Abstract: There is provided a paste composition using copper fine particles that are capable of exhibiting conductivity after low-temperature sintering, which themselves are less oxidized, and that can be produced with a high yield ratio. A paste composition contains: (A) copper fine particles having a thickness or minor axis of 10 to 500 nm and coated with amino alcohol represented by the chemical formula (1) and (B) an organic solvent.

Abstract: Disclosed is a metal mixture composition containing lead and tin, and comprising by weight at least 10% tin and 45% lead, at least 90% of tin and lead together, more lead than tin, from 1-5000 ppm of copper, at least 0.42% antimony and at least 0.0001 % wt of sulphur, at most 0.1% of the total of chromium, manganese, vanadium, titanium and tungsten, and at most 0.1% of each one of aluminium, nickel, iron and zinc. Disclosed is also a process comprising a pre-treatment step for producing this metal mixture composition, followed by a vacuum distillation step wherein lead is removed by evaporation and a bottom stream is obtained comprising at least 0.6% wt of lead.

Abstract: A flux includes a solvent and a thixotropic agent, the solvent including a carboxylic acid that is liquid at ordinary temperature.

Abstract: A rosin-modified product being a reactant of a rosin or a rosin derivative and an alkanolamine represented by a following Formula (1) NH3-n—(R—OH)n(n?3); or??(1) being produced by a reaction of a rosin or a rosin derivative, an organic acid and an alkanolamine.

Abstract: A copper particle mixture ensures suppression of copper oxidation and high dispersibility, and that can be sintered at a low temperature in a short period of time can suitably be used for a conductive copper ink material. The copper particle mixture contains copper fine particle A and copper nanoparticle B, the copper fine particle A having an average particle diameter of 0.1 ?m to 5 ?m, and being coated with at least one dicarboxylic acid selected from the group consisting of malonic acid and oxalic acid, the copper nanoparticle B comprising a central portion comprising a copper single crystal, and a protective layer surrounding the central portion, and having an average particle diameter of 1 nm to 100 nm, and the protective layer of the copper nanoparticle B containing at least one member selected from the group consisting of C3-6 primary alcohols, C3-6 secondary alcohols, and derivatives thereof.

Abstract: Implementations of the disclosure are directed to a lead-free mixed solder powder paste suitable for low temperature to middle temperature soldering applications. The lead-free solder paste may consist of: an amount of a first solder alloy powder between 44 wt % and 83 wt %, the first solder alloy powder comprising Sn; an amount of a second solder alloy powder between 5 wt % to 44 wt %, the second alloy powder comprising Sn, where the first solder alloy powder has a liquidus temperature lower than a solidus temperature of the second solder alloy powder; and a remainder of flux. The solder paste may be used for reflow at a peak temperature below the solidus temperature of the higher solidus temperature solder powder but above the melting temperature of the lower solidus temperature one.

Abstract: A printing method for selectively depositing braze powders on a surface comprises extruding a filament from a nozzle moving relative to a surface, where the filament comprises a flowable carrier mixed with a braze powder. As the nozzle moves, the filament is deposited on the surface in a predetermined pattern defined by the motion of the nozzle relative to the surface; thus, the braze powders are deposited at one or more predetermined locations on the surface.

Abstract: Configurations are described that provide uniform heat distribution of resistive heaters. These configurations allow successful anti-icing and deicing with relatively low applied power. One aspect involves the use of a thin film heater applied just underneath the topcoat to efficiently direct all heat to the surface, allowing anti-icing and de-icing with minimal power. This can be accomplished by employing a hybrid electrode interface, using a metal foil or metal braid that is attached to the aircraft surface with a structural adhesive that has been smoothed along the edges with metal-filled adhesive. Another aspect uses an array of heater cells created as a single sheet and a heat spreading material, provided underneath or overtop of the heater cells.

Abstract: Provided is a solder composition including a flux, a solder alloy, and a silicone oil. The solder composition can have a kinematic viscosity at 25° C. of 5000 mm2/s or more and 200,000 mm2/s or less. The silicone oil can be at least one member selected from the group consisting of dimethyl silicone oil, methylphenyl silicone oil, methylhydrogen silicone oil, reactive silicone oil, and non-reactive silicone oil.

Abstract: Disclosed is a conductive ink composition and a manufacturing method thereof. The composition includes about 50 to about 99 wt % copper nanoparticles and about 1 to about 50 wt % tin. Copper nanoparticles are atomized and suspended in a tin bath, wherein the copper nanoparticles are evenly dispersed within the bath through sonification. The composition is cooled, extracted, and formed into a filament for use as a conductive ink. The ink has a resistivity of about 46.2×E?9 ?*m to about 742.5×E?9 ?*m. Once in filament form, the tin-copper mix will be viable for material extrusion, thus allowing for a lower cost, electrically conductive traces to be used in additive manufacturing.

Abstract: Provided is a flux for solder paste including an organic component as a main component, which is composed of a fatty acid and an aliphatic primary amine.

Abstract: A SnAgCuSb-based Pb-free solder alloy is disclosed. The disclosed solder alloy is particularly suitable for, but not limited to, producing solder joints, in the form of solder preforms, solder balls, solder powder, or solder paste (a mixture of solder powder and flux), for harsh environment electronics.

Abstract: A filler feed wire (20) including both a laser conductive element (26) and a filler material (22) extending along a length of the wire. Laser energy (30) can be directed into a proximal end (32) of the laser conductive element for melting a distal end (34) of the feed wire to form a melt pool (24) for additive fabrication or repair. The laser conductive element may serve as a flux material. In this manner, laser energy is delivered precisely to the distal end of the feed wire, eliminating the need to separately coordinate laser beam motion with feed wire motion.

Abstract: The provided relates to a method for preparing an anisotropic conductive adhesive for fine pitch and an anisotropic conductive adhesive for fine pitch prepared by the same method. Provided is a method for preparing an anisotropic conductive adhesive for a fine pitch including: (i) removing an oxide film of solder particles having self-fusion and self-orientation functions between metal terminals of a substrate by melting the solder particles at a predetermined temperature using a first reducing agent; (ii) removing moisture generated in step (i); and (iii) preparing an anisotropic conductive adhesive by mixing the solder particles from which the oxide film and the moisture are removed with a binder resin in steps (i) and (ii), in which step (iii) is performed in a state where a contact with oxygen is blocked.

Abstract: Provided is flux containing rosin-based resin, a solvent, a thixotropic agent and an activator. The thixotropic agent includes any or both of hardened castor oil and bisamide-based thixotropic agent. The contents of the hardened castor oil and the bisamide-based thixotropic agent are respectively within the range of 4 wt. % or more and 10 wt. % or less and the range of 1 wt. % or more and 5 wt. % or less based on the total weight of the flux. The contents of the thixotropic agent are within the range of 5 wt. % or more and 15 wt. % or less based on the total weight of the flux. The activator includes hydrohalide, a halogenated aliphatic compound and an imidazole compound. The contents of the halogen in the flux are within the range of 9000 ppm or more and 50000 ppm or less.

Abstract: The invention concerns a brazing sheet comprising a core layer (5) and a braze cladding, said core layer (5) being aluminium or an aluminium alloy, said braze cladding comprising (a) a flux composite layer (2), which flux composite layer comprises a matrix of aluminium or an aluminium alloy, said matrix containing flux particles; (b) at least one filler alloy layer (1) not containing flux particles; and, (c) an aluminium or aluminium alloy layer (3) not containing flux particles, said layer forming the outermost surface of at least one side of the brazing sheet, wherein the flux composite layer (a) is positioned between said filler alloy layer (b) and said aluminium or aluminium alloy layer (c). The invention further concerns a method for its manufacturing, a cladding plate, use of the brazing sheet and a brazed heat exchanger.

Abstract: A circuit assembly can be made by adhering a conductive element to a substrate with an adhesive. A first layer including an adhesive can be applied over at least a portion of a surface of the substrate. A second layer including a conductive metal can be applied over at least a portion of the first layer. The first layer and the second layer can be exposed to a temperature for a duration of time to (1) fuse the conductive metal together in at least a portion of the first layer and (2) cure the adhesive of the second layer. The fusing can be substantially complete before the curing is substantially complete to enhance bonding of the adhesive to the fused conductive metal.

Abstract: A method comprising an arc ignition phase (IP), an arc-stabilizing phase (AP) and a stable arc phase (SP). The arc stabilizing phase comprises an initial sub-phase (IS) comprising the step of feeding at least one hot wire (4, 12) at constant feed speed and a main sub-phase (MS) comprising the steps of feeding said hot wire at constant feed speed and feeding at least one cold wire (22) at constant feed speed. The stable arc phase comprises the steps of continuously adjusting the feed speed of the hot wire and continuously adjusting the feed speed of the cold wire. The invention also relates to a welding apparatus (1) for carrying out the method. The welding apparatus comprises a hot wire feeding means (150), a contact means (2), a cold wire feeding means (35) and a control unit (31).

Abstract: It is an object of the present invention to provide flux and a solder material of which the activity hardly decreases even at a high temperature and which can also suppress the occurrence of migration. Flux containing an isocyanuric acid derivative containing two or more carboxyl groups and the like are provided.

Abstract: The present disclosure relates to evaluation of a mounted resistor formed between a bump and electrodes. A display device of the present disclosure includes a display panel formed in a transparent substrate and a display driver driving the display panel. A plurality of bumps is formed on a connection surface of the display driver. A plurality of electrodes is formed on the transparent substrate and corresponds in position to the plurality of bumps. COG mounting enables the bumps on the display driver side to electrically connect to the electrodes on the transparent substrate side. On the connection surface of the display driver, the bumps, which are for use in signal transmission, further include a first evaluation-oriented bump (TA[i]) and a second evaluation-oriented bump (TB[i]). Evaluation-oriented electrodes (EL[i]) are disposed on the transparent substrate and correspond in position to the first evaluation-oriented bump (TA[i]) and the second evaluation-oriented bump (TB[i]).

Abstract: There is provided an inexpensive bonding material, which can be easily printed on articles to be bonded to each other and which can suppress the generation of voids in the bonded portions of the articles to be bonded to each other, and a bonding method using the same. In a bonding material of a copper paste which contains a copper powder containing 0.3% by weight or less of carbon and having an average particle diameter of 0.1 to 1 ?m, and an alcohol solvent, such as a monoalcohol, a diol, a triol or a terpene alcohol, the content of the copper powder is in the range of from 80% by weight to 95% by weight, and the content of the alcohol solvent is in the range of from 5% by weight to 20% by weight.

Abstract: An electrical contact comprises an electrically conductive contact material and a plurality of particles adhered to an area of the contact material. At least some of the particles have a portion penetrating into the contact material.

Abstract: Provided are a solder alloy for preventing Fe erosion, a resin flux cored solder, a wire solder, a resin flux cored wire solder, a flux coated solder, a solder joint, and a soldering method which, in order to prolong the life of a soldering iron tip, suppress erosion of the soldering iron tip and by which adhesion of carbide to the soldering iron tip is suppressed. The present invention has an alloy composition comprising, by mass %, 0.02-0.1% Fe, more than 0% and equal to or less than 0.2% Zr, with the remainder being Sn, and is used to prevent Fe erosion.

Abstract: The present invention relates to a conductive paste for bonding comprising 100 parts by weight of the metal powder, 5 to 20 parts by weight of a solvent, and 0.05 to 3 parts by weight of a polymer, wherein the polymer comprises a first polymer and a second polymer, wherein the molecular weight (Mw) of the first polymer is 5,000 to 95,000, and the molecular weight (Mw) of the second polymer is 100,000 to 300,000.

Abstract: Provided are a light emitting device and a method of fabricating the same. The light emitting device includes: a light emitting structure including a first conductivity type semiconductor layer, a second conductivity type semiconductor layer, and an active layer and including a first surface and a second surface; first and second contact electrodes each ohmic-contacting the first and second conductivity type semiconductor layers; and first and second electrodes disposed on the first surface of the light emitting structure, in which the first and second electrodes each include sintered metal particles and the first and second electrodes each include inclined sides of which the tangential gradients with respect to sides of vertical cross sections thereof are changing.

Abstract: A submerged arc welding process using welding wire containing, based on the total mass of the welding wire, Ni: 50% or more by mass, Cr: 14.5% to 16.5% by mass, Mo: 15.0% to 17.0% by mass, W: 3.0% to 4.5% by mass, Fe: 4.0% to 7.0% by mass, and C, Si, Mn, P, S, Cu, V, Co, and Al: a predetermined amount or less, and a bonded flux containing, based on the total mass of the bonded flux, Al2O3: 35% to 55% by mass, SiO2: 5% to 25% by mass, CaO: 2% to 10% by mass, CaF2: 25% to 45% by mass, and Na2O: 2% to 4% by mass.

Abstract: The preparation and use of particulate metallic solder alloy having particles of a single chemical composition is described. The particles of the particulate metallic solder alloy have a bimodal size distribution in which particles in a smaller size range have a largest dimension that is smaller than a smallest dimension of particles in a larger size range of the bimodal distribution. In some examples the particles in the smaller size mode have dimensions in the range of 1 to 100 nm. In some examples, the particles in the larger size mode have dimensions in the range of 2 to 75 microns in dimension. In some examples, a halogen-free flux is used. In some examples, a solvent is used to make a paste.

Abstract: A thermal managing electrical connection tape includes a carrier film and a composition including solder powder, with the composition being applied to the carrier film. The composition includes a soldering flux having the solder powder disposed therein. The composition contains between about 50 wt % and about 70 wt % soldering flux. The composition further contains between about 30 wt % and about 50 wt % solder powder. A method of fabricating a thermal managing electrical connection tape includes providing a composition including at least one of a soldering flux and epoxy and/or acrylic, adding a solder powder to the composition, casting the composition on a carrier film, drying the carrier film in a drying furnace to form a dried tape, and cutting the dried tape to a desired width to form a thermal managing electrical connection tape.

Abstract: Provided is a metal material for 3D printing, the metal material including an alloy that includes a eutectic metal, and a metal particle, wherein the melting point of the alloy is about 100° C. to about 300° C., and the melting point of the metal particle exceeds about 300° C.

Abstract: A welded joint having high strength and good hydrogen embrittlement resistance is provided. A welded joint is a welded joint obtained by welding a base material using a welding material. The base material has a chemical composition of, in mass %: C: 0.005 to 0.1%; Si: up to 1.2%; Mn: 2.5 to 6.5%; Ni: 8 to 15%; Cr: 19 to 25%; Mo: 0.01 to 4.5%; V: 0.01 to 0.5%; Nb: 0.01 to 0.5% Al: less than 0.05%; N: 0.15 to 0.45%; O: up to 0.02%; P: up to 0.05%; and S: up to 0.04%, and a balance being iron and impurities, and which satisfies Equation (1). The welding material has a chemical composition which satisfies Equations (1) and (2). Ni+0.65Cr+0.98Mo+1.05Mn+0.35Si+12.6C?29??(1) 0.31C+0.048Si?0.02Mn?0.056Cr+0.007Ni?0.013Mo??1.

Abstract: A heat sink assembly for a power module is provided. The assembly includes a main body having a first cooling circuit and a second cooling circuit. The first cooling circuit includes a first plurality of channels, at least one first end channel, at least one second end channel, a first inlet, and a first outlet. The first cooling circuit is adapted to provide a first flow of a coolant through the main body. The second cooling circuit includes a second plurality of passages, at least one first end passage, at least one second end passage, a second inlet, and a second outlet. The second cooling circuit is adapted to provide a second flow of the coolant through the main body. The first cooling circuit and second cooling circuit is adapted to provide a cross flow of the first flow and second flow through the main body respectively.

Abstract: A thermosetting resin composition includes an epoxy compound having an isocyanuric acid ring represented by the following formula (1), and a solid lubricant.

Abstract: A welding wire is provided with a hollow section for accommodating flux. The flux has a composition including: Mn: 5-20%, Si: 1-15%, TiO2: 5-25%, SiO2: 0.1-10%, Mo: 0.1-5% by weight, the balance being iron. When welding low alloy high strength steel by using the welding wire, the slag on the welding bead can be easily cleaned and a smooth surface can be formed on the welding bead which makes it easier to galvanize a zinc layer over the surface of the welding bead. The welding wire provides better welding operation performance and generates less welding spatters.

Abstract: A ball forming device 50 for forming a ball 43 at a tip of a wire 42 by producing discharge between a torch electrode 48 and the tip of the wire 42, the device includes: a current supply unit 54 configured to supply a ball-forming current between the torch electrode 48 and the tip of the wire 42; and a current control unit 57 configured to control the current supply unit 54, so that a signal of the ball-forming current for a predetermined period includes a first period in which the signal takes a predetermined current value and a second period including a triangle wave. With this, it is possible to provide a ball forming device, a wire-bonding apparatus, and a ball formation method that are capable of suppressing formation of deformed balls.

Abstract: It is an object to provide a stainless steel flux-cored wire in which the amount of hexavalent chromium in fume can be reduced while maintaining the weldability excellent. The stainless steel flux-cored wire contains, as percentage to the total mass of the wire: Cr: 11-30 mass %; metal Si, Si oxide and Si compound: 0.5-4.0 mass % in total in terms of Si [Si]; fluorine compound: 0.01-1.0 mass % in terms of F [F]; TiO2: 1.5 mass % or above; ZrO2+Al2O3: 3.2 mass % or below; Na compound, K compound and Li compound: 0.50 mass % or below in total of each of an amount in terms of Na [Na], an amount in terms of K [K] and an amount in terms of Li [Li]; and satisfies {([Na]+[K]+[Li])×[Cr]2}/([Si]+4.7×[F])?10, where [Cr] represents Cr content.

Abstract: The purpose of the present invention is to provide a conductive copper paste which is curable in an ambient atmosphere, has a long pot life, and, has a low specific resistance even under a high-temperature and short-time curing condition, wherein the specific resistance after curing does not greatly vary depending on a copper powder content. The conductive copper paste provided is characterized by containing (A) a copper powder, (B) a thermosetting resin, (C) a fatty acid that is liquid at normal temperature, and (D) triethanolamine. Preferably, component (B) is a resol-type phenol resin. More preferably, the content of component (B) is 10 to 20 parts by mass with respect to a total of 100 parts by mass of component (A) and component (B).

Abstract: This disclosure relates generally to Gas Metal Arc Welding (GMAW) and, more specifically, to Metal-cored Arc Welding (MCAW) of mill scaled steel workpieces. A metal-cored welding wire, including a sheath and a core, capable of welding mill scaled workpieces without prior descaling is disclosed. The metal-cored welding wire has a sulfur source that occupies between approximately 0.04% and approximately 0.18% of the weight of the metal-cored welding wire, and has a cellulose source that occupies between approximately 0.09% and approximately 0.54% of the weight of the metal-cored welding wire.

Abstract: A solder alloy suitable for high temperature environments, such as for example electronic systems used in an oil or gas well where the temperature may be in the region of 175° C., the solder alloy having a Silver weight % in the range of 3.5 to 7.0, a Copper weight % in the range of 1.0 to 4.0, and an Antimony weight % in the range of 1.0 to 3.0. Other embodiments are described and claimed.

Abstract: The present invention relates to organic acid- or latent organic acid-functionalized polymer-coated metal powders, such as metal powders used as appropriate in the formation of solder alloys, spheres and pastes.

Abstract: A resin composition having an adhesive property in a high temperature range that is estimated during soldering, and flux using this resin composition, a flux residue of which is washable. The resin composition contains a hydroxyl carboxylic acid having two or more carboxyl groups and a hydroxyl group in its molecule and a thermosetting resin in a ratio of 1:3 or more and 1:7 or less. Further, the flux contains the hydroxyl carboxylic acid having two or more carboxyl groups and a hydroxyl group in its molecule in an amount of 8.5% by mass or more and 16% by mass or less, and a thermosetting resin in an amount of 50% by mass or more and 60% by mass or less, wherein a ratio between the hydroxyl carboxylic acid and the thermosetting resin is 1:7 or less.

Abstract: Provided is a solder alloy having excellent wettability on both of a Cu surface and an Ni surface. The solder alloy has such an alloy composition that 0.6 to 0.9 mass % of Cu and 0.01 to 0.1 mass % of Al are contained, 0.02 to 0.1 mass % of Ti and/or 0.01 to 0.05 mass % of Co may be contained as required and the remainder is made up by Sn.

Abstract: A solder paste consists of an amount of a first solder alloy powder between 60 wt % to 92 wt %; an amount of a second solder alloy powder greater than 0 wt % and less than 12 wt %; and a flux; wherein the first solder alloy powder comprises a first solder alloy that has a solidus temperature above 260° C.; and wherein the second solder alloy powder comprises a second solder alloy that has a solidus temperature that is less than 250° C.

Abstract: The invention relates generally to welding and, more specifically, to welding wires for arc welding, such as Gas Metal Arc Welding (GMAW) or Flux Core Arc Welding (FCAW). A disclosed tubular welding wire has a sheath and a core, and the tubular welding wire includes an organic stabilizer component, a rare earth component, and a corrosion resistant component comprising one or more of: nickel, chromium, and copper.

Abstract: Provided is a solder transfer sheet which is capable of increasing the amount of solder to be transferred without the occurrence of bridging. A solder transfer sheet 1A includes a base material 5, an adhesive layer 4 formed on the surface of the base material 5, a solder powder-containing adhesive layer 3 formed on the surface of the adhesive layer 4, and a solder powder layer 2 formed on the surface of the solder powder-containing adhesive layer 3. In the solder powder layer 2, particles of solder powder 20 are arranged in a one-layer sheet form. In the solder powder-containing adhesive layer 3, solder powder 30 and an adhesive component 31 are mixed so as to have such a thickness that two or more layers of the solder powder 30 are stacked.

Abstract: A solder bump formed on an Ni electrode with the use of a solder ball containing Bi as a main component and Sn as a sub component. The solder ball contains Sn from 1.0 to 10.0 mass % and at most 1.0 mass % of at least one of Cu and Ag. A solder joint portion obtained by use of the solder bump has at least one of Sn and an SnBi eutectic alloy.

Abstract: According to one embodiment, a metallic particle paste includes a polar solvent and particles dispersed in the polar solvent and containing a first metal. A second metal different from the first metal is dissolved in the polar solvent.

Abstract: The invention relates generally to welding and, more specifically, to welding wires for arc welding, such as Gas Metal Arc Welding (GMAW) or Flux Core Arc Welding (FCAW). In one embodiment, a method of manufacturing a tubular welding wire includes disposing a core within a metallic sheath. Further, the core includes an organic stabilizer component, in which the organic stabilizer component is an alkali metal or alkali earth metal salt of an organic molecule or an organic polymer.

Abstract: An electronic device includes a first electronic part, a second electronic part opposite the first electronic part, and a bonding portion between the first electronic part and the second electronic part. The bonding portion contains a solder containing a substance whose crystal structure reversibly changes in temperature rise and fall processes which accompany the operation of the electronic device or electronic equipment including the electronic device. A change in the crystal structure of the substance contained in the solder promotes recovery and recrystallization of the solder in the temperature rise and fall processes which accompany the operation of the electronic device or the electronic equipment. As a result, the coarsening of crystal grains in the solder is suppressed.

Abstract: A semiconductor package structure comprises a substrate, a die bonded to the substrate, and one or more stud bump structures connecting the die to the substrate, wherein each of the stud bump structures having a stud bump and a solder ball encapsulating the stud bump to enhance thermal dissipation and reduce high stress concentrations in the semiconductor package structure.

Abstract: A brazing or soldering wire has a pair channels recessed therein. A divider separates the pair of channels. The divider has opposing walls extending outwardly from corresponding base portions of the pair of channels. A first engagement surface is located between the opposing walls. A pair of outer walls is separated by the pair of channels and the divider. A second engagement surface is formed between an outer surface of the elongated wire and a terminal end of one of the outer walls and is substantially coplanar with the first engagement surface. A third engagement surface is formed between the outer surface of the elongated wire and a terminal end of the other of the outer walls and is substantially coplanar with the first engagement surface. A cured flux solution is located within the pair of channels.