Metallic Patents (Class 148/24)
  • Patent number: 10410992
    Abstract: A ball forming device 50 for forming a ball 43 at a tip of a wire 42 by producing discharge between a torch electrode 48 and the tip of the wire 42, the device includes: a current supply unit 54 configured to supply a ball-forming current between the torch electrode 48 and the tip of the wire 42; and a current control unit 57 configured to control the current supply unit 54, so that a signal of the ball-forming current for a predetermined period includes a first period in which the signal takes a predetermined current value and a second period including a triangle wave. With this, it is possible to provide a ball forming device, a wire-bonding apparatus, and a ball formation method that are capable of suppressing formation of deformed balls.
    Type: Grant
    Filed: August 12, 2016
    Date of Patent: September 10, 2019
    Assignee: SHINKAWA LTD.
    Inventors: Yoshihito Hagiwara, Kazumasa Sasakura, Tatsuyuki Sunada
  • Patent number: 10406637
    Abstract: A welding wire is provided with a hollow section for accommodating flux. The flux has a composition including: Mn: 5-20%, Si: 1-15%, TiO2: 5-25%, SiO2: 0.1-10%, Mo: 0.1-5% by weight, the balance being iron. When welding low alloy high strength steel by using the welding wire, the slag on the welding bead can be easily cleaned and a smooth surface can be formed on the welding bead which makes it easier to galvanize a zinc layer over the surface of the welding bead. The welding wire provides better welding operation performance and generates less welding spatters.
    Type: Grant
    Filed: October 20, 2010
    Date of Patent: September 10, 2019
    Assignee: ILLINOIS TOOL WORKS INC.
    Inventors: Jie Yan, Xiangui Cao, Fuhu Chen, Mingqian Yang
  • Patent number: 10369666
    Abstract: It is an object to provide a stainless steel flux-cored wire in which the amount of hexavalent chromium in fume can be reduced while maintaining the weldability excellent. The stainless steel flux-cored wire contains, as percentage to the total mass of the wire: Cr: 11-30 mass %; metal Si, Si oxide and Si compound: 0.5-4.0 mass % in total in terms of Si [Si]; fluorine compound: 0.01-1.0 mass % in terms of F [F]; TiO2: 1.5 mass % or above; ZrO2+Al2O3: 3.2 mass % or below; Na compound, K compound and Li compound: 0.50 mass % or below in total of each of an amount in terms of Na [Na], an amount in terms of K [K] and an amount in terms of Li [Li]; and satisfies {([Na]+[K]+[Li])×[Cr]2}/([Si]+4.7×[F])?10, where [Cr] represents Cr content.
    Type: Grant
    Filed: January 3, 2012
    Date of Patent: August 6, 2019
    Assignee: Kobe Steel, Ltd.
    Inventors: Hiroshi Sugahara, Tetsunao Ikeda, Hirohisa Watanabe
  • Patent number: 10347388
    Abstract: The purpose of the present invention is to provide a conductive copper paste which is curable in an ambient atmosphere, has a long pot life, and, has a low specific resistance even under a high-temperature and short-time curing condition, wherein the specific resistance after curing does not greatly vary depending on a copper powder content. The conductive copper paste provided is characterized by containing (A) a copper powder, (B) a thermosetting resin, (C) a fatty acid that is liquid at normal temperature, and (D) triethanolamine. Preferably, component (B) is a resol-type phenol resin. More preferably, the content of component (B) is 10 to 20 parts by mass with respect to a total of 100 parts by mass of component (A) and component (B).
    Type: Grant
    Filed: February 29, 2016
    Date of Patent: July 9, 2019
    Assignee: NAMICS CORPORATION
    Inventors: Masashi Kajita, Takashi Sakamoto, Shigeko Konno, Tomoyuki Takahashi
  • Patent number: 10300565
    Abstract: This disclosure relates generally to Gas Metal Arc Welding (GMAW) and, more specifically, to Metal-cored Arc Welding (MCAW) of mill scaled steel workpieces. A metal-cored welding wire, including a sheath and a core, capable of welding mill scaled workpieces without prior descaling is disclosed. The metal-cored welding wire has a sulfur source that occupies between approximately 0.04% and approximately 0.18% of the weight of the metal-cored welding wire, and has a cellulose source that occupies between approximately 0.09% and approximately 0.54% of the weight of the metal-cored welding wire.
    Type: Grant
    Filed: October 9, 2015
    Date of Patent: May 28, 2019
    Assignee: HOBART BROTHERS COMPANY
    Inventors: Steven Edward Barhorst, Daryl L. Duncan, Joseph C. Bundy, Zhigang Xiao
  • Patent number: 10299388
    Abstract: A solder alloy suitable for high temperature environments, such as for example electronic systems used in an oil or gas well where the temperature may be in the region of 175° C., the solder alloy having a Silver weight % in the range of 3.5 to 7.0, a Copper weight % in the range of 1.0 to 4.0, and an Antimony weight % in the range of 1.0 to 3.0. Other embodiments are described and claimed.
    Type: Grant
    Filed: May 4, 2016
    Date of Patent: May 21, 2019
    Assignee: Halliburton Energy Services, Inc.
    Inventors: Andrew Albert Hrametz, Alexander T. Duncan
  • Patent number: 10189121
    Abstract: The present invention relates to organic acid- or latent organic acid-functionalized polymer-coated metal powders, such as metal powders used as appropriate in the formation of solder alloys, spheres and pastes.
    Type: Grant
    Filed: May 18, 2017
    Date of Patent: January 29, 2019
    Assignee: Henkel IP & Holding GmbH
    Inventor: Puwei Liu
  • Patent number: 10160827
    Abstract: A resin composition having an adhesive property in a high temperature range that is estimated during soldering, and flux using this resin composition, a flux residue of which is washable. The resin composition contains a hydroxyl carboxylic acid having two or more carboxyl groups and a hydroxyl group in its molecule and a thermosetting resin in a ratio of 1:3 or more and 1:7 or less. Further, the flux contains the hydroxyl carboxylic acid having two or more carboxyl groups and a hydroxyl group in its molecule in an amount of 8.5% by mass or more and 16% by mass or less, and a thermosetting resin in an amount of 50% by mass or more and 60% by mass or less, wherein a ratio between the hydroxyl carboxylic acid and the thermosetting resin is 1:7 or less.
    Type: Grant
    Filed: October 14, 2015
    Date of Patent: December 25, 2018
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Daisuke Maruko, Atsumi Takahashi, Takayuki Yoshida
  • Patent number: 10137536
    Abstract: Provided is a solder alloy having excellent wettability on both of a Cu surface and an Ni surface. The solder alloy has such an alloy composition that 0.6 to 0.9 mass % of Cu and 0.01 to 0.1 mass % of Al are contained, 0.02 to 0.1 mass % of Ti and/or 0.01 to 0.05 mass % of Co may be contained as required and the remainder is made up by Sn.
    Type: Grant
    Filed: December 25, 2012
    Date of Patent: November 27, 2018
    Assignee: SENJU METAL INDUSTRY CO., LTD.
    Inventors: Tsukasa Ohnishi, Shunsaku Yoshikawa, Seiko Ishibashi, Rei Fujimaki
  • Patent number: 10118260
    Abstract: A solder paste consists of an amount of a first solder alloy powder between 60 wt % to 92 wt %; an amount of a second solder alloy powder greater than 0 wt % and less than 12 wt %; and a flux; wherein the first solder alloy powder comprises a first solder alloy that has a solidus temperature above 260° C.; and wherein the second solder alloy powder comprises a second solder alloy that has a solidus temperature that is less than 250° C.
    Type: Grant
    Filed: February 23, 2015
    Date of Patent: November 6, 2018
    Assignee: Indium Corporation
    Inventors: Hongwen Zhang, Ning-Cheng Lee
  • Patent number: 10112268
    Abstract: The invention relates generally to welding and, more specifically, to welding wires for arc welding, such as Gas Metal Arc Welding (GMAW) or Flux Core Arc Welding (FCAW). A disclosed tubular welding wire has a sheath and a core, and the tubular welding wire includes an organic stabilizer component, a rare earth component, and a corrosion resistant component comprising one or more of: nickel, chromium, and copper.
    Type: Grant
    Filed: October 8, 2014
    Date of Patent: October 30, 2018
    Assignee: HOBART BROTHERS COMPANY
    Inventors: Mario Anthony Amata, Steven Edward Barhorst, Tre′ Dorell Heflin-King
  • Patent number: 10111342
    Abstract: Provided is a solder transfer sheet which is capable of increasing the amount of solder to be transferred without the occurrence of bridging. A solder transfer sheet 1A includes a base material 5, an adhesive layer 4 formed on the surface of the base material 5, a solder powder-containing adhesive layer 3 formed on the surface of the adhesive layer 4, and a solder powder layer 2 formed on the surface of the solder powder-containing adhesive layer 3. In the solder powder layer 2, particles of solder powder 20 are arranged in a one-layer sheet form. In the solder powder-containing adhesive layer 3, solder powder 30 and an adhesive component 31 are mixed so as to have such a thickness that two or more layers of the solder powder 30 are stacked.
    Type: Grant
    Filed: December 21, 2015
    Date of Patent: October 23, 2018
    Assignees: Senju Metal Industry Co., Ltd., Nitta Corporation
    Inventors: Kaichi Tsuruta, Takeo Saitoh, Manabu Muraoka, Hiroki Oshima, Koji Yamashita, Shinichiro Kawahara
  • Patent number: 10090268
    Abstract: A solder bump formed on an Ni electrode with the use of a solder ball containing Bi as a main component and Sn as a sub component. The solder ball contains Sn from 1.0 to 10.0 mass % and at most 1.0 mass % of at least one of Cu and Ag. A solder joint portion obtained by use of the solder bump has at least one of Sn and an SnBi eutectic alloy.
    Type: Grant
    Filed: July 27, 2015
    Date of Patent: October 2, 2018
    Assignees: MURATA MANUFACTURING CO., LTD., SENJU METAL INDUSTRY CO., LTD.
    Inventors: Yasuyuki Sekimoto, Hidekiyo Takaoka, Shigeo Nishimura, Minoru Ueshima, Tohru Kurushima
  • Patent number: 10086478
    Abstract: According to one embodiment, a metallic particle paste includes a polar solvent and particles dispersed in the polar solvent and containing a first metal. A second metal different from the first metal is dissolved in the polar solvent.
    Type: Grant
    Filed: July 22, 2014
    Date of Patent: October 2, 2018
    Assignee: KABUSHIKI KAISHA TOSHIBA
    Inventors: Daisuke Hiratsuka, Tomohiro Iguchi, Masayuki Uchida
  • Patent number: 10016850
    Abstract: The invention relates generally to welding and, more specifically, to welding wires for arc welding, such as Gas Metal Arc Welding (GMAW) or Flux Core Arc Welding (FCAW). In one embodiment, a method of manufacturing a tubular welding wire includes disposing a core within a metallic sheath. Further, the core includes an organic stabilizer component, in which the organic stabilizer component is an alkali metal or alkali earth metal salt of an organic molecule or an organic polymer.
    Type: Grant
    Filed: January 16, 2013
    Date of Patent: July 10, 2018
    Assignee: HOBART BROTHERS COMPANY
    Inventors: Steven Barhorst, Mario Amata, Kevin Pagano
  • Patent number: 9831199
    Abstract: An electronic device includes a first electronic part, a second electronic part opposite the first electronic part, and a bonding portion between the first electronic part and the second electronic part. The bonding portion contains a solder containing a substance whose crystal structure reversibly changes in temperature rise and fall processes which accompany the operation of the electronic device or electronic equipment including the electronic device. A change in the crystal structure of the substance contained in the solder promotes recovery and recrystallization of the solder in the temperature rise and fall processes which accompany the operation of the electronic device or the electronic equipment. As a result, the coarsening of crystal grains in the solder is suppressed.
    Type: Grant
    Filed: September 26, 2016
    Date of Patent: November 28, 2017
    Assignee: FUJITSU LIMITED
    Inventors: Taiki Uemura, Seiki Sakuyama
  • Patent number: 9768137
    Abstract: A semiconductor package structure comprises a substrate, a die bonded to the substrate, and one or more stud bump structures connecting the die to the substrate, wherein each of the stud bump structures having a stud bump and a solder ball encapsulating the stud bump to enhance thermal dissipation and reduce high stress concentrations in the semiconductor package structure.
    Type: Grant
    Filed: April 30, 2012
    Date of Patent: September 19, 2017
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Meng-Tse Chen, Hsiu-Jen Lin, Chih-Wei Lin, Cheng-Ting Chen, Ming-Da Cheng, Chung-Shi Liu
  • Patent number: 9731383
    Abstract: A brazing or soldering wire has a pair channels recessed therein. A divider separates the pair of channels. The divider has opposing walls extending outwardly from corresponding base portions of the pair of channels. A first engagement surface is located between the opposing walls. A pair of outer walls is separated by the pair of channels and the divider. A second engagement surface is formed between an outer surface of the elongated wire and a terminal end of one of the outer walls and is substantially coplanar with the first engagement surface. A third engagement surface is formed between the outer surface of the elongated wire and a terminal end of the other of the outer walls and is substantially coplanar with the first engagement surface. A cured flux solution is located within the pair of channels.
    Type: Grant
    Filed: July 9, 2014
    Date of Patent: August 15, 2017
    Assignee: Bellman-Melcor Development, LLC
    Inventor: Steven Campbell
  • Patent number: 9724786
    Abstract: Various embodiments of a metal cored wires, hardband alloys, and methods are disclosed. In one embodiment of the present invention, a hardbanding wire comprises from about from about 16% to about 30% by weight chromium; from about 4% to about 10% by weight nickel; from about 0.05% to about 0.8% by weight nitrogen; from about 1% to about 4% by weight manganese; from about 1% to about 4% by weight carbon from about 0.5% to about 5% by weight molybdenum; from about 0.25% to about 2% by weight silicon; and the remainder is iron including trace elements. The hardband alloy produced by the metal cored wire meets API magnetic permeability specifications and has improved metal to metal, adhesive wear resistance compared to conventional hardband alloys.
    Type: Grant
    Filed: November 12, 2013
    Date of Patent: August 8, 2017
    Assignee: Postle Industries, Inc.
    Inventor: Christopher J. Postle
  • Patent number: 9721599
    Abstract: A suspension board with circuit includes a metal supporting board, an insulating base layer formed on one side of the metal supporting board in a thickness direction thereof, a conductive layer, and an insulating cover layer formed on the one side of the insulating base layer to cover the conductive layer. Either one of the insulating base layer and the insulating cover layer includes an opening extending therethrough in the thickness direction. The conductive layer includes a wire formed on the one side of the insulating base layer, and a connection terminal electrically connected to the wire and exposed from the opening to be capable of electrical connection to an electronic element. The suspension board with circuit further includes a protective layer for protecting the connection terminal exposed from the opening.
    Type: Grant
    Filed: June 4, 2015
    Date of Patent: August 1, 2017
    Assignee: NITTO DENKO CORPORATION
    Inventor: Takatoshi Sakakura
  • Patent number: 9610655
    Abstract: A solder paste includes a flux and powder mixed with the flux, where the powder includes first powder and second powder mixed with each other. The first powder may be a tin (Sn) and at least one metal dissolved in the tin (Sn), and the second powder may be a copper (Cu) powder, the surface of which is coated with silver (Ag).
    Type: Grant
    Filed: May 7, 2014
    Date of Patent: April 4, 2017
    Assignee: LG INNOTEK CO., LTD.
    Inventor: Deok Ki Hwang
  • Patent number: 9604315
    Abstract: Provided is a welding method and electrodes (wires) with aluminum as a primary deoxidizer and a basic flux system for joining a workpieces with weld metal of comparable strengths and enhanced toughness. For instance, provided is a welding wire, comprising an aluminum content configured to act as a primary deoxidizer, and an overall composition configured to produce a weld deposit comprising a basic slag over a weld bead, wherein the aluminum content is configured to kill the oxygen in the weld pool, and wherein the oxygen comprises oxygen provided by a shielding gas or produced by heating of welding filler materials. Further provided is a welding method comprising arc welding a workpiece using an electrode having aluminum as a primary deoxidizer under a gas shield to produce a bead of weld deposit and a basic slag over the weld bead.
    Type: Grant
    Filed: October 19, 2015
    Date of Patent: March 28, 2017
    Assignee: ILLINOIS TOOL WORKS INC.
    Inventors: Mario Anthony Amata, Joseph C. Bundy
  • Patent number: 9597753
    Abstract: A solder paste whereby metal does not flow out of a joint during a second or subsequent reflow heating stage. The solder paste excels in terms of temporal stability and exhibits high joint strength at room temperature and at high temperatures. The solder paste comprises a powdered metal component and a flux component, the powdered metal component comprising: 10-70 mass % of a powdered intermetallic compound comprising copper and tin and 30-90 mass % of a solder powder including tin as a main component. Neither the powdered intermetallic compound nor the solder powder contains a copper-only phase, inhibiting the elution of copper ions into the flux.
    Type: Grant
    Filed: March 28, 2014
    Date of Patent: March 21, 2017
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Motoki Koroki, Shunsaku Yoshikawa, Sakie Okada, Taro Itoyama, Hideyuki Komuro, Naoko Hirai, Keitaro Shimizu
  • Patent number: 9573836
    Abstract: The present invention concerns a bushing assembly comprising: (a) a liquid glass feeding unit arranged upstream of and in fluid communication with, (b) a first and second tip plate assemblies (1A, 1B) extending along a longitudinal direction, arranged side by side, and each surrounded by side walls and end walls and, the first and second tip plate assemblies being separated from one another by a stiffening rib structure (21) extending along said longitudinal direction, characterized in that, the feeding unit comprises a glass distribution manifold (2), which defines two separate fluid communication paths to the first and second tip plate assemblies (1A, 1B), and in that, the stiffening rib structure (21) forms an integral part of the floor of the manifold (2).
    Type: Grant
    Filed: May 17, 2013
    Date of Patent: February 21, 2017
    Assignee: 3B-Fibreglass sprl
    Inventors: Philippe Simon, Dimitri Laurent, Utku Ahmet Özden, Christoph Broeckmann, Alexander Bezold
  • Patent number: 9572255
    Abstract: An electronic device has a printed substrate having land electrodes and a chip-type electronic component having external electrodes formed on a surface of a component element body. The land electrodes and the external electrodes are bonded via a solder to form electrode bonding parts. A thermosetting resin is filed between the electrode bonding parts. The bonding material contains solder particles having a melting point T1, a thermosetting resin having a curing temperature T2 that is higher than the melting point T1, and an activating agent having an activation temperature T3 that is lower than the curing temperature T2. The viscosity of the contained components except the solder particles at the melting point T1 is 0.57 Pa·s or less, and the melting point T1 and the activation temperature T3 satisfy T1?T3<50° C.
    Type: Grant
    Filed: March 25, 2014
    Date of Patent: February 14, 2017
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Akihiro Nomura, Hidekiyo Takaoka
  • Patent number: 9541366
    Abstract: A spark generating tube includes a single tube and a pyrotechnical mixture. The single tube only has a single layer of plastic material, such as ethylene vinyl acetate (EVA) and polyethylene. The pyrotechnical mixture has formed a thin layer in contact with the single layer of the single tube. The pyrotechnical contains an oxidizer, a reducing agent, a substance with low temperature of Tammann and an agent for lubricating and adhering, wherein the agent for lubricating and adhering is either talc or graphite, and the reducing agent can be an aluminum powder in microscale. During the process for manufacturing a spark generating tube, the mixture of the oxidizers and additives is formed separately from the reducing agent. The final mixture is obtained only in the single tube formed with an extruder. In this way, only a very small amount of pyrotechnic mixture is formed at any instant.
    Type: Grant
    Filed: August 25, 2014
    Date of Patent: January 10, 2017
    Assignee: IBQ INDUSTRIAS QUIMICAS S/A
    Inventor: Marco Antonio Falquete
  • Patent number: 9527168
    Abstract: A titanium oxide raw material for a welding material, which can achieve the improvement in a bead shape and high-speed welding. The titanium oxide raw material has the form of particles and has a composition containing 58.0 to 99.0 mass % of TiO2, 2.5 mass % or less of Si, 3.0 mass % or less of Al, 5.0 mass % or less of Mn, 35.0 mass % or less of Fe, 5.0 mass % or less of Mg and 2.0 mass % or less of Ca, wherein the surface of each of the particles is coated with an oxide and/or a composite oxide of at least one element selected from Ti, Fe, Mn, Al and Si and the atom percentages of Ti, Fe, Mn, Al, Si and O in the oxide and/or the composite oxide fulfill the following three formulae.
    Type: Grant
    Filed: January 25, 2012
    Date of Patent: December 27, 2016
    Assignee: Kobe Steel, Ltd.
    Inventors: Eri Yamamoto, Norio Masaie, Akiyoshi Kataoka
  • Patent number: 9529333
    Abstract: A method of assembling a device including first and second parts, the method including: taking the first and second parts; assembling the first and second parts provided by their arrangement so a gap is present between the first and second parts; taking a metal alloy, chosen for its ability to become at least partially amorphous; shaping the metal alloy to fill the gap between the first and second parts to join them and thereby form the device, the metal alloy having been subject to a treatment allowing the alloy to become at least partially amorphous, at a latest at a time of the shaping. The metal alloy is subject to a temperature increase above the melting temperature thereof causing the alloy to lose any local crystalline structure, the increase followed by cooling to a lower temperature than vitreous transition temperature thereof allowing the material to become at least partially amorphous.
    Type: Grant
    Filed: June 22, 2011
    Date of Patent: December 27, 2016
    Assignee: The Swatch Group Research and Development Ltd.
    Inventors: Yves Winkler, Stewes Bourban, Alban Dubach
  • Patent number: 9515044
    Abstract: Provided is an electronic device which includes a conductor allowing an electric signal to transmit therethrough, the conductor containing a plurality of species of metal components having different melting points, and internally having a constituent concentration gradient produced as a result of diffusion of the metal components.
    Type: Grant
    Filed: October 14, 2015
    Date of Patent: December 6, 2016
    Assignee: Napra Co., Ltd.
    Inventor: Shigenobu Sekine
  • Patent number: 9504168
    Abstract: A fluxing-encapsulant material and method of use thereof in a thermal compression bonding (TCB) process is described. In an embodiment, the TCB process includes ramping the bond head to 250° C.-300° C. at a ramp rate of 50° C./second-100° C./second. In an embodiment, the fluxing-encapsulant material comprising one or more epoxy resins having an epoxy equivalent weight (EEW) of 150-1,000, a curing agent, and a fluxing agent having a mono-carboxylic acid or di-carboxylic acid and a pKa of 4-5.
    Type: Grant
    Filed: September 30, 2011
    Date of Patent: November 22, 2016
    Inventors: Sivakumar Nagarajan, Sandeep Razdan, Nisha Ananthakrishnan, Craig J. Weinman, Kabirkumar J. Mirpuri
  • Patent number: 9498853
    Abstract: The present invention provides an amorphous caesium aluminum fluoride complex, a process for its production and the use of the complex as a flux, in particular for the soft soldering of aluminum.
    Type: Grant
    Filed: December 20, 2006
    Date of Patent: November 22, 2016
    Inventors: Gerd J. Harms, Hartmut Hofmann, Klaus-Peter Lehmann, Alexander Schiedt
  • Patent number: 9475154
    Abstract: Electrodes for depositing hardfacing alloys containing boron, carbon, chromium, manganese, and silicon on the surface of metal components that are subjected to high thermal and mechanical stresses. The deposited hardfacing alloys have from about 2.5 to about 14.0 atomic percent boron and have a hardness on the Rockwell “C” scale of at least about 65 HRC in the first layer of the weld deposit.
    Type: Grant
    Filed: May 30, 2013
    Date of Patent: October 25, 2016
    Assignee: Lincoln Global, Inc.
    Inventors: Daniel J Langham, Badri K Narayanan
  • Patent number: 9227273
    Abstract: There is provided a high-temperature Pb-free solder paste having the strength required to join electronic parts to a substrate and having excellence in wettability and workability. The solder paste formed by mixing a solder alloy and a flux, the solder alloy consisting of, based on the total mass of the solder alloy as 100 mass %: 0.4 to 13.5 mass % of Zn, at least one of 0.01 to 2.0 mass % of Cu or 0.03 to 0.7 mass % of Al, and a balance being Bi except for inevitable impurities.
    Type: Grant
    Filed: November 18, 2011
    Date of Patent: January 5, 2016
    Assignee: SUMITOMO METAL MINING CO., LTD.
    Inventor: Takashi Iseki
  • Patent number: 9209155
    Abstract: The present invention aims to provide a method for producing a semiconductor device, the method being capable of achieving high reliability by suppressing voids. The present invention also aims to provide a flip-chip mounting adhesive for use in the method for producing a semiconductor device. The present invention relates to a method for producing a semiconductor device, including: step 1 of positioning a semiconductor chip on a substrate via an adhesive, the semiconductor chip including bump electrodes each having an end made of solder; step 2 of heating the semiconductor chip at a temperature of the melting point of the solder or higher to solder and bond the bump electrodes of the semiconductor chip to an electrode portion of the substrate, and concurrently to temporarily attach the adhesive; and step 3 of removing voids by heating the adhesive under a pressurized atmosphere, wherein the adhesive has an activation energy ?E of 100 kJ/mol or less, a reaction rate of 20% or less at 2 seconds at 260° C.
    Type: Grant
    Filed: August 5, 2013
    Date of Patent: December 8, 2015
    Assignee: SEKISUI CHEMICAL CO., LTD.
    Inventors: Sayaka Wakioka, Hiroaki Nakagawa, Yoshio Nishimura, Shujiro Sadanaga
  • Patent number: 9107332
    Abstract: A printed circuit board includes a base, a circuit pattern, a solder mask, an activated metal layer, a plurality of metal seed layers, and a plurality of metal bumps. The conductive circuit pattern is formed on the base, to include a plurality of conductive pads. The solder mask is formed on a surface of the conductive circuit pattern and portions of the base are exposed from the circuit pattern. The solder mask includes blind vias corresponding to the pads, and laser-activated catalyst. The activated metal layer is obtained by laser irradiation at the wall of the blind via. The activated metal layer is in contact with the solder mask. The metal seed layer is formed on the activated metal layer and the pads. Each metal bump is formed on the metal seed layer, and each metal bump protrudes from the solder mask.
    Type: Grant
    Filed: April 16, 2013
    Date of Patent: August 11, 2015
    Assignee: Zhen Ding Technology Co., Ltd.
    Inventor: Wen-Hung Hu
  • Patent number: 9095936
    Abstract: The present invention relates to variable melting point solder formulations. The solder is comprised of at least one base metal or base metal alloy, preferably alloyed with at least one melting point depressant metal, such that the solidus point of the solder composition is reduced to an initial solidus temperature. Said base metal or base metal alloy, alloyed with at least one melting point depressant metal is mixed with at least one additive metal or additive metal alloy. When heated to a process temperature above said initial solidus temperature, a reaction occurs between the melting point depressant metal, and the additive metal, such that solidification occurs at the process temperature via the formation of intermetallic phases, effectively increasing the solidus of the base metal, and of the overall solder.
    Type: Grant
    Filed: August 26, 2011
    Date of Patent: August 4, 2015
    Assignee: DYNAJOIN CORPORATION
    Inventors: Douglas J. McIsaac, Mark A. Whitney, Stephen F. Corbin
  • Patent number: 9085051
    Abstract: Certain example embodiments of this invention relate to silver pastes that are capable of making an electrical connection with at least one conductive layer in a layer stack, even where the at least one conductive layer is protected by one or more strong dielectric layers, and/or methods of making the same. Certain example embodiments include a chemically modified silver paste that may be cured or fired using a standard glass tempering furnace (e.g., an electrical or gas-fuelled furnace) or a short-wave infrared heating process at temperatures below 750 degrees C. In certain example embodiments, the fluorine causes apertures or micro-factures in the dielectric layer(s), which allows the silver in the paste to move therethrough (e.g., by capillary action) to form a contact with the conductive layer(s).
    Type: Grant
    Filed: March 29, 2010
    Date of Patent: July 21, 2015
    Assignee: Gaurdian Industries Corp.
    Inventor: Jemssy Alvarez
  • Publication number: 20150136461
    Abstract: A solder alloy of a tin-silver-copper solder alloy, containing tin, silver, antimony, bismuth, copper, and nickel, and substantially does not contain germanium, relative to the total amount of the solder alloy, the silver content is more than 1.0 mass % and less than 1.2 mass %, the antimony content is 0.01 mass % or more and 10 mass % or less, and the bismuth content is 0.01 mass % or more and 3.0 mass % or less.
    Type: Application
    Filed: June 25, 2013
    Publication date: May 21, 2015
    Inventors: Yoji Imamura, Kazuki Ikeda, JinYu Piao, Tadashi Takemoto
  • Publication number: 20150125281
    Abstract: A multi-component braze filler alloy comprising at least 70% by weight MarM509A superalloy with the remainder MarM509B superalloy is diffusion brazed to a CM247 alloy base substrate, such as a gas turbine blade or vane. It is shown that generally higher braze temperatures lead to improved results including the possibility of re-welding such a brazed component, resulting in a re-repaired brazed component capable of continued commercial service.
    Type: Application
    Filed: November 4, 2013
    Publication date: May 7, 2015
    Inventors: Petya M. Georgieva, James A. Yarbrough
  • Publication number: 20150110548
    Abstract: The present disclosure provides compositions and methods for forming three-dimensional structures atop substrates. These structures may be formed and processed so as to braze together two substrates. The structures may be controllably formed in three dimensions so as to accommodate virtually any substrate geometry or configuration. The structures may also be disposed so as to maintain spacing between two surfaces.
    Type: Application
    Filed: October 22, 2014
    Publication date: April 23, 2015
    Inventor: Aarne H. Reid
  • Publication number: 20150090367
    Abstract: A flux for soldering includes a base resin, a solvent, and an activating agent. The base resin contains a rosin. An amount of the rosin to be incorporated is from 0% by weight to 30% by weight with respect to a total amount of the base resin. The activating agent includes a compound having a plurality of carboxyl groups on a cyclohexyl structure represented by a general formula (1). X is (a) one or more carboxyl groups, or (b) one or more carboxyl groups and at least one selected from a hydrogen atom, chloro group, bromo group, alkyl group, and cyclohexyl group. A position of the X is not limited. A number of the X is one or more. The X may have either one of the (a) and (b) alone, or a plurality of the (a) and (b) in combination.
    Type: Application
    Filed: September 25, 2014
    Publication date: April 2, 2015
    Applicant: TAMURA CORPORATION
    Inventors: Masahiro TSUCHIYA, Akira KITAMURA, Momoko SEINO, Masaya ARAI
  • Publication number: 20150086776
    Abstract: The present invention relates to a blend of at least one boron source and at least one silicon source, wherein the blend comprises boron and silicon in a weight ratio boron to silicon within a range from about 5:100 to about 2:1, wherein silicon and boron are present in the blend in at least 25 wt %, and wherein the at least one boron source and the at least one silicon source are oxygen free except for inevitable amounts of contaminating oxygen, and wherein the blend is a mechanical blend of powders, and wherein particles in the powders have an average particle size less than 250 ?m. The present invention relates further to a composition comprising the blend a substrate applied with the blend, a method for providing a brazed product, and uses.
    Type: Application
    Filed: March 27, 2013
    Publication date: March 26, 2015
    Applicant: ALFA LAVAL CORPORATE AB
    Inventors: Per Sjödin, Kristian Walter
  • Publication number: 20150075676
    Abstract: The object of the present invention is to provide a soldering-flux-oriented novel base resin that enhances the fluidity of a soldering flux and both the visco-stability and adhesion of a solder paste, while improving the color tone and anti-crack property of the flux residue. The present invention is directed to a base resin for a soldering flux, the base resin comprising a rosin (A) containing at least 15 wt % of a pimarane-type resin acid (a-1), at least 1 wt % of a labdane-type resin acid (a-2), and at least 50 wt % of an abietane-type resin acid that has no conjugated double bond (a-3).
    Type: Application
    Filed: May 13, 2013
    Publication date: March 19, 2015
    Applicant: ARAKAWA CHEMICAL INDUSTRIES, LTD.
    Inventors: Yasushi Funakoshi, Takashi Nakatani, Tetsuya Yoshimoto
  • Publication number: 20150068713
    Abstract: The invention relates to a solder powder for connecting components made of aluminium or aluminium alloys by brazing, in particular a brazing powder for connecting heat exchanger components. The solder powder consists of powder particles on an aluminium-silicon base having a weight fraction of more than 12% by weight of silicon, wherein the powder particles have been produced by a rapid solidification and contain uniformly distributed silicon primary crystal precipitations in the eutectic aluminium-silicon alloy structure. Coating with such a solder powder leads to a uniform distribution of the silicon on the surface of the component coated with solder powder and thus to the same good soldering results.
    Type: Application
    Filed: March 20, 2013
    Publication date: March 12, 2015
    Inventors: Norbert William Sucke, Lothar Löchte, Martin Grzesik
  • Publication number: 20150069638
    Abstract: According to one embodiment, a metallic particle paste includes a polar solvent and particles dispersed in the polar solvent and containing a first metal. A second metal different from the first metal is dissolved in the polar solvent.
    Type: Application
    Filed: July 22, 2014
    Publication date: March 12, 2015
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Daisuke HIRATSUKA, Tomohiro IGUCHI, Masayuki UCHIDA
  • Publication number: 20150059928
    Abstract: Provided is flux which is capable of suppressing increase in the viscosity of solder paste during its storage and is also capable of improving the fusibility of a solder alloy. In the flux which contains an activator and a solvent and forms solder paste by being mixed with a granular solder alloy, this flux contains a solvent of monoalkyl propylene glycol series. It is preferable that the solvent of monoalkyl propylene glycol series is butyl propylene triglycol or butyl propylene diglycol. It is also preferable that a contented amount of the solvent of monoalkyl propylene glycol series is equal to or more than 75% but equal to or less than 100% relative to a contented amount of all the solvents.
    Type: Application
    Filed: April 5, 2012
    Publication date: March 5, 2015
    Applicant: Senju Metal Industry Co., Ltd.
    Inventors: Tomohiro Yamagame, Daisuke Minakuchi
  • Patent number: 8968488
    Abstract: A cream solder obtained by kneading an Sn—Ag—Cu alloy together with a flux, wherein the Sn—Ag—Cu alloy includes a mixture of a first powdery alloy and a second powdery alloy, the first powdery alloy is represented by an Sn—Ag phase diagram having a solid-liquid coexistence region and has a given silver amount which is larger than that in the eutectic composition (3.5 wt. % silver), and the second powdery alloy has a silver amount which is that in the eutectic composition (3.5 wt. % silver) or which is close to that in the eutectic composition and is smaller than that in the first powdery alloy. This cream solder has excellent strength and thermal stability, and satisfactory bonding properties. It is based on an inexpensive Sn—Ag—Cu solder alloy. It is suitable for use as a high-temperature-side lead-free solder material conformable to temperature gradation bonding. Also provided is a method of soldering.
    Type: Grant
    Filed: July 3, 2007
    Date of Patent: March 3, 2015
    Assignees: Fuji Electric Co., Ltd., Nihon Handa Co., Ltd.
    Inventors: Mitsuo Yamashita, Tomoaki Goto, Takeshi Asagi
  • Publication number: 20150053753
    Abstract: The present invention addresses the problem of providing a composite nanometal paste which is relatively low in price and is excellent in terms of bonding characteristics, thermal conductivity, and electrical property. The present invention is a copper-filler-containing composite nanometal paste that contains composite nanometal particles each comprising a metal core and an organic coating layer formed thereon. The metal paste contains a copper filler and contains, as binders, first composite nanometal particles and second composite nanometal particles which differ from the first composite nanometal particles in the thermal decomposition temperature of the organic coating layer, wherein the mass proportion W1 of the organic coating layer in the first composite nanometal particles is in the range of 2-13 mass %, the mass proportion W2 of the organic coating layer in the second composite nanometal particles is in the range of 5-25 mass %, and these particles satisfy the relationships W1.
    Type: Application
    Filed: March 30, 2012
    Publication date: February 26, 2015
    Applicants: Applied Nanoparticle Laboratory Corporation, Shindengen Electric Manufacturing Co., Ltd.
    Inventors: Teruo Komatsu, Ryo Matsubayashi
  • Patent number: 8961709
    Abstract: A solder paste using a Sn—Ag base, Sn—Cu base, or similar alloy powder has a high melting point, so it causes thermal damage to electronic devices. Sn—Ag—In base lead-free solder alloys having a low melting temperature have been studied, but they are difficult to use because they cause much occurrence of chips standing up during reflow. The present invention forms a solder paste by separating a Sn—Ag—In base lead-free solder into first and second solder alloy powders for which the difference in their peak temperatures measured by differential thermal analysis is at least 10° C. and blends the mixed powders with a flux.
    Type: Grant
    Filed: March 9, 2004
    Date of Patent: February 24, 2015
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Kunihito Takaura, Kaichi Tsuruta, Hiroshi Kawanakago, Hiroshi Takahashi
  • Patent number: 8950652
    Abstract: A sintering method is provided which allows components to be joined to each other in a stable way, wherein the processing temperature is less than 200° C. and stable contact points are produced, which have low porosity and also high electrical and thermal conductivity. The method for joining components includes (a) providing a sandwich arrangement having at least (a1) one component 1, (a2) one component 2, and (a3) a metal paste located between component 1 and component 2, and (b) sintering the sandwich arrangement. The metal paste contains (A) 75-90 weight percent of at least one metal present in the form of particles having a coating containing at least one organic compound, (B) 0-12 weight percent of at least one metal precursor, (C) 6-20 weight percent of at least one solvent, and (D) 0.1-15 weight percent of at least one sintering agent selected from the group comprising (i) organic peroxides, (ii) inorganic peroxides, and (iii) inorganic acids.
    Type: Grant
    Filed: September 3, 2010
    Date of Patent: February 10, 2015
    Assignee: Heraeus Materials Technology GmbH & Co. KG
    Inventors: Michael Schäfer, Wolfgang Schmitt, Jian Zeng