Abstract: The present invention provides a thermoelectric conversion device having high thermoelectric conversion performance. In this device, electrodes are arranged so that electric current flows in an interlayer direction of a layered substance, unlike the arrangements derived from common knowledge in the art. In the thermoelectric conversion device according to the present invention, a thermoelectric-conversion film is obtained through epitaxial growth and formed by arranging an electrically conducting layer and an electrically insulating layer alternately; the electrically conducting layer has an octahedral crystal structure in which a transition metal atom M is positioned at its center and oxygen atoms are positioned at its vertexes; and the electrically insulating layer includes a metal element or a crystalline metal oxide.

Abstract: A thermoelectric module device includes a first substrate having inner and outer surfaces, a second substrate having inner and outer surfaces, a Peltier-junction module sandwiched between the inner surfaces of the first and second substrates, the Peltier-junction module being made up of a series of Peltier junctions including a pair of outermost Peltier junctions, a pair of power supply electrodes connected to the pair of the outermost Peltier junctions, respectively, and a metallization layer provided on the outer surface of the second substrate for being soldered to a package, the metallization layer being divided into spaced first and second portions which correspond to the Peltier-junction module and the pair of power supply electrodes, respectively.

Abstract: A thermoelectric unit for a thermoelectric insulated container. The thermoelectric unit is configured to be inserted in a small opening in the insulated container. A cold side heat sink is mounted on the portion of the thermoelectric unit that extends inside of the insulated container, and a hot side heat sink is mounted on a portion of the thermoelectric unit that extends outside. The thermoelectric unit is arranged so that a thermoelectric module for the thermoelectric unit, the cold side heat sink, and the hot side heat sink are aligned linearly. A hot side fan and motor unit is mounted on the outside of the hot side heat sink and a cold side fan and motor unit is mounted on the outside of the cold side heat sink. The hot and cold side fan and motor units may also be mounted linearly with the hot and cold side heat sinks.

Abstract: Preferred electrode devices (10) including a substrate (11) and cathode (13) and anode material (12) coated thereon in discreet locations are described. The cathode materials desirably include multiple layers of thin metal films (14). Preferred cell devices including conductive elements and a solid state source of charged ions for migration into and through the conductive elements are also described.

Abstract: A thermoelectric device and method of manufacturing the device, where thermoelectric elements of opposite conductivity type are located on respective opposing sides of a heat source member. Heat sinks are disposed on opposite sides of the thermoelectric elements. Peltier metal contacts are positioned between the thermoelectric elements and each of the heat source member and heat sinks. A plurality of devices may be arranged together in a thermally parallel, electrically series arrangement, or in a thermally parallel, electrically parallel arrangement. The arrangement of the elements allow the direction of current flow through the pairs of elements to be substantially the same as the direction of current flow through the metal contacts.

Abstract: A nanocomposite having enhanced energy conversion between thermal, electron, phonons, and photons energy states. The composition comprises a synergistic blend of nanoscale powders wherein the powders have nanoscale layered surface modifiers and a conductive medium. The powders and conductive medium are optionally altered through non-thermal modifiers and made into energy conversion devices.

Abstract: Apparatus having a cooling device capable of both power generation using heat from a heat-generating component and cooling of the heat-generating component is provided. The cooling device has a heat-receiving part which receives heat conducted from a CPU, which is an external heat-generating component, a thermoelectric conversion part arranged to absorb heat from the heat-receiving part and having operating modes including a mode of cooling the heat-receiving part by being supplied with a current and a power generation mode of converting heat received from the heat-receiving part into a current and outputting the current, and a selecting part which makes a selection according to a temperature condition of the CPU as to in which one of the modes the thermoelectric conversion part should be operated.

Abstract: A thermoelectric cooling and heating device including a substrate, a plurality of thermoelectric elements arranged on one side of the substrate and configured to perform at least one of selective heating and cooling such that each thermoelectric element includes a thermoelectric material, a Peltier contact contacting the thermoelectric material and forming under electrical current flow at least one of a heated junction and a cooled junction, and electrodes configured to provide current through the thermoelectric material and the Peltier contact. As such, the thermoelectric cooling and heating device selectively biases the thermoelectric elements to provide on one side of the thermolectric device a grid of localized heated or cooled junctions.

Abstract: A self-powered, heat-activated LED exhaust tip assembly (10) that is comprised of three major elements: a cylindrical enclosure (12), a heat conducting sub-assembly (80) and an electronics circuit (130). The sub-assembly (80) consists of an external heat conducting plate (82), and an enclosure-internal heat conductive horizontal structure (110) that is attached to the plate (82) through a heat conductive vertical rod (98). When heated vehicle exhaust gases pass through the enclosure (12), the gases heat the structure (110) and the heat is then transferred to the plate (92) via the rod (98). The heat from the plate (82) is transferred to a peltier device (132) that interfaces with the plate (82). The heated peltier device (132) produces a first d-c voltage (11) that is applied to a DC to DC converter (134), where a second d-c voltage (13) is produced.

Abstract: A thermoelectric generating device has a thermoelectric element which utilizes an exhaust gas from an engine as a high temperature heat source and an engine coolant as a low temperature heat source in order to generate electricity. An introducing passage introduces a part of the exhaust gas passed through the thermoelectric element into an intake of the engine. An introducing valve opens and closes the introducing passage. A controller controls an opening degree of the introducing valve according to a load of the engine.

Abstract: Thermoelectric material is produced through a process sequence including a liquid quenching, a primary solidification such as a hot pressing or extrusion and an upset forging; although the C-planes of the crystal grains are directed in parallel to the direction in which the force is exerted on flakes during the hot pressing/extrusion, the a-axes are randomly directed; the a-axes are oriented in a predetermined direction through the upset forging; this results in improvement of electric resistivity without reduction in the figure of merit.

Abstract: Increasing the output signal from CPP GMR devices by increasing the read current has not previously been considered an option because it would make the device run too hot. This problem has been overcome by using, for the upper and lower leads, materials that differ significantly in their thermoelectric powers. Thus, when DC is passed through the device, from ? to + TEP leads, hot and cold junctions are formed and heat is transferred from the micro-device into the leads, resulting in a net local cooling of the device which enables it to operate at higher power. For a GMR device, this translates to a larger output voltage, making it easier, more sensitive, and more reliable to use.

Abstract: A highly efficient thermoelectric cooler controller for temperature stabilization. The circuit comprises a temperature sensor and a thermoelectric cooler, both in thermal communication with a component to be temperature stabilized. The circuit further comprises a power amplifier electrically coupled to the thermoelectric cooler. The power amplifier is employed as a controlled current source to efficiently supply current to the thermoelectric cooler when maximum cooling is required.

Abstract: Apparatus providing at least one thermoelectric device for pressurizing a liquefied gas container and methods employing same are disclosed. A thermoelectric device including a heating surface and a cooling surface is used for pressurizing a container by vaporizing liquefied gas within the container by transferring heat energy from a portion of the liquefied gas in contact with the cooling surface to another portion of the liquefied gas in contact with the heating surface of the thermoelectric device to convert some of the liquefied gas to a vapor state. Liquefied gas vapor and/or liquid phase may be supplied by disclosed apparatus and methods. The apparatus may also be used as a vapor pump or a liquid pump, or fluid pump. Methods of operation are also disclosed.

Abstract: An apparatus for and method of distillation uses a high temperature thermoelectric device to heat a liquid, such as water to vapor (steam) and cool the vapor to a purified, distilled liquid. Distillation system has no moving parts, thereby increasing reliability while reducing noise and maintenance. Liquid in a container has a heating section on the container extending into it to boil it into a vapor that is fed to a condenser section disposed on the container adjacent to the heating section. A thermoelectric section provided with a Peltier effect device is interposed between the heating section and condenser section. The Peltier effect device has one side in contiguous contact with the condenser to transfer heat from it and another side is in contiguous contact with the heating section to transfer heat to it to boil the liquid into the vapor and feed the vapor through the condenser that condenses it into distilled liquid.

Abstract: Method and apparatus for thermal management of an integrated circuit. A semiconductor device includes an integrated circuit and an integrated thermoelectric cooler formed on a common substrate. A semiconductor device is fabricated by forming an integrated circuit on a front side of the substrate and forming an integrated thermoelectric cooler on a back side of the substrate. A first thermal sink of semiconductor material capable of absorbing heat from the integrated circuit is formed on the back side of the substrate. N-type thermoelectric elements are formed on contacts formed on the first thermal sink. P-type thermoelectric elements are formed on contacts formed on a second thermal sink of semiconductor material capable of dissipating heat. The p-type and n-type thermoelectric elements are bonded to the contacts on the first and second thermal sinks, respectively, by a flip-chip soldering process.

Abstract: A system and apparatus for charging an electronic device using solar energy are disclosed. In one form, a portable storage apparatus operable to charge a battery associated with an electronic device is disclosed. The apparatus includes a first material configured to provide a storage space for storing articles. The storage space includes an interior portion and an exterior portion. The apparatus further includes a first flexible solar panel coupled to an exterior portion of the portable storage apparatus and integrated as a part of the first material. A second positional solar panel is also provided and coupled to an interior portion of the portable storage apparatus. The apparatus further includes a universal 12-volt charge port coupled to the first and second solar panels and operable to receive a charge conductor for charging the electronic device.

Abstract: A thermoelectric semiconductor module (10) includes a plurality of semiconductor pellets (14, 18) having Peltier characteristics are mechanically interconnected and arranged in an electrical series circuit with heat transferring means (12, 16, 20) with all interconnections being directly made. The means (12, 16, 20) can be of platelike construction with an L-shaped cross-section or, alternatively, with a U-shaped cross-section. A large number of modules (10) can be arranged in a two-dimensional or three-dimensional stack (30) with adjacent lines or planes of modules electrically interrelated by end segment connectors (32). In a further version, one side of a modular plane has heat exchanger fins (44-50) while the other side is electrically connected by ceramic segments (58) with deposited conductors (56). In yet another version, the modules are mounted onto rotating discs (94, 96) so as to act as a fluid impeller moving therepast enhancing thermal efficiency.

Abstract: Compounds are expressed by general formula of AxBC2−y where 0≦x≦2 and 0≦y<1, and have CdI2 analogous layer structures; A-site is occupied by at least one element selected from the group consisting of Li, Na, K, Rb, Cs, Mg, Ca, Sr, Ba, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Zr, Nb, Mo, Ru, Rh, Pd, Ag, Cd, Hf, Ta, W, Re, Ir, Pt, Au, Sc, rare earth elements containing Y, B, Al, Ga, In, Tl, Sn, Pb and Bi; B-site is occupied by at least one element selected from the group consisting of Ti, V, Cr, Zr, Nb, Mo, Hf, Ta, W, Ir, and Sn; C-site is occupied by at least one element selected from the group consisting of S, Se and Te; the compounds exhibit large figure of merit so as to be preferable for thermoelectric generator/refrigerator.

Abstract: A condensation panel to be used for harvesting water from atmospheric moisture during those times of the diurnal cycle when relative humidity is at or near 100% utilizes very localized cooling to optimize condensation on a surface whose materials promote the condensation and collection of the water. The panel is passive in the sense that it can be deployed and left in an unmaintained condition for considerable periods of time. At least one time each day, almost certainly in the morning, water harvested by the process of assisted condensation can be collected for use.

Abstract: An electric generator system for producing electric power from the environmental temperature changes such as occur during a normal summer day on Earth or Mars. In a preferred embodiment a phase-change mass is provided which partially or completely freezes during the relatively cold part of a cycle and partially or completely melts during the relatively hot part of the cycle. A thermoelectric module is positioned between the phase-change mass and the environment. The temperature of the phase-change mass remains relatively constant throughout the cycle. During the hot part of the cycle heat flows from the environment through the thermoelectric module into the phase change mass generating electric power which is stored in an electric power storage device such as a capacitor or battery. During the cold part of the cycle heat flows from the phase change mass back through the module and out to the environment also generating electric power that also is similarly stored.

Abstract: Heat dissipating Silicon-on-Insulator (SOI) structures which utilize thermoelectric effects to more effectively dissipate thermal energy from SOI-based electronic circuits.

Abstract: A silicon based film is provided which comprises a crystal phase formed on a substrate with a surface shape represented by a function f, wherein the silicon-based film is formed on a substrate with a surface shape having a standard deviation of an inclination arctan (df/dx) from 15° to 55° within the range of a sampling length dx from 20 nm to 100 nm. Raman scattering strength resulting from an amorphous component in the silicon-based film is not more than a Raman scattering strength resulting from a crystalline component. A difference between a spacing in a direction parallel to a principal surface of the substrate and a spacing of a single crystal silicon is within the range of 0.2% to 1.0% with regard to the spacing of the single crystal silicon.

Abstract: Improved thermoelectric assemblies are disclosed, wherein layers of heterostructure thermoelectric materials or thin layers of thermoelectric material form thermoelectric elements. The layers are bound together with agents that improve structural strengths, allow electrical current to pass in a preferred direction, and minimize or reduce adverse affects, such a shear stresses, that might occur to the thermoelectric properties and materials of the assembly by their inclusion.

Abstract: A device for generating power to run an electronic component. The device includes a heat-conducting substrate (composed, e.g., of diamond or another high thermal conductivity material) disposed in thermal contact with a high temperature region. During operation, heat flows from the high temperature region into the heat-conducting substrate, from which the heat flows into the electrical power generator. A thermoelectric material (e.g., a BiTe alloy-based film or other thermoelectric material) is placed in thermal contact with the heat-conducting substrate. A low temperature region is located on the side of the thermoelectric material opposite that of the high temperature region. The thermal gradient generates electrical power and drives an electrical component.

Abstract: A thermoelectric module which includes case 1, heat-radiation side insulating substrate 4a, heat-absorption side insulating substrate 4b, first soldering layer 5a formed of a first soldering agent to connect the heat-radiation side insulating substrate 4a and the case 1, a plurality of P-type and N-type semiconductor chips interposed between the heat-radiation side insulating substrate 4a and the heat-absorption side insulating substrate 4b, the plurality of P-type and N-type semiconductor chips being arranged alternately, and a second soldering layer 15a (15b) formed of a second soldering agent to connect the heat-radiation side insulating substrate 4a and one end of each of the plural P-type and N-type semiconductor chips (the heat-absorption side insulating substrate 4b and the other end of each of the plural P-type and N-type semiconductor chips), the first soldering agent and the second soldering agent being identical in raw material.

Abstract: A thermoelectric module includes plural thermoelectric semiconductor chips connected in series, first and second substrates, plural first and second electrodes formed on the first and second substrates, first solder through which the first and second electrodes are bonded to end portions of the thermoelectric semiconductor chips. The first substrate includes two or more protrusions protruding toward opposite sides with respect to the second substrate when being viewed vertically. A method of assembling a thermoelectric module in a radiating member includes the steps of mounting the first substrate on a radiating member through the second solder having a liquidus temperature lower than a solidus temperature of the first solder; holding the protrusions by leading edges of support arms where the second solder is melted to push the first substrate toward the radiating member under pressure while rocking the first substrate in a direction orthogonal to the pushing direction.

Abstract: Disclosed is a thermoelectric module, comprising a plurality of p-type thermoelectric elements each comprising a p-type semiconductor having a skutterdite crystal structure, a plurality of n-type thermoelectric elements each comprising a n-type semiconductor having a skutterdite crystal structure, at least one first electrode, at least one second electrode, at least one first alloy layer and at least one second alloy layer, wherein said at least one first alloy layer and said at least one second alloy layer contain Sb and at least one transition metal element selected from the group consisting of Ag, Au and Cu.

Abstract: A thermoelectric microactuator on a substrate includes a first temperature control element having a first surface bonded to the substrate and having a second surface. A first electrically nonconductive layer has a first surface bonded to the second surface of the first temperature control element and has a second surface. An actuator arm includes a first region bonded to the second surface of the first nonconductive layer and includes a flexure contiguously extending from the first region to an end cantilevered beyond the first nonconductive layer and forming an axis at the junction of the flexure and the first region. The first temperature control element controls the temperature of the actuator arm to thereby deflect the flexure about the axis.

Abstract: Thermoelectric material of (Bi, Sb)(Te, Se) system is produced through a liquid quenching method and an extrusion from a die unit having an inlet portion and an outlet portion crossing each other at 30-150 degrees so that the crystal grains have an average grain size equal to or less than 30 microns and (001) planes mostly oriented in parallel to a direction in which electric current to flow, thereby achieving the figure of merit equal to or greater than 3.0×10−3/K.

Abstract: A combined thermocouple and thermopile capable of producing multiple EMF signals. The combined thermocouple and thermopile construction is particularly adapted for use as an electric generator capable of producing multiple EMF signals and able to respond faster to changes to the presence or absence of a pilot or gas burner flame. The conductors of the thermopile are comprised of dissimilar metals joined at each end to form hot and cold thermocouple junctions. The thermopile may provide multiple EMF signals when a third wire lead is affixed to a cold junction between either end of the array. The array of thermocouples is formed in a circle and enclosed in a metal sleeve or jacket.

Abstract: A thermoelectric device with improved efficiency is provided. In one embodiment, the thermoelectric device includes a first thermoelement and a second thermoelement electrically coupled to the first thermoelement. An array of first tips are in close physical proximity to, but not necessarily in physical contact with, the first thermoelement at a first set of discrete points. An array of second tips are in close physical proximity to, but not necessarily in physical contact with, the second thermoelement at a second set of discrete points. The first and second conical are constructed entirely from metal, thus reducing parasitic resistances.

Abstract: In a thermal electric generator, a thermoelectric cooling device has a hot side in thermal communication with a heat collector that is disposed in thermal communication with a heat source. A heat sink is provided on a cold side of the thermoelectric cooling device. A heat-insulating layer is disposed between the heat collector and the heat sink, and has the thermoelectric cooling device embedded therein. The hot side of the thermoelectric cooling device receives heat energy from the heat collector so as to result in a temperature difference between the hot and cold sides. The thermoelectric cooling device generates an electrical current corresponding to the temperature difference.

Abstract: A nanoscale force sensing device includes a probe having a tip with multiple isolated channels which can receive different materials. The device may be either straight or cantilevered and may be mounted to permit detection of surface forces while performing other functions at the same time.

Abstract: Apparatus providing at least one thermoelectric device for pressurizing a liquefied gas container and methods employing same are disclosed. A thermoelectric device including a heating surface and a cooling surface is used for pressurizing a container by vaporizing liquefied gas within the container by transferring heat energy from a portion of the liquefied gas in contact with the cooling surface to another portion of the liquefied gas in contact with the heating surface of the thermoelectric device to convert some of the liquefied gas to a vapor state. Liquefied gas vapor and/or liquid phase may be supplied by disclosed apparatus and methods. The apparatus may also be used as a vapor pump or a liquid pump, or fluid pump. Methods of operation are also disclosed.

Abstract: A thermoelectric module includes a case, a insulating base plate for a exoergic side, a insulating base plate for endoergic side, a first soldering layer which joins the insulating base plate for the exoergic side to the case via a first soldering material, and a second soldering layer which joins P-type and N-type semiconductor tips to the insulating base plate for an exoenergic side and a insulating base plate for an endoergic side, using second soldering material. The melting point temperature of the first soldering material for the first soldering layer is higher than the melting point temperature of the second material for the second soldering layer.

Abstract: The present invention provides a thermoelectric cooler (TEC) In one embodiment, the TEC includes a first substrate and a second substrate. In addition, the TEC includes first and second TEC elements coupled to and between the first substrate and the second substrate. Moreover, the second TEC elements have a physical parameter different from the first TEC elements. A method of manufacturing a TEC and a laser pump module incorporating the TEC or the method are also disclosed.

Abstract: A Seebeck effect thermal sensor is formed in an integrated fashion with a power-dissipating device such as a power MOSFET. The integrated device generates a temperature difference between a relatively cold peripheral area and a relatively warm central area, the temperature difference having a known relationship to electrical operating conditions of the device. A structure for a power MOSFET includes two side-by-side arrays of source/drain diffusions. The Seebeck sensor has warm junctions at the central area and cold junctions at the peripheral area, and generates an electrical output signal having a known relationship to the temperature difference between the peripheral and central areas to provide an indication of the electrical operating conditions of the device. One Seebeck sensor includes alternating metal and polysilicon traces, wherein the polysilicon traces lie between source and drain diffusions of a power MOSFET just as do active polysilicon gates.

Abstract: A thermoelectric material having a high Seeback coefficient and a large power factor and excellent in shock resistance, thermal strain resistance, and formability, and a thermoelectric element are disclosed. The thermoelectric material and thermoelectric element is composed of a multilayered body made up of a laminar body of a semimetal, a metal, or a synthetic resin and a laminar body of a semimetal. The average thickness of the laminar bodies ranges from 0.3 nm to 1000 nm. Embodiments of the combination of the laminar bodies are Bi—Al, Bi-polyamide series resin, and Ag—Fe. Such a multilayered body is manufactured by forming an initial multilayered body composed of all the types of laminar bodies constituting the multilayered body and rolling or uniaxially pressing a stack of such initial multilayered bodies.

Abstract: A flexible thermoelectric circuit is disclosed. Thermoelectric circuits have traditionally been of the rigid or substantially rigid form. Several different embodiments of thermoelectric circuits are disclosed which permit flexion in one or more directions to permit applications where flexible thermoelectric circuits are advantageous.

Abstract: A thermoelectric module comprising an N-type thermoelectric element having excellent characteristics in air atmosphere even when the temperature rises to a medium-to-high temperature region of about 500° C. and, further, improving the conversion efficiency of, a thermoelectric module, by the combination of an excellent P-type thermoelectric material and an excellent n-type thermoelectric material containing a compound having a skutterudite structure, the module comprising an N-type thermoelectric elements each containing a compound having a skutterudite structure, P-type thermoelectric elements each connected directly or by way of a metal member to the N-type thermoelectric elements and containing an Mn—Si series compound.

Abstract: A thermoelectric cooler utilizing superlattice and quantum-well materials may be deposited directly onto a die using thin-film deposition techniques. The materials may have a figure-of-merit of greater than one.

Abstract: Representative configurations for improved thermoelectric power generation systems to improve and increase thermal efficiency are disclosed.

Abstract: A method and structure for a semiconductor structure that includes a substrate having at least one integrated circuit heat generating structure is disclosed. The invention has at least one integrated circuit cooling device on the substrate adjacent the heat generating structure. The cooling device is adapted to remove heat from the heat generating structure. The cooling device includes a cold region and a hot region. The cold region is positioned adjacent the heat generating structure. The cooling device has one of a silicon germanium super lattice structure. The cooling device also has a plurality of cooling devices that surround the heat generating structure. The cooling device includes a thermoelectric cooler.

Abstract: A sealing member for a thermoelectric assembly includes an elastomeric body having one or more apertures formed therethrough for sealingly receiving an electrical wire projecting from the thermoelectric module. Sealing engagement between each electrical wire and each aperture may be enhanced by the use of a sealing agent, or by molding the wire, its sheath or a wire connector to each aperture. Preferably, a pair of wire guides project from the sealing member, each having a central channel in substantial registry with one of the apertures and providing additional surface area for wire support which reduces any tendency to create spaces between the wires and apertures. The sealing member may include one or more peripheral channels to capture water vapor, one or more indexing guides which receive fasteners from the assembly to locate the sealing member therein, as well as insulative filler material, and/or a central insulative channel.

Abstract: Counter-current heat flow systems are disclosed, where heat containing medium flows in adjacent conduits arranged anti-parallel to one another so that the medium flowing from a warm zone to a cool zone flows adjacent to the medium flowing from the cool to the warm zone in the opposite direction. A plurality of heat pumps are distributed along the conduits to actively pump heat between adjacent points of the conduits. Little energy is required to pump heat between the adjacent points yet a large temperature difference can be maintained between the warm and the cool zones. The heat containing medium can be a fluid or an electric current. The medium in one conduit may have a different heat capacity than the medium in the other conduit. A controller may be included to regulate the plurality of heat pumps and/or the flow of the media to maintain a desired temperature at the warm zone or the cool zone.

Abstract: A method of forming thermoelectric materials includes combining at least one P-type extrusion with at least one N-type extrusion to form a first P/N-type billet. The P/N-type billet may be extruded to form a first P/N-type extrusion having at least one P-type region, and at least one N-type region. The P/N-type extrusion may be segmented into a plurality of P/N-type extrusion segments. In a particular embodiment, a plurality of the P/N-type extrusion segments may be combined to form a second P/N-type billet. The second P/N-type billet may be extruded to form a second P/N-type extrusion having a second plurality of P-type regions and a second plurality of N-type regions.

Abstract: A class of thermoelectric compounds based on the skutterudite structure with heavy filling atoms in the empty octants and substituting transition metals and main-group atoms. High Seebeck coefficients and low thermal conductivities are achieved in combination with large electrical conductivities in these filled skutterudites for large ZT values. Substituting and filling methods are disclosed to synthesize skutterudite compositions with desired thermoelectric properties. A melting and/or sintering process in combination with powder metallurgy techniques is used to fabricate these new materials.

Abstract: A cuboid p-type and an n-type thermoelectric conversion material having a composite of an alloy powder for a rare earth magnet and a bismuth-based thermoelectric conversion material that has been rendered a p-type semiconductor or an n-type semiconductor by the addition of the required dopant, are arranged alternately with a material with low thermal conductivity and high electrical resistivity interposed between them. The low- and the high-temperature sides of these thermoelectric conversion materials are connected with wires, a magnetic field is applied in the x axis direction, a temperature gradient ∇T is imparted in the z axis direction a p-n junction is created, and thermoelectromotive force is extracted from the connection end in a plane in the y axis direction. There is a marked increase in the Seebeck coefficient even though no magnetic field is applied externally.

Abstract: Apparatus having a cooling device capable of both power generation using heat from a heat-generating component and cooling of the heat-generating component is provided. The cooling device has a heat-receiving part which receives heat conducted from a CPU, which is an external heat-generating component, a thermoelectric conversion part arranged to absorb heat from the heat-receiving part and having operating modes including a mode of cooling the heat-receiving part by being supplied with a current and a power generation mode of converting heat received from the heat-receiving part into a current and outputting the current, and a selecting part which makes a selection according to a temperature condition of the CPU as to in which one of the modes the thermoelectric conversion part should be operated.