retention members adjacent the one or more channels. At least a portion of the heating element is mechanically interlocked with the channel by deforming the retention members into a closed position.

Abstract: An electronic device includes a first portion and a second portion, an electric power generating device and a load device. The electronic device is disposed in an opening of a connected space, and the electronic device and a wall have the opening divide the connected space into the first space and the second space. The first portion is located in a first space having a first ambient temperature, and the second portion is located in a second space having a second ambient temperature. The electric power generating device is configured to generate a thermo-electromotive force based on a temperature difference between the first ambient temperature and the second ambient temperature to generate electrical energy. The load device is configured to obtain the electrical energy and operate on the electrical energy.

Abstract: An object of the present invention is to provide a stable thermoelectric battery. The object can be solved by a thermoelectric battery comprising a working electrode containing a n-type silicon and germanium, a counter electrode, and a solid electrolyte having a polymer having a specific repeating unit with a molecular weight of 200 to 1,000,000, or a derivative thereof, wherein the solid electrolyte contains copper ions or iron ions as an ion source.

Abstract: Disclosed is a thermoelectric module. One embodiment of the thermoelectric modules comprises: a first substrate; a first electrode disposed on the first substrate; a thermoelectric leg disposed on the first electrode; a second electrode disposed on the thermoelectric leg; a second substrate disposed on the second electrode; a plurality of wire parts electrically connected to the first electrode and the second electrode; a first sealing part disposed on the first substrate and surrounding the side surface of the second substrate; and a second sealing part passing through the first sealing part and disposed on the inside and outside of the first sealing part. At least one of the plurality of wire parts is partially disposed inside the second sealing part.

Abstract: An integrated circuit (IC) package comprising an IC die, the IC die having a first surface and an opposing second surface. The IC die comprises a semiconductor material. The first surface comprises an active layer. A thermoelectric cooler (TEC) comprising a thermoelectric material is embedded within the IC die between the first surface and the second surface and adjacent to the active layer. The TEC has an annular shape that is substantially parallel to the first and second surfaces of the IC die. The thermoelectric material is confined between an outer sidewall along an outer perimeter of the TEC and an inner sidewall along an inner perimeter of the TEC. The outer and inner sidewalls are substantially orthogonal to the first and second surfaces of the IC die.

Abstract: A thermoelectric conversion device includes: a thermoelectric module layer, in which a thermoelectric conversion chip is surrounded by a thermal insulation rubber containing a rubber component and a hollow filler forming a plurality of air gaps that are independent from one another; an insulation base layer and an insulation intermediate layer, which are thermal-conductive insulation sheets and sandwiches the thermoelectric module layer; a heat diffusion layer, which has a higher thermal conductance than those of the insulation base layer and the insulation intermediate layer and is stacked on the insulation intermediate layer; and a thermal radiation layer, which has thermal conductivity and is stacked on the heat diffusion layer. And at least one pair among the adjacent layers is bonded through chemical bonds.

Abstract: Micro-scale thermoelectric devices having high thermal resistance and efficiency for use in cooling and energy harvesting applications and relating fabricating methods are disclosed. The thermoelectric devices include first substrates substantially parallel with second substrates. Scaffold members are deposited between the first and second substrate. The scaffold members include a plurality of cavities having sidewalls. The scaffold members may be formed from the second substrate. The sidewalls are substantially vertical with respect to the second substrate. The sidewalls may be substantially parallel. Thermoelectric materials are deposited on the sidewalls.

Abstract: Embodiments include a semiconductor package with a thermoelectric cooler (TEC), a method to form such semiconductor package, and a semiconductor packaged system. The semiconductor package includes a die with a plurality of backend layers on a package substrate. The backend layers couple the die to the package substrate. The semiconductor package includes the TEC in the backend layers of the die. The TEC includes a plurality of N-type layers, a plurality of P-type layers, and first and second conductive layers. The first conductive layer is directly coupled to outer regions of bottom surfaces of the N-type and P-type layers, and the second conductive layer is directly coupled to inner regions of top surfaces of the N-type and P-type layers. The first conductive layer has a width greater than a width of the second conductive layer. The N-type and P-type layers are directly disposed between the first and second conductive layers.

Abstract: An IC package, comprising a first IC component comprising a first interconnect on a first surface thereof; a second IC component comprising a second interconnect on a second surface thereof. The second component is above the first component, and the second surface is opposite the first surface. A thermoelectric cooling (TEC) device is between the first surface and the second surface. The TEC device is electrically coupled to the first interconnect and to the second interconnect.

Abstract: A thermoelectric device and a manufacturing method thereof according to one embodiment of the present invention are disclosed. The thermoelectric device includes a plurality of upper electrodes and a plurality of lower electrodes, and an N-type thermoelectric material and a P-type thermoelectric material which are electrically connected, alternately arranged between the upper electrodes and the lower electrodes, and obliquely disposed on the lower electrode.

Abstract: In one embodiment, a method includes forming a plurality of thermocouples coupled in series by forming first metal segments comprising a first metal, each of the first metal segments having a L-shape. The method further includes forming a plurality of deep openings to expose a first contact region of each of the first metal segments, and forming a plurality of shallow openings to expose a second contact region of each of the first metal segments. The method further includes forming second metal segments comprising a second metal over the dielectric layer. The second metal is a different type of metal than the first metal. Each of the second metal segments contacts one of the first contact region of the first metal segments through one of the plurality of deep openings and contacts one of the second contact region of the first metal segments through one of the plurality of shallow openings. The plurality of thermocouples is formed within a building component.

Abstract: A nanophononic metamaterial-based thermoelectric energy conversion device and processes for fabricating a nanophononic metamaterial-based thermoelectric energy conversion device is provided. In one implementation, for example, a nanophononic metamaterial-based thermoelectric energy conversion device includes a first conductive pad, a second conductive pad, and a plurality of strip units. In one implementation, the first conductive pad is coupled to a first connection of the thermoelectric energy conversion device, and the second conductive pad is coupled to a second connection of the thermoelectric energy conversion device. The plurality of strip units are connected in series between the first and second conductive pads and provide a parallel heat transfer pathway. The strip units include a nanostructure design comprising a nanophononic metamaterial.

Abstract: A thermoelectric power-generation device includes: a first flow path through which a high-temperature medium flows; a second flow path through which a low-temperature medium that has a temperature difference with respect to the high-temperature medium flows; an insulating isolation plate configured to isolate the first flow path from the second flow path; insulating outer layer isolation plates provided at outermost portions of layered flow paths including the first flow path and the second flow path; a plurality of thermoelectric conversion units configured to generate power using the temperature difference; and electrodes provided at the outer layer isolation plates and configured to connect the thermoelectric conversion units with mutually different semiconductor polarities in series, and the thermoelectric conversion units are disposed so as to straddle the first flow path and the second flow path.

Abstract: Exemplary thermoelectric devices and methods are disclosed herein. Thermoelectric generator performance is increased by the shaping isothermal fields within the bulk of a thermoelectric pellet, resulting in an increase in power output of a thermoelectric generator module. In one embodiment, a thermoelectric device includes a pellet comprising a semiconductor material, a first metal layer surrounding a first portion of the pellet, and a second metal layer surrounding a second portion of the pellet. The first and second metal layers are configured proximate to one another about a perimeter of the pellet. The pellet is exposed at the perimeter. And the perimeter is configured at a sidewall height about the pellet to provide a non-linear effect on a power output of the thermoelectric device by modifying an isotherm surface curvature within the pellet. The device also includes a metal container thermally and electrically bonded to the pellet.

Abstract: A loop heat pipe includes a reservoir, an evaporator adjacent to the reservoir, and a condenser including a condenser inlet and a condenser outlet. The loop heat pipe further includes a vapor transport line connecting the evaporator to the condenser inlet, a liquid transport line connecting the condenser outlet to the evaporator, and a vapor bypass joining the vapor transport line near the condenser inlet and joining the liquid transport line near the condenser outlet. The vapor bypass includes a vapor bypass housing. The vapor bypass housing includes a temperature. The loop heat pipe also includes a thermally-controlled connection between the vapor bypass housing and the condenser, and a thermal controller connected to the thermally-controlled connection and regulating the temperature of the vapor bypass housing via the thermally-controlled connection.

Abstract: A tablet cooling device includes a copper plate, having a fan mounted on the coper plate to direct airflow; a heat sink secured directly under the fan; a thermal control board to control and regulate the fan and heat sink; and a peltier cooler secured underneath the heat sink; a sub cooling plate, having a circulation channel embedded in the sub cooling plate; a liquid mixture is circulated through the circulation channel; a power source; the thermal control board detects temperature to maintain a predetermined temperature range via active and passive cooling.

Abstract: A multi-stage cascaded thermoelectrical cooler (TEC) package is used in conjunction with an air cooling system to control temperature of battery cells in a battery module such that the temperature differences stay within a predetermined range. Battery cells in the battery module are divided into one or more regular sections and one or more TEC enhancing sections. A regular section and a TEC enhancing section can use different types of battery cell holders to assemble the battery cells. TECs in the TEC package are integrated into each enhancing section, where each stage of the TEC package is attached to one or more battery cells in a different region of the enhancing section. A higher stage, which is more powerful in enhancing heat transfer and extracting heat from battery cells, is attached to one or more battery cells in a section closer to the air outlet. The TEC package is powered by a discharging convertor circuit of the battery module.

Abstract: Disclosed is an embodiment is a thermoelectric module comprising: a first thermally conductive plate; a thermoelectric element arranged on the first thermally conductive plate; a second thermally conductive plate arranged on the thermoelectric element; and a cover frame, which is arranged on the first thermally conductive plate, and has an accommodation space such that the thermoelectric element is accommodated in the accommodation space, wherein the thermoelectric element includes: a first substrate; a plurality of thermoelectric legs arranged on the first substrate; a second substrate arranged on the plurality of thermoelectric legs; and electrodes comprising a plurality of first electrodes arranged between the first substrate and the plurality of thermoelectric legs; and a plurality of second electrodes arranged between the second substrate and the plurality of thermoelectric legs, and the cover frame includes: an outer frame arranged to be spaced from the thermoelectric element on the first thermally cond

Abstract: [Object] To provide a thermoelectric generation cell using a safe and inexpensive general-purpose thermoelectric material.

Abstract: The systems and methods described herein relate to remote cooling. More particularly, the systems described herein include a side to be cooled coupled to an object to be cooled, and a side where heat is dissipated at a distant location. The side to be cooled includes a thermodynamic energy converter and a coil that is electrically coupled to the thermodynamic energy converter. The side where heat is dissipated includes a coil configured to inductively couple with the coil of the side to be cooled. The side where heat is dissipated also includes a heating element electrically coupled to the second coil. The heating element is configured to convert electrical energy into thermal energy. The thermodynamic energy converter absorbs thermal energy from the object to be cooled and converts, directly or indirectly, the thermal energy into electrical energy.

Abstract: Provided is a refrigerator. The refrigerator includes: a cabinet forming a storage chamber therein and including a cooling module mounting portion, a cabinet sealing portion formed on an outer surface of the cooling module mounting portion; a cooling module detachably mounted to the cooling module mounting portion and including an evaporator, a condenser, and a compressor, wherein the cooling module includes a module housing, and the module housing includes a module sealing portion facing the cabinet sealing portion, and the module sealing portion includes a module inclination portion positioned at an inclination with respect to a direction in which the cooling module is insertable into the cabinet to be mounted to the cabinet; and a sealing member positioned between the cabinet sealing portion and the module sealing portion.

Abstract: A thermoelectric module includes a flexible film with an insulation characteristic, the film having a shape that is longer in a lengthwise direction than in a width direction, a plurality of n-type thermoelectric elements and a plurality of p-type thermoelectric elements alternately arranged on one surface of the film in the lengthwise direction of the film, and first electrodes and second electrodes that alternately connect the plurality of n-type thermoelectric elements and the plurality of p-type thermoelectric elements at one side and an opposite side with respect to the width direction of the film to electrically connect the plurality of n-type thermoelectric elements and the plurality of p-type thermoelectric elements in series. One lateral end and an opposite lateral end of the film are bent with the plurality of n-type thermoelectric elements, the plurality of p-type thermoelectric elements, the first electrodes, and the second electrodes attached to the film.

Abstract: A plate-shaped thermoelectric conversion material having a first main surface and a second main surface on the opposite side of the first main surface is formed of semiconductor grains that are in contact with one another. The semiconductor grains each include a particle composed of a semiconductor containing an amorphous phase, and an oxidized layer covering the particle. The distance between the first main surface and the second main surface exceeds 0.5 mm.

Abstract: A heat conversion device according to an embodiment of the present invention comprises: a plurality of P-type thermoelectric legs and a plurality of N-type thermoelectric legs which are electrically connected and arranged in an array; an insulating part disposed on one surface of the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs; a heat sink disposed on the insulating part; a fan disposed spaced a predetermined distance from the heat sink; and a plurality of fastening members having moduli of elasticity of 1*103 kgf/cm2 to 30*103 kgf/cm2 and fixing the heat sink and the fan.

Abstract: Systems and methods for light based heating of light absorbing sources for modification of nucleic acids through fast thermal cycling of polymerase chain reaction are provided. The system includes a polymeric fluidic device comprising one or more reaction wells. A first light absorbing material is disposed on a first support to define a reaction well and first and second ports are coupled to the reaction wells. The first and second ports are configured to allow input of a fluidic sample into the reaction well. A lyophilized reagent is pre-loaded in the reaction well. A light source is configured to illuminate the first light absorbing material. A first portion of light illuminated onto the first light absorbing material is absorbed into the first light absorbing material and is configured to elevate the temperature of the first light absorbing material to heat the fluidic sample within the reaction well.

Abstract: A method of fabricating a thermoelectric device includes providing a thermoelectric device having a thermally conductive first plate, a thermally conductive second plate, and a plurality of thermoelectric elements in a region bounded by and including the first plate and the second plate. The plurality of thermoelectric elements is in thermal communication with the first plate and the second plate. The method further includes forming a polymeric coating in the region on at least one surface of the first plate, at least one surface of the second plate, and at least one surface of the plurality of thermoelectric elements.

Abstract: A superconductor thermal filter is disclosed that includes a normal metal layer having a first side, an insulating layer overlying the first side of the normal metal layer, and a multilayer superconductor structure having a first side overlying a side of the insulating layer opposite the side that overlies the normal metal layer. The multilayer superconductor structure is comprised of a plurality of superconductor layers with each superconductor layer having a smaller superconducting energy band gap than the preceding superconductor as the superconductor layers extend away from the normal metal layer. The thermal filter further includes a normal metal layer quasiparticle trap having a first side and a second side with the first side being disposed on a second side of the multilayer superconductor. A bias voltage is applied between the normal metal layer and the normal metal layer quasiparticle trap to remove hot electrons from the normal metal layer.

Abstract: The invention relates to the field of thermoelectric compositions and devices. Thermoelectric compositions comprise thermoelectric material in a flexible membrane that comprises structural material and voids. Thermoelectric subassemblies comprise thermoelectric material and electrical contact material along and on and surrounding structural material of the flexible membrane. Thermoelectric subassemblies can comprise thermoelectric elements positioned end-to-end in a flexible membrane that can be bent and positioned in a housing that can be adapted to accommodate various types of thermoelectric devices. Methods for making and using thermoelectric compositions, subassemblies, and devices are described.

Abstract: A body force per unit mass acting on mobile charge carriers within a first electrically conducting material is configured to induce at least one region of accumulation of charge within at least a portion of the first material. The magnitude of the associated change in the voltage between two given points within the first material is a function of the relevant electrical properties of the material. A second electrically conducting material can be electrically coupled to the first material via a first electrical contact. The relevant electrical properties of the second material can be configured to be different to the relevant electrical properties of the first material. The voltage difference between the two points in the first material can be different to the voltage difference between two equivalent points in the second material.

Abstract: An optical spectrometer module for analysing samples. The optical spectrometer module comprises two or more sample holders. Each sample holder is adapted to receive and reproducibly position a sample in fixed locations within the optical spectrometer module. Each sample holder is also adapted to receive a light beam to thereby enable a sample contained in the sample holder to be exposed to the received light beam. Each sample holder is further adapted to enable light transmitted through the sample holder to exit the sample holder. The optical spectrometer module also comprises two or more electro-thermal components. Each electro-thermal component is thermally coupled to a respective sample holder to control the temperature of the sample holder.

Abstract: Provided is a thermoelectric conversion module having a high heat resistance. The thermoelectric conversion module includes a first substrate, a second substrate, a thermoelectric element, and a bonding layer. The first substrate includes a first metalized layer. The second substrate includes a second metalized layer which faces the first metalized layer. The thermoelectric element includes a chip formed from a thermoelectric material and is arranged between the first metalized layer and the second metalized layer. The bonding layer is composed of a sintered body of a metallic material of which the average crystal particle diameter is no greater than 20 ?m and bonds the first metalized layer and the second metalized layer with the thermoelectric element.

Abstract: A refrigerator includes a storage space, an evaporator located inside of the storage space, a grille panel assembly that partitions the storage space to separate an evaporator space, a cryogenic freezing compartment that defines an insulation space within the storage space that maintains a temperature of the insulation space less than a temperature of the storage space, and a thermoelectric module assembly located at the grille panel and configured to supply cold air to the cryogenic freezing compartment. The thermoelectric module assembly includes a thermoelectric module having a heat absorption surface and a heat generation surface, a cold sink configured to contact the heat absorption surface and located in the cryogenic freezing compartment, a heat sink configured to contact the heat generation surface and located in the evaporator space, and an insulation frame that receives the thermoelectric module and that thermally insulates the cold sink from the heat sink.

Abstract: Disclosed embodiments include thermoelectric-based thermal management systems and methods configured to heat and/or cool an electrical device. Thermal management systems can include at least one electrical conductor in electrical and thermal communication with a temperature-sensitive region of the electrical device and at least one thermoelectric device in thermal communication with the at least one electrical conductor. Electric power can be directed to the thermoelectric device by the same electrical conductor or an external power supply, causing the thermoelectric device to provide controlled heating and/or cooling to the electrical device via the at least one electrical conductor. The thermoelectric management system can be integrated with the management system of the electrical device on a printed circuit substrate.

Abstract: A thermoelectric generator includes a tube in which a first fluid flows, a power generation module, a holding member, and a heat exchanging fin. The power generation module includes a thermoelectric conversion element. The holding member holds a stacked body in which the power generation module and the tube are stacked with each other such that heat can be transferred between the power generation module and the tube. Both end portions of the holding member are located and fixed outside both ends of the stacked body. The heat exchanging fin includes a pair of end fin portions provided on the reverse surface of the holding member at portions corresponding to the both ends of the stacked body, and an intermediate fin located between the pair of end fin portions and higher in stiffness than the pair of end fin portions.

Abstract: A vehicle system includes a vehicle component, a battery, and a thermoelectric module coupled to the component to allow heat transfer between the catalytic converter and the thermoelectric module, wherein the thermoelectric module is electrically connected to the battery. The vehicle system further includes a temperature sensor coupled to the vehicle component. The temperature sensor is configured to measure the temperature of the vehicle component. The vehicle system further includes a controller in electronic communication with the thermoelectric module. The controller is programmed to switch the thermoelectric module among the heating mode, the cooling mode, and the power-generation mode based on the temperature of the vehicle component. The vehicle component may be an exhaust manifold, a turbocharger turbine housing, an exhaust gas conduit coupled between an exhaust manifold and a catalytic converter, and/or a catalytic converter.

Abstract: A thermoelectric element, particularly for a thermoelectric converter, includes an assembly of constituent layers comprising a central layer made of p- or n-type thermoelectric material, then, in an assembly direction, and on each side of said central layer, an intermediate layer forming a diffusion barrier followed by a buffer layer made of composite metal material. The buffer layers are intended to be secured to metal electrodes, characterized in that the cumulative thickness of the two buffer layers is greater than or equal to 50% of the thickness of the central layer, and preferably greater than or equal to 100% of the thickness of the central layer and very preferably greater than or equal to 200% of the thickness of the central layer, and in that the constituent material of the buffer layers is an alloy of two metals chosen from the family: TixAg1-x, VxFe1-x, VxAg1-x, TixFe1-x, where 0<x<1.

Abstract: A grasping element is provided including a manual actuator associated with a thermoelectric module, and an optional device powered by the thermoelectric module upon manipulation of the manual actuator. The thermoelectric module can generate electricity via a thermal gradient generated by a user's body. The electricity can power the optional device directly and/or indirectly.

Abstract: A thermoelectric heating/cooling device may include first and second thermally conductive headers. A plurality of thermoelectric elements thermally may be coupled in parallel between the first and second thermally conductive headers. In addition, a resistive heating element may be provided on the second header, and the second header may be between the resistive heating element and the plurality of thermoelectric elements.

Abstract: A method is provided for producing an electrically-powered device and/or component that is embeddable in a solid structural component, and a system, a produced device and/or a produced component is provided. The produced electrically powered device includes an attached autonomous electrical power source in a form of a unique, environmentally-friendly structure configured to transform thermal energy at any temperature above absolute zero to an electric potential without any external stimulus including physical movement or deformation energy. The autonomous electrical power source component provides a mechanism for generating renewable energy as primary power for the electrically-powered device and/or component once an integrated structure including the device and/or component is deployed in an environment that restricts future access to the electrical power source for servicing, recharge, replacement, replenishment or the like.