Group Iv Element Containing (c, Si, Ti, Ge, Zr, Sn, Hf, Pb) Patents (Class 136/239)
  • Publication number: 20080295879
    Abstract: New thermoelectric materials and devices are disclosed for application to high efficiency thermoelectric power generation. New functional materials based on oxides, rare-earth-oxides, rare-earth-nitrides, rare-earth phosphides, copper-rare-earth oxides, silicon-rare-earth-oxides, germanium-rare-earth-oxides and bismuth rare-earth-oxides are disclosed. Addition of nitrogen and phosphorus are disclosed to optimize the oxide material properties for thermoelectric conversion efficiency. New devices based on bulk and multilayer thermoelectric materials are described. New devices based on bulk and multilayer thermoelectric materials using combinations of at least one of thermoelectric and pyroelectric and ferroelectric materials are described. Thermoelectric devices based on vertical pillar and planar architectures are disclosed. The advantage of the planar thermoelectric effect allows utility for large area applications and is scalable for large scale power generation plants.
    Type: Application
    Filed: July 26, 2007
    Publication date: December 4, 2008
    Applicant: Translucent Photonics, Inc.
    Inventor: Petar B. Atanackovic
  • Publication number: 20080276979
    Abstract: The present invention provides nanowires and nanoribbons that are well suited for use in thermoelectric applications. The nanowires and nanoribbons are characterized by a periodic longitudinal modulation, which may be a compositional modulation or a strain-induced modulation. The nanowires are constructed using lithographic techniques from thin semiconductor membranes, or “nanomembranes.
    Type: Application
    Filed: May 7, 2007
    Publication date: November 13, 2008
    Inventors: Max G. Lagally, Paul G. Evans, Clark S. Ritz
  • Publication number: 20080257395
    Abstract: A miniature quantum well thermoelectric device. The device includes a number of quantum well n-legs and a number of quantum well p-legs. Each of the p-legs are alternately electrically connected in series with each of the n-legs at locations that are thermal communication with a cold side and a hot side. The device can be adapted to function as a cooler and it can be adapted to function as an electric power generator. In a preferred embodiment the p-legs and said n-legs are configured generally radially between the hot side and the cold side. In this preferred embodiments each of the n-legs has at least 600 n-type layers with each n-type layer separated from other n-type layers by an insulating layer and each of the p-legs has at least 600 p-type layers with each p-type layer separated from other p-type layers by an insulating layer.
    Type: Application
    Filed: March 12, 2008
    Publication date: October 23, 2008
    Inventors: Velimir Jovanovic, Daniel Krommenhoek, John C. Bass, Saeid Ghamaty, Norbert Elsner
  • Publication number: 20080236644
    Abstract: A thermoelectric material has a composition expressed by (Fe1-pVp)100-x(Al1-qSiq)x (0.35?p?0.7, 0.01?q?0.7, 20?x?30 atomic %). The thermoelectric material includes a crystal phase having an L21 structure or a crystal phase having a B2 structure as a main phase.
    Type: Application
    Filed: September 4, 2007
    Publication date: October 2, 2008
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Shinya Sakurada, Naoki Shutoh
  • Publication number: 20080223427
    Abstract: A thermoelectric converter including plural thermoelectric conversion modules connected in series by having p-type semiconductors and n-type semiconductors alternately provided in through holes of a ceramic honeycomb, respectively. Ends of the p-type semiconductors are connected to ends of the n-type semiconductors on both sides of the through holes.
    Type: Application
    Filed: November 30, 2007
    Publication date: September 18, 2008
    Applicant: IBIDEN CO., LTD.
    Inventor: Kazushige OHNO
  • Publication number: 20080223426
    Abstract: A thermoelectric converter including p-type semiconductors and n-type semiconductors alternately provided in corresponding first and second through holes, respectively, in a ceramic honeycomb. The first and second through holes have different cross-sectional shapes and are alternately arranged. The semiconductors have respective first and second ends thereof successively connected to different ones of the semiconductors on first and second sides, respectively, of the corresponding through holes.
    Type: Application
    Filed: November 21, 2007
    Publication date: September 18, 2008
    Applicant: IBIDEN CO., LTD.
    Inventor: Kazushige OHNO
  • Publication number: 20080216884
    Abstract: BaAuGe, BaAuGaGe, BaPtGe, BaPdGe, BaPdGaGe, BaPdGaSi, BaPtGaSi, BaCuGaGe, and BaAgGaGe clathrate compounds, and thermoelectric conversion element comprising the clathrate compounds. Methods for producing thermoelectric conversion elements are also provided, comprising melting, heat-treating, particle-forming, and sintering processes.
    Type: Application
    Filed: January 24, 2005
    Publication date: September 11, 2008
    Inventors: Yasufumi Shibata, Hiroaki Anno, Kakuei Matsubara
  • Publication number: 20080210285
    Abstract: A thermoelectric conversion material having a novel composition is provided. The thermoelectric conversion material comprises a first dielectric material layer, a second dielectric material layer, and an electron localization layer that is present between the first dielectric material layer and the second dielectric material layer and that has a thickness of 1 nm.
    Type: Application
    Filed: November 15, 2005
    Publication date: September 4, 2008
    Applicants: JAPAN SCIENCE AND TECHNOLOGY AGENCY, NATIONAL UNIVERSITY CORPORATION NAGOYA UNIVERSITY
    Inventors: Hideo Hosono, Masahiro Hirano, Hiromichi Ohta, Kunihito Koumoto
  • Publication number: 20080202575
    Abstract: Thermoelectric materials with high figures of merit, ZT values, are disclosed. In many instances, such materials include nano-sized domains (e.g., nanocrystalline), which are hypothesized to help increase the ZT value of the material (e.g., by increasing phonon scattering due to interfaces at grain boundaries or grain/inclusion boundaries). The ZT value of such materials can be greater than about 1, 1.2, 1.4, 1.5, 1.8, 2 and even higher. Such materials can be manufactured from a thermoelectric starting material by generating nanoparticles therefrom, or mechanically alloyed nanoparticles from elements which can be subsequently consolidated (e.g., via direct current induced hot press) into a new bulk material. Non-limiting examples of starting materials include bismuth, lead, and/or silicon-based materials, which can be alloyed, elemental, and/or doped. Various compositions and methods relating to aspects of nanostructured thermoelectric materials (e.g., modulation doping) are further disclosed.
    Type: Application
    Filed: December 3, 2007
    Publication date: August 28, 2008
    Applicants: MASSACHUSETTS INSTITUTE OF TECHNOLOGY (MIT), The Trustees of Boston College
    Inventors: Zhifeng Ren, Bed Poudel, Gang Chen, Yucheng Lan, Dezhi Wang, Qing Hao, Mildred Dresselhaus, Yi Ma, Xiao Yan, Xiaoyuan Chen, Xiaowei Wang, Joshi R. Giri, Bo Yu
  • Publication number: 20080190475
    Abstract: The present invention provides a thermoelectric material comprised of a clathrate compound expressed by Ba8GaXGe(44-X), where 14?X?18. This thermoelectric material does not require the conventionally indispensible long heat treatment yet is provided with a superior thermoelectric property equal to the past.
    Type: Application
    Filed: March 3, 2006
    Publication date: August 14, 2008
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventor: Takuji Kita
  • Publication number: 20080178920
    Abstract: Certain embodiments disclosed herein are directed to devices for cooling. In certain examples, a thermoelectric device comprising a substrate and a superlattice coupled to the substrate is disclosed. In some examples, the superlattice includes a first semi-conducting material and a second semi-conducting material coupled to the first semi-conducting material to provide an interface between the first and second semi-conducting materials.
    Type: Application
    Filed: November 30, 2007
    Publication date: July 31, 2008
    Applicant: SCHLUMBERGER TECHNOLOGY CORPORATION
    Inventor: John Ullo
  • Publication number: 20080173344
    Abstract: A thermoelectric material includes a composite having a first electrically conducting component and second low thermal conductivity component. The first component may include a semiconductor and the second component may include an inorganic oxide. The thermoelectric composite includes a network of the first component having nanoparticles of the second component dispersed in the network.
    Type: Application
    Filed: November 1, 2007
    Publication date: July 24, 2008
    Inventors: Minjuan Zhang, Yunfeng Lu
  • Publication number: 20080169016
    Abstract: The present invention is directed to an electrical device that comprises a first and a second fiber having a core of thermoelectric material embedded in an electrically insulating material, and a conductor. The first fiber is doped with a first type of impurity, while the second fiber is doped with a second type of impurity. A conductor is coupled to the first fiber to induce current flow between the first and second fibers.
    Type: Application
    Filed: August 10, 2007
    Publication date: July 17, 2008
    Inventor: Biprodas DUTTA
  • Publication number: 20080135082
    Abstract: A thermoelectric conversion module (10) comprises first and second electrode members (13, 14), and thermoelectric elements (11, 12) arranged between the electrode members (13, 14). The thermoelectric elements (11, 12) are made of a half-Heusler material and are electrically and mechanically connected to the first and second electrode members (13, 14) via bonding parts (17). The bonding parts (17) include a bonding material which contains at least one selected from Ag, Cu and Ni as a main component and at least one of active metal selected from Ti, Zr, Hf, Ta, V and Nb in a range from 1 to 10% by mass.
    Type: Application
    Filed: December 12, 2005
    Publication date: June 12, 2008
    Inventors: Shinsuke Hirono, Takayuki Naba, Masami Okamura
  • Patent number: 7365265
    Abstract: A thermoelectric material having enhanced Seebeck coefficient is characterized by a microstructure comprising nanoscale Pb inclusions dispersed in matrix substantially composed of PbTe. The excess Pb is obtained either by adding Pb in an amount greater than the stoichiometric amount needed to form PbTe, or by adding an additive effective to getter Te so as to produce the desired excess. The method is generally applicable to enhance thermoelectric properties of compounds of Pb, Sn or Ge, and Te, Se, or S.
    Type: Grant
    Filed: June 14, 2005
    Date of Patent: April 29, 2008
    Assignee: Delphi Technologies, Inc.
    Inventors: Joseph Pierre Heremans, Christopher M. Thrush, Donald T. Morelli
  • Patent number: 7342170
    Abstract: A super-lattice thermoelectric device. The device is comprised of p-legs and n-legs, each leg being comprised of a large number of very thin alternating layers of two materials with differing electron band gaps. The n-legs in the device are comprised of alternating layers of Si and SiC. The p-legs are comprised of alternating layers of B4C and B9C. In preferred embodiments the layers are about 100 angstroms thick. Thermoelectric modules made according to the present invention are useful for both cooling applications as well as electric power generation. This preferred embodiment is a thermoelectric 10×10 egg crate type module about 6 cm×6 cm×0.76 cm designed to produce 70 Watts with a temperature difference of 300 degrees C. with a module efficiency of about 30 percent. The module has 98 active thermoelectric legs, with each leg having more than 3 million super-lattice layers.
    Type: Grant
    Filed: April 5, 2004
    Date of Patent: March 11, 2008
    Assignee: Hi-Z Technology, Inc.
    Inventors: Saeid Ghamaty, Norbert B. Elsner, John C. Bass
  • Patent number: 7342169
    Abstract: A thermoelectric structure and device including at least first and second material systems having different lattice constants and interposed in contact with each other, and a physical interface at which the at least first and second material systems are joined with a lattice mismatch and at which structural integrity of the first and second material systems is substantially maintained. The at least first and second material systems have a charge carrier transport direction normal to the physical interface and preferably periodically arranged in a superlattice structure.
    Type: Grant
    Filed: October 7, 2002
    Date of Patent: March 11, 2008
    Assignee: Nextreme Thermal Solutions
    Inventors: Rama Venkatasubramanian, Edward Siivola, Thomas Colpitts, Brooks O'Quinn
  • Patent number: 7326851
    Abstract: A thermoelectrically active p- or n-conductive semiconductor material is constituted by a ternary compound of the general formula (I) (Pb1-xGex)Te??(I) with x value from 0.16 to 0.5, wherein 0 to 10% by weight of the ternary compound may be replaced by other metals or metal compounds, wherein the semiconductor material has a Seebeck coefficient of at least ±200 ?V/K at a temperature of 25° C.
    Type: Grant
    Filed: April 11, 2003
    Date of Patent: February 5, 2008
    Assignees: BASF Aktiengesellschaft, Michigan State University
    Inventors: Hans-Josef Sterzel, Klaus Kühling, Mercouri G. Kanatzidis, Duck-Young Chung
  • Patent number: 7312392
    Abstract: The present invention provides a thermoelectric conversion device having high thermoelectric conversion performance. In this device, electrodes are arranged so that electric current flows in an interlayer direction of a layered substance, unlike the arrangements derived from common knowledge in the art. In the thermoelectric conversion device according to the present invention, a thermoelectric-conversion film is obtained through epitaxial growth and formed by arranging an electrically conducting layer and an electrically insulating layer alternately; the electrically conducting layer has an octahedral crystal structure in which a transition metal atom M is positioned at its center and oxygen atoms are positioned at its vertexes; and the electrically insulating layer includes a metal element or a crystalline metal oxide.
    Type: Grant
    Filed: August 2, 2005
    Date of Patent: December 25, 2007
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Satoshi Yotsuhashi, Tsutomu Kanno, Hideaki Adachi, Akihiro Odagawa, Yasunari Sugita
  • Patent number: 7247603
    Abstract: A Superconducting Quantum Interference Device (SQUID) is disclosed comprising a pair of resistively shunted Josephson junctions connected in parallel within a superconducting loop and biased by an external direct current (dc) source. The SQUID comprises a semiconductor substrate and at least one superconducting layer. The metal layer(s) are separated by or covered with a semiconductor material layer having the properties of a conductor at room temperature and the properties of an insulator at operating temperatures (generally less than 100 Kelvins). The properties of the semiconductor material layer greatly reduces the risk of electrostatic discharge that can damage the device during normal handling of the device at room temperature, while still providing the insulating properties desired to allow normal functioning of the device at its operating temperature. A method of manufacturing the SQUID device is also disclosed.
    Type: Grant
    Filed: October 20, 2004
    Date of Patent: July 24, 2007
    Assignee: Star Cryoelectronics
    Inventors: Robin Harold Cantor, John Addison Hall
  • Patent number: 7179986
    Abstract: A thermoelectric (TE) device includes a first leg of TE material (a pseudobinary or pseudoternary alloy) and a second leg comprising a metal wire. The second leg is in thermal and electrical communication with the first leg. The TE device has a ZT value of approximately 2.0 at a temperature of approximately 300K.
    Type: Grant
    Filed: May 8, 2003
    Date of Patent: February 20, 2007
    Assignee: Massachusetts Institute of Technology
    Inventors: Theodore C. Harman, Patrick J. Taylor, Michael P. Walsh, Brian E. LaForge
  • Patent number: 7166796
    Abstract: In devices used for the direct conversion of heat into electricity, or vice versa, known in the art as thermoelectric power generators, thermoelectric refrigerators and thermoelectric heat pumps, the efficiency of energy conversion and/or coefficient of performance have been considerably lower than those of conventional reciprocating or rotary, heat engines and/or vapor-compression systems, employing certain refrigerants. The energy conversion efficiency of power generating devices, for example, aside from the hot and cold junction temperatures, also depends on a parameter known in the art as the thermoelectric figure of merit Z=S2?/k, where S is the thermoelectric power, ? is the electrical conductivity and k is the thermal conductivity, of the material that constitutes the p-type, and/or n-type, thermoelements, or branches, of the said devices. In order to achieve a considerable increase in the energy conversion efficiency, a thermoelectric figure of merit of the order of 10?2 K?1, or more, is needed.
    Type: Grant
    Filed: September 5, 2002
    Date of Patent: January 23, 2007
    Inventor: Michael C. Nicoloau
  • Patent number: 7109408
    Abstract: A solid-state energy converter with a semiconductor or semiconductor-metal implementation is provided for conversion of thermal energy to electric energy, or electric energy to refrigeration. In n-type heat-to-electricity embodiments, a highly doped n* emitter region made of a metal or semiconductor injects carriers into an n-type gap region. A p-type layer is positioned between the emitter region and gap region, allowing for discontinuity of corresponding Fermi-levels and forming a potential barrier to sort electrons by energy. Additional p-type layers can optionally be formed on the collector side of the converter. One type of these layers with higher carrier concentration (p*) serves as a blocking layer at the cold side of the converter, and another layer (p**) with carrier concentration close to the gap reduces a thermoelectric back flow component. Ohmic contacts on both sides of the device close the electrical circuit through an external load to convert heat to electricity.
    Type: Grant
    Filed: March 15, 2004
    Date of Patent: September 19, 2006
    Assignee: Eneco, Inc.
    Inventors: Yan R. Kucherov, Peter L. Hagelstein
  • Patent number: 7002071
    Abstract: A thermoelectric conversion material is formed of a polycrystal structure of crystal grains composed of a silicon-rich phase, and an added element-rich phase in which at least one type of added element is deposited at the grain boundary thereof, the result of which is an extremely large Seebeck coefficient and low thermal conductivity, allowing the thermoelectric conversion rate to be raised dramatically, and affording a silicon-based thermoelectric conversion material composed chiefly of silicon, which is an abundant resource, and which causes extremely low environmental pollution.
    Type: Grant
    Filed: March 10, 2000
    Date of Patent: February 21, 2006
    Assignee: Sumitomo Special Metals Co. Ltd.
    Inventors: Nobuhiro Sadatomi, Osamu Yamashita, Tsunekazu Saigo, Masao Noumi
  • Patent number: 6991370
    Abstract: The temperature measuring apparatus according to the present invention is of the high melting point metal carbide—carbon system material thermocouple type. According to this temperature measuring apparatus, it is possible to measure temperatures from a room temperature range to a high temperature range in excess of 2000° C. continuously, stably and with good accuracy. A constitution is preferable wherein a rod-like member formed of high melting point metal carbide is inserted into a pipe-like member with a bottom formed of carbon system material, and connected at the bottom to serve as a temperature measuring portion.
    Type: Grant
    Filed: July 22, 2003
    Date of Patent: January 31, 2006
    Assignee: Kobe Steel, Ltd.
    Inventors: Shigeo Kofune, Takao Fujikawa
  • Patent number: 6946596
    Abstract: Tunneling-effect converters of thermal energy to electricity with an emitter and a collector separated from each other by a distance that is comparable to atomic dimensions and where tunneling effect plays an important role in the charge movement from the emitter to the collector across the gap separating such emitter and collector. At least one of the emitter and collector structures includes a flexible structure. Tunneling-effect converters include devices that convert thermal energy to electrical energy and devices that provide refrigeration when electric power is supplied to such devices.
    Type: Grant
    Filed: September 13, 2002
    Date of Patent: September 20, 2005
    Inventors: Yan R. Kucherov, Peter L. Hagelstein
  • Patent number: 6833083
    Abstract: Compounds are expressed by general formula of AxBC2−y where 0≦x≦2 and 0≦y<1, and have CdI2 analogous layer structures; A-site is occupied by at least one element selected from the group consisting of Li, Na, K, Rb, Cs, Mg, Ca, Sr, Ba, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Zr, Nb, Mo, Ru, Rh, Pd, Ag, Cd, Hf, Ta, W, Re, Ir, Pt, Au, Sc, rare earth elements containing Y, B, Al, Ga, In, Tl, Sn, Pb and Bi; B-site is occupied by at least one element selected from the group consisting of Ti, V, Cr, Zr, Nb, Mo, Hf, Ta, W, Ir, and Sn; C-site is occupied by at least one element selected from the group consisting of S, Se and Te; the compounds exhibit large figure of merit so as to be preferable for thermoelectric generator/refrigerator.
    Type: Grant
    Filed: February 25, 2002
    Date of Patent: December 21, 2004
    Assignee: NEC Corporation
    Inventors: Hideto Imai, Yuichi Shimakawa, Takashi Manako, Yoshimi Kubo
  • Publication number: 20040244826
    Abstract: The invention aims to provide a thermoelectric conversion material of &bgr;-iron disilicides that performs &bgr;-phase transformation in as a short time as just the industrially useful level. Moreover, the invention aims to provide a thermoelectric conversion material of &bgr;-iron disilicides having a low heat conductivity and a high thermoelectric conversion efficiency without changing Seebeck coefficient and resistivity, and a thermoelectric conversion element using the material. Specifically, a thermoelectric conversion material of &bgr;-iron disilicides containing dopant and at least one selected from at least Sn and Pb and a thermoelectric conversion element using the material are provided.
    Type: Application
    Filed: March 19, 2004
    Publication date: December 9, 2004
    Applicant: JFE STEEL CORPORATION
    Inventor: Katsuhiko Takagi
  • Publication number: 20040206387
    Abstract: A substrate of which the crystal planes are orientated perpendicular to a main surface thereof and made of the same kind of ion is prepared. Then, film forming operation is performed on the main surface of the substrate to epitaxially grow a Fe—Si based thin film thereon.
    Type: Application
    Filed: January 16, 2004
    Publication date: October 21, 2004
    Applicant: TOKYO INSTITUTE OF TECHNOLOGY
    Inventor: Hiroshi Funakubo
  • Publication number: 20040200519
    Abstract: A thermoelectrically active p- or n-conductive semiconductor material is constituted by a ternary compound of the general formula (I)
    Type: Application
    Filed: April 11, 2003
    Publication date: October 14, 2004
    Inventors: Hans-Josef Sterzel, Klaus Kuhling, Mercouri G. Kanatzidis, Duck-Young Chung
  • Patent number: 6774298
    Abstract: A thermoelectric module which includes case 1, heat-radiation side insulating substrate 4a, heat-absorption side insulating substrate 4b, first soldering layer 5a formed of a first soldering agent to connect the heat-radiation side insulating substrate 4a and the case 1, a plurality of P-type and N-type semiconductor chips interposed between the heat-radiation side insulating substrate 4a and the heat-absorption side insulating substrate 4b, the plurality of P-type and N-type semiconductor chips being arranged alternately, and a second soldering layer 15a (15b) formed of a second soldering agent to connect the heat-radiation side insulating substrate 4a and one end of each of the plural P-type and N-type semiconductor chips (the heat-absorption side insulating substrate 4b and the other end of each of the plural P-type and N-type semiconductor chips), the first soldering agent and the second soldering agent being identical in raw material.
    Type: Grant
    Filed: January 31, 2002
    Date of Patent: August 10, 2004
    Assignee: Aisin Seiki Kabushiki Kaisha
    Inventors: Hitoshi Tauchi, Masato Itakura, Hirotsugu Sugiura
  • Patent number: 6770508
    Abstract: An ohmic electrode for an SiC semiconductor includes a p-type Si layer formed on the surface of a p-type SiC semiconductor, and a metal silicide layer formed on the surface of the Si layer, the metal silicide layer being formed from a metal silicide such as PtSi. The p-type Si layer is preferably formed from p-type Si having a carrier concentration equal to or higher than that of the aforementioned p-type SiC. Preferably, the ohmic electrode is formed as follows: deposition of Si is performed; deposition of a metal silicide is performed by means of laser ablation; laser irradiation is performed to thereby improve ohmic properties and enhance adhesion between the result deposition layer and the p-type SiC semiconductor, and then further deposition of the metal silicide is performed by means of laser ablation.
    Type: Grant
    Filed: November 24, 2003
    Date of Patent: August 3, 2004
    Assignee: NGK Spark Plug Co., Ltd.
    Inventors: Kenshiro Nakashima, Yasuo Okuyama, Hitoshi Yokoi, Takafumi Oshima
  • Patent number: 6759587
    Abstract: The present invention provides the novel thermoelectric materials having, in combination, processability and excellent thermoelectric characteristics, the thermoelectric materials being able to provide n-type thermoelectric characteristics in accordance with the nature of the employed inorganic thermoelectric materials; a thermoelectric device employing the materials; and a method for producing the thermoelectric materials.
    Type: Grant
    Filed: April 26, 2002
    Date of Patent: July 6, 2004
    Assignees: Hokushin Corporation
    Inventors: Naoki Toshima, Hu Yan, Kohsuke Kamei, Akinori Tsubata, Takashi Tokuda
  • Publication number: 20040112418
    Abstract: The present invention provides a thermoelectric material made from the ZrNiSn-based, half-Heusler structure where Pd is alloyed on the site of Ni, Hf alloyed on Zr, and Sb doped on Sn, all in accordance with the formula Zr0 5Hf0.5Ni1-xPdxSn0.99Sb0 01. The structure significantly increases the value of the figure of merit (ZT) by decreasing the structure's thermal conductivity, without significant increases to its Seebeck coefficient.
    Type: Application
    Filed: December 12, 2002
    Publication date: June 17, 2004
    Inventors: Jihui Yang, Lidong Chen, Gregory Paul Meisner, Ctirad Uher
  • Publication number: 20040107988
    Abstract: A thermoelectric (TE) device includes a first leg of TE material (a pseudobinary or pseudoternary alloy) and a second leg comprising a metal wire. The second leg is in thermal and electrical communication with the first leg. The TE device has a ZT value of approximately 2.0 at a temperature of approximately 300K.
    Type: Application
    Filed: May 8, 2003
    Publication date: June 10, 2004
    Inventors: Theodore C. Harman, Patrick J. Taylor, Michael P. Walsh, Brian E. LaForge
  • Publication number: 20040031515
    Abstract: A high-performance thermoelectric conversion element using an Si-group thermoelectric conversion material, and an thermoelectric conversion element capable of providing a high-out-put power by improving a power generating efficiency, wherein the thermal expansion coefficient of an electrode material is set to up to 10 ppm/K in order to provide a good electrode joining between a p-type thermoelectric conversion material and a n-type thermoelectric conversion material consisting of an Si-group thermoelectric conversion material to thereby ease thermal stress and prevent cracking and breaking at a joining portion, and, in joining, a brazing filler material selected according to a working temperature range is interposed to thereby provide good joining characteristics, reduce an output loss, and improve a heat resistance and a heat-cycle resistance.
    Type: Application
    Filed: July 8, 2003
    Publication date: February 19, 2004
    Inventors: Nobuhiro Sadatomi, Tsunekazu Saigo
  • Patent number: 6677515
    Abstract: A thermoelectric material is disclosed that is manufactured from a method including the steps of: providing a Group IV element boride, and doping the Group IV element boride with a doping element chosen from one of the column III, IV, V elements, wherein the doping element is different from the Group IV element in the Group IV element boride, and the doping element is not boron. An alternate method of fabricating a thermoelectric material includes the steps of simultaneously growing on a substrate a Group IV element boride and at least one doping element chosen from one of the Group III, IV, or V elements wherein the doping element is different than the Group IV element in the Group IV element boride and the doping element is not boron.
    Type: Grant
    Filed: August 13, 2001
    Date of Patent: January 13, 2004
    Assignee: Motorola, Inc.
    Inventors: Jun Wang, Daniel S. Marshall
  • Patent number: 6673996
    Abstract: A high-efficiency thermoelectric unicouple is used for power generation. The unicouple is formed with a plurality of legs, each leg formed of a plurality of segments. The legs are formed in a way that equalizes certain aspects of the different segments. Different materials are also described.
    Type: Grant
    Filed: May 1, 2002
    Date of Patent: January 6, 2004
    Assignee: California Institute of Technology
    Inventors: Thierry Caillat, Andrew Zoltan, Leslie Zoltan, Jeffrey Snyder
  • Patent number: 6653548
    Abstract: A cuboid p-type and an n-type thermoelectric conversion material having a composite of an alloy powder for a rare earth magnet and a bismuth-based thermoelectric conversion material that has been rendered a p-type semiconductor or an n-type semiconductor by the addition of the required dopant, are arranged alternately with a material with low thermal conductivity and high electrical resistivity interposed between them. The low- and the high-temperature sides of these thermoelectric conversion materials are connected with wires, a magnetic field is applied in the x axis direction, a temperature gradient ∇T is imparted in the z axis direction a p-n junction is created, and thermoelectromotive force is extracted from the connection end in a plane in the y axis direction. There is a marked increase in the Seebeck coefficient even though no magnetic field is applied externally.
    Type: Grant
    Filed: October 10, 2001
    Date of Patent: November 25, 2003
    Assignee: Sumitomo Special Metals Co., Ltd.
    Inventor: Osamu Yamashita
  • Publication number: 20030192582
    Abstract: The Thermal Electric Generator (TEG) includes a high efficiency multi-layer semiconductor device adapted to enable heat, over a wide temperature range, to be converted into useful power. This is not a simple solar panel. The “heat” referred to here can be from radiation or any other convection or conduction source. One important aspect is that the TEG not only works in a “solar” environment, but is more particularly adapted to recover energy from heat generated by electronic components and circuits, mechanical rotating equipment and machinery, waste energy, furnaces, geothermal, etc. This heat comes in the form of released electrons, thus, the invention is based on the concept of fluctuation voltages and the conversion of the same into useful energy, which translates into an increased efficiency of over 50% compared to the peak existing efficiency (i.e.
    Type: Application
    Filed: April 10, 2002
    Publication date: October 16, 2003
    Inventor: Hector Guevara
  • Patent number: 6620994
    Abstract: A thermoelectric module including a couple formed between two bismuth telluride thermoelectrodes. The first thermoelectrode is doped with palladium, selenium, or a combination of the two. The second thermoelectrode is doped with antimony, gold, or a combination of the two. Multiple thermoelectric modules may be used in series and parallel to achieve the desired voltage and current outputs.
    Type: Grant
    Filed: October 4, 2001
    Date of Patent: September 16, 2003
    Assignee: Leonardo Technologies, Inc.
    Inventor: Andrea Rossi
  • Patent number: 6552255
    Abstract: The thermoelectric properties (resistivity, thermopower and thermal conductivity) of single crystals of the low-dimensional pentatelluride materials are disclosed. The pentatellurides are well suited for use in thermoelectric devices. In general, the pentatellurides include hafnium pentatelluride and zirconium pentatelluride, which can both be substituted with selective amounts of various metals, including titanium, selenium, and antimony.
    Type: Grant
    Filed: September 3, 1999
    Date of Patent: April 22, 2003
    Assignee: Clemson University
    Inventors: Terry M. Tritt, Roy L. Littleton, Joseph Kolis, Christopher Feger
  • Publication number: 20030056819
    Abstract: Compounds are expressed by general formula of AxBC2−y where 0≦x≦2 and 0≦y<1, and have CdI2 analogous layer structures; A-site is occupied by at least one element selected from the group consisting of Li, Na, K, Rb, Cs, Mg, Ca, Sr, Ba, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Zr, Nb, Mo, Ru, Rh, Pd, Ag, Cd, Hf, Ta, W, Re, Ir, Pt, Au, Sc, rare earth elements containing Y, B, Al, Ga, In, Tl, Sn, Pb and Bi; B-site is occupied by at least one element selected from the group consisting of Ti, V, Cr, Zr, Nb, Mo, Hf, Ta, W, Ir, and Sn; C-site is occupied by at least one element selected from the group consisting of S, Se and Te; the compounds exhibit large figure of merit so as to be preferable for thermoelectric generator/refrigerator.
    Type: Application
    Filed: February 25, 2002
    Publication date: March 27, 2003
    Applicant: NEC Corporation
    Inventors: Hideto Imai, Yuichi Shimakawa, Takashi Manako, Yoshimi Kubo
  • Patent number: 6525260
    Abstract: A silicon-based polycrystal powder, which contains no more than 30 at % Ge, C, Sn, or another such element that does not generate carriers as well as an added element that does generate carriers, and which has a crystal structure including crystal grains made up of at least 80 at % silicon, and a grain boundary phase where at least one type of said added element is precipitated at the boundary of said crystal grains, is mixed with a clathrate compound powder with low thermal conductivity and electrical resistivity, and this mixture is subjected to hot compression molding, the product of which has a composite structure in which the particles of the clathrate compound polycrystals are disposed around the particles of the silicon-based polycrystals.
    Type: Grant
    Filed: August 17, 2001
    Date of Patent: February 25, 2003
    Assignee: Sumitomo Special Metals Co., Ltd.
    Inventors: Osamu Yamashita, Nobuhiro Sadatomi, Tsunekazu Saigo
  • Publication number: 20030029492
    Abstract: A thermoelectric material comprising a Group IV element boride doped with one of the Group III, IV, or V elements, wherein the doping element is different from the Group IV element in the Group IV element boride, and the doping element is not boron. A method of fabricating a thermoelectric material including the steps of: providing a Group IV element boride, and doping the Group IV element boride with a doping element chosen from one of the column III, IV, or V elements, wherein the doping element is different from the Group IV element in the Group IV element boride, and the doping element is not boron. An alternate method of fabricating a thermoelectric material is also disclosed including the steps of simultaneously growing on a substrate a Group IV element boride and at least one doping element chosen from one of the Group III, IV, or V elements wherein the doping element is different than the Group IV element in the Group IV element boride and the doping element is not boron.
    Type: Application
    Filed: August 13, 2001
    Publication date: February 13, 2003
    Applicant: Motorola, Inc.
    Inventors: Jun Wang, Daniel S. Marshall
  • Patent number: 6498288
    Abstract: Provided is an SiGe crystal having an improved performance index and excellent machinability as a material constituting a thermoelectric element, neither degradation in characteristics nor cracking occurring during use. Crystal grains forming the crystal are 5×10−5 mm3 or more in size.
    Type: Grant
    Filed: July 24, 2000
    Date of Patent: December 24, 2002
    Assignee: Shin-Etsu Handotai Co., Ltd.
    Inventors: Takao Abe, Ichiro Yonenaga, Tetsuya Igarashi
  • Patent number: 6444896
    Abstract: Quantum-dot superlattice (QLSL) structures having improved thermoelectric properties are described. In one embodiment, PbSexTe1−x/PbTe QDSLs are provided having enhanced values of Seebeck coefficient and thermoelectric figure of merit (ZT) relative to bulk values.
    Type: Grant
    Filed: August 25, 2000
    Date of Patent: September 3, 2002
    Assignee: Massachusetts Institute of Technology
    Inventors: Theodore C. Harman, Patrick J. Taylor, Michael P. Walsh
  • Publication number: 20020088485
    Abstract: It is an object of the present invention to provide a thermoelectric conversion material, and a method for manufacturing this material, with which the thermal conductivity of a silicon-based thermoelectric conversion material can be greatly lowered without lowering the Seebeck coefficient or electrical conductivity of the material, which affords a marked increase in the thermoelectric figure of merit.
    Type: Application
    Filed: August 17, 2001
    Publication date: July 11, 2002
    Inventors: Osamu Yamashita, Nobuhiro Sadatomi, Tsunekazu Saigo
  • Patent number: 6399871
    Abstract: Ternary tellurium compounds and ternary selenium compounds may be used in fabricating thermoelectric devices with a thermoelectric figure of merit (ZT) of 1.5 or greater. Examples of such compounds include Tl2SnTe5, Tl2GeTe5, K2SnTe5 and Rb2SnTe5. These compounds have similar types of crystal lattice structures which include a first substructure with a (Sn, Ge) Te5 composition and a second substructure with chains of selected cation atoms. The second substructure includes selected cation atoms which interact with selected anion atoms to maintain a desired separation between the chains of the first substructure. The cation atoms which maintain the desired separation between the chains occupy relatively large electropositive sites in the resulting crystal lattice structure which results in a relatively low value for the lattice component of thermal conductivity (&kgr;g).
    Type: Grant
    Filed: December 29, 2000
    Date of Patent: June 4, 2002
    Assignee: Marlow Industries, Inc.
    Inventor: Jeffrey W. Sharp
  • Patent number: RE39640
    Abstract: A family of isostructural compounds have been prepared having the general formula AnPbmBinO2n+m. These compounds possess a NaCl lattice type structure as well as low thermal conductivity and controlled electrical conductivity. Furthermore, the electrical properties can be controlled by varying the values for n and m. These isostructural compounds can be used for semiconductor applications such as detectors, lasers and photovoltaic cells. These compounds also have enhanced thermoelectric properties making them excellent semiconductor materials for fabrication of thermoelectric devices.
    Type: Grant
    Filed: November 6, 2003
    Date of Patent: May 22, 2007
    Assignee: Board of Trustees operating Michigan State University
    Inventors: Mercouri G. Kanatzidis, Duck-Young Chung, Stephane DeNardi, Sandrine Sportouch