Metallic Patents (Class 148/24)
  • Patent number: 10821558
    Abstract: There is provided an inexpensive bonding material, which can be easily printed on articles to be bonded to each other and which can suppress the generation of voids in the bonded portions of the articles to be bonded to each other, and a bonding method using the same. In a bonding material of a copper paste which contains a copper powder containing 0.3% by weight or less of carbon and having an average particle diameter of 0.1 to 1 ?m, and an alcohol solvent, such as a monoalcohol, a diol, a triol or a terpene alcohol, the content of the copper powder is in the range of from 80% by weight to 95% by weight, and the content of the alcohol solvent is in the range of from 5% by weight to 20% by weight.
    Type: Grant
    Filed: August 31, 2015
    Date of Patent: November 3, 2020
    Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Keiichi Endoh, Hiromasa Miyoshi, Kimikazu Motomura, Satoru Kurita
  • Patent number: 10777912
    Abstract: An electrical contact comprises an electrically conductive contact material and a plurality of particles adhered to an area of the contact material. At least some of the particles have a portion penetrating into the contact material.
    Type: Grant
    Filed: December 7, 2017
    Date of Patent: September 15, 2020
    Assignee: TE Connectivity Germany GmbH
    Inventors: Soenke Sachs, Volker Seipel, Helge Schmidt, Felix Greiner, Christian Gregor
  • Patent number: 10717158
    Abstract: Provided are a solder alloy for preventing Fe erosion, a resin flux cored solder, a wire solder, a resin flux cored wire solder, a flux coated solder, a solder joint, and a soldering method which, in order to prolong the life of a soldering iron tip, suppress erosion of the soldering iron tip and by which adhesion of carbide to the soldering iron tip is suppressed. The present invention has an alloy composition comprising, by mass %, 0.02-0.1% Fe, more than 0% and equal to or less than 0.2% Zr, with the remainder being Sn, and is used to prevent Fe erosion.
    Type: Grant
    Filed: August 17, 2017
    Date of Patent: July 21, 2020
    Assignee: SENJU METAL INDUSTRY CO., LTD.
    Inventors: Takashi Saito, Shunsaku Yoshikawa, Yoko Kurasawa
  • Patent number: 10696875
    Abstract: The present invention relates to a conductive paste for bonding comprising 100 parts by weight of the metal powder, 5 to 20 parts by weight of a solvent, and 0.05 to 3 parts by weight of a polymer, wherein the polymer comprises a first polymer and a second polymer, wherein the molecular weight (Mw) of the first polymer is 5,000 to 95,000, and the molecular weight (Mw) of the second polymer is 100,000 to 300,000.
    Type: Grant
    Filed: September 14, 2017
    Date of Patent: June 30, 2020
    Assignee: E. I. DU PONT DE NEMOURS AND COMPANY
    Inventor: Yumi Matsuura
  • Patent number: 10700249
    Abstract: Provided are a light emitting device and a method of fabricating the same. The light emitting device includes: a light emitting structure including a first conductivity type semiconductor layer, a second conductivity type semiconductor layer, and an active layer and including a first surface and a second surface; first and second contact electrodes each ohmic-contacting the first and second conductivity type semiconductor layers; and first and second electrodes disposed on the first surface of the light emitting structure, in which the first and second electrodes each include sintered metal particles and the first and second electrodes each include inclined sides of which the tangential gradients with respect to sides of vertical cross sections thereof are changing.
    Type: Grant
    Filed: December 26, 2017
    Date of Patent: June 30, 2020
    Assignee: SEOUL VIOSYS CO., LTD.
    Inventors: Chang Yeon Kim, Ju Yong Park, Sung Su Son
  • Patent number: 10688602
    Abstract: A submerged arc welding process using welding wire containing, based on the total mass of the welding wire, Ni: 50% or more by mass, Cr: 14.5% to 16.5% by mass, Mo: 15.0% to 17.0% by mass, W: 3.0% to 4.5% by mass, Fe: 4.0% to 7.0% by mass, and C, Si, Mn, P, S, Cu, V, Co, and Al: a predetermined amount or less, and a bonded flux containing, based on the total mass of the bonded flux, Al2O3: 35% to 55% by mass, SiO2: 5% to 25% by mass, CaO: 2% to 10% by mass, CaF2: 25% to 45% by mass, and Na2O: 2% to 4% by mass.
    Type: Grant
    Filed: July 10, 2017
    Date of Patent: June 23, 2020
    Assignee: Kobe Steel, Ltd.
    Inventors: Junichi Kawata, Kazuhiro Fukuda
  • Patent number: 10668573
    Abstract: The preparation and use of particulate metallic solder alloy having particles of a single chemical composition is described. The particles of the particulate metallic solder alloy have a bimodal size distribution in which particles in a smaller size range have a largest dimension that is smaller than a smallest dimension of particles in a larger size range of the bimodal distribution. In some examples the particles in the smaller size mode have dimensions in the range of 1 to 100 nm. In some examples, the particles in the larger size mode have dimensions in the range of 2 to 75 microns in dimension. In some examples, a halogen-free flux is used. In some examples, a solvent is used to make a paste.
    Type: Grant
    Filed: January 11, 2016
    Date of Patent: June 2, 2020
    Assignee: University of Massachusetts
    Inventors: Zhiyong Gu, Fan Gao, Evan Wernicki, Jonathan Campelli
  • Patent number: 10625356
    Abstract: A thermal managing electrical connection tape includes a carrier film and a composition including solder powder, with the composition being applied to the carrier film. The composition includes a soldering flux having the solder powder disposed therein. The composition contains between about 50 wt % and about 70 wt % soldering flux. The composition further contains between about 30 wt % and about 50 wt % solder powder. A method of fabricating a thermal managing electrical connection tape includes providing a composition including at least one of a soldering flux and epoxy and/or acrylic, adding a solder powder to the composition, casting the composition on a carrier film, drying the carrier film in a drying furnace to form a dried tape, and cutting the dried tape to a desired width to form a thermal managing electrical connection tape.
    Type: Grant
    Filed: February 10, 2016
    Date of Patent: April 21, 2020
    Assignee: ALPHA ASSEMBLY SOLUTIONS INC.
    Inventors: Steven Dane Prokopiak, Sanyogita Arora, Ranjit S. Pandher, Ellen S. Tormey, Bawa Singh
  • Patent number: 10563292
    Abstract: Provided is a metal material for 3D printing, the metal material including an alloy that includes a eutectic metal, and a metal particle, wherein the melting point of the alloy is about 100° C. to about 300° C., and the melting point of the metal particle exceeds about 300° C.
    Type: Grant
    Filed: April 8, 2016
    Date of Patent: February 18, 2020
    Assignees: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE, DAELIM CHEMICAL CO., LTD.
    Inventors: Yong Suk Yang, Hong Hyun Shin, In-Kyu You, Sunghoon Hong
  • Patent number: 10556298
    Abstract: A welded joint having high strength and good hydrogen embrittlement resistance is provided. A welded joint is a welded joint obtained by welding a base material using a welding material. The base material has a chemical composition of, in mass %: C: 0.005 to 0.1%; Si: up to 1.2%; Mn: 2.5 to 6.5%; Ni: 8 to 15%; Cr: 19 to 25%; Mo: 0.01 to 4.5%; V: 0.01 to 0.5%; Nb: 0.01 to 0.5% Al: less than 0.05%; N: 0.15 to 0.45%; O: up to 0.02%; P: up to 0.05%; and S: up to 0.04%, and a balance being iron and impurities, and which satisfies Equation (1). The welding material has a chemical composition which satisfies Equations (1) and (2). Ni+0.65Cr+0.98Mo+1.05Mn+0.35Si+12.6C?29??(1) 0.31C+0.048Si?0.02Mn?0.056Cr+0.007Ni?0.013Mo??1.
    Type: Grant
    Filed: February 20, 2015
    Date of Patent: February 11, 2020
    Assignee: NIPPON STEEL CORPORATION
    Inventors: Kana Jotoku, Hiroyuki Hirata, Tomohiko Omura, Jun Nakamura, Takahiro Osuki
  • Patent number: 10462941
    Abstract: A heat sink assembly for a power module is provided. The assembly includes a main body having a first cooling circuit and a second cooling circuit. The first cooling circuit includes a first plurality of channels, at least one first end channel, at least one second end channel, a first inlet, and a first outlet. The first cooling circuit is adapted to provide a first flow of a coolant through the main body. The second cooling circuit includes a second plurality of passages, at least one first end passage, at least one second end passage, a second inlet, and a second outlet. The second cooling circuit is adapted to provide a second flow of the coolant through the main body. The first cooling circuit and second cooling circuit is adapted to provide a cross flow of the first flow and second flow through the main body respectively.
    Type: Grant
    Filed: November 6, 2017
    Date of Patent: October 29, 2019
    Assignee: Caterpillar Inc.
    Inventors: Keith Elliot Dixler, Jon Nathaniel Husser, Allen Ben Chu, Todd George Nakanishi
  • Patent number: 10451111
    Abstract: A thermosetting resin composition includes an epoxy compound having an isocyanuric acid ring represented by the following formula (1), and a solid lubricant.
    Type: Grant
    Filed: January 28, 2016
    Date of Patent: October 22, 2019
    Assignee: MINEBEA MITSUMI INC.
    Inventors: Tadahiko Karaki, Aya Kakegawa, Koichiro Sagiyama
  • Patent number: 10406637
    Abstract: A welding wire is provided with a hollow section for accommodating flux. The flux has a composition including: Mn: 5-20%, Si: 1-15%, TiO2: 5-25%, SiO2: 0.1-10%, Mo: 0.1-5% by weight, the balance being iron. When welding low alloy high strength steel by using the welding wire, the slag on the welding bead can be easily cleaned and a smooth surface can be formed on the welding bead which makes it easier to galvanize a zinc layer over the surface of the welding bead. The welding wire provides better welding operation performance and generates less welding spatters.
    Type: Grant
    Filed: October 20, 2010
    Date of Patent: September 10, 2019
    Assignee: ILLINOIS TOOL WORKS INC.
    Inventors: Jie Yan, Xiangui Cao, Fuhu Chen, Mingqian Yang
  • Patent number: 10410992
    Abstract: A ball forming device 50 for forming a ball 43 at a tip of a wire 42 by producing discharge between a torch electrode 48 and the tip of the wire 42, the device includes: a current supply unit 54 configured to supply a ball-forming current between the torch electrode 48 and the tip of the wire 42; and a current control unit 57 configured to control the current supply unit 54, so that a signal of the ball-forming current for a predetermined period includes a first period in which the signal takes a predetermined current value and a second period including a triangle wave. With this, it is possible to provide a ball forming device, a wire-bonding apparatus, and a ball formation method that are capable of suppressing formation of deformed balls.
    Type: Grant
    Filed: August 12, 2016
    Date of Patent: September 10, 2019
    Assignee: SHINKAWA LTD.
    Inventors: Yoshihito Hagiwara, Kazumasa Sasakura, Tatsuyuki Sunada
  • Patent number: 10369666
    Abstract: It is an object to provide a stainless steel flux-cored wire in which the amount of hexavalent chromium in fume can be reduced while maintaining the weldability excellent. The stainless steel flux-cored wire contains, as percentage to the total mass of the wire: Cr: 11-30 mass %; metal Si, Si oxide and Si compound: 0.5-4.0 mass % in total in terms of Si [Si]; fluorine compound: 0.01-1.0 mass % in terms of F [F]; TiO2: 1.5 mass % or above; ZrO2+Al2O3: 3.2 mass % or below; Na compound, K compound and Li compound: 0.50 mass % or below in total of each of an amount in terms of Na [Na], an amount in terms of K [K] and an amount in terms of Li [Li]; and satisfies {([Na]+[K]+[Li])×[Cr]2}/([Si]+4.7×[F])?10, where [Cr] represents Cr content.
    Type: Grant
    Filed: January 3, 2012
    Date of Patent: August 6, 2019
    Assignee: Kobe Steel, Ltd.
    Inventors: Hiroshi Sugahara, Tetsunao Ikeda, Hirohisa Watanabe
  • Patent number: 10347388
    Abstract: The purpose of the present invention is to provide a conductive copper paste which is curable in an ambient atmosphere, has a long pot life, and, has a low specific resistance even under a high-temperature and short-time curing condition, wherein the specific resistance after curing does not greatly vary depending on a copper powder content. The conductive copper paste provided is characterized by containing (A) a copper powder, (B) a thermosetting resin, (C) a fatty acid that is liquid at normal temperature, and (D) triethanolamine. Preferably, component (B) is a resol-type phenol resin. More preferably, the content of component (B) is 10 to 20 parts by mass with respect to a total of 100 parts by mass of component (A) and component (B).
    Type: Grant
    Filed: February 29, 2016
    Date of Patent: July 9, 2019
    Assignee: NAMICS CORPORATION
    Inventors: Masashi Kajita, Takashi Sakamoto, Shigeko Konno, Tomoyuki Takahashi
  • Patent number: 10300565
    Abstract: This disclosure relates generally to Gas Metal Arc Welding (GMAW) and, more specifically, to Metal-cored Arc Welding (MCAW) of mill scaled steel workpieces. A metal-cored welding wire, including a sheath and a core, capable of welding mill scaled workpieces without prior descaling is disclosed. The metal-cored welding wire has a sulfur source that occupies between approximately 0.04% and approximately 0.18% of the weight of the metal-cored welding wire, and has a cellulose source that occupies between approximately 0.09% and approximately 0.54% of the weight of the metal-cored welding wire.
    Type: Grant
    Filed: October 9, 2015
    Date of Patent: May 28, 2019
    Assignee: HOBART BROTHERS COMPANY
    Inventors: Steven Edward Barhorst, Daryl L. Duncan, Joseph C. Bundy, Zhigang Xiao
  • Patent number: 10299388
    Abstract: A solder alloy suitable for high temperature environments, such as for example electronic systems used in an oil or gas well where the temperature may be in the region of 175° C., the solder alloy having a Silver weight % in the range of 3.5 to 7.0, a Copper weight % in the range of 1.0 to 4.0, and an Antimony weight % in the range of 1.0 to 3.0. Other embodiments are described and claimed.
    Type: Grant
    Filed: May 4, 2016
    Date of Patent: May 21, 2019
    Assignee: Halliburton Energy Services, Inc.
    Inventors: Andrew Albert Hrametz, Alexander T. Duncan
  • Patent number: 10189121
    Abstract: The present invention relates to organic acid- or latent organic acid-functionalized polymer-coated metal powders, such as metal powders used as appropriate in the formation of solder alloys, spheres and pastes.
    Type: Grant
    Filed: May 18, 2017
    Date of Patent: January 29, 2019
    Assignee: Henkel IP & Holding GmbH
    Inventor: Puwei Liu
  • Patent number: 10160827
    Abstract: A resin composition having an adhesive property in a high temperature range that is estimated during soldering, and flux using this resin composition, a flux residue of which is washable. The resin composition contains a hydroxyl carboxylic acid having two or more carboxyl groups and a hydroxyl group in its molecule and a thermosetting resin in a ratio of 1:3 or more and 1:7 or less. Further, the flux contains the hydroxyl carboxylic acid having two or more carboxyl groups and a hydroxyl group in its molecule in an amount of 8.5% by mass or more and 16% by mass or less, and a thermosetting resin in an amount of 50% by mass or more and 60% by mass or less, wherein a ratio between the hydroxyl carboxylic acid and the thermosetting resin is 1:7 or less.
    Type: Grant
    Filed: October 14, 2015
    Date of Patent: December 25, 2018
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Daisuke Maruko, Atsumi Takahashi, Takayuki Yoshida
  • Patent number: 10137536
    Abstract: Provided is a solder alloy having excellent wettability on both of a Cu surface and an Ni surface. The solder alloy has such an alloy composition that 0.6 to 0.9 mass % of Cu and 0.01 to 0.1 mass % of Al are contained, 0.02 to 0.1 mass % of Ti and/or 0.01 to 0.05 mass % of Co may be contained as required and the remainder is made up by Sn.
    Type: Grant
    Filed: December 25, 2012
    Date of Patent: November 27, 2018
    Assignee: SENJU METAL INDUSTRY CO., LTD.
    Inventors: Tsukasa Ohnishi, Shunsaku Yoshikawa, Seiko Ishibashi, Rei Fujimaki
  • Patent number: 10118260
    Abstract: A solder paste consists of an amount of a first solder alloy powder between 60 wt % to 92 wt %; an amount of a second solder alloy powder greater than 0 wt % and less than 12 wt %; and a flux; wherein the first solder alloy powder comprises a first solder alloy that has a solidus temperature above 260° C.; and wherein the second solder alloy powder comprises a second solder alloy that has a solidus temperature that is less than 250° C.
    Type: Grant
    Filed: February 23, 2015
    Date of Patent: November 6, 2018
    Assignee: Indium Corporation
    Inventors: Hongwen Zhang, Ning-Cheng Lee
  • Patent number: 10112268
    Abstract: The invention relates generally to welding and, more specifically, to welding wires for arc welding, such as Gas Metal Arc Welding (GMAW) or Flux Core Arc Welding (FCAW). A disclosed tubular welding wire has a sheath and a core, and the tubular welding wire includes an organic stabilizer component, a rare earth component, and a corrosion resistant component comprising one or more of: nickel, chromium, and copper.
    Type: Grant
    Filed: October 8, 2014
    Date of Patent: October 30, 2018
    Assignee: HOBART BROTHERS COMPANY
    Inventors: Mario Anthony Amata, Steven Edward Barhorst, Tre′ Dorell Heflin-King
  • Patent number: 10111342
    Abstract: Provided is a solder transfer sheet which is capable of increasing the amount of solder to be transferred without the occurrence of bridging. A solder transfer sheet 1A includes a base material 5, an adhesive layer 4 formed on the surface of the base material 5, a solder powder-containing adhesive layer 3 formed on the surface of the adhesive layer 4, and a solder powder layer 2 formed on the surface of the solder powder-containing adhesive layer 3. In the solder powder layer 2, particles of solder powder 20 are arranged in a one-layer sheet form. In the solder powder-containing adhesive layer 3, solder powder 30 and an adhesive component 31 are mixed so as to have such a thickness that two or more layers of the solder powder 30 are stacked.
    Type: Grant
    Filed: December 21, 2015
    Date of Patent: October 23, 2018
    Assignees: Senju Metal Industry Co., Ltd., Nitta Corporation
    Inventors: Kaichi Tsuruta, Takeo Saitoh, Manabu Muraoka, Hiroki Oshima, Koji Yamashita, Shinichiro Kawahara
  • Patent number: 10090268
    Abstract: A solder bump formed on an Ni electrode with the use of a solder ball containing Bi as a main component and Sn as a sub component. The solder ball contains Sn from 1.0 to 10.0 mass % and at most 1.0 mass % of at least one of Cu and Ag. A solder joint portion obtained by use of the solder bump has at least one of Sn and an SnBi eutectic alloy.
    Type: Grant
    Filed: July 27, 2015
    Date of Patent: October 2, 2018
    Assignees: MURATA MANUFACTURING CO., LTD., SENJU METAL INDUSTRY CO., LTD.
    Inventors: Yasuyuki Sekimoto, Hidekiyo Takaoka, Shigeo Nishimura, Minoru Ueshima, Tohru Kurushima
  • Patent number: 10086478
    Abstract: According to one embodiment, a metallic particle paste includes a polar solvent and particles dispersed in the polar solvent and containing a first metal. A second metal different from the first metal is dissolved in the polar solvent.
    Type: Grant
    Filed: July 22, 2014
    Date of Patent: October 2, 2018
    Assignee: KABUSHIKI KAISHA TOSHIBA
    Inventors: Daisuke Hiratsuka, Tomohiro Iguchi, Masayuki Uchida
  • Patent number: 10016850
    Abstract: The invention relates generally to welding and, more specifically, to welding wires for arc welding, such as Gas Metal Arc Welding (GMAW) or Flux Core Arc Welding (FCAW). In one embodiment, a method of manufacturing a tubular welding wire includes disposing a core within a metallic sheath. Further, the core includes an organic stabilizer component, in which the organic stabilizer component is an alkali metal or alkali earth metal salt of an organic molecule or an organic polymer.
    Type: Grant
    Filed: January 16, 2013
    Date of Patent: July 10, 2018
    Assignee: HOBART BROTHERS COMPANY
    Inventors: Steven Barhorst, Mario Amata, Kevin Pagano
  • Patent number: 9831199
    Abstract: An electronic device includes a first electronic part, a second electronic part opposite the first electronic part, and a bonding portion between the first electronic part and the second electronic part. The bonding portion contains a solder containing a substance whose crystal structure reversibly changes in temperature rise and fall processes which accompany the operation of the electronic device or electronic equipment including the electronic device. A change in the crystal structure of the substance contained in the solder promotes recovery and recrystallization of the solder in the temperature rise and fall processes which accompany the operation of the electronic device or the electronic equipment. As a result, the coarsening of crystal grains in the solder is suppressed.
    Type: Grant
    Filed: September 26, 2016
    Date of Patent: November 28, 2017
    Assignee: FUJITSU LIMITED
    Inventors: Taiki Uemura, Seiki Sakuyama
  • Patent number: 9768137
    Abstract: A semiconductor package structure comprises a substrate, a die bonded to the substrate, and one or more stud bump structures connecting the die to the substrate, wherein each of the stud bump structures having a stud bump and a solder ball encapsulating the stud bump to enhance thermal dissipation and reduce high stress concentrations in the semiconductor package structure.
    Type: Grant
    Filed: April 30, 2012
    Date of Patent: September 19, 2017
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Meng-Tse Chen, Hsiu-Jen Lin, Chih-Wei Lin, Cheng-Ting Chen, Ming-Da Cheng, Chung-Shi Liu
  • Patent number: 9731383
    Abstract: A brazing or soldering wire has a pair channels recessed therein. A divider separates the pair of channels. The divider has opposing walls extending outwardly from corresponding base portions of the pair of channels. A first engagement surface is located between the opposing walls. A pair of outer walls is separated by the pair of channels and the divider. A second engagement surface is formed between an outer surface of the elongated wire and a terminal end of one of the outer walls and is substantially coplanar with the first engagement surface. A third engagement surface is formed between the outer surface of the elongated wire and a terminal end of the other of the outer walls and is substantially coplanar with the first engagement surface. A cured flux solution is located within the pair of channels.
    Type: Grant
    Filed: July 9, 2014
    Date of Patent: August 15, 2017
    Assignee: Bellman-Melcor Development, LLC
    Inventor: Steven Campbell
  • Patent number: 9724786
    Abstract: Various embodiments of a metal cored wires, hardband alloys, and methods are disclosed. In one embodiment of the present invention, a hardbanding wire comprises from about from about 16% to about 30% by weight chromium; from about 4% to about 10% by weight nickel; from about 0.05% to about 0.8% by weight nitrogen; from about 1% to about 4% by weight manganese; from about 1% to about 4% by weight carbon from about 0.5% to about 5% by weight molybdenum; from about 0.25% to about 2% by weight silicon; and the remainder is iron including trace elements. The hardband alloy produced by the metal cored wire meets API magnetic permeability specifications and has improved metal to metal, adhesive wear resistance compared to conventional hardband alloys.
    Type: Grant
    Filed: November 12, 2013
    Date of Patent: August 8, 2017
    Assignee: Postle Industries, Inc.
    Inventor: Christopher J. Postle
  • Patent number: 9721599
    Abstract: A suspension board with circuit includes a metal supporting board, an insulating base layer formed on one side of the metal supporting board in a thickness direction thereof, a conductive layer, and an insulating cover layer formed on the one side of the insulating base layer to cover the conductive layer. Either one of the insulating base layer and the insulating cover layer includes an opening extending therethrough in the thickness direction. The conductive layer includes a wire formed on the one side of the insulating base layer, and a connection terminal electrically connected to the wire and exposed from the opening to be capable of electrical connection to an electronic element. The suspension board with circuit further includes a protective layer for protecting the connection terminal exposed from the opening.
    Type: Grant
    Filed: June 4, 2015
    Date of Patent: August 1, 2017
    Assignee: NITTO DENKO CORPORATION
    Inventor: Takatoshi Sakakura
  • Patent number: 9610655
    Abstract: A solder paste includes a flux and powder mixed with the flux, where the powder includes first powder and second powder mixed with each other. The first powder may be a tin (Sn) and at least one metal dissolved in the tin (Sn), and the second powder may be a copper (Cu) powder, the surface of which is coated with silver (Ag).
    Type: Grant
    Filed: May 7, 2014
    Date of Patent: April 4, 2017
    Assignee: LG INNOTEK CO., LTD.
    Inventor: Deok Ki Hwang
  • Patent number: 9604315
    Abstract: Provided is a welding method and electrodes (wires) with aluminum as a primary deoxidizer and a basic flux system for joining a workpieces with weld metal of comparable strengths and enhanced toughness. For instance, provided is a welding wire, comprising an aluminum content configured to act as a primary deoxidizer, and an overall composition configured to produce a weld deposit comprising a basic slag over a weld bead, wherein the aluminum content is configured to kill the oxygen in the weld pool, and wherein the oxygen comprises oxygen provided by a shielding gas or produced by heating of welding filler materials. Further provided is a welding method comprising arc welding a workpiece using an electrode having aluminum as a primary deoxidizer under a gas shield to produce a bead of weld deposit and a basic slag over the weld bead.
    Type: Grant
    Filed: October 19, 2015
    Date of Patent: March 28, 2017
    Assignee: ILLINOIS TOOL WORKS INC.
    Inventors: Mario Anthony Amata, Joseph C. Bundy
  • Patent number: 9597753
    Abstract: A solder paste whereby metal does not flow out of a joint during a second or subsequent reflow heating stage. The solder paste excels in terms of temporal stability and exhibits high joint strength at room temperature and at high temperatures. The solder paste comprises a powdered metal component and a flux component, the powdered metal component comprising: 10-70 mass % of a powdered intermetallic compound comprising copper and tin and 30-90 mass % of a solder powder including tin as a main component. Neither the powdered intermetallic compound nor the solder powder contains a copper-only phase, inhibiting the elution of copper ions into the flux.
    Type: Grant
    Filed: March 28, 2014
    Date of Patent: March 21, 2017
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Motoki Koroki, Shunsaku Yoshikawa, Sakie Okada, Taro Itoyama, Hideyuki Komuro, Naoko Hirai, Keitaro Shimizu
  • Patent number: 9573836
    Abstract: The present invention concerns a bushing assembly comprising: (a) a liquid glass feeding unit arranged upstream of and in fluid communication with, (b) a first and second tip plate assemblies (1A, 1B) extending along a longitudinal direction, arranged side by side, and each surrounded by side walls and end walls and, the first and second tip plate assemblies being separated from one another by a stiffening rib structure (21) extending along said longitudinal direction, characterized in that, the feeding unit comprises a glass distribution manifold (2), which defines two separate fluid communication paths to the first and second tip plate assemblies (1A, 1B), and in that, the stiffening rib structure (21) forms an integral part of the floor of the manifold (2).
    Type: Grant
    Filed: May 17, 2013
    Date of Patent: February 21, 2017
    Assignee: 3B-Fibreglass sprl
    Inventors: Philippe Simon, Dimitri Laurent, Utku Ahmet Özden, Christoph Broeckmann, Alexander Bezold
  • Patent number: 9572255
    Abstract: An electronic device has a printed substrate having land electrodes and a chip-type electronic component having external electrodes formed on a surface of a component element body. The land electrodes and the external electrodes are bonded via a solder to form electrode bonding parts. A thermosetting resin is filed between the electrode bonding parts. The bonding material contains solder particles having a melting point T1, a thermosetting resin having a curing temperature T2 that is higher than the melting point T1, and an activating agent having an activation temperature T3 that is lower than the curing temperature T2. The viscosity of the contained components except the solder particles at the melting point T1 is 0.57 Pa·s or less, and the melting point T1 and the activation temperature T3 satisfy T1?T3<50° C.
    Type: Grant
    Filed: March 25, 2014
    Date of Patent: February 14, 2017
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Akihiro Nomura, Hidekiyo Takaoka
  • Patent number: 9541366
    Abstract: A spark generating tube includes a single tube and a pyrotechnical mixture. The single tube only has a single layer of plastic material, such as ethylene vinyl acetate (EVA) and polyethylene. The pyrotechnical mixture has formed a thin layer in contact with the single layer of the single tube. The pyrotechnical contains an oxidizer, a reducing agent, a substance with low temperature of Tammann and an agent for lubricating and adhering, wherein the agent for lubricating and adhering is either talc or graphite, and the reducing agent can be an aluminum powder in microscale. During the process for manufacturing a spark generating tube, the mixture of the oxidizers and additives is formed separately from the reducing agent. The final mixture is obtained only in the single tube formed with an extruder. In this way, only a very small amount of pyrotechnic mixture is formed at any instant.
    Type: Grant
    Filed: August 25, 2014
    Date of Patent: January 10, 2017
    Assignee: IBQ INDUSTRIAS QUIMICAS S/A
    Inventor: Marco Antonio Falquete
  • Patent number: 9527168
    Abstract: A titanium oxide raw material for a welding material, which can achieve the improvement in a bead shape and high-speed welding. The titanium oxide raw material has the form of particles and has a composition containing 58.0 to 99.0 mass % of TiO2, 2.5 mass % or less of Si, 3.0 mass % or less of Al, 5.0 mass % or less of Mn, 35.0 mass % or less of Fe, 5.0 mass % or less of Mg and 2.0 mass % or less of Ca, wherein the surface of each of the particles is coated with an oxide and/or a composite oxide of at least one element selected from Ti, Fe, Mn, Al and Si and the atom percentages of Ti, Fe, Mn, Al, Si and O in the oxide and/or the composite oxide fulfill the following three formulae.
    Type: Grant
    Filed: January 25, 2012
    Date of Patent: December 27, 2016
    Assignee: Kobe Steel, Ltd.
    Inventors: Eri Yamamoto, Norio Masaie, Akiyoshi Kataoka
  • Patent number: 9529333
    Abstract: A method of assembling a device including first and second parts, the method including: taking the first and second parts; assembling the first and second parts provided by their arrangement so a gap is present between the first and second parts; taking a metal alloy, chosen for its ability to become at least partially amorphous; shaping the metal alloy to fill the gap between the first and second parts to join them and thereby form the device, the metal alloy having been subject to a treatment allowing the alloy to become at least partially amorphous, at a latest at a time of the shaping. The metal alloy is subject to a temperature increase above the melting temperature thereof causing the alloy to lose any local crystalline structure, the increase followed by cooling to a lower temperature than vitreous transition temperature thereof allowing the material to become at least partially amorphous.
    Type: Grant
    Filed: June 22, 2011
    Date of Patent: December 27, 2016
    Assignee: The Swatch Group Research and Development Ltd.
    Inventors: Yves Winkler, Stewes Bourban, Alban Dubach
  • Patent number: 9515044
    Abstract: Provided is an electronic device which includes a conductor allowing an electric signal to transmit therethrough, the conductor containing a plurality of species of metal components having different melting points, and internally having a constituent concentration gradient produced as a result of diffusion of the metal components.
    Type: Grant
    Filed: October 14, 2015
    Date of Patent: December 6, 2016
    Assignee: Napra Co., Ltd.
    Inventor: Shigenobu Sekine
  • Patent number: 9504168
    Abstract: A fluxing-encapsulant material and method of use thereof in a thermal compression bonding (TCB) process is described. In an embodiment, the TCB process includes ramping the bond head to 250° C.-300° C. at a ramp rate of 50° C./second-100° C./second. In an embodiment, the fluxing-encapsulant material comprising one or more epoxy resins having an epoxy equivalent weight (EEW) of 150-1,000, a curing agent, and a fluxing agent having a mono-carboxylic acid or di-carboxylic acid and a pKa of 4-5.
    Type: Grant
    Filed: September 30, 2011
    Date of Patent: November 22, 2016
    Inventors: Sivakumar Nagarajan, Sandeep Razdan, Nisha Ananthakrishnan, Craig J. Weinman, Kabirkumar J. Mirpuri
  • Patent number: 9498853
    Abstract: The present invention provides an amorphous caesium aluminum fluoride complex, a process for its production and the use of the complex as a flux, in particular for the soft soldering of aluminum.
    Type: Grant
    Filed: December 20, 2006
    Date of Patent: November 22, 2016
    Inventors: Gerd J. Harms, Hartmut Hofmann, Klaus-Peter Lehmann, Alexander Schiedt
  • Patent number: 9475154
    Abstract: Electrodes for depositing hardfacing alloys containing boron, carbon, chromium, manganese, and silicon on the surface of metal components that are subjected to high thermal and mechanical stresses. The deposited hardfacing alloys have from about 2.5 to about 14.0 atomic percent boron and have a hardness on the Rockwell “C” scale of at least about 65 HRC in the first layer of the weld deposit.
    Type: Grant
    Filed: May 30, 2013
    Date of Patent: October 25, 2016
    Assignee: Lincoln Global, Inc.
    Inventors: Daniel J Langham, Badri K Narayanan
  • Patent number: 9227273
    Abstract: There is provided a high-temperature Pb-free solder paste having the strength required to join electronic parts to a substrate and having excellence in wettability and workability. The solder paste formed by mixing a solder alloy and a flux, the solder alloy consisting of, based on the total mass of the solder alloy as 100 mass %: 0.4 to 13.5 mass % of Zn, at least one of 0.01 to 2.0 mass % of Cu or 0.03 to 0.7 mass % of Al, and a balance being Bi except for inevitable impurities.
    Type: Grant
    Filed: November 18, 2011
    Date of Patent: January 5, 2016
    Assignee: SUMITOMO METAL MINING CO., LTD.
    Inventor: Takashi Iseki
  • Patent number: 9209155
    Abstract: The present invention aims to provide a method for producing a semiconductor device, the method being capable of achieving high reliability by suppressing voids. The present invention also aims to provide a flip-chip mounting adhesive for use in the method for producing a semiconductor device. The present invention relates to a method for producing a semiconductor device, including: step 1 of positioning a semiconductor chip on a substrate via an adhesive, the semiconductor chip including bump electrodes each having an end made of solder; step 2 of heating the semiconductor chip at a temperature of the melting point of the solder or higher to solder and bond the bump electrodes of the semiconductor chip to an electrode portion of the substrate, and concurrently to temporarily attach the adhesive; and step 3 of removing voids by heating the adhesive under a pressurized atmosphere, wherein the adhesive has an activation energy ?E of 100 kJ/mol or less, a reaction rate of 20% or less at 2 seconds at 260° C.
    Type: Grant
    Filed: August 5, 2013
    Date of Patent: December 8, 2015
    Assignee: SEKISUI CHEMICAL CO., LTD.
    Inventors: Sayaka Wakioka, Hiroaki Nakagawa, Yoshio Nishimura, Shujiro Sadanaga
  • Patent number: 9107332
    Abstract: A printed circuit board includes a base, a circuit pattern, a solder mask, an activated metal layer, a plurality of metal seed layers, and a plurality of metal bumps. The conductive circuit pattern is formed on the base, to include a plurality of conductive pads. The solder mask is formed on a surface of the conductive circuit pattern and portions of the base are exposed from the circuit pattern. The solder mask includes blind vias corresponding to the pads, and laser-activated catalyst. The activated metal layer is obtained by laser irradiation at the wall of the blind via. The activated metal layer is in contact with the solder mask. The metal seed layer is formed on the activated metal layer and the pads. Each metal bump is formed on the metal seed layer, and each metal bump protrudes from the solder mask.
    Type: Grant
    Filed: April 16, 2013
    Date of Patent: August 11, 2015
    Assignee: Zhen Ding Technology Co., Ltd.
    Inventor: Wen-Hung Hu
  • Patent number: 9095936
    Abstract: The present invention relates to variable melting point solder formulations. The solder is comprised of at least one base metal or base metal alloy, preferably alloyed with at least one melting point depressant metal, such that the solidus point of the solder composition is reduced to an initial solidus temperature. Said base metal or base metal alloy, alloyed with at least one melting point depressant metal is mixed with at least one additive metal or additive metal alloy. When heated to a process temperature above said initial solidus temperature, a reaction occurs between the melting point depressant metal, and the additive metal, such that solidification occurs at the process temperature via the formation of intermetallic phases, effectively increasing the solidus of the base metal, and of the overall solder.
    Type: Grant
    Filed: August 26, 2011
    Date of Patent: August 4, 2015
    Assignee: DYNAJOIN CORPORATION
    Inventors: Douglas J. McIsaac, Mark A. Whitney, Stephen F. Corbin
  • Patent number: 9085051
    Abstract: Certain example embodiments of this invention relate to silver pastes that are capable of making an electrical connection with at least one conductive layer in a layer stack, even where the at least one conductive layer is protected by one or more strong dielectric layers, and/or methods of making the same. Certain example embodiments include a chemically modified silver paste that may be cured or fired using a standard glass tempering furnace (e.g., an electrical or gas-fuelled furnace) or a short-wave infrared heating process at temperatures below 750 degrees C. In certain example embodiments, the fluorine causes apertures or micro-factures in the dielectric layer(s), which allows the silver in the paste to move therethrough (e.g., by capillary action) to form a contact with the conductive layer(s).
    Type: Grant
    Filed: March 29, 2010
    Date of Patent: July 21, 2015
    Assignee: Gaurdian Industries Corp.
    Inventor: Jemssy Alvarez
  • Publication number: 20150136461
    Abstract: A solder alloy of a tin-silver-copper solder alloy, containing tin, silver, antimony, bismuth, copper, and nickel, and substantially does not contain germanium, relative to the total amount of the solder alloy, the silver content is more than 1.0 mass % and less than 1.2 mass %, the antimony content is 0.01 mass % or more and 10 mass % or less, and the bismuth content is 0.01 mass % or more and 3.0 mass % or less.
    Type: Application
    Filed: June 25, 2013
    Publication date: May 21, 2015
    Inventors: Yoji Imamura, Kazuki Ikeda, JinYu Piao, Tadashi Takemoto