Fluxing Patents (Class 148/23)
  • Patent number: 10434610
    Abstract: A solder paste for the mounting of electronic components and substrates contains a mixture of oxalic acid, adipic acid, and an amine component. An electronic component may be mounted on a substrate through the use of the solder paste. Also, a module may utilize the solder paste.
    Type: Grant
    Filed: December 12, 2014
    Date of Patent: October 8, 2019
    Assignee: Heraeus Deutschland GmbH & Co. KG
    Inventors: Jens Nachreiner, Joachim Wiese, Sebastian Fritzsche
  • Patent number: 10434592
    Abstract: There is provided a flux applying apparatus configured to jet and apply a flux to a target, whereby the flux applying apparatus is capable of rapidly collecting a surplus flux in a sub-tank and returning the same to the main tank for further jetting and applying. In particular, the flux applying apparatus is coupled to a control unit capable of estimating a flux amount trapped in the sub-tank on the basis of a time period for which the flux is to be jetted from the nozzle.
    Type: Grant
    Filed: June 12, 2017
    Date of Patent: October 8, 2019
    Assignee: FUJITSU TEN LIMITED
    Inventor: Hisaki Hayashi
  • Patent number: 10424529
    Abstract: It is an object of the present invention to obtain a ceramic circuit substrate having high bonding strength, excellent heat cycle resistance, enhanced reliability of operation as an electronic device, and excellent heat dissipation properties. The present invention provides a ceramic circuit substrate in which metal plates, particularly copper plates, and both main surfaces of a ceramic substrate are bonded vial silver-copper brazing material layers. The silver-copper brazing material layers are formed from a silver-copper brazing material including i) 0.3-7.5 parts by mass of carbon fibers, and ii) 1.0-9.0 parts by mass of at least one active metal selected from titanium, zirconium, hafnium, niobium, tantalum, vanadium, and tin; with respect to iii) a total of 100 parts by mass of a) 75-98 parts by mass of silver powder and b) 2-25 parts by mass of copper powder. The carbon fibers having an average length of 15-400 ?m, an average diameter of 5-25 ?m and an average aspect ratio of 3-28.
    Type: Grant
    Filed: February 20, 2015
    Date of Patent: September 24, 2019
    Assignee: DENKA COMPANY LIMITED
    Inventors: Ryota Aono, Kosuke Wada, Masao Tsuichihara, Takeshi Miyakawa
  • Patent number: 10367126
    Abstract: A light-emitting device includes a base having an insulating part and a metal block; a light-emitting diode (LED) chip over the base; a water soluble paste between the LED chip and the base metal block for chip fixing and heat conduction; packaging glue covering the LED chip; and the LED chip bottom, water soluble paste and the base metal block form an all-metal thermal conducting path to achieve low a thermal resistance.
    Type: Grant
    Filed: May 29, 2015
    Date of Patent: July 30, 2019
    Assignee: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Junpeng Shi, Pei-Song Cai, Hao Huang, Zhenduan Lin, Chih-Wei Chao, Chen-Ke Hsu
  • Patent number: 10325693
    Abstract: Disclosed herein are copper-containing (Cu-containing) conductive pastes, copper (Cu) electrodes formed by firing the Cu-containing conductive paste over a substrate, and articles comprising a structural element with such Cu electrodes, wherein, the Cu-containing conductive paste contains a powder mixture of Cu, Ge, and B particles dispersed in an organic medium.
    Type: Grant
    Filed: August 28, 2014
    Date of Patent: June 18, 2019
    Assignee: E I DU PONT DE NEMOURS AND COMPANY
    Inventors: Minfang Mu, Yundan Wu
  • Patent number: 10293467
    Abstract: Embodiments of the invention relate to methods of making articles having portions of polycrystalline diamond bonded to a surface of a substrate and polycrystalline diamond compacts made using the same. In an embodiment, a molding technique is disclosed for forming cutting tools comprising polycrystalline diamond portions bonded to the outer surface of a substrate.
    Type: Grant
    Filed: November 22, 2016
    Date of Patent: May 21, 2019
    Assignee: US SYNTHETIC CORPORATION
    Inventor: David P. Miess
  • Patent number: 10286482
    Abstract: A weld kit is presented for use in creating a weld with limited access to a structure. The weld kit contains a back plate being a combination of a thermic material attached to a metallic material. Additionally, the weld kit has a lowering device secured to the back plate. A plurality of tacking nodes travel through both the thermic material and the metallic material of the back plate. The plurality of tacking nodes are operative to accept and distribute heat from a welding arc to create a tack weld at a location where at least one of the plurality of tacking nodes contacts a weld joint. The presented weld kit may be used to repair a damaged enclosed structure. Additionally, the presented weld kit may also be used to create an enclosed structure in a manufacture type environment.
    Type: Grant
    Filed: June 15, 2015
    Date of Patent: May 14, 2019
    Assignee: Caterpillar Inc.
    Inventors: Huijun Wang, Kendall Reed Powell, Yan Shao, Donald Stickel, Howard Ludewig
  • Patent number: 10273591
    Abstract: A flux composition which includes one or more organic compounds including one or more sulfonic acid groups, salts or anhydrides thereof is applied to tin or tin alloy deposits. The flux composition is then homogenized on the tin or tin alloy to inhibit tin or tin alloy oxidation and improve brightness of the tin or tin alloy.
    Type: Grant
    Filed: January 20, 2013
    Date of Patent: April 30, 2019
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventor: Peter R. Levey
  • Patent number: 10269753
    Abstract: The manufacturing method of a semiconductor device includes applying a conductive paste containing metal particles to a specified area in an electrode plate including a recess in a surface of the electrode plate, the specified area being adjacent to the recess. The manufacturing method of a semiconductor device includes placing a semiconductor chip on the conductive paste so that an outer peripheral edge of the semiconductor chip is located above the recess. The manufacturing method of a semiconductor device includes hardening the conductive paste by heating the conductive paste while applying pressure to the semiconductor chip in a direction toward the electrode plate.
    Type: Grant
    Filed: December 19, 2017
    Date of Patent: April 23, 2019
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventor: Akinori Sakakibara
  • Patent number: 10265808
    Abstract: A flux for a resin flux cored solder contains 30% or more by mass but 80% or less by mass rosin ester and 5% or more by mass but 15% or less by mass activator. The total content ratio of base materials including the rosin ester is preferably equal to or more than 85% by mass but equal to or less than 95% by mass.
    Type: Grant
    Filed: December 16, 2015
    Date of Patent: April 23, 2019
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Motohiro Onitsuka, Yoko Kurasawa, Toshihisa Kugi, Hiroshi Kawanago, Kaichi Tsuruta
  • Patent number: 10259083
    Abstract: A cleaning flux contains as a solvent 60-98% by weight of one or both of an alkylene oxide-resorcinol copolymer and an ethylene oxide-propylene oxide condensation-added alkylene diamine. An addition amount of the alkylene oxide-resorcinol copolymer is within a range of 0-98% by weight and the addition amount of the ethylene oxide-propylene oxide condensation-added alkylene diamine is within the range of 0-98% by weight. The cleaning flux further includes one or both of an organic acid and a halogen compound. The addition amount of the organic acid is within the range of 0-18% by weight and the addition amount of the halogen compound is within the range of 0-4% by weight.
    Type: Grant
    Filed: September 12, 2013
    Date of Patent: April 16, 2019
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Naokatsu Kojima, Daisuke Maruko
  • Patent number: 10252378
    Abstract: A cored wire for hybrid laser cladding includes a hollow metal sheath and a core powder composition. The core powder can include, by weight percent: carbon from about 0.8% to about 1.2%, manganese from about 1% to about 1.4%, silicon from about 0.8% to about 1%, chromium from about 22% to about 30%, titanium from about 0.5% to about 2%, vanadium from about 0.5% to about 2%, boron from about 0.8% to about 1.2%, phosphorus from 0% to about 0.04%, and sulfur from 0% to about 0.03%, the balance of the core powder composition being substantially iron. Components and methods using the cored wire are also disclosed.
    Type: Grant
    Filed: December 10, 2015
    Date of Patent: April 9, 2019
    Assignee: Caterpillar Inc.
    Inventors: Mark S. Diekevers, Robert L. Meyer, Scott H. Magner, Gregory W. Tomlins
  • Patent number: 10220442
    Abstract: A method of making a flux-coated binder includes treating metal binder slugs to have an adherent surface, adding a flux powder to the treated metal binder slugs, and distributing the flux powder on the adherent surface of the metal binder slugs.
    Type: Grant
    Filed: August 21, 2015
    Date of Patent: March 5, 2019
    Assignee: SMITH INTERNATIONAL, INC.
    Inventor: Mingdong Cai
  • Patent number: 10183894
    Abstract: In some examples, a method including positioning a first ceramic or ceramic matrix composite (CMC) part and a second ceramic or CMC part adjacent to each other to define a joint between adjacent portions of the first ceramic or CMC part and the second ceramic or CMC part; and depositing an aqueous braze paste at least one of in the joint or adjacent the joint, wherein the aqueous braze paste comprises water, a water-soluble polymeric binder, and a silicon-based powder alloy.
    Type: Grant
    Filed: February 23, 2016
    Date of Patent: January 22, 2019
    Assignee: Rolls-Royce Corporation
    Inventors: Scott Nelson, Sean E. Landwehr, Joel Davis, Raymond Ruiwen Xu
  • Patent number: 10174226
    Abstract: An adhesive composition comprising silver particles containing silver atoms and zinc particles containing metallic zinc, wherein the silver atom content is 90 mass % or greater and the zinc atom content is from 0.01 mass % to 0.6 mass %, with respect to the total transition metal atoms in the solid portion of the adhesive composition.
    Type: Grant
    Filed: June 14, 2013
    Date of Patent: January 8, 2019
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Hideo Nakako, Toshiaki Tanaka, Michiko Natori, Dai Ishikawa, Hiroshi Matsumoto
  • Patent number: 10160062
    Abstract: A braze preform is provided that includes a filler metal and a luminescent material that covers at least a portion of the filler metal and that can luminesce when exposed to a black light. The luminescent material may include a luminescent ink and a solvent that are mixed together before being applied to filler metal. Presence of the braze preform may be determined using automated equipment by detecting luminescence of the braze preform with a sensor. A decision may be made on whether to advance a parts assembly for brazing based on the determination of presence or absence of the braze preform on such parts assembly.
    Type: Grant
    Filed: December 28, 2015
    Date of Patent: December 25, 2018
    Assignee: Lucas-Milhaupt, Inc.
    Inventors: Lawrence A. Wolfgram, Alan Belohlav
  • Patent number: 10155289
    Abstract: A pressure resistant and corrosion resistant copper alloy contains 73.0 mass % to 79.5 mass % of Cu and 2.5 mass % to 4.0 mass % of Si with a remainder composed of Zn and inevitable impurities, in which the content of Cu [Cu] mass % and the content of Si [Si] mass % have a relationship of 62.0?[Cu]?3.6×[Si]?67.5. In addition, the area fraction of the ? phase “?”%, the area fraction of a ? phase “?”%, the area fraction of a ? phase “?”%, the area fraction of the ? phase “?”%, and the area fraction of a ? phase “?”% satisfy 30?“?”?84, 15?“?”?68, “?”+“?”?92, 0.2?“?”/“?”?2, “?”?3, “?”?5, “?”+“?”?6, 0?“?”?7, and 0?“?”+“?”+“?”?8. Also disclosed is a method of manufacturing a brazed structure made of the above pressure resistant and corrosion resistant copper alloy.
    Type: Grant
    Filed: April 22, 2013
    Date of Patent: December 18, 2018
    Assignee: Mitsubishi Shindoh Co., Ltd.
    Inventor: Keiichiro Oishi
  • Patent number: 10151363
    Abstract: A method for forming a vehicular brake rotor involving loading a shaped metal substrate with a mixture of metal alloying components and ceramic particles in a dieheating the contents of the die while applying pressure to melt at least one of the metal components of the alloying mixture whereby to densify the contents of the die and form a ceramic particle-containing metal matrix composite coating on the metallic substrate; and cooling the resulting coated product.
    Type: Grant
    Filed: November 24, 2017
    Date of Patent: December 11, 2018
    Assignee: ATS MER, LLC
    Inventors: Lori Bracamonte, James Withers, Jowie Abcede
  • Patent number: 10147696
    Abstract: An electronic device and a method for producing an electronic device are disclosed. In an embodiment the electronic device includes a first component and a second component and a sinter layer connecting the first component to the second component, the sinter layer comprising a first metal, wherein at least one of the components comprises at least one contact layer which is arranged in direct contact with the sinter layer, which comprises a second metal different from the first metal and which is free of gold.
    Type: Grant
    Filed: September 17, 2015
    Date of Patent: December 4, 2018
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventor: Andreas Ploessl
  • Patent number: 10124443
    Abstract: Brazing alloy wire formed from a composite comprising a sheath of at least one ductile first phase and a core comprising particles of a different composition to the sheath, in which: the sheath has an annealing temperature in degrees K the particles have a melting point at least 20% above the annealing temperature of the sheath the particles have a size distribution in which 25% by weight or less comprise particles less than 25 ?m in size the particles are discrete.
    Type: Grant
    Filed: February 19, 2015
    Date of Patent: November 13, 2018
    Assignee: Morgan Advanced Ceramics, Inc.
    Inventors: Mark Miklos, Abdelouahab Ziani
  • Patent number: 10099321
    Abstract: A soldering flux of the present invention contains, as a base resin, an acrylic resin (A) having an acid value of 0 to 70, and an acrylic resin (B) having an acid value of 30 to 230. The acrylic resin (A) is obtained by polymerization of a monomer mixture containing alkyl(meth)acrylate having an alkyl group having carbon atoms of 12 to 23. The acrylic resin (B) is obtained by polymerization of a monomer mixture containing alkyl(meth)acrylate having an alkyl group having carbon atoms of 6 to 10. The acid value of the acrylic resin (B) is higher than the acid value of the acrylic resin (A), and a difference between these two resins is 15 or more.
    Type: Grant
    Filed: December 13, 2013
    Date of Patent: October 16, 2018
    Assignee: HARIMA CHEMICALS, INC.
    Inventors: Kosuke Inoue, Tetsuyuki Shigesada, Kenichi Takeshima, Takuji Sukekawa, Masao Murata
  • Patent number: 10092983
    Abstract: A brazing composition contains 1 part by mass or more and 10 parts by mass or less of Zn powder, 1 part by mass or more and 5 parts by mass or less of Si powder, 3 parts by mass or more and 10 parts by mass or less of K—Al—F flux, 1 part by mass or more and 3 parts by mass or less of (meth)acrylic resin, wherein the mass ratio (Zn/Si) of Zn powder relative to Si powder is 1 or more and 5 or less.
    Type: Grant
    Filed: September 26, 2013
    Date of Patent: October 9, 2018
    Assignee: HARIMA CHEMICALS, INCORPORATED
    Inventor: Daigo Kiga
  • Patent number: 10086480
    Abstract: Disclosed is a flux composition for use in brazing of an aluminum alloy material and includes a flux component [A] containing KAlF4; and a fluoride [B] containing an element other than Group 1 elements and Group 2 elements and containing no potassium (K). Also disclosed is a brazing sheet which includes an aluminum alloy core; a filler material lying on or over at least one side of the core; and a flux layer lying on or over one side of the filler material and including the flux composition.
    Type: Grant
    Filed: October 17, 2012
    Date of Patent: October 2, 2018
    Assignees: Kobe Steel, Ltd., DENSO CORPORATION
    Inventors: Nobuhiro Kobayashi, Motohiro Horiguchi, Koichi Sakamoto, Toshiki Ueda, Shimpei Kimura, Takahiro Izumi
  • Patent number: 10035222
    Abstract: A soldering flux includes a base resin, an activator, and a solvent. The activator contains an acrylic resin having an acid value of not more than 50 mg KOH/g and represented by a general formula (1). A monomer weight ratio of a, b, and c is b/(a+b+c)?0.6, at least one of a and c may be 0, R1 is an alkyl group having a carbon number of 8 to 24, R2 is a substituent other than the R1 and may be one of substituents including a hydrogen atom, a methyl group, an alkyl group, an aryl group, and a hydroxyl group or a combination of a plurality of substituents, and R3, R4, and R5 are hydrogen atoms or methyl groups. The solvent contains a compound having a carboxyl group in a cyclohexyl skeleton and represented by a general formula (2).
    Type: Grant
    Filed: September 25, 2014
    Date of Patent: July 31, 2018
    Assignee: TAMURA CORPORATION
    Inventors: Masahiro Tsuchiya, Akira Kitamura, Momoko Seino, Masaya Arai
  • Patent number: 10016848
    Abstract: Aiming at providing a metal particle, an electro-conductive paste, a formed article, and a laminated article that are able to form a highly reliable and high-quality electric interconnect, an electro-conductive bonding portion, or a three-dimensional structure that is less likely to produce the Kirkendall void, this invention discloses a metal particle which include an outer shell and a core part, the outer shell including an intermetallic compound and covering the core part.
    Type: Grant
    Filed: October 26, 2016
    Date of Patent: July 10, 2018
    Assignee: Napra Co., Ltd.
    Inventor: Shigenobu Sekine
  • Patent number: 9975206
    Abstract: Solder paste compositions and methods for applying solder paste. The solder paste includes lubricating additives to the flux to decrease friction and the changes of metal to metal contact between the surfaces of the solder balls and other surfaces that the solder balls come into contact with. The solder paste also includes solder balls of different average sizes, that improves the desirable liquid like properties of the granular paste while further reducing viscosity. As such, the solder paste is used in current screen printing solder paste application methods without the risk of clogging or agglomeration of solder paste particles on surfaces. The solder paste is also used in jetting or dispensing solder paste application methods without the risk of clogging or agglomeration within the cylinders/containers or apertures and nozzles that are used within such methods.
    Type: Grant
    Filed: April 4, 2012
    Date of Patent: May 22, 2018
    Assignee: Micronic MyData AB
    Inventor: Torbjorn Sandstrom
  • Patent number: 9928934
    Abstract: Provided is a curable composition for an electronic component that can be quickly cured and furthermore can have increased storage stability. The curable composition for an electronic component according to the present invention contains an epoxy compound, an anionic curing agent, a flux, and a basic compound excluding the anionic curing agent.
    Type: Grant
    Filed: January 16, 2014
    Date of Patent: March 27, 2018
    Assignee: SEKISUI CHEMICAL CO., LTD.
    Inventors: Hideaki Ishizawa, Takashi Kubota
  • Patent number: 9916915
    Abstract: The paste for diffusion layer formation used for formation of a GDL for a fuel cell contains a solvent, and conductive particles, a first surfactant having a first decomposition temperature and a second surfactant having a second decomposition temperature that is lower than the first decomposition temperature, all of which are dispersed in the solvent. The paste for diffusion layer formation contains a lower amount of the first surfactant than the second surfactant on a weight basis.
    Type: Grant
    Filed: September 19, 2014
    Date of Patent: March 13, 2018
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventor: Tohru Oda
  • Patent number: 9902022
    Abstract: Provided is a flux which can remove metal oxides to improve solder wettability and can fix the object to be soldered with flux residue. The flux contains thermosetting resin, and long-chain dibasic acid mixture including one or more species of first long-chain dibasic acid having an alkyl group in a side chain, the first long-chain dibasic acid being added as a hardening agent for hardening the thermosetting resin and an activator, and second long-chain dibasic acid having an alkyl group and an alkoxycarbonyl group in a side chain and having carbon number of 8 or more in a main chain between the carboxyl groups at opposite terminals. It is preferable that content of the thermosetting resin is 30% through 70% and content of the long-chain dibasic acid mixture is 20% through 60%.
    Type: Grant
    Filed: February 27, 2015
    Date of Patent: February 27, 2018
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Masashi Uehata, Yasuyuki Yamagawa, Kazuya Kitazawa, Yoshinori Takagi
  • Patent number: 9844840
    Abstract: A flux for soldering includes a base resin, a solvent, and an activating agent. The base resin contains a rosin. An amount of the rosin to be incorporated is from 0% by weight to 30% by weight with respect to a total amount of the base resin. The activating agent includes a compound having a plurality of carboxyl groups on a cyclohexyl structure represented by a general formula (1). X is (a) one or more carboxyl groups, or (b) one or more carboxyl groups and at least one selected from a hydrogen atom, chloro group, bromo group, alkyl group, and cyclohexyl group. A position of the X is not limited. A number of the X is one or more. The X may have either one of the (a) and (b) alone, or a plurality of the (a) and (b) in combination.
    Type: Grant
    Filed: September 25, 2014
    Date of Patent: December 19, 2017
    Assignee: TAMURA CORPORATION
    Inventors: Masahiro Tsuchiya, Akira Kitamura, Momoko Seino, Masaya Arai
  • Patent number: 9837572
    Abstract: Provided is a method of manufacturing a solar cell module including: a step (A) of applying a conductive adhesive composition comprising conductive particles having metal, or the like; a step (B) of disposing wiring members so as to face with electrodes of the solar battery cells with the applied conductive adhesive composition interposed therebetween; a step (C) of heating the solar battery cells with the wiring members obtained in the step (B); and a step (D) of laminating sealing resins onto both surfaces of the solar battery cells with the wiring members obtained in the step (C), laminating protection glass onto a light-receiving surface of the solar battery cell and a protection film onto a rear surface of the solar battery cell, and performing heating, in which a melting point of the metal in the conductive particles is or lower than the heating temperature in the step (C).
    Type: Grant
    Filed: January 11, 2012
    Date of Patent: December 5, 2017
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Aya Momozaki, Shigeki Katogi, Hiroki Hayashi, Michiko Natori, Shinichirou Sukata
  • Patent number: 9815149
    Abstract: The present invention is directed to flux compositions and uses thereof. One composition comprises an activator and a solvent being a glycerol ethoxylate with a molecular weight of 200-500. Another composition comprises an activator, a solvent being a glycerol ethoxylate with a molecular weight of 200-500 and an amine. A soldering method for joining objects is also provided, comprising the steps of applying a flux composition to at least a portion of one or more of the objects, and joining the objects.
    Type: Grant
    Filed: April 3, 2012
    Date of Patent: November 14, 2017
    Assignee: International Business Machines Corporation
    Inventors: Kang-Wook Lee, Nathalie Normand, Valerie Oberson
  • Patent number: 9808874
    Abstract: The present invention is directed to a soldering method for joining objects is also provided, comprising the steps of applying a flux composition to at least a portion of one or more of the objects, and joining the objects.
    Type: Grant
    Filed: September 13, 2012
    Date of Patent: November 7, 2017
    Assignee: International Business Machines Corporation
    Inventors: Kang-Wook Lee, Jae-Woong Nah, Nathalie Normand, Valerie Oberson
  • Patent number: 9803111
    Abstract: An adhesive for a semiconductor, comprising an epoxy resin, a curing agent, and a compound having a group represented by the following formula (1): wherein R1 represents an electron-donating group.
    Type: Grant
    Filed: October 1, 2012
    Date of Patent: October 31, 2017
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Kazutaka Honda, Akira Nagai, Makoto Satou
  • Patent number: 9802275
    Abstract: Rosin-free thermosetting flux formulations for enhancing the mechanical reliability of solder joints. In accordance with one or more aspects, a solder paste as shown and described herein imparts improved or enhanced solder joint properties relating to at least one of drop shock, thermal cycling, thermal shock, shear strength, flexural strength performance, and/or other thermal-mechanical performance attributes.
    Type: Grant
    Filed: December 31, 2014
    Date of Patent: October 31, 2017
    Inventors: Morgana de Avila Ribas, Rahul Raut, Traian Cornel Cucu, Shu Tai Yong, Siuli Sarkar, Ramakrishna Hosur Katagiriyappa
  • Patent number: 9770786
    Abstract: As electronic equipment has become smaller in size, printed circuit boards which cannot be subjected to cleaning have been developed, and a no-clean lead-free solder paste is becoming necessary. In order for a solder paste not to require cleaning, it is necessary that the color of the residue be transparent and that the residue be non-tacky. A maleated rosin, which is a rosin suited for no-clean paste, has a high acid value so it is not suitable for a flux for lead-free solder. As a means of suppressing a reaction between a flux containing a maleated rosin and a Sn—Ag—Cu based solder alloy powder, a Sn—Ag—Cu—Sb based solder alloy powder is used which adds 1-8 mass % of Sb to a Sn—Ag—Cu based solder alloy. As a result, it is possible to provide a solder paste which has the excellent effect that the solder paste does not easily undergo changes over time and has a long pot life.
    Type: Grant
    Filed: June 1, 2010
    Date of Patent: September 26, 2017
    Assignee: SENJU METAL INDUSTRY CO., LTD.
    Inventors: Yoshitaka Toyoda, Fumihiro Imai
  • Patent number: 9770774
    Abstract: The invention relates to a method for cleaning the process gas in soldering installations and solder suction systems, in particular for reducing the abietic acid in the process gas, wherein the process gas to be cleaned is conducted through a cleaning system which contains one or more of the following compounds (cleaning compounds): a) carboxylic acids with reducing properties, namely oxalic acid, formic acid, citric acid and/or ascorbic acid: b) metal compounds of higher oxidation states, namely manganates, permanganates, chromates and/or dichromates; c) alcohols which can be convened into the carboxylic acids mentioned in a) by means of oxidation; d) basic lime compounds.
    Type: Grant
    Filed: October 30, 2013
    Date of Patent: September 26, 2017
    Assignee: ERSA GmbH
    Inventor: Viktoria Rawinski
  • Patent number: 9765200
    Abstract: Embodiments in accordance with the present invention encompass polymer compositions that are useful in the assembly of microelectronic components onto a variety of substrate materials. Such polymer compositions providing for both holding the microelectronic components at desired positions on a substrate, providing fluxing for the solder bonding of such components to the substrate and remaining in place as an underfill for such components.
    Type: Grant
    Filed: August 13, 2013
    Date of Patent: September 19, 2017
    Assignee: PROMERUS, LLC
    Inventors: Christopher Apanius, Andrew Bell, Leah Langsdorf, W. C. Peter Tsang
  • Patent number: 9735123
    Abstract: A semiconductor device structure and a manufacturing method are provided. The method includes forming a conductive pillar over a semiconductor substrate. The method also includes forming a solder layer over the conductive pillar. The method further includes forming a water-soluble flux over the solder layer. In addition, the method includes reflowing the solder layer to form a solder bump over the conductive pillar and form a sidewall protection layer over a sidewall of the conductive pillar during the solder layer is reflowed.
    Type: Grant
    Filed: March 13, 2014
    Date of Patent: August 15, 2017
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Li-Guo Lee, Yi-Chen Liu, Yung-Sheng Liu, Yi-Jen Lai, Chun-Jen Chen, Hsi-Kuei Cheng
  • Patent number: 9708195
    Abstract: TiO2 based scrubbing granules, and methods of making and using such TiO2 based scrubbing granules are described. TiO2-based scrubbing granules include granulated TiO2 and about 0.5% to about 20% dry weight inorganic salt binder. Other TiO2 based scrubbing granules include unsintered granulated TiO2 and about 0.5% to about 20% dry weight inorganic salt binder. Inorganic salt binder include sodium aluminate. Methods of making TiO2 based scrubbing granules include i) combining TiO2 particles with inorganic salt binder to form TiO2-binder mixture comprising from about 0.5% to about 20% dry weight binder; ii) granulating the TiO2-binder mixture; and drying the granulated TiO2-binder mixture to form TiO2-based scrubbing granules.
    Type: Grant
    Filed: April 26, 2013
    Date of Patent: July 18, 2017
    Assignee: Cristal USA, Inc.
    Inventors: Venkata Ramana Reddy Sama, Kit Stacey Eremchuk, Mark D. Pomponi, Gabor Feher, Alexandre Jean Fines
  • Patent number: 9700964
    Abstract: The invention described herein pertains generally to boric acid free flux composition in which boric acid and/or borax is substituted with a molar equivalent amount of potassium tetraborate tetrahydrate. In some embodiments, a phthalocyanine pigment is used to effect a color change at activation temperature.
    Type: Grant
    Filed: March 14, 2014
    Date of Patent: July 11, 2017
    Assignee: Lincoln Global, Inc.
    Inventor: Robert A. Howard
  • Patent number: 9682447
    Abstract: The present invention relates to organic acid- or latent organic acid-functionalized polymer-coated metal powders, such as metal powders used as appropriate in the formation of solder alloys, spheres and pastes.
    Type: Grant
    Filed: August 20, 2010
    Date of Patent: June 20, 2017
    Assignee: Henkel IP & Holding GmbH
    Inventor: Puwei Liu
  • Patent number: 9669491
    Abstract: A method of forming a steel part is provided. The method includes the steps of coating a first steel plate to obtain a first precoat upon the first steel plate so as to define a first base, a first intermetallic alloy layer on the first base and a first metal alloy layer on the first intermetallic alloy layer. On a first face of the first steel plate the first metal alloy layer is removed in a first area of the first steel plate, while at least part of the first intermetallic alloy layer in the first area remains. A second steel plate is coated to obtain a second precoat upon the second steel plate so as to define a second base, a second intermetallic alloy layer on the second base and a second metal alloy layer on the second intermetallic alloy layer. On a second face of the second steel plate, the second metal alloy layer is removed in a second area of the second metal plate, while at least part of the second intermetallic alloy layer in the second area remains.
    Type: Grant
    Filed: September 25, 2015
    Date of Patent: June 6, 2017
    Assignee: ARCELORMITTAL FRANCE
    Inventors: Jean-Francois Canourgues, Aurelien Pic, Pascal Verrier, Rene Vierstraete, Wolfram Ehling, Bernd Thommes
  • Patent number: 9656352
    Abstract: A flux coating composition may include a composition paste including an elastomer solution mixed with a flux powder or a flux paste. When the composition is heated during a brazing operation, the composition yields no metal oxides and ?50 ppm of carbon, ash, fumes, smoke, or other by-product contaminants. The flux may include a binder with an acrylic resin and a plurality of synthetic rubber compounds.
    Type: Grant
    Filed: June 12, 2014
    Date of Patent: May 23, 2017
    Assignee: Lucas-Milhaupt, Inc.
    Inventors: Paul Julien Gagnon, Jr., Michael Anthony Raposa, David Wayne Jordan, Daniel J. Jossick, George Napolean Martin
  • Patent number: 9609760
    Abstract: An electronic component mounting method including the steps of: providing a first electronic component having a principal surface provided with a plurality of bumps; providing a substrate having a placement area provided with a plurality of first electrodes corresponding to the plurality of bumps; applying flux to the plurality of bumps; applying flux to at least one of the first electrodes adjacent to at least one reinforcement position set on a peripheral portion of the placement area; dispensing a thermosetting resin onto the reinforcement position, and at least partially coating the first electrode adjacent to the reinforcement position, with the thermosetting resin; placing the first electronic component on the substrate such that the bumps land on the corresponding first electrodes, and thus bringing the thermosetting resin into contact with a peripheral edge portion of the first electronic component; and heating the substrate with the first electronic component placed thereon.
    Type: Grant
    Filed: June 1, 2012
    Date of Patent: March 28, 2017
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Tsubasa Saeki, Yoshiyuki Wada, Koji Motomura, Tadahiko Sakai
  • Patent number: 9609762
    Abstract: Provided is a flux that includes at least one polybutadiene (meth)acrylate compound selected from polybutadiene (meth)acrylate compounds and polybutadiene (meth)acrylate compounds, and a hydrogenated dimer acid.
    Type: Grant
    Filed: March 11, 2013
    Date of Patent: March 28, 2017
    Assignee: KOKI Company Limited
    Inventors: Kenji Arai, Mitsuyasu Furusawa, Junichi Aoki, Mayumi Takada, Munehiko Nakatsuma
  • Patent number: 9579738
    Abstract: The present invention is directed to flux compositions. One composition comprises an activator, a medium-viscosity solvent being a polymer, and a high-viscosity solvent being a copolymer containing first monomers and second monomers. Another composition comprises an activator, and a high-viscosity solvent comprising a copolymer containing first monomers and second monomers. Another composition comprises an activator of 6-12 percent by weight of glutaric acid, pimelic acid, tartaric acid, or mixtures thereof, and a medium-viscosity solvent of 88-94 percent by weight comprising a polymer with hydroxyl end groups. Another composition comprises an activator in a liquid state comprising poly(ethylene glycol)-diacid, and a medium-viscosity solvent comprising a polymer with hydroxyl end groups.
    Type: Grant
    Filed: February 25, 2011
    Date of Patent: February 28, 2017
    Assignee: International Business Machines Corporation
    Inventors: Kang-Wook Lee, Jae-Woong Nah, Nathalie Normand, Valerie Oberson
  • Patent number: 9566668
    Abstract: Flux formulations that remain pliable and tack-free after deposition are disclosed. In certain examples, the flux comprises a first component and an effective amount of a second component to provide a pliable flux after deposition. The flux may also include activators, plasticizers, surface active agents and other components.
    Type: Grant
    Filed: November 12, 2013
    Date of Patent: February 14, 2017
    Inventors: Narahari Pujari, Sanyogita Arora, Siuli Sarkar, Anna Lifton, Rahul Raut, Bawa Singh
  • Patent number: 9421646
    Abstract: The object of the present invention is to provide a solder paste that enables to form a surface mounting structure for electronic components that exhibits crack resistance in a solder joint section even in 100 heat-shock cycles at ?40° C. to 150° C. as required for use in the vicinity of engines for vehicular applications. A flux including an amine halogen salt and a dicarboxylic acid is kneaded with a Sn—Ag—Bi—In alloy powder. As a result, a solder paste exhibiting long continuous printability, little occurrence of solder balls, and excellent joining ability with no cracking in 100 heat-shock cycles at ?40° C. to 150° C. is obtained.
    Type: Grant
    Filed: March 9, 2011
    Date of Patent: August 23, 2016
    Assignees: KOKI COMPANY LIMITED, PANASONIC CORPORATION
    Inventors: Atsushi Irisawa, Masashi Kashiwabara, Kenji Kondo, Masahito Hidaka
  • Patent number: 9321133
    Abstract: The invention described herein generally pertains to a system and method for detecting a moisture with a flux used in a welding process. A sensor is employed with a flux source that supplies a welding operation or process in which the sensor detects a moisture level with a flux within the flux source. A monitor component is configured to receive or aggregate data from the sensor, wherein the data relates to the moisture level associated with a flux supply or a portion of flux.
    Type: Grant
    Filed: February 25, 2013
    Date of Patent: April 26, 2016
    Assignee: LINCOLN GLOBAL, INC.
    Inventors: Ulrich M. Fischer, Steven R. Sumner, Patrick S. Wahlen