Abstract: A conductive paste includes: a solder powder having a melting point of less than or equal to 120° C.; a conductive filler; a flux for removing an oxide film of the solder powder; and a solvent, wherein a ratio of a mass of the conductive filler to a mass of the solder powder is 20% to 80%.

Abstract: Provided are flux in which solder wettability is improved, and a solder paste in which the flux is used. The flux contains 0.5-20.0 wt % of a (carboxyalkyl)isocyanurate adduct, and 5.0-45.0 wt % of a rosin, and furthermore contains a solvent. The (carboxyalkyl)isocyanurate adduct is a mono(carboxyalkyl)isocyanurate adduct, a bis(carboxyalkyl)isocyanurate adduct, a tris(carboxyalkyl)isocyanurate adduct, or a combination of two or more of these.

Abstract: A flux containing an organic acid, a water-soluble base agent, and a solvent, but not containing water is adopted. In this flux, the organic acid includes 1,2,3-propanetricarboxylic acid. The water-soluble base agent is one or more selected from the group consisting of a nonionic surfactant and a weak cationic surfactant. The content of the 1,2,3-propanetricarboxylic acid is 1% by mass or more and 15% by mass or less with respect to the total amount of the entire flux, the total content of the water-soluble base agent is 30% by mass or more and 65% by mass or less with respect to the total amount of the entire flux, and the total content of the solvent is 30% by mass or more and 65% by mass or less with respect to the total amount of the entire flux. According to this flux, the wettability of solder can be enhanced and ball missing after reflow and flux residue washing is suppressed.

Abstract: A brazing material for brazing aluminum or an aluminum alloy includes fluoride-based flux, a solidifying agent, and a coating film uniformity agent, and is solid at 25° C.

Abstract: A flux includes: at least one liquid solvent that has one or more hydroxy groups and is liquid at ordinary temperature; and at least two solid solvents that respectively have one or more hydroxy groups and are solid at normal temperature, in which the content of each of the solid solvents is less than 40 mass % based on the total content of the liquid solvent and the solid solvents.

Abstract: A multilayer ceramic capacitor includes a laminated body and first and second external electrodes respectively on both end surfaces of the laminated body. When regions where first internal electrodes or second internal electrodes are not present are regarded as side margin portions in a cross section of the laminated body as viewed from the laminating direction, the side margin portions include multiple side margin layers, and the content of Si in the side margin layer closest to the internal electrode is lower than that in the side margin layer other than the side margin layer closest to the internal electrode.

Abstract: Provided are a resin composition and a soldering flux. The resin composition includes at least one acid and rosin. The acid is selected from a dimer acid which is a reaction product of oleic acid and linoleic acid, a trimer acid which is a reaction product of oleic acid and linoleic acid, a hydrogenated dimer acid obtained by hydrogenating a dimer acid which is a reaction product of oleic acid and linoleic acid, and a hydrogenated trimer acid obtained by hydrogenating a trimer acid which is a reaction product of oleic acid and linoleic acid. A weight ratio of the at least one acid to the rosin is 0.15 or more and 1.00 or less based on the weight of the rosin. The soldering flux is obtained by diluting the resin composition with a solvent.

Abstract: Disclosed is a method for activating a surface of metals, such as self-passivated metals, and of metal-oxide dissolution, effected using a fluoroanion-containing composition. Also disclosed is an electrochemical cell utilizing an aluminum-containing anode material and a fluoroanion-containing electrolyte, characterized by high efficiency, low corrosion, and optionally mechanical or electrochemical rechargeability. Also disclosed is a process for fusing (welding, soldering etc.) a self-passivated metal at relatively low temperature and ambient atmosphere, and a method for electrodepositing a metal on a self-passivated metal using metal-oxide source.

Abstract: Compositions and methods for coupling metals to aluminum surfaces are provided. The compositions are prepared as aqueous solutions or suspensions, and can be applied to the aluminum surface using conventional printing techniques. Rheology of the printable composition can be adjusted to provide a gel or a cream. Curing steps, if necessary, are performed at low temperatures that are compatible with plastic/polymer components of mass produced devices, such as aluminum RFID antennae.

Abstract: A flux comprising an organic acid; a solvent; and polyoxyethylene behenyl alcohol having an average number of moles of ethylene oxide added of 7 to 40 mol.

Abstract: Described herein are compositions for use in the brazing of metal substrates. Methods of making and using these compositions are also described herein.

Abstract: This invention relates to a process for obtaining lead (Pb) and/or tin (Sn) from a lead- and/or tin-based material using a deep eutectic solvent.

Abstract: Provided are a flux, resin flux cored solder and a flux coated pellet which are washable with water. Resin flux cored solder is composed of solder having a linear shape and a flux filled in a substantially central part (core) of the cross section of the solder. The flux contains an amine for salt formation and an organic acid for salt formation, in which the amount of the organic acid is within a range between 10 parts by mass or more and 645 parts by mass or less based on 100 parts by mass of the amine. The organic acid for salt formation is composed of at least one organic acid selected from the group consisting of malonic acid, succinic acid, glutaric acid, tartaric acid, malic acid, diglycolic acid, and citric acid.

Abstract: Provided are a flux composition that is applicable without any film formation step, and solder paste, a solder joint and a solder joining method using the flux composition. The flux composition contains 20 wt % or more and 50 wt % or less of an epoxy resin, 15 wt % or more and 45 wt % or less of diallyl bisphenol A, and 1 wt % or more and 30 wt % or less of organic acid.

Abstract: Provided is flux that can achieve a low residue so as to make it possible to ensure solder wettability, ensure holding properties of a solder ball, and suppress the amount of residue after soldering and enable application for use without washing. The flux includes 1-15% by weight of an organic acid mixture comprising an organic acid with 10 or more carbon atoms, 50-90% by weight of isobornyl cyclohexanol, and 5-45% by weight of a different solvent. The proportion of the isobornyl cyclohexanol is 50-95% by weight, where 100% by weight is the total of the isobornyl cyclohexanol and the different solvent. The organic acid mixture comprising the organic acid with 10 or more carbon atoms comprises 2-methylnonanedioic acid, 4-(methoxycarbonyl)-2,4-dimethylundecanedioic acid, 4,6-bis(methoxycarbonyl)-2,4,6-trimethyldecanedioic acid, and 8,9-bis(methoxycarbonyl)-8,9-dimethylhexadecanedioic acid.

Abstract: A device, for example a medical implant, and a method of making the same, the device having a metal or metal alloy substrate, for example cobalt chrome, and a diffusion hardened metallic surface, for example a plasma carburized surface, contacting a non-diffusion hardened surface or a diffusion hardened surface having a diffusion hardening species different from that of the opposing surface.

Abstract: A multilayer ceramic capacitor includes a laminated body and first and second external electrodes respectively on both end surfaces of the laminated body. When regions where first internal electrodes or second internal electrodes are not present are regarded as side margin portions in a cross section of the laminated body as viewed from the laminating direction, the side margin portions include multiple side margin layers, and the content of Si in the side margin layer closest to the internal electrode is lower than that in the side margin layer other than the side margin layer closest to the internal electrode.

Abstract: A semiconductor device and method for providing an enhanced removal of heat from a semiconductor die within an integrated fan out package on package configuration is presented. In an embodiment a metal layer is formed on a backside of the semiconductor die, and the semiconductor die along and through vias are encapsulated. Portions of the metal layer are exposed and a thermal die is connected to remove heat from the semiconductor die.

Abstract: Provided is a flux that contains at least one of an amine compound containing at least one acetylated amino group and an amino acid compound containing at least one acetylated amino group, as an activator.

Abstract: A solder composition contains: flux composition containing (A) rosin-based resin, (B) activator, and (C) solvent; and (D): solder powder with a melting point of 200 to 250 degrees C. The component (A) contains (A1) rosin-based resin with a softening point of 120 degrees C. or more and an acid number of 220 mgKOH/g or more and (A2) rosin-based resin with a softening point of 100 degrees C. or less and an acid number of 20 mgKOH/g or less. The component (C) contains (C1) hexanediol solvent with a melting point of 40 degrees C. or more and a boiling point of 220 degrees C. or less and (C2) solvent with a viscosity of 10 mPa·s or less at 20 degrees C. and a boiling point of 270 degrees C. or more. A content of the component (A1) ranges from 15 to 25 mass % with respect to the flux composition (100 mass %).

Abstract: A silver sintering preparation comprising: (A) 30 to 88 wt.-% of silver flake particles having a mean particle diameter (d50) in the range of >1 to 20 ?m, (B) 5 to 30 wt.-% of at least one silver precursor, (C) 1 to 10 wt.-% of an organic polymer system, and (D) 6 to 30 wt.-% of organic solvent, wherein the organic polymer system (C) is chemically essentially stable at temperatures <300° C. and forms a continuous phase together with the organic solvent (D).

Abstract: A solder composition of the invention contains solder powders and a flux composition. The flux composition contains (A) a resin and (B) an activator. The (B) component contains (B1) an organic acid, and (B2) a pyridine compound represented by a formula (1) below. A chlorine concentration is 900 mass ppm or less, a bromine concentration is 900 mass ppm or less, an iodine concentration is 900 mass ppm or less and a total halogen concentration is 1500 mass ppm or less in the solder composition. In the formula (1), X1, X2 and X3 are the same or different, each of X1, X2 and X3 representing a hydrogen atom, a hydroxyl group, a methyl group, an ethyl group or a propyl group, and all of X1, X2 and X3 are not simultaneously hydrogen atoms.

Abstract: A multilayer ceramic capacitor includes a laminated body and first and second external electrodes respectively on both end surfaces of the laminated body. When regions where first internal electrodes or second internal electrodes are not present are regarded as side margin portions in a cross section of the laminated body as viewed from the laminating direction, the side margin portions include multiple side margin layers, and the content of Si in the side margin layer closest to the internal electrode is lower than that in the side margin layer other than the side margin layer closest to the internal electrode.

Abstract: A multilayer ceramic capacitor includes a laminated body and first and second external electrodes respectively on both end surfaces of the laminated body. When regions where first internal electrodes or second internal electrodes are not present are regarded as side margin portions in a cross section of the laminated body as viewed from the laminating direction, the side margin portions include multiple side margin layers, and the content of Si in the side margin layer closest to the internal electrode is lower than that in the side margin layer other than the side margin layer closest to the internal electrode.

Abstract: The present invention provides a bonding wire capable of simultaneously satisfying ball bonding reliability and wedge bondability required of bonding wires for memories, the bonding wire including a core material containing one or more of Ga, In, and Sn for a total of 0.1 to 3.0 at % with a balance being made up of Ag and incidental impurities; and a coating layer formed over a surface of the core material, containing one or more of Pd and Pt, or Ag and one or more of Pd and Pt, with a balance being made up of incidental impurities, wherein the coating layer is 0.005 to 0.070 ?m in thickness.

Abstract: A flux composition for treating a metal surface prior to batch hot galvanizing in molten zinc-based alloys is disclosed. The flux composition can include (a) 40 to 70 wt. % zinc chloride, (b) 10 to 30 wt. % ammonium chloride, (c) 6 to 30 wt. % of a set of at least two alkali or alkaline earth metal halides, (d) from 0.1 to 2 wt. % lead chloride, and (e) from 2 to 15 wt. % tin chloride, provided that the combined amounts of lead chloride and tin chloride represent at least 2.5 wt. % of the composition. A fluxing bath having this flux composition dissolved in water for use in galvanizing processes, as well as, a method for continuous or batch-wise treatment of metal articles in order to produce a protective coating layer with a thickness ranging from 5 to 30 ?m is also disclosed.

Abstract: A method for the production of a silver sintering agent in the form of a layer-shaped silver sintering body having silver oxide surfaces and the use thereof are provided.

Abstract: A multilayer ceramic capacitor includes a laminated body and first and second external electrodes respectively on both end surfaces of the laminated body. When regions where first internal electrodes or second internal electrodes are not present are regarded as side margin portions in a cross section of the laminated body as viewed from the laminating direction, the side margin portions include multiple side margin layers, and the content of Si in the side margin layer closest to the internal electrode is lower than that in the side margin layer other than the side margin layer closest to the internal electrode.

Abstract: A flux for a resin flux cored solder or a flux coated solder, in which scattering of flux and solder in using the solder is suppressed, and a resin flux cored solder or a flux coated solder including such a flux are provided. The flux for a resin flux cored solder can include a rosin resin, an activator, and at least one selected from an acrylic polymer and a vinyl ether polymer, which has a weight average molecular weight of 8000 to 100000, in an amount of 0.1 to 3 mass-% based on the total mass of the flux.

Abstract: A nanoparticle powder is disclosed including a plurality of stabilized nanoparticles having a superalloy composition. At least about 90% of the particles have a convexity between about 0.980-1 and a circularity between about 0.850-1. A method for forming a braze paste is disclosed including mixing the plurality of stabilized nanoparticles with at least one organometallic precursor and up to about 5 wt % binder. A method for modifying an article is disclosed including applying the braze paste to a substrate including at least one crack, removing at least about 70% of the binder in the braze paste, and then applying additional braze paste over the first portion. Under vacuum or inert gas atmosphere, essentially all remaining binder is evaporated. The braze paste is brazed to the article at about 40-60% of the superalloy's bulk liquidus temperature, forming a brazed material and thereby sealing the at least one crack.

Abstract: A method is provided for joining at least two components of a medical instrument, the at least two components are held so as to form at least one soldering gap between mutually assigned joining areas of the components, a solder material is arranged for filling the at least one soldering gap, and the arrangement of the at least two components and of the solder material is heated to a soldering temperature of the solder material, wherein the solder material is an iron-based solder. A use of an iron-based solder and a medical instrument, in particular a laryngoscope spatula, are also provided.

Abstract: The present invention discloses a planar glass sealing structure and a manufacturing method thereof, the planar glass sealing structure comprises, in a top-down order: a first glass substrate, an insulating layer, a metal sealing frame and a second glass substrate. The insulating layer is formed as a frame shape, and disposed on a peripheral margin of the first glass substrate; the metal sealing frame is formed by heating to melt a metal solder layer between the first and second glass substrate, and it can keep a fixed gap between the first and second glass substrate, so that an inner space thereof is kept in an excellent sealed condition. The present invention can ensure the sealing structure of two correspondingly assembled glass substrates, so that the inner space thereof is insulated from moisture and oxygen, so as to increase the performance and quality of the device.

Abstract: An approach to provide an electronic assembly process that includes receiving at least one electronic assembly after a solder reflow process using a Sn-containing solder and a water-soluble flux. The approach includes baking the at least one electronic assembly in an oxygen containing environment and, then cleaning the at least one electronic assembly in an aqueous cleaning process.

Abstract: Provided is a flux containing not less than 11.0 degrees and not more than 17.0 of a contact angle between the flux and a resist substrate on which the flux has been printed to have 1.0 mm of a diameter and 0.15 mm of a thickness when heating the resist substrate at 150 degrees C. for 30 seconds and cooling the resist substrate to a room temperature. The flux also contains more than zero seconds and not more than 2.0 seconds of a zero-cross time when heating a Cu plate at 150 degrees C. in a thermostat oven for 12 hours, applying the flux onto the baked Cu plate, and dipping the baked Cu plate onto which the flux is applied into a Sn-3.0Ag-0.5Cu alloy at a dipping speed of 15 mm/sec and by 2.0 mm of a dipped depth.

Abstract: It discloses a high-efficient energy-saving and surfacing layer well-forming self-shielded flux-cored welding wire. A low-carbon steel strip is used as an outer cover, and a flux core comprises the following components in percentage by mass: 42-60% high carbon ferrochrome with a particle size of 80 meshes, 10-18% ferrosilicon, 16-25% ferroboron, 2-8% rare earth silicon, 2-8% graphite, 1-4% aluminum magnesium alloy, 2-5% manganese powder and the balance of iron powder, wherein the graphite, the aluminum magnesium alloy and the manganese powder are all added with two particle sizes including 60 meshes and 200 meshes, and the weight of the flux core powder accounts for 49-53% of the total weight of the welding wire.

Abstract: Provided is a flux that is able to suppress any solder bridges even when it is applied to the narrow pitched electrodes such that the bridge occurs when using the past flux. The flux is characterized by containing 15% by mass or more and 35% by mass or less of polyoxyalkylene ethylenediamine, 2% by mass or more and 15% by mass or less of an organic acid, 10% by mass or more and 30% by mass or less of a base material, 3% by mass or more and 30% by mass or less of an amine and 20% by mass or more and 40% by mass or less of a solvent.

Abstract: Methods/structures of joining package structures are described. Those methods/structures may include forming a metal formate on a surface of a first solder interconnect structure disposed on a first package substrate at a first temperature, and attaching a second solder interconnect structure disposed on a second package substrate to the first solder interconnect structure at a second temperature. The second temperature decomposes at least a portion of the metal formate and generates a hydrogen gas. The generated hydrogen gas removes an oxide from the second solder interconnect structure during joint formation at the second temperature.

Abstract: A conductive adhesive that does not contain toxic substances such as solder (lead) and shows excellent adhesiveness. Specifically, it is a conductive adhesive composition, which includes: (A) a thermosetting resin; (C) a filler that contains a metal element; and (D) at least one catalyst or curing agent, wherein the reaction initiation temperature for the (A) thermosetting resin and the (D) at least one catalyst or curing agent is 180° C. or higher. More preferably, the reaction initiation temperature is 200° C. or higher. More preferably, it is a conductive adhesive composition that further includes (B) a flux and (E) a polymer component.

Abstract: An object of the present invention is to provide a flux in which the occurrence of a bridge and a ball is suppressed at the time of soldering, and a resin composition for the flux. The flux comprising: at least one selected from 0.3 to 2.0 mass % of an organochlorine compound, and more than 0.04 mass % and 1.00 mass % or less of an amine hydrochloride; and 0.2 to 1.5 mass % of an organophosphorus compound that is at least one selected from a phosphonic acid ester and a phenyl-substituted phosphinic acid, each based on the whole flux.

Abstract: An object of the present invention is to provide a flux in which the occurrence of a bridge and a ball is suppressed at the time of soldering, and a resin composition for the flux. The flux comprising: at least one selected from 0.3 to 2.0 mass % of an organochlorine compound, and more than 0.04 mass % and 1.00 mass % or less of an amine hydrochloride; and 0.2 to 1.5 mass % of an organophosphorus compound that is at least one selected from a phosphonic acid ester and a phenyl-substituted phosphinic acid, each based on the whole flux.

Abstract: Described herein are compositions for use in the brazing of metal substrates, methods of making and using these compositions are also described herein. Heat exchangers often have a distributor tube whose external surface is provided with cooling fins. The distributor tube is typically a steel tube coated with a metal having good heat conduction, such as aluminum. The cooling fins themselves also generally comprise aluminum because of its good heat conductivity and low weight.

Abstract: There is provided a flux applying apparatus configured to jet and apply a flux to a target, whereby the flux applying apparatus is capable of rapidly collecting a surplus flux in a sub-tank and returning the same to the main tank for further jetting and applying. In particular, the flux applying apparatus is coupled to a control unit capable of estimating a flux amount trapped in the sub-tank on the basis of a time period for which the flux is to be jetted from the nozzle.

Abstract: A solder paste for the mounting of electronic components and substrates contains a mixture of oxalic acid, adipic acid, and an amine component. An electronic component may be mounted on a substrate through the use of the solder paste. Also, a module may utilize the solder paste.

Abstract: It is an object of the present invention to obtain a ceramic circuit substrate having high bonding strength, excellent heat cycle resistance, enhanced reliability of operation as an electronic device, and excellent heat dissipation properties. The present invention provides a ceramic circuit substrate in which metal plates, particularly copper plates, and both main surfaces of a ceramic substrate are bonded vial silver-copper brazing material layers. The silver-copper brazing material layers are formed from a silver-copper brazing material including i) 0.3-7.5 parts by mass of carbon fibers, and ii) 1.0-9.0 parts by mass of at least one active metal selected from titanium, zirconium, hafnium, niobium, tantalum, vanadium, and tin; with respect to iii) a total of 100 parts by mass of a) 75-98 parts by mass of silver powder and b) 2-25 parts by mass of copper powder. The carbon fibers having an average length of 15-400 ?m, an average diameter of 5-25 ?m and an average aspect ratio of 3-28.

Abstract: A light-emitting device includes a base having an insulating part and a metal block; a light-emitting diode (LED) chip over the base; a water soluble paste between the LED chip and the base metal block for chip fixing and heat conduction; packaging glue covering the LED chip; and the LED chip bottom, water soluble paste and the base metal block form an all-metal thermal conducting path to achieve low a thermal resistance.

Abstract: Disclosed herein are copper-containing (Cu-containing) conductive pastes, copper (Cu) electrodes formed by firing the Cu-containing conductive paste over a substrate, and articles comprising a structural element with such Cu electrodes, wherein, the Cu-containing conductive paste contains a powder mixture of Cu, Ge, and B particles dispersed in an organic medium.

Abstract: Embodiments of the invention relate to methods of making articles having portions of polycrystalline diamond bonded to a surface of a substrate and polycrystalline diamond compacts made using the same. In an embodiment, a molding technique is disclosed for forming cutting tools comprising polycrystalline diamond portions bonded to the outer surface of a substrate.

Abstract: A weld kit is presented for use in creating a weld with limited access to a structure. The weld kit contains a back plate being a combination of a thermic material attached to a metallic material. Additionally, the weld kit has a lowering device secured to the back plate. A plurality of tacking nodes travel through both the thermic material and the metallic material of the back plate. The plurality of tacking nodes are operative to accept and distribute heat from a welding arc to create a tack weld at a location where at least one of the plurality of tacking nodes contacts a weld joint. The presented weld kit may be used to repair a damaged enclosed structure. Additionally, the presented weld kit may also be used to create an enclosed structure in a manufacture type environment.

Abstract: A flux composition which includes one or more organic compounds including one or more sulfonic acid groups, salts or anhydrides thereof is applied to tin or tin alloy deposits. The flux composition is then homogenized on the tin or tin alloy to inhibit tin or tin alloy oxidation and improve brightness of the tin or tin alloy.

Abstract: The manufacturing method of a semiconductor device includes applying a conductive paste containing metal particles to a specified area in an electrode plate including a recess in a surface of the electrode plate, the specified area being adjacent to the recess. The manufacturing method of a semiconductor device includes placing a semiconductor chip on the conductive paste so that an outer peripheral edge of the semiconductor chip is located above the recess. The manufacturing method of a semiconductor device includes hardening the conductive paste by heating the conductive paste while applying pressure to the semiconductor chip in a direction toward the electrode plate.