Abstract: An embodiment of a process for realizing a system for recovering heat is described, the process comprising the steps of: formation on a substrate of a plurality of L-shaped down metal structures; deposition of a dielectric layer on the substrate and the plurality of L-shaped down metal structures by using a screen printing approach; definition and opening in the dielectric layer of upper contacts and lower contacts of the L-shaped down metal structures; formation of a plurality of L-shaped up metal structures being connected to the plurality of L-shaped down metal structure in correspondence of the upper and lower contacts so as to form a plurality of serially connected thermocouples, each comprising at least one L-shaped down metal structure and at least one L-shaped up metal structure, being made of different metal materials and interconnected at a junction, the serially connected thermocouples thus realizing the system for recovering heat.

Abstract: Disclosed are apparatus and methodology for constructing thermoelectric devices (TEDs). N-type elements are paired with P-type elements in an array of pairs between substrates. The paired elements are electrically connected in series by various techniques including brazing for hot side and/or also cold side connections, and soldering for cold side connections while being thermally connected in parallel. In selected embodiments, electrical and mechanical connections of the elements may be made solely by mechanical pressure.

Abstract: A semiconductor chip includes a semiconductor circuit layer and a semiconductor thermoelectric layer disposed on a substrate. The circuit layer includes a first circuit and a second circuit disposed horizontally in a first direction. The thermoelectric layer includes a first on-die thermoelectric element, where the thermoelectric layer is disposed on the circuit layer including the first circuit and the second circuit. The first on-die thermoelectric element is configured to distribute heat generated at the first circuit horizontally in the first direction toward the second circuit.

Abstract: A thermoelectric module may include a fluid-tight housing having at least one thermoelectrically active element arranged therein. The at least one thermoelectrically active element may have a coating. The housing may form an outer encapsulation and the coating may form an inner encapsulation for the at least one thermoelectrically active element.

Abstract: Systems and methods for mitigating heat rejection limitations of a thermoelectric module are disclosed. In some embodiments, a method of operating a thermoelectric module includes providing a first amount of power to the thermoelectric module and determining that a temperature of a hot side of the thermoelectric module is above a first threshold. The method also includes, in response to determining that the temperature of the hot side is above the first threshold, providing a second amount of power to the thermoelectric module that is less than the first amount of power. The method also includes determining that the temperature of the hot side of the thermoelectric module is below a second threshold and providing a third amount of power to the thermoelectric module. In some embodiments, this mitigates heat rejection limitations of the thermoelectric module, especially when the hot side of the thermoelectric module is passively cooled.

Abstract: The present document describes an apparatus for recovering heat from an electronic component to generate electric energy. The apparatus comprises a thermoelectric generator having a cold side and a hot side, the hot side being in thermal communication with the electronic component. The apparatus further comprises a heat dissipation device in thermal communication with the cold side of the thermoelectric generator for dissipate heat it receives, and a heat transfer device with a thermal conductivity greater than 200 W(m·K) for directly transferring the heat from the electronic component to the heat dissipation device.

Abstract: A power supply circuit includes a thermoelectric conversion element configured to generate electric power when it is differentially heated, an adjustable current circuit configured to draw a current from the thermoelectric conversion element and resultantly output a constant current over a period of time, a voltage conversion circuit configured to output a voltage based on the current output by the adjustable current circuit, and a control circuit configured to control the adjustable current circuit to change a target value of the constant current output by the adjustable current circuit.

Abstract: An electronic module includes a first base layer and at least one via. The first base layer has a first surface and a second surface opposite the first surface, and defines at least one first hole. The first base layer includes a first metal. The via is disposed in the first hole of the first base layer. The via includes a thermoelectric material. A value of Z×T for the thermoelectric material is greater than a value of Z×T for the first metal, wherein Z is a thermoelectric figure of merit, T is temperature (in K), and the value of Z×T for the thermoelectric material is greater than 0.5.

Abstract: A honeycomb sandwich structure includes a main body portion having a first skin material, a second skin material, and a honeycomb core sandwiched between the first skin material and the second skin material, and a thermoelectric conversion module that generates power using a temperature difference between a high temperature side module front surface and a low temperature side module rear surface. The thermoelectric conversion module is embedded in a main body portion such that at least one of the module front surface and the module rear surface is in a state being exposed from the main body portion, and as a result, a temperature difference is generated between the module front surface and the module rear surface.

Abstract: Method of wireless communication between a first device and a second device, in which, the first device and the second device comprising respectively a first thermoelectric generator and a second thermoelectric generator, the two thermoelectric generators being in thermal coupling, a first signal is generated within the first device, the first thermoelectric generator is electrically powered as a function of the first signal so as to create a first thermal gradient in the said first generator and a second thermal gradient in the second generator, and a second signal is generated within the second device on the basis of the electrical energy produced by the second thermoelectric generator in response to the said second thermal gradient.

Abstract: An organic electroluminescence (EL) element including an anode, a light-emitting layer above the anode, a first functional layer on and in contact with the light-emitting layer, a second functional layer on and in contact with the first functional layer, and a cathode above the second functional layer. A lowest unoccupied molecular orbital (LUMO) level of the first functional layer is lower than at least one of a LUMO level of the second functional layer and a Fermi level of a metal material included in the second functional layer.

Abstract: One embodiment of a method for producing a plurality of nanostructures embedded in a host comprising the steps of: assembling a first preform, drawing said first preform into a first fiber, cutting said first fiber into a plurality of pieces, assembling said pieces of said first fiber into a second preform, and drawing said second preform into a second fiber. The host is made of a low thermal conductivity material such as a polymer or combination of polymers. The host can assume the form of a plurality of nanotubes which further reduces the host's thermal conductivity due to enhanced phonon scattering. The host can exhibit anisotropic thermal conductivity which reduces its thermal conductivity perpendicular to the direction in which it was drawn. The nanostructure-host composite can be cut into pieces and assembled into efficient thermoelectric devices for use in cooling or electric power generation applications. Other embodiments are described and shown.

Abstract: In order to further improve the spin-current/electric-current conversion efficiency in a spin-current thermoelectric conversion element, a thermoelectric conversion element includes a magnetic material layer having in-plane magnetization; and an electromotive material layer magnetically coupled with the magnetic material layer. The electromotive material layer includes a first conductor with a spin orbit coupling arising, and a second conductor having lower electric conductivity than electric conductivity of the first conductor.

Abstract: A thermoelectric material includes a plurality of first semiconductor members having first band gap energy and a second semiconductor member having second band gap energy higher than the first band gap energy. The first semiconductor member and the second semiconductor member are alternately arranged in a direction of carrier transport. The first semiconductor member has a width in the direction of carrier transport not greater than 5 nm and a distance between two adjacent first semiconductor members in the direction of carrier transport is not greater than 3 nm.

Abstract: A thermoelectric module includes a pair of support substrates having mutually opposed regions; wiring conductors each disposed on one principal surfaces of the pair of support substrates, the one principal surfaces being opposed to each other; a plurality of thermoelectric elements disposed between the one principal surfaces; a lead member joined to one wiring conductor disposed on one support substrate; and a cover material which covers a junction where the lead member is joined to the one wiring conductor disposed on the one support substrate. The one support substrate has a first protruding portion including the junction, and the other support substrate has a second protruding portion located so as not to overlap the junction as seen in a direction perpendicular to the one principal surface. The cover material is joined to the first protruding portion and the second protruding portion.

Abstract: A thermoelectric power module which can be manufactured without spoiling solderability or joining strength when a thermoelectric element and an electrode are joined to each other by using solder, and in which electric resistance does not largely increase in long time use.

Abstract: Managing temperature of a semiconductor device having a temperature inverted processor core and stacked memory by operation of an integrated thermoelectric cooler. The thermoelectric cooler is operated to pump heat from a stacked memory device that requires a cool operating temperature to a temperature inverted processor core that maintains a higher operating temperature until threshold operating temperatures are achieved.

Abstract: A natural heat energy conversion and storage device includes: a heat energy transmission system, an energy conversion system, and an energy storage unit. The heat energy transmission system is used for performing large-scale collection of heat energy through an energy absorption and expansion unit, and transferring the heat energy to a heated end of a heat pipe, which can be superconducting. The heat pipe transfers the heat energy to an energy conversion unit where the heat energy can be converted into electric energy. The energy conversion unit is used for converting the heat energy collected by the heat energy transmission system into electric energy, and storing the generated electric energy into the energy storage unit. The number of modules of the energy conversion unit is at least one. The energy storage unit is used for storing the electric energy obtained through conversion by the energy conversion unit.

Abstract: A charging/discharging apparatus utilizing the thermoelectric conversion effect includes a thermoelectric conversion module, a current path providing unit and a charging/discharging element. The thermoelectric conversion module is disposed between an upper cover and a lower cover of a wearable device. The thermoelectric conversion module generates a current according to a temperature difference between the upper cover and the lower cover. The current path providing unit coupling with the thermoelectric conversion module provides a first current path and a second current path. The charging/discharging element couples with the current path providing unit. When a temperature of the lower cover is higher than a temperature of the upper cover, the current charges the charging/discharging element through the first current path. When a temperature of the upper cover is higher than a temperature of the lower cover, the current charges the charging/discharging element through the second current path.

Abstract: An assembly comprising a sample block, a heat sink and at least one electrodeposited thermoelectric element is disclosed. Further, an instrument and a method for performing a temperature-dependent reaction are disclosed.

Abstract: A cooling and heating apparatus for a vehicle cup holder is provided that has an improved performance for cooling and heating a drink by directly cooling or heating the drink in the cup. The apparatus includes a cup having a thermoelectric module and a first electroconductive part on an outer surface thereof and a cup holder that has a heat dissipating member and a second electroconductive part. Additionally, a controller is connected to the thermoelectric module to realize an electrical closed circuit and is configured to adjust an amount of an electric current applied to the thermoelectric module based on a desired temperature to heat or cool a drink in the cup.

Abstract: A detection device for infrared radiation has a detection circuit of infrared radiation equipped with at least one photodetector. A readout circuit is electrically connected to the detection circuit, and is configured to process the signal emitted by the detection circuit. A Joule-Thomson cooler cools a cold table thermally and mechanically connected to the detection circuit and the readout circuit. The cold table including an internal cavity supplied with gaseous mixture. A relief port of the gas mixture is arranged at an input in the internal cavity. An output of the compressor feeds the relief port in a gaseous mixture. The input of the compressor receives the relaxed gaseous mixture from an output of the internal cavity.

Abstract: A power heat dissipation device includes a heat-conducting layer, a heat sink and at least one cooling chip. The heat-conducting layer has a heat-absorbing surface and a heat-dissipating surface. The heat sink is in thermal contact with the heat-dissipating surface, and a heat-conducting section is formed in the heat sink. The cooling chip is embedded in the heat sink and disposed adjacent to the heat transferring channel. The cooling chip has a cooling surface which is perpendicular to the heat-absorbing surface. The cooling surface faces the heat transferring channel. The cooling chip removes heat from the heat-conducting section in the heat sink.

Abstract: A method and/or apparatus of energy harvesting for wearable technology through a thin flexible thermoelectric device is disclosed. A lower conduction layer is deposited onto a lower dielectric layer. An active layer, comprising at least one thin film thermoelectric conduit and a thermal insulator, is above the lower conduction layer. An internal dielectric layer is deposited above the active layer, and conduit holes are drilled above each thermoelectric conduit. An upper conduction layer and upper dielectric layer are deposited, connecting the thermoelectric conduits in series. The resulting flexible thermoelectric device generates a voltage when exposed to a temperature gradient.

Abstract: A vehicle may include a battery and an antenna assembly mounted on the vehicle. The antenna assembly may be mounted on the roof of the vehicle. The antenna assembly may include a cooling arrangement electrically connected with the battery, a pair of thermally conductive plates, and a semiconductor sandwiched between the plates, electrically connected with the battery, and configured to, in response to a temperature difference between the plates, generate a current for the battery. A photovoltaic generator may be electrically connected with the battery to increase electrical generation.

Abstract: A thermoelectric device has a foam substrate, thermoelectric elements and metallic foil strip assemblies. The foam substrate has apertures therein. The thermoelectric elements are inserted into the apertures. The metallic foil strip assemblies include upper and lower foil strips. A first end of a first upper foil strip is inserted into a first aperture contacting an upper heat transferring surface of the first thermoelectric element. A second end is inserted into a second aperture contacting an upper heat transferring surface of a second thermoelectric element with an elongated portion of the metallic foil strip assembly extending between the first aperture and the second aperture along the upper surface. A first end of a second upper foil strip is inserted into the second aperture contacting the upper heat transferring surface of the second thermoelectric element and a second end is similarly inserted into a third aperture.

Abstract: An active temperature controlled container is configured to be portable so as to safely transport temperature sensitive and perishable goods (such as biological material): within a vessel that is thermally coupled to a thermoelectric assembly disposed within the container, where the thermoelectric assembly is powered by a battery. The battery is secured within a compartment in an outer portion of the housing of the container in a way that the battery may be removed to be recharged, inspected, swapped out for another battery or power source, or the like.

Abstract: Sensor including a substrate, an assembly of thermoelectric layers including at least one first and one second junction of a thermocouple, at least one first and one second connection pads arranged to transfer heat respectively to each first and each second junction, a support member (2) of the substrate (3) intended to be connected to the hot source (Sc) and to the cold source (Sf), first and second metal connectors arranged to electrically connect the support member (2) respectively to each first and each second connection pad, the support member (2) including a thermal conductor configured to transfer heat from the hot source (Sc) to the first metal connector, and to transfer heat from the second metal connector to the cold source (Sf).

Abstract: A heat radiation-thermoelectric fin includes a thermoelectric inorganic material on a heterogeneous laminate of graphene. The heterogeneous laminate may be tube-shaped or plate-shaped, and a metal conductor may be coupled to one or more of the heterogeneous laminate. A thermoelectric module may be formed to include the fin, and a thermoelectric apparatus may include a heat supplier connected to the thermoelectric module.

Abstract: A method is provided for producing an electrically-powered device and/or component that is embeddable in a solid structural component, and a system, a produced device and/or a produced component is provided. The produced electrically powered device includes an attached autonomous electrical power source in a form of a unique, environmentally-friendly structure configured to transform thermal energy at any temperature above absolute zero to an electric potential without any external stimulus including physical movement or deformation energy. The autonomous electrical power source component provides a mechanism for generating renewable energy as primary power for the electrically-powered device and/or component once an integrated structure including the device and/or component is deployed in an environment that restricts future access to the electrical power source for servicing, recharge, replacement, replenishment or the like.

Abstract: A method for detecting a fault in a thermoelectric device (102), the method comprising: applying a voltage across the thermoelectric device (102); ceasing to apply the voltage to the thermoelectric device (102) after a predefined period of time; measuring a Seebeck voltage Vs across the thermoelectric device (102); comparing Vs to a first threshold voltage VT; and creating a record of a fault if Vs is below VT.

Abstract: In various embodiments, a chip package is provided. The chip package may include a chip including a chip metal surface, a metal contact structure electrically contacting the chip metal surface, and packaging material including a contact layer being in physical contact with the chip metal surface and/or with the metal contact structure; wherein at least in the contact layer of the packaging material, a summed concentration of chemically reactive sulfur, chemically reactive selenium and chemically reactive tellurium is less than 10 atomic parts per million.

Abstract: A thermoelectric element includes a p-type/n-type semiconductor element having an upper end surface and a lower end surface, a lower electrode that is joined to the lower end surface of the p-type/n-type semiconductor element to connect the p-type/n-type semiconductor element and another n-type/p-type semiconductor element adjacently thereto and has an area less than that of the lower end surface in a joint region therebetween. A joint portion is made of a solder and has a surface joint part joining the lower end surface of the p-type/n-type semiconductor element and a surface of the lower electrode while the lower end surface of the p-type/n-type semiconductor element and the surface of the lower electrode are opposed to each other A fillet part is formed to fill a space produced between intersecting surfaces, i.e., the lower end surface and a lateral side of the lower electrode, and composes a step part formed by the lower end surface and the lower electrode.

Abstract: A method for producing an electrically-powered device and/or component that is embeddable in a solid structural component is provided. The electrically powered device includes an attached autonomous electrical power source in a form of a unique, environmentally-friendly structure that is configured to transform thermal energy at any temperature above absolute zero to an electric potential without any external stimulus including physical movement or deformation energy. The autonomous electrical power source component provides a mechanism for generating renewable energy as primary for the electrically-powered device and/or component once an integrated structure including the electrically-powered device is deployed in an environment that restricts future access to the electrical power source for servicing, recharge, replacement, replenishment or the like.

Abstract: The thermoelectric conversion module includes a porous insulating film having an insulation property and a thermoelectric conversion element in a thin film shape formed on a first surface of the insulating film, the first surface includes a surface inclined to a second surface positioned on an opposite side of the first surface, and a density of the insulating film increases as a distance between the first surface and the second surface decreases.

Abstract: An active temperature controlled container is configured to be portable so as to safely transport temperature sensitive and perishable goods (such as biological material): within a vessel that is thermally coupled to a thermoelectric assembly disposed within the container, where the thermoelectric assembly is powered by a battery. The battery is secured within a compartment in an outer portion of the housing of the container in a way that the battery may be removed to be recharged, inspected, swapped out for another battery or power source, or the like.

Abstract: Described herein are systems and methods for cryogenic fluid delivery to achieve the lowest reasonable saturation pressure while dispensing a cryogenic fluid such as liquefied natural gas to a holding tank on a use device. The systems and methods utilize a liquid nitrogen component and a liquefaction engine, very cold liquefied natural gas and a liquefaction engine, or a combination of both very cold liquefied natural gas and a liquid nitrogen component to deliver LNG to a holding tank on a use device.

Abstract: The invention relates to a thermoelectric module, having an electric insulation, an electric conductor path, one surface of the electric conductor path being attached to a surface of the electrical insulation, and a thermoelectric material, one surface of the thermoelectric material being attached to another surface of the conductor path.

Abstract: The invention is directed to an energy efficient thermoelectric heat pump assembly. The thermoelectric heat pump assembly preferably comprises two to nine thermoelectric unit layers capable of active use of the Peltier effect; and at least one capacitance spacer block suitable for storing heat and providing a delayed thermal reaction time of the assembly. The capacitance spacer block is thermally connected between the thermoelectric unit layers. The present invention further relates to a thermoelectric transport and storage devices for transporting or storing temperature sensitive goods, for example, vaccines, chemicals, biologicals, and other temperature sensitive goods. Preferably the transport or storage devices are configured and provide on-board energy storage for sustaining, for multiple days, at a constant-temperature, with an acceptable temperature variation band.

Abstract: An electronic apparatus includes a first thermoelectric converter that converts thermal energy dissipated from a heat source into electrical energy, a second thermoelectric converter provided on a side of a low-temperature portion of the first thermoelectric converter and that converts electrical energy into thermal energy, and a power supply controller that controls supply of power to the second thermoelectric converter such that the low-temperature portion of the first thermoelectric converter is cooled or heated.

Abstract: Example dryers and washer-dryers having a closed process air circuit having a drum, a condenser downstream from the drum for dehumidifying warm moist air, and a thermoelectric device having a cold side arranged in the process air circuit downstream from the drum are disclosed. Example thermoelectric devices have a warm side cooled by a fluid which is circulated in a liquid/air heat exchanger arranged in the process air circuit downstream from the condenser. Using the disclosed architectures, appliance design can be simplified without decreasing overall system performance.

Abstract: A thermoelectric conversion module is disclosed that corrects the difference in thermal resistance between a P-type thermoelectric conversion member and an N-type thermoelectric conversion member. In this thermoelectric conversion module, since insulators included in the P-type thermoelectric conversion member and the N-type thermoelectric conversion member have a different thermal resistance, it is possible to correct the difference in thermal resistance between the P-type thermoelectric conversion element and the N-type thermoelectric conversion element.

Abstract: A thermoelectric module includes a low temperature-side wiring line, a high temperature-side wiring line, a low temperature-side member, a plurality of low temperature-side thermoelectric conversion elements made of a BiTe-based material, a high temperature-side member, a plurality of high temperature-side thermoelectric conversion elements made of a material different from the BiTe-based material, an insulating member, a radiant heat blocking plate, a low temperature-side electrode, and a high temperature-side electrode. The radiant heat blocking plate is arranged on the side of the high temperature-side member with respect to the low temperature-side wiring line and the high temperature-side wiring line. A thermoelectric module that can restrain burning of wiring lines, as well as a thermoelectric power generating apparatus and a thermoelectric generator including the same can thereby be obtained.

Abstract: A thermoelectric device includes a semiconductor stacked thermoelectric thin film including a first high-purity layer composed of SiGe as a main material and a composite carrier supply layer formed on the first high-purity layer. The composite carrier supply layer includes a second high-purity layer and third high-purity layer composed of Si as a main material, and a carrier supply layer held between the second and third high-purity layers and composed of SiGe as a main material. The carrier supply layer is a P-type carrier supply layer to which an additive of a group XIII element is added or a N-type carrier supply layer to which an additive of a group XV element is added.

Abstract: The present disclosure relates to bonding structures useful in semiconductor packages. In an embodiment, a semiconductor device includes a semiconductor element, two pillar structures, and an insulation layer. The semiconductor element has a surface and includes at least one bonding pad disposed adjacent to the surface. The two pillar structures are disposed on a single bonding pad. The insulation layer is disposed adjacent to the surface of the semiconductor element. The insulation layer defines an opening, the opening exposes a portion of the single bonding pad, and the two pillar structures are disposed in the opening.

Abstract: The thermoelectric device includes a first set of identical unitary thereto-electric systems, each system including at least one thermocouple and the first set has at least one faulty unitary thermoelectric system. It further has devices for detecting functional unitary thermoelectric systems of the first set of unitary thermoelectric systems, and devices designed to electrically connect a second set of functional unitary thermoelectric systems chosen from the first set of unitary thermoelectric systems, in the form of an electric circuit, so that all the unitary thermoelectric systems of the electric circuit have the same current flowing through them.

Abstract: The present invention is directed to a thermoelectric device that includes a plurality of thermoelectric couples positioned between a top plate and a bottom plate, wherein each thermoelectric couple comprises n-type and p-type element assemblies electrically connected in series and thermally connected in parallel. When the device is used for electrical power generation, the efficiency is increased by using semiconductor materials with a high Seebeck coefficient, increasing the distance between the n-type and p-type element assemblies, increasing the length of the electrical conductors/thermal distance between the top and bottom plates, and/or using an insulation plate spaced from the top plate. When the device is used for heating/cooling, the coefficients of performance are increased by using semiconductor materials with a high Seebeck coefficient and/or optimizing the length of the electrical conductors/thermal distance between the top and bottom plates.

Abstract: A method of manufacturing a thin-film thermo-electric generator includes the steps of: forming two or more PN junctions each having a three-layer structure; forming a substrate which has a first side and an opposed second side; coupling the PN junctions at the first side of the substrate to define a first group of PN junctions at the first side of the substrate; and providing two electrodes that one of the electrodes is extracted from the first group of PN junctions. Accordingly, each of the PN junctions is formed by depositing an insulating thin-film layer between a P-type thermo-electric thin-film layer and a N-type thermo-electric thin-film layer.

Abstract: A liquid crystal display panel poor alignment repairing apparatus includes: a shell including an accommodation space which includes a separate first chamber and a separate second chamber; and a temperature control device, which is to control temperatures in the first chamber and the second chamber in such a manner of heating a to-be-repaired liquid crystal display panel in the first chamber and simultaneously cooling a to-be-repaired liquid crystal display panel in the second chamber.

Abstract: A copper nanorod thermal interface material (TIM) is described. The copper nanorod TIM includes a plurality of copper nanorods having a first end thermally coupled with a first surface, and a second end extending toward a second surface. A plurality of copper nanorod branches are formed on the second end. The copper nanorod branches are metallurgically bonded to a second surface. The first surface may be the back side of a die. The second surface may be a heat spread or a second die. The TIM may include a matrix material surrounding the copper nanorods. In an embodiment, the copper nanorods are formed in clusters.